Water cooling plate for server
By integrating the water cooling plate and heat absorption components into an integrated flow channel structure, the problems of leakage risk and poor heat dissipation of server water cooling plates are solved, achieving an efficient and low-cost heat dissipation solution.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ASINK GREEN MATIERIAL CORP
- Filing Date
- 2025-06-05
- Publication Date
- 2026-06-26
AI Technical Summary
The water-cooled plates used in existing servers have problems such as leakage risk, complex structure, high maintenance cost and poor heat dissipation.
The integrated water circuit board design, with its integrated flow channel structure and heat absorption components, transfers the low-temperature coolant to the corresponding heat absorption components in the heat exchange chamber through the flow channel structure on the integrated water circuit board, achieving efficient heat dissipation for each heat source and reducing the risk of leakage.
It improves heat dissipation efficiency, reduces the risk of leakage and structural complexity, lowers maintenance costs, and meets user needs.
Smart Images
Figure CN224417256U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of liquid-cooled server technology, and in particular to a water-cooled plate for servers. Background Technology
[0002] With the development of high-performance computing (HPC), artificial intelligence (AI) and cloud computing, server power density continues to rise. Traditional air cooling can no longer meet the heat dissipation requirements of these servers, and liquid cooling technology has become the mainstream solution due to its efficient heat dissipation capabilities.
[0003] When servers employ liquid cooling, heat dissipation is typically achieved through a water-cooled plate. However, existing server water-cooled plates are usually of a split design, relying on multiple pipes and connectors, which increases the potential for leaks, posing safety hazards and resulting in high maintenance costs. Furthermore, when a server has multiple heat sources requiring cooling, the coolant flows sequentially from inlet to outlet through each heat source. By the time the coolant reaches the last heat source, it has already absorbed heat from the preceding sources, causing its temperature to rise and resulting in inadequate cooling for that final heat source. To ensure effective cooling for the last heat source, heat pipes are typically added to the water-cooled plate for auxiliary heat dissipation, and additional fan arrays are also required. However, this increases structural complexity, noise, and the risk of leaks. Therefore, the water-cooled plates used in existing servers suffer from poor cooling performance, leakage risks, and structural complexity.
[0004] In the process of developing this utility model, the applicant discovered at least the following problems in the prior art:
[0005] The water-cooled plates used in existing servers cannot adequately meet users' needs. Utility Model Content
[0006] The purpose of this invention is to provide a water-cooled plate for servers, thereby solving the technical problem that existing water-cooled plates used in servers cannot adequately meet user needs. The various technical effects of the preferred solutions among the many technical solutions provided by this invention are detailed below.
[0007] To achieve the above objectives, the present invention provides the following technical solution:
[0008] A water-cooling plate for a server provided by the utility model comprises an integrated water channel plate and a heat absorption component. The heat absorption component is fixedly connected to the bottom of the integrated water channel plate, and the heat absorption component corresponds to and is in contact with a plurality of heat sources; a flow channel structure and a heat exchange cavity for accommodating a coolant are arranged on the integrated water channel plate. The heat exchange cavity corresponds to the heat absorption component, and the heat exchange cavity is arranged above the corresponding heat absorption component. The heat exchange cavity is connected to a water inlet and a water outlet through the flow channel structure.
[0009] Optionally, the heat exchange cavity comprises a first cavity, a second cavity and a third cavity. The first cavity, the second cavity and the third cavity are arranged in a "pin" shape on the integrated water channel plate, and the second cavity is communicated with the third cavity.
[0010] Optionally, the flow channel structure comprises an inlet flow channel and an outlet flow channel. One end of the inlet flow channel is fixedly connected to the water inlet, and the inlet flow channel sequentially communicates with the first cavity, the second cavity and the third cavity. The coolant output from the water inlet flows into the first cavity, the second cavity and the third cavity through the inlet flow channel; the outlet flow channel communicates the first cavity and the third cavity, and the outlet flow channel is fixedly connected to the water outlet.
[0011] Optionally, the inlet flow channel comprises a first flow channel, a second flow channel and a third flow channel. The first end of the second flow channel is communicated with the first end of the first flow channel and the water inlet, and the second end of the first flow channel extends to the top of the first cavity; the second end of the second flow channel is communicated with the first end of the third flow channel, and the second end of the second flow channel and the first end of the third flow channel are arranged on the top of the second cavity. The second end of the third flow channel extends to the top of the third cavity.
