Temperature sensing components for electron migration testing

Abstract

This application provides a temperature measurement assembly for electron migration testing, used to measure the temperature of a chip under test on a test socket. The assembly includes a temperature measuring element, a sleeve, and a resistance temperature detector (RTD) element disposed within the sleeve. The RTD element extends along the length of the sleeve and has two opposing terminals extending through the sleeve. The sleeve is used to be embedded in the test socket. A heat-resistant plate is disposed at one end of the temperature measuring element and has two opposing mounting ends. The two terminals are respectively disposed on the two mounting ends and protrude relative to the mounting ends. The heat-resistant plate separates the RTD element and the test socket. The electron migration testing temperature measurement assembly provided in this application utilizes a heat-resistant plate to prevent the RTD element from sticking to the test socket at high temperatures.

Description

Technical Field

[0001] This application relates to semiconductor test component technology, and more particularly to a temperature measurement component for electron migration testing. Background Technology

[0002] Electromigration testing is a critical test in semiconductor manufacturing and reliability engineering, primarily used to evaluate the resistance of metal interconnects (such as copper or aluminum wires in integrated circuits) to electromigration under prolonged high current density.

[0003] In electron migration testing, temperature sensing elements are used to detect the temperature of the test circuit and chip to prevent the probe from being damaged by excessive temperature.

[0004] Existing temperature sensing elements generally use platinum resistance thermometry, which involves placing a small piece of platinum wire wound around a ceramic pillar on top of a ceramic or metal sheath and using the platinum wire to measure the temperature. This method can only measure the temperature of a single point and is relatively large. In addition, in platinum resistance thermometry, the connection point of the platinum resistance thermometer is in direct contact with the chip test socket. Under prolonged high-temperature conditions, the resistance thermometer will stick to the test socket, affecting normal electron migration testing. Utility Model Content

[0005] This application provides a temperature measurement component for electron migration testing, which solves the technical problem in related technologies that thermal resistance elements are easily stuck to the test socket due to high temperature.

[0006] This application provides a temperature measurement component for electron migration testing, used to measure the temperature of a chip under test on a test socket. The temperature measurement component for electron migration testing includes:

[0007] A temperature measuring device includes a sleeve and a resistance temperature detector (RTD) disposed in the sleeve. The RTD extends along the length of the sleeve and has two opposite terminals extending out of the sleeve. The sleeve is used to be fitted onto the test socket.

[0008] A heat-resistant plate is disposed at one end of the temperature measuring element. The heat-resistant plate has two mounting ends that are arranged opposite to each other. The two wiring terminals are respectively disposed on the two mounting ends and protrude from the mounting ends. The heat-resistant plate is used to separate the thermal resistance element and the test base.

[0009] In some possible implementations, the heat-resistant plate is a mica plate or a ceramic plate.

[0010] In some possible implementations, the sleeve is provided with two spaced-apart mounting grooves that extend along the axial direction of the sleeve;

[0011] The two terminals of the thermal resistance element are respectively wound around a support post, which is used to pass through the mounting groove so that the thermal resistance element is fixed in the sleeve.

[0012] In some possible implementations, the resistance element is a Pt500 platinum resistance thermometer, and the support is a ceramic column.

[0013] In some possible implementations, a probe is connected to the mounting end for connecting to the chip under test, and both terminals of the thermal resistor are connected to the probe.

[0014] In some possible implementations, each of the mounting terminals is provided with two probes, and each of the terminals is used to connect to the two probes on the corresponding mounting terminal.

[0015] In some possible implementations, the two mounting ends are arranged symmetrically relative to the sleeve, and the probes located on the mounting ends are arranged symmetrically relative to the sleeve.

[0016] In some possible implementations, the probe is a metal component.

[0017] In some possible implementations, the sleeve is a ceramic tube with a diameter of 2 mm.

[0018] In some possible implementations, the heat-resistant plate is provided with through holes for the wiring terminals of the thermal resistance element to pass through.

[0019] The temperature measurement assembly for electron migration testing provided in this application utilizes a heat-resistant plate to physically separate the resistance temperature detector (RTD) element and the test socket, thereby blocking the metal heat conduction path under high-temperature conditions and preventing the RTD element from sticking to the test socket due to high temperatures. Furthermore, the terminals of the RTD element protrude through the sleeve and are fixed to the mounting end of the heat-resistant plate, protruding relative to the mounting end. The terminals of the RTD element are doubly fixed by the sleeve and the heat-resistant plate, effectively enhancing the RTD element's shock resistance and deformation resistance.

