Heat pump air conditioning system

Abstract

The application discloses a heat pump air conditioning system, comprising a driving module, the driving module comprising a driving circuit and a heat-conducting substrate, wherein the driving circuit is used for driving a motor in the heat pump air conditioning system, and the heat-conducting substrate is used for conducting and dissipating heat generated by the driving circuit to the surrounding environment; further comprising a heating module and a heat dissipation module, wherein the heating module is arranged close to the heat-conducting substrate or in the heat-conducting substrate; when the heating module is in a heating state, the heating module is used for raising the temperature of the heat-conducting substrate, and the heat dissipation module is arranged close to the heating module, and the heat dissipation module comprises a heat dissipation pipeline, and the heat dissipation pipeline is used for guiding refrigerant flow to dissipate heat for the driving module. The heat pump air conditioning system provided by the application forms a reasonable heat transfer path by arranging the heat dissipation module close to the heating module and arranging the heating module close to the heat-conducting substrate; on one hand, the heating module does not affect normal heat dissipation, and on the other hand, the heating module can be used for raising the temperature of the heat-conducting substrate to inhibit condensation of the driving module, and the heating power can be greatly reduced.

Description

Technical Field

[0001] This application relates to the field of refrigeration equipment technology, and more particularly to a heat pump air conditioning system. Background Technology

[0002] Due to the inherent limitations of electronic device efficiency, approximately 80% of the input electrical power is lost as waste heat. Therefore, it is crucial to effectively address the waste heat emission and temperature control issues generated by electronic devices and equipment to ensure their performance and reliability. As the heat flux density of electronic devices and equipment continues to increase, the space available for heat dissipation is shrinking, making traditional air-cooled radiators insufficient for lightweight and miniaturized requirements. Increasingly, air conditioner outdoor units are adopting refrigerant liquid cooling solutions. Refrigerant liquid cooling utilizes the refrigerant circulation within the air conditioning system itself, offering advantages such as high heat dissipation efficiency, no fan noise, and low cost. However, for heat pump air conditioning systems, during the hot water production process, condensation easily occurs in high-temperature environments because the high-pressure side pressure does not change with ambient temperature, limiting the widespread application of refrigerant liquid cooling technology.

[0003] A heat pump air conditioning system includes a hydraulic module, which is used to produce hot water. The hydraulic module includes a heat exchanger, which acts as a condenser during hot water production, transferring heat from the refrigerant to the water and raising its temperature. Because the condenser exchanges heat directly with the water, its condensation temperature is significantly affected by the water temperature. When the outdoor ambient temperature is high but the water temperature is low, the refrigerant temperature in the heat exchanger of the hydraulic module is likely to be lower than the dew point temperature of the air in the environment where the electronic control components operate, causing condensation failure of the electronic control power devices.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Utility Model Content

[0005] This application provides a heat pump air conditioning system with several embodiments, including a drive module. The drive module includes a drive circuit and a heat-conducting substrate. The drive circuit drives at least one motor in the heat pump air conditioning system, and the heat-conducting substrate conducts and dissipates the heat generated during the operation of the drive circuit to the surrounding environment. The heat pump air conditioning system also includes a heating module and a heat dissipation module. The heating module is disposed near or within the heat-conducting substrate; when the heating module is in a heating state, it raises the temperature of the heat-conducting substrate. The heat dissipation module is disposed near the heating module and includes heat dissipation pipes for guiding refrigerant flow to dissipate heat from the drive module.

[0006] The above technical solution has the following advantages or beneficial effects: The heat pump air conditioning system provided in this application forms a reasonable heat transfer path by placing the heat dissipation module close to the heating module and the heating module close to the heat-conducting substrate; the heating module does not affect normal heat dissipation on the one hand, and can be used to raise the temperature of the heat-conducting substrate to suppress condensation on the drive module, which can significantly reduce the heating power.

[0007] In some embodiments of this application, the heat pump air conditioning system further includes a hydraulic module comprising a hydraulic module heat exchanger that serves as a condenser to heat water; wherein the heat dissipation pipe is disposed downstream of the hydraulic module heat exchanger serving as a condenser and is fluidly connected to the hydraulic module heat exchanger.

[0008] The above technical solution has the following advantages or beneficial effects: This application effectively suppresses the condensation problem of hydraulic modules at high ambient temperature and low inlet water temperature.

[0009] In some embodiments of this application, the heat pump air conditioning system further includes: an outdoor heat exchanger that functions as a condenser in cooling mode; wherein the heat dissipation pipe is disposed downstream of the outdoor heat exchanger that functions as a condenser and is fluidly connected to the outdoor heat exchanger.

[0010] The above technical solution has the following advantages or beneficial effects: This application can realize thermal management of heat pump air conditioning systems under different working modes.

