A DBC substrate that facilitates heat dissipation

Abstract

This utility model relates to the field of module packaging technology, and in particular to a DBC substrate that facilitates heat dissipation. The substrate includes a substrate with a working area and a connection area. The working area includes a chip area and an electronic component area. A frame is provided on the outside of the substrate, and multiple pins are fixedly disposed on the frame. The pins are soldered to the connection area, and the frame is connected to the substrate through the pins, increasing the heat dissipation area of ​​the substrate and improving heat dissipation efficiency. Simultaneously, a heat-conducting sheet, preferably a metal plate, is disposed below the substrate to further increase heat dissipation efficiency. By providing a flow channel and interface on the substrate to cooperate with an external liquid cooling device, heat-conducting liquid can be introduced into the flow channel to absorb heat from the substrate, thereby ensuring the stability of the substrate temperature.

Description

Technical Field

[0001] This utility model relates to the field of module packaging technology, and in particular to a DBC substrate that facilitates heat dissipation. Background Technology

[0002] Existing DBC substrates employ ceramic surface metallization technology based on gas-metal eutectic reaction. This technology was first proposed by Burgess and Sun in 1975 and applied to power module packaging. Specifically, copper foil of the required thickness is placed on an alumina ceramic substrate, heated to 1066°C in an oxygen-containing nitrogen atmosphere. Copper forms a eutectic liquid phase containing copper and oxygen in the oxygen atmosphere, which wets the interface between the directly contacting copper layer and alumina ceramic layer, and the copper and ceramic are firmly bonded together through a chemical reaction.

[0003] Traditional DBC substrates use solder mask to position the chip mounting area. However, the solder mask has poor corrosion resistance, and the temperature at the four corners of the chip is high during operation. This prevents the heat from dissipating in time, leading to overheating. To solve this problem, Chinese Patent Publication No. CN220934069U discloses "a novel DBC substrate" that uses an L-shaped metal mesa combination in the chip positioning area of ​​the front copper layer. This can define the chip boundary, achieve precise chip positioning, avoid the chip drift problem caused by using solder mask, and also avoid the defects of poor corrosion resistance and easy peeling of solder mask. The metal mesa that abuts against the chip can quickly dissipate the heat generated by the chip during operation, extending the chip's lifespan.

[0004] However, in actual use, the chips, electronic components, and copper substrate will generate heat during use, causing the temperature of the ceramic substrate itself to increase over time, thus affecting the performance of the DBC board. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies, such as the temperature of the ceramic substrate itself increasing over time, which affects the performance of the DBC board, and to propose a DBC substrate that facilitates heat dissipation.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] Design a DBC substrate for easy heat dissipation, including a substrate, on which a working area and a connection area are provided, the working area including a chip area and an electronic component area, and a frame is provided on the outside of the substrate, on which multiple pins are fixedly disposed, and the pins are soldered to the connection area.

[0008] Furthermore, a copper substrate is attached to both the chip area and the electronic component area, and an insulating layer is covered on the copper substrate. The coating dots of the chip penetrate the insulating layer and connect with the copper substrate.

[0009] Furthermore, a flow channel is provided at the lower end of the substrate, and a heat-conducting sheet covering the flow channel is provided on the substrate.

[0010] Furthermore, the substrate is provided with a sealing strip corresponding to the flow channel, the heat-conducting sheet is connected to the sealing strip, and the space between the heat-conducting sheet and the substrate is filled with heat-conducting adhesive.

[0011] Furthermore, the substrate is provided with an interface that communicates with the flow channel, and the interface is connected to an external liquid cooling device.

[0012] Furthermore, the heat-conducting sheet has connecting portions on both sides, and the substrate has mounting grooves corresponding to the connecting portions, with the connecting portions fixedly connected to the mounting grooves.

[0013] The DBC substrate proposed in this utility model, which facilitates heat dissipation, has the following advantages:

[0014] In this invention, the frame is connected to the substrate via pins, increasing the heat dissipation area of ​​the substrate and improving heat dissipation efficiency. At the same time, a heat-conducting sheet is provided below the substrate, preferably a metal plate, to further increase heat dissipation efficiency.

[0015] Secondly, in this invention, by providing a flow channel and interface on the substrate and connecting an external liquid cooling device, heat-conducting liquid can be introduced into the flow channel to absorb the heat of the substrate, thereby ensuring the stability of the substrate temperature. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a DBC substrate that facilitates heat dissipation according to this utility model;

[0017] Figure 2 This is a schematic diagram of the interface structure of this utility model;

[0018] Figure 3 This is an enlarged structural diagram of region A of this utility model;

[0019] Figure 4 This is a schematic diagram of the flow guide channel of this utility model.

