Wafer etching cleaning mechanism

Abstract

The utility model relates to wafer processing equipment technical field, specifically wafer etching cleaning mechanism, including support seat, and support seat fixedly connected with etching pool has, and etching pool fixedly connected with support plate has, and support plate installs drive assembly, and etching pool rotationally connected with connecting shaft has, and connecting shaft fixedly connected with two eccentric wheels has, and etching pool's inside fixedly connected with four guide posts, and four guide posts slidingly connected with same first bracket have, and the bottom side fixed connection of first bracket has two connecting frames, and eccentric wheel and adjacent connecting frame between rolling connection, and connecting shaft is equipped with linkage structure, and the inside of etching pool is equipped with pumping structure, and the first bracket is clamped with material box frame, and material box frame is clamped with two wafer material box, can make wafer inside etching pool shake, simultaneously can make etching liquid flow in the inside of etching pool, in order to facilitate etching liquid and wafer contact more fully, to be able to improve wafer etching's effect.

Description

Technical Field

[0001] This utility model relates to an etching and cleaning mechanism, specifically a wafer etching and cleaning mechanism, belonging to the technical field of wafer processing equipment. Background Technology

[0002] In the semiconductor wafer manufacturing process, etching and cleaning are key processes that directly affect the surface quality of the wafer, circuit accuracy, and the performance of subsequent devices. The etching process removes impurities from the wafer surface through a chemical reaction between the etching solution and the wafer surface material, while the cleaning process removes residual etching solution and reaction products to avoid secondary contamination of the wafer.

[0003] However, during the etching stage, traditional institutions often use a "static immersion" method, which involves fixing the wafer to a support and then placing it statically into the etching tank. This method has two major problems: First, the contact between the etching solution and the wafer is insufficient. Because the wafer is stationary, an "etching solution retention layer" easily forms on its surface, especially in the edge area where the wafer contacts the support. The etching solution cannot be replenished in time, resulting in a much lower etching reaction rate in these areas than in other areas, ultimately causing uneven etching on the wafer surface. Second, the overall fluidity of the etching solution is poor. The etching solution in the etching tank relies solely on natural diffusion to achieve uniform composition. As the etching reaction proceeds, the concentration of the etching solution around the wafer gradually decreases, and the fresh etching solution at the edge of the tank cannot quickly replenish the reaction area, further exacerbating the uneven etching. Utility Model Content

[0004] The purpose of this invention is to provide a wafer etching and cleaning mechanism to solve the above problems. It allows the wafer to move inside the etching tank and the etching solution to flow inside the etching tank, so that the etching solution can come into more sufficient contact with the wafer, thereby improving the wafer etching effect.

[0005] This utility model achieves the above-mentioned objectives through the following technical solution: a wafer etching and cleaning mechanism, including a support base, an etching pool fixedly connected to the support base, a swaying structure on the etching pool, the swaying structure including a support plate and a drive assembly, the support plate fixedly connected to the etching pool, the drive assembly mounted on the support plate, a connecting shaft rotatably connected to the etching pool, the output end of the drive assembly fixedly connected to one end of the connecting shaft, two eccentric wheels fixedly connected to the connecting shaft, four guide columns fixedly connected inside the etching pool, a first bracket slidably connected to the four guide columns, two connecting frames fixedly connected to the bottom side of the first bracket, the eccentric wheels rollingly connected to adjacent connecting frames, a linkage structure on the connecting shaft, a liquid extraction structure inside the etching pool, a material box holder engaged on the first bracket, two wafer material boxes engaged on the material box holder, and a linkage structure on the connecting shaft.

[0006] Preferably, the cross-section of the support plate is in the shape of an "U" and the diameter of the eccentric wheel is equal to the width of the inner side of the connecting frame.

[0007] Preferably, a handle is fixedly connected to the material box frame, the handle is located in the middle of the material box frame, and the two wafer material boxes are symmetrically distributed about the middle of the material box frame.

[0008] Preferably, the liquid extraction structure includes support blocks and connecting cylinders. Four support blocks are fixedly connected inside the corrosion tank. The same connecting cylinder is fixedly connected to two support blocks located on one side of the corrosion tank. Two rotating shafts are rotatably connected to the corrosion tank. The rotating shafts pass through adjacent connecting cylinders. Two impellers are fixedly connected to the rotating shafts.

