Circuit board etching device
By introducing a reversing mechanism into the circuit board etching device, the ceramic circuit board passes through two etching mechanisms in opposite directions, which solves the problem of uneven etching in the prior art and improves the etching effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- UNIVERSAL CIRCUIT BOARD EQUIP CO LTD
- Filing Date
- 2025-04-10
- Publication Date
- 2026-05-08
AI Technical Summary
The thickness of the copper lines on existing ceramic circuit boards leads to uneven etching, and the existing automated etching method results in long etching times and deep line trenches, leading to uneven etching effects.
Design a circuit board etching device, including a first etching mechanism, a second etching mechanism and a reversing mechanism. The reversing mechanism changes the front and back orientation of the circuit board, so that it is etched in opposite directions by the two mechanisms, thereby ensuring the uniformity of the etching tank wall.
This method achieves uniformity in the etching tank walls of ceramic circuit boards, thereby improving the processing quality of the circuit boards.
Smart Images
Figure CN224218597U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board processing technology, and in particular to a circuit board etching device. Background Technology
[0002] Existing ceramic circuit boards have thick copper traces on their surface that need to be etched. Current etching methods typically employ an automated etching spray process. Because the copper on these boards is relatively thick, the etching time is long, and the etched traces are quite deep. Furthermore, the etched ceramic circuit boards produced using this method often exhibit uneven etching. Utility Model Content
[0003] The main purpose of this invention is to provide a circuit board etching device, which aims to improve the problem of uneven etching process on circuit boards.
[0004] To achieve the above objectives, this utility model proposes a circuit board etching apparatus for etching circuit boards, comprising:
[0005] First etching mechanism;
[0006] The second etching mechanism is located downstream of the first etching mechanism. Both the first and second etching mechanisms include a first conveying component and an etching spraying component. The first conveying component is used to convey the circuit board, and the etching spraying component is used to spray liquid onto the circuit board on the first conveying component to perform etching processing on the circuit board.
[0007] The reversing mechanism includes a second conveying component, a detection component, and a reversing component. The second conveying component is disposed between the first etching mechanism and the second etching mechanism to convey the circuit board on the first etching mechanism to the second etching mechanism. The detection component and the reversing component are electrically connected. The detection component is used to detect the position of the circuit board on the second conveying component. The reversing component is used to drive the circuit board on the second conveying component to rotate and change direction so that the front and rear directions of the circuit board are interchanged. The second conveying component is used to convey the rotated and reversed circuit board to the second etching mechanism.
[0008] In one embodiment, the reversing assembly includes a robotic arm and a suction module. The suction module is located at the free end of the robotic arm and is used to adsorb and position the circuit board on the second conveying assembly. The robotic arm is used to drive the suction module and the circuit board on the suction module to rotate and reverse.
[0009] In one embodiment, the suction module includes a suction pump and a suction cup. The suction pump is fixedly connected to the robotic arm, and the suction cup is located at the end of the suction pump away from the robotic arm and is connected in communication with the suction pump.
[0010] In one embodiment, the suction module further includes a flexible element disposed at the end of the suction cup away from the suction pump.
[0011] In one embodiment, the suction module further includes an elastic element disposed between the robotic arm and the suction pump.
[0012] In one embodiment, the reversing mechanism further includes a lifting assembly, which is vertically and vertically disposed within the second conveying assembly and located directly below the detection assembly. The lifting assembly is used to move the circuit board closer to or away from the detection assembly.
[0013] In one embodiment, the lifting assembly includes a lifting column and a fiber optic sensor. The fiber optic sensor is used to sense the position of the circuit board on the second conveying assembly. The fiber optic sensor is electrically connected to the lifting column. When the fiber optic sensor senses the circuit board, the lifting column lifts and positions the circuit board.
[0014] In one embodiment, the reversing component is movably disposed above the second conveying component, and the detection component and the reversing component are spaced apart along the conveying direction.
[0015] In one embodiment, the detection component is a CCD camera, which is positioned above the second transport component.
