Heat dissipation module and electronic equipment
By using high-melting-point metal balls in the heat dissipation module to control the welding thickness, the problem of uneven welding layer thickness is solved, improving thermal conductivity stability and heat dissipation capacity, and meeting the high-performance requirements of electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAMEN JISSYU SOLDER PASTE CO LTD
- Filing Date
- 2025-02-24
- Publication Date
- 2026-05-08
AI Technical Summary
The uneven thickness of the welding layer in existing heat dissipation modules leads to poor thermal conductivity stability, which cannot meet the miniaturization and integration requirements of electronic devices.
High-melting-point metal balls are used as the solder filler layer to control the welding thickness and improve thermal conductivity stability. The metal balls with high thermal conductivity form tiny thermal conduction channels to accelerate heat transfer.
The weld layer thickness is uniform, which improves the thermal conductivity stability and heat dissipation capacity of the heat dissipation module and meets the high-performance requirements of electronic devices.
Smart Images
Figure CN224218682U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology, specifically to a heat dissipation module and electronic equipment. Background Technology
[0002] The advent of the era of artificial intelligence and big data has placed higher demands on CPU computing power and GPU image processing capabilities. While CPU and GPU power consumption has increased, so too have the requirements for the heat dissipation modules that come into contact with them. Heat dissipation modules are assembled by soldering heat pipes, fins, and bases together in a reflow oven using soldering materials. Since heat pipe materials cannot withstand high temperatures, low-temperature solder paste (melting point 138℃) has become the preferred soldering material for heat dissipation modules. However, existing low-temperature solder pastes suffer from volume changes and wicking effects, resulting in disordered solder flow and uneven solder layer thickness, which affects the thermal conductivity stability of the heat dissipation module after soldering. Therefore, it is necessary to construct a heat dissipation module with higher thermal conductivity stability by adjusting the solder layer. Utility Model Content
[0003] The purpose of this utility model is to provide a heat dissipation module with controllable welding thickness and high thermal conductivity stability, which can be applied to electronic devices.
[0004] The first aspect of this utility model provides a heat dissipation module, comprising:
[0005] The first heat dissipation unit provides the first heat-conducting surface;
[0006] The second heat dissipation unit provides a second heat-conducting surface;
[0007] At least one solder filler layer is disposed between the first heat-conducting surface and the second heat-conducting surface, the solder filler layer being composed of metal balls and solder filling the gap between the first heat-conducting surface and the second heat-conducting surface;
[0008] The melting point of the metal ball is higher than the welding temperature.
[0009] In some embodiments, the thickness of the solder filler layer is 10-50 μm.
[0010] In some embodiments, the thermal conductivity of the metal sphere is 300 W / (m*K) or higher.
[0011] In some embodiments, the metal ball is a pure metal ball, an alloy metal ball, or a metal ball with a surface coating.
[0012] In some embodiments, the metal ball is a copper metal ball, a copper alloy metal ball, or a metal ball with a copper-plated surface.
[0013] In some embodiments, the diameter of the metal sphere is 10-50 μm.
[0014] In some embodiments, the ratio of the major diameter to the minor diameter of the metal sphere is less than 1.2; the mass of the metal spheres with a major diameter to minor diameter ratio of less than 1.2 accounts for more than 90% of the total mass of the metal spheres.
[0015] In some embodiments, the first heat dissipation unit is a flat heat pipe, a heat spreader, or a heat-conducting base plate; and / or
[0016] The second heat dissipation unit is a heat pipe or fins.
[0017] In some embodiments, the first heat dissipation unit is made of copper or nickel-plated aluminum; and / or
[0018] The second heat dissipation unit is made of copper or nickel-plated aluminum.
[0019] A second aspect of this utility model provides an electronic device, comprising:
[0020] Motherboard; mounting medium for various electronic components;
[0021] Heat source: Electronic components with different functions;
[0022] A heat dissipation module is mounted on the heat dissipation surface of the heat source for dissipating heat from the heat source; the heat dissipation module is the heat dissipation module provided in the first aspect.
[0023] Compared with the prior art, the beneficial technical effects of this utility model are as follows:
[0024] This invention uses non-melting metal balls at the welding temperature to control the welding thickness, making the welding filler layer thickness uniform and improving the thermal conductivity stability of the heat dissipation module; the high thermal conductivity metal balls interspersed in the solder filler layer further enhance the heat dissipation capacity of the heat dissipation module. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the heat dissipation module described in an embodiment of the present invention. Detailed Implementation
[0026] The present invention will be further described in detail with reference to specific embodiments. The following embodiments can enable those skilled in the art to have a more comprehensive understanding of the present invention, but do not limit the present invention in any way.
