Housing unit and semiconductor power module

Abstract

A housing unit (2) for a semiconductor power module (1) comprises a molded body (3) configured to enclose electrical components of the semiconductor power module (1). The housing unit (2) further comprises at least one terminal (10) integrated and at least partially embedded in the molded body (3) such that the at least one terminal (10) extends through the molded body (3) and an end (11) of the at least one terminal (10) is exposed at an upper surface (6) of the molded body (3) with respect to a stacking direction (A) of the semiconductor power module (1). The at least one terminal (10) further comprises at least one sealing structure (13, 14) arranged in a boundary region (5) between the exposed end (11) and the molded edge (4) of the molded body (3), the sealing structure (13, 14) being configured to limit an upper extension of the molded body (3) during formation of the molded body (3).

Description

Technical Field

[0001] This disclosure relates to a housing unit for a semiconductor power module and a method for manufacturing a corresponding housing unit. This disclosure further relates to a semiconductor power module including such a housing unit. Background Technology

[0002] Conventional power modules utilize power semiconductor packaging technology and typically include a housing and the electrical components assembled within it. Providing a stable housing that contributes to the reliable operation of the power module is a challenge. Utility Model Content

[0003] Embodiments of this disclosure provide a housing unit for a semiconductor power module that is capable of stable operation and reliable manufacturing for high-voltage power module applications. Further embodiments of this disclosure provide a semiconductor power module and a method for manufacturing a housing unit for the semiconductor power module.

[0004] According to one embodiment, a housing unit for a semiconductor power module includes a molded body configured to enclose electronic and / or electrical components of the semiconductor power module. The housing unit further includes at least one terminal integrated into and at least partially embedded in the molded body, such that the at least one terminal extends through the molded body. An end of the at least one terminal forms an uppermost portion of the terminal and is at least partially exposed on the upper surface of the molded body relative to the stacking direction of the semiconductor power module. The at least one terminal further includes at least one sealing structure disposed in a boundary region between the exposed end and a molded edge of the molded body. The sealing structure is configured to limit the upper extension of the molded body during molding of the molded body.

[0005] Due to the described configuration of the housing unit, one or more terminals extending through the molded body are securely sealed, providing reliable electrical connection to other components of the semiconductor power module. Therefore, the housing unit eliminates unwanted leakage of molding material into the corresponding ends of the terminals, thus contributing to the reliable operation of the semiconductor power module for low-, medium-, and even high-voltage power module applications and large modules. The described configuration, along with the uncontaminated upper end, allows for reliable electrical contact with external busbars or signal connectors. The ends of the corresponding terminals may be formed as terminal nuts.

[0006] Specific sealing structures attached to terminals can achieve reliable sealing even for vertically arranged terminals (e.g., those with round or square shapes). In this regard, terms such as “vertical,” “upper,” or “lower” refer to the expected alignment or orientation of components under normal operating conditions of a semiconductor power module. Thus, the stacking direction can also be referred to as the vertical direction, and the corresponding lateral direction can also be referred to as the horizontal direction and typically spans the main extension plane.

[0007] According to one embodiment, a sealing structure is formed on the outer surface of at least one terminal such that it partially or completely surrounds the terminal relative to a lateral or radial direction perpendicular to the stacking direction. The terminal may have terminal legs and an elongated terminal shaft or body, wherein the upper end forms the end of the terminal. The terminal shaft extends through the molded body and may have different shapes, such as circular, rectangular, elliptical, or any other shape with respect to the cross-section along the lateral direction. Inside the housing, the corresponding terminal may have another or arbitrary shape. Thus, at least one terminal may be formed to include cylindrical, cuboid, and elliptical shapes. At least one terminal may be further formed to be solid or hollow and have a tubular shape. The sealing structure restricts the molding material formation of the molded body and may be formed in sections or as a closed loop around the terminal shaft. Alternatively or additionally, the sealing structure may be spirally formed around the terminal shaft. For example, one or more terminals may have multiple loops.