[0016] In one embodiment, both the first conveying assembly and the second conveying assembly include a driving member and a plurality of roller groups arranged along the conveying direction. The driving member is used to drive the plurality of roller groups to rotate. Each roller group includes a rotating shaft and a plurality of rollers. The plurality of rollers are arranged at intervals along the extension direction of the rotating shaft. The rollers of one adjacent roller group are rotatably disposed between two rollers of the other.
[0017] The technical solution of this utility model is designed such that the ceramic circuit board is transported and etched in opposite directions when it passes through the first etching mechanism and the second etching mechanism. As the ceramic circuit board enters the second etching mechanism from the first etching mechanism, the relative walls of the etching grooves formed on the ceramic circuit board transported in the first etching mechanism will be interchanged along the transport direction when it enters the second etching mechanism. This ensures that the relative walls of the etching grooves can maintain uniform etching when the ceramic circuit board passes through the first etching mechanism and the second etching mechanism, thereby improving the quality of the ceramic circuit board. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0019] Figure 1 A schematic diagram of an embodiment of the circuit board etching apparatus provided by this utility model;
[0020] Figure 2 for Figure 1 Schematic diagram of the mid-section structure;
[0021] Figure 3 for Figure 2 A magnified view of the structure at point A in the middle;
[0022] Figure 4 A schematic diagram of the reversing mechanism provided by this utility model;
[0023] Figure 5 for Figure 4 A magnified schematic diagram of the structure at point B in the middle;
[0024] Figure 6 for Figure 4 A magnified schematic diagram of the structure at point C.
[0025] Explanation of icon numbers:
[0026] 1. Circuit board etching device; 10. First etching mechanism; 11. First conveying assembly; 111. Roller group; 1111. Rotating shaft; 1112. Roller; 12. Etching spray assembly; 20. Second etching mechanism; 30. Reversing mechanism; 31. Second conveying assembly; 32. Reversing assembly; 321. Robotic arm; 322. Suction module; 3221. Suction pump; 3222. Suction cup; 3223. Flexible component; 3224. Elastic component; 33. Detection assembly; 34. Lifting assembly; 40. Ceramic circuit board; 41. Substrate; 42. Copper sheet; 42a. Etching tank.
[0027] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0029] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.
[0030] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0031] Because existing ceramic circuit boards are etched using an assembly line etching spray method, the etching time is relatively long due to the copper busbars being located further back on the ceramic circuit board. In contrast, ceramic circuit boards are etched using a simultaneous conveyor-to-grid etching method. Figure 3 As shown, the ceramic circuit board is etched in this state. Since the orientation of the ceramic circuit board remains unchanged during the etching process, the etching solution will accumulate on the rear wall of the etching tank along the conveying direction of the ceramic circuit board due to the inertia caused by the movement of the ceramic circuit board. This results in over-etching of the rear wall of the etching tank along the conveying direction of the ceramic circuit board, while the etching effect of the etching tank along the conveying direction of the ceramic circuit board is poor.
[0032] Therefore, in view of the above-mentioned technical problems, this utility model proposes a circuit board etching device.
[0033] Please see Figure 1 and Figure 2 In one embodiment of this utility model, the circuit board etching apparatus 1 is used for etching circuit boards, including a first etching mechanism 10, a second etching mechanism 20, and a reversing mechanism 30. The second etching mechanism 20 is located downstream of the first etching mechanism 10. Both the first etching mechanism 10 and the second etching mechanism 20 include a first conveying component 11 and an etching spraying component 12. The first conveying component 11 is used to convey the circuit board, and the etching spraying component 12 is used to spray liquid onto the circuit board on the first conveying component 11 to perform etching. The reversing mechanism 30 includes a second conveying component 31 and a detection component. The first etching mechanism 10 and the second etching mechanism 20 are connected by a component 33 and a reversing component 32. The second conveying component 31 is disposed between the first etching mechanism 10 and the second etching mechanism 20 for conveying the circuit board on the first etching mechanism 10 to the second etching mechanism 20. The detection component 33 and the reversing component 32 are electrically connected. The detection component 33 is used to detect the position of the circuit board on the second conveying component 31. The reversing component 32 is used to drive the circuit board on the second conveying component 31 to rotate and change direction so that the front and rear directions of the circuit board are interchanged. The second conveying component 31 is used to convey the rotated and reversed circuit board to the second etching mechanism 20.
