A heat dissipation structure of an LED lamp panel

Abstract

This utility model relates to a heat dissipation structure for an LED light board in the field of circuit boards. It includes a circuit board substrate and LED beads soldered in the circuit board substrate. The surface of the circuit board substrate is provided with printed circuits and pads. The LED beads are soldered in the pads. The surface of the circuit board substrate is divided into a working area and an idle area. The printed circuits and pads are located in the working area. A silicon substrate is provided between the working area and the idle area. Copper disk terminals are provided at both ends of the silicon substrate substrate. One end of the copper disk terminal is soldered to the pad, and the other end of the copper disk terminal is in contact with the idle area. Several micro-grooves are formed on the surface of the silicon substrate substrate. The micro-grooves are intersected and distributed. The micro-grooves are filled with highly thermally conductive graphene. Wedge-shaped positioning bumps are also provided at both ends of the silicon substrate substrate. Positioning grooves are provided on the surface of the pads and the idle area. The wedge-shaped positioning bumps can be paired and inserted into the positioning grooves. Heat dissipation is achieved by utilizing the idle area of ​​the circuit board substrate itself. It can be well adapted to the miniaturized and integrated LED light board substrate structure design.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, and in particular to a heat dissipation structure for an LED light board. Background Technology

[0002] With the rapid development of electronic devices towards miniaturization and lightweight design, compact LED light panels, with their small size and high integration, are widely used in space-constrained fields such as smart wearable devices, miniature projectors, and automotive lighting. These light panels achieve efficient lighting within limited space by integrating a large number of LED chips on a circuit board, meeting the miniaturization requirements of modern electronic devices and driving technological upgrades and product innovation in related industries.

[0003] However, compact LED light panels face severe heat dissipation challenges in practical applications. Due to the highly compact overall structure of the light panel, the space on the circuit board for installing heat dissipation components is significantly reduced. Traditional heat dissipation devices such as finned heat sinks and heat pipe heat sinks are too bulky to fit into the limited installation space of compact light panels. LED chips continuously generate heat during operation. If this heat cannot be dissipated in time, the local temperature of the light panel will rise rapidly. This will not only reduce the luminous efficiency and lifespan of the LED chips, but may also cause performance degradation of electronic components on the circuit board, or even cause the entire light panel to fail, seriously affecting the stable operation of the equipment. Utility Model Content

[0004] In order to overcome the shortcomings of existing technical solutions, this utility model provides a heat dissipation structure for LED light panels, which can effectively solve the technical problem that existing compact LED light panels lack space for heat sink structures.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A heat dissipation structure for an LED light board includes a circuit board and LED beads soldered in the circuit board. The surface of the circuit board is provided with printed circuits and pads. The LED beads are soldered in the pads and are conductive through the printed circuits. The surface of the circuit board is divided into a working area and an idle area. The printed circuits and pads are located in the working area. A silicon substrate is disposed between the working area and the idle area. Copper disk terminals are provided at both ends of the silicon substrate. A titanium-nickel alloy buffer sheet is disposed between the copper disk terminals and the connection surface of the silicon substrate. One end of the copper disk terminal is soldered to the pad, and the other end of the copper disk terminal is in contact with the idle area. Several microgrooves are formed on the surface of the silicon substrate. The microgrooves are intersected and distributed. The microgrooves are filled with highly thermally conductive graphene. Wedge-shaped positioning bumps are also provided at both ends of the silicon substrate. Positioning grooves are provided on the surface of the pads and the idle area. The wedge-shaped positioning bumps can be paired and inserted into the positioning grooves.

[0007] Furthermore, a heat sink is provided in the idle area, and a positioning groove is provided on the surface of the heat sink. The copper disk terminal of the silicon substrate near the idle area is connected to the heat sink.

[0008] Furthermore, the heat sink is provided with a welding groove, the surface of which is coated with a silver layer, and the copper disk terminal of the silicon substrate near the idle area is welded to the welding groove.

[0009] Furthermore, the microgrooves are uniformly distributed in a grid pattern on the surface of the silicon substrate.

[0010] Furthermore, the microtrenches are radially distributed, extending from the center of the silicon substrate to the edge.

[0011] Furthermore, the wedge-shaped positioning bump is disposed on the bottom surface of the silicon substrate, and a positioning hole is provided in the middle of the copper disk terminal and the titanium-nickel alloy buffer sheet, through which the wedge-shaped positioning bump passes.

[0012] Furthermore, the high thermal conductivity graphene includes graphene sheets and a silicone adhesive layer, with the graphene sheets disposed in the microgrooves via the silicone adhesive layer.

