Bearing assembly and double-sided polishing equipment

Abstract

The embodiment of the utility model provides a bearing assembly and double-sided polishing equipment, the bearing assembly is used for the substrate polishing operation of the double-sided polishing equipment, the bearing assembly comprises a disc-shaped body, the body is used for being arranged in a through hole of a planet wheel of the double-sided polishing equipment, the body comprises an upper part and a lower part, and the upper part and the lower part of the body are connected through a connecting rod. The upper part and the lower part are respectively used for arranging a first substrate and a second substrate so as to carry the first substrate and the second substrate, and the upper part and the lower part are arranged in a way that when the body is arranged in the through hole, the first substrate and the second substrate are arranged in the through hole; the to-be-polished surfaces of the first substrate and the second substrate exceed the through hole in the axial direction of the through hole.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to carrier components and double-sided polishing equipment. Background Technology

[0002] Silicon carbide (SiC) wafers are a novel semiconductor material with broad application prospects in power electronics, radio frequency devices, and high-temperature, high-frequency environments due to their high breakdown field strength, high thermal conductivity, high electron saturation drift velocity, and excellent chemical stability. Compared with conventional silicon-based semiconductor materials, silicon carbide wafers can operate stably under higher voltage, higher temperature, and stronger radiation environments, leading to their widespread application in many fields.

[0003] Silicon carbide wafers are typically grown using methods such as physical vapor deposition (PVT) and undergo a series of precision processing steps including cutting, grinding, and polishing to meet the stringent requirements of high-performance device manufacturing. Silicon carbide wafers exhibit a distinct bifacial structure, with one side being a carbon (C) face and the other a silicon (Si) face. The significant differences in the physical and chemical properties of the carbon and silicon faces of silicon carbide wafers present considerable challenges to their fabrication.

[0004] Currently, the polishing of silicon carbide wafers mainly adopts the double-sided polishing method. Although this method can improve the processing efficiency to a certain extent, the different material removal rates of the silicon side and the carbon side can easily lead to damage or cracks in the silicon carbide wafers during the polishing process. Furthermore, it is difficult to accurately control the total thickness variation (TTV) of the silicon carbide wafers, which affects product quality and production efficiency. Utility Model Content

[0005] To address the aforementioned technical problems, this utility model aims to provide a support component and a double-sided polishing device. This support component allows for single-sided polishing of silicon carbide substrates using the double-sided polishing device, improving polishing efficiency, enhancing polishing results, reducing product breakage risk, and improving product quality.

[0006] The technical solution of this utility model is implemented as follows:

[0007] In a first aspect, this utility model provides a support component for substrate polishing operations in a double-sided polishing device, the support component comprising:

[0008] A disc-shaped body, which is arranged in the through-hole of the planetary gear of the double-sided polishing device.

[0009] The body includes an upper portion and a lower portion, which are respectively used to arrange a first substrate and a second substrate to support the first substrate and the second substrate. The upper portion and the lower portion are configured such that when the body is arranged in the through hole, the surfaces of the first substrate and the second substrate to be polished both extend beyond the through hole in the axial direction of the through hole.

[0010] In some optional examples, the carrier assembly further includes a first flexible pad disposed between the upper portion and the first substrate in the axial direction of the through hole, and a second flexible pad disposed between the lower portion and the second substrate in the axial direction of the through hole.

[0011] In some optional examples, the carrier assembly further includes a first support ring surrounding a circumferential side of the first substrate and a second support ring surrounding a circumferential side of the second substrate, wherein both the first and second support rings are partially accommodated in the through-hole, and the heights extending out of the through-hole in the axial direction of the through-hole are respectively less than the heights of the first substrate extending out of the through-hole and the heights of the second substrate extending out of the through-hole.

[0012] In some alternative examples, the first support ring and the second support ring are integrally connected to the first flexible pad and the second flexible pad, respectively.

[0013] In some alternative examples, the upper portion is formed with a first groove for receiving the first substrate, and the lower portion is formed with a second groove for receiving the second substrate.

