Image capturing module and endoscope

Abstract

The utility model relates to the technical field of endoscopes, in particular to an image capturing module and an endoscope. The image capturing module comprises a lens assembly, a circuit board and a transmission structure, the lens assembly is arranged at one end of the circuit board and electrically connected to the circuit board, the transmission structure comprises a flexible circuit board, one end of the flexible circuit board is provided with a plurality of second conductive parts arranged at intervals in the width direction of the flexible circuit board, and the second conductive parts are configured to be electrically connected with the first conductive parts. The other end of the flexible circuit board is provided with a third conductive part, and the third conductive part is configured to be connected with an external circuit. The wire harness of the lens assembly is welded on the circuit board in an aligned manner, then the flexible circuit board of the transmission structure is welded with the circuit board in an aligned manner, and the flexible circuit board is connected to the external circuit, so that the welding process is effectively simplified, and the connection reliability and the connection efficiency are improved.

Description

Technical Field

[0001] This application relates to the field of endoscope technology, and more particularly to an image acquisition module and an endoscope. Background Technology

[0002] Endoscopes are widely used in the medical field for the diagnosis and treatment of diseased tissues within the body. Endoscopes used in the diagnosis and treatment of diseases in the urinary tract, biliary tract, and bronchi have a small outer diameter head, and the head typically houses an image acquisition module, an illumination module, and a circuit board.

[0003] Most endoscopes in related technologies use small image acquisition modules connected to long coaxial cables by welding. With technological upgrades, the number of wires required for the image acquisition module interface has increased. This not only significantly increases the difficulty of welding, but also poses a great challenge to production operations due to the limited welding space caused by the miniaturization of the image acquisition module, coupled with the large number of wires and the need for strict one-to-one signal connection in sequence, which seriously reduces production efficiency. Utility Model Content

[0004] This application discloses an imaging module and an endoscope, which can effectively simplify the alignment welding process and improve welding reliability and efficiency.

[0005] To achieve the above objectives, firstly, this application discloses an image-capturing module, comprising:

[0006] Lens assembly;

[0007] The circuit board, wherein the lens assembly is disposed at one end of the circuit board and electrically connected to the circuit board, and the other end of the circuit board is provided with a plurality of spaced first conductive parts;

[0008] A transmission structure includes a flexible circuit board. One end of the flexible circuit board is provided with a plurality of spaced second conductive portions, which are configured to be electrically connected to the first conductive portions in a one-to-one correspondence, so that the flexible circuit board is electrically connected to the circuit board. The other end of the flexible circuit board is provided with a third conductive portion, which is configured to connect to an external circuit.

[0009] The flexible circuit board has a first surface and a second surface opposite each other along its thickness direction. The second conductive part is provided with a first receiving part, which penetrates through the first surface and the second surface. The first receiving part is configured to receive conductive material to connect the first conductive part and the second conductive part.

[0010] This application achieves electrical connection between a lens assembly and external circuitry using a flexible circuit board. The lens assembly is positioned at one end of the circuit board, and a first conductive portion is located at the other end. A second conductive portion is located at one end of the flexible circuit board, and a third conductive portion is located at the other end. By aligning and soldering the first and second conductive portions, the lens assembly and external circuitry are connected without the need for repeated wiring, effectively simplifying the soldering process and further improving production efficiency.

[0011] Furthermore, by using a flexible circuit board to connect the lens assembly to external circuitry, multiple signal lines can be integrated together. This results in a thin, lightweight structure with high integration, which improves space utilization and assembly efficiency of the imaging module. Additionally, by reducing the space occupied by the endoscope, the size of the endoscope lens section can be effectively reduced, allowing the endoscope to adapt to more confined environments and broadening its applicability. Moreover, the flexible circuit board provides excellent electrical performance. Electrically connecting the flexible circuit board to the lens assembly and external circuitry effectively improves the reliability of the connection between the lens assembly and external circuitry, thereby enhancing signal transmission stability. Specifically, the first receiving portion penetrates the first and second surfaces of the flexible circuit board to achieve an electrical connection between the flexible circuit board and the circuit board. This makes it easier for solder to remain on the first receiving portion, improving the connection reliability and soldering quality between the flexible circuit board and the circuit board.

[0012] In some possible implementations, both the first surface and the second surface are provided with the second conductive portion.

[0013] By setting second conductive parts on both surfaces of the flexible circuit board and achieving conduction through the first accommodating part, the conductivity of the flexible circuit board can be improved, thereby further enhancing the stability and integrity of signal transmission.

