Power conversion device and photovoltaic system

Abstract

The utility model provides a power conversion device and a photovoltaic system. The power conversion equipment comprises a shell, a power supply module and a power supply module, the electronic component group is located in the shell, and the electronic component group is located on the inner surface of one side of the shell; the radiator is located on one side of the shell, the radiator comprises a substrate, the substrate is attached to the outer surface of the shell, and the substrate and a part of the electronic element set are oppositely arranged; the fan is arranged in the shell, the fan is provided with an air inlet face and an air outlet face, the included angle a between the plane where at least one of the air inlet face and the air outlet face is located and the plane where the side, facing the shell, of the base plate is located is larger than 0 degree and smaller than 90 degrees. According to the power conversion equipment, the structure of the power conversion equipment is reasonably arranged, so that internal circulation heat dissipation can be carried out on the electronic element group in the shell through the fan, and external heat dissipation can be carried out on the electronic element group in the shell through the radiator. In other words, multiple modes are combined to carry out heat dissipation on the electronic component group for multiple times, so that the heat dissipation effect of the product can be effectively improved.

Description

Technical Field

[0001] This application relates to the field of power conversion equipment technology, and more specifically, to a power conversion device and a photovoltaic system. Background Technology

[0002] In related technologies, power conversion equipment includes a sealed enclosure and multiple electronic components, all of which are located inside the enclosure. A heat sink is installed outside the enclosure to dissipate heat from the multiple electronic components inside.

[0003] As the integration of power conversion equipment increases, the volumetric power density becomes higher, leading to higher temperatures within the sealed enclosure. Simply installing a heat sink to dissipate heat from the multiple electronic components inside the enclosure results in poor heat dissipation, severely impacting the lifespan of these components and reducing their reliability. Utility Model Content

[0004] This application aims to address at least one of the technical problems existing in the prior art or related technologies.

[0005] Therefore, the first aspect of this application proposes a power conversion device.

[0006] The second aspect of this application proposes a photovoltaic system.

[0007] In view of the above, a first aspect of this application provides a power conversion device, comprising: a housing; an electronic component assembly located within the housing and situated on an inner surface of one side of the housing; a heat sink located on one side of the housing, the heat sink including a substrate, the substrate being attached to the outer surface of the housing and disposed opposite to a portion of the electronic component assembly; and a fan disposed within the housing, the fan having an air inlet surface and an air outlet surface, wherein the plane containing at least one of the air inlet surface and the air outlet surface forms an angle α with the plane containing the side of the substrate facing the housing, where 0° < α < 90°.

[0008] The power conversion device provided in this application includes a housing, an electronic component assembly, a heat sink, and a fan.

[0009] Both the electronic component assembly and the fan are housed within the housing, which serves as the mounting platform for both. Specifically, the electronic component assembly is located within the housing, specifically on one inner surface of the housing.

[0010] The heat sink is located on one side of the housing, that is, on the outside of the housing. The heat sink includes a substrate, which is positioned opposite a portion of the electronic component assembly. The area of ​​contact between the heat sink substrate and the housing is limited, allowing the heat-generating portions of the electronic component assembly to be positioned opposite the substrate, with these portions closer to the heat sink substrate than the less heat-generating portions. Most of the heat generated by the electronic component assembly is directly conducted to the heat sink substrate, and the heat sink transfers this heat to the outside air through convection, thus leaving only a small amount of heat inside the housing.

[0011] Furthermore, the fan is located inside the housing. When the fan operates, it increases the airflow speed inside the housing, allowing the heat remaining inside the housing to be quickly transferred to the air inside the housing. The flowing air transfers heat to the inner surface of the housing through convection heat exchange. The inner surface of the housing then transfers heat to the outer surface of the housing through heat conduction. Finally, the outer surface of the housing transfers heat to the outside air through convection heat exchange. This completes the convection heat exchange inside the housing.

[0012] Additionally, the fan has an inlet surface and an outlet surface, at least one of which is inclined relative to the heat sink's substrate. Specifically, the angle between the plane containing the inlet surface and the plane containing the side of the substrate facing the housing is α, and / or the angle between the plane containing the outlet surface and the plane containing the side of the substrate facing the housing is α, where 0° < α < 90°. It is understandable that when either the inlet or outlet surface is perpendicular to the plane containing the side of the substrate facing the housing, the fan's space occupancy in the thickness direction of the housing increases, increasing the housing's thickness dimension. Furthermore, horizontal airflow can obstruct some electronic component groups, causing heat accumulation. When either the inlet or outlet surface is parallel to the plane containing the side of the substrate facing the housing, i.e., airflow is directed downwards from the top of the electronic component group, the temperature of the directly airflowed portion of the electronic component group can be reduced. However, the downward airflow will only have a strong airflow within a small area of ​​the fan's inlet and outlet surfaces, leading to a decrease in heat exchange efficiency in other areas within the housing. Therefore, this application reasonably defines the fit structure between the fan's air inlet and outlet surfaces and the heat sink's substrate. This reduces the space occupied by the fan in the thickness direction of the housing, which is beneficial for reducing the thickness dimension of the power conversion device. It allows air inside the housing to be blown downwards from the top towards the electronic component assembly, or drawn upwards directly from the bottom of the electronic component assembly. This increases the contact area between the air and the electronic component assembly, reduces heat accumulation caused by the electronic component assembly blocking the airflow, and creates a larger air circulation within the housing. Electronic components located at different positions within the housing can effectively contact and exchange heat with the air, enhancing the heat exchange effect. Simultaneously, when hot air flows to the portion of the housing where it is positioned opposite the substrate, the heat sink can accelerate the heat transfer into the air, further improving the heat dissipation effect.

[0013] Therefore, this application demonstrates a reasonable structural design for the power conversion device, enabling both internal cooling of the electronic component assembly within the housing via a fan and external cooling via a heat sink. This combination of multiple methods allows for repeated cooling of the electronic component assembly, effectively improving heat dissipation and achieving rapid cooling. This provides structural support for ensuring the lifespan of the electronic component assembly, reduces the internal temperature, and enhances the overall performance and lifespan of the device. Furthermore, the well-designed structure of the heat sink, electronic component assembly, and fan minimizes the fan's space occupancy in the thickness direction of the housing, reducing the overall thickness of the power conversion device. This increases the contact area between the air and the electronic component assembly, reducing heat accumulation caused by component blockage and creating a larger airflow circulation within the housing, further enhancing heat dissipation.

[0014] In some technical solutions, optionally, 15°≤a≤75°.

[0015] In this technical solution, the range of the included angle α is further limited. When the included angle α is in the range of 15° to 75°, the matching angle between the fan's air inlet surface, the fan's air outlet surface and the heat sink's base plate can be further optimized, thereby further improving the heat exchange effect.