[0011] In some embodiments of this application, the thermally conductive substrate includes: a first thermally conductive substrate surface, on which the driving circuit is mounted; a second thermally conductive substrate surface, which is opposite to the first thermally conductive substrate surface; the heating module includes: a housing, which is flat and in close contact with the second thermally conductive substrate surface; a heating element disposed in the housing; and a heat dissipation module disposed on the side of the housing away from the second thermally conductive substrate surface and in close contact with the housing.

[0012] The above technical solution has the following advantages or beneficial effects: by using a shell made of thermally conductive material, heat can be effectively exchanged during heat dissipation, so that the heat conducted through the thermally conductive substrate can be transferred to the refrigerant in the heat dissipation pipe, so that the drive circuit can maintain a stable working state. On the other hand, when there is a risk of condensation, the temperature of the thermally conductive substrate can be quickly increased, further ensuring that there is no risk of condensation in the drive module, thus achieving good thermal management in both aspects.

[0013] In some embodiments of this application, the outer shell includes: a heating cavity, in which the heating element is disposed; and a weight-reducing cavity, which is an empty cavity; the heating cavity and the weight-reducing cavity are disposed adjacent to each other.

[0014] The above technical solution has the following advantages or beneficial effects: the design of the heating chamber and the weight reduction chamber ensures efficient temperature distribution and controllable shell weight.

[0015] In some embodiments of this application, the heat dissipation module further includes: a heat dissipation bracket, the heat dissipation pipes being disposed on the heat dissipation bracket, and the heat dissipation bracket being in close contact with the heating module; the heating module further includes: a first thermally conductive layer, the first thermally conductive layer being disposed between the outer shell and the heat dissipation bracket; and a second thermally conductive layer, the second thermally conductive layer being disposed between the outer shell and the surface of the second thermally conductive substrate.

[0016] The above technical solution has the following advantages or beneficial effects: the first thermally conductive layer and the second thermally conductive layer can reduce the interfacial contact thermal resistance and improve the efficiency of heat conduction.

[0017] In some embodiments of this application, the thermally conductive substrate includes: a housing, in which the heating module is disposed; the housing has: a first thermally conductive substrate surface, in which the driving circuit is mounted; a second thermally conductive substrate surface, which is opposite to the first thermally conductive substrate surface; a heating cavity, in which a heating element is disposed; and a weight-reducing cavity, which is an empty cavity; the weight-reducing cavity and the heating cavity are spaced apart.

[0018] The above technical solution has the following advantages or beneficial effects: the integrated design can further reduce the overall size and is more suitable for miniaturized product appearance.

[0019] In some embodiments of this application, the heat dissipation module further includes: a heat dissipation bracket, the heat dissipation pipes are disposed on the heat dissipation bracket, the heat dissipation bracket is in close contact with the housing; a heat-conducting layer is disposed between the heat dissipation bracket and the surface of the second thermally conductive substrate.

[0020] The above technical solution has the following advantages or beneficial effects: the thermally conductive layer can reduce the interfacial contact thermal resistance and improve the efficiency of heat conduction.

[0021] In some embodiments of this application, the heating element is a PTC element, a resistance wire, an electrothermal film, or a semiconductor heating element.

[0022] The above technical solution has the following advantages or beneficial effects: This application can use a variety of electric heating elements to meet different heating efficiencies and structural design requirements.

[0023] In some embodiments of this application, the heating element is a heating pipe connected to the exhaust end of the compressor, and a solenoid valve is provided between the heating pipe and the exhaust end of the compressor.

[0024] The above technical solution has the following advantages or beneficial effects: by heating the pipeline, the temperature of the heat-conducting substrate is increased by using a high-temperature refrigerant, thus suppressing the formation of condensation.

[0025] Other features and advantages of this application will become clearer after reading the detailed embodiments in conjunction with the accompanying drawings. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic block diagram of the structure of a heat pump air conditioning system provided in some embodiments of this application;

[0028] Figure 2 A schematic diagram of refrigerant circulation in the cooling mode of a heat pump air conditioning system provided in some embodiments of this application;

[0029] Figure 3 This is a schematic diagram of refrigerant circulation in the heating mode of a heat pump air conditioning system provided in some embodiments of this application;

[0030] Figure 4 A schematic diagram of the refrigerant flow direction of the heat dissipation module in the heat pump air conditioning system provided in some embodiments of this application in cooling mode and heating mode;

[0031] Figure 5 This is a schematic diagram of the structure of the heat pump air conditioning system drive module, heating module and heat dissipation module provided in some embodiments of this application;

[0032] Figure 6 This is another structural schematic diagram of the heat pump air conditioning system drive module, heating module, and heat dissipation module provided in some embodiments of this application;

[0033] Figure 7 This is a schematic diagram illustrating the temperature changes of the heat pump air conditioning system drive circuit, heating module, heat-conducting substrate, dew point temperature, and heat dissipation module provided in some embodiments of this application.

