Power device, circuit board assembly, and electronic device

Abstract

The application discloses a power device, a circuit board assembly and electronic equipment, and relates to the technical field of electrical equipment, comprising a body, a first surface and a second surface oppositely arranged along a first direction, the first surface having a welding area; a plurality of limiting members are arranged on the first surface and protrude from the first surface along the first direction, and the plurality of limiting members are arranged at intervals on the periphery of the welding area, and the limiting members abut against the heat sink along the first direction. When the welding area of the body and the heat sink are welded by means of solder paste or other welding materials, the plurality of limiting members are arranged at intervals on the periphery of the welding area and abut against the heat sink, which can effectively prevent the power device from tilting due to the flow of welding materials or thermal stress during the welding process, ensure that the power device remains flat after welding, thereby improving the welding quality and reliability, enhancing the heat dissipation performance, reducing the risk of poor electrical contact or uneven heat distribution caused by the tilting of the power device, and improving the safety and reliability of the power device.

Description

Technical Field

[0001] This application relates to the field of electrical equipment technology, and more particularly to a power device, circuit board assembly, and electronic device. Background Technology

[0002] Some electronic devices, such as inverters, typically contain multiple electrical components, including circuit boards and power devices. During assembly, power devices are usually fixed to the surface of a heat sink by soldering. However, after soldering, the power devices may tilt, affecting their heat dissipation and electrical performance. Utility Model Content

[0003] This application provides a power device, a circuit board assembly, and an electronic device, aiming to solve the technical problem of tilting after the power device and heat sink are soldered.

[0004] To achieve the above objectives, according to a first aspect of this application, a power device is provided, comprising:

[0005] The body has a first surface and a second surface disposed opposite to each other along a first direction, and the first surface has a welding area;

[0006] The limiting component is provided in multiple ways, and the multiple limiting components are provided on the first surface and protrude from the first surface along the first direction, and the multiple limiting components are spaced apart on the periphery of the welding area.

[0007] In some embodiments, the power device includes:

[0008] A connecting component is disposed on at least one side of the body along the second direction and connected to the body;

[0009] An insulating component is connected to the body and is located on the side of the connecting component closer to the first surface.

[0010] In some embodiments, the connection assembly includes a plurality of leads, which are respectively disposed on both sides of the body along the second direction, and at least a portion of the leads are connected to an insulating component.

[0011] In some embodiments, the connection component includes at least two pins disposed on one side of the body along a second direction and connected to the body respectively, with at least a portion of each pin connected to an insulating component.

[0012] In some embodiments, the power device includes a cover portion connected to the body, the cover portion covering at least two pins and exposing the ends of the pins.

[0013] In some embodiments, the multiple limiting members and the body are an integral structure.

[0014] In some embodiments, the welding area has a central axis, and a plurality of limiting members are disposed on both sides of the central axis and are symmetrical about the central axis.

[0015] According to a second aspect of this application, a circuit board assembly is provided, comprising:

[0016] heat sink;

[0017] A power device includes a body and a plurality of limiting members. The body has a first surface and a second surface that are disposed opposite to each other along a first direction. The first surface has a welding area. The welding area is located on the side of the body facing the heat sink and is connected to the heat sink by welding. The plurality of limiting members are disposed on the first surface and protrude from the first surface along the first direction. The plurality of limiting members are spaced apart on the periphery of the welding area and abut against the heat sink along the first direction.

[0018] In some embodiments, the heat sink includes a base and a protrusion connected together, a limiting member abutting against the base in a first direction, the protrusion protruding from the base in the first direction, and the protrusion being connected to a welding area.

[0019] According to a third aspect of this application, an electronic device is provided, including the power device described above, or the circuit board assembly described above.