[0014] In some optional examples, the carrier component further includes a first flexible pad disposed between the bottom of the first groove and the first substrate, and a second flexible pad disposed between the bottom of the second groove and the second substrate.

[0015] In some optional examples, both the first flexible pad and the second flexible pad are fixed to the body.

[0016] In some optional examples, the body is made of ceramic material, glass-ceramic material, or high-strength polymer material.

[0017] In some optional examples, the first flexible pad and the second flexible pad are made of a polymeric elastic material or a polymeric elastic material.

[0018] In some alternative examples, the first support ring and the second support ring are made of ceramic material, resin material or polymer composite material.

[0019] In some alternative examples, the first substrate and the second substrate are silicon carbide substrates.

[0020] Secondly, this utility model embodiment provides a double-sided polishing device, the double-sided polishing device comprising:

[0021] Top plate;

[0022] Place a price order;

[0023] According to the first aspect of the bearing component.

[0024] This invention provides a support component and a double-sided polishing apparatus. The support component is used for substrate polishing operations within the double-sided polishing apparatus. The support component may include a disc-shaped body for placement within through-holes in the planetary gears of the double-sided polishing apparatus. By engaging with the through-holes of the planetary gears, the body allows two substrates to be housed back-to-back within the planetary gears to support the substrates during the polishing operation. Only one main surface of each substrate supported by the body extends beyond the through-hole and is polished, while the other main surface is isolated and protected by the body. This not only avoids cracking or damage caused by uneven stress in conventional double-sided polishing processes but also optimizes substrate thickness uniformity and improves the overall quality after polishing. Furthermore, this support component enables efficient single-sided polishing without requiring large-scale modifications to existing double-sided polishing equipment, significantly reducing equipment upgrade costs and improving processing efficiency and equipment utilization. Attached Figure Description

[0025] Figure 1 This is a three-dimensional schematic diagram of the substrate.

[0026] Figure 2 This is a schematic cross-sectional view of a conventional double-sided polishing device.

[0027] Figure 3 This is a schematic cross-sectional view of the planetary gear.

[0028] Figure 4 A schematic cross-sectional view of a load-bearing component provided for an embodiment of this utility model.

[0029] Figure 5 A schematic cross-sectional view of a support component provided for another embodiment of the present invention.

[0030] Figure 6 A schematic cross-sectional view of a typical double-sided polishing device.

[0031] Figure 7 A schematic cross-sectional view of a support component provided in another embodiment of the present invention.

[0032] Figure 8A schematic cross-sectional view of a support component provided in another embodiment of the present invention.

[0033] Figure 9 A cross-sectional schematic diagram of a load-bearing component provided for another embodiment of this utility model.

[0034] Figure 10 A schematic cross-sectional view of a double-sided polishing device provided for an embodiment of this utility model. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0036] The embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0037] Substrates used in the semiconductor industry have different structural characteristics depending on the material properties and application requirements. For example, some substrates, such as single-crystal silicon wafers, have relatively uniform structural characteristics, while others, such as silicon carbide (SiC) substrates, have different surface characteristics.

[0038] Figure 1 The substrate 100 is schematically shown. This substrate 100 is a silicon carbide substrate, generally disk-shaped, and has two main surfaces: a first main surface 101 and a second main surface 102. The first main surface 101 is a silicon surface, and the second main surface 102 is a carbon surface. Due to significant differences in the physical properties of the silicon and carbon surfaces, their application scenarios and processing techniques also differ. Taking the polishing process as an example, the differences in hardness, lattice structure, and chemical properties between the silicon and carbon surfaces lead to significant differences in their removal rates during polishing.