[0034] Figure 8 This is a schematic diagram of the structure of the heat-conducting substrate in a heat pump air conditioning system provided in some embodiments of this application;

[0035] Figure 9 This is a schematic diagram of the structure of a heat pump air conditioning system provided in some embodiments of this application;

[0036] Figure 10This is a schematic diagram of the structure of the heat pump air conditioning system drive module, heating module, and heat dissipation module provided in other embodiments of this application;

[0037] Figure 11 This is a schematic diagram of the structure of the heat pump air conditioning system drive module, heating module, and heat dissipation module provided in other embodiments of this application;

[0038] Figure 12 This is a schematic diagram of the structure of the heat pump air conditioning system drive module, heating module and heat dissipation module provided in some embodiments of this application;

[0039] Figure 13 This is a schematic diagram of the structure of the heat pump air conditioning system drive module, heating module and heat dissipation module provided in some embodiments of this application;

[0040] Figure 14 This is a schematic diagram of the structure of the heat pump air conditioning system drive module, heating module and heat dissipation module provided in some embodiments of this application;

[0041] Figure 15 This is a schematic diagram of the structure of the heat pump air conditioning system drive module, heating module and heat dissipation module provided in some embodiments of this application;

[0042] Figure 16 This is a schematic diagram of the structure of the heat-conducting substrate housing in a heat pump air conditioning system provided in some embodiments of this application;

[0043] Figure 17 This is a schematic diagram of the structure of a heat pump air conditioning system provided in other embodiments of this application;

[0044] In the picture:

[0045] 1. Heat pump air conditioning system; 11. Compressor; 12. Outdoor heat exchanger; 13. Switching valve; 14. Gas-liquid separator; 15. Indoor heat exchanger; 16. Hydraulic module heat exchanger; 17. Heat dissipation module; 171. Heat dissipation piping; 172. Heat dissipation bracket; 18. Throttling device;

[0046] 20. Drive module; 21. Drive circuit; 22. Thermally conductive substrate; 201. Housing; 221. Surface of the first thermally conductive substrate; 222. Surface of the second thermally conductive substrate;

[0047] 30. Heating module; 301. Housing; 302. Upper end face; 303. Lower end face; 304. First heating element; 305. First weight-reducing cavity; 306. First heating cavity; 307. Second weight-reducing cavity; 308. Second heating cavity; 309. Second heating element;

[0048] 41. First thermally conductive layer; 42. Second thermally conductive layer; 43. Thermally conductive layer;

[0049] 501. Outdoor ambient dry bulb temperature sensor; 502. Outdoor ambient wet bulb temperature sensor; 503. Refrigerant heat dissipation temperature sensor; 504. Inlet water temperature sensor;

[0050] 60. Heating pipes; 61. Solenoid valve. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0052] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0053] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0054] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0055] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0056] The following disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0057] This application designs and provides a heat pump air conditioning system. Heat pump air conditioning systems are widely used in modern buildings and are a highly efficient and energy-saving air conditioning technology that achieves both cooling and heating functions through the heat pump principle. The heat pump air conditioning system utilizes a refrigerant circulating between the evaporator, compressor, condenser, and throttling device, transferring heat between high-temperature and low-temperature environments according to demand, thereby regulating indoor temperature. In cooling mode, the heat pump air conditioning system absorbs heat from indoors and releases it to the outdoors; in heating mode, it absorbs heat from outdoors and releases it to the indoors, exhibiting high energy efficiency and environmentally friendly characteristics.

[0058] From a thermodynamic perspective, the refrigerant cycle of a heat pump air conditioning system includes an evaporator, compressor, condenser, and throttling device connected in sequence. The refrigerant cycle involves a series of processes, including compression, condensation, expansion, and evaporation, to cool or heat indoor spaces, or to heat domestic hot water.

[0059] Low-temperature, low-pressure refrigerant enters the compressor, which compresses it into high-temperature, high-pressure refrigerant gas and discharges the compressed refrigerant gas. The discharged refrigerant gas flows into the condenser. The condenser condenses the compressed refrigerant into a liquid phase, and heat is released to the surrounding environment through the condensation process.

[0060] The throttling device causes the high-temperature, high-pressure liquid refrigerant condensed in the condenser to expand into a low-pressure liquid refrigerant. The evaporator evaporates the expanded refrigerant in the throttling device and returns the low-temperature, low-pressure refrigerant gas to the compressor. The evaporator achieves its cooling effect by utilizing the latent heat of refrigerant evaporation to exchange heat with the material being cooled.

[0061] From the perspective of component composition, refer to the appendix. Figure 1 This application introduces some embodiments of the heat pump air conditioning system provided. Figure 2 This is a schematic diagram of the refrigerant circulation in the cooling mode of a heat pump air conditioning system. Figure 3 This is a schematic diagram of the refrigerant circulation in the heating mode of a heat pump air conditioning system.

