Gripping mechanism and conveying device

By creating a gap at the carrier component, the suction cup assembly can adsorb the non-process surface of the silicon wafer from below, solving the problem of excessive contact area between the existing silicon wafer clamping mechanism and the process surface, and improving the yield and efficiency of silicon wafers.

CN224482043UActive Publication Date: 2026-07-10LAPLACE (WUXI) SEMICON TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
LAPLACE (WUXI) SEMICON TECH CO LTD
Filing Date
2025-07-10
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing silicon wafer clamping mechanisms have an excessively large contact area with the silicon wafer during operation, which affects the yield and efficiency of the silicon wafer.

Method used

By creating a gap at the non-contact surface of the silicon wafer at the carrier component, the suction cup assembly can adsorb the non-process surface of the silicon wafer from below. Thus, the suction cup assembly contacts the side and non-process surface of the silicon wafer during the gripping process, minimizing contact with the process surface of the silicon wafer, thereby improving the yield and efficiency of the silicon wafer.

Benefits of technology

This technology minimizes contact between process surfaces during the silicon wafer clamping process, thereby improving wafer yield and efficiency.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224482043U_ABST
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Abstract

The embodiment of the present application relates to the photovoltaic technical field, and provides a clamping mechanism for clamping a silicon wafer and conveying equipment.The clamping mechanism comprises a bottom plate, a bearing assembly, a jig box and a suction device.The bearing assembly is arranged on the bottom plate and is used for bearing the silicon wafer and forming a gap below the non-process surface of the silicon wafer.The jig box is arranged in a spaced mode with the bearing assembly.The suction device comprises a driving assembly and a suction disc assembly, the suction disc assembly is configured to suck the silicon wafer and transfer the silicon wafer between the bearing assembly and the jig box under the driving of the driving assembly, and the suction disc assembly comprises first and second suction discs which can be opened and closed relatively.When the suction disc assembly is located above the bearing assembly, the first and second suction discs can enter the gap by opening and closing to suck the non-process surface.
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