[0008] According to one embodiment, the sealing structure includes at least one recess formed on the outer surface of at least one terminal. The recess may be formed such that a molding edge of the molding body extends into the at least one recess. The molding edge realizes a locally uppermost portion of the molding body near the terminal. Thus, upon interaction with a corresponding molding tool, the recess may form a given notch for absorbing and containing molding material to prevent unwanted seepage into the region of the end.

[0009] Alternatively or additionally, the sealing structure may include at least one protrusion formed on the outer surface of at least one terminal. Such a protrusion may limit the upper extension of the molding edge of the molding body relative to the stacking direction. Thus, when interacting with the corresponding molding tool, the protrusion may form a given barrier to prevent the outflow of molding material, thereby preventing unwanted contamination of the end.

[0010] According to a further embodiment, one or more terminals include two or more sealing structures formed in a boundary region between the exposed end and the molded edge of the molded body. Each of these sealing structures may include one or more recesses and / or one or more protrusions formed on the outer surface of the respective terminal. For example, the sealing structure may include only protruding portions or recessed portions, or a combination of varying protruding and recessed portions. The arrangement of one or more sealing portions may completely or partially or segmentally surround the respective terminal.

[0011] The sealing structure can be an additional element separate from the elongated body of the terminal or integrally formed with the terminal. Regarding the vertical cross-section along the stacking direction, the sealing structure can be formed in at least one of the shapes of a square, rectangle, trapezoid, semicircle, and triangle. Further, regarding the vertical cross-section along the stacking direction, the sealing structure can include a height having a value of 0.1-2.0 mm and / or a width having a value of 0.1-2.0 mm. The height refers to the vertical direction along the stacking direction, and the width refers to the corresponding horizontal direction. The horizontal direction can also be referred to as the lateral direction, and the width can also be referred to as the depth of the recess or the thickness of the protrusion or sealing structure. The height and width are each set relative to the outer surface of the relevant terminal adjacent to the corresponding sealing structure. Therefore, the height can refer to the length of the protrusion or recess along the stacking direction, respectively.

[0012] For example, considering circular or cylindrical terminals, the protrusion forming the sealing feature can project radially above the adjacent outer surface of the terminal and have a width of up to 2 mm. Therefore, considering cylindrical terminals, the recess forming the sealing feature can project radially behind the adjacent outer surface of the terminal with a width or depth of up to 2 mm. It has been found in the context of this disclosure that such dimensions can safely help prevent unwanted leakage of the molding material during the formation of the molded body and thus the outer area of ​​the nut or the end of the corresponding terminal.

[0013] According to one embodiment, the semiconductor power module includes an embodiment of a housing unit and electrical and / or electronic components disposed within the housing unit. The semiconductor power module may further include an insulating metal substrate structure having a top metal layer, a bottom metal layer, and an intermediate dielectric layer. The dielectric layer may be formed as a resin sheet or a molded resin layer. The insulating metal substrate structure is electrically connected to the housing unit via at least one terminal to the top metal layer. The top metal layer may be formed with a metallization made of a film and / or sheet comprising copper and / or aluminum and / or copper alloys and / or aluminum alloys. For example, this may also be applied to the bottom metal layer, which may be formed as a copper and / or aluminum plate and / or a corresponding alloy. Because of this, the described semiconductor power module includes embodiments of the aforementioned housing unit, the described features and characteristics of which are also disclosed for the semiconductor power module, and vice versa.

[0014] Alternatively, the semiconductor power module may include a substrate or base plate coupled to the housing unit. Preferably, the substrate is an isolation substrate. The substrate may include an isolation sheet made of ceramic material, at least one metallization layer (on which power semiconductor devices are mounted), and optional back-side metallization. Alternatively or additionally, the semiconductor power module may include a substrate in the form of a lead frame, a ceramic substrate (e.g., an LTCC substrate). The substrate may be mounted on a base plate.