[0014] In some possible implementations, a plurality of second conductive portions are spaced apart along a first direction, and / or, a plurality of second conductive portions are spaced apart along a second direction, with the second conductive portions corresponding to the first conductive portions;

[0015] Wherein, the first direction is the width direction of the flexible circuit board, and the second direction intersects with the first direction.

[0016] For example, a plurality of second conductive parts may be spaced apart along a first direction, or a plurality of second conductive parts may be spaced apart along a second direction, or a plurality of second conductive parts may be spaced apart along a first direction and a plurality of second conductive parts may be spaced apart along a second direction. The embodiments of this application do not limit this.

[0017] When multiple second conductive parts are spaced apart along a first direction and also spaced apart along a second direction, the welding process can be effectively simplified and production efficiency improved because repeated wire arrangement is unnecessary. Furthermore, this arrangement can effectively increase the number of interface lines on the flexible circuit board, facilitating the adaptation of more lens assemblies.

[0018] In some possible implementations, a plurality of second conductive portions are spaced apart along the first direction, a plurality of second conductive portions are spaced apart along the second direction, and the second conductive portions are corresponding to the first conductive portions;

[0019] The two adjacent second conductive portions are staggered along the first direction, and / or the two adjacent second conductive portions are staggered along the second direction.

[0020] Multiple second conductive parts are staggered along the first direction and / or the second direction, which can effectively improve the space utilization of the flexible circuit board, thereby effectively reducing the size of the flexible circuit board and meeting the miniaturization design requirements of endoscopes.

[0021] In some possible implementations, the second conductive portion extends along the second direction, and in the first direction, a plurality of second conductive portions are spaced apart. The second conductive portion has a first end and a second end opposite to each other along the second direction, and the first receiving portion on two adjacent second conductive portions is respectively disposed at the first end and the second end.

[0022] This design avoids solder joints on adjacent second conductive parts, thus effectively preventing short circuits between two adjacent second conductive parts.

[0023] In some possible implementations, the third conductive portion includes an encapsulation portion and a plurality of connecting portions, the encapsulation portion being disposed on the first surface, and the plurality of connecting portions being disposed on two opposite sides of the encapsulation portion, the connecting portions being configured to connect to external circuitry.

[0024] By setting up a packaging section and a connecting section for connecting external lines, multiple signal lines can be integrated together. Its structure is thin and light with high integration, which is conducive to improving the space utilization and assembly efficiency of the imaging module.

[0025] In some possible implementations, both the first surface and the second surface are provided with the third conductive portion, and the third conductive portion is provided with a second receiving portion, which penetrates through the first surface and the second surface. In the width direction of the flexible circuit board, the second receiving portions on two adjacent third conductive portions are staggered, and the second receiving portion is configured to receive conductive material.

[0026] In this way, the third conductive part can be electrically connected to the external circuit to realize signal transmission to the lens assembly. In addition, the second receiving parts on two adjacent third conductive parts are staggered, which can effectively prevent the solder of two adjacent third conductive parts from connecting, thereby effectively avoiding the problem of short circuit between two adjacent third conductive parts.

[0027] In some possible implementations, the second conductive portion includes opposing first and second sides, the first side being disposed at one edge of the flexible circuit board along its length direction, the first side being provided with the first receiving portion, the first receiving portion being configured to penetrate the flexible circuit board along its length direction.

[0028] Based on fluid dynamics principles, the solder flows within the notch, resulting in better edge connection reliability for the second conductive part. Furthermore, due to adhesion, the notch can absorb solder, and the solder does not easily diffuse, making it difficult for adjacent second conductive parts to connect. This effectively improves the welding quality between the flexible circuit board and the circuit board, thereby enhancing the reliability of the endoscope.

[0029] In some possible implementations, the circuit board has opposing third and fourth surfaces along its thickness direction, and both the third and fourth surfaces are provided with the first conductive portion;

[0030] The flexible circuit board includes two flexible circuit boards, which are spaced apart. The circuit board is configured to be inserted between the two flexible circuit boards so that the first conductive part and the second conductive part are connected accordingly.

[0031] Considering the gradual upgrading of technology, the number of interface lines of the lens assembly is gradually increasing. By setting the first conductive part on both the third and fourth surfaces of the circuit board, the number of the first conductive part can be effectively increased, thereby increasing the number of interface lines of the circuit board and improving the applicability of the imaging module.

