A work platform for wafer debonding
The wafer debonding equipment, which combines positioning, vacuum adsorption, and laser separation, solves the problems of insufficient positioning accuracy, separation reliability, and automation in the wafer debonding process of existing technologies. It achieves efficient and precise wafer debonding, thereby improving production efficiency and product yield.
CN224482002UActive Publication Date: 2026-07-10SHANGHAI BONA MICROELECTRONIC EQUIP CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI BONA MICROELECTRONIC EQUIP CO LTD
- Filing Date
- 2025-06-19
- Publication Date
- 2026-07-10
Smart Images
Figure CN224482002U_ABST
Abstract
The utility model relates to wafer unbonding equipment technical field, specifically disclose a kind of working platform for wafer unbonding, including workbench, mobile mechanism is arranged on the workbench and can move along horizontal direction;The mobile mechanism includes the moving plate of being provided with cavity, the top of the moving plate is equipped with the adsorption hole for adsorbing fixed wafer carrier with moving plate cavity intercommunication, for adsorbing fixed wafer carrier;The top of the workbench is fixedly connected with two left and right distribution's vertical plate located in the rear of mobile mechanism, the front end of two The vertical plate is respectively provided with first support mechanism and carrier separation mechanism located above the moving path of mobile mechanism;The first support mechanism includes first support plate fixedly installed in the front end of left vertical plate, and this wafer unbonding working platform is through positioning, vacuum adsorption, laser and separation mechanism cooperation, realizes the efficient precision of wafer unbonding process, effectively promotes production efficiency and product yield.
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