[0009] Preferably, the axis of the rotating shaft and the center of the adjacent connecting cylinder are on the same straight line, and the two connecting cylinders are symmetrically distributed about the middle of the corrosion pool.

[0010] Preferably, the linkage structure includes a first synchronous pulley and a synchronous belt, the first synchronous pulley is fixedly connected to the connecting shaft, the second synchronous pulley is fixedly connected to the rotating shaft, and the same synchronous belt is wound around the two second synchronous pulleys and the first synchronous pulley.

[0011] Preferably, the support base is provided with a cleaning structure, the cleaning structure includes a cleaning tank and a second bracket, the cleaning tank is fixedly connected to the support base, the second bracket is fixedly connected inside the cleaning tank, and a solenoid valve is installed at the bottom of the cleaning tank.

[0012] Preferably, a connecting pipe is fixedly connected to the cleaning pool, and multiple nozzles are installed on the connecting pipe, with adjacent nozzles being linearly and equidistantly distributed.

[0013] The beneficial effects of this invention are as follows: During the etching process of wafers, the drive assembly can be activated, which will drive the connecting shaft to rotate. The connecting shaft will drive two eccentric wheels to rotate, and the eccentric wheels will roll inside the connecting frame while rotating, thus driving the connecting frame to move up and down. The simultaneous up and down movement of the two connecting frames will drive the first support to move up and down, and the two wafer cassettes will move up and down together with the first support. This allows multiple wafers inside the wafer cassettes to move up and down together, thereby ensuring more thorough contact between the wafers and the etching solution and guaranteeing the uniformity of etching. At the same time, during the rotation of the connecting shaft, the linkage structure will drive the liquid extraction structure to make the etching solution flow inside the etching pool, thereby making the concentration of the etching solution inside the etching pool more uniform, further ensuring the uniformity of wafer etching and improving the wafer etching effect. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the connection structure between the first synchronous pulley and the synchronous belt of this utility model;

[0016] Figure 3 This is a schematic diagram of the connection structure between the support plate and the drive assembly of this utility model;

[0017] Figure 4 This is a schematic diagram of the connection structure between the eccentric wheel and the connecting frame of this utility model;

[0018] Figure 5 This is a schematic diagram of the connection structure between the material box frame and the handle of this utility model.

[0019] In the diagram: 1. Support base; 2. Etching tank; 3. Shaking structure; 301. Support plate; 302. Drive assembly; 303. Connecting shaft; 304. Eccentric wheel; 305. Connecting frame; 306. First bracket; 307. Guide column; 4. Linkage structure; 401. First synchronous pulley; 402. Synchronous belt; 403. Second synchronous pulley; 5. Liquid extraction structure; 501. Support block; 502. Connecting cylinder; 503. Rotating shaft; 504. Impeller; 6. Material box rack; 7. Handle; 8. Wafer material box; 9. Cleaning structure; 901. Cleaning tank; 902. Second bracket; 903. Solenoid valve; 904. Connecting pipe; 905. Nozzle. Detailed Implementation

[0020] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only part of the embodiments of the present utility model, not all of them. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present utility model.

[0021] Please refer to Figures 1-5 As shown in the figure, a wafer etching and cleaning mechanism includes a support base 1. An etching tank 2 is fixedly connected to the support base 1. A shaking structure 3 is provided on the etching tank 2. The shaking structure 3 includes a support plate 301 and a driving assembly 302. The support plate 301 is fixedly connected to the etching tank 2, and the driving assembly 302 is mounted on the support plate 301. A connecting shaft 303 is rotatably connected to the etching tank 2. The output end of the driving assembly 302 is fixedly connected to one end of the connecting shaft 303. Two eccentric wheels 304 are fixedly connected to the connecting shaft 303. Four guide columns 307 are fixedly connected inside the etching tank 2, and the four guide columns 307 are slidably connected with a same first bracket 306. Two connecting frames 305 are fixedly connected to the bottom side of the first bracket 306, and the eccentric wheels 304 are in rolling connection with the adjacent connecting frames 305. A linkage structure 4 is provided on the connecting shaft 303, a liquid pumping structure 5 is provided inside the etching tank 2, a material cassette holder 6 is clamped on the first bracket 306, two wafer material cassettes 8 are clamped on the material cassette holder 6, and the linkage structure 4 is provided on the connecting shaft 303.