[0032] In some possible implementations, the imaging module further includes a housing, in which the lens assembly and the circuit board are disposed, and a portion of the circuit board is configured to be exposed outside the housing so that the first conductive portion and the second conductive portion are correspondingly electrically connected.

[0033] Because endoscopes operate in complex environments, a housing provides waterproof and dustproof protection for internal components such as the lens assembly and circuit boards. Simultaneously, the housing also provides structural strength to the lens assembly, enabling the endoscope to adapt to various application scenarios.

[0034] In some possible implementations, the first conductive portion and / or the second conductive portion and / or the third conductive portion are gold fingers.

[0035] Gold fingers achieve good conductivity by electroplating a layer of gold on the surface of the conductive contact. By configuring the first conductive part and / or the second conductive part and / or the third conductive part as gold fingers, the transmission efficiency and stability of the signal can be effectively improved, which is beneficial to improving the real-time performance and accuracy of the endoscope.

[0036] In some possible implementations, the transmission structure further includes a sleeve in which the flexible circuit board is disposed.

[0037] Understandably, since the flexible circuit board is long and narrow, placing it inside the sleeve can protect it from water and dust, and prevent it from being damaged by the external environment, thereby effectively improving the reliability of the endoscope.

[0038] Secondly, this application also includes an endoscope comprising a display module and an image acquisition module as described in the first aspect above, the image acquisition module being electrically connected to the display module via the flexible circuit board.

[0039] Compared with the prior art, the beneficial effects of this application are:

[0040] This application discloses an imaging module and endoscope. The imaging module includes a lens assembly, a circuit board, and a transmission structure. The lens assembly is disposed at one end of the circuit board and electrically connected to the circuit board. The transmission structure includes a flexible circuit board. One end of the flexible circuit board has a plurality of second conductive portions spaced apart along its width direction. The second conductive portions are configured to be electrically connected to first conductive portions, thereby electrically connecting the flexible circuit board to the circuit board. The other end of the flexible circuit board has a third conductive portion, which is configured to connect to external circuitry. By aligning and soldering the signal lines of the lens assembly onto the circuit board, and then aligning and soldering the flexible circuit board of the transmission structure to the circuit board and connecting it to external circuitry, repeated cable management is eliminated, effectively simplifying the soldering process and improving connection reliability and efficiency. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1A This is a schematic diagram of the imaging module provided in the embodiments of this application;

[0043] Figure 1B A schematic diagram of the imaging module (excluding housing and casing) provided in the embodiments of this application;

[0044] Figure 2 This is a schematic diagram of the lens assembly and circuit board provided in the embodiments of this application;

[0045] Figure 3 A schematic diagram of the third surface of the lens assembly and circuit board provided in an embodiment of this application;

[0046] Figure 4 A schematic diagram of the fourth surface of the lens assembly and circuit board provided in an embodiment of this application;

[0047] Figure 5 A schematic diagram of the first surface of a flexible circuit board provided in an embodiment of this application;

[0048] Figure 6 A schematic diagram of the second surface of a flexible circuit board provided in an embodiment of this application;

[0049] Figure 7 A schematic diagram of the first surface of another flexible circuit board provided in an embodiment of this application;

[0050] Figure 8 A schematic diagram of the second surface of another flexible circuit board provided in an embodiment of this application;

[0051] Figure 9 This is a schematic diagram of the structure of an imaging module provided in another embodiment of this application;

[0052] Figure 10 A schematic diagram of the third surface of a lens assembly and a circuit board provided in another embodiment of this application;

[0053] Figure 11 A schematic diagram of the fourth surface of the lens assembly and circuit board provided in another embodiment of this application;

[0054] Figure 12 A schematic diagram of the first surface of a flexible circuit board provided in another embodiment of this application;

[0055] Figure 13 A schematic diagram of the second surface of a flexible circuit board provided in another embodiment of this application;

[0056] Figure 14 This is a schematic diagram of the structure of an endoscope provided in an embodiment of this application.

