Flexible circuit board, anti-shake motor and electronic device

Abstract

The utility model relates to the field of microelectronic, disclose a kind of flexible circuit board, anti-shake motor and electronic equipment.The utility model includes: first metal layer, insulating layer and second metal layer;Bent flexible circuit board's first metal layer includes: first surface and fourth surface, bent flexible circuit board's second metal layer includes: second surface and third surface;First surface, second surface, third surface and fourth surface are sequentially arranged along first direction;Capacitor structure's polar plate unit is etched on first surface, driving chip is arranged on third surface or fourth surface, polar plate is connected with driving chip by first circuit, driving chip is connected with external pin by second circuit, and first circuit and second circuit are respectively at the two sides of driving chip.The structure of bent single-layer flexible circuit board realizes the function of multilayer flexible circuit board structure, avoids crosstalk between circuit while reducing the manufacturing cost of flexible circuit board.

Description

Technical Field

[0001] This utility model relates to the field of microelectronics, and in particular to a flexible circuit board, a vibration stabilization motor, and an electronic device. Background Technology

[0002] A capacitor motor utilizes plates within the motor to form a capacitor. Changes in the signal detected by the capacitor provide feedback on the movement of the lens within the motor. Because the capacitor signal is susceptible to interference from communication lines, special attention must be paid to the spacing between the capacitor plate lines and the communication lines during wiring to ensure the accuracy of the capacitance detection results. Furthermore, to integrate the capacitor plate lines and communication lines, a multi-layer flexible circuit board structure is typically required. To ensure continuity between the layers of the flexible circuit board, blind vias are used in the multi-layer flexible circuit board structure.

[0003] However, the process of blind via design is complex. Each additional layer of blind vias increases the manufacturing cost of flexible circuit boards by about 30% to 50%, which is not conducive to cost control of miniaturized motor equipment. Utility Model Content

[0004] The purpose of this utility model embodiment is to provide a flexible circuit board, a shake-stabilizing motor, and an electronic device. It achieves the functionality of a multi-layer flexible circuit board structure through a bent single-layer flexible circuit board structure. The single-layer flexible circuit board structure is simple, eliminates the need for blind or buried vias, and reduces the manufacturing cost of the flexible circuit board. Simultaneously, by integrating electrode units, driver chips, and corresponding connection lines on four different surfaces formed by the bent single-layer flexible circuit board, crosstalk between capacitor electrode lines and communication lines is resolved.

[0005] To address the aforementioned technical problems, embodiments of this utility model provide a flexible circuit board, comprising: a first metal layer, an insulating layer, and a second metal layer; the bent flexible circuit board is disposed on the base of the motor, the first metal layer of the bent flexible circuit board comprising: a first surface and a fourth surface, and the second metal layer of the bent flexible circuit board comprising: a second surface and a third surface; the first surface, the second surface, the third surface, and the fourth surface are arranged sequentially along a first direction; a capacitor structure electrode unit is etched on the first surface, and a driving chip is disposed on the third surface or the fourth surface; the electrode is connected to the driving chip through a first line, and the driving chip is connected to an external pin through a second line, the first line and the second line being located on opposite sides of the driving chip.

[0006] An embodiment of this utility model also provides a stabilization motor, including: the aforementioned flexible circuit board and a lens; when the lens moves, the signal received by the driving chip of the flexible circuit board through the first line from the electrode unit changes, and the signal of the electrode unit is used to determine the moving distance of the lens.

[0007] An embodiment of this utility model also provides an electronic device, including: a power supply, the aforementioned flexible circuit board or the aforementioned anti-shake motor; the power supply supplies power to the flexible circuit board through external pins of the flexible circuit board.