[0013] Compared with the prior art, the beneficial effects of this utility model are: it utilizes the idle area of ​​the circuit board itself for heat dissipation, avoiding the occupation of the limited space of the micro circuit board, and can be well adapted to the miniaturized and integrated LED lamp circuit board structure design. There is no need to set up a bulky finned heat sink. The working area is the high temperature area in the circuit board because of the heat generated by the LED beads, while the idle area has no LED beads working and the temperature is lower, which is the low temperature area in the circuit board. The silicon substrate has good thermal conductivity, and with the high thermal conductivity graphene filled in the cross-distributed micro trenches on its surface, the heat conduction efficiency can be further improved, and heat can be quickly transferred from the high temperature working area to the low temperature idle area. Attached Figure Description

[0014] Figure 1 This is a perspective view of the present utility model;

[0015] Figure 2 This is the front view of the present invention;

[0016] Figure 3 This is a structural diagram of the silicon substrate in this utility model;

[0017] Figure 4 This is a schematic diagram of the silicon substrate in this utility model being installed in a circuit board;

[0018] The numbers in the diagram are: 1-Circuit board, 2-LED lamp bead, 3-Printed circuit, 4-Solder pad, 5-Silicon substrate, 6-Copper disk terminal, 7-Titanium-nickel alloy buffer sheet, 8-Positioning groove, 9-Wedge-shaped positioning protrusion, 10-Heat sink, 11-Soldering groove. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] The following is combined with Figures 1-4 A detailed description of the heat dissipation structure of an LED light board according to this utility model is provided below:

[0021] A heat dissipation structure for an LED light board includes a circuit board 1 and LED beads 2 soldered in the circuit board 1. The surface of the circuit board 1 is provided with printed lines 3 and pads 4. The LED beads 2 are soldered in the pads 4 and are conductive through the printed lines 3. The surface of the circuit board 1 is divided into a working area and an idle area. The printed lines 3 and pads 4 are located in the working area. A silicon substrate 5 is provided between the working area and the idle area. Copper disk terminals 6 are provided at both ends of the silicon substrate 5. A titanium-nickel alloy buffer sheet 7 is provided between the copper disk terminals 6 and the connection surface of the silicon substrate 5. One end of the copper disk terminal 6 is soldered to the pad 4, and the other end of the copper disk terminal 6 is in contact with the idle area. Several microgrooves are formed on the surface of the silicon substrate 5. The microgrooves are intersected and distributed. The microgrooves are filled with highly thermally conductive graphene. Wedge-shaped positioning bumps 9 are also provided at both ends of the silicon substrate 5. Positioning grooves 8 are provided on the surface of the pads 4 and the idle area. The wedge-shaped positioning bumps 9 can be paired and inserted into the positioning grooves 8.

[0022] By utilizing the unused area of ​​the circuit board 1 itself for heat dissipation, the limited space of the micro circuit board is avoided. This allows for good adaptation to miniaturized and integrated circuit board structure designs, eliminating the need for a bulky finned heat sink. The working area is the high-temperature area of ​​the circuit board 1 due to the heat generated by the LED beads 2, while the unused area is the low-temperature area of ​​the circuit board 1 because no LED beads 2 are working. The silicon substrate 5 has good thermal conductivity, and the high thermal conductivity graphene filled in the cross-distributed micro-grooves on its surface can further improve the heat conduction efficiency, quickly transferring heat from the high-temperature working area to the low-temperature unused area. The titanium-nickel alloy buffer sheet 7 can alleviate the stress caused by the thermal expansion difference between silicon and copper.

[0023] A heat sink 10 is installed in the idle area. A copper disk terminal 6 of the silicon substrate 5 near the idle area is connected to the heat sink 10. The heat sink 10 has a welding groove 11, with a positioning groove 8 and a silver plating layer on its surface. The copper disk terminal 6 of the silicon substrate 5 near the idle area is welded to the welding groove 11. The design of the welding groove 11 provides precise positioning for the connection between the copper disk terminal 6 and the heat sink 10, ensuring accurate welding position. The silver plating layer has excellent electrical and thermal conductivity, reducing contact thermal resistance at the welding point, improving the heat transfer efficiency from the copper disk terminal 6 to the heat sink 10, and enhancing the oxidation resistance of the welding point, extending the service life of the structure. The heat sink 10 can further expand the heat dissipation area, enhance the heat diffusion capacity of the idle area, prevent heat accumulation in the idle area, and improve overall heat dissipation efficiency. Simultaneously, the positioning groove 8 of the welding groove 11 cooperates with the wedge-shaped positioning protrusion 9 of the silicon substrate 5, further strengthening the connection stability between the silicon substrate 5 and the idle area, ensuring the continuity of the heat transfer path.