[0015] According to one embodiment, a method for manufacturing a housing unit for a semiconductor power module includes: providing a molding material configured to form a molded body of the housing unit to enclose electrical or electronic components of the semiconductor power module. The method further includes: providing and positioning at least one terminal, the terminal including an end and at least one sealing structure formed adjacent to the end. The method further includes: forming the molded body by molding the molding material provided around the at least one terminal, such that the at least one terminal is integrated and at least partially embedded in and extends through the molded body. The molded body is formed to interact with the at least one terminal such that the end is exposed on a top surface of the molded body relative to the stacking direction of the semiconductor power module. At least one sealing structure is disposed in a boundary region between the exposed end and a molded edge of the molded body, thereby limiting the upper extension of the molded body during the formation of the molded body.

[0016] Because of this, the described method enables the manufacture of embodiments of the aforementioned housing unit for semiconductor power modules, the described features and characteristics of which are also disclosed with respect to the manufacturing method, and vice versa. Therefore, this disclosure comprises several aspects, wherein each feature described with respect to one of these aspects is also disclosed herein with respect to another aspect, even if the corresponding feature is not explicitly mentioned in the context of a particular aspect.

[0017] According to an embodiment of the method, the molding material includes a thermoplastic or thermosetting resin, the thermoplastic or thermosetting resin being configured with a filler material made of particles and / or fibers for injection molding or transfer molding, and the molding body is formed by injection molding or transfer molding using the thermoplastic or thermosetting resin.

[0018] According to a further embodiment of the method, the step of providing and positioning at least one terminal includes providing at least one sealing structure having a recess and / or protrusion formed on the outer surface of the terminal. The method includes positioning the terminal to extend into a cavity of a molding tool such that the recess and / or protrusion restricts the upper level of the cavity prior to forming a molded body by molding. One or more sealing structures of the terminal can be configured to mate with corresponding structures of the molding tool, for example, to achieve a very precise and reliable seal.

[0019] The described configuration of the housing unit enables the mounting of a terminal block, in which main power and / or auxiliary terminals (e.g., for signal wiring) can be incorporated into the molded housing. For example, the terminal block comprises a plurality of vertically arranged and embedded terminals having portions exposed from the molded body, wherein each vertically arranged terminal has at least one sealing feature adjacent to an edge of the molded body. The terminal portions within the housing or the molded body can have any shape and may also have horizontal portions. The described configuration of the housing unit allows for vertically positioned terminals and an enclosed molded body, for example, even when the molding tool comprises two clamping housings, but the terminals are located in positions other than at the interface between the housings of the molding tool. This also refers to a situation where most terminals are arranged horizontally relative to the clamping members of the molding tool, but additional vertically arranged terminals may also be present.

[0020] For example, the terminals may have a copper or copper alloy substrate. Additionally, one or more terminals may include a coating made of or comprising nickel, gold, silver, or any other metal. Terminals may include a coating located on the bottom surface of one or more layers, made of or comprising nickel, gold, silver, and / or other metals. Alternatively or additionally, additional portions or entire terminals may be coated. One or more terminals are specifically designed to securely seal their upper portions and prevent contamination of the upper ends of the terminals, which are intended to protrude from the molded body below.

[0021] Terminal blocks can provide a complete module housing or a portion thereof. The molded body can be made of, or comprise, thermoplastic or thermosetting resins or any other resin material. The molding body can be manufactured by injection molding, transfer molding, or any other suitable molding process. The corresponding molding material may include filler materials such as granules or fibers.

[0022] Due to the specific sealing structure formed on the terminals, contamination of exposed portions (e.g., the respective ends of vertically arranged main terminals and / or auxiliary terminals arranged in the molded body forming the terminal block) can be prevented. Terminals extending vertically from the terminal block may have horizontal or inclined portions within the molded body. Therefore, the corresponding sealing features counteract the exudation of resin components during the molding process of the molded body. The sealing structure may completely or at least partially surround the axis of the terminal, which is adjacent to the edge of the molded portion in contact with the terminal. Therefore, molding material can reliably prevent the terminal portions to be exposed from the terminal block from being covered or contaminated.