[0039] Conventional double-sided polishing processes are typically suitable for simultaneously processing two sides of substrates with uniform properties, such as silicon substrates. Figure 2 A portion of a conventional double-sided polishing apparatus 200 is schematically shown. The double-sided polishing apparatus 200 may include an upper fixed disk 201, a lower fixed disk 202, and a planetary gear 203 disposed between the upper fixed disk 201 and the lower fixed disk 202. The upper fixed disk 201 and the lower fixed disk 202 are arranged opposite each other in a vertical direction, and polishing pads 204 are respectively fixed on their opposing surfaces for simultaneously polishing both main surfaces of the substrate 100. Figure 2 and Figure 3 The planetary gear 203 has through holes 203A for accommodating the substrate, and teeth 203B are formed on the outer periphery of the planetary gear 203. The planetary gear 203 can drive the substrate 100 to rotate between the upper fixed plate 201 and the lower fixed plate 202 through gear meshing motion, so as to achieve simultaneous polishing of both sides of the substrate.

[0040] However, when using a double-sided polishing equipment 200 to perform double-sided polishing on substrates with different main surfaces, such as silicon carbide substrates, the different removal rates of the silicon and carbon surfaces result in uneven mechanical stress on the two main surfaces during processing. This uneven stress not only easily leads to cracks or even damage to the substrate, but even if the substrate does not break, its total thickness variation will increase significantly due to the uneven stress, making it difficult to meet the stringent requirements for substrate thickness uniformity in semiconductor devices.

[0041] Therefore, existing double-sided simultaneous polishing processes are no longer suitable for the precision machining of substrates with different surface properties. To avoid the above problems, single-sided polishing is currently commonly used, that is, processing the two main surfaces sequentially. However, while this step-by-step single-sided polishing method reduces the risk of substrate damage, it leads to a significant decrease in processing efficiency and low equipment utilization. Therefore, how to improve polishing efficiency while ensuring substrate integrity and thickness uniformity has become a critical technical problem that urgently needs to be solved in the current semiconductor substrate processing field.

[0042] To address the aforementioned problems, embodiments of this utility model propose a support component and a double-sided polishing device.

[0043] See Figure 4 Some embodiments of this utility model provide a support component 1 for substrate polishing operations in a double-sided polishing apparatus. The support component 1 may include a disc-shaped body 12, which is disposed within a through-hole 203A of a planetary gear 203 in the double-sided polishing apparatus. The body 12 includes an upper portion 13 and a lower portion 14, which are respectively used to dispose of a first substrate 100A and a second substrate 100B to support the first substrate 100A and the second substrate 100B. The upper portion 13 and the lower portion 14 are configured such that when the body 12 is disposed in the through-hole, the main surfaces of the first substrate 100A and the second substrate 100B to be polished both extend beyond the through-hole 203A in the axial direction of the through-hole 203A.

[0044] For ease of explanation, the carrier component 1 will be described below using silicon carbide substrates as examples of the first substrate 100A and the second substrate 100B.

[0045] As explained above, the through-holes 203A of the planetary gear 203 are used to accommodate the substrate and provide stable support during the polishing process. Although the planetary gear 203 includes three through-holes 203A in the exemplary embodiment, it is understood that the number of through-holes 203A can be adjusted according to specific application requirements, for example, to one, two or more. This invention does not limit this.

[0046] The through-hole 203A extends along the axial direction of the planetary gear 203 and may have a circular cross-section to accommodate the shape of the substrate. The body 12 may be disk-shaped, with its radial dimension matching or slightly smaller than that of the through-hole 203A, so that it can be securely accommodated within the through-hole 203A.

[0047] In a double-sided polishing apparatus, planetary gears 203 are typically arranged horizontally, while through-holes 203A penetrate the planetary gears 203 vertically, so that the main surfaces of the substrates to be polished face the upper fixed plate 201 and the lower fixed plate 202 respectively, facilitating simultaneous polishing operations. Therefore, the body 12 is also arranged horizontally within the through-hole 203A, meaning its axial direction is parallel to the axial direction of the through-hole 203A. The body 12 is configured such that the first substrate 100A and the second substrate 100B can be simultaneously arranged at the upper portion 13 and the lower portion 14 of the body 12, respectively, thereby achieving efficient single-sided polishing.

