An eddy current sensor based on hot riveting and welding structure

Abstract

The utility model discloses a kind of electric eddy current sensors based on hot riveting and welding structure, including shell, PCBA board and wiring harness, the shell is provided with the accommodating area compatible with PCBA board;The PCBA board is provided with at least one first riveting portion and several wiring harness welding areas;At least one second riveting portion is provided on the shell corresponding to the first riveting portion on the PCBA board;The PCBA board is placed in the accommodating area on shell, the first riveting portion on the PCBA board and the second riveting portion on the shell form corresponding distribution, and corresponding first riveting portion and second riveting portion are fixedly connected by hot riveting between;The wiring harness is correspondingly distributed and set in the wiring harness welding area on PCBA board, and fixedly connected by welding.This utility model can effectively solve the low assembly efficiency of PCBA board and shell and high product failure rate, improve the production yield of electric eddy current sensor.

Description

Technical Field

[0001] This utility model relates to sensors, specifically to eddy current sensors. Background Technology

[0002] When fixing the existing eddy current sensor PCBA board, wiring harness and housing, they are generally fixed by bayonet or screw.

[0003] Both of these fixing methods have many problems in practical applications:

[0004] (1) The PCBA board is fixed to the shell by screws, which has low production efficiency and the resulting fixed structure does not meet the working environment of the eddy current sensor.

[0005] (2) The PCBA is fixed to the shell by a snap-fit ​​method, which results in a complex fixing structure and is prone to cracking and breakage during the production process.

[0006] Therefore, it is evident that providing a simple, stable, reliable fixing structure that meets the working environment requirements of eddy current sensors for the PCBA board, wiring harness, and housing in eddy current sensors is a problem that urgently needs to be solved in this field. Utility Model Content

[0007] The present invention aims to provide an eddy current sensor with a hot riveting and welding structure, which forms a stable and reliable fixed connection structure between the PCBA board, the wire harness and the housing through hot riveting and welding, thereby overcoming the problems existing in the prior art.

[0008] To achieve the above objectives, the present invention provides an eddy current sensor based on a hot riveting and welding structure, comprising a housing, a PCBA board, and a wiring harness, wherein the housing is provided with a mounting area adapted to the PCBA board.

[0009] The PCBA board is provided with at least one first riveting part and a plurality of wire harness soldering areas; the outer casing is provided with at least one second riveting part corresponding to the first riveting part on the PCBA board; the PCBA board is placed in a placement area on the outer casing, the first riveting part on the PCBA board and the second riveting part on the outer casing are correspondingly distributed, and the corresponding first riveting part and second riveting part are fixedly connected by hot riveting; the wire harnesses are correspondingly distributed in the wire harness soldering areas on the PCBA board and are fixedly connected by soldering.

[0010] Furthermore, the first riveting portion on the PCBA board is located at the edge of the PCBA board and / or in the central region of the PCBA board.

[0011] Furthermore, the second riveting part on the outer shell is a hot-melt post, and the first riveting part on the PCBA board is a riveting hole adapted to the hot-melt post. The hot-melt post can be inserted into the riveting hole to form a hot-riveting structure through hot riveting.

[0012] Furthermore, the wiring harness is positioned horizontally or vertically relative to the PCBA board.

[0013] Furthermore, the PCBA board is coated with an adhesive layer.

[0014] The eddy current sensor provided by this utility model achieves rapid and stable fixed installation between the PCBA board and the housing based on a hot riveting structure. At the same time, it achieves a stable connection between the PCBA board and the wire harness through welding. This can effectively solve the problems of low assembly efficiency and high product defect rate of PCBA board and housing, and improve the yield rate of eddy current sensor production. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0016] Figure 1 This is an example diagram of the main structure of the eddy current sensor in this utility model;

[0017] Figure 2 This is an exploded view of the eddy current sensor in this utility model;

[0018] Figure 3 for Figure 1 Sectional view in the BB direction;

[0019] Figure 4 for Figure 1 Enlarged view of point A in the middle. Detailed Implementation

[0020] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the following description, in conjunction with specific illustrations, further elaborates on this utility model.

[0021] See Figure 1 and 2 The diagram shown is an example of the overall structure of the eddy current sensor 100 provided by this utility model.