[0023] Preparing such terminal blocks or housing portions with integrated power terminals and / or auxiliary terminals can advantageously influence the assembly of the corresponding semiconductor power modules. If at least a portion of the housing and one or more terminals form a common building block (e.g., a housing unit), the assembly of the semiconductor power module can be simplified. On the one hand, only one large portion needs to be implemented into the module assembly, rather than multiple single portions. All terminals can be properly aligned for subsequent bonding processes involving welding or soldering the terminals to a substrate (e.g., an insulating metal substrate). On the other hand, the terminal block or housing unit can serve as a fixing device to support the bonding process. Additionally, pre-producing terminal blocks with integrated terminals as described allows for the implementation of vertical main terminals and / or auxiliary terminals into the semiconductor power module. Alternatively or additionally, one or more terminals embedded in the molded body can each have a predetermined slope or other orientation relative to the vertical or stacking direction.

[0024] In the context of this disclosure, it has been found that, compared to conventional terminals integrated into a molded object, there is a risk that portions of the terminals intended to be exposed from the molded object may be partially covered or contaminated by the molding material. Such risks can be mitigated by using complex and expensive molding tools that provide a proper seal at the terminals to prevent exposed portions from being covered by molding material or contaminated due to the leaching of components of the molding material.

[0025] For example, considering that leadframe-based packaging undergoes a transfer molding process using a molding tool consisting of upper and lower sections, sealing can be achieved by implementing a dambar onto the leadframe. This dambar mechanically connects all horizontally oriented terminals, allowing the two parts of the molding tool to provide a seal by clamping the sides of the dambar. However, this terminal sealing method does not guarantee against leakage and is unsuitable for vertically arranged terminals, especially those with a circular cross-sectional shape, and also unsuitable for terminals located elsewhere on the module body where sealing by the dambar is impossible. In such cases, when the molding tool comprises two clamping housings but the terminals are located elsewhere than at the interface between the housings, the clamping and sealing method does not work properly because vertically arranged terminals cannot be securely enclosed by the molding tool.

[0026] By using the described housing unit and a specially designed and robustly sealed structure on the terminals, it is feasible to prevent or at least counteract the unwanted leakage of molding material into the exposed end areas at low cost. Therefore, the described housing unit contributes to the reliable operation of semiconductor power modules and can be manufactured effortlessly without the need for complex and expensive molding devices. The housing unit further facilitates simple installation in customer applications. The housing unit can be used for large semiconductor power modules and power modules for higher voltage levels. For example, this enables the manufacture of semiconductor power modules with a lateral length or width of 34 mm × 100 mm or even up to 140 mm × 190 mm. In this respect, the lateral length or width extends in a lateral direction perpendicular to the stacking direction of the semiconductor power modules.

[0027] Intentionally introducing a sealing structure to prevent or at least reduce contamination of the exposed portions of the terminals by the molding material has at least some of the following advantages, not only for manufacturers but also for customer acceptance:

[0028] • Improved yield at the supplier's site → Reduced part costs due to less scrapped parts or less rework or cleaning.

[0029] • Reduced tolerances required for auxiliary ends → lower part prices

[0030] • A cleaner optical appearance in the final product compared to unclear seepage / overflow lines → improved customer acceptance.

[0031] • Additional design freedom → providing more space for customer gate units

[0032] The described housing unit can be applied to all power modules having a housing with main terminals and / or auxiliary terminals integrated with the molded body. Attached Figure Description

[0033] Exemplary embodiments are explained below with the help of schematic diagrams and reference numerals. The accompanying drawings show:

[0034] Figure 1 An embodiment of a semiconductor power module with a housing unit is shown in perspective.

