A crystal oscillator

Abstract

The utility model discloses a crystal oscillator relates to the field of crystal oscillator, including upper cover, frame, piezoelectric resonator and base, frame is provided with through -hole, and the opposite two ends of frame are fixedly connected with upper cover and base respectively to form the closed mounting space for installing piezoelectric resonator at through -hole, and piezoelectric resonator is fixedly installed in the closed mounting space, the utility model patent is through optimizing crystal structure, has improved the production efficiency of crystal oscillator.

Description

Technical Field

[0001] This utility model relates to the field of crystal oscillator technology, and in particular to a crystal oscillator structure that can improve production efficiency. Background Technology

[0002] A crystal oscillator (or resonator) is an electronic component that utilizes the piezoelectric effect of piezoelectric materials such as quartz crystals to convert electrical energy into mechanical vibration, thereby outputting a stable frequency electrical signal. It is widely used in consumer electronics, communications, automotive electronics, and industrial control. Its core consists of a crystal resonator, electrodes, a base, and a package. Functionally, crystal oscillators can be divided into passive crystal oscillators (requiring external circuit excitation, with a simple structure and low cost) and active crystal oscillators (with built-in oscillation circuitry, outputting a stable signal upon power-up, offering higher frequency accuracy). Some enhanced crystal oscillators (such as temperature-compensated TCXOs and voltage-controlled VCXOs) also integrate temperature compensation or voltage regulation modules, maintaining frequency stability under environmental changes. They are the "frequency heart" ensuring clock synchronization, data transmission, and precise control of electronic devices.

[0003] A crystal oscillator typically consists of a base, a quartz crystal, and a top cover. In existing technologies, it is generally necessary to reinforce the upper end of the base or the lower end of the top cover to create a groove for mounting the quartz crystal. The quartz crystal is then installed in the space formed by the groove. However, regardless of whether the groove is reinforced at the upper end of the base or machined at the lower end of the top cover, in most cases, each one needs to be processed individually, resulting in relatively low production efficiency.

[0004] Therefore, the aforementioned technical problems need to be solved. Utility Model Content

[0005] In order to overcome the shortcomings of the existing technology, this utility model proposes a crystal oscillator, which aims to optimize the crystal oscillator structure and improve production efficiency.

[0006] To solve the above-mentioned technical problems, the basic technical solution proposed by this utility model is as follows: a crystal oscillator, including an upper cover plate, a frame, a piezoelectric resonator and a base, wherein the frame has a through hole penetrating the upper surface and the lower surface, and the upper and lower ends of the frame are respectively fixedly connected to the upper cover plate and the base so that the through hole forms an installation space for installing the piezoelectric resonator, and the piezoelectric resonator is fixedly installed in the installation space.

[0007] Preferably, the frame is a cuboid.

[0008] Preferably, the through hole is square in shape.

[0009] Preferably, the frame is made of PCB material.

[0010] Furthermore, the piezoelectric resonator is a quartz crystal.

[0011] Furthermore, a first adhesive layer is provided between the upper cover plate and the frame.

[0012] Specifically, the first adhesive layer is epoxy resin adhesive.

[0013] Preferably, a second adhesive layer is provided between the base and the frame.

[0014] The second adhesive layer is made of epoxy resin adhesive.

[0015] Preferably, the wall thickness of the frame is between 0.3mm and 2.0mm.

[0016] Specifically, the lower end face of the upper cover plate and the upper end face of the base are both planes.

[0017] Preferably, both the upper cover and the base are made of copper-clad PCB material.

[0018] The beneficial effects of this utility model are:

[0019] The technical solution of this utility model optimizes the structure by opening holes in the frame and then fixing the base and top cover plate on the frame to cover the upper and lower ends of the openings to form a sealed installation space, so that the piezoelectric resonator can be installed in the installation space. This allows the crystal oscillator to be mass-produced separately for the frame, and the frame can be made of different materials for the top cover plate and base without having to change the frame to the corresponding material, which is highly flexible. The frame can generally be produced by injection molding a plate with several through holes and then cutting it, or by directly cutting multiple frames from the plate at one time using a laser, thereby improving the production efficiency of the crystal oscillator. Attached Figure Description

[0020] Figure 1 This is an exploded view of a crystal oscillator according to the present invention;

[0021] Figure 2 is a structural diagram of a crystal oscillator according to this utility model.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Base; 2. Frame; 3. Top cover plate; 4. Piezoelectric resonator; 5. Second adhesive layer; 6. First adhesive layer; 7. Installation space; 21. Through hole. Detailed Implementation

[0024] The following will be combined with the appendix Figure 1 To be continued Figure 2The technical solutions in the embodiments of this utility model are clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0025] In the prior art, it is necessary to process grooves on the upper cover plate 3 or the base 1 of the crystal oscillator, and then, with the combination of the two, form a closed cavity at the groove to accommodate the piezoelectric resonator 4. However, the method of making grooves on the upper cover plate 3 or the base 1 of the crystal oscillator will vary depending on the type of crystal oscillator, the material and the manufacturing process. Common manufacturing methods include machining, mold forming and etching processes.