[0022] Based on the illustration, the eddy current sensor 100 is mainly composed of a housing 110, a PCBA board 120, a wiring harness 130, and other related components of the eddy current sensor.

[0023] Other related components of the eddy current sensor here mainly include rotor 140, insert 150, connector 160, etc.

[0024] The composition of components such as rotor 140, insert 150, and connector 160 is not limited here and can be determined according to actual needs.

[0025] The outer housing 110 here forms the frame structure of the eddy current sensor, which is used to support components such as the PCBA board 120, rotor 140, and insert 150.

[0026] The arrangement of components such as rotor 140 and insert 150 in the housing 110 can be determined according to actual needs, and is not limited here.

[0027] For PCBA board 120, the housing 110 has a placement area 111 for placing PCBA board 120, and the placement area 111 is adapted to PCBA board 120.

[0028] The specific structural form of the outer casing 110 is not limited here and can be determined according to actual needs.

[0029] This PCBA board 120 constitutes the functional main body of the eddy current sensor, and can be placed in the housing 110 in the placement area 111 to form the main structure of the eddy current sensor.

[0030] The PCBA board 120 is provided with at least one first riveting part 121 and a plurality of wire harness soldering areas 122 for fixed connection with the housing 110 and the wire harness 130.

[0031] In conjunction with this, at least one second riveting portion 112 is provided on the outer casing 110 corresponding to the first riveting portion 121 on the PCBA board 120.

[0032] Furthermore, during assembly, the PCBA board 120 is integrally placed in the placement area 111 on the outer casing 110. The placement area 111, based on its own shape, limits the PCBA board 120, ensuring that the PCBA board 120 is securely placed within the placement area 111. At that time, the first riveting portion 121 on the PCBA board 120 and the corresponding second riveting portion on the outer casing are correspondingly distributed.

[0033] Based on this, a fixed connection is formed between the corresponding first riveting part and the second riveting part by hot riveting.

[0034] As further clarification, this solution does not limit the number or distribution area of ​​the first riveting part 121 on the PCBA board, and can be determined according to actual needs.

[0035] Taking the illustration as an example, this example solution provides seven first riveting parts 121 on the PCBA board, with three correspondingly distributed in the central area of ​​the PCBA board and the remaining four correspondingly distributed at the edges of the PCBA board. Furthermore, these seven first riveting parts 121 are preferably symmetrically distributed along the central axis of the PCBA board. This improves the stability of the fixed connection between the PCBA board and the outer casing 110.

[0036] As a further example, such as Figure 3 As shown, in this solution, a hot melt pillar 112 is formed on the outer casing 110 in the area corresponding to the first riveting part 121 on the PCBA board 120, thereby forming the corresponding second riveting part.

[0037] Correspondingly, the first riveting part 121 on the PCBA board has a corresponding riveting hole structure. The riveting hole is adapted to the hot melt post 112 on the outer casing 110, allowing the hot melt post 112 to be inserted therein and protrude from the top.

[0038] Based on this, after the PCBA board 120 is placed in the placement area 111 on the housing 110, the hot melt post 112 on the housing 110, which serves as the second riveting part, will be correspondingly inserted into the riveting hole on the PCBA board, which serves as the first riveting part 121, and the top of the hot melt post 112 will protrude from the corresponding riveting hole on the PCBA board.

[0039] Furthermore, the top of the hot melt column 112 extending from the riveting hole on the PCBA board is hot-riveted using a hot riveting device (e.g., heated, pressurized), causing the top of the hot melt column 112 to deform into an upsetting head structure 113 that can mate with the corresponding riveting hole on the PCBA board. The hot melt column 112 forms a relatively fixed riveting structure by mating with the corresponding riveting hole on the PCBA board through its upsetting head structure, thereby achieving a fixed connection between the PCBA board 120 and the outer casing 110.

[0040] As a further explanation, the hot-melt column 112 in this solution forms a hot-melt state during the hot riveting operation, and is further deformed under pressure to form a disc-shaped upsetting head structure 113, which can cover the corresponding riveting hole on the PCBA board. During the forming process, it forms an adhesive structure with the surrounding area of ​​the riveting hole on the PCBA board 120 based on the hot-melt state, thereby further improving the stability of the final hot riveting structure.