[0008] Compared to related technologies, this utility model embodiment features a single-layer flexible circuit board with a first metal layer, an insulating layer, and a second metal layer. By bending the flexible circuit board, a first, second, third, and fourth surface are sequentially arranged. All four surfaces are metal layers, with an insulating layer between the first and second surfaces, and between the third and fourth surfaces. Electrode units of a capacitor structure are etched on the first surface. A driver chip is disposed on either the third or fourth surface. The electrode units are connected to the driver chip via a first line, and the driver chip is connected to external pins via a second line. The first and second lines are located on opposite sides of the driver chip. Since the metal layer, except for the wiring area, can be grounded, the spacing between the first and second lines effectively shields the signal, thus avoiding crosstalk between the capacitor electrode unit lines and the communication lines. By bending the single-layer flexible circuit board, four metal surfaces usable for wiring are constructed, thereby integrating the electrode units, the driver chip, and the corresponding connection lines, reducing the manufacturing cost of the flexible circuit board.

[0009] In addition, a first groove is provided on the upper or lower surface of the base, the driving chip is located inside the first groove, and the first groove is filled with glue, the surface of the glue being flush with the surface of the base.

[0010] In addition, when the first groove is provided on the lower surface of the base, the second surface is located on the upper surface side of the base, and the third surface is located on the lower surface side of the base.

[0011] Additionally, a first through-hole is provided in the insulating layer at the corresponding position of the electrode unit; when the driving chip is on the third surface, the first line is connected to the driving chip through the first through-hole via the electrode unit, along the second surface and the third surface; a second through-hole is provided in the insulating layer of the driving chip facing the fourth surface; the second line is connected to the external pin via the second through-hole via the driving chip along the fourth surface.

[0012] Additionally, a first through-hole is provided in the insulating layer at the corresponding position of the electrode plate; when the driving chip is on the fourth surface, a third through-hole is provided in the insulating layer facing the third surface; the first line is connected to the driving chip through the first through-hole from the electrode plate unit, along the second surface, the third surface, and through the third through-hole; the second line is connected to the external pin from the driving chip through the fourth surface.

[0013] In addition, the flexible circuit board includes a drive coil; the flexible circuit board is provided with coil solder joints, the coil solder joints are connected to the drive chip through a third line, and the drive coil is connected to the coil solder joints.

[0014] In addition, when the coil solder joint is located on the first surface, the third line connects to the driver chip via the coil solder joint, the first surface, and the fourth surface.

[0015] In addition, there are multiple driving coils, which are located on any different surfaces among the first surface, the second surface, the third surface, and the fourth surface. Attached Figure Description

[0016] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0017] Figure 1 It is based on a structural diagram of a multilayer flexible circuit board;

[0018] Figure 2 This is a structural diagram of the flexible circuit board in the embodiment of this solution when it is not bent;

[0019] Figure 3 This is a structural schematic diagram of the flexible circuit board according to an embodiment of this solution;

[0020] Figure 4 This is a structural schematic diagram of a flexible circuit board and a base according to an embodiment of this solution;

[0021] Figure 5 This is a structural schematic diagram of a flexible circuit board and a base according to an embodiment of this solution;

[0022] Figure 6 This is a structural schematic diagram of a flexible circuit board and a base according to an embodiment of this solution;

[0023] Figure 7This is a structural schematic diagram of a flexible circuit board and a base according to an embodiment of this solution;

[0024] Figure 8 This is a schematic diagram showing the relative position of a flexible circuit board and a first groove according to an embodiment of this solution;

[0025] Figure 9 This is a schematic diagram showing the relative position of a flexible circuit board and a first groove according to an embodiment of this solution;

[0026] Figure 10 This is a schematic diagram showing the relative position of a flexible circuit board and a first groove according to an embodiment of this solution;

[0027] Figure 11 This is a schematic diagram of the routing of the first and second lines of the flexible circuit board according to an embodiment of this solution;

[0028] Figure 12 This is a schematic diagram of the routing of the third circuit of a flexible circuit board according to an embodiment of this solution;

[0029] Figure 13 This is a schematic diagram of the routing of the third circuit of a flexible circuit board according to an embodiment of this solution;

[0030] Figure 14 This is a structural schematic diagram of a flexible circuit board, a drive coil, and a base according to an embodiment of this solution;

[0031] Figure 15 This is a schematic diagram of the structure of the first surface of the flexible circuit board according to an embodiment of this solution;