[0020] In addition, the temperature measuring element is directly embedded in the test socket, and the thermal resistance element extends along the length of the sleeve. The temperature of the chip under test can be detected by using the sleeve. Compared with the single-point temperature measurement method in the prior art, the thermal resistance element in the sleeve further expands the temperature measurement range and can detect the average temperature of the chip under test, thus making it easier to determine the temperature of the chip under test. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of a temperature measuring component for electron migration testing in one embodiment of this application;

[0023] Figure 2 for Figure 1 Schematic diagram of the connection and fit between the medium-temperature resistance element and the support column;

[0024] Figure 3 for Figure 1 A schematic diagram of the middle sleeve. Detailed Implementation

[0025] This application provides a temperature measurement component for electron migration testing, which solves the technical problem in related technologies that thermal resistance elements are easily stuck to the test socket due to high temperature.

[0026] As mentioned in the background art, the temperature sensing elements in the prior art generally adopt the platinum resistance temperature measurement method, that is, a small piece of platinum metal wire is placed on the top of the ceramic or metal sleeve and wound around the ceramic pillar. The temperature is measured by the platinum metal wire. This method can only measure the temperature of a single point and the size is relatively large. In addition, in the platinum resistance temperature measurement method, the connection position of the platinum resistance thermometer is in direct contact with the chip test socket. Under long-term high temperature environment, the resistance thermometer will stick to the test socket, affecting the normal electron migration test.

[0027] Based on the above description, one or more embodiments of this application provide a temperature measurement component for electron migration testing. A heat-resistant plate physically separates the resistance temperature detector (RTD) element and the test socket, thereby blocking the metal heat conduction path under high-temperature conditions and preventing the RTD element from sticking to the test socket due to high temperatures. Furthermore, the wiring terminals of the RTD element protrude through the sleeve and are fixed to the mounting end of the heat-resistant plate, protruding relative to the mounting end. The wiring terminals of the RTD element are doubly fixed by the sleeve and the heat-resistant plate, effectively enhancing the RTD element's shock resistance and deformation resistance.

[0028] In addition, the temperature measuring element is directly embedded in the test socket, and the thermal resistance element extends along the length of the sleeve. The temperature of the chip under test can be detected by using the sleeve. Compared with the single-point temperature measurement method in the prior art, the thermal resistance element in the sleeve further expands the temperature measurement range and can detect the average temperature of the chip under test, thus making it easier to determine the temperature of the chip under test.

[0029] The following description, in conjunction with the accompanying drawings, illustrates the solutions of the embodiments of this application.

[0030] like Figure 1 As shown in the figure, the temperature measuring component for electron migration testing in this application embodiment is used to measure the temperature of the chip under test on the test socket. The temperature measuring component for electron migration testing includes a temperature measuring element and a heat-resistant plate 300.

[0031] The temperature measuring element includes a sleeve 100 and a resistance thermometer 200 disposed in the sleeve 100. The resistance thermometer 200 extends along the length of the sleeve 100 and has two opposing terminals 210 extending out of the sleeve 100. The sleeve 100 is used to be embedded in the test socket. A heat-resistant plate 300 is disposed at one end of the temperature measuring element. The heat-resistant plate 300 has two mounting ends 310 arranged opposite to each other. The two terminals 210 are respectively disposed on the two mounting ends 310 and protrude from the mounting ends 310. The heat-resistant plate 300 is used to separate the resistance thermometer 200 and the test socket.

[0032] As can be seen from the above description, the temperature measurement component for electron migration testing in this application embodiment uses a temperature measuring element to detect the temperature of the chip under test. A heat-resistant plate 300 isolates the thermal resistance element 200 of the temperature measuring element from the test socket, thereby blocking the metal heat conduction path under high-temperature conditions and preventing the thermal resistance element 200 from being affected by high temperatures and sticking to the test socket. Furthermore, the terminal 210 of the thermal resistance element 200 protrudes through the sleeve 100 and is fixed to the mounting end 310 of the heat-resistant plate 300, protruding relative to the mounting end 310. The terminal 210 of the thermal resistance element 200 is doubly fixed by the sleeve 100 and the heat-resistant plate 300, effectively enhancing the shock resistance and deformation resistance of the thermal resistance element 200.

