Battery device and electric device

Abstract

The application provides a battery device and a power utilization device. The battery device comprises a battery monomer group and a sampling assembly. The sampling assembly comprises a sampling chip and a circuit board. The sampling chip has a plurality of function pins. The circuit board comprises a plurality of connection lines and a plurality of voltage sampling parts. The function pins are connected to the voltage sampling parts through the connection lines, so as to be connected to voltage sampling points through the voltage sampling parts. In a first direction, voltage signals obtained by a plurality of first voltage sampling parts located on a first edge part on the circuit board increase. First voltage sampling pins in a plurality of function pin groups are arranged in a first spiral direction along a circumference of the sampling chip. In the first spiral direction, voltage signals obtained by the first voltage sampling pins increase. The first spiral direction is the same as the first direction in a tangent direction towards a side of the first edge part. The technical scheme provided by the application can reduce the setting cost and the process cost of the sampling system in the battery device.

Description

Technical Field

[0001] This application relates to the field of battery technology, and more specifically, to a battery device and an electrical device. Background Technology

[0002] Energy conservation and emission reduction are key to the sustainable development of the automotive industry, and electric vehicles, due to their energy-saving and environmentally friendly advantages, have become an important part of this sustainable development. For electric vehicles, battery technology is a crucial factor in their development.

[0003] In battery technology, to ensure the safety of battery devices, sampling units are typically installed within them. These units collect operational information to monitor the battery's condition. However, existing sampling units generally use multi-layered circuit boards, which are complex to manufacture and costly to produce. Utility Model Content

[0004] This application provides a battery device and an electrical device that can reduce the setup cost and manufacturing cost of the sampling system in the battery device.

[0005] This application is achieved through the following technical solution:

[0006] In a first aspect, embodiments of this application provide a battery device, which includes a battery cell group and a sampling component. The battery cell group includes multiple voltage sampling points. The sampling component includes a sampling chip and a circuit board. The sampling chip is connected to the circuit board and has multiple functional pins. The circuit board includes multiple connection lines and multiple voltage sampling sections. The functional pins are connected to the voltage sampling sections via the connection lines to connect to the voltage sampling points. The circuit board includes a first edge portion. The voltage sampling section includes multiple first voltage sampling sections located on the first edge portion. Along a first direction, the voltage signals acquired by the multiple first voltage sampling sections located on the first edge portion increase. The multiple functional pins include a first voltage sampling pin group, which includes multiple first voltage sampling pins. The first voltage sampling sections are connected to the first voltage sampling pins via connection lines. The first voltage sampling pins in the first voltage sampling pin group are arranged sequentially along a first spiral direction in the circumferential direction of the sampling chip. Along the first spiral direction, the voltage signals acquired by the first voltage sampling pins increase. The first spiral direction is the same as the first direction in the tangential direction towards the first edge portion.

[0007] In the technical solution of this application embodiment, the sampling component includes a sampling chip and a circuit board. The sampling chip has multiple functional pins, which are connected to different voltage sampling sections through connection lines on the circuit board, and connected to the voltage sampling points of the battery cell group through the voltage sampling sections. Multiple first voltage sampling sections are disposed on the first edge of the circuit board. The first voltage sampling sections are connected to the first voltage sampling pins through connection lines. By arranging the multiple first voltage sampling pins in the first voltage sampling pin group sequentially along a first spiral direction on the sampling chip, the voltage signal acquired by the first voltage sampling pins increases incrementally along the first spiral direction. Furthermore, the tangential direction of the first spiral direction towards the first edge is the same as the first direction. This facilitates the sequential connection of the multiple first voltage sampling pins to the multiple first voltage sampling sections of the first edge along the first spiral direction, resulting in a spiral distribution of the connection lines corresponding to the first voltage sampling pin group, reducing the likelihood of crossovers in the connection lines.

[0008] According to some embodiments of this application, multiple first voltage sampling pins are respectively numbered as different CIN X pins, where X is one of multiple different positive integers equal to 0 and greater than or equal to 1. Each of the multiple CIN X pins is selectively connected to multiple first voltage sampling units via connection lines. The CIN X pins of the multiple first voltage sampling pins are arranged sequentially along a first spiral direction in the circumferential direction of the sampling chip, and X of the CIN X pins increases sequentially along the first spiral direction. The tangential direction of the first spiral direction towards the first edge is the same as the first direction. This facilitates the sequential connection of the multiple CIN pins of the multiple first voltage sampling pins to the multiple first voltage sampling units of the first edge along the first spiral direction, so that the connection lines corresponding to the first CIN pin group are spirally distributed without crossing.

[0009] According to some embodiments of this application, the plurality of functional pins further includes a first DIS pin group, which includes a plurality of DIS Y pins. The Y value of the plurality of DIS Y pins is one of a plurality of different positive integers equal to 0 and greater than or equal to 1. Each of the plurality of DIS Y pins is selectively connected to a plurality of first voltage sampling units via connection lines. The plurality of DIS Y pins in the first DIS pin group are arranged sequentially along a first spiral direction in the circumferential direction of the sampling chip, and the Y value of the DIS Y pins increases sequentially along the first spiral direction. The tangential direction of the first spiral direction towards the first edge is the same as the first direction. This facilitates the sequential connection of the plurality of DIS Y pins in the first DIS pin group to the plurality of first voltage sampling units of the first edge along the first spiral direction, so that the connection lines corresponding to the first DIS pin group are spirally distributed without crossing.

[0010] According to some embodiments of this application, the multiple functional pins further include a first equalization circuit pin group, which includes multiple first equalization circuit pins. The first voltage sampling unit is connected to the first equalization circuit pins via a connection line. The first equalization circuit pins in the first equalization circuit pin group are arranged sequentially along a first spiral direction in the circumferential direction of the sampling chip. Furthermore, along the first spiral direction, the voltage signal acquired by the first equalization circuit pin increases. The first spiral direction is the same as the first direction in the tangential direction toward the first edge portion.

[0011] This allows multiple first equalization circuit pins in the first equalization circuit pin group to be sequentially connected to multiple first voltage sampling sections on the first edge along the first spiral direction, so that the connection lines connected to the first equalization circuit pin group are spirally distributed without crossing.

[0012] According to some embodiments of this application, the circuit board further includes a second edge portion, with the first edge portion and the second edge portion respectively distributed on opposite sides of the sampling chip; the second edge portion is provided with a plurality of second voltage sampling portions, and the voltage signals acquired by the plurality of second voltage sampling portions located on the second edge portion increase sequentially along the first direction. This ensures that the voltage sampling points of both the first edge portion and the second edge portion increase along the first direction, facilitating the connection of multiple battery cell series-parallel circuits arranged along the first direction.

[0013] According to some embodiments of this application, multiple functional pins include a second voltage sampling pin group, the second voltage sampling pin group includes multiple second voltage sampling pins, and the second voltage sampling part is connected to the second voltage sampling pins through a connection line; the second voltage sampling pins in the second voltage sampling pin group are arranged sequentially in the circumferential direction of the sampling chip along a second spiral direction, and the voltage signal acquired by the second voltage sampling pin increases along the second spiral direction, and the second spiral direction is the same as the first direction in the tangential direction toward the second edge portion.

[0014] This allows multiple second voltage sampling pins in the second voltage sampling pin group to be sequentially connected to multiple second voltage sampling sections on the second edge along the second spiral direction, so that the connection lines connected to the second voltage sampling pin group are spirally distributed without crossing.

[0015] According to some embodiments of this application, multiple functional pins include a second CIN pin group, which includes multiple CIN Z pins, where the Z value is different from the X value in the CIN X pin. Each of the multiple CIN Z pins is selectively connected to multiple second voltage sampling sections via connection lines. The CIN Z pins in the second CIN pin group are arranged sequentially along a second spiral direction in the circumferential direction of the sampling chip, and the Z value of the CIN Z pins increases sequentially along the second spiral direction. The second spiral direction is the same as the first direction in the tangential direction toward the second edge.

[0016] This allows multiple CIN pins in the second CIN pin group to be sequentially connected to multiple second voltage sampling sections on the second edge along the second spiral direction, so that the connection lines corresponding to the second CIN pin group are spirally distributed without crossing.

[0017] According to some embodiments of this application, multiple functional pins include a second equalization circuit pin group, the second equalization circuit pin group includes multiple second equalization circuit pins, and the second voltage sampling unit is connected to the second equalization circuit pins through a connection line; the second equalization circuit pins in the second equalization circuit pin group are arranged sequentially in the circumferential direction of the sampling chip along a second spiral direction, and the voltage signal acquired by the second equalization circuit pins increases along the second spiral direction, and the tangential direction of the second spiral direction toward the second edge is the same as the first direction.

[0018] This allows multiple second equalization circuit pins in the second equalization circuit pin group to be sequentially connected to multiple second voltage sampling sections on the second edge along the second spiral direction, so that the connection lines connected to the second equalization circuit pin group are spirally distributed without crossing.

[0019] According to some embodiments of this application, multiple functional pins include a second DIS pin group, which includes multiple DIS Q pins. The Q value is different from the Y value in the DIS Y pin. Each of the multiple DIS Q pins is selectively connected to multiple second voltage sampling sections via connection lines. The multiple DIS Q pins in the second DIS pin group are arranged sequentially along a second spiral direction in the circumferential direction of the sampling chip. Furthermore, along the second spiral direction, the Q value of the DIS Q pins increases sequentially. The second spiral direction is the same as the first direction in the tangential direction toward the second edge.

[0020] This allows multiple DIS Q pins in the second DIS pin group to be sequentially connected to multiple second voltage sampling sections on the second edge along the second spiral direction, so that the connection lines corresponding to the second DIS pin group are spirally distributed without crossing.

[0021] According to some embodiments of this application, the first spiral direction and the second spiral direction are opposite. Based on the fact that the plurality of first voltage sampling sections located on the first edge and the plurality of second voltage sampling sections located on the second edge are sequentially increased along the first direction, it is convenient to arrange the connection lines of the two sets of pin groups, which are respectively connected to the first edge and the second edge, in a spiral shape along the first spiral direction and the second spiral direction, so that the connection lines of the two sets of pin groups do not interfere with each other.

[0022] According to some embodiments of this application, the battery cell group includes a negative output terminal and a positive output terminal. The voltage sampling point for sampling the voltage signal of the negative output terminal is numbered 0, and the voltage sampling point for sampling the voltage signal of the positive output terminal is numbered N. Along the current direction from the negative output terminal to the positive output terminal of the battery cell group, the numbers of multiple voltage sampling points are sequentially increased from 0 to N, where N is a positive integer. The circuit board also includes a second edge portion, which is provided with multiple second voltage sampling portions. The first edge portion and the second edge portion are respectively distributed on opposite sides of the sampling chip. The sampling chip also includes a second voltage sampling pin group, which includes multiple second voltage sampling pins. The second voltage sampling portions are connected to the second voltage sampling pins through connection lines. At least a portion of the voltage sampling points numbered odd are connected to the first voltage sampling pins, and at least a portion of the voltage sampling points numbered even are connected to the second voltage sampling pins. The first voltage sampling pin group and the second voltage sampling pin group are arranged at intervals along the circumference of the sampling chip.

[0023] This allows the voltage sampling pins located on different sides of the sampling chip to be connected to the voltage sampling sections on different edges of the circuit board, and ensures that the connection lines connected to the first voltage sampling pin group do not interfere with the connection lines connected to the second voltage sampling pin group.

[0024] According to some embodiments of this application, the first voltage sampling pin group and the second voltage sampling pin group are located on different sides of the sampling chip. This allows the sampling chip to make full use of the functional pins on different sides of the sampling chip, enabling the sampling chip to be designed to be smaller and occupy less area on the circuit board, thereby reducing the impact on the layout of connection lines.

[0025] According to some embodiments of this application, multiple sampling components are connected to the same battery cell group. This reduces the number of battery cells that each sampling component needs to connect to, and simplifies the process of arranging connection lines on the circuit board of each sampling component to prevent the connection lines from crossing.

[0026] According to some embodiments of this application, multiple sampling components are arranged along a first direction. Each sampling chip includes communication pins, and the communication pins of two adjacent sampling chips along the first direction are connected via wires independently formed on the circuit board. This allows multiple sampling components to be independently formed before being connected, and the communication wires can be arranged without additional space on the circuit board, simplifying the arrangement of non-intersecting connection lines on the circuit board.

[0027] According to some embodiments of this application, two adjacent sampling chips along a first direction include a first sampling chip and a second sampling chip. The first sampling chip includes two first communication pins, and the second sampling chip includes two second communication pins. The wires include a first wire and a second wire, which are respectively used to connect a first communication pin and a second communication pin, forming a twisted pair. Using a twisted pair for communication between adjacent sampling chips enables stronger anti-interference capabilities for signals transmitted between the sampling chips.

[0028] According to some embodiments of this application, multiple sampling components are arranged along a first direction, and two adjacent sampling chips along the first direction communicate wirelessly. This eliminates the need for additional communication wires between the two sampling chips, thus avoiding the use of space on the circuit board for wiring and eliminating the need for additional physical wire connections.

[0029] According to some embodiments of this application, the battery device further includes a main control board, and the sampling chip of at least one sampling component includes a first communication pin for connecting to the main control board. The sampling chip can directly connect to the main control board for signal transmission, instead of first transmitting to a slave control board and then to the main control board. This reduces the number of transmission steps and connection nodes, thereby improving the efficiency and reliability of signal transmission.

[0030] According to some embodiments of this application, multiple sampling components are arranged along a first direction, and the battery cell group includes a first battery cell and a second battery cell located at opposite ends along the first direction; at least one sampling component is connected to at least one of the first battery cell and the second battery cell to perform temperature sampling. This allows for monitoring of the battery cells located at the ends of the battery cell group when monitoring the battery temperature, resulting in more accurate temperature difference detection of the entire battery cell group.

[0031] According to some embodiments of this application, the first battery cell is connected to the one with the shortest distance among the multiple sampling components, and / or the second battery cell is connected to the one with the shortest distance among the multiple sampling components. This makes the connection line used for temperature sampling of the first or second battery cell as short as possible, so that the connection line used for temperature sampling of the first or second battery cell does not need to cross other sampling components, thus avoiding interference with the wiring layout of other sampling components.

[0032] According to some embodiments of this application, a plurality of sampling components arranged along a first direction are included in the same battery cell group. The sampling components located at both ends along the first direction are respectively a first sampling component and a second sampling component. The distance between the first sampling component and the first battery cell is less than the distance between the second sampling component and the first battery cell, and the distance between the second sampling component and the second battery cell is less than the distance between the first sampling component and the second battery cell. The first sampling component is connected to the first battery cell to perform temperature sampling, and / or the second sampling component is connected to the second battery cell to perform temperature sampling.

[0033] The connection lines used for temperature sampling of the first or second battery cell are made as short as possible, so that the connection lines used for temperature sampling of the first or second battery cell do not need to cross other sampling components, thus avoiding interference with the wiring layout of other sampling components.

[0034] According to some embodiments of this application, a battery cell group includes a first subgroup and a second subgroup, both of which include a portion of the battery cells in the battery cell group; the first subgroup includes a first battery cell, and the second subgroup includes a second battery cell, with the number of battery cells in the first and second subgroups being equal; a first sampling component includes a first circuit board, a first sampling chip, and a first temperature sensing element, the first sampling chip being disposed on the first circuit board and electrically connected to a plurality of voltage sampling points on the first subgroup via the first circuit board, and the first temperature sensing element being connected to the first battery cell to collect the temperature of the first battery cell; a second sampling component includes a second circuit board, a second sampling chip, and a second temperature sensing element, the second sampling chip being disposed on the second circuit board and electrically connected to a plurality of voltage sampling points on the second subgroup via the second circuit board, and the second temperature sensing element being connected to the second battery cell to collect the temperature of the second battery cell.

[0035] Both the first and second subgroups include a portion of multiple battery cells. The first subgroup includes first battery cells, and the second subgroup includes second battery cells. The number of battery cells in the first and second subgroups is equal, meaning the number of battery cells sampled by the first and second sampling components is equal. The circuit boards in the first and second sampling components can be manufactured using standard parts, facilitating mass production. The first sampling chip is electrically connected to multiple voltage sampling points on the first subgroup via the first circuit board. The first sampling chip can collect voltage information from multiple battery cells in the first subgroup. The first temperature sampling element is connected to the first battery cell to collect its temperature. Similarly, the second sampling chip is electrically connected to multiple voltage sampling points in the second subgroup via the second circuit board. The second sampling chip can collect voltage information from multiple battery cells in the second subgroup. The second temperature sampling element is connected to the second battery cell to collect its temperature.

[0036] According to some embodiments of this application, the first sampling chip and the first temperature sensing element are both disposed on the first circuit board; the second sampling chip and the second temperature sensing element are both disposed on the second circuit board; the first sampling chip is disposed at the same position on the first circuit board and the second sampling chip is disposed at the same position on the second circuit board; the first temperature sensing element is disposed at a different position on the first circuit board and the second temperature sensing element is disposed at a different position on the second circuit board.

[0037] Both the first sampling chip and the first temperature sensing element are mounted on the first circuit board. The first circuit board not only enables electrical connections between the first sampling chip and the voltage sampling points in the first subgroup, as well as between the first sampling chip and the first temperature sensing element, but also provides support for the first sampling chip and the first temperature sensing element, resulting in higher stability and reliability. Similarly, both the second sampling chip and the second temperature sensing element are mounted on the second circuit board. The second circuit board not only enables electrical connections between the second sampling chip and the voltage sampling points in the second subgroup, as well as between the second sampling chip and the second temperature sensing element, but also provides support for the second sampling chip and the second temperature sensing element, resulting in higher stability and reliability. The first sampling chip is positioned at the same location relative to the first subgroup as the second sampling chip relative to the second subgroup. When installing the first and second temperature sensing elements, the first and second circuit boards serve as reference points for their installation positions, respectively, facilitating rapid assembly of the first and second temperature sensing elements.

[0038] According to some embodiments of this application, the first circuit board and the second circuit board are the same circuit board, and each circuit board has multiple connection areas in different positions; the first temperature sensing element is selectively connected to one of the multiple connection areas of the first circuit board, and the second temperature sensing element is selectively connected to the other of the multiple connection areas of the second circuit board.

[0039] The first and second circuit boards can be produced as standard parts using the same set of production molds, which facilitates mass production and reduces manufacturing costs. By setting multiple connection areas at different locations on the circuit boards, the placement of the first and second temperature sensors can be achieved simply by selecting different connection areas on the circuit board according to requirements. This allows the first temperature sensor to be positioned differently on the first circuit board and the second temperature sensor to be positioned differently on the second circuit board, resulting in higher installation efficiency for both temperature sensors.

[0040] According to some embodiments of this application, the first circuit board includes a first main body and a first cantilever, a first sampling chip is disposed on the first main body, one end of the first cantilever is connected to the first main body, and a first temperature sampling element is disposed on the other end of the first cantilever; and / or, the second circuit board includes a second main body and a second cantilever, a second sampling chip is disposed on the second main body, one end of the second cantilever is connected to the second main body, and a second temperature sampling element is disposed on the other end of the second cantilever.

[0041] The first sampling chip is disposed on the first main body. The first cantilever is a cantilever structure protruding beyond the edge of the first main body. The first circuit board does not need to cover the open area around the first cantilever; it only needs to extend beyond the first main body for the first temperature sampling element to be installed, thus saving the area of ​​the first circuit board and reducing its manufacturing cost. And / or, the second circuit board includes a second main body and a second cantilever. The second sampling chip is disposed on the second main body. The second cantilever is a cantilever structure protruding beyond the edge of the second main body. The second circuit board does not need to cover the open area around the second cantilever; it only needs to extend beyond the second main body for the second temperature sampling element to be installed, thus saving the area of ​​the second circuit board and reducing its manufacturing cost.