[0020] This application provides a power device and a circuit board assembly. The power device includes a body and multiple limiting members. The circuit board assembly includes a heat sink and the power device. The body has a first surface and a second surface disposed opposite to each other along a first direction. The first surface has a soldering area. Multiple limiting members are disposed on the first surface and protrude from the first surface along the first direction. The multiple limiting members are spaced apart on the periphery of the soldering area and abut against the heat sink along the first direction. When the soldering area of ​​the body and the heat sink are soldered with solder paste or other soldering materials, the multiple limiting members spaced apart on the periphery of the soldering area and abut against the heat sink can effectively prevent the power device from tilting during the soldering process due to the flow of soldering materials or thermal stress. This ensures that the power device remains flat after soldering, thereby improving soldering quality and reliability, enhancing heat dissipation performance, reducing the risk of poor electrical contact or uneven heat distribution caused by the tilting of the power device, and improving the safety and reliability of the power device.

[0021] The electronic device in this application includes the power device or the circuit board assembly described above. Therefore, the electronic device can have all the technical features and beneficial effects of the power device or the circuit board assembly described above, which will not be repeated here. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0024] Figure 1 This is a schematic diagram of the structure of a power device according to an embodiment of this application;

[0025] Figure 2 This is a schematic diagram of the structure of a power device according to another embodiment of this application;

[0026] Figure 3 This is a side view of a power device according to an embodiment of this application;

[0027] Figure 4 This is a schematic diagram of the structure of a power device according to another embodiment of this application;

[0028] Figure 5 This is an exploded view of a circuit board assembly according to an embodiment of this application;

[0029] Figure 6 This is a cross-sectional view of a circuit board assembly according to an embodiment of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Body; 2. Limiting component; 3. Connecting component; 4. Insulating component; 5. Covering part; 6. Heat sink; 7. Circuit board; 8. Welding part; 10. First side; 11. Second side; 30. Lead-out terminal; 31. Pin; 60. Base; 61. Protrusion; 100. Welding area; X, First direction; Y, Second direction. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0033] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0034] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0035] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0036] The applicant noted that some electronic devices, such as inverters, typically incorporate multiple electrical structures, including circuit boards 7 and power devices. During assembly, power devices are usually fixed to the surface of the heat sink 6 by welding. However, after welding, the power devices may tilt, affecting their heat dissipation and electrical performance. Typically, limiting posts are needed on the welding surface of the heat sink 6 to prevent the power devices from tilting due to welding material flow or thermal stress during welding. However, installing limiting posts on the heat sink 6 involves lengthy processing times, resulting in higher costs and lower production efficiency.

[0037] In view of this, embodiments of this application provide a power device and a circuit board assembly. The power device includes a body 1 and a plurality of limiting members 2. The circuit board assembly includes a heat sink 6 and the power device. The body 1 has a first surface 10 and a second surface 11 disposed opposite to each other along a first direction X. The first surface 10 has a welding area 100. The plurality of limiting members 2 are disposed on the first surface 10 and protrude from the first surface 10 along the first direction X. The plurality of limiting members 2 are spaced apart on the periphery of the welding area 100 and abut against the heat sink 6 along the first direction X. When the welding area 100 of the body 1 and the heat sink 6 are welded with solder paste or other welding materials, the plurality of limiting members 2 are spaced apart on the periphery of the welding area 100 and abut against the heat sink 6. This can effectively prevent the power device from tilting due to the flow of welding materials or thermal stress during the welding process, ensuring that the power device remains flat after welding. This improves the welding quality and reliability, enhances heat dissipation performance, reduces the risk of poor electrical contact or uneven heat distribution caused by the tilting of the power device, and improves the safety and reliability of the power device.

[0038] The power devices, circuit board assemblies, and electronic devices of this application will now be described in detail with reference to the accompanying drawings. Unless otherwise specified, the features of the following embodiments and implementations can be combined with each other.

[0039] Figure 1 This is a schematic diagram of the structure of a power device according to an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a power device according to another embodiment of this application; Figure 3 This is a side view of a power device according to an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a power device according to another embodiment of this application.