[0048] exist Figure 4 In the embodiment shown, the upper portion 13 and lower portion 14 of the body 12 are both flat surfaces, and the thickness of the body 12 is less than the thickness of the planetary gear 203. Thus, the upper portion 13 and lower portion 14, together with the inner peripheral wall of the through-hole 203A, form two coaxial grooves on opposite sides of the planetary gear 203 to accommodate the first substrate 100A and the second substrate 100B. It should be understood that the thicknesses of the body 12, the planetary gear 203, and the substrates are all measured in their axial directions. The thickness of the body 12 is set such that when the first substrate 100A is placed in the upper portion 13 and the second substrate 100B is placed in the lower portion 14, the main surfaces of the two substrates to be polished extend beyond the through-hole 203A, i.e., to the outside of the planetary gear 203, to ensure sufficient contact with the polishing pad. Furthermore, the planetary gear 203 does not contact the polishing pad, thereby avoiding interference with the polishing operation. Furthermore, the first substrate 100A and the second substrate 100B are placed back-to-back in the axial direction within the through-hole 203A, such that each substrate exposes only a single main surface for polishing, while the other main surface is isolated and protected by the body 12.

[0049] This arrangement effectively avoids the uneven stress caused by different material removal rates in conventional double-sided polishing processes, thereby reducing the risk of substrate cracking or breakage and optimizing the overall thickness uniformity of the polished substrate. Before the polishing operation begins, the two substrates are placed in the upper portion 13 and the lower portion 14, respectively, with their main surfaces to be polished facing the upper platen 201 and the lower platen 202. Subsequently, the planetary gear 203 is driven to rotate through a gear meshing transmission mechanism, causing the substrates to rotate synchronously during the polishing process. Since the unpolished main surfaces of both substrates are supported and protected by the body 12, it can be ensured that only a single main surface of each substrate is processed. This single-sided polishing method not only avoids the stress unevenness problem caused by double-sided polishing, but also allows the polished main surfaces of the two substrates to maintain the same or similar removal rates, thereby optimizing polishing parameters and improving the processing quality and consistency of the two substrates.

[0050] Furthermore, the carrier component 1 has a simple structure, is easy to install and disassemble, and facilitates substrate loading and routine maintenance. Simultaneously, its design is compatible with other components of existing double-sided polishing equipment, allowing for full utilization of existing equipment resources without large-scale modifications, reducing equipment upgrade costs, and improving equipment utilization and processing efficiency. Compared to conventional double-sided polishing processes, this carrier component not only optimizes polishing precision but also improves the overall processing stability and reliability of the substrate.

[0051] In summary, some embodiments of this utility model provide a support component 1 for supporting a substrate during polishing operations in a double-sided polishing device. The support component 1 may include a disc-shaped body 12 disposed within a through-hole 203A of a planetary gear 203 in the double-sided polishing device. The body 12, by engaging with the through-hole of the planetary gear, allows two substrates to be housed back-to-back within the planetary gear 203, so that only one main surface of each substrate extends beyond the through-hole 203A for polishing, while the other main surface is isolated and protected by the body 12. This not only avoids cracking or damage caused by uneven stress in conventional double-sided polishing processes but also optimizes the substrate thickness uniformity and improves the overall quality after polishing. Furthermore, this support component 1 achieves efficient single-sided polishing without requiring large-scale modifications to existing double-sided polishing equipment, thereby significantly reducing equipment upgrade costs and improving processing efficiency and equipment utilization.

[0052] Since the body 12 needs to provide stable support for the substrate during the polishing process, it should have sufficient rigidity to ensure that the substrate does not shift or deform during polishing. However, a rigid body 12 may cause mechanical damage to the substrate when in direct contact with it. Therefore, in some embodiments of this invention, the support component 1 may also include a flexible pad disposed at the bottom of the groove. This flexible pad not only provides a buffer between the body 12 and the substrate, reducing the impact of mechanical stress on the substrate, but also enhances the stability of the substrate through adsorption.