[0042] According to some embodiments of this application, the first cantilever portion and / or the second cantilever portion are bent structures.

[0043] The first cantilever section adopts a bent structure, which can bend and deform relative to the first main body under external force. On the one hand, when installing the first temperature sensor, there may be an installation deviation between the position of the first cantilever section and the temperature sampling position of the first battery cell in the first subgroup. The bending deformation of the first cantilever section can adjust its position relative to the first main body, aligning the first temperature sensor with the temperature sampling position in the first subgroup, thus facilitating precise installation. On the other hand, during the operation of the battery cell group, the battery cells in the first subgroup will expand and deform. The first cantilever section adapts to the expansion and deformation of the battery cells through its bending structure, ensuring that the first temperature sensor on the first cantilever section is always thermally connected to the temperature sampling position corresponding to the first battery cell, reducing the impact of the battery cell's expansion and deformation on the sampling accuracy of the first temperature sensor. And / or, the second cantilever portion adopts a bent structure. Under external force, the second cantilever portion can bend and deform relative to the second main body. On one hand, when installing the second temperature sensor, there may be an installation deviation between the position of the second cantilever portion and the temperature sampling position of the second battery cell in the second subgroup. The bending deformation of the second cantilever portion can adjust its position relative to the second main body, aligning the second temperature sensor with the temperature sampling position in the second subgroup, thus facilitating precise installation. On the other hand, during the operation of the battery cell group, the battery cells in the second subgroup will expand and deform. The second cantilever portion, through its bending structure, adapts to the amount of expansion and deformation of the battery cells, ensuring that the second temperature sensor on the second cantilever portion is always thermally connected to the temperature sampling position corresponding to the second battery cell, reducing the impact of the battery cell's expansion and deformation on the sampling accuracy of the second temperature sensor.

[0044] According to some embodiments of this application, the first temperature sensing element is integrated into the first sampling chip, and the second temperature sensing element is integrated into the second sampling chip; the first sampling chip is located at a different position on the first circuit board and the second sampling chip is located at a different position on the second circuit board.

[0045] The first temperature sensing element is integrated into the first sampling chip, enabling the first sampling chip to collect temperature information of the first battery cell in the first subgroup through the first temperature sensing element. This occupies less space and eliminates the need for separate connection lines between the first sampling chip and the first temperature sensing element on the first circuit board, resulting in higher integration of the first sampling unit. Similarly, the second temperature sensing element is integrated into the second sampling chip, enabling the second sampling chip to collect temperature information of the second battery cell in the second subgroup through the second temperature sensing element. This also occupies less space and eliminates the need for separate connection lines between the second sampling chip and the second temperature sensing element on the second circuit board, resulting in higher integration of the second sampling component.

[0046] According to some embodiments of this application, the first circuit board and the second circuit board are identical circuit boards, each circuit board having multiple mounting areas in different positions. A first sampling chip is selectively mounted in one of the multiple mounting areas of the first circuit board, and a second sampling chip is selectively mounted in another of the multiple mounting areas of the second circuit board. Since the first and second circuit boards are identical, they can be produced as standard parts using the same set of production molds, which facilitates mass production and reduces manufacturing costs. By pre-setting multiple mounting areas in different positions on the circuit board, the placement of the first and second sampling chips only requires selecting different mounting areas on the circuit board according to requirements, thus achieving different placement positions for the first and second sampling chips on the first and second circuit boards, respectively, resulting in higher installation efficiency.

[0047] According to some embodiments of this application, the sampling chip integrates at least one of a filtering component and an equalization component. The filtering component and / or equalization component are jointly integrated within the sampling chip. This reduces the number of peripheral devices and the space occupied by them, increases the energy density of the battery device, and reduces the impact of environmental factors such as moisture and solder slag on the filtering component and / or equalization component, thus slowing down the aging rate of the components and improving the reliability and stability of the battery device.

[0048] According to some embodiments of this application, the sampling chip includes a package frame and a die, with a filtering component integrated on the die, and / or an equalization component integrated between the die and the package frame. This approach offers several advantages: firstly, integrating the filtering component into the die reduces the sampling chip area and increases device integration density; secondly, placing the equalization component between the die and the package frame facilitates matching the circuit structure and / or device model of the equalization component to different application scenarios, and reduces the impact of heat generated by the equalization component on the overall heat dissipation of the sampling chip.

[0049] According to some embodiments of this application, the connection line includes a first connection line and a second connection line. The first connection line includes at least one break structure, which includes a first connection point, a second connection point, and an interval region located between the first connection point and the second connection point. The second connection line passes through the interval region. The sampling component also includes a connection device, with its two ends connected to the first connection point and the second connection point, respectively.

[0050] Where some connecting lines need to cross each other by projection, one of the lines can be made into a break structure, and the other line can pass through the gap area of ​​the break structure to avoid the two lines crossing and interfering with each other's signal transmission. Connecting devices (such as zero-ohm devices) are used to connect the two ends of the broken line so that the signal to be transmitted by the line can be transmitted normally.

[0051] According to some embodiments of this application, in the same projection plane perpendicular to the thickness direction of the circuit board, the orthographic projections of all connection lines connected to different sampling sections do not overlap. This non-overlapping orthographic projection means that there is no line crossing or partial overlap among the connection lines on the circuit board connected to different sampling sections. This allows for a circuit board structure of insulating layer-line layer-insulating layer, eliminating the need for multiple alternating insulating and line layers and the need for cross-layer connection processes. This results in lower material and process costs, a simpler molding scheme, and higher sampling reliability.

[0052] According to some embodiments of this application, the circuit board includes two insulating cover films and a conductive layer sandwiched between the two insulating cover films, with all connection lines formed on the conductive layer. Without the lines intersecting, all lines can be formed on the conductive layer, eliminating the need for additional conductive layers and allowing all lines to be formed on the same conductive layer at once, thus reducing the material used in the conductive layer and lowering the manufacturing cost of the circuit.

[0053] According to some embodiments of this application, at the location of the voltage sampling section, at least one of the two insulating cover films has a window to expose at least a portion of the conductive layer. The sampling section is soldered to the sampling point through the portion of the conductive layer exposed in the insulating cover film. Based on a single conductive layer, it is easier for the circuit board to form pads and connect to the sampling point by opening windows in the insulating cover film, making the connection process simpler.

[0054] According to some embodiments of this application, the conductive layer is formed into connection lines using a die-cutting or etching process. Based on a single conductive layer, die-cutting or etching can form all connection lines in one step, simplifying the connection line forming process and saving costs.

[0055] According to some embodiments of this application, at least one sampling component is used to sample multiple battery cells. This allows one sampling chip to connect to multiple battery cells simultaneously for sampling, improving the utilization rate of the sampling chip and reducing the number of sampling chips to lower costs.

[0056] According to some embodiments of this application, at least one sampling component is used to sample 2-20 individual battery cells. This ensures that the number of connection lines required in the same sampling component is not excessive, and that the number of pins connected on the same sampling chip is not insufficient, thus reducing the number of chips used while addressing the challenge of preventing cross-connection of connection lines.

[0057] According to some embodiments of this application, a battery cell pack includes multiple battery cells. Each battery cell includes a casing, a first terminal, and a second terminal. The first and second terminals have opposite polarities and are located on a first wall of the casing, at opposite ends of the first wall. A sampling component is located on the first wall, and a sampling chip is located between the first and second terminals. When the first and second terminals are located on opposite sides of the sampling chip, the sampling units can also be located on opposite sides of the sampling chip, facilitating the connection of functional pins on the sampling chip to the sampling units on both sides for detecting the electrical signals of the first and second terminals.

[0058] According to some embodiments of this application, a battery cell pack includes multiple battery cells. Each battery cell includes a casing, a first terminal, and a second terminal. The first and second terminals have opposite polarities and are located on a first wall of the casing. The maximum dimension of the first wall along its length is greater than its maximum dimension along its width. The first and second terminals are located at one end of the first wall along its length, and a sampling chip is located on the same side of the first and second terminals along their length. When both the first and second terminals are located at one end of the first wall along its length, there may not be enough space between them to accommodate the sampling assembly. The sampling assembly can be positioned on the same side of the first and second terminals, and the sampling units can also be positioned on the same side of the sampling chip to detect the electrical signals of the first and second terminals.

[0059] According to some embodiments of this application, a battery cell group includes multiple battery cells. Each battery cell includes a housing, a first terminal and a second terminal. The first terminal and the second terminal have opposite polarities. The maximum dimension of the battery cell along its length is greater than the maximum dimension along its width and the maximum dimension along its height. The housing includes a first wall and a second wall disposed opposite to each other along its length. The first terminal is located on the first wall, and the second terminal is located on the second wall. The first terminal is electrically conductive to the housing. A sampling component is disposed on the second wall, and at least one voltage sampling point is used to collect the electrical signal of the housing.

[0060] When the first and second poles are located on two different side walls of the housing, if the circuit board is extended directly to the vicinity of the first and second poles to collect electrical signals, a longer circuit board is required. Instead, the electrical signal from one pole can be transmitted to the vicinity of the other pole by using the housing to conduct the collection of electrical signals from both poles. This makes it easier to set up the sampling component at that location to collect the electrical signals from both poles, thus saving material costs.

[0061] According to some embodiments of this application, a battery cell assembly includes multiple battery cells. Each battery cell includes a housing, a first terminal, and a second terminal. The first and second terminals have opposite polarities. The housing includes two opposing first walls, which are the surface walls with the largest area. The second and third walls are respectively adjacent to the first walls. The first terminal is located on one of the first walls, and the second terminal is located on the other first wall. The maximum dimension of the battery cell along its length is greater than the maximum dimension of the battery cell along its width and height. The first and second terminals are respectively located at both ends of the battery cell along its length. The first terminal is electrically connected to the housing. A sampling component is located on the wall where the second terminal is located. Furthermore, at least one voltage sampling point is used to collect the electrical signal of the housing.

[0062] When the first and second poles are located on two opposite side walls of the housing, if the circuit board is extended directly to the vicinity of the first and second poles to collect electrical signals, a longer circuit board is required. Instead, the electrical signal from one pole can be transmitted to the vicinity of the other pole by using the housing to conduct the collection of electrical signals from both poles. This makes it easier for the sampling component to be set up at that location to collect the electrical signals from both poles, thus saving material costs.

[0063] According to some embodiments of this application, the battery cell pack includes multiple cylindrical battery cells. Each cylindrical battery cell includes a housing, a first terminal and a second terminal. The first terminal and the second terminal have opposite polarities. The first terminal and the second terminal are respectively disposed at both ends of the cylindrical housing along the axial direction. The first terminal and the housing are electrically connected. A sampling component is located on the end face where the second terminal is located. Furthermore, at least one voltage sampling point is used to collect the electrical signal of the housing.

[0064] Since the end face area of ​​the battery cell is small, the positive and negative terminals can be arranged on the two opposite end faces of the cylindrical battery cell, and the casing is electrically connected to one of the terminals, so that the sampling component can be arranged on the end face where the other terminal is located to collect the electrical signals of the two terminals at the same time.

[0065] According to some embodiments of this application, the battery cell pack includes multiple cylindrical battery cells. Each cylindrical battery cell includes a housing, a first terminal and a second terminal. The first terminal and the second terminal are located on the same end face. A sampling component is located on the end face where the first terminal and the second terminal are located. A sampling chip is located on the same side of the first terminal and the second terminal.

[0066] When the positive and negative terminals of a cylindrical battery cell are located on the same end face, the sampling component can also be arranged on the end face where the positive and negative terminals are located to collect the electrical signals of the two terminals.

[0067] Secondly, embodiments of this application also provide an electrical device, which includes the battery device of any of the foregoing embodiments, and the electrical device is used to provide electrical energy.

[0068] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0069] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0070] Figure 1 This application provides structural schematic diagrams of vehicles for some embodiments;

[0071] Figure 2 This is an exploded view of the battery device provided in some embodiments of this application;

[0072] Figure 3 An exploded schematic diagram of a single battery cell in a battery device provided in some embodiments of this application;

[0073] Figure 4 This is a schematic diagram of the structure of a sampling component (voltage sampling point located on one side) in a battery device provided in some embodiments of this application;

[0074] Figure 5 for Figure 4 A schematic diagram of the functional pin distribution on the upper part of the mid-sampling chip;

[0075] Figure 6 This is a schematic diagram of a battery device with the voltage sampling point located on one side, provided in some embodiments of this application.

[0076] Figure 7 This is a schematic diagram of the structure of a sampling component (voltage sampling points are located on both sides) in a battery device provided in some embodiments of this application;

[0077] Figure 8 for Figure 7 A schematic diagram of the functional pin distribution on the upper part of the mid-sampling chip;

[0078] Figure 9A schematic diagram of the connection line layout when the sampling points are distributed on both sides of the circuit board, as provided in some embodiments of this application;

[0079] Figure 10 for Figure 9 A schematic diagram of the functional pin distribution on the upper part of the mid-sampling chip;

[0080] Figure 11 A schematic diagram illustrating the structure of a battery device in which multiple sampling components cooperate with a battery cell assembly, provided in some embodiments of this application;

[0081] Figure 12 for Figure 11 Explosion diagram of the battery device;

[0082] Figure 13 This application provides a schematic diagram of the communication connection between adjacent sampling components according to some embodiments;

[0083] Figure 14 A schematic diagram illustrating the communication connection between multiple sampling components and the main control board in a battery device provided in some embodiments of this application;

[0084] Figure 15 This is a schematic diagram showing the distribution of multiple connection areas on a circuit board in a sampling component provided in some embodiments of this application;

[0085] Figure 16 This is a schematic diagram of the structure of the first sampling component in a battery device provided in some embodiments of this application;

[0086] Figure 17 This is a schematic diagram of the structure of the second sampling component in a battery device provided in some embodiments of this application;

[0087] Figure 18 A schematic diagram showing the distribution of multiple mounting areas on a circuit board in a battery device provided in some embodiments of this application;

[0088] Figure 19 A schematic diagram of a filtering component and an equalization component on a sampling chip provided in some embodiments of this application;

[0089] Figure 20 A schematic diagram showing the distribution of filtering and equalization components on a sampling chip according to some embodiments of this application;

[0090] Figure 21 A schematic diagram of the filtering component of a sampling chip provided in some embodiments of this application;

[0091] Figure 22 A schematic diagram showing the distribution of interconnecting lines on a circuit board according to some embodiments of this application;

[0092] Figure 23A schematic diagram illustrating the connection between the circuit board and the sampling point (busbar) provided in some embodiments of this application;

[0093] Figure 24 This application provides schematic diagrams of the structure of a sampling component in a battery device containing peripheral devices, as shown in some embodiments.

[0094] Figure 25 A schematic diagram illustrating the connection between the sampling component and the voltage sampling point of the battery cell group in a battery device provided in other embodiments of this application;

[0095] Figure 26 Schematic diagram of the sampling components provided in other embodiments of this application, applicable to blade batteries;

[0096] Figure 27 This is a schematic diagram of the sampling component provided in some embodiments of this application, applicable to cylindrical batteries.

[0097] Icons: 1000 - Vehicle; 100 - Battery Unit; 200 - Controller; 300 - Motor; 10 - Housing; 11 - First Sub-Housing; 12 - Second Sub-Housing; 20 - Battery Cell Pack; 21 - Battery Cell; 211 - Housing; 212 - End Cap; 213 - First Wall; 214 - First Terminal; 215 - Second Terminal; 216 - Electrode Assembly; 217 - Second Wall; 22 - First Sub-Group; 221 - First Battery Cell; 23 - Second Sub-Group; 231 - Second Battery Cell; 24 - Third Sub-Group; 25 - Voltage Sampling Point with Odd Number; 26 - Voltage sampling points numbered evenly; 27 - Voltage sampling points; 30 - Sampling components; 31 - Circuit board; 311 - First edge portion; 312 - Second edge portion; 313 - Voltage sampling section; 3131 - First voltage sampling section; 3132 - Second voltage sampling section; 314 - Connecting lines; 3141 - First connecting line; 3142 - Second connecting line; 3143 - Connecting devices; 315 - Insulating cover film; 316 - Conductive layer; 32 - Sampling chip; 321 - Functional pin; 3211 - First voltage sampling pin group; 32111 - First voltage sampling Pins; 3212 - First equalization circuit pin group; 32121 - First equalization circuit pin; 3213 - Second voltage sampling pin group; 32131 - Second voltage sampling pin; 3214 - Second equalization circuit pin group; 32141 - Second equalization circuit pin; 3215 - First side; 3216 - Second side; 3217 - Third side; 3218 - Fourth side; 33 - First sampling component; 331 - First sampling chip; 3311 - First wire; 332 - First temperature sensing element; 333 - First circuit board; 3331 - First main body; 3 332-First cantilever section; 3333-Connection area; 3334-Mounting area; 34-Second sampling component; 341-Second sampling chip; 3411-Second wire; 342-Second temperature sensing element; 343-Second circuit board; 3431-Second main body section; 3432-Second cantilever section; 35-Peripheral device; 36-Third sampling component; 40-Bus unit; 41-First busbar; 42-Second busbar; 50-Isolation plate; 60-Main control board; X-First direction; Y-Second direction; S-First spiral direction; T-Second spiral direction; P-Tangential direction. Detailed Implementation

[0098] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0099] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the description, claims, and accompanying drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy.

[0100] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0101] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0102] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0103] In this application, "multiple" refers to two or more (including two), and similarly, "multiple groups" refers to two or more (including two), and "multiple pieces" refers to two or more (including two).

[0104] The battery apparatus mentioned in the embodiments of this application may include one or more battery cell assemblies for providing voltage and capacity. A battery cell assembly may include multiple battery cells connected in series, parallel, or mixed connections via a busbar.

[0105] In some embodiments, a battery cell assembly is typically formed by arranging multiple battery cells; as an example, a battery cell assembly can be a battery module, which is formed by arranging and fixing multiple battery cells together to form a single module. As an example, a battery module can be formed by bundling multiple battery cells together with cable ties.

[0106] In some embodiments, the battery device may be a battery pack, which includes a housing and one or more individual battery cells housed within the housing.

[0107] As an example, the battery cell assembly can be a battery module, which can be housed in a housing by fixing the battery module in the housing.

[0108] As an example, battery cell assemblies can also be housed in a housing by directly fixing multiple battery cells to the housing.

[0109] In some embodiments, the housing may be part of the vehicle's chassis structure. For example, a portion of the housing may be at least a part of the vehicle's floor, or a portion of the housing may be at least a part of the vehicle's crossbeams and longitudinal beams.

[0110] In some embodiments, the battery device may be an energy storage device. Energy storage devices include energy storage containers, energy storage cabinets, etc.

[0111] In this embodiment of the application, the battery cell can be a secondary battery, which refers to a battery cell that can be recharged to activate the active materials and continue to be used after the battery cell has been discharged.

[0112] The battery cell may be, but is not limited to, lithium-ion battery, sodium-ion battery, sodium-lithium-ion battery, lithium metal battery, sodium metal battery, lithium-sulfur battery, magnesium-ion battery, nickel-metal hydride battery, nickel-cadmium battery, lead-acid battery, etc.

[0113] A single battery cell typically includes an electrode assembly. The electrode assembly includes a positive electrode, a negative electrode, and a separator. During the charging and discharging process of a single battery cell, active ions (such as lithium ions) repeatedly insert and extract between the positive and negative electrodes. The separator, positioned between the positive and negative electrodes, prevents short circuits while allowing active ions to pass through.

