A novel copper bath for TGV and ceramic through-hole plating

Abstract

This utility model discloses a novel copper cylinder for TGV and ceramic filling electroplating, relating to the field of copper cylinder technology. It includes a copper cylinder body, with a left-right oscillating motor on one side and an eccentric wheel assembly at the output end of the oscillating motor. Two rows of side spray pipes are symmetrically arranged within the copper cylinder body, with the nozzles of the two rows of side spray pipes installed alternately. A hanger for suspending workpieces is provided between the two rows of side spray pipes. The two ends of the hanger are fixed to the middle position of the copper cylinder body via hanger guide grooves. This utility model, based on a traditional copper cylinder, changes the original left-right oscillating cathode flat plate and hanger to a fixed installation, and changes the side spray pipes to left-right oscillation, keeping the relative position of the hanger and anode unchanged, thereby forming a more uniform electroplating layer and improving electroplating uniformity.

Description

Technical Field

[0001] This utility model relates to the field of copper cylinder technology, specifically a novel copper cylinder for TGV and ceramic hole-filling electroplating. Background Technology

[0002] With the rapid development of 5G communication, artificial intelligence, high-performance computing, and new energy vehicles, electronic packaging technology is evolving towards higher density, higher performance, smaller size, and stronger heat dissipation capabilities. Against this backdrop, through-glass via (TGV) technology and ceramic substrates (such as alumina, aluminum nitride, low-temperature co-fired ceramic (LTCC) / high-temperature co-fired ceramic (HTCC)) have gained widespread application in high-density interconnects, RF modules, and power electronic packaging due to their excellent electrical performance, thermal management capabilities, and high reliability. Achieving void-free, highly uniform copper filling of high aspect ratio microvias / blind vias on TGV and ceramic substrates is a core process step in manufacturing these advanced interconnect structures, directly affecting the performance, yield, and reliability of the final devices. Currently, acidic copper sulfate plating is the mainstream technology for achieving hole metallization. However, existing copper plating systems and their additive combinations face significant challenges in meeting the requirements for perfect filling of microvias on TGV (often with aspect ratios greater than 5:1, even reaching 10:1 or higher) and dense ceramic substrates.

[0003] In traditional copper cylinder designs, the working principle mainly relies on a left-right swing motor to drive the cathode flat plate to swing, thereby realizing the left-right movement of the cathode flat plate and the mounting fixture. At the same time, the nozzle is in a fixed state, and the left-right swing of the cathode flat plate allows the ceramic plate on the mounting fixture to be evenly sprayed with electrolyte from the side nozzle.

[0004] However, this traditional copper plating tank design has some significant drawbacks. Although a current shielding plate is installed on the current-shielding anode screen, the oscillation motion is limited to the left and right direction. When the cathode flat plate oscillates left and right, the previously shielded high-current areas move accordingly, exposing new high-current areas. This severely affects the uniformity of electroplating. Specifically, the left-right oscillation motion makes it difficult to achieve an ideal match between the electrolyte spray trajectory and the current distribution. This results in uneven current density distribution on the ceramic plate surface during electroplating, leading to localized areas of excessively thick or thin plating. This affects product quality and performance, limiting the development and application of traditional copper plating tanks in high-precision electroplating.

[0005] Based on this, a new type of copper tank for TGV and ceramic hole-filling electroplating is now provided, which can eliminate the drawbacks of existing devices. Utility Model Content

[0006] The purpose of this invention is to provide a novel copper tank for TGV and ceramic hole-filling electroplating to solve the problems in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A novel copper cylinder for TGV and ceramic filling electroplating includes a copper cylinder body. A left-right swing motor is provided on one side of the copper cylinder body, and an eccentric wheel assembly is provided at the output end of the left-right swing motor. Two rows of side spray pipes are symmetrically arranged inside the copper cylinder body. The nozzles of the two rows of side spray pipes are staggered. A hanger for hanging workpieces is provided between the two rows of side spray pipes. The two ends of the hanger are fixed to the middle position of the copper cylinder body through hanger guide grooves.

[0009] Based on the above technical solutions, this utility model also provides the following optional technical solutions:

[0010] In one alternative: the eccentric wheel assembly is connected to the side nozzle.

[0011] In one alternative: one side of the side spray pipe is connected to the main side spray pipe via a PVDF hose, and the side spray inlet of the side spray pipe is located at the lower part of the copper cylinder body.

[0012] In one alternative: the upper end of the side nozzle is provided with a movable nozzle guide rail and a guide wheel.

[0013] In one alternative: the lower end of the side nozzle is provided with a movable nozzle assembly, the lower end of the movable nozzle assembly is provided with a nozzle guide wheel, and nozzle guide plates are provided on both sides of the nozzle guide wheel.

[0014] In one alternative: a cathode flat is provided on one side of the hanger.

[0015] In one alternative: two rows of titanium baskets or insoluble anodes are symmetrically arranged on both sides of the fixture, and a current-shielding anode screen is provided on one side of the titanium baskets or insoluble anodes.

[0016] In one alternative: the titanium basket or insoluble anode and the current-shielding anode screen are both located on the side of the side nozzle away from the mounting fixture.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0018] This invention, based on the traditional copper cylinder, changes the original left-right swinging cathode flat plate and hanger to a fixed installation, and changes the side spray pipe to a left-right swinging installation. This ensures that the relative position of the hanger and the anode remains unchanged. In this way, the current shielding plate on the current shielding anode screen can more effectively block the current in the high current area. Unlike the original design, where the left-right swinging caused the originally shielded high current area to move out of the shielding plate's position and re-form a high current area, thus affecting the electroplating effect, the absence of a re-formation of a high current area allows for a more uniform electroplating layer and improves electroplating uniformity. Attached Figure Description

[0019] Figure 1 This is a front view schematic diagram of the present invention.