[0053] Specifically, such as Figure 5 As shown, the support component 1 may include a first flexible pad 15 disposed in the axial direction of the through hole 203A between the upper portion 13 and the first substrate 100A, and a second flexible pad 16 disposed in the axial direction of the through hole 203A between the lower portion 14 and the second substrate 100B.

[0054] One side of each flexible pad can be fixed to the body 12, while the other side can directly contact the substrate. When the substrate is subjected to polishing pressure, the flexible pad will be compressed to a certain extent, and its deformation can absorb some of the stress, thereby avoiding substrate damage caused by direct contact with the rigid body 12. In addition, the flexible pad can form a uniform support between the substrate and the body 12, keeping the substrate stable during polishing and improving processing accuracy.

[0055] To further ensure that the substrate moves synchronously with the planetary gears 203 and to avoid damage to the substrate due to relative sliding or collision, the substrate can be temporarily fixed to the body 12 during the polishing process. Specifically, the first substrate 100A can be temporarily fixed to the upper portion 13 of the body 12, and the second substrate 100B can be temporarily fixed to the lower portion 14 of the body 12. In some embodiments, an adhesive, such as wax, can be used to fix the substrate to the body 12 to ensure that the substrate does not slide during polishing. After the polishing operation is completed, the substrate can be separated from the body 12 by heating, dissolving, or chemically decomposing the adhesive, thereby completing the unloading of the substrate. However, the use of adhesive adds an additional process step and may leave residues on the substrate surface, resulting in additional cleaning requirements and increasing the overall processing cost.

[0056] In contrast, when the support component 1 includes a flexible pad, the adsorption properties of the flexible pad can be utilized to fix the substrate using the surface tension of water. Specifically, before the polishing operation, the first flexible pad 15 and the second flexible pad 16 can be wetted with water, so that the first substrate 100A and the second substrate 100B are simultaneously adsorbed onto the surfaces of the first flexible pad 15 and the second flexible pad 16 by the capillary action and surface tension of water, respectively. This not only ensures the stability of the two substrates during the polishing process but also avoids the additional cleaning requirements and contamination risks associated with adhesives, improving the simplicity and environmental friendliness of the process.

[0057] In practical applications, flexible pads can be optimized based on the substrate's thickness, size, and polishing process requirements. For example, the thickness of the flexible pad can be adjusted according to the required buffering level during polishing to ensure that the substrate can properly adhere to the polishing pad under polishing pressure, improving processing uniformity. Furthermore, the surface of the flexible pad can be microstructured, such as by creating tiny grooves or textures, to enhance its adhesion, allowing the substrate to adhere more stably to the flexible pad without the need for additional adhesives.

[0058] The flexible pad can be made of high-molecular-weight elastic materials or polymeric elastic materials, such as silicone, fluororubber (FKM), polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), thermoplastic elastomer (TPE), and polyvinyl chloride (PVC). In some examples, the flexible pad can be made of polyurethane. Polyurethane materials have good elasticity, abrasion resistance, and chemical stability, enabling them to provide reliable cushioning and adsorption properties during polishing. Specifically, flexible pads made of polyurethane can effectively absorb the mechanical stress experienced by the substrate during polishing, reducing damage caused by direct contact with the rigid body 12, while ensuring the stability of the substrate during polishing. In addition, polyurethane materials have good resistance to common cleaning solutions such as deionized water (DIW) and will not degrade in performance due to prolonged contact with liquids, thereby extending the service life of the flexible pad and improving the maintenance efficiency of double-sided polishing equipment.

[0059] When the bearing assembly 1 performs a polishing operation in conjunction with the upper and lower fixed plates, the polishing pads fixed on the working surfaces of the upper and lower fixed plates come into contact with the substrate under pressure, removing material through mechanical and chemical action to achieve fine processing of the substrate surface. However, since the polishing pads are usually made of flexible materials, they may undergo local deformation under stress, resulting in an encapsulation effect on the substrate. Figure 6 As shown, the deformed polishing pad 204 will not only cover the surface of the substrate to be polished, but may also cover the edge of the substrate and part of the circumferential surface.

