Housing for a semiconductor module and semiconductor module

Abstract

This application relates to a housing and a semiconductor module. It includes: a frame body comprising circumferentially connected outer frame beams that enclose a cavity for accommodating semiconductor devices; a mounting surface on the bottom surface of the frame body for mounting a base plate via adhesive bonding; an adhesive-receiving groove formed on the mounting surface with a first preset depth for accommodating adhesive; the adhesive-receiving groove being located around the cavity; the height of the inner sidewall of the adhesive-receiving groove near the cavity being lower than the height of the corresponding outer sidewall; and an adhesive-blocking groove formed on the mounting surface and located outside the adhesive-receiving groove; the distance between the adhesive-blocking groove and the adhesive-receiving groove is less than a first preset value; the adhesive-blocking groove having a second preset depth greater than the first preset depth. The technical solution of this application can reduce adhesive overflow during base plate mounting and improve the quality of the semiconductor module.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and in particular to a housing for a semiconductor module and a semiconductor module. Background Technology

[0002] During the packaging process of semiconductor modules, the housing and base plate need to be pressed and bonded together with sealant. Due to limited space (the width of the dispensing path is about 1mm-2mm), the sealant may be squeezed out during assembly, resulting in excess sealant. This affects both the appearance and the installation of the semiconductor module in the equipment. Utility Model Content

[0003] In view of this, this application provides a housing for a semiconductor module and a semiconductor module to solve at least one problem existing in the prior art.

[0004] To achieve the above objectives, the technical solution of this application is implemented as follows: In a first aspect, embodiments of this application provide a housing for a semiconductor module, comprising: The frame includes circumferentially connected outer frame beams that enclose a cavity to accommodate semiconductor devices; the bottom surface of the frame has a mounting surface for mounting a base plate by adhesive bonding. An adhesive reservoir is formed on the mounting surface and has a first preset depth to accommodate adhesive; the adhesive reservoir is located around the cavity; the height of the adhesive reservoir near the inner wall of the cavity is lower than the height of the opposite outer wall. An adhesive-blocking groove is formed on the mounting surface and located outside the adhesive-receiving groove; the distance between the adhesive-blocking groove and the adhesive-receiving groove is less than a first preset value; the adhesive-blocking groove has a second preset depth, which is greater than the first preset depth.

[0005] In one optional embodiment, the bottom wall of the adhesive container is configured as an inclined surface with a higher outer surface and a lower inner surface, so that the adhesive container forms a trapezoidal groove with a smaller bottom and a larger top, guiding the adhesive to flow inward.

[0006] In one alternative embodiment, the inclination angle of the bottom wall of the adhesive container is 10°-30°.

[0007] In one optional embodiment, the bottom wall of the adhesive container is provided with a step, and the depth of the outer portion of the bottom wall is greater than the depth of the inner portion of the bottom wall.

[0008] In one optional embodiment, a recycling hole is provided at the bottom of the adhesive-blocking groove, and the recycling hole communicates with the cavity to form a recycling channel.

[0009] In one optional embodiment, the groove opening at one end of the adhesive-blocking groove near the adhesive-containing groove is provided with a rounded corner, and the groove opening at the other end is provided with a right angle.

[0010] In one alternative embodiment, the inner wall of the adhesive container is inclined inward to form a trapezoidal groove that is smaller at the bottom and larger at the top, guiding the adhesive to flow inward.

[0011] In one alternative embodiment, the inner wall of the adhesive container is inclined inward at 30°-45°.

[0012] In one alternative embodiment, the intersection between the bottom wall of the adhesive container and the outer wall of the adhesive container is rounded.

[0013] Secondly, embodiments of this application provide a semiconductor module, including: The housing of any of the semiconductor modules described above; The base plate is fixed to the mounting surface of the housing with adhesive to form a cavity in the housing for accommodating semiconductor devices.