[0062] like Figures 1 to 3 As shown, in the heat pump air conditioning system 1, the compressor 11 is the core component. The compressor 11 compresses the refrigerant, changing its pressure from low to high, enabling efficient heat transfer during circulation. The compressor 11 is powered by a motor, such as a three-phase asynchronous motor or a permanent magnet synchronous motor. The motor converts electrical energy into mechanical energy, driving the piston, rotor, or other components inside the compressor 11. The compressor motor is driven by a compressor motor drive circuit 21. Specifically, the compressor motor drive circuit 21 includes power switching devices, such as IGBTs (Insulated Gate Bipolar Transistors) or MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors). The compressor motor drive circuit 21 converts direct current to alternating current using PWM (Pulse Width Modulation) to drive the compressor motor. Because compressor motors typically require high power and torque, the compressor motor drive circuit 21 is configured to handle high current and high voltage. In some embodiments, the drive circuit 21 also includes multiple protection circuits, such as overcurrent protection circuits, overvoltage protection circuits, overheat protection circuits, etc.

[0063] The outdoor unit of the heat pump air conditioning system 1 refers to the part of the refrigerant cycle that includes the compressor 11. The outdoor unit also includes an outdoor heat exchanger 12. The outdoor heat exchanger 12 is used for heat exchange between the refrigerant and the air. An outdoor fan (not shown) is located near the outdoor heat exchanger 12 to guide airflow. The motor in the outdoor fan can be, for example, a permanent magnet DC motor (BLDC). The outdoor fan motor is driven by an outdoor fan motor drive circuit 21, which also includes power switching devices and uses PWM to achieve various speeds.

[0064] The outdoor unit also includes a switching valve 13, which controls the flow of refrigerant to switch between heating and cooling modes. The switching valve 13 is typically a four-way valve.

[0065] The outdoor unit also includes a gas-liquid separator 14. The gas-liquid separator 14 separates the gas and liquid components in the refrigerant. Located on the suction side of the compressor 11, the gas-liquid separator 14 prevents liquid refrigerant from entering the compressor 11, thus protecting it from liquid slugging damage. The gas-liquid separator 14 separates the refrigerant based on gravity or centrifugal force. When the refrigerant enters the gas-liquid separator 14, the gas and liquid components naturally separate due to their density difference. The gaseous refrigerant, with its lower density, rises to the top of the gas-liquid separator 14, while the liquid refrigerant, with its higher density, sinks to the bottom. The separated gaseous refrigerant enters the suction side of the compressor 11 through the upper outlet of the gas-liquid separator 14, while the separated liquid refrigerant is stored at the bottom of the gas-liquid separator 14 and returned to the refrigerant circulation via the oil return line, or processed in other ways.

[0066] To simplify wiring and installation, the compressor motor drive circuit 21 and the outdoor fan motor drive circuit 21 are integrated. For example, Figure 5 As shown, the outdoor unit of the heat pump air conditioning system 1 is equipped with a drive module 20. The drive module 20 includes a drive circuit 21, which includes a compressor 11 drive circuit 21 and an outdoor fan motor drive circuit 21. The drive circuit 21 is used to drive at least one motor in the heat pump air conditioning system 1, such as the compressor motor or the outdoor fan motor mentioned above.

[0067] Due to the switching and conduction losses generated by the power switching devices during high-frequency switching, as well as the eddy current losses and dielectric losses generated by other components due to rapid changes in current, the drive circuit 21 generates a large amount of heat during operation. To achieve effective thermal management, the drive module 20 also includes a thermally conductive substrate 22, which is used to conduct and dissipate the heat generated by the drive circuit 21 during operation to the surrounding environment, thereby ensuring that all components are within a safe operating temperature range.

[0068] In some embodiments of this application, the thermally conductive substrate 22 is made of a metallic material, such as aluminum or an aluminum alloy.

[0069] The structure and function of the indoor unit are explained below.

[0070] The indoor unit includes an indoor heat exchanger 15, which is matched with an indoor fan (not shown) to guide airflow and exchange heat with the refrigerant in the indoor heat exchanger 15. The motor in the indoor fan can be a permanent magnet DC motor (BLDC) or other types of motor. The indoor fan motor is driven by an indoor fan motor drive circuit 21, which also includes power switching devices and uses PWM to achieve various speeds. The indoor fan motor drive circuit 21 is typically located within the indoor unit.

[0071] The heat pump air conditioning system 1 provided in this application also includes a hydraulic module. The hydraulic module includes a circulation pump and a hydraulic module heat exchanger 16. The circulation pump is used to drive the circulation of water, and the hydraulic module heat exchanger 16 is used to exchange heat between water and refrigerant, transferring heat from the refrigerant to the water to raise the water temperature; or transferring heat from the water to the refrigerant to lower the water temperature. The heated water can be used in underfloor heating, radiator heating, and other heating systems to provide hot water circulation, or for domestic hot water supply systems.

[0072] Based on the thermally conductive substrate 22, the heat pump air conditioning system 1 provided in this application further utilizes a heat dissipation module 17 to cool the drive module 20. The heat dissipation module 17 is disposed on one side of the drive module 20 and includes heat dissipation pipes 171. The heat dissipation pipes 171 are used to guide refrigerant to dissipate heat from the drive module 20. The heat dissipation pipes 171 are located downstream of the condenser; more specifically, such as... Figures 1 to 3 As shown, it is located on the main outlet road of the condenser, as... Figure 4 As shown, in cooling mode and heating mode, the refrigerant in heat dissipation pipe 171 flows in reverse.