[0114] In some embodiments, the positive electrode may be a positive electrode sheet, which may include a positive electrode current collector and a positive electrode active material disposed on at least one surface of the positive electrode current collector.

[0115] As an example, the positive current collector has two surfaces opposite each other in its own thickness direction, and the positive active material is disposed on either or both of the two opposite surfaces of the positive current collector.

[0116] As an example, the positive electrode current collector can be a metal foil or a composite current collector. For example, as a metal foil, it can be made of stainless steel, copper, aluminum, carbon electrodes, carbon, nickel, or titanium with a silver-plated surface. The composite current collector may include a polymer material base layer and a metal layer. The composite current collector can be formed by forming a metal material (aluminum, aluminum alloy, nickel, nickel alloy, titanium, titanium alloy, silver, and silver alloy, etc.) on a polymer material substrate (such as a substrate of polypropylene, polyethylene terephthalate, polybutylene terephthalate, polystyrene, polyethylene, etc.).

[0117] As an example, the positive electrode active material may include at least one of the following materials: lithium phosphate, lithium transition metal oxide, and their respective modified compounds. However, this application is not limited to these materials, and other conventional materials that can be used as positive electrode active materials for battery cells may also be used.

[0118] In some embodiments, the negative electrode may be a negative electrode sheet, and the negative electrode sheet may include a negative electrode current collector.

[0119] As an example, the negative electrode current collector can be a metal foil or a composite current collector. For example, as a metal foil, it can be aluminum with a silver-plated surface, stainless steel with a silver-plated surface, copper, aluminum, carbon electrode, carbon, nickel, or titanium, etc.

[0120] In some embodiments, the negative electrode current collector has two surfaces opposite each other in its own thickness direction, and the negative electrode active material is disposed on either or both of the two opposite surfaces of the negative electrode current collector.

[0121] As an example, the negative electrode active material may be a negative electrode active material known in the art for use in battery cells. As an example, the negative electrode active material may include at least one of the following materials: artificial graphite, natural graphite, soft carbon, hard carbon, silicon-based materials, tin-based materials, and lithium titanate, etc. Silicon-based materials may be selected from at least one of elemental silicon, silicon oxide compounds, silicon-carbon composites, silicon-nitrogen composites, and silicon alloys. Tin-based materials may be selected from at least one of elemental tin, tin oxide compounds, and tin alloys. However, this application is not limited to these materials, and other conventional materials that can be used as negative electrode active materials in battery cells may also be used. These negative electrode active materials may be used alone or in combination of two or more.

[0122] In some embodiments, the diaphragm is a separator membrane. This application does not impose any particular limitation on the type of separator membrane; any known porous separator membrane with good chemical and mechanical stability can be selected.

[0123] As an example, the main material of the separator can be selected from at least one of glass fiber, non-woven fabric, polyethylene, polypropylene, polyvinylidene fluoride, and ceramic. The separator can be a single-layer film or a multi-layer composite film, without particular limitation. When the separator is a multi-layer composite film, the materials of each layer can be the same or different, without particular limitation. The separator can be a separate component located between the positive and negative electrodes, or it can be attached to the surfaces of the positive and negative electrodes.

[0124] In some embodiments, the membrane is a solid electrolyte. The solid electrolyte is disposed between the positive and negative electrodes, serving both to transport ions and to isolate the positive and negative electrodes.

[0125] In some implementations, the electrode assembly is a wound structure. The positive and negative electrode sheets are wound into a wound structure.

[0126] In some implementations, the electrode assembly is a stacked structure.

[0127] In some embodiments, the battery cell may include a housing. The housing is used to encapsulate components such as electrode assemblies and electrolytes. The housing may be made of steel, aluminum, plastic (such as polypropylene), composite metal (such as copper-aluminum composite), or aluminum-plastic film, etc.

[0128] In some embodiments, the housing includes an end cap and a casing, the casing having an opening, and the end cap closing the opening to form a sealed space for accommodating substances such as electrode assemblies and electrolytes. The casing may have one or more openings. The end cap may also be provided one or more times.

[0129] In some embodiments, at least one electrode terminal is provided on the housing, and the electrode terminal is electrically connected to the tab of the electrode assembly. The electrode terminal can be directly connected to the tab or indirectly connected to the tab through a current collector. The electrode terminal can be provided on the end cap or on the housing.

[0130] In some implementations, an explosion-proof valve is provided on the housing. The explosion-proof valve is used to release the internal pressure of the battery cells.

[0131] As an example, the battery cell can be a cylindrical battery cell, a prismatic battery cell, a pouch battery cell, or a battery cell of other shapes. Prismatic battery cells include prismatic battery cells, blade-shaped battery cells, and multi-prismatic batteries, such as hexagonal prismatic batteries. There are no particular limitations in the embodiments of this application.

[0132] In battery technology, the sampling unit in a battery device typically includes a BMS signal processing board and a signal collection board. The BMS signal processing board is located on one side of the battery cell array, where multiple battery cells are arranged, while the signal collection board is located on the side above the busbar in the battery cell array. The signal collection board only collects voltage and / or temperature signals from the battery cell array. After collecting the signals from the battery cell array, the signal collection board transmits them to the BMS signal processing board. The chips in the BMS signal processing board perform preliminary processing on the signals transmitted by the signal collection board, and finally transmit them to the battery management system (BMU).

[0133] In other words, the signal transmission of a traditional sampling unit is divided into two stages. First, the voltage and / or temperature signals need to be collected by a signal collection board, which only serves the function of collecting signals. Then, the signals are transmitted to the chip on the BMS signal processing board on the battery cell assembly side. After processing by the chip on the BMS signal processing board, the signals are finally transmitted to the Battery Management Unit (BMU) to achieve a closed loop in signal transmission. This transmission method results in structural redundancy. The voltage information of all battery cells needs to be transmitted sequentially through the signal collection board to the BMS signal processing board, resulting in a large signal collection board size to meet the wiring requirements. Furthermore, the BMS signal processing board also requires a circuit board and chip to cooperate in processing the signals, leading to high structural costs for the sampling unit.

[0134] To optimize the structure of the sampling unit, the traditional signal collection board can be divided into multiple modules. Each module collects signals from the battery cells in its corresponding area. Then, the BMS signal processing board is eliminated, and the chips in the BMS signal processing board are placed in each module. Each module, together with one chip, forms an independent sampling unit to collect and process signals from the battery cells in that area. The processed signals are then transmitted to the battery management unit.

[0135] A sampling unit may include a sampling chip and a circuit board. Functional pins on the sampling chip are electrically connected to corresponding sampling points in the battery cell assembly via lines on the circuit board. However, the sampling chip has a large number of functional pins, which are scattered and irregularly distributed. Furthermore, the sampling chip occupies a certain amount of layout space on the circuit board. When the functional pins are electrically connected to the voltage sampling points, if the lines on the circuit board intersect in the same projection plane perpendicular to the thickness direction of the circuit board, a multi-layer circuit board structure is required. This structure consists of multiple layers of insulating and wiring layers, with cross-layer connections at the intersections to prevent interference between different lines. However, multi-layer circuit board structures tend to result in higher material costs and more complex processes involving cross-layer connections, leading to high manufacturing costs and poor reliability.

[0136] In view of this, to solve the problem of high circuit board cost in the sampling unit, some embodiments of this application provide a battery device, which includes a battery cell group and a sampling component. The battery cell group includes multiple voltage sampling points; the sampling component includes a sampling chip and a circuit board. The sampling chip is connected to the circuit board and has multiple functional pins. The circuit board includes multiple connection lines and multiple voltage sampling sections. The functional pins are connected to the voltage sampling sections through the connection lines to connect to the voltage sampling points through the voltage sampling sections; the circuit board includes a first edge portion, and the voltage sampling section includes multiple first voltage sampling sections located on the first edge portion. Along a first direction, the voltage signals acquired by the multiple first voltage sampling sections located on the first edge portion increase. The multiple functional pins include a first voltage sampling pin group, which includes multiple first voltage sampling pins. The first voltage sampling sections are connected to the first voltage sampling pins through connection lines. The first voltage sampling pins in the first voltage sampling pin group are arranged sequentially along a first spiral direction in the circumferential direction of the sampling chip, and along the first spiral direction, the voltage signals acquired by the first voltage sampling pins increase. The first spiral direction is the same as the first direction in the tangential direction towards the first edge portion.

[0137] The battery device provided in this application embodiment includes a sampling component comprising a sampling chip and a circuit board. The sampling chip has multiple functional pins, which are connected to different voltage sampling sections via connection lines on the circuit board, and are connected to voltage sampling points of the battery cell group via the voltage sampling sections. Multiple first voltage sampling sections are disposed on the first edge of the circuit board. The first voltage sampling sections are connected to the first voltage sampling pins via connection lines. By arranging the multiple first voltage sampling pins in the first voltage sampling pin group sequentially along a first spiral direction on the sampling chip, the voltage signal acquired by the first voltage sampling pins increases incrementally along the first spiral direction. Furthermore, the tangential direction of the first spiral direction towards the first edge is the same as the first direction. This facilitates the sequential connection of the multiple first voltage sampling pins to the multiple first voltage sampling sections of the first edge along the first spiral direction, resulting in a spiral distribution of the connection lines corresponding to the first voltage sampling pin group, reducing the likelihood of the connection lines crossing.

[0138] The battery device disclosed in this application can be used, but is not limited to, in electrical equipment such as vehicles, ships, or aircraft. A power system for such electrical equipment can be constructed using the battery device disclosed in this application.

[0139] The technical solutions described in the embodiments of this application are applicable to various electrical devices that use battery cells and battery devices, such as mobile phones, portable devices, laptops, electric vehicles, electric toys, power tools, vehicles, ships and spacecraft, etc. For example, spacecraft include airplanes, rockets, space shuttles and spacecraft.

[0140] For ease of explanation, the following embodiments will use a vehicle as an example of an electrical device according to an embodiment of this application.

[0141] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of a vehicle 1000 provided in some embodiments of this application. The vehicle 1000 can be a gasoline-powered vehicle, a natural gas-powered vehicle, or a new energy vehicle. New energy vehicles can be pure electric vehicles, hybrid electric vehicles, or range-extended electric vehicles, etc. A battery device 100 is provided inside the vehicle 1000, and the battery device 100 can be located at the bottom, front, or rear of the vehicle 1000. The battery device 100 can be used to power the vehicle 1000; for example, the battery device 100 can serve as the operating power source for the vehicle 1000's electrical system, such as meeting the power requirements for starting, navigation, and operation of the vehicle 1000.

[0142] The vehicle 1000 may also include a controller 200 and a motor 300. The controller 200 is used to control the battery device 100 to supply power to the motor 300, for example, for the power needs of the vehicle 1000 during startup, navigation and driving.

[0143] In some embodiments of this application, the battery device 100 can not only serve as the operating power source for the vehicle 1000, but also as the driving power source for the vehicle 1000, replacing or partially replacing fuel or natural gas to provide driving power for the vehicle 1000.

[0144] Please refer to Figure 2 and Figure 3 The battery device 100 includes a housing 10 and a battery cell pack 20, with the battery cell pack 20 housed within the housing 10. The housing 10 provides a space for the battery cell pack 20 and can have various structures. In some embodiments, the housing 10 may include a first sub-housing 11 and a second sub-housing 12, which overlap each other, collectively defining a space for accommodating the battery cell pack 20. The second sub-housing 12 may be a hollow structure with one open end, while the first sub-housing 11 may be a plate-like structure, covering the open side of the second sub-housing 12 so that the first sub-housing 11 and the second sub-housing 12 together define the space. Alternatively, both the first sub-housing 11 and the second sub-housing 12 may be hollow structures with one open side, with the open side of the first sub-housing 11 overlapping the open side of the second sub-housing 12.

[0145] In the battery device 100, the number of battery cells 21 in the battery cell group 20 can be multiple. The multiple battery cells 21 can be connected in series, parallel, or mixed. Mixed connection means that multiple battery cells 21 are connected in both series and parallel. Multiple battery cells 21 can be directly connected in series, parallel, or mixed together, and then the whole formed by multiple battery cells 21 is housed in the housing 10. Of course, the battery device 100 can also be formed by first connecting multiple battery cells 21 in series, parallel, or mixed to form a battery module, and then connecting multiple battery modules in series, parallel, or mixed to form a whole, which is housed in the housing 10.

[0146] The battery device 100 may also include other structures, such as a busbar for electrical connection between multiple battery cells 21.

[0147] Please refer to Figure 3 , Figure 3 This is an exploded view of the battery cell 21 provided in an embodiment of this application. The battery cell 21 includes a housing 211, an electrode assembly 216, and electrode terminals. The housing 211 includes an end cap 212 with an opening, and the end cap 212 closes the opening to isolate the internal environment of the battery cell 21 from the external environment. The housing 211 includes a first wall 213, which may optionally be at least a portion of the end cap 212. The electrode terminals are disposed on the first wall 213 and include a first terminal post 214 and a second terminal post 215. The electrode terminals can be insulatedly connected to the first wall 213 by means of riveting or injection molding, etc. One or two electrode terminals may be provided on one first wall 213.

[0148] The housing 211 is a component used to cooperate with the end cap 212 to form the internal environment of the battery cell 21, wherein the formed internal environment can accommodate the electrode assembly 216, electrolyte, and other components. The housing 211 can be of various shapes and sizes. Specifically, the shape of the housing 211 can be determined according to the specific shape and size of the electrode assembly 216. The housing 211 can be made of various materials, such as copper, iron, aluminum, stainless steel, aluminum alloy, plastic, etc.

[0149] End cap 212 refers to a component that covers the opening of housing 211 to isolate the internal environment of battery cell 21 from the external environment. The shape of end cap 212 can be adapted to the shape of housing 211 to fit it. Optionally, end cap 212 can be made of a material with certain hardness and strength (such as aluminum alloy), so that end cap 212 is not easily deformed under pressure and impact, giving battery cell 21 higher structural strength and improved reliability. Functional components such as electrode terminals can be provided on end cap 212. Electrode terminals can be used for electrical connection with electrode assembly 216 to output or input electrical energy to battery cell 21. The material of end cap 212 can also be various, such as copper, iron, aluminum, stainless steel, aluminum alloy, plastic, etc., and this application embodiment does not impose special limitations on this.

[0150] Electrode assembly 216 is a component in the battery cell 21 where electrochemical reactions occur. The housing 211 may contain one or more electrode assemblies 216.

[0151] This application provides a battery device; please refer to... Figures 4 to 6 The battery device 100 includes a battery cell group 20 and a sampling component 30. The battery cell group 20 includes multiple voltage sampling points 27. The sampling component 30 includes a sampling chip 32 and a circuit board 31. The sampling chip 32 is connected to the circuit board 31 and has multiple functional pins 321. The circuit board 31 includes multiple connection lines 314 and multiple voltage sampling units 313. The functional pins 321 are connected to the voltage sampling units 313 through the connection lines 314, so that they can be connected to the voltage sampling points 27 through the voltage sampling units 313. The circuit board 31 includes a first edge portion 311. The voltage sampling units 313 include multiple first voltage sampling units 3131, which are located on the first edge portion 311 and along a first direction X. The voltage signal acquired by the plurality of first voltage sampling units 3131 on the first edge portion 311 increases; the plurality of functional pins 321 include a first voltage sampling pin group 3211, the first voltage sampling pin group 3211 includes a plurality of first voltage sampling pins 32111, the first voltage sampling unit 3131 is connected to the first voltage sampling pin 32111 through a connecting line 314; the first voltage sampling pins 32111 in the first voltage sampling pin group 3211 are arranged sequentially in the circumferential direction of the sampling chip 32 along the first spiral direction S, and the voltage signal acquired by the first voltage sampling pin 32111 increases along the first spiral direction S, the first spiral direction S is the same as the first direction X in the tangential direction P toward the first edge portion 311.

[0152] The sampling chip 32 (Chip) is a common name for an integrated circuit (IC), which refers to a miniature electronic circuit that integrates a large number of electronic components (such as transistors, resistors, capacitors, etc.) and interconnections on a tiny semiconductor substrate (usually a silicon wafer) through semiconductor technology.

[0153] Circuit board 31 can be a printed circuit board (PCB) or a flexible circuit board (FPC). A flexible circuit board is a highly reliable and highly flexible printed circuit board made with polyimide or polyester film as a substrate. The specific type of circuit board 31 can be determined according to the actual situation. Circuit board 31 is a component with complete sampling function, not just one layer in a multilayer circuit board.

[0154] The circuit board 31 includes multiple connection lines 314 and multiple voltage sampling units 313. The connection lines 314 refer to the connection lines between the functional pins 321 of the sampling chip 32 and the voltage sampling units 313. The connection lines 314 can be formed by etching the circuit board 31, by die-cutting, or by other processes. The voltage sampling units 313 refer to the parts on the circuit board 31 that connect to the voltage sampling points 27. The specific number of voltage sampling units 313 depends on the number of voltage sampling points 27. The voltage sampling units 313 can be formed on the circuit board 31 itself, and the circuit board 31 directly connects to the voltage sampling points 27 using the voltage sampling units 313. Alternatively, the voltage sampling units 313 can be connecting pieces, such as nickel plates, provided on the circuit board 31, and the circuit board 31 connects to the voltage sampling points 27 through the nickel plates.

[0155] The first edge portion 311 refers to one of the edge portions on the circuit board 31, and a plurality of first voltage sampling portions 3131 are disposed on the first edge portion 311. The plurality of first voltage sampling portions 3131 can be all the voltage sampling portions 313 on the circuit board 31, or it can be a portion of the voltage sampling portions 313 on the circuit board 31, depending on the distribution of the voltage sampling points 27 of the battery cell group 20.

[0156] For example, if all voltage sampling points 27 of the battery cell pack 20 are located on one side of the first edge portion 311 of the circuit board 31, then the plurality of first voltage sampling portions 3131 can be all voltage sampling portions 313 on the circuit board 31, that is, all voltage sampling points 27 of the battery cell pack 20 are located on the same side of the circuit board 31. Alternatively, if all voltage sampling points 27 of the battery cell pack 20 are located on opposite sides of the circuit board 31, then the plurality of first voltage sampling portions 3131 on the first edge portion 311 can be a subset of voltage sampling portions 313 on the circuit board 31.

[0157] The first voltage sampling unit 3131 is connected to the first voltage sampling pin 32111 via a connecting line 314, meaning that each first voltage sampling pin 32111 is connected to the corresponding first voltage sampling unit 3131 on the first edge portion 311 via a connecting line 314.

[0158] The first spiral direction S refers to the arrangement direction of multiple first voltage sampling pins 32111 in the first voltage sampling pin group 3211 on the sampling chip 32 in the circumferential direction of the sampling chip 32, and the first spiral direction S satisfies the increasing direction of the voltage signal acquired by the multiple first voltage sampling pins 32111.

[0159] Please refer to Figure 4 The first helical direction S has the same tangent direction P on the side facing the first edge portion 311 as the first direction X. This means that when the first helical direction S passes through the first edge portion 311, the tangent direction P on the side facing the first edge portion 311 is the same as the first direction X, that is, the tangent direction P on the side facing the first edge portion 311 of the first helical direction S is parallel to the first direction X. In this way, the multiple first voltage sampling pins 32111 in the first voltage sampling pin group 3211 are connected sequentially along the first helical direction S to the multiple first voltage sampling portions 3131 of the first edge portion 311, so that the connection lines 314 connected to the first voltage sampling pin group 3211 are distributed in a spiral shape, and the phenomenon of line crossing is not easy to occur.