[0035] Figure 2-6 An embodiment of the housing unit's terminals and molded body is illustrated in schematic cross-sectional views; and

[0036] Figure 7 A flowchart illustrating an embodiment of a method for manufacturing a housing unit for a semiconductor power module is shown.

[0037] The accompanying drawings are included to provide further understanding. It will be understood that the embodiments shown in the drawings are illustrative and not necessarily drawn to scale. The same reference numerals denote elements or parts having the same function. Where an element or part corresponds to each other in function in different drawings, its description will not be repeated for each of the following drawings. For clarity, elements may not appear with their corresponding reference numerals in all drawings. Detailed Implementation

[0038] Figure 1 The illustration shows a perspective view of an embodiment of a semiconductor power module 1. According to a further embodiment, the semiconductor power module 1 may include, for example... Figure 1 Alternative forms are shown. For example, the semiconductor power module 1 includes a housing unit 2 having a molded body 3 configured to enclose electrical components of the semiconductor power module 1, such as power semiconductor devices, conductive plates, or tracks. The housing unit 2 further includes at least one terminal 10 integrated and at least partially embedded in the molded body 3. Figure 1 The housing unit 2 of the semiconductor power module 1 includes six vertically arranged terminals 10 that extend through the upper surface of the molding body 3, such that the corresponding ends 11 of the associated terminals 10 are at least partially exposed on the upper surface 6 of the molding body 3.

[0039] In this description, terms such as "vertical," "horizontal," "upper," or "lower" refer to... Figure 1 The components illustrated are aligned or oriented as expected under normal operating conditions of the semiconductor power module 1. Therefore, stacking direction A achieves the vertical direction, and the corresponding lateral directions B and C achieve the horizontal direction and span the main extension plane of the semiconductor power module 1. Therefore, the illustrated terminal 10 can be referred to as a vertical terminal.

[0040] The semiconductor power module 1 may further include a substrate or a substrate having the substrate fused thereon. The substrate may be implemented as an isolation substrate or an insulating metal substrate structure, the insulating metal substrate structure including a top metal layer, a bottom metal layer and a dielectric layer in between.

[0041] Terminal 10 further includes at least one sealing structure, the at least one sealing structure being a recess 13 disposed on the outer surface 15 of the corresponding terminal 10 (see Figure 2 and Figure 3 ) or protrusion 14 (see Figure 4 and Figure 5 The corresponding sealing structure is arranged in the boundary region 5 and / or defined during the molding of the molded body 3 in the boundary region 5 between the exposed portion or end 11 and the molding edge 4 of the molded body 3. Thus, the corresponding sealing structure is configured to reliably limit the upper extension of the molded body 3 during the corresponding molding process.

[0042] Figure 2-6 An enlarged cross-sectional view of the boundary region 5 and a possible embodiment of a sealing structure attached to or formed on the outer surface 15 of the terminal 10 are shown. According to... Figure 2 and Figure 3 The sealing structure can be formed as a recess 13 that can completely surround the elongated shaft 12 of the terminal 10. Therefore, the recess 13 can be formed as a circumferential groove having a funnel shape or a groove shape. Considering the illustrated cross-section, the recess 13 can be defined by the remaining outer surface 15 of the terminal 10 as having a square, rectangular, trapezoidal, semi-circular and / or triangular shape.

[0043] The recess 13 forms a free volume to capture and contain molding material during the formation of the molded body 3. Therefore, the molding edge 4 is formed at the shaft 12 and extends into the recess 13. The recess 13, or a typical sealing structure, can be formed in conjunction with a corresponding molding tool required to perform the molding process for producing the molded body 3. Thus, the remaining outer surface at the end is not contaminated by molding material, limiting the upper extension of the molded body.