[0073] In cooling mode, the outdoor heat exchanger 12 is used as a condenser. The heat dissipation pipe 171 is located downstream of the outdoor heat exchanger 12 and is fluidly connected to it. The high-temperature and high-pressure refrigerant discharged from the compressor 11 enters the outdoor heat exchanger 12 through the switching valve 13. The outdoor heat exchanger 12 acts as a condenser, where the refrigerant condenses into a liquid phase. The refrigerant flowing out of the outdoor heat exchanger 12 passes through the throttling device 18 and then through the heat dissipation pipe 171. The refrigerant flowing out of the heat dissipation pipe 171 further flows into the hydraulic module heat exchanger 16 and / or the indoor heat exchanger 15, and returns to the outdoor unit after passing through the hydraulic module heat exchanger 16 and / or the indoor heat exchanger 15. It then passes through the gas-liquid separator 14 and returns to the compressor 11.

[0074] In heating mode, the hydraulic module heat exchanger 16 and / or the indoor heat exchanger 15 are used as condensers, and the heat dissipation pipe 171 is located downstream of the hydraulic module heat exchanger 16 and / or the indoor heat exchanger 15 used as condensers and is fluidly connected to the hydraulic module heat exchanger 16 and / or the indoor heat exchanger 15. The high-temperature, high-pressure refrigerant discharged from the compressor 11 enters the hydraulic module heat exchanger 16 and / or the indoor heat exchanger 15 through the switching valve 13. The hydraulic module heat exchanger 16 and / or the indoor heat exchanger 15 serve as condensers, where the refrigerant condenses. The hydraulic module heat exchanger 16 and / or the indoor heat exchanger 15 condenses the compressed refrigerant into a liquid phase. The refrigerant flowing out of the hydraulic module heat exchanger 16 and / or the indoor heat exchanger 15 merges with the refrigerant. The merged refrigerant first passes through the heat dissipation pipe 171, then through the throttling device 18, and enters the outdoor heat exchanger 12. The outdoor heat exchanger 12 serves as an evaporator, allowing the low-temperature, low-pressure refrigerant to return to the compressor 11 through the gas-liquid separator 14.

[0075] Even in summer, the hydraulic module heat exchanger 16 can operate independently to provide hot water; however, when the ambient temperature is high, the refrigerant pressure in the heat dissipation pipe 171 is low due to the inlet water temperature, and the refrigerant temperature will remain in a low temperature range, such as 13°C to 15°C. When the refrigerant in the heat dissipation pipe 171 flows near the drive module 20, it is likely that the surface temperature of the drive module 20 will be lower than the dew point temperature of the surrounding air, and water vapor in the air will condense on the surface of the drive module 20; condensation may cause the drive circuit 21 to malfunction.

[0076] like Figure 5 As shown, to solve this problem, the heat pump air conditioning system 1 provided in this application also includes a heating module 30. The heating module 30 is disposed close to the heat-conducting substrate 22, while the heat dissipation module 17 is disposed close to the heating module 30. When in heating mode, the heating module 30 is used to raise the temperature of the heat-conducting substrate 22 to suppress condensation. More specifically, compared to the heat dissipation module 17, the heating module 30 is closer to the heat-conducting substrate 22, and the heating module 30 is in direct contact with the heat-conducting substrate 22.

[0077] To suppress condensation, the surface temperature of the drive module 20 needs to be raised above the dew point temperature of the surrounding air. However, when condensation occurs, if the heating module 30 is positioned close to the heat dissipation pipe 171, for example, on the side of the heat dissipation pipe 171 away from the drive module 20, a very high heating amount is required to suppress condensation due to the large heat capacity of the refrigerant. Actual testing, using a 3HP model as the experimental subject, showed that with an outdoor ambient temperature of 40°C and an inlet water temperature of 10°C for the hydraulic module heat exchanger 16, the refrigerant temperature in the heat dissipation pipe 171 was 13°C to 17°C. To suppress condensation, the refrigerant temperature in the heat dissipation pipe 171 needs to be raised to 40°C, requiring a heating power of approximately 2kW to 3kW.

[0078] In contrast, placing the heat dissipation module 17 on one side of the drive module 20 and the heating module 30 close to the heat-conducting substrate 22 creates a reasonable heat transfer path, raising the temperature of the drive circuit 21 and the heat-conducting substrate 22, which is in direct contact with the drive circuit 21, to above the dew point temperature of the surrounding air. The heat-conducting substrate 22 has a high thermal conductivity, and the thermal resistance R between the drive circuit 21 and the heat-conducting substrate 22 is... j-al The thermal resistance R between the thermally conductive substrate 22 and the heating module 30 al-PTC、 The thermal resistance R between the heating module 30 and the heat dissipation pipe 171 PTC-ref The thermal resistance between them satisfies R j-al ≈R al-PTC <R PTC-ref The temperatures of the drive circuit 21, the heat-conducting substrate 22, and the heating module 30 are closer together. Although a large temperature difference is maintained with the low-temperature refrigerant in the heat dissipation pipe 171, condensation can still be effectively suppressed. Figure 7 As shown.