[0160] In the technical solution of this application embodiment, the sampling component 30 includes a sampling chip 32 and a circuit board 31. The sampling chip 32 has multiple functional pins 321. The multiple functional pins 321 are connected to different voltage sampling sections 313 through the connection lines 314 on the circuit board 31, and are connected to the voltage sampling points 27 of the battery cell group 20 through the voltage sampling sections 313. A plurality of first voltage sampling units 3131 are provided on the first edge portion 311 of the circuit board 31. The first voltage sampling units 3131 are connected to the first voltage sampling pins 32111 through the connecting lines 314. By arranging the plurality of first voltage sampling pins 32111 in the first voltage sampling pin group 3211 sequentially along the first spiral direction S of the sampling chip 32, the voltage signal acquired by the first voltage sampling pins 32111 increases along the first spiral direction S. The tangential direction P of the first spiral direction S toward the first edge portion 311 is the same as the first direction X. This makes it easy for the plurality of first voltage sampling pins 32111 to be sequentially connected to the plurality of first voltage sampling units 3131 of the first edge portion 311 along the first spiral direction S. This makes the connecting lines 314 corresponding to the first voltage sampling pin group 3211 spirally distributed, and the connecting lines 314 are less likely to cross.

[0161] According to some embodiments of this application, please refer to Figure 5 Multiple first voltage sampling pins 32111 are respectively numbered as different CIN X pins. The X of the multiple CIN X pins is one of multiple different positive integers equal to 0 and greater than or equal to 1. Each of the multiple CIN X pins is selectively connected to multiple first voltage sampling sections 3131 through connection lines 314. The CIN X pins of the multiple first voltage sampling pins 32111 are arranged sequentially in the circumferential direction of the sampling chip 32 along the first spiral direction S. Furthermore, along the first spiral direction S, the X of the CIN X pins increases sequentially. The first spiral direction S is the same as the first direction X in the tangential direction P toward the side of the first edge section 311.

[0162] The CIN X pin is the input capacitor pin of the sampling chip 32. It is mainly used to connect an external capacitor to filter out noise and fluctuations in the input voltage and ensure signal stability.

[0163] The first CIN pin, also known as the first voltage sampling pin 32111 in the first voltage sampling pin group 3211, is numbered as CIN X pin on the circumference of the sampling chip 32, where X is 0 or a positive integer. Please refer to... Figure 10 For example, the multiple first voltage sampling pins 32111 include CIN 0 pin, CIN 1 pin, CIN 2 pin, and CIN 3 pin, etc. The first spiral direction S refers to the arrangement direction of the multiple CIN X pins on the sampling chip 32 in the circumferential direction of the sampling chip 32, and the first spiral direction S satisfies the increasing direction of the voltage signal acquired by the multiple CIN X pins.

[0164] The first helical direction S has the same tangent direction P towards the first edge portion 311 as the first direction X. This means that when the first helical direction S passes through the first edge portion 311, the tangent direction P of the first helical direction S towards the first edge portion 311 is the same as the first direction X. In other words, the tangent direction P of the first helical direction S towards the first edge portion 311 is parallel to the first direction X.

[0165] This allows multiple CIN pins in multiple first voltage sampling pins 32111 to be sequentially connected to multiple first voltage sampling sections 3131 of the first edge portion 311 along the first spiral direction S, so that the connection lines 314 connected to the first CIN pin group are spirally distributed without crossing.

[0166] Based on some embodiments of this application, please continue to refer to Figure 5The multiple functional pins 321 also include a first DIS pin group, which includes multiple DIS Y pins. The Y of the multiple DIS Y pins is one of multiple different positive integers equal to 0 and greater than or equal to 1. Each of the multiple DIS Y pins is selectively connected to multiple first voltage sampling sections 3131 through connection lines 314. The multiple DIS Y pins in the first DIS pin group are arranged sequentially in the circumferential direction of the sampling chip 32 along the first spiral direction S. Along the first spiral direction S, the Y of the DIS Y pins increases sequentially. The first spiral direction S is the same as the first direction X in the tangential direction P toward the side of the first edge portion 311.

[0167] The first DIS pin group, also known as the first equalization circuit pin group 3212, includes multiple DIS Y pins. The pins of the first equalization circuit 32121 on the circumference of the sampling chip 32 are numbered as DIS Y pins, where Y is 0 or a positive integer. Please refer to... Figure 10 For example, the first DIS pin group includes DIS 0 pin, DIS 1 pin, DIS 2 pin, and DIS 3 pin, etc. The first spiral direction S refers to the circumferential arrangement direction of the multiple DIS Y pins in the first DIS pin group on the sampling chip 32, and the first spiral direction S satisfies the increasing direction of the voltage signals acquired by the multiple DIS Y pins.

[0168] Furthermore, the pins in the first CIN pin group and the first DIS pin group are alternately distributed in the circumferential direction of the sampling chip 32, such as... Figure 10 As shown, along the circumference of the sampling chip 32, the CIN0 pin, DIS0 pin, CIN1 pin, DIS1 pin, CIN2 pin, DIS2 pin, etc. are arranged sequentially with increasing numbers and along the first spiral direction S.

[0169] It should be noted that the CIN0 pin and the DIS0 pin are electrically connected to the same voltage sampling unit 313 through the same connection line 314. The connection line 314 is divided into two wires, one end of which is connected to the CIN0 pin and the DIS0 pin respectively, and the other end is connected to the corresponding voltage sampling unit 313.

[0170] The first helical direction S has the same tangent direction P on the side facing the first edge portion 311 as the first direction X. This means that when the first helical direction S passes through the first edge portion 311, the tangent direction P on the side facing the first edge portion 311 is the same as the first direction X. In other words, the tangent direction P on the side facing the first edge portion 311 is parallel to the first direction X. In this way, the multiple DIS Y pins in the first DIS pin group are connected to the multiple first voltage sampling portions 3131 of the first edge portion 311 in sequence along the first helical direction S, so that the connection lines 314 connected to the first DIS pin group are distributed in a spiral shape, and the phenomenon of line crossing is not easy to occur.

[0171] This allows multiple DIS Y pins in the first DIS pin group to be sequentially connected to multiple first voltage sampling units 3131 of the first edge portion 311 along the first spiral direction S, so that the connection lines 314 connected to the first DIS pin group are spirally distributed without crossing.

[0172] According to some embodiments of this application, please refer to Figure 5 The multiple functional pins 321 also include a first equalization circuit pin group 3212, which includes multiple first equalization circuit pins 32121. The first voltage sampling unit 3131 is connected to the first equalization circuit pins 32121 via a connection line 314. The first equalization circuit pins 32121 in the first equalization circuit pin group 3212 are arranged sequentially along the first spiral direction S in the circumferential direction of the sampling chip 32. Furthermore, along the first spiral direction S, the voltage signal acquired by the first equalization circuit pins 32121 increases. The first spiral direction S has the same tangential direction P towards the first edge portion 311 as the first direction X.

[0173] The first equalization circuit pin 32121 refers to a specific pin in the sampling chip 32 of the battery device 100 used to implement the battery equalization function. These pins allow equal charging of each battery cell 21 in the battery cell pack 20 through resistive discharge, so as to ensure that the charge of each battery cell 21 is consistent, thereby improving the overall performance and lifespan of the battery cell pack 20.

[0174] The first voltage sampling unit 3131 is connected to the first equalization circuit pin 32121 via a connecting line 314, meaning that each first equalization circuit pin 32121 is connected to the corresponding first voltage sampling unit 3131 on the first edge portion 311 via a connecting line 314.

[0175] The first spiral direction S refers to the circumferential arrangement direction of the multiple first equalization circuit pins 32121 in the first equalization circuit pin group 3212 on the sampling chip 32, and the first spiral direction S satisfies the increasing direction of the voltage signal acquired by the multiple first equalization circuit pins 32121. The tangent direction P of the first spiral direction S towards the first edge portion 311 is the same as the first direction X, which means that when the first spiral direction S passes through the first edge portion 311, the tangent direction P of the first spiral direction S towards the first edge portion 311 is the same as the first direction X, that is, the tangent direction P of the first spiral direction S towards the first edge portion 311 is parallel to the first direction X.

[0176] This allows multiple first equalization circuit pins 32121 in the first equalization circuit pin group 3212 to be sequentially connected to multiple first voltage sampling units 3131 of the first edge portion 311 along the first spiral direction S, so that the connection lines 314 connected to the first equalization circuit pin group 3212 are spirally distributed without crossing.

[0177] According to some embodiments of this application, please refer to Figures 6 to 8 The circuit board 31 also includes a second edge portion 312, and the first edge portion 311 and the second edge portion 312 are respectively distributed on opposite sides of the sampling chip 32; the second edge portion 312 is provided with a plurality of second voltage sampling portions 3132, and along the first direction X, the voltage signals acquired by the plurality of second voltage sampling portions 3132 located on the second edge portion 312 increase sequentially.

[0178] The second edge portion 312 and the first edge portion 311 are two edge portions disposed opposite to each other on the circuit board 31. The second edge portion 312 is provided with a plurality of second voltage sampling portions 3132, that is, a portion of the voltage sampling points 27 in the battery cell group 20 are disposed close to the first edge portion 311 of the circuit board 31, and another portion of the voltage sampling points 27 in the battery cell group 20 are disposed in the second edge portion 312 of the circuit board 31.

[0179] The voltage sampling points 27 of the first edge portion 311 and the second edge portion 312 are increased along the first direction X, which facilitates the connection of the series and parallel circuits of multiple battery cells 21 arranged along the first direction X.

[0180] Based on some embodiments of this application, please refer to... Figure 7 and Figure 8Multiple functional pins 321 include a second voltage sampling pin group 3213, which includes multiple second voltage sampling pins 32131. The second voltage sampling part 3132 is connected to the second voltage sampling pins 32131 via a connection line 314. The second voltage sampling pins 32131 in the second voltage sampling pin group 3213 are arranged sequentially along the second spiral direction T in the circumferential direction of the sampling chip 32. The voltage signal acquired by the second voltage sampling pins 32131 increases along the second spiral direction T. The second spiral direction T is the same as the first direction X in the tangential direction P toward the second edge part 312.

[0181] The second voltage sampling unit 3132 is connected to the second voltage sampling pin 32131 via a connecting line 314, meaning that each second voltage sampling pin 32131 is connected to the corresponding second voltage sampling unit 3132 on the second edge portion 312 via a connecting line 314.

[0182] The second spiral direction T refers to the arrangement direction of multiple second voltage sampling pins 32131 in the second voltage sampling pin group 3213 on the sampling chip 32 in the circumferential direction of the sampling chip 32, and the second spiral direction T satisfies the increasing direction of the voltage signal acquired by the multiple second voltage sampling pins 32131.

[0183] The second spiral direction T has the same tangent direction P on the side facing the second edge portion 312 as the first direction X. This means that when the second spiral direction T passes through the second edge portion 312, the tangent direction P on the side facing the second edge portion 312 is the same as the first direction X. In this way, the multiple second voltage sampling pins 32131 in the second voltage sampling pin group 3213 are connected to the multiple second voltage sampling portions 3132 of the second edge portion 312 in sequence along the second spiral direction T, so that the connection lines 314 connected to the second voltage sampling pin group 3213 are spirally distributed, and the phenomenon of line crossing is not easy to occur.

[0184] This allows multiple second voltage sampling pins 32131 in the second voltage sampling pin group 3213 to be sequentially connected to multiple second voltage sampling sections 3132 of the second edge portion 312 along the second spiral direction T, so that the connection lines 314 connected to the second voltage sampling pin group 3213 are spirally distributed without crossing.

[0185] Based on some embodiments of this application, please refer to... Figure 7 and Figure 8Multiple functional pins 321 include a second CIN pin group, which includes multiple CIN Z pins. The value of Z is different from that of X in the CIN X pin. Each of the multiple CIN Z pins is selectively connected to multiple second voltage sampling sections 3132 via connection lines 314. The CIN Z pins in the second CIN pin group are arranged sequentially in the circumferential direction of the sampling chip 32 along the second spiral direction T. Along the second spiral direction T, the Z of the CIN Z pins increases sequentially. The second spiral direction T is the same as the first direction X in the tangential direction P toward the side of the second edge portion 312.

[0186] The second CIN pin group, also known as the second voltage sampling pin group 3213, includes multiple CIN Z pins. The Z pins in the CIN Z pins have different numbers than the CIN X pins. For example, if X in the CIN X pin can be a value such as 0, 2, 4, or 6, then Z in the CIN Z pins can be a value such as 1, 3, 5, or 7.

[0187] The second spiral direction T refers to the arrangement direction of multiple CIN Z pins in the second CIN pin group on the sampling chip 32 in the circumferential direction of the sampling chip 32, and the second spiral direction T satisfies the increasing direction of the voltage signal acquired by the multiple CIN Z pins.

[0188] This allows multiple CIN pins in the second CIN pin group to be sequentially connected to multiple second voltage sampling units 3132 of the second edge portion 312 along the second spiral direction T, so that the connection lines 314 connected to the second CIN pin group are spirally distributed without crossing.

[0189] According to some embodiments of this application, multiple functional pins 321 include a second equalization circuit pin group 3214, which includes multiple second equalization circuit pins 32141. The second voltage sampling unit 3132 is connected to the second equalization circuit pins 32141 through the connection line 314. The second equalization circuit pins 32141 in the second equalization circuit pin group 3214 are arranged sequentially in the circumferential direction of the sampling chip 32 along the second spiral direction T. The voltage signal acquired by the second equalization circuit pins 32141 increases along the second spiral direction T. The tangential direction P of the second spiral direction T toward the second edge portion 312 is the same as the first direction X.

[0190] Multiple second equalization circuit pins 32141 constitute a second equalization circuit pin group 3214. The second voltage sampling unit 3132 is connected to the second equalization circuit pins 32141 via a connecting line 314, meaning that each second equalization circuit pin 32141 is connected to the corresponding second voltage sampling unit 3132 on the second edge portion 312 via a connecting line 314.

[0191] The second spiral direction T refers to the circumferential arrangement direction of multiple second equalization circuit pins 32141 in the second equalization circuit pin group 3214 on the sampling chip 32, and the second spiral direction T satisfies the increasing direction of the voltage signal acquired by the multiple second equalization circuit pins 32141.

[0192] This allows multiple second equalization circuit pins 32141 in the second equalization circuit pin group 3214 to be sequentially connected to multiple second voltage sampling units 3132 of the second edge portion 312 along the second spiral direction T, so that the connection lines 314 connected to the second equalization circuit pin group 3214 are spirally distributed without crossing.

[0193] Based on some embodiments of this application, please refer to... Figure 7 and Figure 8 The multiple functional pins 321 include a second DIS pin group, which includes multiple DIS Q pins. The Q value is different from the Y value in the DIS Y pin. Each of the multiple DIS Q pins is selectively connected to multiple second voltage sampling sections 3132 through a connection line 314. The multiple DIS Q pins in the second DIS pin group are arranged sequentially in the circumferential direction of the sampling chip 32 along the second spiral direction T. Along the second spiral direction T, the Q value of the DIS Q pins increases sequentially. The second spiral direction T is the same as the first direction X in the tangential direction P toward the side of the second edge portion 312.

[0194] The second DIS pin group, also known as the second equalization circuit pin group 3214, includes multiple DIS Q pins. The pins of the second equalization circuit 32141 on the circumference of the sampling chip 32 are numbered as DIS Q pins, where Q is a different positive integer than Y in the first DIS pin group. For example, if the first DIS pin group includes DIS 0, DIS 2, DIS 4, and DIS 6, then the second DIS pin group could include DIS 1, DIS 3, DIS 5, and DIS 7.

[0195] The second spiral direction T refers to the arrangement direction of multiple DIS Q pins in the second DIS pin group on the sampling chip 32 in the circumferential direction of the sampling chip 32, and the second spiral direction T satisfies the increasing direction of the voltage signal acquired by the multiple DIS Q pins.

[0196] This allows multiple DIS Q pins in the second DIS pin group to be sequentially connected to multiple second voltage sampling units 3132 of the second edge portion 312 along the second spiral direction T, so that the connection lines 314 connected to the second DIS pin group are spirally distributed without crossing.

[0197] According to some embodiments of this application, please refer to Figure 7 The first helix direction S is opposite to the second helix direction T.

[0198] The first helical direction S and the second helical direction T are opposite. For example, if the first helical direction S is clockwise, then the second helical direction T is counterclockwise. Or, if the first helical direction S is counterclockwise, then the second helical direction T is clockwise.

[0199] With the plurality of first voltage sampling units 3131 located on the first edge portion 311 and the plurality of second voltage sampling units 3132 located on the second edge portion 312 increasing sequentially along the first direction X, the connection lines 314 of the two sets of pin groups that are respectively connected to the first edge portion 311 and the second edge portion 312 can be arranged in a spiral shape along the first spiral direction S and the second spiral direction T, so that the connection lines 314 of the two sets of pin groups do not interfere with each other.

[0200] According to some embodiments of this application, please refer to Figure 7 and Figure 8 The battery cell assembly 20 includes a negative output terminal and a positive output terminal. Voltage sampling points 27 for sampling the voltage signal of the negative output terminal are numbered 0, and voltage sampling points 27 for sampling the voltage signal of the positive output terminal are numbered N. Along the current direction from the negative output terminal to the positive output terminal of the battery cell assembly 20, the numbers of multiple voltage sampling points 27 sequentially increase from 0 to N, where N is a positive integer. The circuit board 31 includes a first edge portion 311 and a second edge portion 312. The first edge portion 311 is provided with multiple first voltage sampling sections 3131, and the second edge portion 312 is provided with multiple second voltage sampling sections 3132. The first edge portion 311 and the second edge portion 312 are respectively distributed on opposite sides of the sampling chip 32. Multiple functional pins 321 include a first voltage sampling pin group 3211 and a second... The voltage sampling pin group 3213 includes a first voltage sampling pin group 3211, which includes a plurality of first voltage sampling pins 32111. A first voltage sampling unit 3131 is connected to the first voltage sampling pins 32111 via a connection line 314. The second voltage sampling pin group 3213 includes a plurality of second voltage sampling pins 32131. A second voltage sampling unit 3132 is connected to the second voltage sampling pins 32131 via the connection line 314. At least a portion of the voltage sampling points 25 numbered odd are connected to the second voltage sampling pins 32131, and at least a portion of the voltage sampling points 26 numbered even are connected to the first voltage sampling pins 32111. The first voltage sampling pin group 3211 and the second voltage sampling pin group 3213 are spaced apart along the circumference of the sampling chip 32.

[0201] The voltage sampling points 27 are numbered sequentially from 0 to N, where N is a positive integer. For example, N can be any positive integer such as 0, 1, 2, 3, 4, 5, 6, 7, or 8. The number of voltage sampling points 27 is related to the number of battery cells 21 in the battery cell group 20, which is N-1. The voltage sampling points 27 are located on opposite sides of the circuit board 31.

[0202] The voltage sampling point 27 in the battery cell group 20 is connected to the first voltage sampling part 3131 and the second voltage sampling part 3132 on the circuit board 31, and then connected to the first voltage sampling pin group 3211 and the second voltage sampling pin group 3213 of the sampling chip 32 through the connection line 314 on the circuit board 31, so as to realize the acquisition of the voltage signal of the battery cell group 20.

[0203] At least some of the odd-numbered voltage sampling points 25 are connected to the second voltage sampling pin 32131. This means that a portion of the odd-numbered voltage sampling points 25 are connected to the second voltage sampling pin 32131, while another portion of the odd-numbered voltage sampling points 25 are connected to other voltage sampling pins on the sampling chip 32. Alternatively, all the odd-numbered voltage sampling points 27 can be connected to the second voltage sampling pin 32131.

