Packaging structure of annular integrated passive device

By using a ring-shaped integrated passive device packaging structure, the heat dissipation and integration problems of RF devices are solved, achieving effective heat dissipation and passive device integration, thereby improving the performance and integration level of RF devices.

CN224356636UActive Publication Date: 2026-06-12GUANGXI XINBAITE MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202520818190.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-27
Publication Date
2026-06-12
Estimated Expiration
2035-04-27

AI Technical Summary

Technical Problem

The heat dissipation problem of radio frequency devices is difficult to solve in the existing technology, especially under high integration and high power consumption, which leads to the degradation or damage of device performance. At the same time, it is impossible to integrate passive devices and adjustable circuits at the same time.

Method used

The packaging structure of the ring-integrated passive device includes a substrate, a frame base island, a middle base island chip, a ring PCB, passive devices, and external output pins. The interconnection between devices is achieved through wire bonding and lead connection, which enhances heat dissipation and integrates passive devices.

Benefits of technology

Effective heat dissipation of RF devices was achieved, and passive components and adjustable circuits were integrated simultaneously, ensuring the power output and device integration of RF devices.

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Abstract

The utility model belongs to the technical field of chip packaging, and particularly discloses a packaging structure of an annular integrated passive device, which comprises a substrate, a frame base island, a middle base island chip, an annular PCB (printed circuit board), a passive device and external output pins, the frame base island and the annular PCB are arranged on the outer surface of the substrate, the external output pins are arranged on the periphery of the outermost edge of the substrate, and the passive device is arranged on the middle base island chip. The middle base island chip is mounted on the frame base island, the passive devices are mounted on the annular PCB, the middle base island chip is connected with the external output pins through routing, the middle base island chip is connected with the annular PCB through leads, and the passive devices comprise a synchronous passive device and a chip-level passive device. And the synchronous passive device and the chip-level passive device are mounted on the annular PCB. Heat dissipation of a product can be guaranteed by increasing contact between the radio frequency device and the base island, a passive device chip and a passive device are synchronously integrated, and power output of the radio frequency device and integration of more devices are guaranteed.
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