[0044] according to Figure 4 and Figure 5The sealing structure can alternatively be formed as a protrusion 14 that can completely surround the elongated shaft 12 of the terminal 10. Therefore, the protrusion 14 can be formed as a circumferential ring with a wedge-shaped, spherical, or raised shape. Considering the illustrated cross-section, the protrusion 14 can be formed through the outer surface 15 of the terminal 10 into a square, rectangular, trapezoidal, semi-circular, and / or triangular shape. The protrusion 14 forms a barrier to the molding material and limits the upper extension of the molding edge 4 relative to the stacking direction A. Furthermore, one or more terminals 10 may include a sealing structure having one or more recesses 13 and / or one or more protrusions 14.

[0045] Figure 6 The illustration shows possible dimensions of a sealing structure in the form of a rectangular recess 13. However, these dimensions can also be applied to other shapes of the recess 13 and also to possible shapes of the protrusion 14. Regarding the illustrated cross-sectional view, the recess 13 has a height H along the vertical or stacking direction A and a depth or width W along the radial or lateral directions B, C. For example, the value of the height H can be 0.1-2.0 mm, and the value of the width W can be 0.1-2.0 mm. Depending on the intended application, the height H and / or width W of the recess 13 or the protrusion 14 can alternatively have larger values.

[0046] The described and illustrated configuration of the housing unit 2 with terminals 10 helps prevent resin material contamination of the exposed portions of the vertical main terminals and / or auxiliary terminals 10, or resin components seeping into the area of ​​the exposed ends 11, to provide a reliable electrical connection to other components. Thus, molding material covering the terminal portions to be exposed from the molding body 3 can be counteracted. Terminals 10 can have solid, hollow, or tubular shapes, as well as round or angular shapes. Regarding the completed molding body 3, recesses 13 or protrusions 14 are arranged in the boundary region 5 immediately adjacent to the molding edge 4 of the molding body 3.

[0047] The steps of the corresponding manufacturing method can be followed as follows: Figure 7 The flowchart shown is illustrated. In step S1, a molding material is provided, which is configured as a raw material to form the molded body 3 for the housing unit 2. For example, the molding material may be a thermoplastic and / or thermosetting resin having a filler material made of granules or fibers.

[0048] In a further step S2, one or more terminals 10 are provided and positioned in a molding tool. Each terminal 10 includes a corresponding upper end portion 11 and a lower shaft 12, and at least one sealing structure formed adjacent to the end portion 11 in the form of a recess 13 or a protrusion 14. Terminals 10 with the desired sealing structure can be purchased, or the sealing structure can be formed during the manufacturing process. Thus, one or more recesses 13 can be cut, drilled, turned, punched, or milled into the outer surface 15 of the terminal 10. One or more protrusions 14 can be similarly formed.

[0049] In a further step S3, a molded body can be formed by molding a molding material provided around the placed terminal 10. The housing unit 2 having the molded body 3 and integrated terminal 10 can be manufactured using any type of molding process (e.g., injection molding or transfer molding). Thus, the terminal 10 is integrated into and embedded in the molded body 3 and extends through the molded body 3, with its end 11 exposed on the upper surface 6 of the molded body 3. A sealing structure restricts or limits the upper extension of the molded body 3 in the boundary region 5 between the exposed end 11 and the molding edge 4 of the molded body 3 during its formation. Taking into account the introduced molding fluid, one or more sealing structures can be configured to mate with corresponding structures of the molding tool to achieve precise and reliable sealing and restraint.

[0050] Figures 1 to 7 The embodiments shown represent exemplary embodiments of the improved housing unit 2 and semiconductor power module 1 and their manufacturing methods; therefore, they do not constitute a complete list of all embodiments. For example, the actual arrangement and method of the metal substrate structure and power module may differ from the embodiments shown.