[0079] Using the 3HP model as the test subject, the heating power required to raise the temperature of the heat-conducting substrate 22 to above the dew point temperature is approximately 200W to 250W. Compared with the heating power required to raise the temperature of the refrigerant in the heat dissipation pipe 171, this is reduced by almost an order of magnitude, significantly reducing the heating power.

[0080] The heat pump air conditioning system 1 provided in this application forms a reasonable heat transfer path by placing the heat dissipation module 17 close to the heating module 30 and the heating module 30 close to the heat-conducting substrate 22. The heating module 30 does not affect normal heat dissipation on the one hand, and can be used to raise the temperature of the heat-conducting substrate 22 to suppress condensation on the drive module 20, which can significantly reduce the heating power.

[0081] In some embodiments of this application, the thermally conductive substrate 22 is a planar thin plate, with a first thermally conductive substrate surface 221 and a second thermally conductive substrate surface 222 formed on its two sides, respectively. The driving circuit 21 is disposed on the first thermally conductive substrate surface 221, for example, by mechanical connection or plug-in connection, and the second thermally conductive substrate surface 222 is opposite to the first thermally conductive substrate surface 221. Exemplarily, both the first thermally conductive substrate surface 221 and the second thermally conductive substrate surface 222 are planar. In other embodiments of this application, the first thermally conductive substrate surface 221 and the second thermally conductive substrate surface 222 may also be stepped, or have several countersunk holes or through holes to facilitate the installation or wiring of electronic components, or may be designed in other shapes.

[0082] The heating module 30 includes a housing 301 and a heating element. The housing 301 is flat, for example, similar to the thermally conductive substrate 22, and is a thin planar plate. The housing 301 is in close contact with the surface 222 of the second thermally conductive substrate. The heating element is disposed within the housing 301. The heat dissipation module 17 is disposed on the side of the housing 301 away from the surface 222 of the second thermally conductive substrate and is in close contact with the housing 301. The housing 301 is made of a thermally conductive material, such as aluminum or an aluminum alloy. Aluminum or aluminum alloy can achieve rapid heat conduction and has good heat dissipation effect. On the one hand, it can effectively conduct heat during heat dissipation, so that the heat conducted through the thermally conductive substrate 22 can be transferred to the refrigerant in the heat dissipation pipe 171, so that the drive circuit 21 can maintain a stable operating state. On the other hand, it can quickly increase the temperature of the thermally conductive substrate 22 when there is a risk of condensation, further ensuring that the drive module 20 is free from the risk of condensation; thus achieving good thermal management in both aspects.

[0083] In some embodiments of this application, such as Figure 8 As shown, the shell 301, which is in the shape of a planar thin plate, has an upper end face 302 and a lower end face 303 that are generally rectangular, and a heating cavity and a weight reduction cavity are formed in the shell 301.

[0084] A heating element is disposed within the heating cavity. Exemplarily, the heating element is disposed substantially through the heating cavity to achieve uniform heat distribution along the length of the upper end face 302 and the lower end face 303. The weight-reducing cavity is an empty cavity, its length substantially extending through the outer shell 301. The heating cavity and the weight-reducing cavity are disposed adjacent to each other, thereby effectively limiting the weight of the entire heating module 30. Exemplarily, such as... Figure 8As shown, the weight-reducing cavity includes a first weight-reducing cavity 305 and a second weight-reducing cavity 307, and the heating cavity includes a first heating cavity 306 and a second heating cavity 308. Independently operating first heating elements 304 and second heating elements 309 are respectively disposed in the first heating cavity 306 and the second heating cavity 308. In the width direction of the upper end face 302 and the lower end face 303, the first weight-reducing cavity 305 and the second weight-reducing cavity 307 are respectively formed on both sides of the outer shell 301. From the outside in, the first weight-reducing cavity 305 is adjacent to the first heating cavity 306, and the second weight-reducing cavity 307 is adjacent to the second heating cavity 308. The remaining part of the outer shell 301 is a heat-conducting body, made of aluminum or aluminum alloy, which is a solid metal entity to ensure good thermal conductivity. The upper end face 302 of the outer shell 301 is in close contact with the surface 222 of the second heat-conducting substrate, and the lower end face 303 is in close contact with the second heat dissipation module 17.