[0014] The semiconductor module housing and semiconductor module provided in this application embodiment include: a frame body, including circumferentially connected outer frame beams that enclose a cavity for accommodating semiconductor devices; the bottom surface of the frame body has a mounting surface for mounting a base plate by adhesive bonding; an adhesive-containing groove formed on the mounting surface with a first preset depth to accommodate adhesive; the adhesive-containing groove is located around the cavity; the height of the inner sidewall of the adhesive-containing groove near the cavity is lower than the height of the opposite outer sidewall; an adhesive-blocking groove formed on the mounting surface and located outside the adhesive-containing groove; the distance between the adhesive-blocking groove and the adhesive-containing groove is less than a first preset value; the adhesive-blocking groove has a second preset depth, which is greater than the first preset depth. Therefore, the semiconductor module housing and semiconductor module of this application embodiment have an adhesive-containing groove with a first depth, and the height of the inner sidewall near the cavity is set lower than the height of the opposite outer sidewall, so that the adhesive preferentially overflows from the inside, and an adhesive-blocking groove is provided on the outside of the adhesive-containing groove to prevent the overflowing adhesive from flowing outside the housing. Therefore, the housing and semiconductor module of the semiconductor module in this application embodiment can reduce adhesive overflow during the base plate mounting process and improve the quality of the semiconductor module.

[0015] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 A bottom view of the housing of a semiconductor module provided in an embodiment of this application; Figure 2 for Figure 1 A magnified view of a portion of point A in the middle; Figure 3 for Figure 2 A cross-sectional schematic diagram; Figure 4 for Figure 2 Another cross-sectional view diagram.

[0017] Explanation of reference numerals in the attached figures: 10. Frame structure; 11. Outer frame beam; 12. Mounting surface; 20. Adhesive receiving groove; 21. Bottom wall; 30. Adhesive blocking groove. Detailed Implementation

[0018] To make the technical solutions and beneficial effects of this application more obvious and understandable, the technical solutions in the embodiments of this application are clearly and completely described below by listing specific embodiments. Obviously, the embodiments of this application are not exhaustive, and the described embodiments are only some embodiments of this application, not all embodiments.

[0019] The exemplary embodiments disclosed in this application will now be described in more detail with reference to the accompanying drawings, providing detailed structures and steps to illustrate the technical solution of this application. Note that the drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used herein is for the purpose of describing particular embodiments only and should not be construed as limiting the technical solutions of this application.

[0021] The following description provides numerous specific details to offer a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. To clearly define the inventive concept of this application and avoid confusion with its content, technical features well-known in the art and conventionally understood by those skilled in the art are not elaborated upon. Specifically, this document does not fully list all features of actual embodiments, nor does it provide a detailed description of well-known functions and structures.

[0022] To address the technical problems in related technologies, embodiments of this application provide a housing for a semiconductor module. (See reference...) Figures 1-3 The housing of the semiconductor module includes: The frame body 10 includes circumferentially connected outer frame beams 11, which enclose a cavity for accommodating semiconductor devices; the bottom surface of the frame body 10 has a mounting surface 12 for mounting a base plate by gluing. An adhesive reservoir 20 is formed on the mounting surface 12 and has a first preset depth to accommodate adhesive; the adhesive reservoir 20 is located around the cavity; the height of the inner wall of the adhesive reservoir 20 near the cavity is lower than the height of the opposite outer wall. A sealant groove 30 is formed on the mounting surface 12 and located outside the adhesive receiving groove 20; the distance between the sealant groove 30 and the adhesive receiving groove 20 is less than a first preset value; the sealant groove 30 has a second preset depth, which is greater than the first preset depth.

[0023] Specifically, the adhesive can be a sealant, which is a low-viscosity fluid before curing. Therefore, in the prior art, it is relatively easy for adhesive to overflow.

[0024] Understandably, the frame body 10 can be integrally formed, i.e., there is only one outer frame beam 11, or multiple outer frame beams 11 can be installed circumferentially to form it. For ease of description, the embodiments of this application define the placement of the shell in the direction where the mounting surface 12 of the frame body 10 faces downward.

[0025] Understandably, the outer frame beam 11 has a certain height to accommodate semiconductor devices. Therefore, adhesive overflow can be reduced by providing the adhesive receiving groove 20 and the adhesive blocking groove 30. Both the first preset depth and the second preset depth are less than the height of the outer frame beam 11, meaning that neither the adhesive receiving groove 20 nor the adhesive blocking groove 30 penetrates the outer frame beam 11.

[0026] Understandably, the height of the inner wall of the adhesive groove 20 near the cavity is lower than the height of the opposite outer wall, which facilitates the adhesive to overflow preferentially from the inside. This overflow from the inside does not affect the appearance or the installation of the semiconductor module in the device, and is therefore permissible.

