A vulcanization molding mold for liquid heat conductive adhesive

Abstract

The application provides a vulcanization forming mold for liquid heat-conducting glue, which is applied to preparation of a heat-conducting gasket for testing in a laboratory environment, and comprises an upper cover, a bottom plate, connecting pieces, elastic pieces and fixing assemblies; wherein the connecting pieces, the elastic pieces and the fixing assemblies are one-to-one corresponding and the number of each is not less than four groups; the connecting pieces penetrate the edge regions of the bottom plate and the upper cover in sequence, and the upper cover moves along the connecting pieces; the elastic pieces are arranged at the sections of the connecting pieces between the bottom plate and the upper cover, and the fixing assemblies are arranged at the sections of the connecting pieces penetrating out of the upper cover. The accurate regulation of the distance between the upper cover and the bottom plate is realized through the cooperative matching of the connecting pieces, the elastic reset pieces and the gasket assemblies, so that the thickness of the fixed liquid heat-conducting glue is adjusted to obtain a heat-conducting gasket with a required uniform thickness, and the effect of preparing a sample piece meeting the testing requirements under the condition of a small sample amount is achieved.

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