[0027] With the increasing prevalence of portable electronic devices, people's functional demands on these devices are also growing. This leads to ever-increasing requirements for the computing power of processing centers such as CPUs (Central Processing Units), GPUs (Graphics Processing Units), and SOCs (System-on-Chips). This also means that electronic devices generate more heat, necessitating more complex and powerful heat dissipation components to ensure the performance of these processing centers. However, in existing heat dissipation components, the solder layers between components are prone to volume changes and wicking effects due to the low-temperature solder paste used. This results in disordered solder flow and uneven solder layer thickness. On the one hand, this affects the thermal conductivity stability of the heat dissipation module after soldering; on the other hand, the uncontrollable flow state makes it difficult to achieve sufficient space utilization, thus failing to meet the trend of miniaturization and integration in electronic devices.
[0028] One embodiment of this utility model provides a heat dissipation module that can be applied to commonly used electronic devices, such as desktop computers, laptops, tablets, mobile phones, and televisions.
[0029] Please refer to Figure 1 As shown, the heat dissipation module includes a first heat dissipation unit 10, a second heat dissipation unit 20, and a solder filler layer 30;
[0030] In this embodiment, the first heat dissipation unit 10 provides a first heat-conducting surface as the starting point of heat conduction. The first heat-conducting surface is preferably a flat surface to ensure uniform and efficient heat transfer. The first heat dissipation unit 10 can be a flat heat pipe, a heat spreader, or a heat-conducting base plate, etc. The material of the first heat dissipation unit 10 can be a copper or aluminum nickel-plated flat heat pipe, a copper or aluminum nickel-plated heat-conducting base plate, or a flat heat pipe with a high thermal conductivity and a heat-conducting base plate with a high thermal conductivity. These materials not only have good thermal conductivity but also maintain structural stability during long-term use. The second heat dissipation unit 20 provides a second heat-conducting surface as the endpoint of heat conduction in this heat dissipation module. Correspondingly, the second heat-conducting surface is preferably a flat surface to ensure uniform and efficient heat transfer. The second heat dissipation unit 20 can be a heat pipe or a heat-conducting base plate, etc. The material of the second heat dissipation unit 20 can be a copper or aluminum nickel-plated heat pipe, a copper or aluminum nickel-plated fin, or a heat pipe with a high thermal conductivity coefficient and a fin with a high thermal conductivity coefficient. These materials not only have good thermal conductivity, but also maintain the stability of the structure during long-term use.
[0031] At least one solder filler layer 30 is disposed between the first and second heat-conducting surfaces. This solder filler layer consists of metal balls 31 and solder 32 filling the gaps. The metal balls are made of a material that prevents them from melting at the soldering temperature, thus acting as a "support" to hold the solder and control the thickness of the solder filler layer. This ensures a uniform thickness of the solder filler layer, avoiding thermal instability caused by uneven thickness. Furthermore, the insolubility of the metal balls at the soldering temperature allows them to maintain a relatively fixed position and shape, thereby limiting the flow range of the solder.
[0032] Furthermore, the placement of these metal spheres significantly enhances the heat dissipation capacity of the heat dissipation module due to their high thermal conductivity. These metal spheres are interspersed within the solder filler layer, forming several tiny heat conduction channels that allow heat to be transferred more quickly and efficiently to the second heat dissipation unit, thereby dissipating the heat.
[0033] In one specific embodiment, the solder filler layer 30 is a structural layer formed by soldering low-temperature solder paste. The low-temperature solder paste may include the following components by volume percentage: 50% solder powder and 50% flux paste. The solder powder consists of metal balls and low-temperature tin powder, and the metal balls account for 1%-10% of the total weight of the solder. The flux paste includes the following components by mass percentage: 20%-40% rosin, 2%-10% thixotropic agent, 1%-10% short-chain organic acid, 1%-10% long-chain organic acid, 1%-10% organic amine, and 20%-40% high-boiling-point organic solvent. The flux paste accounts for 9%-12% of the total weight of the solder paste.
[0034] Low-temperature solder paste can also be a mixture of commercial tin-bismuth powder solder paste (Xiamen Jishiyu Solder Co., Ltd., DFC model low-temperature solder paste) and metal balls, with the metal balls accounting for 1%-10% of the total weight of the solder.
