A wafer transfer robot

Abstract

This application provides a wafer transfer robot, including a wafer fork and a guide plate. The lower part of the wafer fork forms two fork arms, and the side of the two fork arms that are close to each other is recessed along a first direction to form a wafer carrying portion for carrying the wafer. A wafer limiting groove is provided at the lower end of the wafer carrying portion for limiting the wafer during transfer. The first direction is parallel to the horizontal plane. The guide plate is disposed on the surface of the fork arm. The guide plate contracts inward on the side near the surface of the fork arm, forming a guide groove between the guide plate and the fork arm. Raised guide strips are provided on the surface of the guide plate to guide the flow of liquid on the surface of the guide plate. The technical solution of this application enables the transfer of wafers between different buffer tanks, and when the wafer is removed from the buffer tank, the liquid adhering to the wafer transfer robot can flow along the guide groove and guide strips, thereby quickly removing residual liquid and preventing contamination of the wafer and the inside of the buffer tank.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing, and more specifically, to a wafer transfer robot. Background Technology

[0002] During wafer fabrication, wafers are typically stored in buffer tanks. After the current process is completed, a robotic arm can usually transfer the wafer to another buffer tank for subsequent processes. These buffer tanks may contain liquids used for cleaning, etching, or other chemical treatments of the wafer. When the robotic arm removes the wafer from the buffer tank, the liquid may adhere to its surface. Since different buffer tanks typically correspond to different processes, the types of liquids they contain may vary. When the robotic arm moves from the first buffer tank to the second, residual liquid on its surface may fall onto the wafer surface in the second buffer tank, potentially causing particles, scratches, or other defects on the wafer surface, affecting the yield of subsequent processing steps and the performance of the final product. Furthermore, some buffer tanks may be equipped with nozzles to spray liquids onto the wafer for processing. These liquids can also adhere to the robotic arm surface, contaminating the wafer.

[0003] However, current technologies typically lack dedicated anti-drip measures for robotic arms. They often rely on simple methods during production to reduce residual liquid on the arm's surface, such as allowing it to linger above the buffer tank after leaving it to allow liquid to drip off. However, this significantly increases production time, and the cleaning effect is difficult to guarantee. Alternatively, some production lines may have dedicated robotic arm cleaning processes, where the arm is rinsed and dried using specialized equipment after leaving the buffer tank. While this ensures the arm doesn't contaminate the wafer or buffer tank, it greatly increases time and cost, severely reducing production efficiency and thus hindering widespread adoption. In conclusion, there is a current need for a robotic arm that effectively prevents liquid dripping to significantly reduce the risk of wafer surface contamination and improve semiconductor processing yield and product quality. Utility Model Content

[0004] The purpose of this application is to provide a wafer transfer robot that can transfer wafers between different buffer tanks. When the wafer is removed from the buffer tank, the liquid attached to the wafer transfer robot can flow along the guide channel and guide strip, thereby quickly removing residual liquid, preventing contamination of the wafer and the inside of the buffer tank, and improving the yield of the final product.

[0005] This application provides a wafer transfer robot, including a wafer fork and a flow guide plate. The lower part of the wafer fork forks to form two fork arms. The sides of the two fork arms that are close to each other are recessed along a first direction to form wafer support portions for supporting the wafer. A wafer limiting groove is provided at the lower end of the wafer support portion. In use, the wafer fork approaches the wafer along the first direction, causing the wafer to rest against the surface of the wafer support portion. Then, the wafer fork moves upward, and the wafer falls into the wafer limiting groove under gravity, thus limiting the wafer. The first direction is parallel to the horizontal plane. The flow guide plate is disposed on the surface of the fork arms. The flow guide plate contracts inward on the side close to the fork arm surface, forming a flow guide groove between the flow guide plate and the fork arm. Raised guide strips are provided on the surface of the flow guide plate to guide the flow of liquid on the surface of the flow guide plate.

[0006] In one feasible embodiment, a flow guide is provided at the lower end of the fork arm, and the lower end of the flow guide is provided with a tip for guiding the liquid in the flow channel out.

[0007] In one feasible approach, the cross-section of the guide channel is one of square, V-shaped, or U-shaped.

[0008] In one feasible approach, the maximum width of the cross-section of the guide channel is 2-5 mm.

[0009] In one feasible solution, the deflector is detachably connected to the fork arm.

[0010] In one feasible approach, the angle between the guide strip and the horizontal plane is greater than or equal to 45 degrees.

[0011] In one feasible solution, the height of the guide strip protrusion is 2-3 mm.