[0060] This encapsulation effect can lead to a significant increase in material removal at the substrate edges, resulting in thinner edges and potentially causing roll-off. Roll-off not only affects the substrate thickness uniformity but can also reduce edge mechanical strength, increasing the difficulty of subsequent processing steps. Furthermore, uneven polishing at the substrate edges can lead to localized stress concentrations, making the substrate more susceptible to breakage during subsequent operations.

[0061] To address the aforementioned problems, in some embodiments of this utility model, see [link to relevant documentation]. Figure 7 The support assembly 1 may further include a first support ring 17 surrounding the circumferential side of the first substrate 100A and a second support ring 18 surrounding the circumferential side of the second substrate 100B. Both the first support ring 17 and the second support ring 18 are partially accommodated in the through-hole 203A, and the height of the through-hole 203A extending in the axial direction is less than the height of the first substrate 100A extending beyond the through-hole 203A and the height of the second substrate 100B extending beyond the through-hole 203A, respectively. In this way, the support rings can effectively support the substrate without interfering with the polishing operation and prevent the polishing pad from deforming and causing over-polishing of the substrate edges.

[0062] During polishing, the polishing pad may undergo localized deformation under pressure, creating a wrapping effect on the circumferential sides of the substrate. Specifically, when the polishing pad deforms locally under pressure, it preferentially wraps around the support ring rather than directly wrapping around the circumferential sides of the substrate. This limits the degree of wrapping the polishing pad around the substrate edges, thereby reducing the amount of material removed from the substrate edges. This structure effectively mitigates edge collapse during polishing, improving substrate thickness uniformity and edge integrity. Furthermore, this structure reduces the risk of microcracks caused by stress concentration in the substrate edge region, thus enhancing the overall reliability of the substrate.

[0063] Furthermore, the axial dimension of each support ring is set below the protrusion height of the substrate from the through-hole 203A to ensure that the surface of the substrate to be polished is fully exposed and in complete contact with the polishing pad, thus not affecting normal polishing operations. At the same time, the radial dimension of the support ring is appropriately enlarged relative to the substrate, so that it can surround the substrate while avoiding direct contact with the substrate, thereby preventing damage to the substrate surface or additional stress concentration caused by direct force.

[0064] In some embodiments of this invention, the body 12 and the support ring can be made of rigid materials to ensure stability and prevent deformation during polishing. The body 12 and the support ring can be made of the same or different materials to optimize structural strength, wear resistance, and chemical stability according to specific needs. For example, the body 12 can be made of ceramic, glass-ceramic, or high-strength polymer materials, while the support ring can be made of ceramic, resin, or polymer composite materials to provide reliable support and effectively resist the force of the polishing pad, reducing deformation or damage caused by uneven stress during polishing.

[0065] It should be noted that the hardness of the support ring should match that of the body 12 to ensure a consistent mechanical response throughout the entire support assembly during polishing, avoiding stress concentration caused by differences in the rigidity of different materials. Furthermore, to meet the high cleanliness requirements of semiconductor manufacturing, the body 12 and the support ring should be made of non-metallic materials, such as alumina ceramics, silicon nitride ceramics, glass ceramics, and various chemically resistant resins. These materials not only possess excellent wear resistance and chemical stability but also effectively prevent the introduction of metal ions, thus preventing substrate contamination and improving processing accuracy and product yield.

[0066] In addition, to further reduce the impact of the support ring on the substrate, a flexible pad (not shown in the figure), such as a polyurethane or rubber layer, can be provided on the surface of the support ring that contacts the substrate to provide cushioning and reduce frictional damage, thereby further optimizing the protection effect of the substrate edge.