[0034] The circuit board etching device 1 provided by this utility model can perform etching processing on circuit boards of different materials, such as ceramic circuit boards 40 with ceramic as the substrate, circuit boards with glass fiber epoxy resin as the substrate, etc. For example, for ease of explanation, the following description will use ceramic circuit boards 40 as an example.
[0035] It is understood that the ceramic circuit board 40 includes a substrate 41 and copper sheets 42 disposed on the upper and lower surfaces of the substrate 41. When the ceramic circuit board 40 is etched by the circuit board etching device 1, the copper sheets 42 on the surface of the substrate are etched by the spray of chemical solution to form etching grooves 42a. In order to make the etching grooves 42a more uniform (that is, to make the groove walls at both ends of the etching grooves 42a along the conveying direction set at an angle with the surface of the substrate 41, and the angle is set as a right angle or close to a right angle, such as 90°±10°), in this embodiment, a reversing mechanism 30 is added between the first etching mechanism 10 and the second etching mechanism 20 so that the ceramic circuit board 40 faces opposite directions after passing through the first etching mechanism 10 and the second etching mechanism 20, thereby making the etching effect of the ceramic circuit board 40 after being etched by the circuit board etching device 1 more uniform.
[0036] The technical solution of this utility model involves adding a reversing mechanism 30 between the first etching mechanism 10 and the second etching mechanism 20 arranged sequentially along the conveying direction. This reversing mechanism 30 is mainly used to change the forward and backward direction of the ceramic circuit board 40 entering the second etching mechanism 20 from the first etching mechanism 10 for etching. Assuming the ceramic circuit board 40 passes through the first etching mechanism 10 for etching in a first direction, the reversing mechanism 30 rotates the ceramic circuit board 40, causing it to enter the second etching mechanism 20 in a second direction opposite to the first direction. This arrangement ensures that the ceramic circuit board 40... When the first etching mechanism 10 and the second etching mechanism 20 are etched, they are conveyed and etched in opposite directions. This allows the ceramic circuit board 40 to enter the second etching mechanism 20 from the first etching mechanism 10 via the reversing mechanism 30. The relative walls of the etching grooves formed on the ceramic circuit board 40 conveyed on the first etching mechanism 10 along the conveying direction will be interchanged when it enters the second etching mechanism 20. This ensures that the relative walls of the etching grooves of the ceramic circuit board 40 can maintain uniform etching when it passes through the first etching mechanism 10 and the second etching mechanism 20, thereby improving the quality of the ceramic circuit board 40.
[0037] It is worth mentioning that, in this embodiment, both the first etching mechanism 10 and the second etching mechanism 20 include a first conveying component 11 for conveying the ceramic circuit board 40 and a spraying component for spraying etching solution onto the ceramic circuit board 40 on the first conveying component 11. In this embodiment, the conveying rate of the first conveying component 11 in the first etching mechanism 10 and the second etching mechanism 20 is the same.
[0038] In this embodiment, the reversing mechanism 30 includes a second conveying component 31 for conveying the ceramic circuit board 40 from the first etching mechanism 10 to the second etching mechanism 20, a detection device for detecting the position of the ceramic circuit board 40 on the second conveying component 31, and a reversing component 32 for rotating and reversing the ceramic circuit board 40 on the second conveying component 31. The conveying speed of the second conveying component 31 is the same as that of the first conveying component 11 to ensure stable conveying of the ceramic circuit board 40. The detection device can be a sensing sensor, such as a light sensor or a CCD camera. The reversing component 32 can be a robotic arm 321, a rotating platform, or a combination of a robotic arm 321 and a rotating platform. No further limitations are imposed on these aspects.