[0016] Examples include a = 16°, a = 20°, a = 22°, a = 30°, a = 36°, a = 40°, a = 42°, a = 45°, a = 50°, a = 54°, a = 58°, a = 60°, a = 65°, and a = 70°, etc., which will not be listed here one by one.

[0017] In some technical solutions, the air outlet surface may optionally be located between the air inlet surface and the plane on the side of the substrate facing the housing.

[0018] In this technical solution, the mating structure of the air outlet surface, air inlet surface, and substrate is further defined. The air outlet surface is located between the air inlet surface and the plane on the side of the substrate facing the housing. That is, the air inside the housing can be blown downwards from the top towards the electronic component group, which can increase the air velocity acting on the electronic component group. The faster the air velocity, the greater the convective heat transfer coefficient, which can effectively improve the heat transfer efficiency.

[0019] Meanwhile, the air outlet is located between the air inlet and the plane on the side of the substrate facing the housing. This arrangement allows the airflow to be blown more evenly and more concentratedly onto the electronic component group, increasing the frequency of contact between the electronic component group and the air, which is beneficial for further improving heat exchange efficiency.

[0020] It is understandable that the plane on the side of the substrate facing the housing is called the first reference plane, and the air outlet is located between the air inlet and the first reference plane.

[0021] In some technical solutions, the air inlet and air outlet can optionally be arranged in parallel.

[0022] In this technical solution, the structure of the fan is further defined so that the air inlet and outlet surfaces are arranged in parallel. This defines the airflow path and ensures the positional relationship between the airflow and the heat sink substrate. This, in turn, ensures the contact area and contact angle between the airflow path and the electronic component assembly, allowing the air to act more evenly and concentratedly on the electronic component assembly. This provides structural support for ensuring the temperature of the electronic component assembly and for ensuring the safety and reliability of the electronic component assembly.

[0023] In some technical solutions, the electronic component group may optionally include: a first electronic component, which is disposed opposite to the substrate; and a second electronic component, which is arranged at a distance from the first electronic component; wherein the power of the first electronic component is greater than the power of the second electronic component.

[0024] In this technical solution, the structure of the electronic component group is defined such that the electronic component group includes a first electronic component and a second electronic component.

[0025] Both the first electronic component and the second electronic component are located inside the housing, and the first electronic component and the second electronic component are located on one side of the inner surface of the housing.

[0026] The components of the electronic component group are divided according to their power, resulting in a first electronic component and a second electronic component. The power of the first electronic component is greater than that of the second electronic component; that is, when the electronic component group is working, the heat generated by the first electronic component is greater than that generated by the second electronic component. The first electronic component, with its higher power, is positioned opposite the substrate of the heat sink, and is closer to the substrate than the second electronic component, which has lower power.

[0027] This design shortens the distance between the first electronic component, which generates a large amount of heat, and the heat sink, allowing the heat generated by the first electronic component to be conducted to the heat sink immediately and in a timely manner. The heat sink can then transfer the heat to the outside air through convection heat exchange, ensuring the heat dissipation efficiency of the first electronic component and improving the heat dissipation efficiency of the electronic component group. This provides structural support for extending the performance and service life of the power conversion equipment.

[0028] In some technical solutions, optionally, at least a portion of the second electronic component is located between the first electronic component and the fan.

[0029] In this technical solution, the cooperative structure of the first electronic component, the second electronic component, and the fan is defined.

[0030] At least a portion of the second electronic component is located between the first electronic component and the fan. That is, a portion of the second electronic component may be located between the first electronic component and the fan, or the entire second electronic component may be located between the first electronic component and the fan. This arrangement further defines the cooperation structure between the fan and the second electronic component, ensuring the airflow path and the contact area and angle with the second electronic component. This ensures that the airflow can act more evenly and concentratedly on the second electronic component, providing structural support for maintaining the temperature at the second electronic component, and providing structural support for ensuring the safety, reliability, and service life of the second electronic component.

[0031] It is understandable that the heat of the first electronic component is mainly dissipated through the heat sink, while the heat of the second electronic component is mainly dissipated through internal circulation under the action of the fan. Therefore, by limiting the positional relationship between the second electronic component and the fan, the contact area, contact angle and contact frequency between the air circulating inside the casing and the second electronic component can be limited, thus ensuring the heat dissipation effect of the second electronic component.

[0032] In some technical solutions, optionally, the second electronic component includes a first component and a second component, wherein the power of the first component is greater than the power of the second component; when a portion of the second electronic component is located between the first electronic component and the fan, the first component is located between the first electronic component and the fan.

[0033] In this technical solution, the structure of the second electronic component is defined.

[0034] The components of the second electronic component are divided according to their power, such that the second electronic component includes the first component and the second component. The power of the first component is greater than that of the second component; that is, when the second electronic component is working, the heat generated by the first component is greater than that generated by the second component.

[0035] When a portion of the second electronic component is located between the first electronic component and the fan, the first electronic component with higher power is located between the first electronic component and the fan. The first electronic component with higher power is closer to the fan. The closer it is to the fan, the greater the air velocity on the surface of the first component. The greater the air velocity, the greater the convective heat transfer coefficient, and the better the heat transfer effect. Therefore, the heat dissipation efficiency of the second electronic component can be effectively improved.

[0036] In some technical solutions, optionally, a guide plate is also provided inside the housing, which encloses a guide channel; at least a portion of the second electronic component is connected to the fan through the guide channel.

[0037] In this technical solution, the structure of the power conversion device is further defined.

[0038] The housing also includes a baffle plate that encloses a flow channel, through which at least a portion of the second electronic component is connected to the fan. The flow channel guides airflow towards the second electronic component. As air flows through the channel, the channel walls act as diffusers, resulting in a higher airflow velocity. The continuous flow channel reduces airflow deflections and flow losses, converting more energy into static pressure. This improves airflow and cooling capacity, preventing excessive velocity from causing significant flow losses, poor aerodynamic performance, and reduced airflow to the second electronic component. Simultaneously, the flow channel also acts as a concentrator, reducing the frequency of airflow separation, detachment, and vortices, thus lowering operating noise and providing structural support for further improving the performance of the power conversion equipment.

[0039] In some technical solutions, the flow channel may optionally also connect to the first electronic component.

[0040] In this technical solution, the cooperative structure between the flow channel and the first electronic component is further defined.

[0041] The flow channel also connects to the first electronic component, that is, the flow channel connects to at least a portion of the first electronic component, the fan, and the second electronic component.