[0040] refer to Figures 1 to 4 This application provides a power device, which includes a body 1 and a plurality of limiting members 2. The body 1 has a first surface 10 and a second surface 11 disposed opposite to each other along a first direction X. The first surface 10 has a welding area 100. The limiting members 2 are provided in a plurality of manner, and the plurality of limiting members 2 are disposed on the first surface 10 and protrude from the first surface 10 along the first direction X. The plurality of limiting members 2 are spaced apart on the periphery of the welding area 100. The limiting members 2 are used to abut against a heat sink 6 along the first direction X. The heat sink 6 is used to conduct, transfer and dissipate heat from the power device to the surrounding environment. When the welding area 100 of the body 1 is welded to the heat sink 6 using solder paste or other welding materials, multiple limiting members 2 are spaced apart around the welding area 100 and abut against the heat sink 6. This effectively prevents the power device from tilting due to the flow of welding materials or thermal stress during the welding process, ensuring that the power device remains flat after welding. This improves the welding quality and reliability, enhances heat dissipation performance, reduces the risk of poor electrical contact or uneven heat distribution caused by the tilting of the power device, and improves the safety and reliability of the power device.

[0041] In some embodiments, the limiting member 2 may be a columnar, block-shaped, or conical structure that protrudes from the first surface 10 along the first direction X. (Refer to...) Figure 1 and Figure 2 The limiting member 2 is a cylinder, and the side of the multiple limiting members 2 away from the first surface 10 abuts against the heat sink 6. This application does not limit the shape of the limiting member 2.

[0042] In some embodiments, refer to Figure 3 The power device includes a connection component 3 and an insulation component 4. The connection component 3 is disposed on at least one side of the body 1 along the second direction Y and is connected to the body 1. The connection component 3 is used to realize electrical connection with external circuits and ensure current transmission. The insulation component 4 is connected to the body 1 and is located on the side of the connection component 3 closer to the first surface 10. The heat sink 6 is usually welded to the welding area 100 of the body 1. The connection component 3 and the heat sink 6 are arranged compactly with a small spacing, which poses a safety risk. In this embodiment, by providing the insulation component 4 between the heat sink 6 and the connection component 3, electrical short circuits or leakage problems between the connection component 3 and the heat sink 6 can be prevented, thereby improving the safety and reliability of the power device.

[0043] In some embodiments, refer to Figure 4 The connecting component 3 includes multiple lead-out terminals 30, which are respectively disposed on both sides of the body 1 along the second direction Y. At least a portion of the lead-out terminals 30 is connected to the insulating component 4. The lead-out terminals 30 are used to connect to components such as film capacitors (not shown) and AC busbars (not shown). Film capacitors are commonly used in power electronic circuits for filtering, energy storage, and coupling. AC busbars are used to connect various electrical components to realize the transmission and distribution of electrical energy. In the application of power devices, the AC busbar is soldered to the lead-out copper sheets to connect the power devices to the AC circuit, enabling them to operate normally. In this embodiment, by providing the insulating component 4 between the heat sink 6 and the lead-out terminals 30, electrical short circuits or leakage problems between the lead-out terminals 30 and the heat sink 6 can be prevented, thereby improving the safety and reliability of the power devices.

[0044] In some embodiments, refer to Figure 1 and Figure 2 The connection component 3 includes at least two pins 31, which are disposed on one side of the body 1 along the second direction Y and connected to the body 1 respectively. At least a portion of each pin 31 is connected to the insulating component 4. The pins 31 are used to connect the internal circuitry of the power device to an external circuitry. Exemplarily, in this embodiment, the pins 31 are used to connect the power device to the circuit board 7. By providing the insulating component 4 between the heat sink 6 and the pins 31, this embodiment can achieve a stable electrical connection and effectively prevent short circuits or leakage caused by insufficient electrical clearance, thereby improving the safety and reliability of the power device.