[0204] At least some of the even-numbered voltage sampling points 26 are connected to the first voltage sampling pin 32111. This means that a portion of the even-numbered voltage sampling points 26 are connected to the first voltage sampling pin 32111, while another portion of the even-numbered voltage sampling points 26 are connected to other voltage sampling pins of the sampling chip 32. Alternatively, all even-numbered voltage sampling points 27 can be connected to the first voltage sampling pin 32111.

[0205] This facilitates the connection of voltage sampling pins located on different sides of the sampling chip 32 to voltage sampling sections 313 on different edges of the circuit board 31, and ensures that the connection line 314 connected to the first voltage sampling pin group 3211 does not interfere with the connection line 314 connected to the second voltage sampling pin group 3213.

[0206] According to some embodiments of this application, the first voltage sampling pin group 3211 and the second voltage sampling pin group 3213 are located on different sides of the sampling chip 32, respectively.

[0207] The first voltage sampling pin group 3211 and the second voltage sampling pin group 3213 are located on different sides of the sampling chip 32, and the distribution of the first voltage sampling pin group 3211 and the second voltage sampling pin group 3213 on the sampling chip 32 can be varied.

[0208] For example, please refer to Figure 7and Figure 8 The sampling chip 32 includes a first side 3215 and a second side 3216 that are relatively distributed. A first voltage sampling pin group 3211 is disposed on the first side 3215, and a second voltage sampling pin group 3213 is disposed on the second side 3216.

[0209] Or, please refer to Figure 9 and Figure 10 The sampling chip 32 includes a first side 3215, a third side 3217, a second side 3216, and a fourth side 3218 connected end to end in sequence. A first voltage sampling pin group 3211 is disposed on the first side 3215 and the fourth side 3218, and a second voltage sampling pin group 3213 is disposed on the second side 3216 and the third side 3217.

[0210] By placing the first voltage sampling pin group 3211 and the second voltage sampling pin group 3213 on different sides of the sampling chip 32, the sampling chip 32 can make full use of the different sides to set the function pins 321, so that the sampling chip 32 can be designed to be smaller and occupy less area on the circuit board 31, thereby reducing the impact on the arrangement of the connection lines 314.

[0211] According to some embodiments of this application, please refer to Figure 11 and Figure 12 Multiple sampling components 30 are connected to the same battery cell group 20.

[0212] Multiple sampling components 30 connected to the same battery cell group 20 means that each sampling component 30 is connected to a portion of the battery cells 21 in the battery cell group 20. The multiple sampling components 30 work together to collect information from all the battery cells 21 in the battery cell group 20. In other words, each sampling component 30 corresponds to one or more different battery cells 21 in the battery cell group 20.

[0213] Connecting multiple sampling components 30 to the same battery cell group 20 reduces the number of battery cells 21 that each sampling component 30 needs to connect to, and reduces the difficulty of arranging the connection lines 314 on the circuit board 31 of each sampling component 30 to prevent the connection lines 314 from crossing.

[0214] According to some embodiments of this application, please refer to Figure 11 and Figure 12 Multiple sampling components 30 are arranged along the first direction X. The sampling chip 32 includes communication pins. The communication pins of two adjacent sampling chips 32 along the first direction X are connected by wires independently formed on the circuit board 31.

[0215] Multiple sampling components 30 are arranged along the first direction X, that is, multiple sampling components 30 are arranged along the arrangement direction of multiple battery cells 21 in the battery cell group 20. Communication pins refer to the pin structures on the sampling chip 32 used for communication connections with adjacent sampling chips 32.

[0216] The communication pins of two adjacent sampling chips 32 along the first direction X are connected by wires independently formed on the circuit board 31. This means that the communication pins of the two sampling chips 32 are connected by communication wires to realize the transmission of communication signals between the two adjacent sampling components 30. The wires do not occupy the space of the circuit board 31.

[0217] This allows multiple sampling components 30 to be molded independently before being connected, and the wires used for communication can be arranged without occupying additional space on the circuit board 31, making it simpler to arrange non-intersecting connection lines 314 on the circuit board 31.

[0218] According to some embodiments of this application, please refer to Figure 13 Two adjacent sampling chips 32 along the first direction X include a first sampling chip 331 and a second sampling chip 341. The first sampling chip 331 includes two first communication pins, and the second sampling chip 341 includes two second communication pins. The wires include a first wire 3311 and a second wire 3411. The first wire 3311 and the second wire 3411 are respectively used to connect a first communication pin and a second communication pin. The first wire 3311 and the second wire 3411 form a twisted pair.

[0219] The first wire 3311 and the second wire 3411 establish a communication connection between the first sampling chip 331 and the second sampling chip 341. Specifically, the first wire 3311 and the second wire 3411 are respectively used to connect a first communication pin and a second communication pin. That is, one end of the first wire 3311 is connected to one of the two first communication pins on the first sampling chip 331, and the other end of the first wire 3311 is connected to one of the two second communication pins on the second sampling chip 341. Similarly, one end of the second wire 3411 is connected to the other of the two first communication pins on the first sampling chip 331, and the other end of the second wire 3411 is connected to the other of the two second communication pins on the second sampling chip 341.

[0220] Twisted pair (TP) is a commonly used transmission medium in structured cabling projects. It consists of two insulated metal wires. By twisting the two insulated metal wires together at a certain density, the electromagnetic waves radiated by each wire during transmission are canceled out by the electromagnetic waves emitted by the other wire, effectively reducing the degree of signal interference.

[0221] Using twisted-pair cables for communication between adjacent sampling chips 32 makes the signals transmitted between the sampling chips 32 more resistant to interference.

[0222] According to some embodiments of this application, a plurality of sampling components 30 are arranged along a first direction X, and two adjacent sampling chips 32 along the first direction X communicate wirelessly.

[0223] The fact that two adjacent sampling chips 32 along the first direction X communicate wirelessly means that the two adjacent sampling chips 32 along the first direction X do not need to transmit signals through a communication line, but can transmit signals through a wireless communication module.

[0224] This eliminates the need for additional communication wires between the two sampling chips 32, thus avoiding the need to occupy space on the circuit board 31 for wiring and also eliminating the need for additional physical wire connections.

[0225] According to some embodiments of this application, please refer to Figure 14 The battery device 100 also includes a main control board 60, and at least one sampling component 30 has a sampling chip 32 that includes a first communication pin for connecting to the main control board 60.

[0226] The main control board 60 is typically responsible for initiating synchronization messages and collecting data messages, monitoring various battery states, and ensuring safe battery use during charging and discharging.

[0227] At least one sampling component 30 has a sampling chip 32 that includes a first communication pin for connecting to the main control board 60, so that the sampling information of the sampling chip 32 can be directly connected to the main control board 60 for signal transmission.

[0228] The sampling chip 32 can be directly connected to the main control board 60 for signal transmission, instead of first transmitting to the slave control board and then to the main control board 60. This reduces the number of transmission links and connection nodes, thereby improving the efficiency and reliability of signal transmission.

[0229] According to some embodiments of this application, please refer to Figure 11 Multiple sampling components 30 are arranged along the first direction X. The battery cell group 20 includes a first battery cell 221 and a second battery cell 231 located at both ends along the first direction X. At least one sampling component 30 is connected to at least one of the first battery cell 221 and the second battery cell 231 to perform temperature sampling.

[0230] The first battery cell 221 and the second battery cell 231 refer to two battery cells 21 located at both ends of the first direction X in the battery cell group 20.

[0231] At least one sampling component 30 is connected to at least one of the first battery cell 221 and the second battery cell 231 to perform temperature sampling. This means that at least one sampling component 30 among the plurality of sampling components 30 can perform temperature sampling on the first battery cell 221 and / or the second battery cell 231. For example, one sampling component 30 among the plurality of sampling components 30 can perform temperature sampling on the first battery cell 221 or the second battery cell 231, or two sampling components 30 among the plurality of sampling components 30 can perform temperature sampling on the first battery cell 221 and the second battery cell 231 respectively.

[0232] At least one sampling component 30 is connected to at least one of the first battery cell 221 and the second battery cell 231 to perform temperature sampling, so that the battery cell 21 located at the end of the battery cell group 20 can be monitored when the battery device 100 is monitored, and the temperature difference detection of the battery device is more accurate.

[0233] According to some embodiments of this application, the first battery cell 221 is connected to the one with the smallest distance among the plurality of sampling components 30, and / or the second battery cell 231 is also connected to the one with the smallest distance among the plurality of sampling components 30.

[0234] The first battery cell 221 is connected to the one with the smallest distance among the multiple sampling components 30, meaning that the first battery cell 221 is connected to the sampling component 30 that is closest to it among the multiple sampling components 30; and / or, the second battery cell 231 is connected to the one with the smallest distance among the multiple sampling components 30, meaning that the second battery cell 231 is connected to the sampling component 30 that is closest to it among the multiple sampling components 30.

[0235] The connection line 314 for sampling the temperature of the first battery cell 221 or the second battery cell 231 is made as short as possible, so that the connection line 314 for sampling the temperature of the first battery cell 221 or the second battery cell 231 does not need to cross other sampling components 30, thus avoiding interference with the wiring layout of other sampling components 30.

[0236] According to some embodiments of this application, please refer to Figure 11The same battery cell group 20 includes multiple sampling components 30 arranged along a first direction X. The sampling components 30 located at both ends along the first direction X are a first sampling component 33 and a second sampling component 34, respectively. The distance between the first sampling component 33 and the first battery cell 221 is less than the distance between the second sampling component 34 and the first battery cell 221, and the distance between the second sampling component 34 and the second battery cell 231 is less than the distance between the first sampling component 33 and the second battery cell 231. The first sampling component 33 is connected to the first battery cell 221 to perform temperature sampling, and / or the second sampling component 34 is connected to the second battery cell 231 to perform temperature sampling.

[0237] The sampling components 30 located at both ends along the first direction X are respectively the first sampling component 33 and the second sampling component 34. This means that among the multiple sampling components 30, the two sampling components 30 located at both ends of the first direction X are respectively the first sampling component 33 and the second sampling component 34.

[0238] The distance between the first sampling component 33 and the first battery cell 221 is less than the distance between the second sampling component 34 and the first battery cell 221. This means that the distance between the first battery cell 221 and the first sampling component 33 is shorter than the distance between the second sampling component 34. Similarly, the distance between the second sampling component 34 and the second battery cell 231 is less than the distance between the first sampling component 33 and the second battery cell 231. This means that the distance between the second battery cell 231 and the second sampling component 34 is shorter than the distance between the first sampling component 33.

[0239] The first sampling component 33 is connected to the first battery cell 221 to perform temperature sampling, that is, the first sampling component 33 can sample the temperature of the first battery cell 221, and / or, the second sampling component 34 is connected to the second battery cell 231 to perform temperature sampling, that is, the second sampling component 34 can sample the temperature of the second battery cell 231.

[0240] The connection line 314 used for temperature sampling of the first battery cell 221 or the second battery cell 231 is made as short as possible, so that the connection line 314 used for temperature sampling of the first battery cell 221 or the second battery cell 231 does not need to cross other sampling components 30, thus avoiding interference with the wiring layout of other sampling components 30.

[0241] Please refer to some embodiments of this application. Figure 11The battery cell group 20 includes a first subgroup 22 and a second subgroup 23. Both the first subgroup 22 and the second subgroup 23 include a portion of the battery cells 21 from a plurality of battery cells 21. The first subgroup 22 includes a first battery cell 221, and the second subgroup 23 includes a second battery cell 231. The number of battery cells 21 in the first subgroup 22 and the second subgroup 23 is equal. The first sampling component 33 includes a first circuit board 333, a first sampling chip 331, and a first temperature sampling element 332. The first sampling chip 331 is disposed on the first circuit board 333 and is electrically connected to multiple voltage sampling points 27 on the first subgroup 22 through the first circuit board 333. The first temperature sampling element 332 is connected to the first battery cell 221 to collect the temperature of the first battery cell 221. The second sampling component 34 includes a second circuit board 343, a second sampling chip 341, and a second temperature sampling element 342. The second sampling chip 341 is disposed on the second circuit board 343 and is electrically connected to multiple voltage sampling points 27 on the second subgroup 23 through the second circuit board 343. The second temperature sampling element 342 is connected to the second battery cell 231 to collect the temperature of the second battery cell 231.

[0242] Both the first subgroup 22 and the second subgroup 23 include a portion of the multiple battery cells 21. Specifically, the first subgroup 22 includes a portion of the multiple battery cells 21, and the second subgroup 23 includes a portion of the multiple battery cells 21. Furthermore, the battery cells 21 included in the first subgroup 22 and the second subgroup 23 are different.

[0243] The first temperature sensing element 332 refers to a temperature sensor capable of acquiring the temperature of the first battery cell 221. The first temperature sensing element 332 can be a thermistor, for example, a negative temperature coefficient thermistor (NTC thermistor). The resistance of an NTC thermistor decreases as temperature increases; both belong to the semiconductor device category. The second temperature sensing element 342 refers to a temperature sensor capable of acquiring the temperature of the second battery cell 231. The second temperature sensing element 342 is a temperature sensor with the same structure as the first temperature sensing element 332.

[0244] Both the first subgroup 22 and the second subgroup 23 include a portion of the battery cells 21 from multiple battery cells 21. The first subgroup 22 includes a first battery cell 221, and the second subgroup 23 includes a second battery cell 231. The number of battery cells 21 in the first subgroup 22 and the second subgroup 23 is equal, meaning the number of battery cells 21 collected by the first sampling component 33 and the second sampling component 34 is equal. The circuit boards in the first sampling component 33 and the second sampling component 34 can be manufactured using standard parts, facilitating mass production. The first sampling chip 331 is electrically connected to multiple voltage sampling points on the first subgroup through the first circuit board 333. The first sampling chip 331 can collect voltage information from multiple battery cells 21 in the first subgroup 22. The first temperature sensor 332 is connected to the first battery cell 221 to collect the temperature of the first battery cell 221. The second sampling chip 341 is electrically connected to multiple voltage sampling points in the second subgroup 23 through the second circuit board 343. The second sampling chip 341 can collect voltage information of multiple battery cells 21 in the second subgroup 23. The second temperature sampling element 342 is connected to the second battery cell 231 to realize the acquisition of the temperature of the second battery cell 231.

[0245] In some embodiments, please refer to Figure 11 The first sampling chip 331 and the first temperature sampling element 332 are both disposed on the first circuit board 333; the second sampling chip 341 and the second temperature sampling element 342 are both disposed on the second circuit board 343; the first sampling chip 331 and the second sampling chip 341 are disposed at the same position on the first circuit board 333; the first temperature sampling element 332 and the second temperature sampling element 342 are disposed at different positions on the first circuit board 333 and the second temperature sampling element 342 are disposed at different positions on the second circuit board 343.

[0246] The first sampling chip 331 is positioned in the same location on the first circuit board 333 as the second sampling chip 341 on the second circuit board 343. This means that the mounting positions of the first sampling chip 331 and the second sampling chip 341 on the first circuit board 333 are exactly the same. For example, if the first sampling chip 331 is located at the center of the first circuit board 333, then the second sampling chip 341 is also located at the center of the second circuit board 343.

[0247] The different positions of the first temperature sensing element 332 and the second temperature sensing element 342 on the first circuit board 333 mean that the relative positions of the first temperature sensing element 332 and the second temperature sensing element 342 on the second circuit board 343 are different. For example, the first temperature sensing element 332 can be located on the left side of the first circuit board 333, and the second temperature sensing element 342 can be located on the right side of the second circuit board 343.

[0248] Both the first sampling chip 331 and the first temperature sensing element 332 are mounted on the first circuit board 333. The first circuit board 333 not only enables electrical connections between the first sampling chip 331 and the voltage sampling point 27 in the first subgroup 22, and between the first sampling chip 331 and the first temperature sensing element 332, but also provides support for the first sampling chip 331 and the first temperature sensing element 332, resulting in higher stability and reliability. Similarly, both the second sampling chip 341 and the second temperature sensing element 342 are mounted on the second circuit board 343. The second circuit board 343 not only enables electrical connections between the second sampling chip 341 and the voltage sampling point 27 in the second subgroup 23, and between the second sampling chip 341 and the second temperature sensing element 342, but also provides support for the second sampling chip 341 and the second temperature sensing element 342, resulting in higher stability and reliability. The first sampling chip 331 is positioned relative to the first subgroup 22 and the second sampling chip 341 is positioned relative to the second subgroup 23. When installing the first temperature sampling element 332 and the second temperature sampling element 342, the first circuit board 333 and the second circuit board 343 are used as references for the installation positions of the first temperature sampling element 332 and the second temperature sampling element 342, respectively, which facilitates the rapid assembly of the first temperature sampling element 332 and the second temperature sampling element 342.

[0249] In some embodiments, please refer to Figure 15 The first circuit board 333 and the second circuit board 343 are the same circuit board 31, and each circuit board 31 has multiple connection areas 3333 in different positions; the first temperature sensing element 332 is selectively connected to one of the multiple connection areas 3333 of the first circuit board 333, and the second temperature sensing element 342 is selectively connected to the other of the multiple connection areas 3333 of the second circuit board 343.

[0250] The first circuit board 333 and the second circuit board 343 are the same circuit board 31, which means that the first circuit board 333 and the second circuit board 343 are completely identical in material, shape and structure. The first circuit board 333 and the second circuit board 343 can be produced as standard parts. The only difference between the first circuit board 333 and the second circuit board 343 is their placement. The first circuit board 333 corresponds to the first subgroup 22 and the second circuit board 343 corresponds to the second subgroup 23.

[0251] The circuit board 31 has multiple connection areas 3333 in different positions, meaning that the circuit board 31 has multiple connection areas 3333 for mounting temperature sensing elements. Each connection area 3333 has the same structure, and each connection area 3333 can be used to mount either the first temperature sensing element 332 or the second temperature sensing element 342. The number of connection areas 3333 on each circuit board 31 can be two, three, or four, etc., and the specific number of connection areas 3333 can be determined according to the actual situation.

[0252] The circuit board 31 has multiple connection areas 3333 in different positions. When arranging the first temperature sensor 332 and the second temperature sensor 342, it is only necessary to select different connection areas 3333 on the circuit board 31 according to the requirements. This allows the first temperature sensor 332 to be set in a different position on the first circuit board 333 and the second temperature sensor 342 to be set in a different position on the second circuit board 343, resulting in higher installation efficiency for the first temperature sensor 332 and the second temperature sensor 342.

[0253] In some embodiments, please combine Figure 16 and Figure 17 The first circuit board 333 includes a first main body 3331 and a first cantilever 3332. A first sampling chip 331 is disposed on the first main body 3331. One end of the first cantilever 3332 is connected to the first main body 3331, and a first temperature sampling element 332 is disposed on the other end of the first cantilever 3332. And / or, the second circuit board 343 includes a second main body 3431 and a second cantilever 3432. A second sampling chip 341 is disposed on the second main body 3431. One end of the second cantilever 3432 is connected to the second main body 3431, and a second temperature sampling element 342 is disposed on the other end of the second cantilever 3432.

[0254] The first sampling chip 331 is disposed on the first main body 3331, and the first cantilever 3332 is a cantilever structure protruding from the edge of the first main body 3331. The first circuit board 333 does not need to cover the open area around the first cantilever 3332. It only needs to extend the first cantilever 3332 out of the first main body 3331 to be installed on the first temperature sampling element 332, which can save the area of ​​the first circuit board 333 and reduce the manufacturing cost of the first circuit board 333. And / or, the second circuit board 343 includes a second main body 3431 and a second cantilever 3432. The second sampling chip 341 is disposed on the second main body 3431. The second cantilever 3432 is a cantilever structure that protrudes beyond the edge of the second main body 3431. The second circuit board 343 does not need to cover the open area around the second cantilever 3432. It only needs to extend the second cantilever 3432 out of the second main body 3431 to allow the second temperature sampling element 342 to be installed. This can save the area of ​​the second circuit board 343 and reduce the manufacturing cost of the second circuit board 343.