[0033] In addition, the temperature measuring element is directly embedded in the test socket, and the thermal resistance element 200 extends along the length of the sleeve 100. The sleeve 100 can be used to detect the temperature of the chip under test. Compared with the single-point temperature measurement method in the prior art, the thermal resistance element 200 in the sleeve 100 further expands the temperature measurement range and can detect the average temperature of the chip under test, thus making it easier to determine the temperature of the chip under test.

[0034] In some embodiments of this application, both the test socket and the chip under test used in the electron migration test can be test components from related technologies, with the chip under test generally disposed on the test socket. This application mainly improves the auxiliary temperature measurement component on the test socket. Therefore, the temperature measurement component used for electron migration testing can be applied to any test socket that can be adapted, and this application does not impose absolute limitations on the embodiments thereof.

[0035] In some embodiments of this application, the heat-resistant plate 300 is a mica plate or a ceramic plate. Using a mica plate or ceramic plate for the heat-resistant plate 300 allows it to withstand higher temperatures and has poor thermal conductivity, effectively isolating heat conduction between the test socket and the resistance temperature detector 200. Furthermore, the mica plate and ceramic plate themselves are non-conductive, preventing electronic crosstalk from affecting the testing accuracy of the chip under test.

[0036] like Figure 2 and Figure 3 As shown, in some embodiments of this application, the sleeve 100 is provided with two spaced mounting grooves 110, which extend along the axial direction of the sleeve 100.

[0037] The two terminals 210 of the thermal resistance element 200 are respectively wound around a support column 120, and the support column 120 is used to pass through the mounting groove 110 so that the thermal resistance element 200 is fixed in the sleeve 100.

[0038] The aforementioned sleeve 100 can be made of an integrally formed ceramic tube. The diameter of the sleeve 100 is 2mm. The two mounting grooves 110 in the sleeve 100 are both through-hole pipes. The two terminals 210 of the thermal resistance element 200 are respectively located in the two mounting grooves 110. The resistance of the thermal resistance element 200 itself is snapped onto the end of the sleeve 100 away from the heat-resistant plate 300.

[0039] Specifically, the support column 120 can be made of high-temperature resistant and non-conductive ceramic. The two terminals 210 of the thermal resistance element 200 are densely wound around the support column 120. The support column 120 is then fitted into the mounting groove 110 of the sleeve 100. Due to the high winding density, Figure 2 The specific number of turns and direction of winding are not specified. By winding the thermal resistor 200 on the support column 120, the temperature sensing element can collect and sense temperature changes along its own length, thus facilitating the measurement of the average temperature of the chip under test.

[0040] In the actual assembly process, the thermal resistance element 200 can be pre-wound and connected to the support column 120, and then the support column 120 with the thermal resistance element 200 wrapped around it can be inserted into the installation operation of the sleeve 100. There is no need to perform positioning operations in the sleeve 100, which facilitates modular assembly.

[0041] Here, the thermal resistance element 200 can be a Pt500 platinum resistance thermometer, and the method by which the thermal resistance element 200 collects temperature can be the same as the existing Pt500 platinum resistance thermometer temperature measurement method, which will not be described again in this embodiment.

[0042] like Figure 1As shown in some embodiments of this application, a probe 400 is connected to the mounting end 310. The probe 400 is used to connect to a temperature probe on the test circuit, and both terminals 210 of the resistance temperature detector (RTD) 200 are connected to the probe 400. Therefore, the RTD 200 is actually directly connected to the probe 400, and the probe 400 is used to connect to the chip under test (DUT), thereby reducing the thermal detection error between the RTD 200 and the DUT. Simultaneously, the connection between the terminals 210 of the RTD 200 and the probe 400 ensures good contact with the DUT while preventing the probe 400 from detaching at high temperatures, thus enhancing the stability of the probe 400 connection.

[0043] Furthermore, each of the mounting ends 310 is provided with two probes 400, and each of the wiring terminals 210 is used to connect to the two probes 400 on the corresponding mounting end 310. The two mounting ends 310 are symmetrically arranged with respect to the sleeve 100, and the probes 400 located on the mounting ends 310 are symmetrically arranged with respect to the sleeve 100.

