A heat conducting sheet surrounding a heat conducting groove

Abstract

The utility model relates to the technical field of radiating fin, disclose a kind of heat-conducting fin of encircling heat-conducting groove, including heat-conducting fin body, multiple heat-conducting grooves are set in the inside of heat-conducting fin body, multiple the heat-conducting groove is by small to big and is evenly arranged in the inside of heat-conducting fin body in straight line array, multiple the heat-conducting fin body top is fixedly connected with radiating fin, multiple the radiating fin is evenly arranged in the top of heat-conducting fin body in straight line array, multiple the heat-conducting groove and radiating fin are interlaced, the heat-conducting fin body top is provided with electromagnetic shield layer, and the heat-conducting fin body bottom is provided with adsorption layer, in the utility model, heat-conducting groove inside heat-conducting fin body guides heat diffusion, cooperates radiating fin and increases heat exchange surface area, while electromagnetic shield layer auxiliary radiating and shielding electromagnetic interference, bottom adsorption layer enhances and the paste of heat source, outer wall positioning block and anti -slip grain ensure installation stability, realize the effect of efficient heat dissipation, effectively shield electromagnetic interference and installation stable.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, and in particular to a heat-conducting plate surrounding a heat-conducting groove. Background Technology

[0002] With the trend towards miniaturization and high performance in electronic devices, the integration and power density of core components such as chips and power modules continue to rise, making heat dissipation a key factor restricting device performance and stability. Traditional heat dissipation sheets mostly use a single material or a simple layered structure, relying solely on thermally conductive silicone or metal sheets for heat conduction. This is insufficient to meet the demands of high-heat-generating scenarios such as 5G base stations and data center servers. Furthermore, as the operating frequency of electronic devices continues to increase, electromagnetic interference is having a more significant impact on signal transmission. Traditional thermal conductive materials lack electromagnetic shielding capabilities, failing to simultaneously meet the dual requirements of heat dissipation and signal protection. Therefore, there is an urgent need to develop new types of heat dissipation sheets with efficient thermal conductivity, electromagnetic shielding, and stable installation characteristics.

[0003] Existing heat-conducting sheets are mainly metal-based heat-conducting sheets, which transfer heat through the high thermal conductivity of metals such as aluminum and copper. In terms of installation and fixing, traditional heat-conducting sheets are mostly glued or screwed. Glue bonding has the problem of being difficult to remove after installation and leaving glue residue that affects secondary use. Screw fixing requires additional holes to be drilled in the equipment, which increases the assembly complexity and the risk of structural damage.

[0004] However, existing heat-conducting sheets generally suffer from a single heat conduction path, insufficient heat dissipation efficiency, and lack of electromagnetic shielding. This leads to performance degradation of devices due to overheating and electromagnetic interference. Traditional planar heat-conducting sheets only contact the heat source on one side and lack a directional heat-conducting structure, resulting in slow heat diffusion and severely affecting chip lifespan and operational stability. Furthermore, ordinary thermal conductive materials do not have electromagnetic shielding capabilities. When electronic devices operate at high frequencies, external electromagnetic interference can easily cause signal distortion and increased bit error rate. Therefore, a heat-conducting sheet with a surrounding heat-conducting groove is proposed to solve the above problems. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a heat-conducting sheet surrounding a heat-conducting groove, which aims to improve the problems of the existing technology, such as a single heat conduction path, insufficient heat dissipation efficiency, slow heat diffusion, serious impact on chip life, and lack of electromagnetic shielding function.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A heat-conducting sheet surrounding heat-conducting grooves includes a heat-conducting sheet body. Multiple heat-conducting grooves are formed inside the heat-conducting sheet body, arranged in a linear array from small to large. Multiple heat-dissipating fins are fixedly connected to the top of the heat-conducting sheet body, also arranged in a linear array. The heat-conducting grooves and heat-dissipating fins are interleaved. An electromagnetic shielding layer is provided on the top of the heat-conducting sheet body, an adsorption layer is provided on the bottom of the heat-conducting sheet body, and a connecting component is provided on the outer wall of the heat-conducting sheet body.