[0012] Optionally, through holes are arranged on the tops of the first cavity, the second cavity and the third cavity. The coolant in the first flow channel enters the first cavity through the through hole on the first cavity, a part of the coolant in the second flow channel enters the second cavity through the through hole on the second cavity, another part of the coolant in the second flow channel flows into the third flow channel, and the coolant in the third flow channel enters the third cavity through the through hole on the third cavity.
[0013] Optionally, the three through holes are respectively arranged at the central positions on the tops of the first cavity, the second cavity and the third cavity.
[0014] Optionally, the heat absorption assembly includes a first heat absorption part, a second heat absorption part, and a third heat absorption part, wherein the first heat absorption part is disposed at the bottom of the first cavity, the second heat absorption part is disposed at the bottom of the second cavity, and the third heat absorption part is disposed at the bottom of the third cavity.
[0015] Optionally, the heat-absorbing assembly further includes a fourth heat-absorbing part, which is disposed between the second heat-absorbing part and the third heat-absorbing part.
[0016] Optionally, the first heat-absorbing part, the second heat-absorbing part, and the third heat-absorbing part each include a substrate and heat dissipation fins, the heat dissipation fins are fixed on the substrate, and the heat dissipation fins are disposed in the heat exchange cavity.
[0017] Optionally, the integrated water circuit board is provided with multiple connection holes, and the integrated water circuit board is fixedly connected to the PCBA board in the server through the connection holes; the integrated water circuit board is made of metal.
[0018] Implementing one of the above-described technical solutions of this utility model has the following advantages or beneficial effects:
[0019] This utility model's water-cooled plate employs an integrated water circuit board. Through its integrated flow channel structure, it reduces the risk of leakage. The flow channel structure on the integrated water circuit board transfers the low-temperature coolant, or a portion thereof, to the corresponding heat-absorbing components within the heat exchange chamber. This effectively dissipates heat from each heat source adjacent to the heat-absorbing components, resulting in high heat dissipation efficiency. Furthermore, this utility model's water-cooled plate has a simple structure and low cost, effectively meeting user needs. Attached Figure Description
[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:
[0021] Figure 1 This is a cross-sectional view of the integrated water circuit board according to an embodiment of the present utility model;
[0022] Figure 2 This is an exploded view of the water-cooled plate according to an embodiment of this utility model;
[0023] Figure 3 This is a schematic diagram of the heat-absorbing part structure according to an embodiment of the present utility model;
[0024] Figure 4 This is an exploded view of the water-cooled plate and PCBA board according to an embodiment of this utility model;
[0025] Figure 5 This is a schematic diagram of the water-cooled plate after installation according to an embodiment of this utility model.
[0026] In the diagram: 1. Integrated water circuit board; 11. Flow channel structure; 111. Inlet flow channel; 1111. First flow channel; 1112. Second flow channel; 1113. Third flow channel; 112. Outlet flow channel; 12. Heat exchange chamber; 121. First chamber; 122. Second chamber; 123. Third chamber; 124. Through hole; 13. Connection hole; 2. Heat absorption component; 21. First heat absorption part; 22. Second heat absorption part; 23. Third heat absorption part; 24. Fourth heat absorption part; 25. Substrate; 26. Heat dissipation fins; 3. Heat source; 4. Inlet; 5. Outlet; 6. PCBA board. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, various exemplary embodiments described below will be referenced to the accompanying drawings, which form part of the exemplary embodiments, illustrating various exemplary embodiments that may be adopted to implement this utility model. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. It should be understood that they are merely examples of processes, methods, and apparatuses consistent with some aspects of this utility model disclosed as detailed in the appended claims, and other embodiments may be used, or structural and functional modifications may be made to the embodiments listed herein without departing from the scope and spirit of this utility model.
[0028] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the referred element must have a specific orientation, or be constructed and operated in a specific orientation. The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. The term "multiple" means two or more. The terms "connected" and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, integral connections, mechanical connections, electrical connections, communication connections, direct connections, indirect connections through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more of the related listed items. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0029] To illustrate the technical solution described in this utility model, specific embodiments are described below, showing only the parts related to the embodiments of this utility model.
