PCBA glue filling dam structure and power module

Abstract

The utility model relates to the field of circuit board, specifically disclose a PCBA glue pouring dam structure and power module, wherein, PCBA glue pouring dam structure includes: PCBA, bending insulation mechanism and insulating baffle, bending insulation mechanism and the edge of PCBA are attached to connect, and the insulating baffle is abutted with PCBA one side, to form the closed dam for PCBA through the cooperation of bending insulation mechanism and insulating baffle. In the utility model, based on the closed dam for PCBA formed by the cooperation of bending insulation mechanism and insulating baffle, replace the point adhesive dam in the related prior art, not only can effectively reduce the production cost brought by point adhesive dam, also save the waiting dam gel solidification and the step of glue pouring transfer, thereby can shorten the glue pouring process time, improve circuit board production efficiency, especially suitable for large size PCBA's glue pouring package.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, and more specifically, to a PCBA potting dam structure and power module. Background Technology

[0002] For high-power AC / DC power modules, the PCBA (Printed Circuit Board Assembly) is relatively large and operates in complex environments. Traditional conformal coating is insufficient to effectively address the high temperature, high humidity, and corrosive conditions encountered by customers. To improve product reliability, potting the internal PCBA has become an important measure. In existing production processes, a dispensing barrier is typically required before potting. Currently, there are three main types of dispensing barriers: machine dispensing barriers, manual dispensing barriers, and barriers using specialized tooling fixtures. Regardless of the method used, each PCBA needs to be barriered before potting, and after the potting solidifies, it needs to be transferred before final assembly. The overall process is complex and can impact production efficiency. Summary of the Invention

[0003] This invention aims to at least partially solve one of the technical problems in related technologies. To this end, this invention proposes a PCBA potting dam structure and power module, which can shorten the potting process time and improve circuit board production efficiency.

[0004] In a first aspect, this utility model provides a PCBA potting dam structure, including a PCBA, a bending insulation mechanism, and an insulating baffle. The bending insulation mechanism is attached to the edge of the PCBA, and the insulating baffle abuts against one side of the PCBA, so that the bending insulation mechanism and the insulating baffle cooperate to form a closed dam for the PCBA.

[0005] Optionally, in one embodiment of the present invention, the bending insulation mechanism is open at the top and includes a first bending portion, a second bending portion, and a supporting bottom surface. The supporting bottom surface is embedded and connected to the bottom of the PCBA. The two sides of the supporting bottom surface abut against the first bending portion and the second bending portion, respectively. The first bending portion is fitted and connected to one edge of the PCBA, and the second bending portion is fitted and connected to the other edge of the PCBA.

[0006] Optionally, in one embodiment of the present invention, a bottom housing is further provided below the bending insulation mechanism. The bottom housing and the bending insulation mechanism are connected to form an accommodating space for mounting the PCBA in the accommodating space.

[0007] Optionally, in one embodiment of the present invention, the bottom housing includes a mounting bottom surface that abuts against the bottom of the bending insulation mechanism, the insulation baffle includes an integrally connected upper bending portion and a lower bottom, the upper bending portion and the lower bottom are perpendicular to each other, the upper bending portion is limited to the PCBA, and the lower bottom is fixedly connected to the mounting bottom surface.

[0008] Optionally, in one embodiment of the present invention, the first bent portion and the second bent portion are symmetrically arranged with respect to the support bottom surface.

[0009] Optionally, in one embodiment of the present invention, the first bent portion and the second bent portion intersect with the insulating baffle to form a first intersection and a second intersection, respectively, and the first intersection and the second intersection are fixed by applying adhesive.

[0010] Optionally, in one embodiment of the present invention, the thickness of both the first bent portion and the second bent portion is not less than 0.25 mm.

[0011] Secondly, this utility model embodiment also provides a power module, including the PCBA potting dam structure as described in the first aspect.

[0012] This utility model proposes a PCBA potting dam structure and power module. By setting a bending insulation mechanism that fits and connects to the edge of the PCBA and an insulating baffle that abuts against one side of the PCBA, a closed dam is formed for the PCBA based on the cooperation of the bending insulation mechanism and the insulating baffle. This replaces the dispensing dam in related prior art. It can not only effectively reduce the production cost of dispensing dam, but also eliminate the steps of waiting for the dam adhesive to solidify and potting transfer, thereby shortening the potting process time and improving the circuit board production efficiency. It is especially suitable for potting and encapsulating large-size PCBAs. Attached Figure Description

[0013] The accompanying drawings are provided to further understand the technical solution of this utility model and constitute a part of the specification. They are used together with the embodiments of this utility model to explain the technical solution of this utility model, and do not constitute a limitation on the technical solution of this utility model.