[0032] Figure 16 This is a three-dimensional structural diagram of a flexible circuit board and a driving coil according to an embodiment of this solution;

[0033] Figure 17 This is a top view of a flexible circuit board and a drive coil according to an embodiment of this solution;

[0034] Figure 18 This is a cross-sectional structural diagram of a flexible circuit board and a drive coil according to an embodiment of this solution;

[0035] Figure 19 This is a schematic diagram of the structure of the second surface of the flexible circuit board according to an embodiment of this solution;

[0036] Figure 20 This is a structural schematic diagram of the third surface of the flexible circuit board according to an embodiment of this solution;

[0037] Figure 21 This is a structural schematic diagram of the fourth surface of the flexible circuit board according to an embodiment of this solution;

[0038] Figure 22 This is a structural diagram showing the relative positions of the transmitting electrode and the receiving electrode in this embodiment of the scheme.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1- Bending area; 10- Flexible circuit board; 11- Blind via;

[0041] 2-Insulating layer;

[0042] 31 - First metal layer; 32 - Second metal layer; 301 - First surface; 302 - Second surface; 303 - Third surface; 304 - Fourth surface;

[0043] 4-Through hole; 41-First through hole; 42-Second through hole; 43-Third through hole;

[0044] 51-First line; 52-Second line; 53-Third line; 511-X-axis receiving plate line; 512-Y-axis receiving plate line; 513-AF receiving plate line; 514-Transmitting plate line; 515-AF coil outflow line; 516-AF coil inflow line;

[0045] 6-Electrode unit; 61-First X-axis receiving electrode; 62-Second X-axis receiving electrode; 63-Y-axis receiving electrode;

[0046] 71-Driver chip; 72-External pin; 73-External solder joint; 74-Coil solder joint; 711-Differential receiving electrode pins for X and Y axes; 712-AF receiving electrode pin; 713-AF coil inlet pin; 714-Emitting electrode pin; 715-AF coil outlet pin; 741-AF coil inlet solder joint; 742-AF coil outlet solder joint; 751-AF receiving electrode solder joint; 752-Emitting electrode solder joint;

[0047] 8-Drive coil;

[0048] 9-Base; 91-First groove; 92-Coil groove;

[0049] 100-jigs. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the various embodiments of this utility model will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this utility model to enable the reader to better understand this utility model. However, the technical solutions claimed by this utility model can be implemented even without these technical details and various changes and modifications based on the following embodiments.

[0051] The division of the following embodiments is for ease of description and should not constitute any limitation on the specific implementation of this utility model. The various embodiments can be combined with or referenced by each other without contradiction.

[0052] The structure of a multilayer flexible circuit board designed to integrate capacitor plates and communication lines, such as... Figure 1 As shown, 10 flexible circuit boards are stacked together. By designing blind vias 11 on each layer of flexible circuit boards, electrical connections between components on adjacent or alternate layers of flexible circuit boards are achieved through the traces via these vias. Since each layer of flexible circuit boards needs to be drilled separately, and the holes in the multi-layer circuit boards need to be aligned, certain precision requirements are placed on the processing. Therefore, the design of blind vias in multi-layer flexible circuit boards increases time and material costs.

[0053] To control costs, embodiments of this utility model relate to a flexible circuit board, such as... Figure 2 As shown, the flexible circuit board includes a first metal layer 31, an insulating layer 2, and a second metal layer 32. Through-holes 4 can be added to the flexible circuit board, and the through-holes can be metallized through electroplating or other methods, thereby achieving electrical connection between different metal layers. Since the flexible circuit board is a single-layer structure, the through-holes 4 can be processed first before bending, reducing the processing difficulty.