[0026] For materials with high hardness, such as ceramics and metals, precision CNC machining equipment can be used for cutting. Taking ceramic crystal oscillator base as an example, the ceramic blank is first fixed on a CNC machine tool. The path of the tool is controlled by writing a program, and the ceramic blank is milled with a milling cutter to process the groove of the required shape and size. This method can ensure the precision and dimensional accuracy of the groove, but the processing efficiency is relatively low and the cost is high. It is suitable for small-batch production or crystal oscillator products with extremely high precision requirements.

[0027] When the crystal oscillator cover plate 3 or base is made of plastic, injection molding is a common method. First, a corresponding mold is made according to the design of the groove. The mold is set with a protrusion that corresponds to the shape of the groove. Molten plastic is injected into the mold cavity. After the plastic cools and solidifies in the mold, a crystal oscillator cover plate 3 or base with grooves can be formed. This method can achieve large-scale production, which is efficient and low-cost. However, the mold development cost is high, and the application range is small, making it unsuitable for applications of various materials.

[0028] For the metal crystal oscillator cover plate 3, a stamping process is generally used. By designing and manufacturing a stamping die of a specific shape, the metal sheet is placed on a stamping machine. Under pressure, the die stamps the metal sheet, causing it to undergo plastic deformation, thereby forming a groove on the metal cover plate 3 or the base. This method can be used to stamp a thinner metal cover plate 3 as a whole and then divide it into individual cover plates 3. However, for thicker cover plates 3, they generally need to be stamped individually, which is less efficient. Moreover, this method is only applicable to the production of metal cover plates 3 and is not suitable for some other materials.

[0029] Therefore, this invention optimizes the crystal oscillator structure and proposes a novel structure that is applicable to a variety of materials and allows for the rapid fabrication of the cavity to accommodate the piezoelectric resonator 4, thereby improving overall production efficiency.

[0030] This embodiment proposes a crystal oscillator, with reference to... Figure 1 and Figure 2 The enclosure includes a top cover plate 3, a frame 2, a piezoelectric resonator 4, and a base 1. A through hole 21 is provided at the upper end of the frame 2. The lower end of the top cover and the upper end of the base 1 are both flat. The piezoelectric resonator 4 is fixedly installed on the upper end of the base 1 by adhesive bonding. Then, the end of the frame 2 with the through hole 21 is fixedly installed on the upper end of the base 1, so that the piezoelectric resonator 4 is placed inside the through hole 21. Finally, the top cover is fixed on the upper end of the frame 2 to cover and seal the through hole 21, thereby completing the encapsulation.

[0031] In this embodiment, the shape of the frame 2 is not limited; it can be circular or square. Similarly, the shape of the through hole 21 is not limited. The piezoelectric resonator 4 can be one of the following: quartz crystal, lithium niobate (LiNbO3) crystal, lithium tantalate (LiTaO3) crystal, potassium sodium niobate (KNN, (K,Na)NbO3) single crystal, or potassium dihydrogen phosphate (KDP) single crystal. The shape of the top cover is roughly the same as that of the frame 2, and the top cover is a flat plate, requiring no additional groove processing. The shape of the base 1 can be roughly the same as that of the frame 2, or it can be slightly larger than the frame 2. The upper end of the base 1 is flat and requires no additional groove processing. The frame 2 and the base 1 can be fixed by adhesive bonding, i.e., by glue, or by snap-fitting, achieved by the cooperation of the through hole 21 slot and the snap-fit ​​block. Similarly, the fixing method of the frame 2 and the top cover is the same as the fixing method of the base 1 and the frame 2.

[0032] In one implementation, such as Figure 1 As shown, the frame 2 is designed as a cuboid, and correspondingly, the top cover and base are also designed as cuboid panels, maintaining a general consistency with the shape of the frame 2.

[0033] Specifically, the through-hole 21 is also set to a cuboid shape, preferably with a rectangular cross-section, so as to better accommodate the shape of the crystal installed inside it.

[0034] In this embodiment, the piezoelectric resonator 4 is preferably made of quartz crystal.

[0035] Furthermore, a first adhesive layer 6 is provided between the upper cover plate 3 and the frame 2.

[0036] Specifically, such as Figure 2 As shown, the first adhesive layer 6 is an adhesive connecting layer used to fix the upper cover plate 3 and the frame 2. Its material can be one of epoxy glue, silicone glue, glass solder (inorganic glue), ultraviolet (UV) curing glue, and polyimide (PI) glue. The first adhesive layer 6 is preferably made of epoxy resin glue.

[0037] In another embodiment, a second adhesive layer 5 is provided between the base 1 and the frame 2 for fixing the base 1 and the frame 2. The second adhesive layer 5 is made of the same material as the first adhesive layer 6, preferably epoxy resin glue.