[0035] The metal ball 31 is a pure metal ball, an alloy metal ball, or a metal ball with a surface coating. The pure metal ball can be, for example, a copper ball, a silver ball, or a gold ball. The alloy metal ball can be, for example, a copper alloy metal ball or a silver alloy metal ball. The metal ball with a surface coating can be, for example, a metal ball with a copper surface coating. Preferably, the metal ball 31 is a copper metal ball, a copper alloy metal ball, or a metal ball with a copper surface coating. The thermal conductivity of the metal ball is 300 W / (m*K) or higher, and the ratio of its major diameter to its minor diameter is less than 1.2. The mass of the metal balls with a major diameter to minor diameter ratio of less than 1.2 accounts for more than 90% of the total mass of the metal balls.
[0036] Using copper or copper-based metal balls with high thermal conductivity and / or good sphericity can improve the thermal stability of the heat dissipation module while achieving uniform solder filler layer thickness.
[0037] When the thickness of the solder filler layer 30 is 10 μm, the maximum diameter of the metal ball 31 must be 10 μm; when the thickness of the solder filler layer 30 is 20 μm, the maximum diameter of the metal ball 31 must be 20 μm; when the thickness of the solder filler layer 30 is 50 μm, the maximum diameter of the metal ball 31 must be 50 μm.
[0038] It should be noted that the above setting is based on the fact that the thickness of the solder filler layer is determined by the maximum diameter of the metal ball. Furthermore, the diameter range of the metal ball 31 described in this invention falls within the range of values related to the maximum diameter of the metal ball used in the solder filler layer 30.
[0039] In a preferred embodiment, the first heat dissipation unit 10 is a copper thermally conductive base plate, and the second heat dissipation unit 20 is a copper fin.
[0040] The second embodiment of this utility model provides an electronic device. Generally, electronic devices include electronic components with different functions. During operation, these electronic components generate heat, forming the heat source of the electronic device. A heat dissipation module is disposed on the heat dissipation surface of the heat source. Simultaneously, to ensure the installation of the electronic components, the electronic device also includes a motherboard, which serves as the carrier for mounting the electronic components.
[0041] In this embodiment, the electronic device includes: a motherboard, a heat source, and a heat dissipation module;
[0042] The heat source is located on the motherboard; and the heat dissipation module is installed on the heat dissipation surface of the heat source for dissipating heat from the heat source. The heat dissipation module is the heat dissipation module provided in the first embodiment.
[0043] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention without departing from the principles and spirit of the present invention.
Claims
1. A heat dissipation module, characterized in that, The heat dissipation module includes: The first heat dissipation unit provides the first heat-conducting surface; The second heat dissipation unit provides a second heat-conducting surface; At least one solder filler layer is disposed between the first heat-conducting surface and the second heat-conducting surface, the solder filler layer being composed of metal balls and solder filling the gap between the first heat-conducting surface and the second heat-conducting surface; The melting point of the metal ball is higher than the welding temperature.
2. The heat dissipation module according to claim 1, characterized in that, The thickness of the solder filler layer is 10-50 µm.
3. The heat dissipation module according to claim 1, characterized in that, The thermal conductivity of the metal sphere is 300 W / (m²). K) and above.
4. The heat dissipation module according to claim 1, characterized in that, The metal ball is a pure metal ball, an alloy metal ball, or a metal ball with a surface coating.
5. The heat dissipation module according to claim 1, characterized in that, The metal ball is a copper metal ball, a copper alloy metal ball, or a copper metal ball with a surface coating.
6. The heat dissipation module according to claim 1, characterized in that, The diameter of the metal sphere is 10-50 µm.
7. The heat dissipation module according to claim 1, characterized in that, The ratio of the major diameter to the minor diameter of the metal sphere is less than 1.2; the mass of the metal spheres with a major diameter to minor diameter ratio of less than 1.2 accounts for more than 90% of the total mass of the metal spheres.
8. The heat dissipation module according to claim 1, characterized in that, The first heat dissipation unit is a flat heat pipe, a heat spreader, or a heat-conducting base plate; and / or The second heat dissipation unit is a heat pipe or fins.
9. The heat dissipation module according to claim 1, characterized in that, The first heat dissipation unit is made of copper or nickel-plated aluminum; and / or The second heat dissipation unit is made of copper or nickel-plated aluminum.
10. An electronic device, Its features are, Includes: motherboard, heat source, and heat dissipation module; Motherboard; mounting medium for electronic components; Heat source: Electronic components with different functions; A heat dissipation module is installed on the heat dissipation surface of the heat source for dissipating heat from the heat source. The heat dissipation module is the heat dissipation module as described in any one of claims 1-9.