[0014] Figure 1 This is a schematic diagram of a PCBA potting dam structure provided in one embodiment of the present invention;

[0015] Figure 2 yes Figure 1 A schematic diagram of the decomposed structure;

[0016] Figure 3 This is an exploded structural diagram of a PCBA potting dam structure provided in another embodiment of the present invention;

[0017] Figure 4 This is a top view of a PCBA potting dam structure provided in one embodiment of the present invention;

[0018] Figure 5 yes Figure 4 An enlarged structural diagram of part A in the diagram;

[0019] Figure 6 This is a schematic diagram of the power module provided in one embodiment of the present invention. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0021] The embodiments of this utility model will be further described below with reference to the accompanying drawings.

[0022] like Figure 1 As shown, the PCBA potting dam structure provided in one embodiment of this utility model may include, but is not limited to:

[0023] PCBA100, bending insulation mechanism 200, and insulating baffle 300 are connected to the edge of PCBA100 by bending insulation mechanism 200 and insulating baffle 300 abutting against one side of PCBA100, so that the bending insulation mechanism 200 and insulating baffle 300 cooperate to form a closed dam for PCBA100. The bending insulation mechanism 200 and insulating baffle 300 can be, but are not limited to, using insulating film, which has good insulation effect and is easy to encapsulate, and is more suitable for the application scenario of this embodiment.

[0024] It can be seen that by setting the bending insulation mechanism 200 to be edge-fitted with PCBA100 and the insulating baffle 300 to abut against one side of PCBA100, a closed dam is formed for PCBA100 based on the cooperation of the bending insulation mechanism 200 and the insulating baffle 300, which replaces the dispensing dam in the relevant prior art. This not only effectively reduces the production cost of dispensing dam, but also eliminates the steps of waiting for the dam adhesive to solidify and the potting and transfer steps, thereby shortening the potting process time and improving the circuit board production efficiency. It is especially suitable for potting and encapsulating large-size circuit boards.

[0025] It should be noted that PCBA100 is usually made from a blank PCB board through SMT assembly or DIP insertion. That is, PCBA100 is basically similar to PCB in nature. Therefore, in this embodiment, in addition to being applicable to PCBA100, it is still applicable to PCB, which will not be elaborated here.

[0026] In one embodiment, such as Figure 1 , Figure 2 and Figure 3 As shown, the bending insulation mechanism 200 is open at the top and may include, but is not limited to, a first bending portion 210, a second bending portion 220, and a supporting bottom surface 230. The supporting bottom surface 230 is embedded and connected to the bottom of the PCBA100. The two sides of the supporting bottom surface 230 abut against the first bending portion 210 and the second bending portion 220, respectively. The first bending portion 210 is fitted and connected to one edge of the PCBA100, and the second bending portion 220 is fitted and connected to the other edge of the PCBA100. In other words, by matching and fitting the two bending portions to the two edges of the PCBA100, a barrier is formed relative to the PCBA100. Then, combined with the insulating baffle 300 abutting against one side of the PCBA100, a closed barrier is formed for the PCBA100.

[0027] In one embodiment, the first bent portion 210 and the second bent portion 220 can both be obtained by bending through pre-processing, but are not limited to.

[0028] In one embodiment, such as Figure 2 and Figure 3 As shown, the first bending portion 210 and the second bending portion 220 are symmetrically arranged with respect to the supporting bottom surface 230. This has the advantage of maintaining good relative stability of the first bending portion 210 and the second bending portion 220, and also helps to improve the overall stability of the bending insulation mechanism 200. Preferably, the angle between the supporting bottom surface 230 and the first bending portion 210 or the second bending portion 220 can be, but is not limited to, 90°, and can be controlled as much as possible within the angle range of 75° to 90°.

[0029] In one embodiment, the thickness of both the first bent portion 210 and the second bent portion 220 can be, but is not limited to, set to not less than 0.25 mm. In this case, the first bent portion 210 and the second bent portion 220 are preferably obtained by bending an insulating film.

[0030] In one embodiment, such as Figure 1 and Figure 2 As shown, the PCBA potting dam structure may also include, but is not limited to, a bottom shell 400 disposed below the bending insulation mechanism 200. The bottom shell 400 and the bending insulation mechanism 200 are connected to form an accommodating space to install the PCBA 100 within the accommodating space. It can be seen that...Figure 1 and Figure 2 The bending height of the first bending portion 210 and the second bending portion 220 on both sides of the bending insulation mechanism 200 shown is basically the same as the height of the two side housings of the bottom housing 400. This is to more accurately and stably match the bottom housing 400 and the bending insulation mechanism 200. In actual application scenarios, the height of the two side housings of the bottom housing 400 should be set to be no less than the bending height of the first bending portion 210 and the second bending portion 220.