[0030] Example 1:
[0031] like Figures 1 to 5 As shown, this utility model provides a water-cooled plate for a server, including an integrated water circuit board 1 and a heat-absorbing component 2. The heat-absorbing component 2 is fixedly connected to the bottom of the integrated water circuit board 1. The heat-absorbing component 2 is corresponding to and attached to multiple heat sources 3. The integrated water circuit board 1 is provided with a flow channel structure 11 and a heat exchange cavity 12 for containing coolant. The heat exchange cavity 12 is corresponding to the heat-absorbing component 2 and is positioned above the corresponding heat-absorbing component 2. The heat exchange cavity 12 is connected to an inlet 4 and an outlet 5 through the flow channel structure 11. Specifically, taking the water-cooled plate adapted to NVIDIA GB200 as an example, when the water-cooled plate is fixed to the PCBA board 6 of the server, the heat-absorbing component 2 fixed to the bottom of the integrated water circuit board 1 is corresponding to and attached to multiple heat sources 3 on the PCBA board 6, thereby allowing the heat-absorbing component 2 to absorb the heat generated by the multiple heat sources 3. After the heat-absorbing component 2 absorbs heat generated by multiple heat sources 3, coolant is output from the inlet 4 and flows into the heat exchange chamber 12 through the flow channel structure 11. The coolant then exchanges heat with the corresponding heat-absorbing component 2 within the heat exchange chamber 12. The cooled coolant is then transferred to the outlet 5 through the flow channel structure 11 and led out through the outlet 5. The coolant continuously flows through the heat-absorbing component 2 within the heat exchange chamber 12, thus dissipating heat from multiple heat sources 3. The flow channel structure 11 and the heat exchange chamber 12 are integrally formed on the integrated water circuit board 1, facilitating manufacturing and reducing the risk of leakage.
[0032] This utility model's water-cooled plate employs an integrated water circuit board 1. Through the integrated flow channel structure 11, the risk of leakage is reduced. The flow channel structure 11 on the integrated water circuit board 1 transfers the low-temperature coolant or a portion of the low-temperature coolant to the heat-absorbing components 2 corresponding to the heat exchange chamber 12. This effectively dissipates heat from each heat source 3 attached to the heat-absorbing components 2, resulting in high heat dissipation efficiency. Furthermore, this utility model's water-cooled plate has a simple structure and low cost, effectively meeting user needs.
[0033] As an optional implementation method, such as Figure 2As shown, the heat exchange cavity 12 includes a first cavity 121, a second cavity 122 and a third cavity 123. The first cavity 121, the second cavity 122 and the third cavity 123 are arranged in a “pin” shape on the integrated water circuit board 1, and the second cavity 122 is connected to the third cavity 123. Specifically, when the GB200 is provided with 2 GPUs and 1 CPU, the integrated water circuit board 1 is provided with a first cavity 121, a second cavity 122 and a third cavity 123. At the same time, the heat absorption component 2 is correspondingly provided with a first heat absorption part 21, a second heat absorption part 22 and a third heat absorption part 23 to dissipate heat from three heat sources 3 respectively. The second cavity 122 is connected to the third cavity 123, so that the coolant in the second cavity 122 can flow into the third cavity 123 to dissipate the heat in the third cavity 123 and flow out through the third cavity 123.
[0034] As an optional implementation manner, as Figure 1 shown, the flow channel structure 11 includes an inlet flow channel 111 and an outlet flow channel 112. One end of the inlet flow channel 111 is fixedly connected to the water inlet 4, and the inlet flow channel 111 is sequentially connected to the first cavity 121, the second cavity 122 and the third cavity 123. The coolant output from the water inlet 4 flows into the first cavity 121, the second cavity 122 and the third cavity 123 through the inlet flow channel 111. The outlet flow channel 112 is connected to the first cavity 121 and the third cavity 123, and the outlet flow channel 112 is fixedly connected to the water outlet 5. Specifically, the water inlet 4 can transport the coolant into the inlet flow channel 111, so that the coolant enters the first cavity 121, the second cavity 122 and the third cavity 123 through the inlet flow channel 111, absorbs the heat in the first cavity 121, the second cavity 122 and the third cavity 123, and realizes the heat dissipation treatment for multiple heat sources 3 corresponding to the heat absorption component 2. The coolant that enters the first cavity 121 from the inlet flow channel 111 flows to the water outlet 5 through the outlet flow channel 112 after absorbing heat and then flows out from the water outlet 5. The coolant that enters the second cavity 122 from the inlet flow channel 111 flows into the interconnected third cavity 123 after absorbing heat. The coolant that enters the third cavity 123 from the inlet flow channel 111 and the coolant that enters the third cavity 123 from the second cavity 122 both flow to the water outlet 5 through the outlet flow channel 112 and then flow out from the water outlet 5. The inlet flow channel 111 and the outlet flow channel 112 transport the coolant, so that the coolant flows through the first cavity 121, the second cavity 122 and the third cavity 123, thereby taking away the heat in the first cavity 121, the second cavity 122 and the third cavity 123.