[0042] The airflow channel serves to guide airflow, allowing it to flow through the channel to the second and first electronic components, ensuring effective contact between the air and the second and first electronic components. It also concentrates airflow, thereby improving the heat exchange efficiency of the second and first electronic components.

[0043] In some technical solutions, the housing may optionally include a cover plate and a surrounding plate, with the surrounding plate connected to the outer edge of the cover plate, and an electronic component assembly located at the cover plate; the number of fans may be multiple, with at least one of the cover plate and the surrounding plate being a fan.

[0044] In this technical solution, the structure of the power conversion device is further defined.

[0045] The housing includes a cover plate and a surrounding plate, with the outer edges of the surrounding plate connected to the cover plate. The electronic component assembly is located at the cover plate. It can be understood that the surrounding plate includes multiple connecting plates, which are connected end-to-end, with any two adjacent connecting plates extending in different directions; that is, the connection point between any two adjacent connecting plates forms a corner. The area of ​​the connecting plates is smaller than the area of ​​the cover plate. Therefore, placing the electronic component assembly at the cover plate ensures sufficient installation space for the electronic component assembly, increases the installation area and size of the electronic component assembly, and also ensures the contact area and contact angle between the airflow and the electronic component assembly.

[0046] The system comprises multiple fans, which are located in at least one of the cover plate and the enclosure plate. Specifically, the cover plate has at least one fan, and / or the enclosure plate has at least one fan. This arrangement increases the number of fans and expands their placement, allowing airflow from multiple directions and positions. This enhances the airflow velocity within the housing, and the higher the airflow velocity, the greater the convective heat transfer coefficient, effectively improving the heat transfer efficiency of the electronic component assembly.

[0047] In some technical solutions, the power conversion device may optionally include a connecting frame and a tilting frame, the connecting frame being connected between the tilting frame and the fan, and the connecting frame also being connected to the inner surface of the housing.

[0048] In this technical solution, the structure of the power conversion device is further defined.

[0049] The power conversion device also includes a connecting frame and a tilting frame. The connecting frame is connected between the tilting frame and the fan, and the connecting frame is also connected to the inner surface of the housing.

[0050] In other words, the fan and housing are assembled together via a connecting bracket and a tilting bracket.

[0051] The tilting bracket extends at an angle relative to the connecting bracket, so the fan can be tilted relative to the connecting bracket, which satisfies the assembly angle between at least one of the fan's air inlet and air outlet surfaces and the heat sink's base plate, such that the plane containing at least one of the air inlet and air outlet surfaces forms an angle α with the plane containing the side of the base plate facing the housing, where 0° < α < 90°.

[0052] In addition, the combination of the connecting bracket and the tilting bracket helps to enhance the strength of the assembly structure of the connecting bracket and the tilting bracket, which in turn helps to improve the stability and reliability of the fan and housing assembly, and can ensure the matching dimensions of the fan and the heat sink.

[0053] In some technical solutions, optionally, the portion of the housing that is attached to the substrate has an opening, through which a portion of the electronic component assembly is connected to the substrate.

[0054] In this technical solution, the mating structure of the housing, substrate, and electronic component assembly is defined.

[0055] The portion of the housing that fits against the substrate has an opening. The part of the electronic component assembly that connects to the substrate protrudes from the housing through this opening. In other words, the opening wall surrounds the portion where the electronic component assembly connects to the substrate, thus avoiding the connection point and ensuring effective connection between the electronic component assembly and the substrate. This design shortens the distance between the electronic component assembly and the substrate, allowing the heat generated by the electronic component assembly to be conducted to the heat sink quickly and efficiently, thereby improving the heat sink's heat dissipation efficiency.

[0056] Understandably, the substrate can seal the opening, which means it can ensure the airtightness of the casing. The substrate can also form part of the casing wall, which reduces the amount of material used in the casing and helps to reduce the production cost of the power conversion equipment.

[0057] In some technical solutions, optionally, the portion of the housing located on the periphery of the opening is disposed opposite to the outer edge of the substrate; the power conversion device also includes a sealing ring located at the connection between the substrate and the housing.

[0058] In this technical solution, the mating structure of the shell and the substrate is further defined.

[0059] The portion of the housing located around the opening is positioned opposite the outer edge of the substrate. That is, the outer edge of the substrate is located outside the opening wall. The substrate can completely cover the opening. If the substrate cannot completely cover the opening, outside air can enter the housing through the opening, and at the same time, the air inside the housing can leak into the outside environment through the opening. In this way, moisture, dirt, and other contaminants from the outside environment will also enter the housing through the opening, making it impossible to guarantee the airtightness of the housing. This poses a safety hazard and fails to meet safety regulations.

[0060] This application arranges the portion of the housing located on the periphery of the opening opposite to the outer edge of the substrate, and by providing a sealing ring, the sealing ring is located at the connection between the substrate and the housing. The sealing ring has the function of sealing the connection between the substrate and the housing, which can ensure the airtightness of the housing. While ensuring effective heat dissipation for the electronic component group, it can also ensure the safety and reliability of the power conversion equipment.

[0061] In some technical solutions, the housing may optionally be a heat-conducting housing.

[0062] In this technical solution, the structure of the heat-conducting shell is further defined, making it a heat-conducting shell with a fan located inside. The fan's operation increases the airflow speed within the heat-conducting shell, allowing residual heat to be quickly transferred to the air inside. The flowing air transfers heat to the inner surface of the heat-conducting shell through convection, and then the inner surface transfers heat to the outer surface through heat conduction. Finally, the outer surface transfers heat to the outside air through convection, thus completing the convective heat transfer within the heat-conducting shell. The heat-conducting shell possesses thermal conductivity, enabling rapid heat transfer to the outside air and meeting the heat dissipation requirements of the electronic component assembly.

[0063] In some technical solutions, the heat sink may optionally include multiple fins, each fin being connected to the side of the substrate away from the housing, and the multiple fins being spaced apart along the direction from the substrate to the fan.

[0064] In this technical solution, the structure of the heat sink is defined such that it includes multiple fins, with any one of the fins connected to the side of the substrate away from the housing. This arrangement increases the heat dissipation area of ​​the heat sink and the contact area between the heat sink and the outside air, thereby improving the heat dissipation efficiency of the heat sink.

[0065] Multiple fins are arranged at intervals along the direction from the substrate to the fan. A flow channel is formed between any two adjacent fins. The flow channel extends in the direction from the substrate to the fins. The extension direction of the flow channel matches the mating position of the electronic component assembly and the substrate. That is, the extension direction of the flow channel extends in the direction from the electronic component assembly to the substrate. This is more conducive to the dissipation of heat transferred from the electronic component assembly to the substrate, which helps to improve the heat dissipation efficiency of the heat sink and ensures the temperature at the electronic component assembly. This provides structural support for ensuring the performance and service life of the electronic component assembly.