[0038] Specifically, it can be made into products of multiple sizes, such as model 5032 (5.0*3.2mm), model 3225 (3.2*2.5mm), model 2520 (2.5*2.0mm), model 2016 (2.0*1.6mm), and model 7040 (7.0*4.0mm), etc. The wall thickness of frame 2 is controlled between 0.3mm and 2.0mm, including the endpoints, that is, the thickness between the inner wall of the through hole 21 and the outer wall of frame 2. This ensures that the frame 2 has sufficient support while keeping the size of the through hole 21 large enough to accommodate a quartz crystal. The thickness of the top cover ranges from 0.1mm to 20mm, including the endpoints.

[0039] Optionally, the crystal oscillator can also be made into other sizes, which is not limited here, and the wall thickness of the frame 2 can also be changed accordingly, which is not limited here.

[0040] The lower end face of the upper cover plate 3 and the upper end face of the base 1 are both flat, so there is no need to process the groove on the lower end of the upper cover plate 3 or the upper end face of the base 1.

[0041] Preferably, both the top cover plate 3 and the base 1 are made of copper-clad PCB material.

[0042] The frame 2 is preferably made of PCB material, which is readily available and easy to process through holes.

[0043] The frame 2 can be obtained by directly opening several through holes 21 on the PCB board and then dividing the board into several frames 2, thereby realizing the rapid processing and production of the frame 2. The through holes 21 can be obtained by laser cutting or by cutting with a grinding wheel.

[0044] Alternatively, the frame 2 can also be made of other materials, such as metal, plastic, resin, etc. Correspondingly, if metal is used, several through holes 21 can be obtained on the metal plate by casting or punching, and then the metal plate can be divided to obtain several frames 2; if plastic or resin is used, a material plate carrying several through holes 21 can be directly integrally formed by injection molding, and then the material plate can be divided to obtain several frames 2.

[0045] The beneficial effects of this utility model are:

[0046] The technical solution of this utility model involves opening a hole in the frame 2, and then fixing the base 1 and the upper cover plate 3 onto the frame 2 respectively to cover the upper and lower ends of the opening to form a sealed installation space 7, so that the piezoelectric resonator 4 can be installed in the installation space 7. The frame 2 can be produced by integrally injection molding a sheet material with several through holes 21 and then cutting it, or by directly cutting multiple frames 2 from the sheet material at one time through laser processing, so as to realize the production of multiple frames 2 at one time. Then, the frame 2 is fixedly connected to the base 1 to quickly form the installation space 7 for installing the piezoelectric resonator 4, thereby improving the production efficiency of crystal oscillators. Furthermore, through the structure of base 1-frame 2-upper cover plate 3, the frame 2 can be made of different materials for the upper cover plate 3 and base 1 without changing the frame 2 to the corresponding material. This provides high flexibility and allows for the rapid production of the installation space 7 for installing the piezoelectric resonator 4, i.e., the cavity for accommodating the piezoelectric resonator 4, thus improving the overall production efficiency.

[0047] Based on the disclosure and teachings of the above specification, those skilled in the art can make changes and modifications to the above embodiments. Therefore, this utility model is not limited to the specific embodiments disclosed and described above, and some modifications and changes to this utility model should also fall within the protection scope of the claims of this utility model. Furthermore, although some specific terms are used in this specification, these terms are only for convenience of explanation and do not constitute any limitation on this utility model.

Claims

1. A crystal oscillator, characterized in that, The device includes a top cover plate (3), a frame (2), a piezoelectric resonator (4), and a base (1). The frame (2) has a through hole (21) that penetrates the upper and lower surfaces. The upper and lower ends of the frame (2) are fixedly connected to the top cover plate (3) and the base (1) respectively, so that the through hole (21) forms an installation space (7) for installing the piezoelectric resonator (4). The piezoelectric resonator (4) is fixedly installed in the installation space (7).

2. A crystal oscillator according to claim 1, characterized in that, The frame (2) is a cuboid, and the through hole (21) is square in shape.

3. A crystal oscillator according to claim 1, characterized in that, The frame (2) is made of PCB material.

4. A crystal oscillator according to claim 1, characterized in that, The piezoelectric resonator (4) is a quartz crystal.

5. A crystal oscillator according to claim 1, characterized in that, A first adhesive layer (6) is provided between the upper cover plate (3) and the frame (2).

6. A crystal oscillator according to claim 5, characterized in that, The first adhesive layer (6) is epoxy resin adhesive.

7. A crystal oscillator according to claim 1, characterized in that, A second adhesive layer (5) is provided between the base (1) and the frame (2).

8. A crystal oscillator according to claim 1, characterized in that, The wall thickness of the frame (2) is between 0.3mm and 2.0mm.

9. A crystal oscillator according to claim 1, characterized in that, The lower end face of the upper cover plate (3) and the upper end face of the base (1) are both planes.

10. A crystal oscillator according to any one of claims 1 to 9, characterized in that, Both the top cover (3) and the base (1) are made of copper-clad PCB material.

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