[0008] As a further description of the above technical solution:

[0009] The connecting component includes two positioning blocks, namely positioning block one and positioning block two, which are symmetrically arranged vertically on the left and right sides of the heat-conducting sheet.

[0010] As a further description of the above technical solution:

[0011] Each of the two positioning blocks and the two positioning blocks has a positioning hole.

[0012] As a further description of the above technical solution:

[0013] The bottom of both positioning blocks 1 and 2 are provided with anti-slip texture, and the heat-conducting sheet body has multiple positioning holes 2 inside.

[0014] As a further description of the above technical solution:

[0015] Multiple anti-slip patterns are arranged in a linear array at the bottom of positioning block one and positioning block two, respectively.

[0016] As a further description of the above technical solution:

[0017] The electromagnetic shielding layer is made of graphene-silver composite coating with a thickness of 0.1-0.5 mm.

[0018] This utility model has the following beneficial effects:

[0019] In this invention, heat is guided to diffuse through the internal heat-conducting grooves of the heat-conducting sheet, and the heat exchange surface area is increased in conjunction with the heat dissipation fins. At the same time, the electromagnetic shielding layer assists in heat dissipation and shields against electromagnetic interference, the bottom adsorption layer enhances the adhesion to the heat source, and the positioning blocks and anti-slip textures on the outer wall ensure stable installation. These structures work together to achieve efficient heat dissipation, effective shielding against electromagnetic interference, and stable installation. This solves the problems of single heat conduction path, insufficient heat dissipation efficiency, slow heat diffusion, serious impact on chip life, and lack of electromagnetic shielding function, thereby improving the practicality of the heat-conducting sheet. Attached Figure Description

[0020] Figure 1 This is a three-dimensional schematic diagram of a heat-conducting sheet surrounding a heat-conducting groove according to the present invention.

[0021] Figure 2 This is a schematic diagram of the outer wall structure of a heat-conducting sheet surrounding a heat-conducting groove, as proposed in this utility model.

[0022] Figure 3 This is a cross-sectional schematic diagram of a heat-conducting sheet surrounding a heat-conducting groove according to the present invention.

[0023] Figure 4 This is a schematic diagram of the bottom structure of a heat-conducting sheet body that surrounds a heat-conducting groove, as proposed in this utility model.

[0024] Legend:

[0025] 1. Heat-conducting plate; 2. Heat-conducting groove; 3. Heat dissipation fins; 4. Electromagnetic shielding layer; 5. Adsorption layer; 6. Positioning block one; 7. Positioning block two; 8. Positioning hole one; 9. Anti-slip texture; 10. Positioning hole two. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Reference Figures 1-4This utility model provides an embodiment of a heat-conducting sheet surrounding heat-conducting grooves, comprising a heat-conducting sheet body 1. Multiple heat-conducting grooves 2 are formed inside the heat-conducting sheet body 1, arranged in a linear array from small to large, to maximize heat conduction and allow heat to be effectively conducted from the center of the heat-conducting sheet body 1 outwards. Multiple heat dissipation fins 3 are fixedly connected to the top of the heat-conducting sheet body 1, arranged in a linear array to enhance heat dissipation and reduce the operating temperature of the device. The heat-conducting grooves 2 and heat dissipation fins 3 are interleaved. An electromagnetic shielding layer 4 is provided on the top of the heat-conducting sheet body 1 to effectively shield external electromagnetic interference, reducing the electromagnetic radiation affecting the electronic device during operation, thereby improving the stability and reliability of the device. An adsorption layer 5 is provided at the bottom of the heat-conducting sheet body 1 to improve the adhesion between the heat-conducting sheet and other components. The surface contact area is increased to enhance heat exchange efficiency. A connecting component is provided on the outer wall of the heat-conducting plate body 1. The connecting component includes two positioning blocks 6 and 7. The two positioning blocks 6 and 7 are symmetrically arranged on the left and right sides of the heat-conducting plate body 1. Positioning holes 8 are opened inside the two positioning blocks 6 and 7 for precise docking with other parts of the equipment during installation, thereby ensuring a stable connection of the heat-conducting plate. Anti-slip textures 9 are provided on the bottom of the two positioning blocks 6 and 7. Multiple positioning holes 10 are opened inside the heat-conducting plate body 1. Multiple anti-slip textures 9 are arranged in a linear array on the bottom of the positioning blocks 6 and 7, which can effectively prevent the heat-conducting plate from shifting due to vibration or external force during installation. The electromagnetic shielding layer 4 is made of graphene-silver composite coating with a coating thickness of 0.1-0.5mm.