[0012] In one feasible approach, a hydrophobic layer is applied to the surface of the deflector to accelerate the flow of surface liquids.

[0013] In one feasible solution, a buffer layer is provided on the surface of the wafer carrier and the inside of the wafer positioning groove to reduce or avoid the impact on the wafer during transport.

[0014] In one feasible embodiment, the upper part of the wafer fork is provided with a connection hole for fixed connection with an external machine.

[0015] Compared with the prior art, the beneficial effects of this application include at least the following:

[0016] This application provides a wafer transfer robot capable of picking up, placing, and transporting wafers, enabling wafer transfer between different buffer tanks. The wafer transfer robot has guide plates on the surface of its forks, forming guide channels between the guide plates and the forks. Guide strips are also provided on the surface of the guide plates. Therefore, when removing a wafer from a buffer tank, liquid adhering to the wafer transfer robot can flow along the guide channels and guide strips, quickly removing residual liquid. In actual production, after removing a wafer from a buffer tank using this wafer transfer robot, it only needs to pause briefly above the buffer tank to drain residual liquid. Therefore, compared to traditional methods with dedicated cleaning processes, using this wafer transfer robot can significantly reduce or even eliminate the impact on production efficiency, while effectively preventing residual liquid from falling onto the wafer surface or entering other buffer tanks, thus preventing contamination of the wafer and the interior of the buffer tanks, and improving the yield of the final product.

[0017] Furthermore, the wafer transfer robot of this application is provided with a flow guide at the lower end of the fork arm. By providing a tip at the lower end of the flow guide, it can be better used to guide the liquid in the flow channel and the surface of the flow plate to drain out, thereby further reducing the liquid residue on the surface of the wafer transfer robot. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a wafer transfer robot according to an embodiment of this application.

[0020] In the figure: 1. Wafer fork; 2. Flow guide plate; 3. Flow guide; 101. Fork arm; 102. Wafer carrier; 103. Wafer limiting groove; 201. Flow guide bar; 202. Flow guide groove; L1. First direction. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0023] like Figure 1 As shown, this application provides a wafer transfer robot, including a wafer fork 1 and a guide plate 2. The lower part of the wafer fork 1 forks to form two fork arms 101. The sides of the two fork arms 101 that are close to each other are recessed along a first direction L1 to form wafer carrying portions 102 for carrying the wafer. A wafer limiting groove 103 is provided at the lower end of the wafer carrying portion 102. In use, the wafer fork 1 approaches the wafer along the first direction L1, causing the wafer to rest against the surface of the wafer carrying portion 102. Then, the wafer fork 1 moves upward, and the wafer falls into the wafer limiting groove 103 under the action of gravity, thus limiting the wafer's position. Figure 1 As shown, the first direction L1 is parallel to the horizontal plane. A guide plate 2 is disposed on the surface of the fork arm 101. The guide plate 2 contracts inward on the side near the surface of the fork arm 101, forming a guide groove 202 between the guide plate 2 and the fork arm 101. The surface of the guide plate 2 is provided with raised guide strips 201 for guiding the flow of liquid on the surface of the guide plate 2.

[0024] exist Figure 1 In this embodiment, the guide vane 2 is only disposed on the first surface of the fork arm 101, but it is not limited to this. In one embodiment, the guide vane 2 may include a first guide vane and a second guide vane, wherein the first guide vane is disposed on the first surface of the fork arm 101 (e.g., ...). Figure 1 As shown in the figure, the first and second guide plates can be symmetrically arranged on both sides of the fork arm 101. The first and second guide plates can respectively form guide grooves with the second side of the fork arm 101, and raised second guide strips can be provided on the surfaces of both the first and second guide plates. This design, with guide plates on both sides of the fork arm 101, can further improve the efficiency of liquid drainage from the surface of the wafer transfer robot and reduce waiting time during production.