[0066] The second aspect of this application proposes a photovoltaic system comprising: a power conversion device as described in the first aspect.

[0067] The photovoltaic system provided in this application includes the power conversion device as described in the first aspect, and therefore has all the beneficial effects of the aforementioned power conversion device, which will not be described in detail here.

[0068] Additional aspects and advantages of this application will become apparent in the following description or may be learned by practice of this application. Attached Figure Description

[0069] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0070] Figure 1 This invention provides a partial structural schematic diagram of a power conversion device according to a first embodiment of the present application from a first perspective.

[0071] Figure 2 This illustration shows a partial structural schematic diagram of a power conversion device according to a first embodiment of the present application from a second perspective;

[0072] Figure 3 for Figure 2 The power conversion device shown is a cross-sectional view along point AA;

[0073] Figure 4 This illustration shows a partial structural schematic diagram of a power conversion device according to a first embodiment of this application from a third-view perspective.

[0074] Figure 5 A partial structural schematic diagram of a power conversion device according to a second embodiment of this application is shown;

[0075] Figure 6A partial structural schematic diagram of a power conversion device according to a third embodiment of this application is shown from a first perspective.

[0076] Figure 7 A partial structural schematic diagram of a power conversion device according to a third embodiment of this application is shown from a second perspective.

[0077] in, Figures 1 to 7 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0078] 10 Power conversion device, 100 Housing, 110 Cover plate, 120 Enclosure plate, 122 First connecting plate, 124 Second connecting plate, 126 Third connecting plate, 128 Fourth connecting plate, 130 Opening, 200 Electronic component group, 210 First electronic component, 220 Second electronic component, 222 First component, 224 Second component, 224a Capacitor, 224b Inductor, 300 Heat sink, 310 Substrate, 320 Fins, 400 Fan, 410 Air inlet surface, 420 Air outlet surface, 500 Guide plate, 510 Guide channel, 600 Connecting frame, 700 Tilt frame, 800 Sealing ring. Detailed Implementation

[0079] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0080] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0081] The following reference Figures 1 to 7 This application describes a power conversion device 10 and a photovoltaic system according to some embodiments.

[0082] like Figure 1 , Figure 2 , Figure 3 , Figure 5 , Figure 6 and Figure 7 As shown, a power conversion device 10 according to some embodiments of this application includes a housing 100, an electronic component group 200, a heat sink 300, and a fan 400.

[0083] The electronic component assembly 200 is located inside the housing 100, and the electronic component assembly 200 is located on one inner surface of the housing 100.

[0084] The radiator 300 is located on one side of the housing 100.

[0085] The heat sink 300 includes a substrate 310.

[0086] The substrate 310 is attached to the outer surface of the housing 100, and the substrate 310 is disposed opposite to a portion of the electronic component assembly 200.

[0087] The fan 400 is located inside the housing 100.

[0088] The fan 400 has an air inlet surface 410 and an air outlet surface 420.

[0089] The plane containing at least one of the air inlet surface 410 and the air outlet surface 420 forms an angle α with the plane containing the side of the substrate 310 facing the housing 100, where 0° < α < 90°.

[0090] The power conversion device 10 provided in this application includes a housing 100, an electronic component group 200, a heat sink 300, and a fan 400.

[0091] Both the electronic component assembly 200 and the fan 400 are housed within the housing 100. The housing 100 serves as a mounting carrier for the electronic component assembly 200 and the fan 400, and has the function of mounting and fixing the electronic component assembly 200 and the fan 400. Specifically, the electronic component assembly 200 is located within the housing 100, and the electronic component assembly 200 is located on one inner surface of the housing 100.

[0092] The heat sink 300 is located on one side of the housing 100, that is, on the outside of the housing 100. The heat sink 300 includes a substrate 310, which is disposed opposite to a portion of the electronic component assembly 200. The area of ​​the substrate 310 of the heat sink 300 in contact with the housing 100 is limited, allowing the portion of the electronic component assembly 200 that generates more heat to be disposed opposite to the substrate 310. The portion of the electronic component assembly 200 that generates more heat is closer to the substrate 310 of the heat sink 300 than the portion that generates less heat. Most of the heat generated by the operation of the electronic component assembly 200 is directly conducted to the substrate 310 of the heat sink 300. The heat sink 300 transfers heat to the outside air through convection heat exchange with the outside air, so that only a small portion of the heat remains inside the housing 100.

[0093] Furthermore, the fan 400 is located inside the housing 100. The operation of the fan 400 can increase the airflow speed inside the housing 100, so that the heat left inside the housing 100 can be quickly transferred to the air inside the housing 100. The flowing air transfers heat to the inner surface of the housing 100 through convection heat exchange. The inner surface of the housing 100 transfers heat to the outer surface of the housing 100 through heat conduction. The outer surface of the housing 100 transfers heat to the outside air through convection heat exchange with the outside air. In this way, the convection heat exchange inside the housing 100 is completed.

[0094] Additionally, the fan 400 has an air inlet surface 410 and an air outlet surface 420, at least one of which is inclined relative to the substrate 310 of the heat sink 300. Specifically, the plane containing the air inlet surface 410 forms an angle α with the plane containing the side of the substrate 310 facing the housing 100, and / or the plane containing the air outlet surface 420 forms an angle α with the plane containing the side of the substrate 310 facing the housing 100, where 0° < α < 90°. It is understood that when the plane containing either the air inlet or the air outlet surface is perpendicular to the plane containing the side of the substrate facing the housing, the space occupied by the fan in the thickness direction of the housing will increase, the size of the housing in the thickness direction will increase, and horizontal airflow will cause some electronic component groups to be obstructed, resulting in heat accumulation. When either the air inlet or outlet plane is parallel to the plane on the side of the substrate facing the housing, i.e., air is blown directly downwards from the top of the electronic component assembly, the temperature of the part of the electronic component assembly directly exposed to the air can be reduced. However, the airflow will only have a strong airflow within a very small area of ​​the fan's air inlet and outlet planes, which will lead to a decrease in the heat exchange effect of airflow in other parts of the housing. Therefore, this application reasonably defines the mating structure between the air inlet surface 410 and the air outlet surface 420 of the fan 400 and the substrate 310 of the heat sink 300. This reduces the space occupied by the fan 400 in the thickness direction of the housing 100, which is beneficial to reducing the thickness dimension of the power conversion device 10. This allows air inside the housing 100 to be blown downwards from the top towards the electronic component assembly 200, or directly drawn upwards from the bottom of the electronic component assembly 200. This increases the contact area between the air and the electronic component assembly 200, reduces heat accumulation caused by the electronic component assembly 200 blocking the air, and also allows the airflow inside the entire housing 100 to form a larger circulation. The electronic component assemblies 200 located at different positions inside the housing 100 can effectively contact and exchange heat with the air, enhancing the heat exchange effect. At the same time, when the hot air flows to the part of the housing 100 where the substrate 310 is opposite, the heat sink 300 can accelerate the transfer of heat to the air, further improving the heat dissipation effect.