[0054] The flexible circuit board is bent and mounted on the base of the motor, such as... Figure 3 As shown, the flexible circuit board is U-shaped bent at the bending area 1. The first metal layer of the bent flexible circuit board includes a first surface 301 and a fourth surface 304, and the second metal layer of the bent flexible circuit board includes a second surface 302 and a third surface 303. The first surface 301, the second surface 302, the third surface 303 and the fourth surface 304 are arranged sequentially along a first direction. The first surface 301 is etched with a capacitor structure electrode unit 6, and the third surface 303 or the fourth surface 304 is provided with a driver chip 71. The electrode unit 6 is connected to the driver chip 71 through a first line 51, and the driver chip 71 is connected to an external pin 72 through a second line 52. The first line 51 and the second line 52 are respectively located on both sides of the driver chip 71.

[0055] The capacitor-structured electrode unit 6 is used to detect the movement of the lens in the motor. Since the lens can move in the X, Y, or Z axis directions, the electrode types can be categorized as X-axis, Y-axis, and Z-axis electrodes, each corresponding to the detection of movement distances in different directions. The X-axis, Y-axis, and Z-axis electrodes can also improve detection accuracy and sensitivity through differential methods. For example... Figure 3 The diagram shows an electrode structure corresponding to a differential detection method. Each X-axis first receiving electrode 61, X-axis second receiving electrode 62, and corresponding transmitting electrode form a capacitance detection structure. The three sets of X-axis capacitance detection structures differentially calculate the lens's movement distance along the X-axis. The Y-axis receiving electrode 63 and its corresponding transmitting electrode form a Y-axis capacitance detection structure. Similarly, the movement distance in the Z-axis direction can also be detected by forming a capacitance detection structure using receiving and transmitting electrodes. Furthermore, differential structures similar to those in the X-axis direction can be set in both the Y-axis and Z-axis directions, which will not be elaborated further here.

[0056] Compared to related technologies, this utility model embodiment features a single-layer flexible circuit board with a first metal layer, an insulating layer, and a second metal layer. By bending the flexible circuit board, a first, second, third, and fourth surface are sequentially arranged. All four surfaces are metal layers, with an insulating layer between the first and second surfaces, and between the third and fourth surfaces. Electrode units of a capacitor structure are etched on the first surface. A driver chip is disposed on either the third or fourth surface. The electrode units are connected to the driver chip via a first line, and the driver chip is connected to external pins via a second line. The first and second lines are located on opposite sides of the driver chip. Since the area of ​​the metal layer, except for the wiring, can be grounded, the spacing between the first and second lines effectively shields the signal, thus avoiding crosstalk between the capacitor electrode unit lines and the communication lines. By bending the single-layer flexible circuit board, four metal surfaces usable for wiring are constructed, thereby integrating the electrode units, the driver chip, and the corresponding connection lines, reducing the manufacturing cost of the flexible circuit board.

[0057] like Figures 4 to 7 As shown, the flexible circuit board is attached to the surface of the base 9, and the two sides of the bending area 1 of the flexible circuit board are at 180 degrees relative to the bending area 1. During bending, pressure is applied to the bending area 1 by the jig 100, and adhesive is applied to the bending area 1 and then heated and cured to improve the stability of the bending area 1. This allows the two sides of the bending area 1 of the flexible circuit board to be flat and adhered.

[0058] The electrode units on the flexible circuit board are formed by etching onto the corresponding metal layers. Similarly, the first and second circuits are formed by etching. The driver chip is mounted on the third or fourth surface of the flexible circuit board using surface mount technology (SMT). For metal layers outside the traces such as the first and second circuits, connections can be made by adding vias, ultimately connecting to the GND ground line to reduce impedance, suppress interference, and ensure a stable potential reference.

[0059] In addition, to prevent the performance of the driver chip from being affected by moisture, a first groove can be provided on the upper or lower surface of the base, the driver chip is located inside the first groove, and the first groove is filled with glue, the surface of the glue being flush with the surface of the base.

[0060] When the first groove is opened on the upper surface of the base, such as Figure 4 As shown, the driver chip 71 is located on the third surface. The driver chip 71 and the flexible circuit board that is attached to the driver chip 71 are both placed inside the first groove 91, while the remaining portion of the flexible circuit board is located on the upper surface of the base 9. The first groove 91 is filled with adhesive, and the depth of the first groove 91 is greater than or equal to the total thickness of the flexible circuit board and the driver chip 71 to ensure that the adhesive can cover the entire driver chip 71.