[0039] In one embodiment, such as Figure 3 As shown, the reversing component 32 includes a robotic arm 321 and a suction module 322. The suction module 322 is located at the free end of the robotic arm 321. The suction module 322 is used to adsorb and position the ceramic circuit board 40 on the second conveying component 31. The robotic arm 321 is used to drive the suction module 322 and the ceramic circuit board 40 on the suction module 322 to rotate and change direction. For example, in this embodiment, the reversing component 32 includes a robotic arm 321, which is a six-axis robotic arm 321 capable of vertical, horizontal, and forward / backward movement. To ensure that the robotic arm 321 can adsorb the ceramic circuit board 40 on the second conveying component 31 without causing damage, in this embodiment, a suction module 322 is provided at the free end of the robotic arm 321. The robotic arm 321 and the suction module 322 are fixedly connected, and the robotic arm 321 can drive the suction module 322 to rotate. In this embodiment, the suction module 322 can be a flexible empty disk, a suction cup 3222, or a combination of a suction pump 3221 and a suction cup 3222. No further limitations are imposed. In this embodiment, the robotic arm 321 can be positioned above or around the second conveying assembly 31. For example, when the robotic arm 321 is positioned above the second conveying assembly 31, it can be mounted on top of the second conveying assembly 31 using a mounting bracket, spaced apart from the second conveying assembly 31, allowing the ceramic circuit board 40 to pass through. When the robotic arm 321 is positioned around the second conveying assembly 31, it can also be mounted using a mounting bracket, but the free end of the robotic arm 321 must be positioned above the second conveying assembly 31.
[0040] For example, the suction module 322 includes a suction pump 3221 and a suction cup 3222. The suction pump 3221 is fixedly connected to the robotic arm 321, and the suction cup 3222 is located at the end of the suction pump 3221 away from the robotic arm 321 and is connected in communication with the suction pump 3221. In this embodiment, the suction module 322 is a combination of the suction pump 3221 and the suction cup 3222, wherein the suction pump 3221 is connected in communication with the suction cup 3222. The suction pump 3221 can be directly connected to the free end of the robotic arm 321, or it can be connected to the robotic arm 321 through a connector. No further limitations are imposed on this.
[0041] In one embodiment, such as Figure 4 As shown, the suction module 322 further includes a flexible element 3223, which is disposed at the end of the suction cup 3222 away from the suction pump 3221. Considering that the ceramic circuit board 40 is very thin and easily broken, in this embodiment, the suction module 322 further includes a flexible element 3223, and the flexible element 3223 is disposed at the end of the suction cup 3222 away from the suction pump 3221, that is, the end where the suction cup 3222 contacts the ceramic circuit board 40. Of course, in other embodiments, the flexible element 3223 can also be disposed between the suction cup 3222 and the suction pump 3221. Such a arrangement can reduce the pressure on the ceramic circuit board 40 when the suction cup 3222 adsorbs it, thus reducing the frequent occurrence of the ceramic circuit board 40 breaking. The flexible element 3223 can be a flexible plastic part or a soft material; there are no further limitations on this.
[0042] In one embodiment, such as Figure 4As shown, the suction module 322 further includes an elastic element 3224, which is disposed between the robotic arm 321 and the suction pump 3221. Similarly, to prevent the ceramic circuit board 40 from breaking due to the suction module 322's hard suction, in this embodiment, the suction module 322 also includes an elastic element 3224. The elastic element 3224 can be a spring, a rubber component, etc., and there are no further limitations on its placement. Regarding the arrangement of the elastic element 3224, it can be placed between the robotic arm 321 and the suction pump 3221; alternatively, it can be placed between the suction pump 3221 and the suction cup 3222. For example, the elastic element 3224 includes two mounting brackets and a spring. One mounting bracket is fixedly connected to the robotic arm 321, while the suction pump 3221 is fixedly connected to the other mounting bracket. The spring connects the two mounting brackets. To ensure that the torque transmission is not affected, guide posts and sleeve posts can be respectively provided on the two mounting brackets. The guide posts are slidably and restrictively located inside the sleeve posts, while the spring is sleeved on the outside of the guide posts and forces the guide posts to always remain on the side away from the bottom wall of the sleeve posts through its own elasticity. This arrangement can reduce the breakage rate of the ceramic circuit board 40 when the suction assembly grips the ceramic circuit board 40.