[0095] Therefore, this application has rationally designed the structure of the power conversion device 10, enabling both internal cooling of the electronic component assembly 200 within the housing 100 via the fan 400 and external cooling of the electronic component assembly 200 within the housing 100 via the heat sink 300. In other words, multiple methods are combined to provide multiple cooling cycles for the electronic component assembly 200 within the housing 100. This effectively improves the heat dissipation effect of the electronic component assembly 200 within the housing 100, achieving rapid heat dissipation and providing structural support to ensure the service life of the electronic component assembly 200. It also reduces the temperature inside the housing 100, thereby improving the overall performance and service life of the device. Meanwhile, due to the reasonable arrangement of the heat sink 300, electronic component group 200 and fan 400, the space occupied by fan 400 in the thickness direction of housing 100 can be reduced, which is conducive to reducing the thickness dimension of power conversion device 10, increasing the contact area between air and electronic component group 200, reducing heat accumulation caused by the shielding of electronic component group 200, and also making the air flow in the entire housing 100 form a larger circulation, further improving the heat dissipation effect.

[0096] For example, the plane on the side of the substrate 310 facing the housing 100 is designated as the first reference plane, the plane on the air inlet surface 410 is designated as the second reference plane, and the plane on the air outlet surface 420 is designated as the third reference plane. The angle between the second reference plane and the first reference plane is α, and / or the angle between the third reference plane and the first reference plane is α.

[0097] For example, fan 400 includes an axial fan.

[0098] In some embodiments, 15° ≤ a ≤ 75°.

[0099] In this embodiment, the range of the included angle α is further defined. When the included angle α is in the range of 15° to 75°, the matching angle between the air inlet surface 410 of the fan 400, the air outlet surface 420 of the fan 400 and the base plate 310 of the heat sink 300 can be further optimized, which can further improve the heat exchange effect.

[0100] Examples include a = 16°, a = 20°, a = 22°, a = 30°, a = 36°, a = 40°, a = 42°, a = 45°, a = 50°, a = 54°, a = 58°, a = 60°, a = 65°, and a = 70°, etc., which will not be listed here one by one.

[0101] In some embodiments, the air outlet surface 420 is located between the air inlet surface 410 and the plane on the side of the substrate 310 facing the housing 100.

[0102] In this embodiment, the mating structure of the air outlet surface 420, the air inlet surface 410, and the substrate 310 is further defined. The air outlet surface 420 is located between the plane containing the air inlet surface 410 and the side of the substrate 310 facing the housing 100. That is, the air inside the housing 100 can be blown downwards from the top towards the electronic component group 200, which can increase the air velocity acting on the electronic component group 200. The faster the air velocity, the greater the convective heat transfer coefficient, which can effectively improve the heat transfer efficiency.

[0103] Meanwhile, the air outlet surface 420 is located between the air inlet surface 410 and the plane on the side of the substrate 310 facing the housing 100. This arrangement allows the airflow to be blown more evenly onto the electronic component group 200, and allows the airflow to be blown more concentrated onto the electronic component group 200. It can also increase the frequency of contact between the electronic component group 200 and the air, which is beneficial to further improve the heat exchange efficiency.

[0104] It is understood that the plane on the side of the substrate 310 facing the housing 100 is called the first reference plane, and the air outlet surface 420 is located between the air inlet surface 410 and the first reference plane.

[0105] In some other embodiments, the air inlet surface 410 is located between the air outlet surface 420 and the plane containing the side of the substrate 310 facing the housing 100. That is, the air inlet surface 410 is located between the air outlet surface 420 and the first reference plane.

[0106] In some embodiments, the air inlet surface 410 and the air outlet surface 420 are arranged in parallel.

[0107] In this embodiment, the structure of the fan 400 is further defined so that the air inlet surface 410 and the air outlet surface 420 are arranged in parallel. This defines the airflow path and ensures the positional relationship between the airflow path and the substrate 310 of the heat sink 300. This, in turn, ensures the contact area and contact angle between the airflow path and the electronic component assembly 200, ensuring that the air can act more evenly and concentratedly on the electronic component assembly 200. This provides structural support for ensuring the temperature of the electronic component assembly 200 and for ensuring the safety and reliability of the electronic component assembly 200.

[0108] In some embodiments, such as Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 7 As shown, the electronic component group 200 includes a first electronic component 210 and a second electronic component 220.

[0109] The first electronic component 210 is disposed opposite to the substrate 310.

[0110] The second electronic component 220 is arranged at an interval from the first electronic component 210.

[0111] The power of the first electronic component 210 is greater than that of the second electronic component 220.

[0112] In this embodiment, the structure of the electronic component group 200 is defined such that the electronic component group 200 includes a first electronic component 210 and a second electronic component 220.

[0113] The first electronic component 210 and the second electronic component 220 are both located inside the housing 100, and the first electronic component 210 and the second electronic component 220 are located on one side of the inner surface of the housing 100.

[0114] The components of the electronic component group 200 are divided according to their power, resulting in the electronic component group 200 including a first electronic component 210 and a second electronic component 220. The power of the first electronic component 210 is greater than that of the second electronic component 220; that is, when the electronic component group 200 is working, the heat generated by the first electronic component 210 is greater than that generated by the second electronic component 220. The first electronic component 210, with its higher power, is positioned opposite to the substrate 310 of the heat sink 300, and is closer to the substrate 310 of the heat sink 300 than the second electronic component 220, which has lower power.

[0115] This arrangement shortens the distance between the first electronic component 210, which generates a large amount of heat, and the heat sink 300, so that the heat generated by the first electronic component 210 can be conducted to the heat sink 300 in a timely manner. The heat sink 300 can transfer the heat to the outside air through convection heat exchange with the outside air, ensuring the heat dissipation efficiency of the first electronic component 210 and improving the heat dissipation efficiency of the electronic component group 200. This provides structural support for extending the performance and service life of the power conversion device 10.

[0116] In some embodiments, such as Figure 1 As shown, at least a portion of the second electronic component 220 is located between the first electronic component 210 and the fan 400.

[0117] In this embodiment, the cooperative structure of the first electronic component 210, the second electronic component 220, and the fan 400 is defined.