[0028] Working Principle: When using this heat-conducting sheet, the heat-conducting sheet body 1 serves as the core carrier. The heat-conducting grooves 2 arranged in a linear array from small to large inside guide the orderly diffusion of heat and increase the contact area with air. Combined with the heat dissipation fins 3 arranged in an alternating pattern on the top, the heat exchange surface area is increased, accelerating the dissipation of heat to the outside. The electromagnetic shielding layer 4 on the top uses the high thermal conductivity of graphene to assist in heat dissipation, while the conductivity of silver is used to build a shielding barrier to reduce the impact of external electromagnetic interference on the heat-conducting sheet and related electronic components, ensuring stable signal transmission. The bottom adsorption layer 5 allows the heat-conducting sheet to adhere to the surface of the heat source, enhancing the heat conduction efficiency. For connection requirements, the positioning blocks 6 and 7 on the outer wall of the heat-conducting sheet body 1 are symmetrically distributed vertically. The positioning holes 8 inside and the positioning holes 10 on the heat-conducting sheet body 1 can be fixed to other devices through bolts or other connectors. The anti-slip texture 9 on the bottom of the positioning blocks increases friction and prevents slippage during installation, ensuring the heat-conducting sheet is stably positioned in the device and ensuring the continuous effectiveness of heat conduction and shielding functions.

[0029] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat-conducting sheet surrounding a heat-conducting groove, comprising a heat-conducting sheet body (1), characterized in that: The heat-conducting plate (1) has multiple heat-conducting grooves (2) inside. The multiple heat-conducting grooves (2) are arranged in a linear array from small to large and are uniformly arranged inside the heat-conducting plate (1). Multiple heat-dissipating fins (3) are fixedly connected to the top of the heat-conducting plate (1). The multiple heat-dissipating fins (3) are arranged in a linear array and are uniformly arranged on the top of the heat-conducting plate (1). The multiple heat-conducting grooves (2) and heat-dissipating fins (3) are interleaved. An electromagnetic shielding layer (4) is provided on the top of the heat-conducting plate (1). An adsorption layer (5) is provided on the bottom of the heat-conducting plate (1). A connecting component is provided on the outer wall of the heat-conducting plate (1).

2. The heat-conducting sheet surrounding the heat-conducting groove according to claim 1, characterized in that: The connecting component includes two positioning blocks (6) and two positioning blocks (7), which are symmetrically arranged on the left and right sides of the heat-conducting sheet (1).

3. The heat-conducting sheet surrounding the heat-conducting groove according to claim 2, characterized in that: The two positioning blocks (6) and the two positioning blocks (7) are each provided with a positioning hole (8).

4. A heat-conducting sheet surrounding a heat-conducting groove according to claim 3, characterized in that: The bottom of the two positioning blocks (6) and the two positioning blocks (7) are provided with anti-slip texture (9), and the heat-conducting sheet (1) has multiple positioning holes (10) inside.

5. A heat-conducting sheet surrounding a heat-conducting groove according to claim 4, characterized in that: Multiple anti-slip patterns (9) are arranged in a linear array at the bottom of positioning block one (6) and positioning block two (7).

6. A heat-conducting sheet surrounding a heat-conducting groove according to claim 1, characterized in that: The electromagnetic shielding layer (4) is made of graphene-silver composite coating with a coating thickness of 0.1-0.5 mm.

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