[0043] In one embodiment, such as Figure 5 As shown, the reversing mechanism 30 also includes a lifting component 34, which is movably disposed within the second conveying component 31. The lifting component 34 is located directly below the detection component 33 and is used to move the ceramic circuit board 40 closer to or away from the detection component 33. To facilitate the driving of the ceramic circuit board 40 by the reversing component 32, a lifting component 34 is also provided in the second conveying component 31 in this embodiment. When the detection component 33 detects that the ceramic circuit board 40 has moved above the lifting component 34, the detection component 33 can cooperate with the corresponding control system to operate the lifting component 34 so that the lifting component 34 lifts the ceramic circuit board 40 (that is, the detection component 33 sends the position information of the ceramic circuit board 40 to the control system, and then the control system controls the operation of the lifting component 34). After the lifting component 34 lifts the ceramic circuit board 40, the reversing component 32 can also drive the static ceramic circuit board 40 under the control of the control system. With this setting, the reversing component 32 can drive the ceramic circuit board 40 more conveniently, so that the ceramic circuit board 40 can rotate and reverse more stably.
[0044] In one embodiment, such as Figure 5As shown, the lifting assembly 34 includes a lifting column and a fiber optic sensor. The fiber optic sensor is used to sense the position of the ceramic circuit board 40 on the second conveying assembly 31. The fiber optic sensor is electrically connected to the lifting column. When the fiber optic sensor senses the ceramic circuit board 40, the lifting column lifts and positions the ceramic circuit board 40. To further improve the capture of the position information of the ceramic circuit board 40, in this embodiment, the lifting assembly 34 includes a lifting column and a fiber optic sensor (not shown in the figure), wherein the fiber optic sensor is used to further determine the position of the ceramic circuit board 40 on the second conveying assembly 31. Of course, the lifting assembly 34 also includes a driving device, which drives the lifting column to perform lifting and lowering actions. In this embodiment, multiple lifting columns are provided, all of which are located in the second conveying assembly 31 and do not affect the operation of the second conveying assembly 31.
[0045] In one embodiment, the reversing component 32 is movably disposed above the second conveying component 31, and the detection component 33 and the reversing component 32 are arranged at intervals along the conveying direction. The specific positions of the detection component 33 and the reversing component 32 are not limited.
[0046] In one embodiment, the detection component 33 is a CCD camera, which is positioned above the second conveying component 31. In this embodiment, the detection component 33 is a CCD camera, which can photograph and position the ceramic circuit board 40, calculate the center of the ceramic circuit board 40 based on its side edges, and transmit this information to the control system. The control system then controls the reversing component 32 to grasp, clamp, or suck up the center of the ceramic circuit board 40, and then rotates the ceramic circuit board 40 according to actual needs. For example, if the ceramic circuit board 40 is deflected when conveyed to the second conveying component 31, the CCD camera will send this deflection angle information to the control system. The control system will then control the reversing component 32 to appropriately increase or decrease the rotation angle of the ceramic circuit board 40, so that when the ceramic circuit board 40 is conveyed from the second conveying component 31 to the first conveying component 11 of the second etching mechanism 20, the side of the ceramic circuit board 40 is parallel to the side of the first conveying component 11.