[0118] At least a portion of the second electronic component 220 is located between the first electronic component 210 and the fan 400. That is, a portion of the second electronic component 220 may be located between the first electronic component 210 and the fan 400, or the entire second electronic component 220 may be located between the first electronic component 210 and the fan 400. This arrangement further defines the mating structure between the fan 400 and the second electronic component 220, ensuring the airflow path and the contact area and angle with the second electronic component 220. This ensures that air can act more evenly and concentratedly on the second electronic component 220, providing structural support for maintaining the temperature at the second electronic component 220, and providing structural support for ensuring the safety, reliability, and service life of the second electronic component 220.

[0119] It is understandable that the heat of the first electronic component 210 is mainly dissipated through the heat sink 300, and the heat of the second electronic component 220 is mainly dissipated through internal circulation under the action of the fan 400. Therefore, by limiting the positional relationship between the second electronic component 220 and the fan 400, the contact area, contact angle and contact frequency between the air circulating inside the housing 100 and the second electronic component 220 can be limited, thus ensuring the heat dissipation effect of the second electronic component 220.

[0120] In some embodiments, such as Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 7 As shown, the second electronic component 220 includes a first component 222 and a second component 224.

[0121] The power of the first element 222 is greater than the power of the second element 224.

[0122] When a portion of the second electronic component 220 is located between the first electronic component 210 and the fan 400.

[0123] The first element 222 is located between the first electronic element 210 and the fan 400.

[0124] In this embodiment, the structure of the second electronic element 220 is defined.

[0125] The components of the second electronic component 220 are divided according to their power, such that the second electronic component 220 includes a first component 222 and a second component 224. The power of the first component 222 is greater than that of the second component 224. That is, when the second electronic component 220 is working, the heat generated by the first component 222 is greater than that generated by the second component 224.

[0126] When a portion of the second electronic component 220 is located between the first electronic component 210 and the fan 400, the first component 222 with higher power is located between the first electronic component 210 and the fan 400. The first component 222 with higher power is closer to the fan 400. The closer it is to the fan 400, the greater the air velocity on the surface of the first component 222. The greater the air velocity, the greater the convective heat transfer coefficient, and the better the heat transfer effect. Therefore, the heat dissipation efficiency of the second electronic component 220 can be effectively improved.

[0127] In some embodiments, such as Figure 6 and Figure 7 As shown, a guide plate 500 is also provided inside the housing 100, and the guide plate 500 encloses the guide channel 510.

[0128] At least a portion of the second electronic component 220 is connected to the fan 400 via the flow channel 510.

[0129] In this embodiment, the structure of the power conversion device 10 is further defined.

[0130] The housing 100 also includes a guide plate 500, which encloses a guide channel 510. At least a portion of the second electronic component 220 is connected to the fan 400 through the guide channel 510. The guide channel 510 serves to guide airflow, allowing air to flow towards the second electronic component 220. As the air flows through the guide channel 510, the channel wall has a diffusion effect, resulting in a relatively high airflow velocity as it enters the guide channel 510 from the fan 400. The continuous flow through the guide channel 510 reduces airflow deflection and flow loss, allowing more energy to be converted into static pressure. This, in turn, improves airflow and cooling capacity, preventing excessive airflow velocity from causing large flow losses, poor aerodynamic performance, and reduced airflow to the second electronic component 220. Meanwhile, the flow guide channel 510 also has the function of collecting airflow, which can reduce the frequency of airflow separation, flow separation, vortex and other phenomena, which is conducive to reducing the operating noise of the product and provides structural support for further improving the performance of the power conversion device 10.

[0131] In some embodiments, such as Figure 6 and Figure 7 As shown, the flow channel 510 is also connected to the first electronic component 210.

[0132] In this embodiment, the cooperative structure of the flow channel 510 and the first electronic component 210 is further defined.

[0133] The flow channel 510 is also connected to the first electronic component 210, that is, the flow channel 510 is connected to at least a portion of the first electronic component 210, the fan 400, and the second electronic component 220.

[0134] The airflow channel 510 has the function of guiding airflow, allowing air to flow through the airflow channel 510 to the second electronic component 220 and the first electronic component 210, ensuring effective contact between the air and the second electronic component 220 and the first electronic component 210, and has the function of concentrating airflow, which can improve the heat exchange efficiency of the second electronic component 220 and the first electronic component 210.

[0135] In some embodiments, such as Figure 1 and Figure 2 As shown, the housing 100 includes a cover plate 110 and a surrounding plate 120.

[0136] The outer edges of the enclosure 120 and the cover plate 110 are connected.

[0137] The electronic component group 200 is located at the cover plate 110.

[0138] There are multiple fans 400, and multiple fans 400 are provided in at least one of the cover plate 110 and the enclosure plate 120.

[0139] In this embodiment, the structure of the power conversion device 10 is further defined.

[0140] The housing 100 includes a cover plate 110 and a surrounding plate 120, with the surrounding plate 120 connected to the outer edge of the cover plate 110. An electronic component assembly 200 is disposed at the cover plate 110. It is understood that the surrounding plate 120 includes multiple connecting plates, which are connected end-to-end, with any two adjacent connecting plates extending in different directions; that is, the connection point of any two adjacent connecting plates forms a corner. The area of ​​the connecting plates is smaller than the area of ​​the cover plate 110. Therefore, placing the electronic component assembly 200 at the cover plate 110 ensures sufficient installation space for the electronic component assembly 200, increases the installation area and size of the electronic component assembly 200, and also ensures the contact area and contact angle between the airflow and the electronic component assembly 200.

[0141] There are multiple fans 400, which are disposed in at least one of the cover plate 110 and the enclosure plate 120. Specifically, the cover plate 110 is provided with at least one fan 400, and / or the enclosure plate 120 is provided with at least one fan 400. This arrangement increases the number of fans 400 and expands the arrangement of the fans 400, enabling airflow from multiple directions and positions. This increases the airflow velocity within the housing 100. The faster the airflow velocity, the greater the convective heat transfer coefficient, which can effectively improve the heat transfer efficiency of the electronic component assembly 200.

[0142] In some embodiments, such as Figure 1 , Figure 2 , Figure 3 and Figure 5As shown, the power conversion device 10 also includes a connecting frame 600 and a tilting frame 700.

[0143] The connecting bracket 600 is connected between the tilting bracket 700 and the fan 400.

[0144] The connecting bracket 600 is also connected to the inner surface of the housing 100.

[0145] In this embodiment, the structure of the power conversion device 10 is further defined.

[0146] The power conversion device 10 also includes a connecting frame 600 and a tilting frame 700. The connecting frame 600 is connected between the tilting frame 700 and the fan 400. The connecting frame 600 is also connected to the housing. That is to say, the fan 400 and the housing 100 are assembled together through the connecting frame 600 and the tilting frame 700.