[0020] Figure 2 This is a side view of the present invention.

[0021] Figure 3 This is a top view of the present invention.

[0022] Figure reference numerals: 100, Copper cylinder body; 101, Left and right swing motor; 102, Eccentric wheel assembly; 103, Cathode flat plate; 104, Titanium basket or insoluble anode; 105, Current shielding anode screen; 106, Side spray main pipe; 107, Movable nozzle guide rail and guide wheel; 108, Side spray pipe; 109, PVDF hose; 110, Movable nozzle assembly; 111, Spray pipe guide plate; 112, Spray pipe guide wheel; 113, Side spray inlet; 200, Hanger; 201, Hanger guide groove. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0024] In one embodiment, such as Figures 1-3As shown, a novel copper cylinder for TGV and ceramic filling electroplating includes a copper cylinder body 100. A left-right oscillating motor 101 is located on one side of the copper cylinder body 100. An eccentric wheel assembly 102 is located at the output end of the left-right oscillating motor 101. Two rows of side spray pipes 108 are symmetrically arranged inside the copper cylinder body 100, with the nozzles of the two rows of side spray pipes 108 staggered. A hanger 200 for hanging workpieces is located between the two rows of side spray pipes 108. The two ends of the hanger 200 are fixed to the middle position of the copper cylinder body 100 through hanger guide grooves 201. The eccentric wheel assembly 102 is connected to the side spray pipes 108. One side of the side spray pipe 108 is connected to the side spray main pipe 106 through a PVDF hose 109. The side spray inlet 113 of the side spray pipe 108 is located at the lower part of the copper cylinder body 100. A movable spray pipe guide rail and guide wheel 107 are located at the upper end of the side spray pipe 108, and a movable spray pipe is located at the lower end of the side spray pipe 108. The component 110 has a nozzle guide wheel 112 at its lower end, and nozzle guide plates 111 on both sides of the nozzle guide wheel 112. The fixture 200 has a cathode flat 103 on one side, and two rows of titanium baskets or insoluble anodes 104 are symmetrically arranged on both sides of the fixture 200. A current shielding anode screen 105 is provided on one side of the titanium baskets or insoluble anodes 104. The titanium baskets or insoluble anodes 104 and the current shielding anode screen 105 are both located on the side of the side nozzle 108 away from the fixture 200. In use, the workpiece to be electroplated is installed on the fixture 200, and the power supply of the copper cylinder body 100 is turned on, so that the cathode flat 103 and the titanium baskets or insoluble anodes 104 are energized. At the same time, the electrolyte is sprayed onto the workpiece through the side nozzle 108, and the side nozzle 108 is driven to swing left and right by the left and right swing motor 101 and the eccentric wheel assembly 102, so that the electrolyte is evenly sprayed onto the surface of the workpiece.

[0025] The above embodiments disclose a novel copper tank for TGV and ceramic filling electroplating. By changing the original left-right swinging cathode flat 103 and hanger 200 to fixed installation, and changing the side spray pipe 108 to swing left and right, the relative position of the hanger 200 and the anode will not change. In this way, the current shielding plate on the current shielding anode screen 105 can more effectively block the current in the high current area. Unlike the original design, the original shielded high current area will not move out of the shielding plate position and re-form a high current area due to left-right swing, thus affecting the electroplating effect. Because there is no re-formation of high current area, the electroplating layer can be formed more evenly, improving the electroplating uniformity.

[0026] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A novel copper cylinder for TGV and ceramic hole filling electroplating, comprising a copper cylinder body (100), one side of which is provided with a left-right swing motor (101), the output end of which is provided with an eccentric wheel assembly (102), and two rows of side nozzles (108) are symmetrically arranged in the copper cylinder body (100), the nozzles of the two rows of side nozzles (108) are staggered, characterized in that, Between the two rows of side spray pipes (108) is a hanger (200) for hanging workpieces. The two ends of the hanger (200) are fixed to the middle position of the copper cylinder body (100) through the hanger guide groove (201).

2. A novel copper cylinder for TGV and ceramic hole filling plating as claimed in claim 1, wherein, The eccentric wheel assembly (102) is connected to the side nozzle (108).

3. A novel copper cylinder for TGV and ceramic hole filling plating as claimed in claim 1, wherein, The side spray pipe (108) is connected to the side spray main pipe (106) via a PVDF hose (109) on one side, and the side spray inlet (113) of the side spray pipe (108) is located at the lower part of the copper cylinder body (100).

4. A novel copper cylinder for TGV and ceramic hole filling plating as claimed in claim 1, wherein, The upper end of the side nozzle (108) is provided with a movable nozzle guide rail and a guide wheel (107).

5. A novel copper cylinder for TGV and ceramic hole filling plating as claimed in claim 1, wherein, The lower end of the side nozzle (108) is provided with a movable nozzle assembly (110), the lower end of the movable nozzle assembly (110) is provided with a nozzle guide wheel (112), and nozzle guide plates (111) are provided on both sides of the nozzle guide wheel (112).

6. A novel copper tank for TGV and ceramic hole-filling electroplating according to claim 1, characterized in that, The mounting bracket (200) has a cathode flat plate (103) on one side.

7. A novel copper tank for TGV and ceramic through-hole plating according to claim 1, characterized in that, The hanger (200) has two rows of titanium baskets or insoluble anodes (104) symmetrically arranged on both sides, and a current shielding anode screen (105) is provided on one side of the titanium baskets or insoluble anodes (104).

8. A novel copper tank for TGV and ceramic hole-filling electroplating according to claim 7, characterized in that, The titanium basket or insoluble anode (104) and the current-shielding anode screen (105) are both located on the side of the side nozzle (108) away from the hanger (200).

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