[0061] like Figure 5 As shown, another case is where the upper surface of the base has a first groove. In this case, the driver chip 71 is located on the fourth surface, the fourth surface of the flexible circuit board is flush with the upper surface of the base 9, and only the driver chip 71 is placed inside the first groove 91, and then the first groove 91 is filled with glue.

[0062] like Figure 6 As shown, with the first groove 91 provided on the lower surface of the base 9, the two bent parts of the flexible circuit board are located on the upper and lower surfaces of the base 9, respectively. The second surface is on one side of the upper surface of the base 9, and the third surface is on one side of the lower surface. The flexible circuit board is bent to the lower surface of the base at a large angle. The driver chip 71 is placed on the third surface and is inverted, placed inside the first groove 91, and filled with glue. This arrangement reduces the risk of breakage caused by bending the flexible circuit board and also increases the distance between the upper and lower flexible circuit boards after bending, enhancing signal shielding strength.

[0063] In addition, such as Figures 4 to 5 As shown, the external pin 72 can be led out through sheet metal connected to external solder points 73 on the flexible circuit board, with the sheet metal embedded in the base. Alternatively, it can be as follows... Figures 6 to 7 As shown, external pin 72 is directly led out from the flexible circuit board by bending it. Figures 4 to 6 Any flexible circuit board configuration can utilize either of the two external pin lead-out methods described above. For ease of fixing the external pins, such as... Figure 6 As shown, when the flexible circuit board is attached to the lower surface of the base, if the external pin 72 is led out by bending the flexible circuit board, the bending direction is towards the upper surface of the base. Figure 7 As shown, when the flexible circuit board is attached to the upper surface of the base, if the external pin 72 is brought out by bending the flexible circuit board, the bending direction is towards the lower surface of the base.

[0064] like Figure 8 As shown, the first groove 91 can be positioned directly below the electrode unit 6. Alternatively, it can be positioned as follows: Figure 9 As shown, the first groove 91 is positioned at any one of the four corners of the motor. Since the base width at the motor's corners is relatively large, it facilitates the routing of external pins. Alternatively, as shown... Figure 10 As shown, the first groove 91 and the electrode plate unit 6 are staggered and placed on the adjacent side of the motor, so that the wiring areas of the first line of the electrode plate and the second line used for communication are further apart, which improves the anti-interference effect and facilitates processing.

[0065] In addition, to improve the shielding effect of signals in different lines, the first and second lines can be respectively placed in the metal layers on both sides of the insulating layer. Since the insulating layer is a non-conductive layer made of materials such as PI and PET, the two lines placed in the metal layers on both sides of the insulating layer have a better anti-crosstalk effect. The wiring methods of the first and second lines are explained below in two cases: the driver chip is placed on the third surface and the fourth surface.

[0066] like Figure 3 The diagram shows the wiring configuration of the first line 51 and the second line 52 when the driver chip 71 is disposed on the third surface 303. A first through-hole 41 is provided in the insulating layer at the corresponding position of the electrode unit 6; the first line 51 connects to the driver chip 71 via the first through-hole 41 from the electrode unit 6 along the second surface 302 and the third surface 303; a second through-hole 42 is provided in the insulating layer of the driver chip 71 facing the fourth surface 304; the second line 52 connects to the external pin 72 via the second through-hole 42 from the driver chip 71 along the fourth surface 304.

[0067] like Figure 11The diagram shows the wiring configuration of the first line 51 and the second line 52 when the driver chip 71 is disposed on the fourth surface 304. A first through-hole 41 is provided in the insulating layer at the corresponding position of the electrode unit 6; a third through-hole 43 is provided in the insulating layer facing the third surface 303 of the driver chip 71; the first line 51 connects to the driver chip 71 via the first through-hole 41, along the second surface 302 and the third surface 303, and through the third through-hole 43 from the electrode unit 6; the second line 52 connects to external pins from the driver chip 71 via the fourth surface 304.