[0147] The tilting bracket 700 extends at an angle relative to the connecting bracket 600. Therefore, the fan 400 can be tilted relative to the connecting bracket 600, which satisfies the assembly angle between at least one of the air inlet surface 410 and the air outlet surface 420 of the fan 400 and the base plate 310 of the heat sink 300, such that the plane containing at least one of the air inlet surface 410 and the air outlet surface 420 forms an angle α with the plane containing the side of the base plate 310 facing the housing 100, where 0° < α < 90°.

[0148] In addition, the cooperation between the connecting bracket 600 and the tilting bracket 700 helps to enhance the assembly structure strength of the connecting bracket 600 and the tilting bracket 700, thereby improving the stability and reliability of the assembly between the fan 400 and the housing 100, and ensuring the fit dimensions between the fan 400 and the heat sink 300.

[0149] In some embodiments, such as Figure 2 and Figure 5 As shown, the portion of the housing 100 that is attached to the substrate 310 has an opening 130.

[0150] A portion of the electronic component assembly 200 is connected to the substrate 310 through the opening 130.

[0151] In this embodiment, the mating structure of the housing 100, the substrate 310, and the electronic component group 200 is defined.

[0152] The portion of the housing 100 that is in contact with the substrate 310 has an opening 130. The portion of the electronic component assembly 200 that connects to the substrate 310 is exposed outside the housing 100 through the opening 130. In other words, the opening wall of the opening 130 surrounds the portion of the electronic component assembly 200 that connects to the substrate 310, thus avoiding the connection and allowing for effective connection between the electronic component assembly 200 and the substrate 310. This arrangement shortens the distance between the electronic component assembly 200 and the substrate 310, enabling the heat generated by the electronic component assembly 200 to be conducted to the heat sink 300 quickly and efficiently, thereby improving the heat dissipation efficiency of the heat sink 300.

[0153] It is understandable that the substrate 310 can seal the opening 130, which means it can ensure the airtightness of the interior of the housing 100. The substrate 310 can form part of the shell wall of the housing 100, which can reduce the amount of material input of the housing 100 and help reduce the production cost of the power conversion device 10.

[0154] In some embodiments, the portion of the housing 100 located on the periphery of the opening 130 is disposed opposite to the outer edge of the substrate 310.

[0155] like Figure 3 As shown, the power conversion device 10 also includes a sealing ring 800, which is located at the connection between the substrate 310 and the housing 100.

[0156] In this embodiment, the mating structure of the housing 100 and the substrate 310 is further defined.

[0157] The portion of the housing 100 located around the opening 130 is positioned opposite to the outer edge of the substrate 310. That is, the outer edge of the substrate 310 is located outside the opening wall of the opening 130. The substrate 310 can completely cover the opening 130. If the substrate cannot completely cover the opening, that is, outside air can enter the housing through the opening, and at the same time, the air inside the housing can leak into the outside environment through the opening. In this way, moisture, dirt, etc. in the outside environment will also enter the housing through the opening, and the airtightness of the housing cannot be guaranteed. This poses a safety hazard and fails to meet safety regulations.

[0158] This application arranges the portion of the housing 100 located on the periphery of the opening 130 opposite to the outer edge of the substrate 310, and by providing a sealing ring 800, the sealing ring 800 is located at the connection between the substrate 310 and the housing 100. The sealing ring 800 has the function of sealing the connection between the substrate 310 and the housing 100, which can ensure the airtightness of the housing 100. While ensuring effective heat dissipation for the electronic component group 200, it can also ensure the safety and reliability of the power conversion device 10.

[0159] For example, the sealing ring 800 includes rubber rings and silicone rings, etc., which will not be listed here.

[0160] In some embodiments, the housing 100 is a heat-conducting housing.

[0161] In this embodiment, the structure of the housing 100 is further defined as a heat-conducting housing. The fan 400 is disposed within the heat-conducting housing. The operation of the fan 400 increases the airflow speed within the heat-conducting housing, allowing residual heat within the housing to be quickly transferred to the air inside. The flowing air transfers heat to the inner surface of the heat-conducting housing through convection. The inner surface then transfers heat to the outer surface of the heat-conducting housing through heat conduction. Finally, the outer surface transfers heat to the outside air through convection, thus completing the convection heat transfer within the heat-conducting housing. The heat-conducting housing's thermal conductivity allows heat to be quickly transferred to the outside air, meeting the heat dissipation requirements of the electronic component assembly 200.

[0162] For example, housing 100 may include a metal housing, such as a carbon steel housing, an aluminum alloy housing, etc., which will not be listed here.

[0163] In some embodiments, such as Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the radiator 300 also includes multiple fins 320.

[0164] Each fin 320 is connected to the side of the substrate 310 opposite to the housing 100.

[0165] Multiple fins 320 are arranged at intervals along the direction from the substrate 310 to the fan 400.

[0166] In this embodiment, the structure of the heat sink 300 is defined such that the heat sink 300 further includes a plurality of fins 320, any one of which is connected to the side of the substrate 310 opposite to the housing 100. This arrangement can increase the heat dissipation area of ​​the heat sink 300 and the contact area between the heat sink 300 and the outside air, which is beneficial to improving the heat dissipation efficiency of the heat sink 300.

[0167] Multiple fins 320 are arranged at intervals along the direction from the substrate 310 to the fan 400. A flow channel is formed between any two adjacent fins 320. The flow channel extends from the substrate 310 to the fins 320. The extension direction of the flow channel matches the mating position of the electronic component assembly 200 and the substrate 310. That is, the extension direction of the flow channel extends along the direction from the electronic component assembly 200 to the substrate 310. This is more conducive to the dissipation of heat transferred from the electronic component assembly 200 to the substrate 310, which helps to improve the heat dissipation efficiency of the heat sink 300 and ensures the temperature at the electronic component assembly 200. This provides structural support for ensuring the performance and service life of the electronic component assembly 200.

[0168] A photovoltaic system according to some embodiments of this application includes: the power conversion device 10 of any of the above embodiments.

[0169] The photovoltaic system provided in this application includes the power conversion device 10 of any of the above embodiments, and therefore has all the beneficial effects of the power conversion device 10, which will not be described in detail here.