[0051] Figure Labels

[0052] 1. Semiconductor power module

[0053] 2. Shell Unit

[0054] 3. Molded body of the shell

[0055] 4. Molded edges

[0056] 5. Boundary Area

[0057] 6. The upper surface of the molded body

[0058] 10 terminals

[0059] 11. End of terminal

[0060] 12-terminal slender shaft

[0061] 13 Recessed part of terminal

[0062] 14-terminal protrusion

[0063] 15. Outer surface of the terminal

[0064] A. Stacking direction

[0065] B Lateral direction

[0066] C Lateral direction

[0067] H. Height of the sealing structure

[0068] W width of the sealing structure

[0069] S(i) Steps in a method for manufacturing a housing unit for a semiconductor power module

Claims

1. A housing unit (2) for a semiconductor power module (1), characterized in that, include: - A molded body (3) is configured to enclose the electrical components of the semiconductor power module (1), and - At least one terminal (10) is integrated and partially embedded in the molded body (3) such that the at least one terminal (10) extends through the molded body (3), and the end (11) of the at least one terminal (10) is exposed on the upper surface (6) of the molded body (3) relative to the stacking direction (A) of the semiconductor power module (1), wherein the at least one terminal (10) further includes at least one sealing structure (13, 14) disposed in a boundary region (5) between the exposed end (11) and the molded edge (4) of the molded body (3), the sealing structure (13, 14) being configured to restrict the upper extension of the molded body (3), wherein the sealing structure includes at least one recess (13) formed on the outer surface (15) of the at least one terminal, and wherein the at least one recess (13) includes a height (H) having a value of 0.1-2.0 mm relative to the stacking direction (A) and / or includes a height (H) having a value of 0.1-2.0 mm relative to the lateral directions (B, C). The depth (W) is mm, and the height and the depth are respectively relative to the outer surface (15) of the at least one terminal (10) adjacent to the corresponding sealing structure (13, 14).

2. The housing unit (2) according to claim 1, characterized in that, The sealing structures (13, 14) are formed on the outer surface (15) of the at least one terminal (10) such that they partially or completely surround the terminal (10) relative to the lateral directions (B, C) perpendicular to the stacking direction (A).

3. The housing unit (2) according to claim 1 or 2, characterized in that, The molded edge (4) of the molded body (3) extends into the at least one recess (13).

4. The housing unit (2) according to claim 1 or 2, characterized in that, The sealing structure includes at least one protrusion (14) formed on the outer surface (15) of the at least one terminal (10).

5. The housing unit (2) according to claim 4, characterized in that, The at least one protrusion (14) restricts the upper extension of the molding edge (4) of the molding body (3) relative to the stacking direction (A).

6. The housing unit (2) according to claim 1 or 2, characterized in that, The at least one terminal (10) includes two or more sealing structures (13, 14) formed in a boundary region (5) between the exposed end (11) and the molded edge (4) of the molded body (3), wherein each of the sealing structures (13, 14) includes at least one of a recess (13) and a protrusion formed on the outer surface (15) of the at least one terminal (10).

7. The housing unit (2) according to claim 1 or 2, characterized in that, The sealing structure (13, 14) is integrally formed with the terminal (10).

8. The housing unit (2) according to claim 1 or 2, characterized in that, Regarding the cross-section along the stacking direction (A), the sealing structures (13, 14) form at least one of the shapes of a square, rectangle, trapezoid, semicircle and triangle.

9. The housing unit (2) according to claim 1 or 2, characterized in that, The at least one terminal (10) is formed as solid or hollow and includes an elongated shaft (12) relative to the stacking direction (A), the elongated shaft having at least one of cylindrical, cuboid and ellipsoidal shapes.

10. A semiconductor power module (1), characterized in that, include: - The housing unit (2) according to any of the preceding claims, and - Electrical components arranged inside the housing unit (2).

11. The semiconductor power module (1) according to claim 10, characterized in that, include: An isolation substrate having an isolation sheet made of ceramic material and at least one metallized layer, wherein the isolation substrate is electrically connected to the housing unit (2) via the at least one terminal (10).

Images