[0057] Explanation of reference numerals in the attached figures:

[0058] 100 - Image capturing module; 10 - Lens assembly;

[0059] 20 - Circuit board; 21 - First conductive part; 22 - Third surface; 23 - Fourth surface;

[0060] 30 - Transmission structure; 31 - Flexible circuit board; 312 - Second conductive part; 3121 - First receiving part; 3122 - Notch; 3123 - First side; 3124 - Second side; 3125 - First end; 3126 - Second end; 313 - Third conductive part; 3131 - Second receiving part; 3132 - Encapsulation part; 3133 - Connecting part; 314 - First surface; 315 - Second surface; 3151 - Reinforcing structure; 32 - Sleeve;

[0061] 40 - Casing;

[0062] 200 - Endoscope; 210 - Display module;

[0063] F1 - Width direction; F2 - Length direction; F3 - Thickness direction. Detailed Implementation

[0064] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0065] In this application, the terms "upper," "inner," "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0066] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0067] Furthermore, the terms "set up," "equipped with," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0068] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0069] Endoscopes, as precision instruments in the medical field, play an indispensable role in diagnosing and treating diseased tissues within the body due to their unique advantages. Especially in the diagnosis and treatment of narrow and complex areas such as the urinary tract, biliary tract, and bronchi, endoscopes, with their small head diameter and high degree of functional integration, have become essential medical tools for doctors. Of course, endoscopes are not only widely used in the medical equipment field, but also in industrial detection, security inspection, and other fields.

[0070] The head of these endoscopes often compactly integrates several key components, including an image acquisition module, an illumination module, and a circuit board, working together to complete high-quality image acquisition and transmission. However, with continuous technological advancements and upgrades, endoscope design also faces numerous challenges. Most endoscopes in related technologies employ small image acquisition modules, connected via long coaxial cables. While this approach meets basic functional requirements to some extent, the increasing number of lines required for the image acquisition module interface significantly increases the soldering difficulty. Even more challenging is the fact that the miniaturization trend of image acquisition modules has led to increasingly limited soldering space, undoubtedly posing a significant challenge to production operations.

[0071] Specifically, an increased number of wires means more solder joints are needed. These joints not only require absolute precision but also strict, one-to-one signal connections in a precise sequence. Performing such complex soldering operations within such a confined space not only consumes a significant amount of the production workers' time but also tests their skill level and poses a severe challenge to production efficiency. A deviation or malfunction at even a single solder joint can impair the performance of the entire endoscope or even render it unusable.

[0072] In view of this, the imaging module and endoscope disclosed in this application are made by aligning and soldering multiple signal lines of the lens assembly onto the circuit board, and then using the flexible circuit board in the transmission structure to align and solder with the circuit board and connect to the external circuit, thereby effectively simplifying the soldering process, improving the connection efficiency, and improving the connection reliability by using the flexible circuit board.

[0073] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0074] Please refer to the following: Figures 1A to 5 ,in, Figure 1AThis is a schematic diagram of the imaging module provided in the embodiments of this application. Figure 1B This is a schematic diagram of the imaging module (excluding the housing and casing) provided in the embodiments of this application. Figure 2 This is a schematic diagram of the lens assembly and circuit board provided in an embodiment of this application. Figure 3 This is a schematic diagram of the third surface of the lens assembly and circuit board provided in an embodiment of this application. Figure 4 This is a schematic diagram of the fourth surface of the lens assembly and circuit board provided in an embodiment of this application. Figure 5 This is a schematic diagram of the first surface of a flexible circuit board provided in an embodiment of this application. In a first aspect, this application discloses an image acquisition module 100, which is applied to an endoscope 200. The image acquisition module 100 includes a lens assembly 10, a circuit board 20, and a transmission structure 30. The lens assembly 10 is disposed at one end of the circuit board 20 and electrically connected to the circuit board 20. The other end of the circuit board 20 has a plurality of first conductive portions 21 spaced apart along its width direction F1. The transmission structure 30 includes a flexible circuit board 31. One end of the flexible circuit board 31 has a plurality of second conductive portions 312 spaced apart along its width direction F1. The second conductive portions 312 are configured to be electrically connected to the first conductive portions 21, so that the flexible circuit board 31 is electrically connected to the circuit board 20. The other end of the flexible circuit board 31 has a third conductive portion 313, which is configured to connect to external circuitry.

[0075] This application achieves electrical connection between the lens assembly 10 and external circuitry using the flexible circuit board 31 of the transmission structure 30. Specifically, the lens assembly 10 is positioned at one end of the circuit board 20, and a first conductive portion 21 is provided at the other end of the circuit board 20. Furthermore, a second conductive portion 312 is provided at one end of the flexible circuit board 31, and a third conductive portion 313 is provided at the other end. By aligning and soldering the first conductive portion 21 and the second conductive portion 312, the lens assembly 10 can be connected to the external circuitry without the need for repeated wiring, thus effectively simplifying the soldering process and further improving production efficiency.