[0035] As an optional implementation manner, as Figure 1As shown, the inlet channel 111 includes a first channel 1111, a second channel 1112, and a third channel 1113. The first end of the second channel 1112 is connected to the first end of the first channel 1111 and the inlet 4, and the second end of the first channel 1111 extends to the top of the first cavity 121. The second end of the second channel 1112 is connected to the first end of the third channel 1113, and the second ends of the second channel 1112 and the first ends of the third channel 1113 are located at the top of the second cavity 122. The second end of the third channel 1113 extends to the top of the third cavity 123. Specifically, a portion of the coolant output from the inlet 4 enters the first cavity 121 through the first channel 1111 to absorb heat, and then flows out through the outlet channel 112. Another portion of the coolant output from the inlet 4 flows into the second channel 1112. A portion of the coolant in the second flow channel 1112 flows into the second cavity 122 to absorb heat and then flows into the third cavity 123. Another portion of the coolant in the second flow channel 1112 flows into the third cavity 123 via the third flow channel 1113 to absorb heat and then flows out through the outlet flow channel 112. The coolant entering the third cavity 123 includes the coolant that has absorbed heat in the second cavity 122 (i.e., the higher-temperature coolant) and the coolant that has not absorbed heat in the second flow channel 1112 flowing into the third flow channel 1113 (i.e., the lower-temperature coolant). The lower-temperature coolant can replenish and neutralize the higher-temperature coolant in the third cavity 123, allowing for better heat exchange within the third cavity 123, improving heat exchange efficiency, and ensuring that the heat dissipation effect is not affected when the coolant flows through the last heat source 3. The flow channel structure 11 is rationally laid out, ensuring that each unit requiring heat dissipation has a supply of low-temperature coolant or a portion of low-temperature coolant, resulting in high heat dissipation efficiency. It eliminates the need for auxiliary heat dissipation devices such as heat pipes, has a simple structure, and is low in cost.
[0036] As an optional implementation method, such as Figure 2As shown, the top of the first cavity 121, the second cavity 122 and the third cavity 123 are all provided with through holes 124. The coolant in the first flow channel 1111 enters the first cavity 121 through the through hole 124 on the first cavity 121. A part of the coolant in the second flow channel 1112 enters the second cavity 122 through the through hole 124 on the second cavity 122. Another part of the coolant in the second flow channel 1112 flows into the third flow channel 1113. The coolant in the third flow channel 1113 enters the third cavity 123 through the through hole 124 on the third cavity 123. Specifically, the second end of the first flow channel 1111 is connected to the first cavity 121 through a through hole 124. The coolant in the first flow channel 1111 is sprayed into the first cavity 121 from top to bottom through the through hole 124 and the pressure of the liquid in the flow channel, thereby spraying onto the first heat-absorbing part 21 below the first cavity 121 to exchange heat with the heat source 3 absorbed by the first heat-absorbing part 21. The second end of the second flow channel 1112 is connected to the second cavity 122 through a through hole 124. A portion of the coolant in the second flow channel 1112 is sprayed into the second cavity 122 from top to bottom through the through hole 124 and the pressure of the liquid in the flow channel, thereby spraying onto the second heat-absorbing part 22 below the second cavity 122 to exchange heat with the heat source 3 absorbed by the second heat-absorbing part 22. The second end of the third flow channel 1113 is connected to the third cavity 123 through the through hole 124 on the third cavity 123. The coolant in the third flow channel 1113 is sprayed into the third cavity 123 from the top down through the through hole 124 on the third cavity 123 and the pressure of the liquid in the flow channel, thereby spraying onto the third heat absorption part 23 below the third cavity 123 to exchange heat with the heat source 3 absorbed on the third heat absorption part 23. By setting the through hole 124 on the top of the first cavity 121, the second cavity 122 and the third cavity 123, the coolant is sprayed onto the heat absorption assembly 2 from the top of the cavity, which can increase the uniformity of contact between the coolant and the heat dissipation fins 26 and improve the heat exchange efficiency.
[0037] As an optional implementation, three through holes 124 are respectively disposed at the top center positions of the first cavity 121, the second cavity 122, and the third cavity 123. Specifically, the through holes 124 being disposed at the top center positions of the cavities facilitates more uniform spraying of coolant and more uniform heat exchange, thereby improving the heat dissipation effect.