[0170] For example, the power conversion device 10 includes a housing 100, an electronic component assembly 200, a heat sink 300, and a fan 400. The fan 400 has an inlet surface 410 and an outlet surface 420. The plane containing the inlet surface 410 is neither perpendicular nor parallel to the plane containing the side of the substrate 310 facing the housing 100, and the angle between the plane containing the inlet surface 410 and the plane containing the side of the substrate 310 facing the housing 100 is α, where 0° < α < 90°. And / or the plane containing the outlet surface 420 is neither perpendicular nor parallel to the plane containing the side of the substrate 310 facing the housing 100, and the angle between the plane containing the outlet surface 420 and the plane containing the side of the substrate 310 facing the housing 100 is α, where 0° < α < 90°. This arrangement reduces the space occupied inside the housing 100 along its thickness direction. The air blows downwards from the top of the electronic component group 200, which reduces heat accumulation caused by the shielding of the electronic component group 200. It also allows the airflow inside the housing 100 to form a larger circulation, and the heat exchange effect in other parts of the housing 100 is also enhanced.

[0171] For example, the electronic component group 200 includes a first electronic component 210 and a second electronic component 220, the second electronic component 220 including a first component 222 and a second component 224. The first electronic component 210 includes a power transistor. The first component 222 includes a relay, and the second component 224 includes at least one of a capacitor 224a and an inductor 224b.

[0172] The interior of the housing 100 is a sealed cavity structure. Most of the heat generated by the first electronic component 210 is conducted to the heat sink 300. The heat sink 300 transfers heat to the outside air through convection, leaving only a small portion of heat inside the housing 100. The heat generated by the second electronic component 220 accumulates inside the housing 100. The fan 400 inside the housing 100 is generally positioned at locations of components with high heat generation, such as at the first component 222. Simultaneously, to accommodate other heat-generating components, the fan 400 accelerates airflow within the housing 100, rapidly transferring heat from the electronic component group 200 to the air inside the housing 100. This airflow interacts with the cover plate 110 and the surrounding plate 120 (e.g., ...). Figure 1 As shown, the enclosure 120 includes a first connecting plate 122, a second connecting plate 124, a third connecting plate 126, and a fourth connecting plate 128. Convective heat transfer is performed to transfer heat to the inner surface of the shell 100. The inner surface of the shell 100 transfers heat to the outer surface of the shell 100 through heat conduction. The outer surface of the shell 100 transfers heat to the outside air through convection heat transfer with the outside air. This completes the convection heat transfer inside the sealed cavity.

[0173] For example, the fan 400 and the tilting frame 700 are bolted together, and the tilting frame 700 and the connecting frame 600 are fixedly connected. The connecting frame 600 is bolted to the surrounding plate 120 of the housing 100. The tilting frame 700 is tilted relative to the connecting frame 600, for example, the tilting frame 700 and the connecting frame 600 are integrally bent. The air inlet surface 410 of the fan 400 is neither parallel nor perpendicular to the end face of the substrate 310 facing the housing 100. The angle between the plane containing the air inlet surface 410 of the fan 400 and the plane containing the side of the substrate 310 facing the housing 100 is α, where 0° < α < 90°. And / or the air outlet surface 420 of the fan 400 is neither parallel nor perpendicular to the end face of the substrate 310 facing the housing 100. The angle between the plane containing the air outlet surface 420 of the fan 400 and the plane containing the side of the substrate 310 facing the housing 100 is α, where 0° < α < 90°.

[0174] For example, the housing 100 includes two cover plates 110 and a surrounding plate 120. The surrounding plate 120 includes four connecting plates. A fan 400 is arranged at each surrounding plate 120 and each connecting plate. The plane containing at least one of the air inlet surface 410 and the air outlet surface 420 of the fan 400 forms an angle α with the plane containing the side of the substrate 310 facing the housing 100, where 0° < α < 90°.

[0175] For example, a guide plate 500 may also be provided between the fan 400 and the second electronic component 220, the guide plate 500 enclosing a guide channel 510, the guide channel 510 connecting at least a portion of the fan 400 and the second electronic component 220 for convective heat exchange. The guide channel 510 also connects to the first electronic component 210.

[0176] For example, the power conversion device 10 includes inverters and converters, etc., which will not be listed here.

[0177] In this application, the term "multiple" refers to two or more unless otherwise expressly defined. The terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "linking" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0178] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. The above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A power conversion device, characterized in that, include: case; An electronic component assembly is located inside the housing, and the electronic component assembly is located on one inner surface of the housing; A heat sink is located on one side of the housing. The heat sink includes a substrate that is attached to the outer surface of the housing and is disposed opposite to a portion of the electronic component group. A fan is disposed within the housing. The fan has an air inlet surface and an air outlet surface. The plane containing at least one of the air inlet surface and the air outlet surface forms an angle α with the plane containing the side of the substrate facing the housing, where 0° < α < 90°.

2. The power conversion device according to claim 1, characterized in that, 15°≤a≤75°。 3. The power conversion device according to claim 1 or 2, characterized in that, The air outlet surface is located between the air inlet surface and the plane on the side of the substrate facing the housing, and the air inlet surface and the air outlet surface are arranged parallel to each other.

4. The power conversion device according to claim 1 or 2, characterized in that, The electronic component group includes: A first electronic component is disposed opposite to the substrate; A second electronic component is arranged at a distance from the first electronic component; Wherein, the power of the first electronic component is greater than the power of the second electronic component; At least a portion of the second electronic component is located between the first electronic component and the fan.

5. The power conversion device according to claim 4, characterized in that, The second electronic component includes a first component and a second component, wherein the power of the first component is greater than the power of the second component; When a portion of the second electronic component is located between the first electronic component and the fan, the first component is located between the first electronic component and the fan.

6. The power conversion device according to claim 4, characterized in that, The housing is also provided with a flow guide plate, which encloses a flow guide channel; At least a portion of the second electronic component is in communication with the fan through the airflow channel.

7. The power conversion device according to claim 6, characterized in that, The flow channel is also connected to the first electronic component.

8. The power conversion device according to claim 1 or 2, characterized in that, The housing includes a cover plate and a surrounding plate, the surrounding plate being connected to the outer edge of the cover plate, and the electronic components being disposed on the cover plate; The number of fans is multiple, and the multiple fans are disposed in at least one of the cover plate and the enclosure plate.

9. The power conversion device according to claim 1 or 2, characterized in that, Also includes: A connecting frame and a tilting frame, the connecting frame being connected between the tilting frame and the fan, and the connecting frame also being connected to the inner surface of the housing.

10. The power conversion device according to claim 1 or 2, characterized in that, The portion of the housing that is in contact with the substrate has an opening, and a portion of the electronic component assembly is connected to the substrate through the opening; The portion of the housing located on the periphery of the opening is disposed opposite to the outer edge of the substrate; The power conversion device also includes a sealing ring located at the connection between the substrate and the housing.

11. A photovoltaic system, characterized in that, include: The power conversion device as described in any one of claims 1 to 10.

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