[0068] In the above two wiring methods for the first and second lines, the X-axis first receiving electrode 61, the X-axis second receiving electrode 62, and the Y-axis receiving electrode 63 are different lines. Electrode lines of the same type are connected to each other, while electrode lines of different types are not connected to each other. For aesthetic purposes and ease of subsequent maintenance, the wiring of different types of electrodes can be arranged in parallel.

[0069] To further enhance the anti-interference effect between lines, insulating material can be filled in the middle U-shaped area of ​​the bent flexible circuit board, that is, insulating material can be filled between the second and third surfaces. This not only fixes the flexible circuit board but also further enhances the signal shielding effect.

[0070] In addition, such as Figure 12 As shown, a hollow copper coil is used to replace the etching coil in the original multilayer flexible circuit board as the drive coil 8. The drive coil used to drive the lens movement is connected to the flexible circuit board. A coil solder joint 74 is set on the flexible circuit board. The coil solder joint 74 is connected to the drive chip 71 through the third line 53. The drive coil 8 is connected to the coil solder joint 74.

[0071] The wiring of the third line 53 is related to the location of the driver chip 71. For example Figure 12 As shown, when the driver chip 71 is on the third surface and the coil solder joint 74 is on the first surface, a through-hole is provided in the driver chip 71 facing the fourth surface. The third line 53 passes through the coil solder joint 74, through the first surface and the fourth surface, and then through the through-hole to connect to the driver chip 71. Figure 13 As shown, when the driver chip 71 is on the fourth surface and the coil solder joint 74 is on the first surface, the third line 53 is connected to the driver chip 71 via the coil solder joint 74, the first surface, and the fourth surface.

[0072] In addition, such as Figure 14As shown, there are multiple drive coils, each corresponding to a different driving direction. The drive coils are fixed to a coil carrier. Since the drive coils become uneven as the number of turns increases, coil grooves 92 can be provided on the coil carrier during assembly to prevent collisions between the moving carrier and the drive coils, thus fixing the position of the drive coils. The flexible circuit board 10 and the coil carrier can be jointly attached to the base, or the drive coils can be directly attached to the base, as long as the flexible circuit board and the drive coils are coplanar. The specific fixing method of the drive coils is not limited.

[0073] like Figure 15 As shown, several coil solder points 74 are set on the flexible circuit board 10, and different coil solder points 74 are connected to drive coils 8 in different directions.

[0074] Furthermore, to improve the driving capability of the drive coil 8, the number of drive coils in a single direction can be increased, with multiple drive coils located on any different surfaces among the first, second, third, and fourth surfaces. For example... Figure 16 As shown, drive coils are respectively provided on the first surface 301 and the second surface 302 of the flexible circuit board to increase the number of turns of the drive coils and improve the driving force.

[0075] In addition, such as Figure 17 The diagram shows the configuration where drive coil 8 is positioned on the four sides of the motor, as shown. Figure 18 As shown Figure 17 As shown in the cross-sectional view of side AB, the driving coil 8 is located on the second surface of the flexible circuit board, directly below the electrode unit 6. At this time, the driving coil 8 can cooperate with the magnet set at the position of the emitting electrode to achieve the driving effect. The magnet used for driving can also act as the emitting electrode, thereby reducing the number of electrode sets.

[0076] To illustrate the structure of the flexible circuit board in this embodiment in more detail, the components and wiring on the first, second, third, and fourth surfaces of the flexible circuit board will be specifically described below.

[0077] like Figure 15 The diagram shows the structure of the first surface, which is etched with multiple receiving plates. It also includes four X-axis and Y-axis coil solder points 74 and a third circuit.

[0078] like Figure 19 The diagram shows the structure of the second surface 302. The receiving plate of the first surface is connected to the second surface through the first through hole 41, and then connected to the third surface through the first line via the 180-degree bend area.