[0031] In one embodiment, such as Figure 1 and Figure 2 As shown, the bottom housing 400 includes a mounting bottom surface 410 that abuts against the bottom of the bending insulation mechanism 200. The insulating baffle 300 includes an integrally connected upper bending portion 310 and a lower bottom portion 320. The upper bending portion 310 and the lower bottom portion 320 are perpendicular to each other. The upper bending portion 310 is limited to the PCBA100, and the lower bottom portion 320 is fixedly connected to the mounting bottom surface 410. It can be seen that by setting the upper bending portion 310 and the lower bottom portion 320 to be perpendicular, the upper bending portion 310 can achieve a 90° edge fit with the PCBA100 after installation when it is bent, thus ensuring the connection stability between the two.

[0032] In one embodiment, the lower bottom 320 can be fixedly connected to the mounting bottom surface 410 in various ways, and there is no limitation here. For example, but not limited to, an adhesive backing can be provided on the lower bottom 320, and then the lower bottom 320 can be adhered to the mounting bottom surface 410 by means of the adhesive backing, or a screw hole can be opened on the lower bottom 320, and then the lower bottom 320 can be fixedly connected to the mounting bottom surface 410 by means of screw holes and screws.

[0033] Preferably, the upper bend 310 can be obtained by bending an insulating film, but is not limited to, and its bending height can be, but is not limited to, not less than 1.2 times the potting thickness of PCBA100.

[0034] In one embodiment, such as Figure 4 and Figure 5 As shown, the first bend 210 and the second bend 220 intersect with the insulating baffle 300 to form the first intersection 500 and the second intersection 500, respectively. Figure 4 , Figure 5 Part A shown corresponds to one side of the first intersection point 500, and the other side is the opposite side of the second intersection point. The principle is the same, and this is to avoid redundancy. Figure 4 , Figure 5(The second intersection is not shown in the image). Both the first intersection 500 and the second intersection are fixed by applying adhesive, thereby ensuring good stability at the intersection of the first bending part 210, the second bending part 220 and the insulating baffle 300, and improving the overall installation stability of the first bending part 210, the second bending part 220 and the insulating baffle 300.

[0035] In addition, such as Figure 6 As shown, one embodiment of this utility model also discloses a power module 600, including a PCBA potting dam structure 700 as shown in any of the above embodiments.

[0036] The power module 600 provided in this embodiment of the present invention corresponds to the PCBA potting dam structure 700 and belongs to the same inventive concept. Therefore, the power module 600 also has the same embodiment and beneficial technical effects as the corresponding PCBA potting dam structure 700. Since the embodiment and beneficial technical effects of the PCBA potting dam structure 700 have been described in detail above, the embodiment and beneficial technical effects of the corresponding power module 600 will not be repeated here.

[0037] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A PCBA potting dam structure, characterized in that, It includes a PCBA, a bending insulation mechanism, and an insulating baffle. The bending insulation mechanism is attached to the edge of the PCBA, and the insulating baffle abuts against one side of the PCBA, so that the bending insulation mechanism and the insulating baffle cooperate to form a closed enclosure for the PCBA.

2. The PCBA potting dam structure according to claim 1, characterized in that, The bending insulation mechanism is open at the top and includes a first bending part, a second bending part, and a supporting bottom surface. The supporting bottom surface is embedded and connected to the bottom of the PCBA. The two sides of the supporting bottom surface abut against the first bending part and the second bending part, respectively. The first bending part is fitted and connected to one edge of the PCBA, and the second bending part is fitted and connected to the other edge of the PCBA.

3. The PCBA potting dam structure according to claim 1, characterized in that, It also includes a bottom housing disposed below the bending insulation mechanism, the bottom housing and the bending insulation mechanism being connected to form an accommodating space for mounting the PCBA in the accommodating space.

4. The PCBA potting dam structure according to claim 3, characterized in that, The bottom housing includes a mounting bottom surface that abuts against the bottom of the bending insulation mechanism. The insulating baffle includes an integrally connected upper bending portion and a lower bottom portion. The upper bending portion and the lower bottom portion are perpendicular to each other. The upper bending portion is limited and connected to the PCBA. The lower bottom portion is fixedly connected to the mounting bottom surface.

5. The PCBA potting dam structure according to claim 2, characterized in that, The first bent portion and the second bent portion are symmetrically arranged relative to the support bottom surface.

6. The PCBA potting dam structure according to claim 2, characterized in that, The first bend and the second bend intersect with the insulating baffle to form a first intersection and a second intersection, respectively, and both the first intersection and the second intersection are fixed by applying adhesive.

7. The PCBA potting dam structure according to claim 2, characterized in that, The thickness of both the first bend and the second bend is not less than 0.25 mm.

8. A power supply module, characterized in that, Includes the PCBA potting dam structure as described in any one of claims 1 to 7.

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