[0045] In some embodiments, the insulating component 4 can be integrally injection molded with the body 1. This eliminates the need for separate assembly of the insulating component 4 and reduces the space occupied by the power device in the first direction X. Furthermore, it reduces process complexity and improves production efficiency. The insulating component 4 can be an insulating partition or insulating coating, or other structure capable of providing insulation. (Refer to...) Figure 3 In this embodiment, the insulating component 4 is a planar insulating partition. The insulating partition forms a physical isolation between the connecting component 3 and the heat sink 6. On the one hand, it reduces space occupation; on the other hand, it effectively prevents short circuits or leakage caused by insufficient electrical clearance, thereby improving the safety and reliability of the power device. This configuration eliminates the need for a separate insulating component between the power device and the heat sink 6, reducing production costs and improving assembly efficiency.

[0046] In some embodiments, refer to Figure 3The power device includes a cover portion 5, which is connected to the body 1 and integrally injection molded with the body 1. The cover portion 5 covers at least two pins 31, exposing the ends of the pins 31. This configuration provides additional physical protection for the cover portion 5, improving the vibration resistance of the multiple pins 31 and preventing breakage under vibration conditions. Furthermore, the cover portion 5 enhances the electrical isolation performance of the pins 31. It is understood that the small gaps between the multiple pins 31 make them prone to deformation during assembly, potentially causing safety issues. The cover portion 5 typically has good insulation properties. In this embodiment, by providing the cover portion 5 to cover at least a portion of at least two pins 31, electrical short circuits between the pins 31 can be effectively prevented. Additionally, the exposed ends of the pins 31 allow for easy connection to external circuits.

[0047] In some embodiments, the plurality of limiting members 2 and the body 1 are an integral structure. Exemplarily, the plurality of limiting members 2 and the body 1 are integrally injection molded. With this configuration, there is no need to assemble the limiting members 2 separately or to set the limiting members 2 on the heat sink 6, which can reduce the complexity of the process, improve production efficiency, and reduce production costs.

[0048] In some embodiments, the welding area 100 has a central axis, and a plurality of limiting members 2 are disposed on both sides of the central axis and are symmetrical about the central axis. In the embodiments of this application, the number of limiting members 2 is greater than or equal to three, and at least three limiting members 2 are symmetrically arranged about the central axis of the welding area 100. This can effectively prevent the power device from tilting or shifting during the welding process due to the flow of welding material or thermal stress, ensuring that the power device remains flat after welding, thereby improving welding quality and reliability, enhancing heat dissipation performance, reducing the risk of poor electrical contact or uneven heat distribution caused by the tilting of the power device, and improving the safety and reliability of the power device.

[0049] For example, refer to Figure 1 There are four limiting members 2, which are evenly distributed on both sides of the welding area 100. They can provide more uniform support for the power device and effectively prevent the power device from tilting or shifting due to the flow of welding material or thermal stress during the welding process. This ensures that the power device remains flat after welding, thereby improving the welding quality and reliability, enhancing heat dissipation performance, reducing the risk of poor electrical contact or uneven heat distribution caused by the tilting of the power device, and improving the safety and reliability of the power device.

[0050] For example, refer to Figure 1 ,exist Figure 2In the illustrated embodiment, there are three limiting members 2, which are arranged symmetrically on both sides of the central axis. The layout of the three limiting members 2 is relatively simple, reducing design and manufacturing complexity, lowering production and material costs, while still achieving good balance. This prevents the power device from tilting or shifting during welding due to welding material flow or thermal stress, ensuring the power device remains flat after welding. This improves welding quality and reliability, enhances heat dissipation performance, reduces the risk of poor electrical contact or uneven heat distribution caused by power device tilting, and ultimately improves the safety and reliability of the power device.