[0079] like Figure 20The diagram shows the structure of the third surface 303. The first lines coming from the second surface, such as the X-axis receiving electrode line 511 and the Y-axis receiving electrode line 512, are connected to the fourth surface through through holes. Additionally, the AF coil outflow line 515, AF coil inflow line 516, transmitting electrode line 514, and AF receiving electrode line 513 need to be considered. These four lines can pass through through holes from the fourth surface to the third surface to the arc where the flexible circuit board intersects with the lens, and then through through holes to the solder joints on the fourth surface. Specifically, the AF receiving electrode line 513 corresponds to the AF receiving electrode solder joint 751, the transmitting electrode line 514 corresponds to the transmitting electrode solder joint 752, the AF coil outflow line 515 corresponds to the AF coil outflow solder joint 742, and the AF coil inflow line 516 corresponds to the AF coil inflow solder joint 741. Each solder joint is connected to the corresponding electrode or coil structure through the base sheet metal and suspension springs.

[0080] like Figure 21 The diagram shows the structure of the fourth surface, on which an IC driver chip 71 is attached. Taking a driver chip with 20 pins as an example, the circuits corresponding to each pin are as follows: a three-axis drive coil (6 pins), with each axis's drive coil corresponding to two pins, one for the inflow end and one for the outflow end. For example, the AF coil inflow pin is 713, and the AF coil outflow pin is 715. The four pins corresponding to the third circuit 53 represent the X-axis coil pin and the Y-axis coil pin, respectively. The aforementioned AF coil inflow pin 713 is connected via... Figure 20 The AF coil inflow line 516 shown corresponds to the AF coil inflow terminal solder joint 741, and the AF coil outflow pin 715 is connected via... Figure 20 The AF coil output line 515 shown corresponds to the AF coil output solder point 742. Two IIC pins control AF and OIS (4 pins) respectively, and the four IIC pins correspond to SDA1, SDA2, SCL1, and SCL2 lines respectively. There are also VDD (1 pin), GND (1 pin), LDO1, and LDO2 (2 pins) for voltage regulation. There are also receiver pins (5 pins), such as the differential receiver pin 711 for the X and Y axes, and the AF receiver pin 712. The transmitter pin is 714. [The text abruptly ends here, likely due to an incomplete translation or missing information.] Figure 21 As can be seen, the X and Y coil traces are directly connected from the fourth surface to the solder joints of the X and Y axis coils on the first surface via a 180-degree bend. The X and Y receiving electrode traces are connected to the third surface via vias. The four IIC communication lines can be directly led from the right side of the driver chip through the fourth surface to external pin 72. In addition, there are external pins VDD and GND. For the linear regulators LDO1 and LDO2 that do not go external, VDD needs to be connected in parallel with a filter capacitor CL. This filter capacitor is used to filter out high-frequency noise and ripple from the preceding power supply (such as VDD).

[0081] Finally, as Figure 22 The diagram shows a schematic of the capacitance detection structure. The emitting plate 64 and the receiving plate are positioned opposite each other. Taking the X-axis capacitance detection structure as an example, it consists of three differential structures formed by the first X-axis receiving plate 61 and the second X-axis receiving plate 62. Each differential structure corresponds to one emitting plate, and the Y-axis receiving plate 63 corresponds to one emitting plate. The resulting capacitance detection structure conforms to the physical formula of a parallel plate capacitor: C = εS / 4πkd, where ε represents the dielectric constant, determined by the medium between the plates, such as air or water; k represents the electrostatic constant, also known as the Coulomb constant, which indicates that the magnitude of the force between two point charges, each with a charge of 1C, when separated by 1m in a vacuum is F = 8.987551 × 10⁻⁶. 9 N, i.e., k = 8.987551 × 10 9 N·m 2 / C; S represents the overlapping area (projected area) of the two plates; d represents the vertical distance between the two plates; π represents pi. As can be seen from the formula, changing the overlapping area or the vertical distance between the plates can change the capacitance value. Based on this capacitance principle, the lens movement distance can be detected based on the change in capacitance value.

[0082] Another feasible embodiment of this utility model relates to a stabilization motor, including: the aforementioned flexible circuit board and a lens; when the lens moves, the signal received by the driving chip of the flexible circuit board through the first line from the electrode unit changes, and the signal of the electrode unit is used to determine the moving distance of the lens.