[0067] In some embodiments of this invention, the first support ring 17 can be integrally connected to the first flexible pad 15, and the second support ring 18 can be integrally connected to the second flexible pad 16. Specifically, the support ring and the flexible pad can be fixed together by bonding, embedding, or co-molding. In some examples, the flexible pad can have a radial dimension larger than that of the substrate, allowing it to extend beyond the edge of the substrate in the radial direction. In this case, one axial end of the support ring can be bonded to the surface of the portion of the flexible pad extending from the substrate using an adhesive, thus forming an integral unit with the substrate. This improves the positional stability of the support ring, the flexible pad, and especially the support ring, during the polishing process, thereby providing more stable support for the substrate.

[0068] In the embodiments described above, both the upper portion 13 and the lower portion 14 are flat surfaces and can respectively form two grooves with the inner peripheral wall of the through hole 203A for accommodating the first substrate 100A and the second substrate 100B. In other embodiments of this invention, see... Figure 8Two grooves can be formed on the body 12, that is, the two grooves are formed only by the body 12 itself. Specifically, the upper portion 13 can be formed with a first groove 13A for accommodating the first substrate 100A, and the lower portion 14 can be formed with a second groove 14A for accommodating the second substrate 100B.

[0069] like Figure 7 As shown, a first groove 13A and a second groove 14A with circular cross-sections are formed on two opposite surfaces of the body 12. The radial dimensions of these two grooves are slightly larger than the radial dimensions of the first substrate 100A and the second substrate 100B, respectively, to accommodate the substrates and ensure their stability during polishing. The edge portions of the body 12 surrounding the first groove 13A and the second groove 14A have dimensions corresponding to the first support ring 17 and the second support ring 18, respectively, to function as support rings. That is, without interfering with normal polishing operations, circumferential support is provided to the substrate, thereby reducing the wrapping effect on the substrate edges when the polishing pad deforms. By limiting the coverage area of ​​the polishing pad on the substrate edges, this design can effectively reduce the amount of material removed from the substrate edges, reduce edge collapse, and improve the thickness uniformity and edge integrity of the substrate.

[0070] Compared to solutions that require additional support rings, this integrated design reduces the number of components, simplifies the assembly process, and minimizes the unnecessary stress that additional components might cause on the substrate. Furthermore, this structure eliminates the need for additional fixing mechanisms, providing stable substrate positioning through grooves on the main body. This enhances the versatility of the entire support assembly and improves processing accuracy and production efficiency.

[0071] Furthermore, in some embodiments of this invention, the support component 1 may further include a flexible pad disposed at the bottom of the groove to provide cushioning and enhance the stability of the substrate. For example... Figure 9 As shown, a first flexible pad 15 and a second flexible pad 16 are respectively arranged in the first groove 13A and the second groove 14A to absorb some of the mechanical stress during the polishing process, reduce stress concentration caused by the substrate directly contacting the rigid body 12, and thus reduce the risk of substrate breakage. In addition, the flexible pad can also improve the fixation effect of the substrate in the groove through surface tension or electrostatic adsorption, and prevent the processing accuracy from being affected by small displacements during the polishing process.

[0072] See Figure 10 Some embodiments of this utility model also provide a double-sided polishing device 2, which may include: an upper fixed plate 201, a lower fixed plate 202, and the bearing component 1 described above.

[0073] Specifically, the upper fixed plate 201 and the lower fixed plate 202 are respectively disposed at the upper and lower parts of the double-sided polishing equipment 2 and can rotate relative to each other to polish the first substrate 100A and the second substrate 100B simultaneously. Polishing pads are fixed on the working surfaces of the upper fixed plate 201 and the lower fixed plate 202, which are used to contact the surfaces of the first substrate 100A and the second substrate 100B to be polished during the polishing process, and remove materials through mechanical and chemical action, thereby achieving fine processing of the substrate surface.

