An interlayer connection structure for a multilayer wiring board

Abstract

The utility model discloses a kind of interlayer interconnection structures for multilayer circuit board in the technical field of circuit board processing, multilayer circuit board includes multiple layer plates, multiple layer plates are integrally formed by once compression, and multiple different depth blind holes are provided on multilayer circuit board, each blind hole extends to set depth from surface layer or bottom layer of multilayer circuit board, the surface of blind hole is provided with conductive layer, and the inside of blind hole is also filled with plug hole medium for making up the current deficiency problem of conductive layer. The utility model solves the defects that interlayer interconnection structure in existing multilayer circuit board is difficult to process, yield is low, cost is difficult to control, etc., greatly reduces the process flow steps of processing, saves processing time, reduces processing cost, improves yield, and the utility model can also make up the problem of insufficient conductive current caused by insufficient copper of mechanical blind hole.

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