[0024] The wedge-shaped positioning bump 9 is disposed on the bottom surface of the silicon substrate 5. The copper disk terminal 6 and the titanium-nickel alloy buffer sheet 7 are provided with positioning holes in the middle. The wedge-shaped positioning bump 9 passes through the positioning hole. The design of the wedge-shaped positioning bump 9 passing through the positioning hole can accurately position and fix the copper disk terminal 6 and the titanium-nickel alloy buffer sheet 7, prevent them from shifting during installation or operation, ensure that the three are tightly fitted together, reduce contact thermal resistance, and make the assembly of each component more convenient, thereby improving the stability and reliability of the overall structure.

[0025] The microgrooves can be distributed radially or uniformly in a grid pattern on the surface of the silicon substrate 5. When radially distributed, the extension direction is from the center of the silicon substrate 5 to the edge. The grid-like distribution of microgrooves enables the high thermal conductivity graphene to form a uniform and continuous thermally conductive network on the surface of the silicon substrate 5, ensuring efficient heat conduction in all areas of the silicon substrate 5, avoiding localized heat accumulation, and improving the overall thermal conductivity of the silicon substrate 5. This is particularly suitable for heat dissipation scenarios where the heat distribution of LED beads 2 is relatively uniform. The radially distributed microgrooves can quickly guide heat from the central area of ​​the silicon substrate 5 to the edge, suitable for heat dissipation scenarios where the LED beads 2 are concentrated in the corresponding position at the center of the silicon substrate 5. This can specifically improve the heat conduction speed from the high-temperature core area to the edge area, optimize the heat diffusion path, and improve local heat dissipation efficiency.

[0026] Furthermore, the high thermal conductivity graphene includes graphene sheets and a silicone adhesive layer. The graphene sheets are disposed in the microgrooves through the silicone adhesive layer. The silicone adhesive layer has good adhesion and high temperature resistance, which can firmly fix the graphene sheets in the microgrooves, ensuring close contact between the graphene sheets and the surface of the silicon substrate 5, reducing interfacial thermal resistance. The silicone adhesive layer also has a certain degree of elasticity, which can alleviate the thermal expansion and contraction stress between the microgrooves and the graphene sheets caused by temperature changes, preventing the graphene sheets from falling off or breaking, and ensuring the long-term stability of thermal conductivity.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A heat dissipation structure for an LED light board, comprising a circuit board and LED beads soldered in the circuit board, wherein the surface of the circuit board is provided with printed circuit lines and pads, and the LED beads are soldered in the pads and are conductive through the printed circuit lines, characterized in that: The surface of the circuit board is divided into a working area and an idle area. The printed circuit and pads are located in the working area. A silicon substrate is placed between the working area and the idle area. Copper disk terminals are provided at both ends of the silicon substrate. A titanium-nickel alloy buffer sheet is provided between the copper disk terminals and the connection surface of the silicon substrate. One end of the copper disk terminal is soldered to the pad, and the other end of the copper disk terminal is in contact with the idle area. Several micro-grooves are formed on the surface of the silicon substrate. The micro-grooves are distributed intersectingly. The micro-grooves are filled with highly thermally conductive graphene. Wedge-shaped positioning bumps are also provided at both ends of the silicon substrate. Positioning grooves are provided on the surface of the pads and the idle area. The wedge-shaped positioning bumps can be paired and inserted into the positioning grooves.

2. The heat dissipation structure of an LED light board according to claim 1, characterized in that: A heat sink is provided in the idle area, and a positioning groove is provided on the surface of the heat sink. The copper disk terminal of the silicon substrate near the idle area is connected to the heat sink.

3. The heat dissipation structure of an LED light board according to claim 2, characterized in that: The heat sink is provided with a welding groove, and the surface of the welding groove is provided with a silver plating layer. The copper disk terminal of the silicon substrate near the idle area is welded to the welding groove.

4. The heat dissipation structure of an LED light board according to any one of claims 1-3, characterized in that: The microgrooves are uniformly distributed in a grid pattern on the surface of the silicon substrate.

5. The heat dissipation structure of an LED light board according to any one of claims 1-3, characterized in that: The microtrenches are radially distributed, extending from the center of the silicon substrate to the edge.

6. The heat dissipation structure of an LED light board according to any one of claims 1-3, characterized in that: The wedge-shaped positioning bump is disposed on the bottom surface of the silicon substrate, and a positioning hole is provided in the middle of the copper disk terminal and the titanium-nickel alloy buffer sheet, through which the wedge-shaped positioning bump passes.

7. The heat dissipation structure of an LED light board according to any one of claims 1-3, characterized in that: The high thermal conductivity graphene includes graphene sheets and a silicone adhesive layer, with the graphene sheets disposed in microgrooves via the silicone adhesive layer.

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