[0255] In some embodiments, the first cantilever portion 3332 and / or the second cantilever portion 3432 are bent structures. A bent structure means that the first cantilever portion 3332 can be bent and deformed relative to the first main body portion 3331 under the action of an external force; and / or, the second cantilever portion 3432 can be bent and deformed relative to the second main body portion 3431 under the action of an external force.

[0256] The first cantilever portion 3332 is designed as a bent structure. Under the action of external force, the first cantilever portion 3332 can be bent and deformed relative to the first main body portion 3331. On the one hand, when installing the first temperature sampling element 332, there may be an installation deviation between the position of the first cantilever portion 3332 and the temperature sampling position on the first battery cell 221 in the first subgroup 22. The position of the first cantilever portion 3332 relative to the first main body portion 3331 can be adjusted by bending and deforming the first cantilever portion 3332, so that the first temperature sampling element 332 is aligned with the temperature sampling position of the first battery cell 221, which is more conducive to the accurate installation of the first temperature sampling element 332. On the other hand, during the operation of the battery cell group 20, the battery cell 21 in the first subgroup 22 will expand and deform. The first cantilever 3332 adapts to the expansion and deformation of the battery cell 21 through its own bending structure, so as to ensure that the first temperature sensor 332 on the first cantilever 3332 is always thermally connected with the temperature acquisition position corresponding to the first battery cell 221, thereby reducing the impact of the expansion and deformation of the battery cell 21 on the acquisition accuracy of the first temperature sensor 332. And / or, the second cantilever portion 3432 is adopted as a bent structure. Under the action of external force, the second cantilever portion 3432 can be bent and deformed relative to the second main body portion 3431. On the one hand, when installing the second temperature sampling element 342, there may be an installation deviation between the position of the second cantilever portion 3432 and the temperature sampling position of the second battery cell 231 in the second subgroup 23. The position of the second cantilever portion 3432 relative to the second main body portion 3431 can be adjusted by bending and deforming the second cantilever portion 3432, so that the second temperature sampling element 342 is aligned with the temperature sampling position on the second battery cell 231, which is more conducive to the accurate installation of the second temperature sampling element 342. On the other hand, during the operation of the battery cell group 20, the battery cell 21 in the second subgroup 23 will expand and deform. The second cantilever 3432 adapts to the expansion and deformation of the battery cell 21 through its own bending structure, so as to ensure that the second temperature sensor 342 on the second cantilever 3432 is always thermally connected with the temperature acquisition position corresponding to the second battery cell 231, thereby reducing the impact of the expansion and deformation of the battery cell 21 on the acquisition accuracy of the second temperature sensor 342.

[0257] In some embodiments, the first temperature sampling element 332 is integrated into the first sampling chip 331, and the second temperature sampling element 342 is integrated into the second sampling chip 341; the first sampling chip 331 is located at a different position on the first circuit board 333 and the second sampling chip 341 is located at a different position on the second circuit board 343.

[0258] The first temperature sensing element 332 is integrated into the first sampling chip 331, meaning that the first temperature sensing element 332 is integrated and disposed on the first sampling chip 331, and the first temperature sensing element 332 is a part of the first sampling chip 331. The second temperature sensing element 342 is integrated into the second sampling chip 341, meaning that the second temperature sensing element 342 is integrated and disposed on the second sampling chip 341, and the second temperature sensing element 342 is a part of the second sampling chip 341. A clearance hole is provided on the first circuit board 333 at the position corresponding to the first temperature sensing element 332 on the first sampling chip 331, allowing for thermally conductive connection between the first temperature sensing element 332 and the corresponding position of the first battery cell 221. A clearance hole is provided on the second circuit board 343 at the position corresponding to the second temperature sensing element 342 on the second sampling chip 341, allowing for thermally conductive connection between the second temperature sensing element 342 and the corresponding position of the second battery cell 231.

[0259] The different positions of the first sampling chip 331 on the first circuit board 333 and the second sampling chip 341 on the second circuit board 343 mean that the relative positions of the first sampling chip 331 and the second sampling chip 341 on the first circuit board 333 are different. For example, the first sampling chip 331 can be set on the left side of the first circuit board 333 and the second sampling chip 341 can be set on the right side of the second circuit board 343.

[0260] The first temperature sensor 332 is integrated into the first sampling chip 331, allowing the first sampling chip 331 to collect temperature information of the first battery cell 221 in the first subgroup 22 via the first temperature sensor 332. This reduces the space required and eliminates the need for a separate connection line 314 between the first sampling chip 331 and the first temperature sensor 332 on the first circuit board 333, resulting in higher integration of the first sampling component 33. Similarly, the second temperature sensor 342 is integrated into the second sampling chip 341, allowing the second sampling chip 341 to collect temperature information of the second battery cell 231 in the second subgroup 23. This also reduces the space required and eliminates the need for a separate connection line 314 between the second sampling chip 341 and the second temperature sensor 342 on the second circuit board 343, resulting in higher integration of the second sampling component 34.

[0261] In some embodiments, please refer to Figure 18The first circuit board 333 and the second circuit board 343 are the same circuit board 31, and each circuit board 31 has multiple mounting areas 3334 in different positions; the first sampling chip 331 is selectively mounted in one of the multiple mounting areas 3334 of the first circuit board 333, and the second sampling chip 341 is selectively mounted in another of the multiple mounting areas 3334 of the second circuit board 343.

[0262] The circuit board 31 has multiple mounting areas 3334 in different positions. This means that the circuit board 31 has multiple mounting areas 3334 for mounting the sampling chip 32. Each mounting area 3334 has the same structure, and each mounting area 3334 can be used to mount either the first sampling chip 331 or the second sampling chip 341. The number of mounting areas 3334 on each circuit board 31 can be two, three, or four, depending on the specific situation. The mounting areas 3334 can specifically be reserved mounting positions on the circuit board 31, with multiple mounting areas 3334 located at different positions on the circuit board 31.

[0263] By using the same circuit board 31 for both the first circuit board 333 and the second circuit board 343, they can be manufactured as standard parts using the same set of production molds, which facilitates mass production of the circuit board 31 and reduces manufacturing costs. Multiple mounting areas 3334 with different positions are pre-set on the circuit board 31. When arranging the first sampling chip 331 and the second sampling chip 341, it is only necessary to select different mounting areas 3334 on the circuit board 31 according to requirements. This allows the first sampling chip 331 to be positioned differently on the first circuit board 333 and the second sampling chip to be positioned differently on the second circuit board 343, resulting in higher installation efficiency for the first sampling chip 331 and the second sampling chip 341.

[0264] In some embodiments, please refer to Figure 11 The battery cell group 20 also includes a third subgroup 24 along the first direction X. The third subgroup 24 is located between the first subgroup 22 and the second subgroup 23. At least two battery cells 21 in the third subgroup 24 are arranged along the first direction X. The multiple sampling components 30 also include a third sampling component 36 along the first direction X. The third sampling component 36 is located between the first sampling component 33 and the second sampling component 34. The third sampling component 36 includes a third sampling chip 32 and a third temperature sampling element. The third sampling chip 32 is electrically connected to multiple voltage sampling points 27 on the third subgroup 24. The third temperature sampling element is used to collect the temperature of at least one battery cell 21 in the third subgroup 24.

[0265] Under the action of the third sampling component 36, the third sampling chip 32 in the third sampling component 36 is electrically connected to multiple voltage sampling points 27 on the third subgroup 24, realizing the acquisition of voltage information of multiple battery cells 21 in the third subgroup 24. The third temperature sampling element is electrically connected to the third sampling chip 32, and the third temperature sampling element can realize the acquisition of temperature information of battery cells 21 in the third subgroup 24. With the cooperation of the first temperature sampling element, the second temperature sampling element and the third temperature sampling element, there are more temperature sampling points at different positions of the battery cell group 20, and the acquired temperature information of the battery device is more accurate.

[0266] According to some embodiments of this application, please refer to Figure 19 The sampling chip integrates at least one of a filtering component and an equalization component.

[0267] The filtering component is connected between the battery cell and the control component. It is used to filter the collected state information of the battery cell and transmit the filtered state information to the control component.

[0268] The equalization component is connected between the battery cell and the control component and is used to equalize the voltage of at least one battery cell connected to the control component.

[0269] Here, the state information of a single battery cell may include, but is not limited to, information such as the voltage, current, and / or temperature of the battery cell. The battery cell state signal corresponding to the collected state information may contain noise when it enters the sampling chip. The filtering component can be used to filter the state information entering the control component to suppress or filter out noise superimposed on the battery cell state signal.

[0270] In some implementations, the battery cell status signal corresponding to the battery cell status information collected by the sampling chip can be fed into the control component via a filtering component.

[0271] When the voltage difference between multiple battery cells connected to the control component is too large, or when the voltage difference between at least one battery cell connected to the control component and other battery cells connected to other sampling chips is too large, the control component can control the equalization component to equalize the voltage of at least one battery cell connected to the control component, thereby reducing the voltage difference between battery cells. For example, the battery management unit can receive the voltage of each battery cell transmitted by the control component, determine the battery cell to be equalized based on the voltage of each battery cell, and control the equalization component connected to the battery cell to be equalized to operate through the control component.

[0272] In some embodiments, the balancing component may include, but is not limited to, at least one of active balancing components and passive balancing components. The active balancing component is used to achieve voltage balance among the battery cells when the voltage difference between the individual cells in the battery device is too large. This is achieved by combining the opening and closing of balancing switches for different battery cells, allowing higher-voltage battery cells to charge lower-voltage battery cells, or by enabling energy exchange between battery cells and balancing capacitors or inductors. The active balancing component may include, but is not limited to, at least one of capacitive active balancing circuits and inductive active balancing circuits. The passive balancing component is used to close the balancing switch corresponding to the higher-voltage battery cell when the voltage difference between the individual battery cells in the battery device is too large. This causes the voltage of the battery cell to decrease after consuming electrical energy through the balancing resistor, thereby reducing the voltage difference between the battery cells.

[0273] It should be noted that the specific circuit structure and device model used in the filtering component and the equalization component can be flexibly selected by those skilled in the art according to the actual situation, and the embodiments of this application do not limit this.

[0274] The filtering and equalization components are integrated with the control components within the sampling chip. This reduces the number of peripheral devices 35 on the sampling chip and the space occupied by them, increases the energy density of the battery device, and reduces the impact of environmental factors such as moisture and solder slag on the filtering and / or equalization components, thus slowing down the aging rate of the components and improving the reliability and stability of the battery device.

[0275] According to some embodiments of this application, please refer to Figure 20 The sampling chip includes a package frame and a die, with filtering components integrated on the die, and / or equalization components integrated between the die and the package frame.

[0276] Here, the sampling chip can be a package, the filtering component can be integrated on the die, and the equalization component can be packaged between the die and the package frame using any suitable packaging method. This application does not limit this.

[0277] For example, the packaging methods that can be used include, but are not limited to, at least one of the following: leadframe structure packaging, system-in-package (SIP), dual in-line package (DIP), and plastic quad flat package (PQF).

[0278] The encapsulation frame refers to the metal frame used to connect the contact points of the die and the external wires, and is usually called the lead frame.

[0279] In some implementations, the die, equalization components, and packaging frame may be covered by a packaging material. The packaging material of the sampling chip may include, but is not limited to, at least one of ceramics, plastics, resins, etc., and the embodiments of this application do not limit this.

[0280] In some implementations, the encapsulation material of the sampling chip may include epoxy resin, which can better protect the internal components of the sampling chip and isolate the sampling chip from external moisture.

[0281] The sampling chip includes a package frame and a die. The filtering component is integrated on the die, and the equalization component is integrated between the die and the package frame. This approach offers two advantages: firstly, integrating the filtering component into the die reduces the sampling chip area and increases device integration density; secondly, placing the equalization component between the die and the package frame facilitates matching the circuit structure and / or device model of the equalization component to different application scenarios, and reduces the impact of heat generated by the equalization component on the overall heat dissipation of the sampling chip.

[0282] In some embodiments, please refer to Figure 21 The filter component includes a first filter capacitor corresponding to each battery cell. One end of the first filter capacitor is connected between the positive terminal of the corresponding battery cell and the control component, and the other end of the first filter capacitor is grounded.

[0283] Here, a corresponding first filter capacitor is provided for each battery cell. By connecting one end of the first filter capacitor between the positive terminal of the corresponding battery cell and the control component, and grounding the other end of the first filter capacitor, noise and AC components in the battery cell status signal output from the positive terminal of the battery cell to the control component can be filtered out, thereby improving the accuracy of the battery cell status signal entering the control component.

[0284] The first filter capacitor can be directly connected to the positive terminal of the corresponding battery cell and the control components, or it can be indirectly connected. The first filter capacitor can be directly grounded, or it can be indirectly grounded through other devices such as resistors and transient voltage suppression diodes.

[0285] It should be noted that the model and specifications of the first filter capacitor can be flexibly selected by those skilled in the art according to the actual application scenario, and the embodiments of this application do not limit this.

[0286] Each first filter capacitor is integrated into the sampling chip. This improves the integration of the sampling chip, reduces the impact and corrosion of the first filter capacitors from environmental factors such as moisture, slows down the aging rate, improves the accuracy of filtering the collected status information, and thus improves the overall reliability of the battery device.

[0287] In some implementations, each of the first filter capacitors can be integrated onto the die in the sampling chip. This further improves the integration density of the sampling chip and further reduces the impact and corrosion of the first filter capacitors from environmental factors such as moisture, thus lowering the aging rate.

[0288] In some implementations, each of the first filter capacitors can be integrated between the die and the package frame in the sampling chip. This facilitates matching the model and specifications of the first filter capacitors to different application scenarios and adjusting the filter cutoff frequency.

[0289] In some embodiments, see continue to see Figure 21 The filter assembly also includes a filter resistor corresponding to each battery cell. One end of the filter resistor is connected to the positive terminal of the corresponding battery cell, and the other end of the filter resistor is connected to the control assembly and grounded through the first filter capacitor.

[0290] Here, by connecting one end of the filter resistor to the positive terminal of the corresponding battery cell and the other end of the filter resistor to the control component and grounded through the first filter capacitor, a resistor-capacitor (RC) filter circuit can be formed between the filter resistor and the first filter capacitor. The model and specifications of both the first filter capacitor and the filter resistor can be flexibly selected by those skilled in the art according to the actual application scenario, and this application embodiment does not limit this selection.

[0291] Each filter resistor and each first filter capacitor are integrated into the sampling chip. This improves the integration of the sampling chip, reduces the impact and corrosion of the first filter capacitors and filter resistors on environmental factors such as moisture, slows down the aging rate, improves the accuracy of filtering the collected status information, and thus improves the overall reliability of the battery device.

[0292] In some implementations, each filter resistor and each first filter capacitor are integrated on the die of the sampling chip. This, on the one hand, further improves the integration density of the sampling chip and further reduces the impact and corrosion of the first filter capacitors and filter resistors from environmental factors such as moisture, thus lowering the aging rate; on the other hand, since the filter resistors are integrated on the die, it allows for the use of filter resistors with larger resistance values. This allows for a further reduction in the capacitance value of the first filter capacitor while still meeting the filtering requirements at the cutoff frequency, thereby reducing the volume occupied by the filter capacitors on the die and further improving the integration density of the sampling chip.

[0293] In some implementations, the filter resistors and the first filter capacitors can be integrated between the die and the package frame in the sampling chip. This facilitates matching the specifications of the filter resistors and first filter capacitors to different application scenarios and adjusting the filter cutoff frequency.

[0294] According to some embodiments of this application, please refer to Figure 22 The connection line 314 includes a first connection line 3141 and a second connection line 3142. The first connection line 3141 includes at least one break structure, which includes a first connection point, a second connection point, and an interval area located between the first connection point and the second connection point. The second connection line 3142 passes through the interval area. The sampling component 30 also includes a connection device 3143, with both ends of the connection device 3143 connected to the first connection point and the second connection point, respectively.

[0295] At locations where projection crossings are required in some connection lines 314, one line can be made into a break structure, and the other line can pass through the interval of the break structure to avoid the two lines crossing and interfering with each other's signal transmission. A connecting device 3143 (e.g., a zero-ohm device) is used to connect the two ends of the broken line so that the signal to be transmitted by the line can be transmitted normally.

[0296] According to some embodiments of this application, in the same projection plane perpendicular to the thickness direction of the circuit board 31, the orthographic projections of all the connection lines 314 connected to different voltage sampling sections 313 do not overlap.

[0297] The orthographic projections of all the connection lines 314 connected to different voltage sampling units 313 do not overlap. That is, there is no phenomenon of line crossing or partial overlap of all the connection lines 314 on the circuit board 31 connected to different voltage sampling units 313. The circuit board 31 can be used with an insulation layer-line layer-insulation layer structure, without the need to set more layers of alternating insulation layers and line layers, and without the need to use the process of connecting lines 314 across layers. This can result in lower material and process costs, a simpler molding scheme, and higher sampling reliability.

[0298] In the same projection plane perpendicular to the thickness direction of the circuit board 31, the orthographic projections of all the connection lines 314 connected to different voltage sampling units 313 do not overlap, which means that the connection lines 314 between the functional pins 321 on the circuit board 31 and the different voltage sampling units 313 do not cross on the circuit board 31.

[0299] According to some embodiments of this application, please refer to Figure 23 The circuit board 31 includes two insulating cover films 315 and a conductive layer 316 sandwiched between the two insulating cover films 315. All connection lines 314 are formed on the conductive layer 316.

[0300] The insulating cover film 315 refers to an insulating material layer that has an insulating function and covers the surface of the conductive layer 316. The conductive layer 316 can be made of a metallic conductive material, for example, the material of the conductive layer 316 can be copper or aluminum. All connecting lines 314 are formed on the conductive layer 316.

[0301] Without crossing any lines, all lines can be formed on the conductive layer 316, eliminating the need for an additional conductive layer 316. This also allows all lines to be formed on the same conductive layer 316 at once, reducing the material used in the conductive layer 316 and lowering the process cost of forming the lines.

[0302] According to some embodiments of this application, please refer to Figure 23 At the voltage sampling section 313, at least one of the two insulating covering films 315 is opened so that at least part of the conductive layer 316 is exposed to the insulating covering film 315, and the sampling section is welded to the sampling point through the part of the conductive layer 316 exposed to the insulating covering film 315.

[0303] At least one of the two insulating covering films 315 has a window to expose at least a portion of the conductive layer 316. This means that at least one of the two insulating covering films 315 has a window, that is, the portion of the insulating covering film 315 with the window is exposed, allowing the conductive layer 316 in that portion to be exposed. The voltage sampling unit 313 is soldered to the voltage sampling point 27 through the portion of the conductive layer 316 exposed in the insulating covering film 315. This means that the voltage sampling unit 313 can be directly soldered to the voltage sampling point 27 through the portion of the conductive layer 316 exposed in the insulating covering film 315.

[0304] Based on the single-layer conductive layer 316, the circuit board 31 can form a pad and connect to the voltage sampling point 27 by opening a window on the insulating cover film 315, which makes the connection process between the circuit board 31 and the voltage sampling point 27 simpler.

[0305] According to some embodiments of this application, the conductive layer 316 is formed into the connecting lines 314 using a die-cutting process or an etching process.