[0025] In actual production, wafers are stored vertically in a buffer tank, which may contain liquids used for cleaning, etching, or other chemical treatments of the wafers. When wafers need to be transferred, the wafer transfer robot first moves downward into the buffer tank, bringing the wafer carrier 102 and the wafer to the same height. At this point, there is a certain distance between the wafer carrier 102 and the wafer in the first direction L1. Then, the wafer carrier 102 is moved along the first direction L1, so that the wafer adheres to the wafer carrier 102. Then, the wafer transfer robot is lifted upward, and the lower part of the wafer falls into the wafer limiting groove 103. The wafer limiting groove 103 can hold the edge of the wafer, thus fixing the wafer. Preferably, the width of the wafer positioning groove 103 can be set to exceed the wafer thickness by 5%-10%. This ensures a certain degree of redundancy, allowing the wafer to fall smoothly into the wafer positioning groove 103, while minimizing or avoiding collisions between the wafer and the inner wall of the wafer positioning groove 103 during transfer, thus preventing wafer damage. After the wafer is removed from the buffer groove, the wafer transfer robot can remain above the buffer groove for a period of time to allow residual liquid on its surface to drain. During this waiting period, manual observation can be used to ensure that the liquid has drained. For example, if no liquid drips from the wafer transfer robot is observed for 10 consecutive seconds, the liquid is considered drained, and the wafer transfer robot can be operated to transfer the wafer. Alternatively, equipment detection can be used. For example, a corresponding weight sensor can be installed on the external machine connected to the wafer transfer robot. If no change in the weight of the wafer transfer robot is detected for 10 consecutive seconds, the liquid is considered drained. The specific detection method is not limited here.

[0026] In addition, such as Figure 1 As shown, a flow guide 3 is provided at the lower end of the fork arm 101, and the lower end of the flow guide 3 is provided with a pointed tip for guiding the liquid in the flow channel 202 out of the channel. Figure 1 As shown, the flow guide 3 gradually narrows from top to bottom. By setting the curvature of the flow guide 3, the inner and outer sides of the flow guide 3 smoothly connect with the wafer limiting groove 103 and the outer side of the fork arm 101, respectively, facilitating liquid flow. A groove with the same cross-sectional size as the flow channel 202 can be provided on the side of the flow guide 3 near the flow channel 202, allowing the groove to smoothly connect with the flow channel 202, extending the flow channel 202 to the lower end of the flow guide 3, enabling the liquid in the flow channel 202 to drain smoothly. The flow guide 3 can be detachably connected to the lower end of the fork arm 101, for example, by screws or clips, thus facilitating the replacement of flow guides 3 with different shapes.

[0027] In summary, the wafer transfer robot of this application can pick up, place, and transport wafers, enabling wafer transfer between different buffer tanks. The wafer transfer robot has a guide plate 2 on the surface of the fork arm 101, forming a guide channel 202 between the guide plate 2 and the fork arm 101. Furthermore, guide strips 201 are provided on the surface of the guide plate. Therefore, when the wafer is removed from the buffer tank, the liquid adhering to the wafer transfer robot can flow along the guide channel 202 and the guide strips 201, thereby quickly removing residual liquid. In actual production, after removing the wafer from the buffer tank using the wafer transfer robot of this application, it only needs to pause briefly above the buffer tank to drain the residual liquid. Therefore, compared to the traditional method of setting up a dedicated cleaning process, using the wafer transfer robot of this application can significantly reduce or even eliminate the impact on production efficiency, while effectively preventing residual liquid from falling onto the wafer surface or entering other buffer tanks, thereby preventing contamination of the wafer and the interior of the buffer tanks and improving the yield of the final product.

[0028] Furthermore, by providing a flow guide 3 at the lower end of the fork arm 1 and a tip at the lower end of the flow guide 3, it can be better used to guide the liquid out of the flow channel 202 and the surface of the flow plate 2, thereby further reducing the liquid residue on the surface of the wafer transfer robot.

[0029] In one embodiment, the cross-section of the flow guide 202 can be square, V-shaped, or U-shaped. A square cross-section flow guide 202 has a larger cross-sectional area, capable of holding more liquid, suitable for situations with high liquid flow rates. Furthermore, the larger cross-sectional area reduces flow resistance, making it suitable for guiding high-viscosity liquids. A V-shaped flow guide 202's shape helps concentrate liquid flow, reducing liquid accumulation within the 202 and thus reducing the risk of dripping, making it particularly suitable for guiding low-viscosity liquids. A U-shaped flow guide 202 helps reduce turbulence during liquid flow, improving flow stability. It can adapt to liquids of varying viscosities and has a wide range of applications.

[0030] Preferably, the maximum width of the cross-section of the flow channel 202 can be set to 2-5 mm. An appropriate width range can effectively balance the liquid flow efficiency and the capacity of the flow channel, taking into account different liquid viscosities and flow rates, ensuring that the liquid flows smoothly in the flow channel, reducing the accumulation and residue of liquid in the flow channel, thereby reducing the possibility of liquid dripping onto the wafer surface, and thus improving the yield and quality of the wafer.