[0022] As a technical optimization scheme of the present utility model, the overall cross-section of the support plate 301 is in a "匚"-shaped structure. The support plate 301 can support the driving assembly 302. The diameter of the eccentric wheel 304 is equal to the inner width of the connecting frame 305, so when the eccentric wheel 304 rolls inside the connecting frame 305, it can drive the connecting frame 305 to move up and down.

[0023] As a technical optimization scheme of the present utility model, a handle 7 is fixedly connected to the material cassette holder 6, and the handle 7 is disposed in the middle of the material cassette holder 6, so that the material cassette holder 6 can be conveniently moved by a manipulator grabbing the handle 7. The two wafer material cassettes 8 are symmetrically distributed about the middle of the material cassette holder 6.

[0024] As a technical optimization of this utility model, the liquid extraction structure 5 includes a support block 501 and a connecting cylinder 502. Four support blocks 501 are fixedly connected inside the corrosion tank 2. The support blocks 501 can support the connecting cylinder 502. The same connecting cylinder 502 is fixedly connected to two support blocks 501 located on one side of the corrosion tank 2. The two connecting cylinders 502 are symmetrically distributed about the middle of the corrosion tank 2. Two rotating shafts 503 are rotatably connected to the corrosion tank 2. The rotating shafts 503 pass through the adjacent connecting cylinders 502. The axis of the rotating shaft 503 and the center of the adjacent connecting cylinder 502 are on the same straight line. Two impellers 504 are fixedly connected to the rotating shaft 503. The simultaneous rotation of the two impellers 504 can make the corrosive liquid flow from one end of the connecting cylinder 502 to the other end of the connecting cylinder 502.

[0025] As a technical optimization of this utility model, the linkage structure 4 includes a first synchronous pulley 401 and a synchronous belt 402. The first synchronous pulley 401 is fixedly connected to the connecting shaft 303, and the second synchronous pulley 403 is fixedly connected to the rotating shaft 503. The same synchronous belt 402 is wound around the two second synchronous pulleys 403 and the first synchronous pulley 401, so that the two rotating shafts 503 can rotate synchronously while the connecting shaft 303 rotates.

[0026] As a technical optimization of this utility model, the support base 1 is provided with a cleaning structure 9, which includes a cleaning tank 901 and a second bracket 902. The cleaning tank 901 is fixedly connected to the support base 1, and the second bracket 902 is fixedly connected inside the cleaning tank 901. The material box rack 6 can be positioned by the second bracket 902. A solenoid valve 903 is installed at the bottom of the cleaning tank 901. The water inside the cleaning tank 901 can be drained by opening the solenoid valve 903.

[0027] As a technical optimization of this utility model, a connecting pipe 904 is fixedly connected to the cleaning tank 901. An external water pipe can be connected to the connecting pipe 904. Multiple nozzles 905 are installed on the connecting pipe 904. The multiple nozzles 905 are linearly and equidistantly distributed. The wafer can be rinsed a second time by spraying water through the multiple nozzles 905.

[0028] In use, during the etching process of the wafers, the drive assembly 302 (preferably a motor) is activated. The drive assembly 302 drives the connecting shaft 303 to rotate, which in turn drives two eccentric wheels 304 to rotate. While rotating, the eccentric wheels 304 roll inside the connecting frame 305, causing the connecting frame 305 to reciprocate up and down. This simultaneous reciprocating motion of the two connecting frames 305 drives the first support 306 to reciprocate up and down, and the two wafer cassettes 8 reciprocate up and down along with the first support 306. This allows the multiple wafers inside the wafer cassettes 8 to also reciprocate up and down, ensuring more thorough contact between the wafers and the etching solution and guaranteeing uniform etching. Simultaneously, the rotation of the connecting shaft 303 drives the first synchronous pulley 401 to rotate. The first synchronous pulley 401 drives two second synchronous pulleys 403 to rotate via a synchronous belt 402. The rotation of the second synchronous pulleys 403 drives the rotating shaft 503 to rotate. The rotating shaft 503 drives the two impellers 504 to rotate simultaneously, causing the etching solution to flow from one end of the connecting cylinder 502 to the other end. This flow of the etching solution within the etching tank 2 ensures a more uniform concentration of the etching solution, further guaranteeing the uniformity of wafer etching and improving the etching effect. After the wafer etching is complete, the robotic arm can grasp the handle 7, then move the material box frame 6 to separate it from the first bracket 306, and then move the material box frame 6 to engage it with the second bracket 902 inside the cleaning tank 901. At this time, multiple wafers are immersed in the clean water inside the cleaning tank 901, achieving initial cleaning. After soaking for a period of time, the solenoid valve 903 can be opened to drain the water from the cleaning tank 901, and then clean water can be sprayed from multiple nozzles 905 to rinse the wafers again, thus achieving a more thorough cleaning.