[0306] The conductive layer 316 is formed with connection lines 314 by die-cutting or etching. Die-cutting and etching are conventional processing techniques for circuit boards 31, and will not be described in detail here.

[0307] Based on the single-layer conductive layer 316, all the connection lines 314 can be formed in one step by using die-cutting or etching processes, which makes the process of forming the connection lines 314 simpler and saves costs.

[0308] According to some embodiments of this application, please refer to Figure 11 At least one sampling component 30 is used to sample multiple battery cells 21.

[0309] At least one sampling component 30 is used to sample multiple battery cells 21, which means that at least one sampling component 30 among the multiple sampling components 30 can sample multiple battery cells 21 simultaneously. The number of multiple battery cells 21 can be any positive integer such as two, three or four, depending on the actual situation.

[0310] This allows one sampling chip 32 to connect to multiple battery cells 21 for sampling simultaneously, improving the utilization rate of the sampling chip 32 and reducing the number of sampling chips 32 to lower costs.

[0311] According to some embodiments of this application, please refer to Figure 11 At least one sampling component 30 is used to sample 2-20 battery cells 21.

[0312] At least one sampling component 30 is used to sample 2-20 battery cells 21. This means that at least one of the multiple sampling components 30 can sample 2-20 battery cells 21. For example, the sampling component 30 can sample 2, 6, 8, 12, 18, or 20 battery cells 21. The number of battery cells 21 corresponding to each sampling component 30 can be equal or unequal, depending on the actual situation.

[0313] This ensures that the number of connection lines 314 that need to be arranged in the same sampling component 30 is not too large, and that the number of pins connected on the same sampling chip 32 is not too small. This reduces the number of chips used while taking into account the difficulty of arranging the connection lines 314 without them crossing.

[0314] Based on some embodiments of this application, please refer to... Figure 2 , Figure 3 and Figure 24 The battery cell group 20 includes multiple battery cells 21. Each battery cell 21 includes a housing 211, a first terminal 214, and a second terminal 215. The first terminal 214 and the second terminal 215 have opposite polarities. The first terminal 214 and the second terminal 215 are located on the first wall 213 of the housing 211. The first terminal 214 and the second terminal 215 are located at opposite ends of the first wall 213. The sampling component 30 is located on the first wall 213, and the sampling chip 32 is located between the first terminal 214 and the second terminal 215.

[0315] The first electrode post 214 and the second electrode post 215 are located on the first wall 213 of the housing 211, which means that the first electrode post 214 and the second electrode post 215 are disposed on the same wall of the housing 211, that is, the two electrode terminals of the battery cell 21 are located on the same side of the battery cell 21.

[0316] The first electrode 214 and the second electrode 215 are located at opposite ends of the first wall 213, and the polarities of the first electrode 214 and the second electrode 215 are opposite. The sampling assembly 30 is located on the first wall 213, and the sampling chip 32 is located between the first electrode 214 and the second electrode 215, meaning that the first electrode 214 and the second electrode 215 are located on both sides of the sampling chip 32, and the sampling section of the circuit board 31 can be located on both sides of the sampling chip 32.

[0317] The battery device 100 may further include a plurality of busbars 40, which electrically connect the first terminal 214 and the second terminal 215 of two adjacent battery cells 21. The plurality of busbars 40 includes a plurality of first busbars 41 and a plurality of second busbars 42. The plurality of first busbars 41 are arranged in a row on one side of the circuit board 31 in the second direction Y, and the plurality of second busbars 42 are arranged in a row on the other side of the circuit board 31 in the second direction Y. Odd-numbered voltage sampling points 25 may be located in the first busbars 41, and even-numbered voltage sampling points 26 may be located in the second busbars 42.

[0318] The battery device 100 also includes an isolation plate 50, which is disposed between the battery cell group 20 and the busbar 40.

[0319] When the first terminal 214 and the second terminal 215 are located on both sides of the sampling chip 32, the voltage sampling unit 313 can also be located on both sides of the sampling chip 32, so that the functional pin 321 on the sampling chip 32 can be connected to the voltage sampling unit 313 on both sides and used to detect the electrical signals of the first terminal 214 and the second terminal 215.

[0320] According to some embodiments of this application, please refer to Figure 2 , Figure 3 and Figure 25 The battery cell group 20 includes multiple battery cells 21. Each battery cell 21 includes a housing 211, a first terminal 214, and a second terminal 215. The first terminal 214 and the second terminal 215 have opposite polarities. The first terminal 214 and the second terminal 215 are located on the first wall 213 of the housing 211. The maximum dimension of the first wall 213 along the length direction is greater than the maximum dimension along the width direction. The first terminal 214 and the second terminal 215 are located at one end of the first wall 213 along the length direction. The sampling chip 32 is located on the same side of the first terminal 214 and the second terminal 215 along the length direction.

[0321] The sampling chip 32 is located on the same side of the first pole 214 and the second pole 215 along the length direction, that is, the first pole 214 and the second pole 215 are located on the same side of the sampling chip 32.

[0322] The battery device 100 includes multiple busbars 40, which connect the first terminal 214 and the second terminal 215 of two adjacent battery cells 21. The voltage sampling points 27 are all located on the busbars 40.

[0323] When both the first pole 214 and the second pole 215 are located at one end of the first wall 213 along its length, there may not be enough space between the first pole 214 and the second pole 215 to accommodate the sampling component 30. The sampling component 30 can be placed on the same side of the first pole 214 and the second pole 215, and the sampling units can also be placed on the same side of the sampling chip 32 to detect the electrical signals of the first pole 214 and the second pole 215.

[0324] According to some embodiments of this application, please refer to Figure 26 The battery cell group 20 includes multiple battery cells 21. Each battery cell 21 includes a housing 211, a first terminal 214, and a second terminal 215. The first terminal 214 and the second terminal 215 have opposite polarities. The maximum dimension of the battery cell 21 along its length is greater than the maximum dimension along its width and the maximum dimension along its height. The housing 211 includes a first wall 213 and a second wall 217 that are disposed opposite each other along its length. The first terminal 214 is located on the first wall 213, and the second terminal 215 is located on the second wall 217. The first terminal 214 is electrically connected to the housing 211. A sampling component 30 is disposed on the second wall 217, and at least one voltage sampling point 27 is used to collect the electrical signal of the housing 211.

[0325] The first electrode 214 is electrically connected to the housing 211, and the potential of the first electrode 214 can be transferred to the second wall 217 through the energized housing 211. The sampling component 30 is set on the second wall 217 to collect the voltage signals of the two electrodes, which can be applied to the sampling of the battery cell 21 as a blade battery.

[0326] When the first pole 214 and the second pole 215 are located on two different side walls of the housing 211, if the circuit board 31 is directly extended to the vicinity of the first pole 214 and the second pole 215 to collect electrical signals, a longer circuit board 31 is required. However, by using the housing 211 to carry the electrical signal of one pole to the vicinity of the other pole, it is convenient for the sampling component 30 to be set up at this location to collect the electrical signals of the two poles, which can save material costs.

[0327] According to some embodiments of this application, please refer to Figure 2 and Figure 3The battery cell assembly 20 includes multiple battery cells 21. Each battery cell 21 includes a housing 211, a first terminal 214, and a second terminal 215. The first terminal 214 and the second terminal 215 have opposite polarities. The housing 211 includes two opposing first walls, which are the surface walls with the largest area. The second wall and the third wall are respectively adjacent to the first wall. The first terminal 214 is located on one of the first walls, and the second terminal 215 is located on the other first wall. The maximum dimension of the battery cell 21 along the length direction is greater than the maximum dimension of the battery cell 21 along the width direction and the maximum dimension along the height direction. The first terminal 214 and the second terminal 215 are respectively located at both ends of the battery cell 21 along the length direction. The first terminal 214 is electrically connected to the housing 211. The sampling component 30 is located on the wall surface where the second terminal 215 is located. Furthermore, at least one voltage sampling point 27 is used to collect the electrical signal of the housing 211.

[0328] When the first pole 214 and the second pole 215 are located on two opposite side walls of the housing 211, if the circuit board 31 is directly extended to the vicinity of the first pole 214 and the second pole 215 to collect electrical signals, a longer circuit board 31 is required. However, by using the housing 211 to carry the electrical signal of one pole to the vicinity of the other pole, it is convenient for the sampling component 30 to be set up at this location to collect the electrical signals of the two poles, which can save material costs.

[0329] According to some embodiments of this application, please refer to Figure 27 The battery cell group 20 includes multiple cylindrical battery cells 21. Each cylindrical battery cell 21 includes a housing 211, a first terminal 214, and a second terminal 215. The first terminal 214 and the second terminal 215 have opposite polarities. The first terminal 214 and the second terminal 215 are respectively disposed at both ends of the cylindrical housing 211 along the axial direction. The first terminal 214 and the housing 211 are electrically connected. The sampling component 30 is located on the end face where the second terminal 215 is located. At least one voltage sampling point 27 is used to collect the electrical signal of the housing 211.

[0330] The end face area of ​​the battery cell 21 is small, so the positive and negative terminals can be arranged on the two opposite end faces of the cylindrical battery cell 21 respectively, and the housing 211 is electrically connected to one of the terminals, so that the sampling component 30 can be arranged on the end face where the other terminal is located to collect the electrical signals of the two terminals at the same time.

[0331] According to some embodiments of this application, the battery cell pack 20 includes a plurality of cylindrical battery cells 21. Each cylindrical battery cell 21 includes a housing 211, a first terminal 214 and a second terminal 215. The first terminal 214 and the second terminal 215 are located on the same end face. The sampling component 30 is located on the end face where the first terminal 214 and the second terminal 215 are located. The sampling chip 32 is located on the same side of the first terminal 214 and the second terminal 215.

[0332] When the positive and negative terminals of the cylindrical battery cell 21 are located on the same end face, the sampling component 30 can also be arranged on the end face where the positive and negative terminals are located to collect the electrical signals of the two terminals.

[0333] In some embodiments, please refer to Figures 1 to 27The battery device 100 includes a battery cell group 20 and a sampling component 30. The battery cell group 20 includes multiple voltage sampling points 27. The sampling component 30 includes a sampling chip 32 and a circuit board 31. The sampling chip 32 is connected to the circuit board 31 and has multiple functional pins 321. The circuit board 31 includes multiple connection lines 314 and multiple voltage sampling units 313. The functional pins 321 are connected to the voltage sampling units 313 through the connection lines 314, so that they can be connected to the voltage sampling points 27 through the voltage sampling units 313. The circuit board 31 includes a first edge portion 311. The voltage sampling units 313 include multiple first voltage sampling units 3131, which are located on the first edge portion 311 and along a first direction X. The voltage signal acquired by the plurality of first voltage sampling units 3131 on the first edge portion 311 increases; the plurality of functional pins 321 include a first voltage sampling pin group 3211, the first voltage sampling pin group 3211 includes a plurality of first voltage sampling pins 32111, the first voltage sampling unit 3131 is connected to the first voltage sampling pin 32111 through a connecting line 314; the first voltage sampling pins 32111 in the first voltage sampling pin group 3211 are arranged sequentially in the circumferential direction of the sampling chip 32 along the first spiral direction S, and the voltage signal acquired by the first voltage sampling pin 32111 increases along the first spiral direction S, the first spiral direction S is the same as the first direction X in the tangential direction P toward the first edge portion 311. Multiple first voltage sampling pins 32111 are respectively numbered as different CIN X pins. The X of the multiple CIN X pins is one of multiple different positive integers equal to 0 and greater than or equal to 1. Each of the multiple CIN X pins is selectively connected to multiple first voltage sampling sections 3131 through connection lines 314. The CIN X pins of the multiple first voltage sampling pins 32111 are arranged sequentially in the circumferential direction of the sampling chip 32 along the first spiral direction S. Furthermore, along the first spiral direction S, the X of the CIN X pins increases sequentially. The first spiral direction S is the same as the first direction X in the tangential direction P toward the side of the first edge section 311. The multiple functional pins 321 also include a first DIS pin group, which includes multiple DIS Y pins. The Y of the multiple DIS Y pins is one of a plurality of different positive integers equal to 0 and greater than or equal to 1. Each of the multiple DIS Y pins is selectively connected to a plurality of first voltage sampling units 3131 via a connection line 314. The multiple DIS Y pins in the first DIS pin group are arranged sequentially in the circumferential direction of the sampling chip 32 along a first spiral direction S. Along the first spiral direction S, the Y of the DIS Y pins increases sequentially. The first spiral direction S is the same as the first direction X in the tangential direction P toward the side of the first edge portion 311.

[0334] The sampling component 30 includes a sampling chip 32 and a circuit board 31. The sampling chip 32 has multiple functional pins 321, which are connected to different voltage sampling sections 313 via connection lines 314 on the circuit board 31, and connected to the voltage sampling points 27 of the battery cell group 20 via the voltage sampling sections 313. A plurality of first voltage sampling units 3131 are provided on the first edge portion 311 of the circuit board 31. The first voltage sampling units 3131 are connected to the first voltage sampling pins 32111 through the connecting lines 314. By arranging the plurality of first voltage sampling pins 32111 in the first voltage sampling pin group 3211 sequentially along the first spiral direction S of the sampling chip 32, the voltage signal acquired by the first voltage sampling pins 32111 increases along the first spiral direction S. The tangential direction P of the first spiral direction S toward the first edge portion 311 is the same as the first direction X. This makes it easy for the plurality of first voltage sampling pins 32111 to be sequentially connected to the plurality of first voltage sampling units 3131 of the first edge portion 311 along the first spiral direction S. This makes the connecting lines 314 corresponding to the first voltage sampling pin group 3211 spirally distributed, and the connecting lines 314 are less likely to cross.

[0335] In some embodiments, the circuit board 31 further includes a second edge portion 312, and the first edge portion 311 and the second edge portion 312 are respectively distributed on opposite sides of the sampling chip 32; the second edge portion 312 is provided with a plurality of second voltage sampling portions 3132, and the voltage signals acquired by the plurality of second voltage sampling portions 3132 located on the second edge portion 312 increase sequentially along the first direction X. The plurality of functional pins 321 include a second voltage sampling pin group 3213, the second voltage sampling pin group 3213 includes a plurality of second voltage sampling pins 32131, and the second voltage sampling portions 3132 are connected to the second voltage sampling pins 32131 through connecting lines 314; the second voltage sampling pins 32131 in the second voltage sampling pin group 3213 are arranged sequentially along the second spiral direction T in the circumferential direction of the sampling chip 32, and the voltage signals acquired by the second voltage sampling pins 32131 increase sequentially along the second spiral direction T, and the tangential direction P of the second spiral direction T toward the second edge portion 312 is the same as the first direction X. Multiple functional pins 321 include a second equalization circuit pin group 3214, which includes multiple second equalization circuit pins 32141. The second voltage sampling unit 3132 is connected to the second equalization circuit pins 32141 via the connection line 314. The second equalization circuit pins 32141 in the second equalization circuit pin group 3214 are arranged sequentially along the second spiral direction T in the circumferential direction of the sampling chip 32. The voltage signal acquired by the second equalization circuit pins 32141 increases along the second spiral direction T. The tangential direction P of the second spiral direction T toward the second edge portion 312 is the same as the first direction X. The first spiral direction S is opposite to the second spiral direction T.

[0336] The voltage sampling points 27 of the first edge portion 311 and the second edge portion 312 both increase along the first direction X, facilitating the connection of multiple battery cells 21 arranged along the first direction X in series and parallel circuits. This also facilitates the sequential connection of multiple second voltage sampling pins 32131 in the second voltage sampling pin group 3213 with the multiple second voltage sampling portions 3132 of the second edge portion 312 along the second spiral direction T, resulting in a spiral distribution of the connection lines 314 corresponding to the second voltage sampling pin group 3213 without crossing. Similarly, this facilitates the sequential connection of multiple second equalization circuit pins 32141 in the second equalization circuit pin group 3214 with the multiple second voltage sampling portions 3132 of the second edge portion 312 along the second spiral direction T, resulting in a spiral distribution of the connection lines 314 corresponding to the second equalization circuit pin group 3214 without crossing.

[0337] In some embodiments, the battery cell group 20 includes a negative output terminal and a positive output terminal. Voltage sampling points 27 for sampling the voltage signal of the negative output terminal are numbered 0, and voltage sampling points 27 for sampling the voltage signal of the positive output terminal are numbered N. Along the current direction from the negative output terminal to the positive output terminal of the battery cell group 20, the numbers of the multiple voltage sampling points 27 sequentially increase from 0 to N, where N is a positive integer. The circuit board 31 includes a first edge portion 311 and a second edge portion 312. The first edge portion 311 is provided with multiple first voltage sampling sections 3131, and the second edge portion 312 is provided with multiple second voltage sampling sections 3132. The first edge portion 311 and the second edge portion 312 are respectively distributed on opposite sides of the sampling chip 32. Multiple functional pins 321 include a first voltage sampling pin group 321. The sampling chip 32 is provided with a first voltage sampling pin group 3211 and a second voltage sampling pin group 3213. The first voltage sampling pin group 3211 includes multiple first voltage sampling pins 32111, and a first voltage sampling unit 3131 is connected to the first voltage sampling pins 32111 via a connection line 314. The second voltage sampling pin group 3213 includes multiple second voltage sampling pins 32131, and a second voltage sampling unit 3132 is connected to the second voltage sampling pins 32131 via the connection line 314. At least a portion of the odd-numbered voltage sampling points 25 are connected to the second voltage sampling pins 32131, and at least a portion of the even-numbered voltage sampling points 26 are connected to the first voltage sampling pins 32111. The first voltage sampling pin group 3211 and the second voltage sampling pin group 3213 are spaced apart circumferentially along the sampling chip 32. The first voltage sampling pin group 3211 and the second voltage sampling pin group 3213 are located on different sides of the sampling chip 32.

[0338] The voltage sampling pins located on different sides of the sampling chip 32 are respectively connected to the voltage sampling section 313 on different edges of the circuit board 31, and the connection line 314 connected to the first voltage sampling pin group 3211 does not interfere with the connection line 314 connected to the second voltage sampling pin group 3213.

[0339] The first voltage sampling pin group 3211 and the second voltage sampling pin group 3213 are located on different sides of the sampling chip 32, which allows the sampling chip 32 to make full use of the different sides to set the function pins 321. This makes the sampling chip 32 smaller and occupies less area on the circuit board 31, thereby reducing the impact on the arrangement of the connection lines 314.

[0340] In some embodiments, multiple sampling components 30 are connected to the same battery cell group 20. The multiple sampling components 30 are arranged along a first direction X. The sampling chip 32 includes communication pins. The communication pins of two adjacent sampling chips 32 along the first direction X are connected by wires independently formed on the circuit board 31. Two adjacent sampling chips 32 along the first direction X include a first sampling chip 331 and a second sampling chip 341. The first sampling chip 331 includes two first communication pins, and the second sampling chip 341 includes two second communication pins. The wires include a first wire 3311 and a second wire 3411. The first wire 3311 and the second wire 3411 are respectively used to connect a first communication pin and a second communication pin. The first wire 3311 and the second wire 3411 form a twisted pair.

[0341] Connecting multiple sampling components 30 to the same battery cell group 20 reduces the number of battery cells 21 that each sampling component 30 needs to connect to, thus simplifying the arrangement of connection lines 314 on the circuit board 31 of each sampling component 30 to prevent them from crossing. Multiple sampling components 30 can be molded independently before being connected, and communication wires can be arranged without occupying additional space on the circuit board 31, making it simpler to arrange non-crossing connection lines 314 on the circuit board 31.