[0085] In some embodiments of this application, the heat dissipation module 17 further includes a heat dissipation bracket 172. A heat dissipation pipe 171 is disposed on the heat dissipation bracket 172, and the heat dissipation bracket 172 is in close contact with the heating module 30. Figure 6 As shown, the heating module 30 further includes a first thermally conductive layer 41 and a second thermally conductive layer 42. The first thermally conductive layer 41 is disposed between the outer shell 301 and the heat dissipation bracket 172, and the first thermally conductive layer 41 can be thermally conductive silicone grease. The second thermally conductive layer 42 is disposed between the outer shell 301 and the surface 222 of the second thermally conductive substrate, and the second thermally conductive layer 42 can also be thermally conductive silicone grease. The first thermally conductive layer 41 and the second thermally conductive layer 42 can reduce the interfacial contact thermal resistance and improve the efficiency of heat conduction.

[0086] For example, the heating element is a PTC element, which can be in the form of a sheet, strip, or block. The PTC element is press-fitted into the heating cavity. On the one hand, the PTC element has good mechanical strength and is not easily broken; on the other hand, during press-fitting, the PTC element surface is in contact, providing good thermal stability and electrical connection stability. Press-fitting ensures close contact between the PTC element and the aluminum or aluminum alloy used to make the housing 301, reducing thermal resistance and achieving more efficient heat conduction. Specifically, the heating cavity can be constructed with connecting grooves, into which the sheet-shaped PTC element is inserted to achieve pressing and effective heat conduction.

[0087] In other embodiments of this application, the heating element may also be a resistance wire, an electrothermal film, or a semiconductor heating element.

[0088] In some embodiments of this application, such as Figure 9As shown, the heat pump air conditioning system 1 includes an outdoor ambient dry-bulb temperature sensor 501, an outdoor ambient wet-bulb temperature sensor 502, a refrigerant heat dissipation temperature sensor 503, and an inlet water temperature sensor 504. The outdoor ambient temperature sensor and the outdoor ambient humidity sensor are located in the outdoor unit. The refrigerant heat dissipation temperature sensor 503 is located between the drive circuit 21 and the heat-conducting substrate 22. The inlet water temperature sensor 504 is located on the inlet water pipe of the hydraulic module. The outdoor dew point temperature can be obtained based on the detected values ​​of the outdoor ambient dry-bulb temperature sensor 501 and the outdoor ambient wet-bulb temperature sensor 502. Furthermore, based on the outdoor dew point temperature, a switching signal can be generated by comparing the detected temperature of the refrigerant heat dissipation temperature sensor 503 with the outdoor dew point temperature, or by comparing the detected temperature of the refrigerant heat dissipation temperature sensor 503 with the outdoor ambient dry-bulb temperature sensor 501, or by comparing the detected temperature of the inlet water temperature sensor 504 with the outdoor ambient dry-bulb temperature sensor 501, to drive the operation of the heating element.

[0089] The comparison between sensor signals can be implemented using a processor chip. For example, an analog-to-digital converter (ADC) circuit can be used to convert the analog signals from the sensor into digital signals, and the acquired digital signals can be stored in the processor chip's memory. The processor chip uses its built-in arithmetic logic unit or comparator circuit to compare the sensor signals and generate a switching signal based on the comparison result to drive the heating element. The comparison between sensor signals can also be implemented using independent ADC circuits and comparator circuits, which are mature technologies in the existing field and will not be elaborated upon here.

[0090] like Figure 10 ,as well as Figures 12 to 16 As shown in some other embodiments of this application, the thermally conductive substrate 22 includes a housing 201. The housing 201 of the thermally conductive substrate 22 is made of aluminum or aluminum alloy, for example, processed into a flat thin plate shape, with a first thermally conductive substrate surface 221 and a second thermally conductive substrate surface 222 formed on its two sides, the second thermally conductive substrate surface 222 being opposite to the first thermally conductive substrate surface 221. The driving circuit 21 is disposed on the first thermally conductive substrate surface 221, for example, by means of mechanical connection or plug-in. Exemplarily, both the first thermally conductive substrate surface 221 and the second thermally conductive substrate surface 222 are planar. In some other embodiments of this application, the first thermally conductive substrate surface 221 and the second thermally conductive substrate surface 222 may also be designed as stepped, or have several countersunk holes or through holes to facilitate the installation or wiring of electronic components, or may be designed as other shapes.

[0091] The heating module 30 is disposed in the housing 201. The housing 201, which is in the shape of a planar thin plate, has an upper end surface 302 and a lower end surface 303 that are generally rectangular. A heating cavity and a weight reduction cavity are formed in the housing 201.

[0092] More specifically, the heating module 30 includes a heating element disposed within a heating cavity. Exemplarily, the heating element is disposed substantially through the heating cavity to achieve uniform heat distribution along the length of the first thermally conductive substrate surface 221 and the second thermally conductive substrate surface 222. The weight-reducing cavity is an empty cavity, the length of which substantially extends through the housing 201. The heating cavity and the weight-reducing cavity are disposed adjacent to each other, thereby effectively limiting the overall weight of the thermally conductive substrate 22 in which the heating module 30 is integrated. The remainder of the housing 201 is a thermally conductive body, which, being made of aluminum or an aluminum alloy, ensures good thermal conductivity.