[0076] Furthermore, by using a flexible circuit board 31 to connect the lens assembly 10 to external circuitry, multiple signal lines can be integrated together. This results in a thin, lightweight structure with high integration, which improves space utilization and assembly efficiency of the imaging module 100. Additionally, by reducing the space occupied by the endoscope 200, the size of the endoscope head can be effectively reduced, allowing the endoscope 200 to adapt to more confined environments and broadening its applicability. Moreover, the flexible circuit board 31 provides excellent electrical performance. Electrically connecting the flexible circuit board 31 to the lens assembly 10 and external circuitry effectively improves the reliability of the connection between the lens assembly 10 and external circuitry, thereby enhancing the stability of signal transmission.

[0077] The circuit board 20 can be a printed circuit board or a flexible circuit board; this embodiment does not specifically limit it.

[0078] In some embodiments, the first conductive portion 21 and / or the second conductive portion 312 and / or the third conductive portion 313 can be gold fingers. Gold fingers achieve good conductivity by electroplating a layer of gold on the surface of the conductive contact. Configuring the first conductive portion 21 and / or the second conductive portion 312 and / or the third conductive portion 313 as gold fingers can effectively improve signal transmission efficiency and stability, which is beneficial to improving the real-time performance and accuracy of the endoscope 200.

[0079] In another embodiment, the first conductive part 21 and / or the second conductive part 312 and / or the third conductive part 313 may also be a solder pad. The solder pad is simple to manufacture, has low cost, and can be widely used in fixed-mount electronic components, making it highly applicable.

[0080] Please refer to it again. Figure 1A In some embodiments, the imaging module 100 further includes a housing 40, in which the lens assembly 10 and circuit board 20 are disposed. Part of the circuit board 20 is configured to be exposed outside the housing 40, so that the first conductive part 21 and the second conductive part 312 are electrically connected. Since the endoscope 200 will experience complex environments, the housing 40 provides waterproof and dustproof protection for internal components such as the lens assembly 10 and circuit board 20. Simultaneously, the housing 40 also provides structural strength for the lens assembly 10, which helps the endoscope 200 adapt to various application scenarios.

[0081] Optionally, the material of the housing 40 may include, but is not limited to, a flexible soft housing or a rigid housing 40. The material of the housing 40 can be flexibly changed according to different application scenarios, and this application embodiment does not limit it in this regard. For example, in the field of medical devices, the housing 40 of the endoscope 200 can be a flexible soft housing.

[0082] Please refer to it again. Figure 1A In some embodiments, the transmission structure 30 further includes a sleeve 32, in which the flexible circuit board 31 is disposed. It is understood that the flexible circuit board 31 is elongated, and placing the flexible circuit board 31 in the sleeve 32 can provide waterproofing and dustproofing for the flexible circuit board 31, and prevent the flexible circuit board 31 from being damaged by the external environment, thereby effectively improving the reliability of the endoscope 200.

[0083] Optionally, the material of the sleeve 32 may include, but is not limited to, flexible hose, rigid sleeve 32 or telescopic sleeve 32, etc., and the embodiments of this application do not limit this.

[0084] Please refer to it again. Figures 3 to 4In some embodiments, the circuit board 20 has opposing third surfaces 22 and fourth surfaces 23 along its thickness direction F3, and both the third surface 22 and the fourth surface 23 are provided with first conductive portions 21. Two flexible circuit boards 31 are included, spaced apart, and the circuit board 20 is configured to be inserted between the two flexible circuit boards 31 so that the first conductive portions 21 and the second conductive portions 312 are correspondingly connected.

[0085] Considering the gradual upgrading of technology, the number of interface lines of the lens assembly 10 is gradually increasing. By providing first conductive parts 21 on both the third surface 22 and the fourth surface 23 of the circuit board 20, the number of first conductive parts 21 can be effectively increased, thereby increasing the number of interface lines of the circuit board 20 and thus improving the applicability of the image acquisition module 100.

[0086] Please refer to the following: Figure 1B , Figures 5 to 6 ,in, Figure 6 This is a schematic diagram of the second surface of a flexible circuit board provided in an embodiment of this application. In some embodiments, the flexible circuit board 31 has a first surface 314 and a second surface 315 opposite to each other along its thickness direction F3. A first receiving portion 3121 is provided on the second conductive portion 312, which penetrates the first surface 314 and the second surface 315. The first receiving portion 3121 is configured to receive conductive material. The first receiving portion 3121 is used for soldering to achieve an electrical connection between the flexible circuit board 31 and the circuit board 20, making it easier for solder to remain on the first receiving portion 3121, thereby improving the connection reliability and soldering quality between the flexible circuit board 31 and the circuit board 20.