[0342] In some embodiments, a plurality of sampling components 30 are arranged along a first direction X, and the battery cell group 20 includes a first battery cell 221 and a second battery cell 231 located at opposite ends along the first direction X. At least one sampling component 30 is connected to at least one of the first battery cell 221 and the second battery cell 231 to perform temperature sampling. The first battery cell 221 is connected to the one of the plurality of sampling components 30 with the smallest distance, and / or, the second battery cell 231 is also connected to the one of the plurality of sampling components 30 with the smallest distance. The same battery cell group 20 includes multiple sampling components 30 arranged along a first direction X. The sampling components 30 located at both ends along the first direction X are a first sampling component 33 and a second sampling component 34, respectively. The distance between the first sampling component 33 and the first battery cell 221 is less than the distance between the second sampling component 34 and the first battery cell 221, and the distance between the second sampling component 34 and the second battery cell 231 is less than the distance between the first sampling component 33 and the second battery cell 231. The first sampling component 33 is connected to the first battery cell 221 to perform temperature sampling, and / or the second sampling component 34 is connected to the second battery cell 231 to perform temperature sampling.

[0343] At least one sampling component 30 is connected to at least one of the first battery cell 221 and the second battery cell 231 to perform temperature sampling, so that the battery cells 21 located at the end of the battery cell group 20 can be monitored when the battery device 100 is monitored, and the temperature difference detection of the battery cells 21 of the whole battery is more accurate. The connection line 314 for sampling the temperature of the first battery cell 221 or the second battery cell 231 is made as short as possible, so that the connection line 314 for sampling the temperature of the first battery cell 221 or the second battery cell 231 does not need to cross other sampling components 30, thus avoiding interference with the wiring layout of other sampling components 30.

[0344] In some embodiments, within the same projection plane perpendicular to the thickness direction of the circuit board 31, the orthographic projections of all connection lines 314 connected to different voltage sampling units 313 do not overlap. This means that the orthographic projections of all connection lines 314 connected to different voltage sampling units 313 within the same projection plane perpendicular to the thickness direction of the circuit board 31 do not overlap on the circuit board 31.

[0345] In some embodiments, the circuit board 31 includes two insulating cover films 315 and a conductive layer 316 sandwiched between the two insulating cover films 315, with all connection lines 314 formed on the conductive layer 316. At the location of the voltage sampling section 313, at least one of the two insulating cover films 315 has a window to expose at least a portion of the conductive layer 316. The sampling section is soldered to the sampling point through the portion of the conductive layer 316 exposed on the insulating cover film 315. Without crossing lines, all lines can be formed on the conductive layer 316, eliminating the need for an additional conductive layer 316 and allowing all lines to be formed on the same conductive layer 316 at once, reducing the material used in the conductive layer 316 and lowering the manufacturing cost of the circuit. Based on a single conductive layer 316, the circuit board 31 can easily connect to the voltage sampling point 27 by forming pads through windows in the insulating cover film 315, simplifying the connection process between the circuit board 31 and the voltage sampling point 27.

[0346] In some embodiments, at least one sampling component 30 is used to sample multiple battery cells 21. This allows one sampling chip 32 to connect to multiple battery cells 21 simultaneously for sampling, improving the utilization rate of the sampling chip 32 and reducing the number of sampling chips 32 to lower costs. At least one sampling component 30 is used to sample 2-20 battery cells 21. This ensures that the number of connection lines 314 that need to be arranged in the same sampling component 30 is not excessive, and that the number of pins connected on the same sampling chip 32 is not insufficient, reducing the number of chips used while also addressing the challenge of preventing the connection lines 314 from intersecting.

[0347] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A battery device, characterized in that, include: The battery cell pack includes multiple voltage sampling points; A sampling component includes a sampling chip and a circuit board. The sampling chip is connected to the circuit board and has multiple functional pins. The circuit board includes multiple connection lines and multiple voltage sampling units. The functional pins are connected to the voltage sampling units through the connection lines to be connected to the voltage sampling points through the voltage sampling units. The circuit board includes a first edge portion, and the voltage sampling unit includes a plurality of first voltage sampling units located on the first edge portion. Along a first direction, the voltage signals acquired by the plurality of first voltage sampling units located on the first edge portion increase. The plurality of functional pins includes a first voltage sampling pin group, the first voltage sampling pin group includes a plurality of first voltage sampling pins, and the first voltage sampling unit is connected to the first voltage sampling pins through the connection line; The first voltage sampling pins in the first voltage sampling pin group are arranged sequentially along the first spiral direction in the circumferential direction of the sampling chip, and the voltage signal acquired by the first voltage sampling pin increases along the first spiral direction. The first spiral direction is the same as the first direction in the tangential direction toward the first edge portion.

2. The battery device according to claim 1, characterized in that, The plurality of first voltage sampling pins are respectively numbered as different CIN X pins, and X of the plurality of CIN X pins is one of a plurality of different positive integers equal to 0 and greater than or equal to 1. Each of the plurality of CIN X pins is selectively connected to the plurality of first voltage sampling units through a connection line. The CIN X pins among the plurality of first voltage sampling pins are arranged sequentially along the first spiral direction in the circumferential direction of the sampling chip, and the X of the CIN X pins increases sequentially along the first spiral direction. The first spiral direction is the same as the first direction in the tangential direction toward the first edge portion.

3. The battery device according to claim 1, characterized in that, The plurality of functional pins also include a first DIS pin group, the first DIS pin group including a plurality of DIS Y pins, wherein the Y of the plurality of DIS Y pins is one of a plurality of different positive integers equal to 0 and greater than or equal to 1, and each of the plurality of DIS Y pins is selectively connected to a plurality of the first voltage sampling units through a connection line. The plurality of DIS Y pins in the first DIS pin group are arranged sequentially along the first spiral direction in the circumferential direction of the sampling chip, and the Y of the DIS Y pins increases sequentially along the first spiral direction. The first spiral direction is the same as the first direction in the tangential direction toward the first edge portion.

4. The battery device according to claim 1, characterized in that, The plurality of functional pins also includes a first equalization circuit pin group, which includes a plurality of first equalization circuit pins, and the first voltage sampling unit is connected to the first equalization circuit pins through the connection line. The first equalization circuit pins in the first equalization circuit pin group are arranged sequentially along the first spiral direction in the circumferential direction of the sampling chip, and the voltage signal acquired by the first equalization circuit pin increases along the first spiral direction. The first spiral direction is the same as the first direction in the tangential direction toward the first edge portion.

5. The battery device according to claim 2, characterized in that, The circuit board also includes a second edge portion, and the first edge portion and the second edge portion are respectively distributed on opposite sides of the sampling chip; The second edge portion is provided with a plurality of second voltage sampling units, and along the first direction, the voltage signals acquired by the plurality of second voltage sampling units located on the second edge portion increase sequentially.

6. The battery device according to claim 5, characterized in that, The plurality of functional pins includes a second voltage sampling pin group, the second voltage sampling pin group includes a plurality of second voltage sampling pins, and the second voltage sampling unit is connected to the second voltage sampling pins through the connection line; The second voltage sampling pins in the second voltage sampling pin group are arranged sequentially along the second spiral direction in the circumferential direction of the sampling chip. The voltage signal acquired by the second voltage sampling pin increases along the second spiral direction. The second spiral direction is the same as the first direction in the tangential direction toward the second edge portion.

7. The battery device according to claim 5, characterized in that, The plurality of functional pins include a second CIN pin group, which includes a plurality of CIN Z pins, wherein the Z value is different from the X value in the CIN X pin, and each of the plurality of CIN Z pins is selectively connected to a plurality of the second voltage sampling units via a connection line; The CIN Z pins in the second CIN pin group are arranged sequentially along the second spiral direction in the circumferential direction of the sampling chip, and the Z of the CIN Z pins increases sequentially along the second spiral direction. The second spiral direction is the same as the first direction in the tangential direction toward the second edge portion.

8. The battery device according to claim 5, characterized in that, The plurality of functional pins includes a second equalization circuit pin group, the second equalization circuit pin group includes a plurality of second equalization circuit pins, and the second voltage sampling unit is connected to the second equalization circuit pins through the connection line; The second equalization circuit pins in the second equalization circuit pin group are arranged sequentially along the second spiral direction in the circumferential direction of the sampling chip. Furthermore, the voltage signal acquired by the second equalization circuit pins increases along the second spiral direction. The second spiral direction is the same as the first direction in the tangential direction toward the second edge portion.

9. The battery device according to claim 5, characterized in that, The plurality of functional pins include a second DIS pin group, which includes a plurality of DIS Q pins, wherein the Q pins have different Y values ​​than the DIS Y pins, and each of the plurality of DIS Q pins is selectively connected to a plurality of the second voltage sampling units via a connection line. The plurality of DIS Q pins in the second DIS pin group are arranged sequentially along the second spiral direction in the circumferential direction of the sampling chip, and the Q of the DIS Q pins increases sequentially along the second spiral direction. The second spiral direction is the same as the first direction in the tangential direction toward the second edge portion.

10. The battery device according to claim 6, characterized in that, The first helix direction is opposite to the second helix direction.

11. The battery device according to claim 1, characterized in that, The battery cell assembly includes a negative output terminal and a positive output terminal. The voltage sampling point used to sample the voltage signal of the negative output terminal is numbered 0, and the voltage sampling point used to sample the voltage signal of the positive output terminal is numbered N. Along the current direction from the negative output terminal to the positive output terminal of the battery cell assembly, the numbers of the multiple voltage sampling points are sequentially increased from 0 to N, where N is a positive integer. The circuit board further includes a second edge portion, which is provided with a plurality of second voltage sampling portions. The first edge portion and the second edge portion are respectively distributed on opposite sides of the sampling chip. The sampling chip further includes a second voltage sampling pin group, which includes a plurality of second voltage sampling pins, and the second voltage sampling unit is connected to the second voltage sampling pins through the connection line; At least a portion of the voltage sampling points numbered odd are connected to the second voltage sampling pin, and at least a portion of the voltage sampling points numbered even are connected to the first voltage sampling pin. The first voltage sampling pin group and the second voltage sampling pin group are spaced apart along the circumferential direction of the sampling chip.

12. The battery device according to claim 11, characterized in that, The first voltage sampling pin group and the second voltage sampling pin group are located on different sides of the sampling chip.

13. The battery device according to claim 1, characterized in that, Multiple of the sampling components are connected to the same battery cell group.

14. The battery device according to claim 13, characterized in that, The sampling components are arranged along the first direction, and the sampling chip includes communication pins. The communication pins of two adjacent sampling chips along the first direction are connected by wires independently formed on the circuit board.

15. The battery device according to claim 14, characterized in that, Two adjacent sampling chips along the first direction include a first sampling chip and a second sampling chip. The first sampling chip includes two first communication pins, and the second sampling chip includes two second communication pins. The wires include a first wire and a second wire. The first wire and the second wire are respectively used to connect one of the first communication pins and one of the second communication pins. The first wire and the second wire form a twisted pair.

16. The battery device according to claim 13, characterized in that, The plurality of sampling components are arranged along the first direction, and two adjacent sampling chips along the first direction communicate wirelessly.

17. The battery device according to claim 13, characterized in that, The battery device also includes a main control board, and the sampling chip of at least one sampling component includes a first communication pin for connecting to the main control board.

18. The battery device according to claim 13, characterized in that, The plurality of the sampling components are arranged along a first direction, and the battery cell group includes a first battery cell and a second battery cell located at both ends along the first direction; At least one sampling component is connected to at least one of the first battery cell and the second battery cell to perform temperature sampling.

19. The battery device according to claim 18, characterized in that, The first battery cell is connected to the one with the smallest distance among the plurality of sampling components, and / or the second battery cell is connected to the one with the smallest distance among the plurality of sampling components.

20. The battery device according to claim 18, characterized in that, The same battery cell group includes multiple sampling components arranged along the first direction. The sampling components located at both ends along the first direction are respectively the first sampling component and the second sampling component. The distance between the first sampling component and the first battery cell is less than the distance between the second sampling component and the first battery cell, and the distance between the second sampling component and the second battery cell is less than the distance between the first sampling component and the second battery cell. The first sampling component is connected to the first battery cell to perform temperature sampling, and / or the second sampling component is connected to the second battery cell to perform temperature sampling.

21. The battery device according to claim 20, characterized in that, The battery cell group includes a first subgroup and a second subgroup, and both the first subgroup and the second subgroup include a portion of the battery cells in the battery cell group; the first subgroup includes the first battery cell, the second subgroup includes the second battery cell, and the number of battery cells in the first subgroup and the second subgroup are equal; The first sampling component includes a first circuit board, a first sampling chip, and a first temperature sensing element. The first sampling chip is disposed on the first circuit board, and the first sampling chip is electrically connected to multiple voltage sampling points on the first subgroup through the first circuit board. The first temperature sensing element is connected to the first battery cell to collect the temperature of the first battery cell. The second sampling component includes a second circuit board, a second sampling chip, and a second temperature acquisition element. The second sampling chip is disposed on the second circuit board, and the second sampling chip is electrically connected to multiple voltage sampling points on the second subgroup through the second circuit board. The second temperature acquisition element is connected to the second battery cell to acquire the temperature of the second battery cell.

22. The battery device according to claim 21, characterized in that, The first sampling chip and the first temperature sensing element are both disposed on the first circuit board; the second sampling chip and the second temperature sensing element are both disposed on the second circuit board; The first sampling chip is positioned at the same location on the first circuit board as the second sampling chip is positioned on the second circuit board. The first temperature sensor is positioned differently on the first circuit board than the second temperature sensor is positioned differently on the second circuit board.

23. The battery device according to claim 22, characterized in that, The first circuit board and the second circuit board are the same circuit board, and each circuit board has multiple connection areas in different positions; The first temperature sensor is selectively connected to one of the plurality of connection areas of the first circuit board, and the second temperature sensor is selectively connected to another of the plurality of connection areas of the second circuit board.

24. The battery device according to claim 22, characterized in that, The first circuit board includes a first main body and a first cantilever. The first sampling chip is disposed on the first main body, one end of the first cantilever is connected to the first main body, and the first temperature sensing element is disposed on the other end of the first cantilever; and / or, The second circuit board includes a second main body and a second cantilever. The second sampling chip is disposed in the second main body, one end of the second cantilever is connected to the second main body, and the second temperature sampling element is disposed at the other end of the second cantilever.

25. The battery device according to claim 24, characterized in that, The first cantilever portion and / or the second cantilever portion are bent structures.

26. The battery device according to claim 21, characterized in that, The first temperature sensing element is integrated into the first sampling chip, and the second temperature sensing element is integrated into the second sampling chip; The location of the first sampling chip on the first circuit board is different from the location of the second sampling chip on the second circuit board.

27. The battery device according to claim 26, characterized in that, The first circuit board and the second circuit board are the same circuit board, and each circuit board has multiple mounting areas in different positions; The first sampling chip is selectively mounted in one of the plurality of mounting areas of the first circuit board, and the second sampling chip is selectively mounted in another of the plurality of mounting areas of the second circuit board.

28. The battery device according to claim 1, characterized in that, The sampling chip integrates at least one of a filtering component and an equalization component.

29. The battery device according to claim 28, characterized in that, The sampling chip includes a package frame and a die, the filtering component is integrated on the die, and / or the equalization component is integrated between the die and the package frame.

30. The battery device according to claim 1, characterized in that, The connection line includes a first connection line and a second connection line. The first connection line includes at least one break structure, which includes a first connection point, a second connection point, and an interval between the first connection point and the second connection point. The second connection line passes through the interval. The sampling component also includes a connecting device, with its two ends connected to the first connection point and the second connection point, respectively.

31. The battery device according to claim 1, characterized in that, In the same projection plane perpendicular to the thickness direction of the circuit board, the orthographic projections of all the connection lines connected to different sampling sections do not overlap.

32. The battery device according to claim 1, characterized in that, The circuit board includes two insulating cover films and a conductive layer sandwiched between the two insulating cover films, and all connection lines are formed on the conductive layer.

33. The battery device according to claim 32, characterized in that, At the location of the voltage sampling section, at least one of the two insulating covering films has a window to expose at least a portion of the conductive layer through the insulating covering film, and the sampling section is welded to the sampling point through the portion of the conductive layer exposed through the insulating covering film.

34. The battery device according to claim 32, characterized in that, The conductive layer is formed by die-cutting or etching processes to create the connection lines.

35. The battery device according to claim 1, characterized in that, At least one of the sampling components is used to sample the plurality of the battery cells.

36. The battery device according to claim 35, characterized in that, At least one sampling component is used to sample 2-20 of the battery cells.

37. The battery device according to claim 1, characterized in that, The battery cell assembly includes multiple battery cells. Each battery cell includes a housing, a first terminal, and a second terminal. The first terminal and the second terminal have opposite polarities. The first terminal and the second terminal are located on a first wall of the housing. The first terminal and the second terminal are located at opposite ends of the first wall. The sampling component is located on the first wall, and the sampling chip is located between the first terminal and the second terminal.

38. The battery device according to claim 1, characterized in that, The battery cell assembly includes multiple battery cells. Each battery cell includes a housing, a first terminal, and a second terminal. The first terminal and the second terminal have opposite polarities. The first terminal and the second terminal are located on a first wall of the housing. The maximum dimension of the first wall along the length direction is greater than the maximum dimension along the width direction. The first terminal and the second terminal are located at one end of the first wall along the length direction. The sampling chip is located on the same side of the first terminal and the second terminal along the length direction.

39. The battery device according to claim 1, characterized in that, The battery cell assembly includes multiple battery cells. Each battery cell includes a housing, a first terminal, and a second terminal. The first terminal and the second terminal have opposite polarities. The maximum dimension of the battery cell along its length is greater than the maximum dimension along its width and the maximum dimension along its height. The housing includes a first wall and a second wall that are disposed opposite each other along the length. The first terminal is located on the first wall, and the second terminal is located on the second wall. The first terminal is electrically connected to the housing. The sampling component is disposed on the second wall, and at least one voltage sampling point is used to collect the electrical signal of the housing.

40. The battery device according to claim 1, characterized in that, The battery cell assembly includes multiple battery cells. Each battery cell includes a housing, a first terminal post, and a second terminal post. The first terminal post and the second terminal post have opposite polarities. The housing includes two opposing first walls. The first wall is the surface wall with the largest area. The second wall and the third wall are respectively adjacent to the first wall. The first terminal post is located on one of the first walls, and the second terminal post is located on the other first wall. The maximum dimension of the battery cell along the length direction is greater than the maximum dimension of the battery cell along the width direction and the maximum dimension along the height direction. The first terminal post and the second terminal post are respectively located at both ends of the battery cell along the length direction. The first electrode is electrically connected to the housing, the sampling component is located on the wall surface where the second electrode is located, and at least one of the voltage sampling points is used to collect the electrical signal of the housing.

41. The battery device according to claim 1, characterized in that, The battery cell assembly includes multiple cylindrical battery cells. Each cylindrical battery cell includes a housing, a first terminal, and a second terminal. The first terminal and the second terminal have opposite polarities. The first terminal and the second terminal are respectively located at both ends of the cylindrical housing along the axial direction. The first terminal and the housing are electrically connected. The sampling component is located on the end face where the second terminal is located. Furthermore, at least one voltage sampling point is used to collect the electrical signal of the housing.

42. The battery device according to claim 1, characterized in that, The battery cell assembly includes multiple cylindrical battery cells. Each cylindrical battery cell includes a housing, a first terminal, and a second terminal. The first terminal and the second terminal are located on the same end face. The sampling component is located on the end face where the first terminal and the second terminal are located. The sampling chip is located on the same side of the first terminal and the second terminal.

43. An electrical device, characterized in that, Includes the battery device according to any one of claims 1-42.

Images