[0031] In one embodiment, the guide plate 2 is detachably connected to the fork arm 101. Specifically, the guide plate 2 and the fork arm 101 can be connected by screws or clips, which is not limited here. A hydrophobic layer can be applied to the surface of the guide plate 2 to reduce the adhesion of liquid on the surface of the guide plate and accelerate the flow of liquid on the surface. Specifically, the hydrophobic layer can be made of materials such as polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), or silicon-based hydrophobic materials. Alternatively, the entire guide plate 2 can be made of a hydrophobic material.

[0032] In one embodiment, the angle between the guide strip 201 and the horizontal plane can typically be set to greater than or equal to 45 degrees, such as 50, 55, 60, 65, 70, or 75 degrees. The specific angle can be optimized based on the properties of the liquid (such as viscosity and surface tension) and the wafer transfer speed, without imposing too many restrictions here. A larger angle helps the liquid flow more smoothly along the guide strip, reduces liquid residue on the guide strip, and reduces the risk of liquid dripping due to gravity, thereby improving wafer yield and quality. Furthermore, a larger angle is suitable for various liquid properties, making it more versatile. In addition, the height of the protrusion of the guide strip 201 can be set to 2-3 mm, thereby ensuring effective guidance of liquid flow while reducing liquid accumulation on the guide strip.

[0033] In one embodiment, a buffer layer is provided on the surface of the wafer carrier 102 and the inner side of the wafer limiting groove 103 to reduce or avoid impacts on the wafer during transport. The buffer layer is preferably made of a material with good elasticity and low friction to absorb the impact force generated during wafer transport and reduce friction between the wafer and the buffer layer, preventing scratches on the wafer surface. Specifically, the buffer groove can be coated with a low-friction material (e.g., polytetrafluoroethylene or polyethylene) on the surface of an elastic material (e.g., polyurethane foam, silicone, or rubber) to improve the overall performance of the buffer layer.

[0034] In one embodiment, the upper part of the wafer fork 1 may be provided with connection holes (not shown in the figure) for fixed connection with an external machine. Typically, multiple connection holes can be provided on the upper part of the wafer fork 1, so that after the external machine is connected to the wafer fork 1 through the connection holes, the wafer fork 1 can be positioned, thereby ensuring that the centerline of the wafer fork 1 is parallel to the vertical direction. Furthermore, other connection mechanisms may also be provided on the upper part of the wafer fork 1; no limitations are imposed here.

[0035] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer transfer robot, characterized by comprising: include: A wafer fork (1) has two forked arms (101) at its lower part. The two forked arms (101) are recessed along a first direction on their respective sides to form a wafer support portion (102) for supporting the wafer. A wafer limiting groove (103) is provided at the lower end of the wafer support portion (102). In use, the wafer fork (1) moves close to the wafer along the first direction, so that the wafer is against the surface of the wafer support portion (102). Then the wafer fork (1) moves upward, and the wafer falls into the wafer limiting groove (103) under the action of gravity to limit the wafer. The first direction is parallel to the horizontal plane. A flow guide plate (2) is disposed on the surface of the fork arm (101); the flow guide plate (2) contracts inward on the side close to the surface of the fork arm (101) to form a flow guide groove (202) between the flow guide plate (2) and the fork arm (101); the surface of the flow guide plate (2) is provided with raised flow guide strips (201) for guiding the liquid on the surface of the flow guide plate (2) to flow.

2. The wafer transfer robot of claim 1, wherein The lower end of the fork arm (101) is provided with a flow guide (3), and the lower end of the flow guide (3) is provided with a tip for guiding the liquid in the flow guide groove (202) to be discharged.

3. The wafer transfer robot of claim 1, wherein The cross-section of the guide channel (202) is one of square, V-shaped or U-shaped.

4. The wafer transfer robot of claim 3, wherein The maximum width of the cross-section of the guide channel (202) is 2-5 mm.

5. The wafer transfer robot of claim 1, wherein The guide plate (2) is detachably connected to the fork arm (101).

6. The wafer transfer robot of claim 1, wherein, The angle between the guide strip (201) and the horizontal plane is greater than or equal to 45 degrees.

7. The wafer transfer robot of claim 1, wherein The height of the protrusion of the guide strip (201) is 2-3mm.

8. The wafer transfer robot of claim 1, wherein, The surface of the guide plate (2) is covered with a hydrophobic layer to accelerate the flow of surface liquid.

9. The wafer transfer robot of claim 1, wherein, A buffer layer is provided on the surface of the wafer carrier (102) and the inner side of the wafer limiting groove (103) to reduce or avoid the impact on the wafer during the transfer process.

10. The wafer transfer robot of claim 1, wherein The upper part of the wafer fork (1) is provided with a connection hole for fixed connection with an external machine.

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