[0038] As an optional implementation method, such as Figure 2As shown, the heat absorption assembly 2 includes a first heat absorption part 21, a second heat absorption part 22, and a third heat absorption part 23. The first heat absorption part 21 is correspondingly disposed at the bottom of the first cavity 121, the second heat absorption part 22 is correspondingly disposed at the bottom of the second cavity 122, and the third heat absorption part 23 is correspondingly disposed at the bottom of the third cavity 123. Specifically, when the GB200 is equipped with 2 GPUs and 1 CPU (in practice, it can also have 3 GPUs or other multiple heat sources 3 with different power), the water-cooled plate is correspondingly provided with the first heat absorption part 21, the second heat absorption part 22, and the third heat absorption part 23. The first heat absorption part 21, the second heat absorption part 22, and the third heat absorption part 23 each correspond to a heat source 3. When the water-cooled plate is fixed on the PCBA board 6, the first heat absorption part 21, the second heat absorption part 22, and the third heat absorption part 23 respectively adhere to the corresponding heat source 3, thereby absorbing the heat generated by the heat source 3 into the heat exchange cavity 12, which facilitates heat exchange through coolant in the heat exchange cavity 12.
[0039] As an optional implementation method, such as Figure 2 As shown, the heat absorption assembly 2 also includes a fourth heat absorption section 24, which is disposed between the second heat absorption section 22 and the third heat absorption section 23. Specifically, when the GB200 has other chips in addition to two GPUs and one CPU, a fourth heat absorption section 24 is added and disposed between the second heat absorption section 22 and the third heat absorption section 23. Since the second cavity 122 and the third cavity 123 are connected, the coolant in the second cavity 122 can pass through the fourth heat absorption section 24 during its flow into the third cavity 123, thereby exchanging the heat absorbed by the fourth heat absorption section 24.
[0040] As an optional implementation method, such as Figure 3As shown, the first heat-absorbing part 21, the second heat-absorbing part 22, and the third heat-absorbing part 23 all include a substrate 25 and heat dissipation fins 26. The heat dissipation fins 26 are fixed on the substrate 25 and disposed within the heat exchange cavity 12. Specifically, the first heat-absorbing part 21, the second heat-absorbing part 22, and the third heat-absorbing part 23 are all composed of a substrate 25 and heat dissipation fins 26. The heat dissipation fins 26 are fixed on the substrate 25, and the substrate 25 is fixedly connected to the integrated water circuit board 1. The heat dissipation fins 26 are disposed within the heat exchange cavity 12. When the coolant flows into the heat exchange cavity 12, it can perform heat exchange treatment on the heat absorbed by the heat dissipation fins 26. The heat dissipation fins 26 can increase the heat exchange area and improve the heat exchange efficiency. The heat dissipation fins 26 can be selected as spade-shaped fins, which are convenient for manufacturing and have high heat exchange efficiency. When the heat source corresponding to the fourth heat-absorbing part 24 has a small heat output, the fourth heat-absorbing part 24 includes a substrate 25. When the heat source corresponding to the fourth heat-absorbing part 24 has a large heat output, the fourth heat-absorbing part 24 includes a substrate 25 and heat dissipation fins 26. In this embodiment, the fourth heat-absorbing part 24 has a structure without heat dissipation fins 26. The first heat-absorbing part 21, the second heat-absorbing part 22, the third heat-absorbing part 23, and the fourth heat-absorbing part 24 can all be made of copper. Using copper heat exchange material can improve heat exchange efficiency.
[0041] As an optional implementation method, such as Figure 1 , Figure 4 and Figure 5 As shown, the integrated water cooling board 1 has multiple connection holes 13. The integrated water cooling board 1 is fixedly connected to the PCBA board 6 inside the server through these connection holes 13. The integrated water cooling board 1 is made of metal. Specifically, the integrated water cooling board 1 has multiple connection holes 13 on its periphery. These connection holes 13 are used for fixing with connectors (such as bolts or spring bolts). The water-cooling plate passes through the connection holes 13 and the mounting holes of the PCBA board 6 via connectors, thereby fixing the water cooling board to the PCBA board 6 and facilitating heat dissipation for the multiple heat sources 3 on the PCBA board 6. The integrated water cooling board 1 is preferably made of aluminum, which is inexpensive, reduces costs, and is lightweight. The integrated water cooling board 1 can also be made of copper or other metals.
[0042] The embodiment is merely a special case and does not indicate that this utility model is implemented in such a way.