[0093] The first heating element 304 and the second heating element 309 can be PTC elements, resistance wires, electric heating molds, or semiconductor heating elements.

[0094] The heat dissipation module 17 also includes a heat dissipation bracket 172. Heat dissipation pipes 171 are mounted on the heat dissipation bracket 172. The heat dissipation bracket 172 is in close contact with the housing 201. Figure 11 As shown, a thermally conductive layer 43 is disposed between the heat dissipation bracket 172 and the surface 222 of the second thermally conductive substrate. The thermally conductive layer 43 can be thermally conductive silicone grease, which can reduce interfacial contact thermal resistance and improve heat conduction efficiency.

[0095] In some embodiments of this application, such as Figure 17 As shown, the heating element is a heating pipe 60, which is connected to the exhaust end of the compressor 11. A solenoid valve 61 is provided between the heating pipe 60 and the exhaust end of the compressor 11. For example, the heating pipe 60 passes through the first heating chamber 306 and the second heating chamber 308. When there is a risk of condensation, the solenoid valve 61 is turned on, and the high-temperature refrigerant discharged from the exhaust end of the compressor 11 is introduced into the heating pipe 60, thereby raising the temperature of the heat-conducting substrate 22 through the high-temperature refrigerant and suppressing the formation of condensate.

[0096] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0097] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat pump air conditioning system, including: The driver module includes: A drive circuit for driving at least one motor in the heat pump air conditioning system; A thermally conductive substrate, which is used to conduct and dissipate the heat generated during the operation of the drive circuit to the surrounding environment; Its characteristic is that it further includes: A heating module is disposed near or within the heat-conducting substrate; when the heating module is in a heating state, it is used to increase the temperature of the heat-conducting substrate. A heat dissipation module is disposed close to the heating module; the heat dissipation module includes: The heat dissipation pipes are used to guide the flow of refrigerant to dissipate heat from the drive module.

2. The heat pump air conditioning system according to claim 1, characterized in that, Also includes: Hydraulic module, comprising: Hydraulic module heat exchanger, which is used as a condenser to heat water; The heat dissipation pipe is located downstream of the hydraulic module heat exchanger, which serves as a condenser, and is fluidly connected to the hydraulic module heat exchanger.

3. The heat pump air conditioning system according to claim 1, characterized in that, Also includes: Outdoor heat exchanger, which functions as a condenser in cooling mode; The heat dissipation pipe is located downstream of the outdoor heat exchanger, which serves as a condenser, and is in fluid connection with the outdoor heat exchanger.

4. The heat pump air conditioning system according to claim 1, characterized in that, Also includes: The thermally conductive substrate includes: The driving circuit is mounted on the surface of the first thermally conductive substrate. The surface of the second thermally conductive substrate is opposite to the surface of the first thermally conductive substrate. The heating module includes: The outer casing is flat and is in close contact with the surface of the second thermally conductive substrate; A heating element, wherein the heating element is disposed within the housing; The heat dissipation module is disposed on the side of the housing away from the surface of the second thermally conductive substrate and is in close contact with the housing.

5. The heat pump air conditioning system according to claim 4, characterized in that, The outer casing includes: A heating chamber, wherein the heating element is disposed in the heating chamber; Weight reduction cavity, wherein the weight reduction cavity is an empty cavity; The heating chamber is arranged adjacent to the weight reduction chamber.

6. The heat pump air conditioning system according to claim 4, characterized in that: The heat dissipation module also includes: A heat dissipation bracket is provided, and the heat dissipation pipes are disposed on the heat dissipation bracket, and the heat dissipation bracket is in close contact with the heating module; The heating module also includes: A first thermally conductive layer is disposed between the outer shell and the heat dissipation bracket; The second thermally conductive layer is disposed between the outer shell and the surface of the second thermally conductive substrate.

7. The heat pump air conditioning system according to claim 1, characterized in that: The thermally conductive substrate includes: The housing contains the heating module disposed within it; the housing has: The driving circuit is mounted on the surface of the first thermally conductive substrate. The surface of the second thermally conductive substrate is opposite to the surface of the first thermally conductive substrate. A heating chamber, wherein a heating element is provided in the heating chamber; The weight-reducing cavity is an empty cavity; the weight-reducing cavity and the heating cavity are spaced apart.

8. The heat pump air conditioning system according to claim 7, characterized in that: The heat dissipation module also includes: A heat dissipation bracket is provided, and the heat dissipation pipes are disposed on the heat dissipation bracket. The heat dissipation bracket is in close contact with the housing. A heat-conducting layer is disposed between the heat dissipation bracket and the surface of the second heat-conducting substrate.

9. The heat pump air conditioning system according to any one of claims 4 to 8, characterized in that: The heating element is a PTC element, a resistance wire, an electrothermal film, or a semiconductor heating element.

10. The heat pump air conditioning system according to any one of claims 4 to 8, characterized in that: The heating element is a heating pipe, which is connected to the exhaust end of the compressor. A solenoid valve is installed between the heating pipe and the exhaust end of the compressor.

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