[0041] The structural form of the hot-melt column 112 on the outer shell 110 is not limited here, and can be determined according to actual needs. For example, it can be columnar or fan-shaped, etc.

[0042] Similarly, the form of the riveting holes formed on the PCBA board 120 is not limited, and can be adapted to the hot-melt pillars 112 on the housing 110. For example, they can be round holes or fan-shaped holes, etc.

[0043] As a priority, a clearance fit is adopted between the hot-melt pillar on the outer casing 110 and the corresponding riveting hole on the PCBA board 120 to improve the reliability of the hot riveting structure.

[0044] Based on the above solution, in this solution, the wire harness 130 is correspondingly distributed in the wire harness soldering area 122 on the PCBA board 120, and a fixed connection is formed by soldering.

[0045] As a further example, such as Figure 4 As shown, the wire harness soldering area 122 on the PCBA board 120 in this solution can be specifically composed of several solder pads 122a.

[0046] The number of pads 122a corresponds to the number of wire harnesses 130 that need to be soldered.

[0047] When the pads 122a are distributed on the PCBA board 120, they are preferably arranged at equal intervals. However, the distribution method is not limited to this, and any other feasible distribution method can be used as needed.

[0048] Furthermore, the location of the pads 122a on the PCBA board 120 can be determined according to actual needs. Generally, they are placed on the side of the PCBA board 120, which facilitates soldering with wire harnesses and avoids affecting other components.

[0049] As a further explanation, the wire harness 130 soldered on the PCBA board has a sleeve 131 on its main body for protection, and the other end of the wire harness 130 is connected to the connector 160.

[0050] Furthermore, the wiring harness 130 is positioned horizontally or vertically relative to the PCBA board, which facilitates subsequent deployment and improves practicality.

[0051] As a further explanation, based on the eddy current sensor 100 formed by the above solution, this solution pots the PCBA board 120 in the placement area 111 that is hot-riveted to the housing 110 with potting glue, forming a sealant layer 170 on the surface of the PCBA board 120. The sealant layer 170 fills the entire placement area 111 and covers the entire PCBA board 120 (including the welded wire harness 130), thus protecting the entire PCBA board 120 and the welded structure between the PCBA board 120 and the wire harness 130, and improving the reliability of the entire eddy current sensor.

[0052] The resulting eddy current sensor utilizes a hot-riveting structure to achieve rapid and stable installation between the PCBA board and the housing. Simultaneously, welding is used to achieve a stable connection between the PCBA board and the wiring harness. Furthermore, an adhesive layer is applied to protect the PCBA board and the connection structure between the PCBA board and the wiring harness. This effectively solves the problems of low assembly efficiency and high product defect rate of the PCBA board and housing, thereby improving the yield rate of eddy current sensor production.

[0053] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An eddy current sensor based on a hot riveting and welding structure, comprising a housing, a PCBA board, and a wiring harness, wherein the housing has a mounting area adapted to the PCBA board; characterized in that, The PCBA board is provided with at least one first riveting part and a plurality of wire harness soldering areas; the outer casing is provided with at least one second riveting part corresponding to the first riveting part on the PCBA board; the PCBA board is placed in a placement area on the outer casing, the first riveting part on the PCBA board and the second riveting part on the outer casing are correspondingly distributed, and the corresponding first riveting part and second riveting part are fixedly connected by hot riveting; the wire harnesses are correspondingly distributed in the wire harness soldering areas on the PCBA board and are fixedly connected by soldering.

2. The eddy current sensor based on a hot riveting and welding structure according to claim 1, characterized in that, The first riveting portion on the PCBA board is located at the edge of the PCBA board and / or in the middle area of ​​the PCBA board.

3. The eddy current sensor based on a hot riveting and welding structure according to claim 1, characterized in that, The second riveting part on the outer shell is a hot-melt post, and the first riveting part on the PCBA board is a riveting hole adapted to the hot-melt post. The hot-melt post can be inserted into the riveting hole to form a hot-riveting structure through hot riveting.

4. The eddy current sensor based on a hot riveting and welding structure according to claim 1, characterized in that, The wiring harness is positioned horizontally or vertically relative to the PCBA board.

5. The eddy current sensor based on a hot riveting and welding structure according to claim 1, characterized in that, The PCBA board is coated with an adhesive layer.

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