[0051] Figure 5 This is an exploded view of a circuit board assembly according to an embodiment of this application; Figure 6 This is a cross-sectional view of a circuit board assembly according to an embodiment of this application. (Reference) Figure 5 and Figure 6 This application provides a circuit board assembly including a heat sink 6 and a power device. The heat sink 6 is used to conduct, transfer, and dissipate heat from the power device to the surrounding environment. The power device includes a body 1 and a plurality of limiting members 2. The body 1 has a first surface 10 and a second surface 11 disposed opposite to each other along a first direction X. The first surface 10 has a soldering area 100. The soldering area 100 is located on the side of the body 1 facing the heat sink 6 and is connected to the heat sink 6. The plurality of limiting members 2 are disposed on the first surface 10 and protrude from the first surface 10 along the first direction X. The plurality of limiting members 2 are spaced apart on the periphery of the soldering area 100 and abut against the heat sink 6 along the first direction X. When the welding area 100 of the body 1 is welded to the heat sink 6 using solder paste or other welding materials, multiple limiting members 2 are spaced apart around the welding area 100 and abut against the heat sink 6. This effectively prevents the power device from tilting due to the flow of welding materials or thermal stress during the welding process, ensuring that the power device remains flat after welding. This improves the welding quality and reliability, enhances heat dissipation performance, reduces the risk of poor electrical contact or uneven heat distribution caused by the tilting of the power device, and improves the safety and reliability of the power device.

[0052] In some embodiments, refer to Figure 6 The heat sink 6 includes a base 60 and a protrusion 61 connected to each other. A limiting member 2 abuts against the base 60 along a first direction X. The protrusion 61 protrudes from the base 60 along the first direction X, and is connected to the soldering area 100 by soldering. The protrusion 61 protrudes from the base 60 along the first direction X and is connected to the soldering area 100 of the body 1 via a soldering part 8, which can more effectively conduct heat from the power device to the surrounding environment, improving heat dissipation efficiency. For example, the soldering part 8 can be a soldering material such as solder paste.

[0053] In some embodiments, the power device includes a circuit board 7, which is disposed opposite to the body 1; at least two pins 31 are respectively connected to the body 1 and located on one side of the body 1 along the second direction Y; the circuit board 7 and the body 1 are connected through the pins 31. The pins 31 are used to connect the power device to the circuit board 7 to ensure the transmission of current and signals.

[0054] In some embodiments, refer to Figure 5 The power device includes a connection component 3 and an insulation component 4. The connection component 3 is disposed on at least one side of the body 1 along the second direction Y and is connected to the body 1. The connection component 3 is used to realize electrical connection with external circuits and ensure current transmission. The insulation component 4 is connected to the body 1 and is located on the side of the connection component 3 closer to the first surface 10. The heat sink 6 is usually welded to the welding area 100 of the body 1. The connection component 3 and the heat sink 6 are arranged compactly with a small spacing, which poses a safety risk. In this embodiment, by providing the insulation component 4 between the heat sink 6 and the connection component 3, electrical short circuits or leakage problems between the connection component 3 and the heat sink 6 can be prevented, thereby improving the safety and reliability of the power device.

[0055] In some embodiments, refer to Figure 5 The connecting component 3 includes multiple lead-out terminals 30, which are respectively disposed on both sides of the body 1 along the second direction Y. At least a portion of the lead-out terminals 30 is connected to the insulating component 4. The lead-out terminals 30 are used to connect to components such as film capacitors (not shown) and AC busbars (not shown). Film capacitors are commonly used in power electronic circuits for filtering, energy storage, and coupling. AC busbars are used to connect various electrical components to realize the transmission and distribution of electrical energy. In the application of power devices, the AC busbar is soldered to the lead-out copper sheets to connect the power devices to the AC circuit, enabling them to operate normally. In this embodiment, by providing the insulating component 4 between the heat sink 6 and the lead-out terminals 30, electrical short circuits or leakage problems between the lead-out terminals 30 and the heat sink 6 can be prevented, thereby improving the safety and reliability of the power devices.

[0056] In some embodiments, refer to Figure 5 The connection component 3 includes at least two pins 31, which are disposed on one side of the body 1 along the second direction Y and connected to the body 1 respectively. At least a portion of each pin 31 is connected to the insulating component 4. The pins 31 are used to connect the internal circuitry of the power device to an external circuitry. Exemplarily, in this embodiment, the pins 31 are used to connect the power device to the circuit board 7. By providing the insulating component 4 between the heat sink 6 and the pins 31, this embodiment can achieve a stable electrical connection and effectively prevent short circuits or leakage caused by insufficient electrical clearance, thereby improving the safety and reliability of the power device.