[0087] The shape of the first receiving portion 3121 can be circular, elliptical, triangular, rectangular, semi-circular, etc., and this application embodiment does not limit this.

[0088] The conductive material may include, but is not limited to, copper, solder, hard gold, electroplated nickel-gold, etc., and the embodiments of this application do not limit it.

[0089] Optionally, the first receiving portion 3121 can be a metallized hole, that is, a thin layer of copper is plated on the hole wall of the first receiving portion 3121 using chemical plating and electroplating methods, so that the first surface 314 and the second surface 315 of the flexible circuit board 31 are electrically connected to each other, which can effectively enhance the connection reliability of the flexible circuit board 31, provide good electrical performance for the imaging module, and thus improve the reliability of the endoscope 200.

[0090] Optionally, both the first surface 314 and the second surface 315 are provided with a second conductive part 312. By providing a second conductive part 312 on both surfaces of the flexible circuit board 31 and achieving conduction through the first receiving part 3121, the conductivity of the flexible circuit board 31 can be improved, thereby further improving the stability and integrity of signal transmission.

[0091] Please see Figure 5 Optionally, the second conductive portion 312 extends along the length direction F2 of the flexible circuit board 31. Multiple second conductive portions 312 are spaced apart along the width direction F1 of the flexible circuit board 31. Each second conductive portion 312 has a first end 3125 and a second end 3126 opposite to each other along the second direction F2. The first receiving portion 3121 on two adjacent second conductive portions 312 is respectively disposed at the first end 3125 and the second end 3126, which can prevent the solder on adjacent second conductive portions 312 from connecting, thereby effectively avoiding the problem of short circuit between two adjacent second conductive portions 312.

[0092] Optionally, the first receiving portion 3121 is located at the edge of the second conductive portion 312 along its length direction F2. In the width direction F1 of the flexible circuit board 31, the positions of two adjacent first receiving portions 3121 can be kept as far apart as possible, further avoiding the connection of solder on adjacent second conductive portions 312, thereby effectively avoiding the problem of short circuit between two adjacent second conductive portions 312.

[0093] Optionally, both the first surface 314 and the second surface 315 are provided with a third conductive portion 313, and the third conductive portion 313 is provided with a second receiving portion 3131. The second receiving portion 3131 penetrates through the first surface 314 and the second surface 315. In the width direction F1 of the flexible circuit board 31, the second receiving portions 3131 on two adjacent third conductive portions 313 are staggered. The second receiving portion 3131 is configured to accommodate conductive material. In this way, the third conductive portion 313 can be electrically connected to an external circuit to realize signal transmission to the lens assembly 10. In addition, the staggered arrangement of the second receiving portions 3131 on two adjacent third conductive portions 313 can effectively prevent the solder of two adjacent third conductive portions 313 from connecting, thereby effectively avoiding the problem of short circuit between two adjacent third conductive portions 313.

[0094] The shape of the second receiving portion 3131 can be circular, elliptical, triangular, rectangular, semi-circular, etc., and this application embodiment does not limit this.

[0095] Please refer to the following: Figures 7 to 8 ,in, Figure 7 This is a schematic diagram of the first surface of another flexible circuit board provided in an embodiment of this application. Figure 8This is a schematic diagram of the second surface of another flexible circuit board provided in an embodiment of this application. In some embodiments, the second conductive portion 312 includes a first side 3123 and a second side 3124 facing each other. The first side 3123 is located at the edge of one end of the flexible circuit board 31 along its length direction F2. The first receiving portion 3121 can be a notch 3122. The first side 3123 has a notch 3122, which penetrates the flexible circuit board 31 along its length direction F2. Based on the principle of fluid dynamics, solder flows in the notch 3122, which makes the edge connection reliability of the second conductive portion 312 better. In addition, due to adhesion, solder can be adsorbed at the notch 3122, and the solder does not easily diffuse, making it difficult for two adjacent second conductive portions 312 to connect. This effectively improves the welding quality between the flexible circuit board 31 and the circuit board 20, thereby improving the reliability of the endoscope 200.

[0096] Optionally, the notch 3122 can be semi-circular. A semi-circular notch 3122 is more conducive to the flow of solder at the notch 3122, and it is easier to process and has a lower manufacturing cost. Of course, in other embodiments, the notch 3122 can also be other shapes, such as polygons, rectangles, etc.