[0029] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0030] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer etching and cleaning mechanism, comprising a support base (1), characterized in that: A corrosion cell (2) is fixedly connected to the supporting base (1), a shaking structure (3) is arranged on the corrosion cell (2), the shaking structure (3) comprises a supporting plate (301) and a driving assembly (302), the supporting plate (301) is fixedly connected to the corrosion cell (2), the driving assembly (302) is mounted on the supporting plate (301), a connecting shaft (303) is rotatably connected to the corrosion cell (2), the output end of the driving assembly (302) is fixedly connected with one end of the connecting shaft (303), two eccentric wheels (304) are fixedly connected to the connecting shaft (303), four guide columns (307) are fixedly connected inside the corrosion cell (2), the four guide columns (307) are slidably connected with a same first bracket (306), two connecting frames (305) are fixedly connected to the bottom side of the first bracket (306), the eccentric wheels (304) are in rolling connection with the adjacent connecting frames (305), a linkage structure (4) is arranged on the connecting shaft (303), a liquid pumping structure (5) is arranged inside the corrosion cell (2), a material cassette rack (6) is clamped on the first bracket (306), two wafer material cassettes (8) are clamped on the material cassette rack (6), and a linkage structure (4) is arranged on the connecting shaft (303).

2. The wafer etching and cleaning mechanism according to claim 1, characterized in that: The overall cross-section of the support plate (301) presents a "匚"-shaped structure, and the diameter of the eccentric wheel (304) is equal to the inner width of the connecting frame (305).

3. The wafer etching and cleaning mechanism according to claim 1, characterized in that: A handle (7) is fixedly connected to the material cassette rack (6), the handle (7) is arranged at the middle part of the material cassette rack (6), and the two wafer material cassettes (8) are symmetrically distributed about the middle part of the material cassette rack (6).

4. The wafer etching and cleaning mechanism according to claim 1, characterized in that: The liquid pumping structure (5) comprises support blocks (501) and connecting cylinders (502), four support blocks (501) are fixedly connected inside the corrosion cell (2), the two support blocks (501) located on one side of the corrosion cell (2) are fixedly connected with a same connecting cylinder (502), two rotating shafts (503) are rotatably connected to the corrosion cell (2), the rotating shafts (503) penetrate through the adjacent connecting cylinders (502), and two impellers (504) are fixedly connected to the rotating shafts (503).

5. The wafer etching and cleaning mechanism according to claim 4, characterized in that: The axis of the rotating shaft (503) and the center of the adjacent connecting cylinder (502) are on the same straight line, and the two connecting cylinders (502) are symmetrically distributed about the middle part of the corrosion cell (2).

6. The wafer etching and cleaning mechanism according to claim 4, characterized in that: The linkage structure (4) comprises a first synchronous pulley (401) and a synchronous belt (402), the first synchronous pulley (401) is fixedly connected to the connecting shaft (303), a second synchronous pulley (403) is fixedly connected to the rotating shaft (503), and a same synchronous belt (402) is wound around the two second synchronous pulleys (403) and the first synchronous pulley (401).

7. The wafer etching and cleaning mechanism according to claim 1, characterized in that: The support base (1) is provided with a cleaning structure (9), the cleaning structure (9) includes a cleaning tank (901) and a second bracket (902), the cleaning tank (901) is fixedly connected to the support base (1), the second bracket (902) is fixedly connected inside the cleaning tank (901), and a solenoid valve (903) is installed at the bottom of the cleaning tank (901).

8. The wafer etching and cleaning mechanism according to claim 7, characterized in that: A connecting pipe (904) is fixedly connected to the cleaning tank (901), and multiple nozzles (905) are installed on the connecting pipe (904). The multiple nozzles (905) are linearly and equidistantly distributed.

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