[0043] The above description is merely a preferred embodiment of the present utility model. Those skilled in the art will understand that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the present utility model. Furthermore, under the teachings of the present utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present utility model. Therefore, the present utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present utility model.
Claims
1. A water-cooled plate for a server, characterized in that, It includes an integrated waterway board (1) and a heat absorption component (2). The heat absorption component (2) is fixedly connected to the bottom of the integrated waterway board (1), and the heat absorption component (2) corresponds to and is in close contact with a plurality of heat sources (3); a flow channel structure (11) and a heat exchange cavity (12) for accommodating a coolant are provided on the integrated waterway board (1). The heat exchange cavity (12) is arranged corresponding to the heat absorption component (2), and the heat exchange cavity (12) is arranged above the corresponding heat absorption component (2). The heat exchange cavity (12) is connected to a water inlet (4) and a water outlet (5) through the flow channel structure (11).
2. The water-cooled plate for a server according to claim 1, characterized in that, The heat exchange cavity (12) includes a first cavity (121), a second cavity (122) and a third cavity (123). The first cavity (121), the second cavity (122) and the third cavity (123) are arranged in a "pin" shape on the integrated waterway board (1), and the second cavity (122) is communicated with the third cavity (123).
3. The water-cooled plate for a server according to claim 2, characterized in that, 4. The water-cooled plate for a server according to claim 3, characterized in that, The flow channel structure (11) includes an inlet flow channel (111) and an outlet flow channel (112). One end of the inlet flow channel (111) is fixedly connected to the water inlet (4), and the inlet flow channel (111) sequentially communicates with the first cavity (121), the second cavity (122) and the third cavity (123). The coolant output from the water inlet (4) flows into the first cavity (121), the second cavity (122) and the third cavity (123) through the inlet flow channel (111); the outlet flow channel (112) communicates the first cavity (121) and the third cavity (123), and the outlet flow channel (112) is fixedly connected to the water outlet (5). The inlet flow channel (111) includes a first flow channel (1111), a second flow channel (1112) and a third flow channel (1113). The first end of the second flow channel (1112) is communicated with the first end of the first flow channel (1111) and the water inlet (4), and the second end of the first flow channel (1111) extends to the top of the first cavity (121); the second end of the second flow channel (1112) is communicated with the first end of the third flow channel (1113), and the second end of the second flow channel (1112) and the first end of the third flow channel (1113) are arranged at the top of the second cavity (122). The second end of the third flow channel (1113) extends to the top of the third cavity (123).
5. The water-cooled plate for a server according to claim 4, characterized in that, The top of the first cavity (121), the second cavity (122), and the third cavity (123) are all provided with through holes (124). The coolant in the first flow channel (1111) enters the first cavity (121) through the through hole (124) on the first cavity (121). A portion of the coolant in the second flow channel (1112) enters the second cavity (122) through the through hole (124) on the second cavity (122). Another portion of the coolant in the second flow channel (1112) flows into the third flow channel (1113). The coolant in the third flow channel (1113) enters the third cavity (123) through the through hole (124) on the third cavity (123).
6. The water-cooled plate for a server according to claim 5, characterized in that, The three through holes (124) are respectively located at the top center of the first cavity (121), the second cavity (122) and the third cavity (123).
7. The water-cooled plate for a server according to claim 2, characterized in that, The heat absorption assembly (2) includes a first heat absorption part (21), a second heat absorption part (22) and a third heat absorption part (23). The first heat absorption part (21) is disposed at the bottom of the first cavity (121), the second heat absorption part (22) is disposed at the bottom of the second cavity (122), and the third heat absorption part (23) is disposed at the bottom of the third cavity (123).
8. The water-cooled plate for a server according to claim 7, characterized in that, The heat-absorbing component (2) further includes a fourth heat-absorbing part (24), which is disposed between the second heat-absorbing part (22) and the third heat-absorbing part (23).
9. The water-cooled plate for a server according to claim 8, characterized in that, The first heat-absorbing part (21), the second heat-absorbing part (22) and the third heat-absorbing part (23) each include a substrate (25) and heat dissipation fins (26). The heat dissipation fins (26) are fixed on the substrate (25) and disposed in the heat exchange cavity (12).
10. The water-cooled plate for a server according to any one of claims 1-9, characterized in that, The integrated water circuit board (1) is provided with multiple connection holes (13), and the integrated water circuit board (1) is fixedly connected to the PCBA board (6) in the server through the connection holes (13); the integrated water circuit board (1) is made of metal.