[0097] Optionally, the notch 3122 can be a metallized hole, which can also improve the electrical connection effect of the flexible circuit board 31, enhance the connection reliability of the flexible circuit board 31, thereby providing good electrical performance for the imaging module and improving the reliability of the endoscope 200.

[0098] Please see Figures 9 to 13 ,in, Figure 9 This is a schematic diagram of the structure of an imaging module provided in another embodiment of this application. Figure 10 This is a schematic diagram of the third surface of the lens assembly and circuit board provided in another embodiment of this application. Figure 11 This is a schematic diagram of the fourth surface of the lens assembly and circuit board provided in another embodiment of this application. Figure 12 This is a schematic diagram of the first surface of a flexible circuit board provided in another embodiment of this application. Figure 13 This is a schematic diagram of the second surface of a flexible circuit board according to another embodiment of this application. In some embodiments, a plurality of second conductive portions 312 are spaced apart along a first direction F1, and / or, a plurality of second conductive portions 312 are spaced apart along a second direction F2, with the second conductive portions 312 corresponding to the first conductive portions 21. The first direction is the width direction F1 of the flexible circuit board 31, and the second direction F2 intersects the first direction F1.

[0099] For example, a plurality of second conductive portions 312 may be spaced apart along the first direction, or a plurality of second conductive portions 312 may be spaced apart along the second direction, or a plurality of second conductive portions 312 may be spaced apart along the first direction F1 and spaced apart along the second direction. This application embodiment does not limit this.

[0100] When multiple second conductive parts 312 are spaced apart along the first direction and also spaced apart along the second direction, the welding process can be effectively simplified and production efficiency improved because there is no need for repeated wire arrangement. Furthermore, this arrangement can effectively increase the number of interface lines on the flexible circuit board 31, which is beneficial for adapting to more lens assemblies 10.

[0101] Specifically, the shape of the second conductive part 312 may include, but is not limited to, a circle, an ellipse, a rectangle, a polygon, etc., and the embodiments of this application do not limit this.

[0102] It is understood that the first direction is the width direction F1 of the flexible circuit board 31, and the second direction can be the length direction F2 of the flexible circuit board 31, or the thickness direction F3 of the flexible circuit board 31. Since the second conductive part 312 is disposed on the first surface 314, the second direction is the length direction F2 of the flexible circuit board 31.

[0103] Please see Figure 12 Optionally, when multiple second conductive parts 312 are spaced apart along the first direction F1 and multiple second conductive parts 312 are spaced apart along the second direction F2, the second conductive parts 312 are correspondingly arranged with the first conductive parts 21, and two adjacent second conductive parts 312 are staggered along the first direction F1 and two adjacent second conductive parts 312 are staggered along the second direction F2. This can effectively improve the space utilization of the flexible circuit board 31, thereby effectively reducing the size of the flexible circuit board 31 and meeting the miniaturization design requirements of the endoscope 200.

[0104] Please see Figures 12 to 13 Optionally, the third conductive part 313 includes an encapsulation part 3132 and a plurality of connecting parts 3133. The encapsulation part 3132 is disposed on the first surface 314, and the plurality of connecting parts 3133 are disposed on opposite sides of the encapsulation part 3132 along the first direction. The plurality of connecting parts 3133 are spaced apart on the first surface 314 along the second direction. The connecting parts 3133 are configured to connect to external circuits. A reinforcing structure 3151 is provided at one end of the second surface 315 near the third conductive part 313.

[0105] By providing the encapsulation part 3132 and the connecting part 3133 for connecting external lines, multiple signal lines can be integrated together. This results in a thin, lightweight structure with high integration, which improves space utilization and assembly efficiency of the imaging module 100. Furthermore, the reinforcing structure 3151, located on the second surface 315 near the third conductive part 313, effectively enhances the mechanical strength and structural stability of the flexible circuit board 31, thereby improving the reliability of the imaging module 100.

[0106] Specifically, the encapsulation part 3132 includes, but is not limited to, a rectangular encapsulation plate, an encapsulation shell, etc., and the connection part 3133 includes, but is not limited to, a metal conductive sheet, a metal conductive strip, etc., which are not limited in this application embodiment.