[0027] Specifically, in some cases, such as when the adhesive has a high viscosity, the inner wall may not be necessary, in order to better guide the adhesive to overflow from the inside.

[0028] Specifically, the first preset depth can be 0.3mm-0.8mm, for example 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm; the height of the inner wall can be 0.1mm-0.3mm, for example 0.1mm, 0.2mm, 0.3mm; and the height of the outer wall can be 0.3mm-0.8mm, for example 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm.

[0029] Understandably, a retaining groove 30 is provided on the outside of the adhesive reservoir 20 to add an extra barrier to prevent adhesive overflow, thereby further reducing adhesive overflow. Specifically, the second preset depth can be 0.5mm-1.0mm, for example, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, or 1.0mm.

[0030] Specifically, the first preset value can be 0.1mm-0.3mm, such as 0.1mm, 0.2mm, or 0.3mm. This effectively prevents adhesive overflow and saves limited space.

[0031] Specifically, the width of both the adhesive receiving groove 20 and the adhesive blocking groove 30 can be 0.8mm-1.2mm to facilitate the flow of adhesive.

[0032] Specifically, the adhesive receiving groove 20 can be provided around the cavity to form a circumferentially connected groove, and it can completely enclose the cavity to facilitate sealing. The adhesive blocking groove 30 does not need to be sealed on all four sides and can be provided in areas where adhesive is prone to overflow and where there is sufficient space. It is understandable that if there is enough space, the adhesive blocking groove 30 can also be designed as a circumferentially connected groove.

[0033] The semiconductor module housing of this embodiment has an adhesive-containing groove 20 with a first depth, and the height of the inner sidewall near the cavity is set lower than the height of the opposite outer sidewall, so that the adhesive preferentially overflows from the inside. An adhesive-blocking groove 30 is provided on the outside of the adhesive-containing groove 20 to prevent the overflowed adhesive from flowing outside the housing. Therefore, the semiconductor module housing and semiconductor module of this embodiment can reduce adhesive overflow during the base plate mounting process and improve the quality of the semiconductor module.

[0034] In some embodiments of this application, the bottom wall 21 of the adhesive container 20 is configured as an inclined surface with a higher outer surface and a lower inner surface, so that the adhesive container 20 forms a trapezoidal groove with a smaller bottom and a larger top, guiding the adhesive to flow inward.

[0035] This can further reduce adhesive overflow.

[0036] Specifically, refer to Figure 4 The bottom wall 21 of the adhesive container 20 has an inclination angle of 10°-30°. This is an inclination angle suitable for the viscosity of the adhesive, so that the adhesive does not flow away before curing, but guides the adhesive to flow inward and prevents it from overflowing. The inclination angle of the bottom wall 21 of the adhesive container 20 is marked as A1 in the attached drawing.

[0037] In some embodiments of this application, the bottom wall 21 of the adhesive reservoir 20 is provided with a step, and the depth of the outer portion of the bottom wall 21 is greater than the depth of the inner portion of the bottom wall 21.

[0038] This serves a similar purpose to setting the bottom wall 21 as a sloping surface with a higher outer edge and a lower inner edge. After setting the steps, the adhesive container 20 is divided into two compartments. The inner compartment is deeper, and the outer adhesive has a greater gravitational potential energy to flow inward, which can also reduce overflow.

[0039] In some embodiments of this application, a recycling hole is provided at the bottom of the adhesive-blocking groove 30, and the recycling hole communicates with the cavity to form a recycling channel.

[0040] In this way, if there is a lot of adhesive overflow, it will not flow into the adhesive barrier 30 and continue to overflow outwards, but will flow into the cavity through the recycling hole at the bottom.

[0041] In some embodiments of this application, the groove opening of the adhesive-blocking groove 30 near the adhesive-containing groove 20 is provided with a rounded corner, and the groove opening at the other end is provided with a right angle.

[0042] In this way, the adhesive overflowing from the adhesive groove 20 can flow smoothly into the adhesive blocking groove 30 through the rounded corners, while the adhesive flowing into the adhesive blocking groove 30 is blocked by the right angle and is not easy to flow out of the shell.