[0074] The support assembly 1 is disposed between the upper fixed plate 201 and the lower fixed plate 202, and is used to accommodate and support the first substrate 100A and the second substrate 100B to be polished. The support assembly 1 includes a planetary gear 203 and a body 12 disposed on the planetary gear 203. The body 12 is used to divide the through hole 203A on the planetary gear 203 into two grooves to accommodate two substrates arranged back to back, so that each substrate exposes only a single surface to be polished, while the other side is supported and isolated by the body 12, so as to avoid the problem of uneven stress caused by different removal rates during conventional double-sided polishing.

[0075] During the polishing operation, the planetary gear 203 drives the first substrate 100A and the second substrate 100B to rotate between the upper fixed plate 201 and the lower fixed plate 202 via a gear transmission mechanism, ensuring that the surfaces of the first substrate 100A and the second substrate 100B to be polished are in full contact with the polishing pad, thereby removing material. The structural design of the support component 1 ensures that the first substrate 100A and the second substrate 100B remain stable during the polishing process, improving the uniformity of thickness and edge integrity after polishing.

[0076] Furthermore, the double-sided polishing equipment 2 of this invention is compatible with substrates of different diameters and thicknesses, and does not require large-scale modifications to existing double-sided polishing equipment; it can be adapted to single-sided polishing needs simply by replacing the support components. This not only improves the adaptability and versatility of the equipment but also reduces equipment modification costs, while simultaneously increasing processing efficiency and product yield.

[0077] It should be noted that the technical solutions described in the embodiments of this utility model can be combined arbitrarily without conflict.

[0078] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A support component for substrate polishing operation in a double-sided polishing apparatus, characterized in that, The carrier component includes: A disc-shaped body, which is arranged in the through-hole of the planetary gear of the double-sided polishing device. The body includes an upper portion and a lower portion, which are respectively used to arrange a first substrate and a second substrate to support the first substrate and the second substrate. The upper portion and the lower portion are configured such that when the body is arranged in the through hole, the surfaces of the first substrate and the second substrate to be polished both extend beyond the through hole in the axial direction of the through hole.

2. The load-bearing component according to claim 1, characterized in that, The support assembly further includes a first flexible pad disposed between the upper portion and the first substrate in the axial direction of the through hole, and a second flexible pad disposed between the lower portion and the second substrate in the axial direction of the through hole.

3. The load-bearing component according to claim 2, characterized in that, The carrier assembly further includes a first support ring surrounding the circumferential side of the first substrate and a second support ring surrounding the circumferential side of the second substrate, wherein both the first support ring and the second support ring are partially accommodated in the through hole, and the heights extending out of the through hole in the axial direction of the through hole are respectively less than the heights of the first substrate extending out of the through hole and the heights of the second substrate extending out of the through hole.

4. The load-bearing component according to claim 3, characterized in that, The first support ring and the second support ring are respectively connected to the first flexible pad and the second flexible pad to form an integral unit.

5. The load-bearing component according to claim 1, characterized in that, The upper portion has a first groove for accommodating the first substrate, and the lower portion has a second groove for accommodating the second substrate.

6. The load-bearing component according to claim 5, characterized in that, The support assembly further includes a first flexible pad disposed between the bottom of the first groove and the first substrate, and a second flexible pad disposed between the bottom of the second groove and the second substrate.

7. The load-bearing component according to any one of claims 2, 3, 4, and 6, characterized in that, Both the first flexible pad and the second flexible pad are fixed to the body.

8. The load-bearing component according to any one of claims 1 to 6, characterized in that, The body is made of ceramic material, glass-ceramic material or high-strength polymer material.

9. The load-bearing component according to any one of claims 2, 3, 4 and 6, characterized in that, The first flexible pad and the second flexible pad are made of a polymer elastic material or a polymer elastic material.

10. The carrier component according to claim 3 or 4, characterized in that, The first support ring and the second support ring are made of ceramic material, resin material or polymer composite material.

11. The load-bearing component according to any one of claims 1 to 6, characterized in that, The first substrate and the second substrate are silicon carbide substrates.

12. A double-sided polishing device, characterized in that, The double-sided polishing equipment includes: Top plate; Place a price order; The carrier component according to any one of claims 1 to 11.

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