[0057] In some embodiments, the insulating component 4 can be integrally injection molded with the body 1. This configuration eliminates the need for separate assembly of the insulating component 4 and avoids occupying excessive space for the power device in the first direction X. Furthermore, it reduces process complexity and improves production efficiency.

[0058] In some embodiments, refer to Figure 5 The power device includes a cover portion 5, which is connected to the body 1. The cover portion 5 covers at least two pins 31, exposing the ends of the pins 31. This configuration provides additional physical protection, improving the vibration resistance of the multiple pins 31 and preventing breakage under vibration conditions. Furthermore, the cover portion 5 enhances the electrical isolation performance of the pins 31. It is understood that the small gaps between the multiple pins 31 make them prone to deformation during assembly, potentially causing safety issues. The cover portion 5 typically has good insulation properties. In this embodiment, by covering at least a portion of at least two pins 31 with the cover portion 5, electrical short circuits between the pins 31 can be effectively prevented. Additionally, the exposed ends of the pins 31 allow for easy connection to external circuits.

[0059] According to a third aspect of this application, an electronic device is provided, comprising the aforementioned power device or the aforementioned circuit board assembly. Therefore, this electronic device can possess all the technical features and beneficial effects of the aforementioned power device or the aforementioned circuit board assembly, which will not be elaborated further here.

[0060] The electronic device in this application includes the power device or the circuit board assembly described above. Therefore, the electronic device can have all the technical features and beneficial effects of the power device or the circuit board assembly described above, which will not be repeated here.

[0061] The power devices, circuit board assemblies, and electronic devices provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

[0062] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent variations and modifications made in accordance with the shape, structure, features and spirit described in the claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A power device, characterized in that, include: The body has a first surface and a second surface disposed opposite to each other along a first direction, the first surface having a welding area; The limiting member is provided in a plurality of them, and the plurality of the limiting members are disposed on the first surface and protrude from the first surface along the first direction, and the plurality of the limiting members are spaced apart on the periphery of the welding area.

2. The power device according to claim 1, characterized in that, The power device includes: A connecting component is disposed on at least one side of the body along the second direction and connected to the body; An insulating component is connected to the body and is located on the side of the connecting component closer to the first surface.

3. The power device according to claim 2, characterized in that, The connection assembly includes a plurality of lead-out terminals, which are respectively disposed on both sides of the body along the second direction, and at least a portion of the lead-out terminals are connected to the insulating assembly.

4. The power device according to claim 2, characterized in that, The connection component includes at least two pins, which are disposed on one side of the body along the second direction and are respectively connected to the body, with at least a portion of each pin connected to the insulating component.

5. The power device according to claim 4, characterized in that, The power device includes a cover portion connected to the body, the cover portion covering at least two of the pins and exposing the ends of the pins.

6. The power device according to claim 1, characterized in that, The multiple limiting components and the main body are an integral structure.

7. The power device according to claim 1, characterized in that, The welding area has a central axis, and a plurality of the limiting members are disposed on both sides of the central axis and are symmetrical about the central axis.

8. A circuit board assembly, characterized in that, include: heat sink; A power device includes a body and a plurality of limiting members. The body has a first surface and a second surface disposed opposite to each other along a first direction. The first surface has a welding area. The welding area is located on the side of the body facing the heat sink, and the welding area is connected to the heat sink by welding. The plurality of limiting members are disposed on the first surface and protrude from the first surface along the first direction. The plurality of limiting members are spaced apart on the periphery of the welding area, and the limiting members abut against the heat sink along the first direction.

9. The circuit board assembly according to claim 8, characterized in that, The heat sink includes a base and a protrusion connected to each other. The limiting member abuts against the base along the first direction. The protrusion protrudes from the base along the first direction and is connected to the welding area.

10. An electronic device, characterized in that, Includes the power device as described in any one of claims 1 to 7, or the circuit board assembly as described in claim 8 or 9.

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