[0043] In some embodiments of this application, the inner wall of the adhesive container 20 is inclined inward so that the adhesive container 20 forms a trapezoidal groove that is smaller at the bottom and larger at the top, guiding the adhesive to flow inward.

[0044] The inner wall of the adhesive reservoir 20 near the cavity is inclined, with the upper end sloping towards the cavity. This allows the adhesive to more easily overflow into the cavity along the inner wall.

[0045] In some embodiments of this application, the inner wall of the adhesive reservoir 20 is inclined inward at 30°-45°.

[0046] Similarly, this is also a suitable tilt angle for the viscosity of the adhesive.

[0047] In some embodiments of this application, the intersection between the bottom wall 21 of the adhesive container 20 and the outer wall of the adhesive container 20 is formed with rounded corners.

[0048] This reduces flow resistance and prevents glue from accumulating at corners and overflowing.

[0049] This application embodiment also provides a semiconductor module, the semiconductor module comprising: The housing of the semiconductor module described above; The base plate is fixed to the mounting surface 12 of the housing with adhesive to form a cavity in the housing for accommodating semiconductor devices.

[0050] The semiconductor module of this embodiment has a receptacle 20 with a first depth, and the height of the inner sidewall near the cavity is set lower than the height of the opposite outer sidewall, so that the adhesive preferentially overflows from the inside. A retaining groove 30 is provided on the outside of the receptacle 20 to prevent the overflowed adhesive from flowing outside the housing. Therefore, the conductor module of this embodiment can reduce adhesive overflow during the base plate mounting process and improve the quality of the semiconductor module.

[0051] It should be noted that the various embodiments or implementation methods in this document can be described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to mutually. It should be understood that in the various embodiments of this application, the embodiment numbers are merely for descriptive purposes and do not represent the superiority or inferiority of the embodiments.

[0052] Understandably, without conflict, the technical features in the technical solutions described in each embodiment can be arbitrarily combined to form new embodiments. For example, each structure in each embodiment can be implemented as an independent embodiment, and the structures can be arbitrarily combined; some or all of the structures in different embodiments can be arbitrarily combined. Each step in each embodiment can be implemented as an independent embodiment, and the steps can be arbitrarily combined; the order of the steps can be arbitrarily interchanged; some or all of the steps in different embodiments can be arbitrarily combined. Furthermore, regarding the table in the embodiments, each element, each row, or each column in the table can be implemented as an independent embodiment.

[0053] In this document, when the terms "embodiment," "implementation," or "example" are used, it means that the specific features described in connection with these implementations or examples are included in at least one implementation, embodiment, or example of this application. It should be noted that the illustrative expressions of the above terms do not necessarily refer to the same implementation, embodiment, or example. Furthermore, the specific features described, such as structures or steps, can be appropriately combined in any one or more implementations, embodiments, or examples.

[0054] In some embodiments, prefixes such as "first" and "second" are used merely to distinguish different descriptive objects and do not impose restrictions on the position, order, priority, or value of the descriptive objects. The description of the descriptive objects is based on the context of the claims or embodiments, and the use of prefixes does not constitute unnecessary limitations. For example, the numerical value of the descriptive object is not limited by ordinal numbers and can be one or more. For instance, in "first device," the numerical value of "device" can be one or more. Furthermore, objects modified by different prefixes can be the same or different. For example, if the descriptive object is "device," then "first device" and "second device" can be the same device or different devices, and their types can be the same or different. Describing "first" does not necessarily imply the existence of "second," and discussing "second" does not necessarily imply the existence of "first."

[0055] In some embodiments, unless otherwise stated, elements expressed in the singular form, such as “a,” “the,” “the,” “the,” “the,” “the,” etc., can mean “one and only one,” or “one or more,” “at least one,” etc. For example, when using articles such as “a,” “an,” “the,” etc. in translation, the noun following the article can be understood as either a singular or a plural expression. In some embodiments, “multiple” refers to two or more.

[0056] In some embodiments, the terms “at least one of”, “one or more”, “a plurality of”, “multiple”, etc., may be used interchangeably.