[0083] Compared with related technologies, the anti-shake motor provided in this embodiment of the utility model is provided with the flexible circuit board provided in the aforementioned embodiment. Therefore, it also has the same technical effects provided in the aforementioned embodiment, which will not be elaborated here.

[0084] Another feasible embodiment of this utility model relates to an electronic device, including: a power supply, the aforementioned flexible circuit board or the aforementioned anti-shake motor; the power supply supplies power to the flexible circuit board through external pins of the flexible circuit board.

[0085] Compared with related technologies, the electronic device provided in this embodiment of the present invention is equipped with the flexible circuit board or anti-shake motor provided in the foregoing embodiments. Therefore, it also has the technical effects provided in the foregoing embodiments, which will not be elaborated here.

[0086] Those skilled in the art will understand that the above embodiments are specific embodiments for implementing the present invention, and in practical applications, various changes can be made to them in form and detail without departing from the spirit and scope of the present invention.

Claims

1. A flexible circuit board, characterized in that, include: First metal layer, insulating layer, and second metal layer; The bent flexible circuit board is disposed on the base of the motor. The first metal layer of the bent flexible circuit board includes a first surface and a fourth surface, and the second metal layer of the bent flexible circuit board includes a second surface and a third surface. The first surface, the second surface, the third surface and the fourth surface are arranged sequentially along a first direction. The first surface has an electrode unit with a capacitor structure etched on it, and the third or fourth surface has a driver chip disposed thereon. The electrode unit is connected to the driver chip through a first line, and the driver chip is connected to an external pin through a second line. The first line and the second line are respectively located on both sides of the driver chip.

2. The flexible circuit board according to claim 1, characterized in that, A first groove is provided on the upper or lower surface of the base, the driving chip is located inside the first groove, and the first groove is filled with glue, the surface of the glue being flush with the surface of the base.

3. The flexible circuit board according to claim 2, characterized in that, When the first groove is provided on the lower surface of the base, the second surface is located on one side of the upper surface of the base, and the third surface is located on one side of the lower surface of the base.

4. The flexible circuit board according to claim 1, characterized in that, The insulating layer at the corresponding position of the electrode unit is provided with a first through hole; When the driver chip is located on the third surface, the first line is connected to the driver chip by the electrode unit through the first through hole, along the second surface and the third surface; The driving chip has a second through hole facing the insulating layer of the fourth surface; The second line is connected to the external pin by the driver chip through the second via along the fourth surface.

5. The flexible circuit board according to claim 1, characterized in that, The insulating layer at the corresponding position of the electrode unit is provided with a first through hole; When the driving chip is located on the fourth surface, the driving chip has a third through hole facing the insulating layer of the third surface; The first line is connected to the driving chip by the electrode unit through the first through hole, along the second surface, the third surface, and through the third through hole; The second line is connected to the external pin via the driver chip and the fourth surface.

6. The flexible circuit board according to any one of claims 1 to 5, characterized in that, Includes the drive coil; The flexible circuit board is provided with coil solder joints, which are connected to the driver chip through a third line, and the driver coil is connected to the coil solder joints.

7. The flexible circuit board according to claim 6, characterized in that, When the coil solder joint is located on the first surface, the third line connects to the driver chip via the coil solder joint, the first surface, and the fourth surface.

8. The flexible circuit board according to claim 6, characterized in that, The number of driving coils is multiple, and the multiple driving coils are located on any different surfaces among the first surface, the second surface, the third surface and the fourth surface.

9. A shake-stabilizing motor, characterized in that, include: The flexible circuit board as described in any one of claims 1 to 8, and the lens; When the lens moves, the signal received by the driving chip of the flexible circuit board from the electrode unit through the first line changes, and the signal of the electrode unit is used to determine the moving distance of the lens.

10. An electronic device, characterized in that, include: The flexible circuit board as described in any one of claims 1 to 8 or the anti-shake motor as described in claim 9, and the power supply; The power supply provides power to the flexible circuit board through external pins.

Images