[0020] In the diagram: 1. Substrate; 2. Working area; 21. Chip area; 22. Electronic component area; 3. Connection area; 4. Frame; 5. Pin; 6. Channel; 7. Thermal plate; 71. Sealing strip; 72. Thermal adhesive; 73. Interface; 74. Connection part. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Reference Figure 1-4 A DBC substrate for easy heat dissipation includes a ceramic substrate 1, on which a working area 2 and a connection area 3 are provided. The working area 2 includes a chip area 21 and an electronic component area 22. A frame 4 is provided on the outside of the substrate 1, and multiple pins 5 are fixedly provided on the frame 4. The pins 5 are soldered to the connection area 3.

[0023] In this utility model, in this embodiment, both the frame 4 and the pin 5 are copper parts. The frame 4 is connected to the connection area 3 of the substrate 1 through the pin 5, thereby increasing the heat dissipation area of ​​the substrate 1 and improving the heat dissipation efficiency.

[0024] Furthermore, in this embodiment, a copper substrate is attached to both the chip area 21 and the electronic component area 22. An insulating layer is covered on the copper substrate. The coating dots of the chip penetrate the insulating layer and connect with the copper substrate. The copper substrate contacts the coating dots of the chip to transmit electrical signals.

[0025] Furthermore, in this embodiment, a flow channel 6 is provided at the lower end of the substrate 1, and a heat-conducting sheet 7 is provided on the substrate 1 to cover the flow channel 6. The heat-conducting liquid can be introduced into the flow channel 6 to absorb the heat of the substrate 1, thereby ensuring the temperature stability of the substrate 1.

[0026] It should be noted that in this embodiment, the substrate 1 is provided with a sealing strip 71 corresponding to the flow channel 6, the heat-conducting sheet 7 is connected to the sealing strip 71, and the space between the heat-conducting sheet 7 and the substrate 1 is filled with heat-conducting adhesive 72. The heat-conducting sheet 7 and the substrate 1 are fixedly connected by the sealing strip 71, which also serves to seal and prevent the heat-conducting liquid in the flow channel 6 from leaking.

[0027] Furthermore, in this embodiment, the substrate 1 is provided with an interface 73 that communicates with the guide channel 6. The interface 73 is connected to a liquid cooling device. The liquid cooling device drives the heat transfer fluid to circulate, absorbs the heat of the substrate 1, and carries away the heat. The cooled heat transfer fluid is then input into the guide channel 6.

[0028] More specifically, in this embodiment, a connecting portion 74 is provided on both sides of the heat-conducting sheet 7, and a mounting groove corresponding to the connecting portion 74 is provided on the substrate 1. The connecting portion 74 is fixedly connected to the mounting groove, and the mounting groove and the connecting portion 74 are bonded together by an adhesive layer to prevent the heat-conducting sheet 7 from separating and falling off from the substrate 1.

[0029] Working principle: The frame 4 is connected to the connection area 3 of the substrate 1 through the pin 5, which increases the heat dissipation area of ​​the substrate 1 and improves the heat dissipation efficiency. The heat-conducting liquid is introduced into the flow channel 6 to absorb the heat of the substrate 1. The heat-conducting liquid is circulated by the liquid cooling device to absorb the heat of the substrate 1 and carry the heat away. The cooled heat-conducting liquid is then introduced into the flow channel 6 to ensure the temperature stability of the substrate 1. The heat-conducting sheet 7 is fixedly connected to the substrate 1 by the sealing strip 71, which also plays a sealing role to prevent the heat-conducting liquid in the flow channel 6 from leaking.

[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A DBC substrate facilitating heat dissipation, comprising a substrate (1), characterized in that, The substrate (1) is provided with a working area (2) and a connection area (3). The working area (2) includes a chip area (21) and an electronic component area (22). The substrate (1) is provided with a frame (4) on the outside. Multiple pins (5) are fixedly arranged on the frame (4). The pins (5) are soldered to the connection area (3).

2. The DBC substrate of claim 1, wherein: Both the chip area (21) and the electronic component area (22) are covered with a copper substrate, and the copper substrate is covered with an insulating layer. The coating dots of the chip penetrate the insulating layer and are connected to the copper substrate.

3. The DBC substrate of claim 1, wherein: A flow channel (6) is provided at the lower end of the substrate (1), and a heat-conducting sheet (7) covering the flow channel (6) is provided on the substrate (1).

4. The DBC substrate of claim 3, wherein: The substrate (1) is provided with a sealing strip (71) corresponding to the flow channel (6), the heat-conducting sheet (7) is connected to the sealing strip (71), and the space between the heat-conducting sheet (7) and the substrate (1) is filled with heat-conducting adhesive (72).

5. The DBC substrate of claim 4, wherein: The substrate (1) is provided with an interface (73) that communicates with the guide groove (6), and the interface (73) is connected to an external liquid cooling device.

6. The DBC substrate of claim 4, wherein: The heat-conducting sheet (7) has a connecting part (74) on both sides, and the substrate (1) has a mounting groove corresponding to the connecting part (74), and the connecting part (74) is fixedly connected to the mounting groove.

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