[0057] In some embodiments, the notation "at least one of A and B", "A and / or B", "A in one case, B in another", "A in one case, B in another", etc., may include the following technical solutions depending on the situation: in some embodiments, A (A is executed regardless of B); in some embodiments, B (B is executed regardless of A); in some embodiments, execution is selected from A and B (A and B are selectively executed); in some embodiments, both A and B are executed. The same applies when there are more branches such as A, B, C, etc.

[0058] In some embodiments, the notation "A or B" may include the following technical solutions, depending on the situation: in some embodiments, A (execution of A regardless of B); in some embodiments, B (execution of B regardless of A); in some embodiments, selective execution from A and B (A and B are selectively executed). The same applies when there are more branches such as A, B, and C.

[0059] In some embodiments, unless otherwise expressly defined, the terms "installation," "connection," "linking," "fixing," "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment according to the specific circumstances.

[0060] In some embodiments, the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “height,” “up,” “down,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” and “counterclockwise” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used for the purpose of simplifying the description of this application and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. That is, they should not be construed as limitations on this application.

[0061] In some embodiments, unless otherwise expressly defined, "above" or "below" the second feature can mean that the first and second features are in direct contact, or indirect contact via an intermediate medium, or that they are not in contact, but simply indicate that the horizontal level of the first feature is higher than that of the second feature. Furthermore, "above" or "below" the second feature can mean that the first feature is directly above or diagonally above, directly below, or diagonally below the second feature.

[0062] In some embodiments, spatial relation terms such as “upper” and “lower” may be used for convenience of description to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figures is flipped, the description of an element or feature “below” other elements or features will change it to “upper” other elements or features. Therefore, the exemplary terms “upper” and “lower” can include both upper and lower orientations. The device may also be otherwise oriented (rotated 90 degrees or otherwise), and the spatial descriptive terms used herein will be interpreted accordingly.

[0063] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations of the technical solutions of this application. Various modifications and changes can be made to the above embodiments without departing from the scope of this application. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

Claims

1. A housing of a semiconductor module, characterized by, include: The frame includes circumferentially connected outer frame beams that enclose a cavity to accommodate semiconductor devices; the bottom surface of the frame has a mounting surface for mounting a base plate by adhesive bonding. An adhesive reservoir is formed on the mounting surface and has a first preset depth to accommodate adhesive; the adhesive reservoir is located around the cavity; the height of the adhesive reservoir near the inner wall of the cavity is lower than the height of the opposite outer wall. An adhesive-blocking groove is formed on the mounting surface and located outside the adhesive-receiving groove; the distance between the adhesive-blocking groove and the adhesive-receiving groove is less than a first preset value; the adhesive-blocking groove has a second preset depth, which is greater than the first preset depth.

2. The housing of a semiconductor module according to claim 1, characterized in that, The bottom wall of the adhesive container is designed as an inclined surface with a higher outer surface and a lower inner surface, so that the adhesive container forms a trapezoidal groove with a smaller bottom and a larger top, guiding the adhesive to flow inward.

3. The housing of a semiconductor module according to claim 2, characterized in that The bottom wall of the adhesive container has an inclination angle of 10°-30°.

4. The case of a semiconductor module according to claim 1, characterized by The bottom wall of the adhesive container is provided with a step, and the depth of the outer part of the bottom wall is greater than the depth of the inner part of the bottom wall.

5. The case of a semiconductor module according to claim 1, characterized by The bottom of the adhesive-blocking groove is provided with a recycling hole, which is connected to the cavity to form a recycling channel.

6. The housing of a semiconductor module according to claim 1, characterized by The groove opening at one end of the adhesive-blocking groove near the adhesive-containing groove is rounded, while the groove opening at the other end is set at a right angle.

7. The housing of the semiconductor module according to claim 1, characterized in that, The inner wall of the adhesive container is inclined inward to form a trapezoidal groove that is smaller at the bottom and larger at the top, guiding the adhesive to flow inward.

8. The housing of the semiconductor module according to claim 7, characterized in that, The inner wall of the adhesive container is inclined inward at 30°-45°.

9. The housing of the semiconductor module according to any one of claims 1-8, characterized in that, The intersection between the bottom wall and the outer wall of the adhesive container is rounded.

10. A semiconductor module, characterized in that, include: The housing of the semiconductor module according to any one of claims 1-9; The base plate is fixed to the mounting surface of the housing with adhesive to form a cavity in the housing for accommodating semiconductor devices.

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