[0107] Please see Figure 14 ,in, Figure 14 This is a schematic diagram of the endoscope provided in an embodiment of this application. In a second aspect, this application also discloses an endoscope 200, which includes a display module 210 and an image acquisition module 100 as described in the first aspect above. The image acquisition module 100 is electrically connected to the display module 210 via a flexible circuit board 31. Having the image acquisition module 100 described in the first aspect also enables the lens assembly 10 to be connected to external circuits (e.g., the display module 210) via a third conductive portion 313 on the flexible circuit board 31, eliminating the need for repeated wiring, thereby effectively simplifying the welding process and further improving production efficiency.

[0108] The display module 210 can be a touch screen, an LCD screen, or the like, used to display image information acquired by the lens assembly 10.

[0109] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An image acquisition module, used in an endoscope, characterized in that, include: Lens assembly; The circuit board, wherein the lens assembly is disposed at one end of the circuit board and electrically connected to the circuit board, and the other end of the circuit board is provided with a plurality of spaced first conductive parts; A transmission structure includes a flexible circuit board. One end of the flexible circuit board is provided with a plurality of spaced second conductive portions, which are configured to be electrically connected to the first conductive portions in a one-to-one correspondence, so that the flexible circuit board is electrically connected to the circuit board. The other end of the flexible circuit board is provided with a third conductive portion, which is configured to connect to an external circuit. The flexible circuit board has a first surface and a second surface opposite each other along its thickness direction. The second conductive part is provided with a first receiving part, which penetrates through the first surface and the second surface. The first receiving part is configured to receive conductive material to connect the first conductive part and the second conductive part.

2. The imaging module according to claim 1, characterized in that, Both the first surface and the second surface are provided with the second conductive portion.

3. The image acquisition module according to claim 1, characterized in that, A plurality of second conductive portions are spaced apart along a first direction, and / or a plurality of second conductive portions are spaced apart along a second direction, wherein the second conductive portions are corresponding to the first conductive portions; Wherein, the first direction is the width direction of the flexible circuit board, and the second direction intersects with the first direction.

4. The imaging module according to claim 1, characterized in that, A plurality of second conductive portions are spaced apart along a first direction, and a plurality of second conductive portions are spaced apart along a second direction, with the second conductive portions corresponding to the first conductive portions; The two adjacent second conductive portions are staggered along the first direction, and / or the two adjacent second conductive portions are staggered along the second direction; Wherein, the first direction is the width direction of the flexible circuit board, and the second direction intersects with the first direction.

5. The imaging module according to claim 1, characterized in that, The second conductive portion extends along the second direction. In the first direction, a plurality of second conductive portions are spaced apart. Each second conductive portion has a first end and a second end opposite to each other along the second direction. The first receiving portion on two adjacent second conductive portions is respectively disposed at the first end and the second end. Wherein, the first direction is the width direction of the flexible circuit board, and the second direction intersects with the first direction.

6. The imaging module according to any one of claims 1-5, characterized in that, Both the first surface and the second surface are provided with the third conductive portion, and the third conductive portion is provided with a second receiving portion. The second receiving portion penetrates through the first surface and the second surface. In the width direction of the flexible circuit board, the second receiving portions on two adjacent third conductive portions are staggered. The second receiving portion is configured to receive conductive material.

7. The imaging module according to any one of claims 1-5, characterized in that, The second conductive portion includes a first side and a second side opposite to each other. The first side is located at the edge of one end of the flexible circuit board along its length direction. The first side is provided with the first receiving portion, which is configured to penetrate the flexible circuit board along its length direction.

8. The imaging module according to any one of claims 1-5, characterized in that, The circuit board has a third surface and a fourth surface opposite each other along its thickness direction, and the first conductive portion is provided on both the third surface and the fourth surface. The flexible circuit board includes two flexible circuit boards, which are spaced apart. The circuit board is configured to be inserted between the two flexible circuit boards so that the first conductive part and the second conductive part are connected accordingly.

9. The imaging module according to any one of claims 1-5, characterized in that, The third conductive portion includes an encapsulation portion and a plurality of connecting portions. The encapsulation portion is disposed on the first surface, and the plurality of connecting portions are disposed on two opposite sides of the encapsulation portion. The connecting portions are configured to connect to external circuitry; and / or The imaging module also includes a housing, in which the lens assembly and the circuit board are disposed. Part of the circuit board is configured to be exposed outside the housing so that the first conductive part and the second conductive part are electrically connected.

10. An endoscope, characterized in that, include: Display module; The image-capturing module as described in any one of claims 1-9 is electrically connected to the display module via the flexible circuit board.

Images