[0044] The two probes 400 on the same mounting end 310 are connected to a terminal 210, forming a parallel connection of terminal 210. This parallel design of the two probes 400 further improves the accuracy of temperature acquisition. The symmetrical arrangement of the two probes 400 on the two mounting ends 310 helps eliminate bending stress and avoids cracking at the root of the sleeve 100 due to uneven stress distribution. Here, the probes 400 can be metal probes to facilitate the connection of the chip under test and the test circuit on the conductivity test socket.

[0045] In some embodiments of this application, the heat-resistant plate 300 is provided with through holes for the wiring terminals 210 of the thermal resistance element 200 to pass through. That is, the heat-resistant plate 300 itself is a plate with a certain thickness, and the through holes inside the heat-resistant plate 300 facilitate the passage of the wiring terminals 210 of the thermal resistance element 200, so that the wiring terminals 210 of the thermal resistance element 200 do not contact the test socket.

[0046] It should be understood that although quantifiers such as "first," "second," etc., may be used herein to describe various units, these units should not be limited by these terms. These terms are used merely to distinguish one unit from another. For example, without departing from the scope of the exemplary embodiments, a first unit may be referred to as a second unit, and similarly, a second unit may be referred to as a first unit.

[0047] The directional terms such as "outer," "middle," and "inner" mentioned or potentially used in this specification are defined relative to the structures shown in the accompanying drawings. They are relative concepts and may therefore vary depending on their location and usage. Therefore, these or other directional terms should not be interpreted as restrictive.

[0048] The above description is merely a preferred embodiment of this application and is not intended to limit this application in any form or substance. It should be noted that those skilled in the art can make various improvements and additions without departing from the method of this application, and these improvements and additions should also be considered within the protection scope of this utility model. Any modifications, alterations, and equivalent changes made by those skilled in the art without departing from the spirit and scope of this application, based on the disclosed technical content, are equivalent embodiments of this application. Furthermore, any modifications, alterations, and evolutions made to the above embodiments based on the essential technology of this application still fall within the scope of the technical solution of this application.

Claims

1. A temperature measurement assembly for electromigration testing, for measuring the temperature of a chip under test on a test socket, characterized in that, The temperature measurement component for electron migration testing includes: A temperature measuring device includes a sleeve and a resistance temperature detector (RTD) disposed in the sleeve. The RTD extends along the length of the sleeve and has two opposite terminals extending out of the sleeve. The sleeve is used to be fitted onto the test socket. A heat-resistant plate is disposed at one end of the temperature measuring element. The heat-resistant plate has two mounting ends that are arranged opposite to each other. The two wiring terminals are respectively disposed on the two mounting ends and protrude from the mounting ends. The heat-resistant plate is used to separate the thermal resistance element and the test base.

2. The temperature measurement component for electron migration testing according to claim 1, characterized in that, The heat-resistant plate is a mica plate or a ceramic plate.

3. The temperature measurement component for electron migration testing according to claim 1, characterized in that, The sleeve has two spaced mounting grooves that extend along the axial direction of the sleeve. The two terminals of the thermal resistance element are respectively wound around a support post, which is used to pass through the mounting groove so that the thermal resistance element is fixed in the sleeve.

4. The temperature measurement component for electron migration testing according to claim 3, characterized in that, The thermal resistance element is a Pt500 platinum resistance thermometer, and the support column is a ceramic column.

5. The temperature measurement component for electron migration testing according to claim 1, characterized in that, A probe is connected to the mounting end, and the probe is used to connect to the chip under test. Both terminals of the thermal resistor are connected to the probe.

6. The temperature measurement component for electron migration testing according to claim 5, characterized in that, Each of the mounting terminals is provided with two probes, and each of the wiring terminals is used to connect to the two probes on the corresponding mounting terminal.

7. The temperature measurement component for electron migration testing according to claim 6, characterized in that, The two mounting ends are arranged symmetrically relative to the sleeve, and the probes located on the mounting ends are arranged symmetrically relative to the sleeve.

8. The temperature measurement component for electron migration testing according to claim 5, characterized in that, The probe is a metal component.

9. The temperature measurement component for electron migration testing according to claim 1, characterized in that, The sleeve is a ceramic tube with a diameter of 2 mm.

10. The temperature measurement component for electron migration testing according to claim 1, characterized in that, The heat-resistant plate is provided with through holes for the wiring terminals of the thermal resistance element to pass through.

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