[0047] In one embodiment, such as Figure 5As shown, both the first conveying assembly 11 and the second conveying assembly 31 include a driving member and a plurality of roller groups 111 arranged along the conveying direction. The driving member is used to drive the plurality of roller groups 111 to rotate. Each roller group 111 includes a rotating shaft 1111 and a plurality of rollers 1112. The plurality of rollers 1112 are arranged at intervals along the extension direction of the rotating shaft 1111. The rollers 1112 of one of the adjacent roller groups 111 are rotatably disposed between the two rollers 1112 of the other. In order to enable the first conveying assembly 11 and the second conveying assembly 31 to convey the small ceramic circuit board 40, in this embodiment, both the first conveying assembly 11 and the second conveying assembly 31 include a driving member and a plurality of roller groups 111. The roller group 111 includes a rotating shaft 1111 and a plurality of rollers 1112. The plurality of rollers 1112 are arranged at intervals along the extension direction of the rotating shaft 1111. The rollers 1112 of one of the adjacent roller groups 111 can be rotatably disposed between the two rollers 1112 of the other, thereby reducing the gap between the roller groups 111 to achieve conveying and etching processing of the smaller ceramic circuit board 40.
[0048] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. A circuit board etching apparatus for etching circuit boards, characterized in that, include: First etching mechanism; The second etching mechanism is located downstream of the first etching mechanism. Both the first and second etching mechanisms include a first conveying component and an etching spraying component. The first conveying component is used to convey the circuit board, and the etching spraying component is used to spray liquid onto the circuit board on the first conveying component to perform etching processing on the circuit board. The reversing mechanism includes a second conveying component, a detection component, and a reversing component. The second conveying component is disposed between the first etching mechanism and the second etching mechanism to convey the circuit board on the first etching mechanism to the second etching mechanism. The detection component and the reversing component are electrically connected. The detection component is used to detect the position of the circuit board on the second conveying component. The reversing component is used to drive the circuit board on the second conveying component to rotate and change direction so that the front and rear directions of the circuit board are interchanged. The second conveying component is used to convey the rotated and reversed circuit board to the second etching mechanism.
2. The circuit board etching apparatus as described in claim 1, characterized in that, The reversing assembly includes a robotic arm and a suction module. The suction module is located at the free end of the robotic arm and is used to adsorb and position the circuit board on the second conveying assembly. The robotic arm is used to drive the suction module and the circuit board on the suction module to rotate and change direction.
3. The circuit board etching apparatus as described in claim 2, characterized in that, The suction module includes a suction pump and a suction cup. The suction pump is fixedly connected to the robotic arm, and the suction cup is located at the end of the suction pump away from the robotic arm and is connected to the suction pump.
4. The circuit board etching apparatus as described in claim 3, characterized in that, The suction module also includes a flexible component, which is located at the end of the suction cup away from the suction pump.
5. The circuit board etching apparatus as described in claim 3, characterized in that, The suction module also includes an elastic element, which is disposed between the robotic arm and the suction pump.
6. The circuit board etching apparatus as described in claim 1, characterized in that, The reversing mechanism further includes a lifting assembly, which is movably disposed within the second conveying assembly and located directly below the detection assembly. The lifting assembly is used to move the circuit board closer to or away from the detection assembly.
7. The circuit board etching apparatus as described in claim 6, characterized in that, The lifting assembly includes a lifting column and a fiber optic sensor. The fiber optic sensor is used to sense the position of the circuit board on the second conveying assembly. The fiber optic sensor is electrically connected to the lifting column. When the fiber optic sensor senses the circuit board, the lifting column lifts and positions the circuit board.
8. The circuit board etching apparatus according to any one of claims 1 to 7, characterized in that, The reversing component is movably disposed above the second conveying component, and the detection component and the reversing component are arranged at intervals along the conveying direction.
9. The circuit board etching apparatus according to any one of claims 1 to 7, characterized in that, The detection component is a CCD camera, which is positioned above the second conveying component.
10. The circuit board etching apparatus according to any one of claims 1 to 7, characterized in that, Both the first conveying assembly and the second conveying assembly include a driving member and a plurality of roller groups arranged along the conveying direction. The driving member is used to drive the plurality of roller groups to rotate. Each roller group includes a rotating shaft and a plurality of rollers. The plurality of rollers are arranged at intervals along the extension direction of the rotating shaft. The rollers of one adjacent roller group are rotatably disposed between two rollers of the other.