A RSU device

Abstract

The utility model discloses a kind of RSU equipment, it is related to electronic toll collection technical field;Single-chip microcontroller and ETC chip are interconnected, single-chip microcontroller is used to control ETC chip and radio frequency amplification unit, the ETC signal of vehicle-mounted unit is transmitted and received by 5.8GHZ antenna, ETC chip and radio frequency amplification circuit are interconnected, single-chip microcontroller and communication module are electrically connected, communication module and SIM card are electrically connected, and the back of the PCB board in the area of radio frequency amplification circuit is provided with heat dissipation window;The utility model integrates the two parts functions of traditional ETC RSU equipment together, it is convenient to install and use, applicable to highway and urban highway use;Reduce electromagnetic interference, inhibit power noise interference, avoid signal crosstalk, improve the stability and reliability of system, it is convenient for fault location and troubleshooting convenient, enhanced module independence, simplify wiring complexity, improve production manufacturing efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of electronic toll collection technology, specifically relating to an RSU device. Background Technology

[0002] Electronic Toll Collection (ETC) is a fully electronic toll collection method that uses automatic vehicle identification technology to achieve non-stop toll collection. Manual Toll Collection (MTC) is a toll collection method where manual operation is performed, while a computer system controls the lane equipment and automatically manages the toll data. A Roadside Unit (RSU) in the ETC system is a device installed on the roadside, using DSRC technology, that communicates with the On-Board Unit (OBU) to achieve vehicle identification and electronic toll deduction. The On-Board Unit (OBU) is installed on the vehicle and supports information exchange with the roadside unit.

[0003] In 2024, the number of ETC users exceeded 300 million, covering 85% of the vehicle market. In fact, the application of ETC is not limited to highway toll collection. With the increasing maturity of the technology, ETC is expanding its application scenarios from highways to various aspects of urban services: ETC smart parking, ETC on-street parking fee collection, ETC smart refueling, ETC smart car washing, and other services. Traditional ETC RSU equipment consists of two parts: a controller unit and an antenna unit. The controller is placed in the toll booth, and the antenna unit is placed on the gantry. Traditional ETC RSU equipment has the following problems in use: First, traditional ETC RSU devices are not suitable for use in cities, and there are no corresponding toll booths to place controller units.

[0004] Second, the electromagnetic signal characteristics generated by different functional modules of traditional ETC RSU devices vary. For example, the radio frequency unit operates in the high-frequency band and generates strong electromagnetic radiation; while the digital processing unit (such as MCU) generates high-frequency digital signal noise during high-speed data processing.

[0005] Third, power modules generate power noise, such as ripple voltage, during operation. If the power module is too close to other modules with high power quality requirements, the noise may be conducted to other modules through power lines or PCB traces, affecting their normal operation.

[0006] Fourth, on a single-board PCB, numerous signal traces crisscross. If signal traces from different functional modules are mixed together, signal crosstalk can easily occur, meaning that a signal on one signal line can couple to an adjacent signal line. Utility Model Content

[0007] To address the problems mentioned in the background section, the purpose of this invention is to provide an RSU device.

[0008] This utility model discloses an RSU device, including a power supply module, a voltage regulator circuit, a microcontroller, an ETC chip, a PSAM circuit, an RF amplifier circuit, a communication module, and a SIM card. The power supply module is electrically connected to the voltage regulator circuit, and both the voltage regulator circuit and the PSAM circuit are electrically connected to the microcontroller. The microcontroller is interconnected with the ETC chip and is used to control the ETC chip and the RF amplifier unit. It transmits and receives ETC signals from the vehicle unit through a 5.8GHz antenna. The ETC chip is interconnected with the RF amplifier circuit, and the microcontroller is electrically connected to the communication module. The communication module is electrically connected to the SIM card. The power supply module, voltage regulator circuit, microcontroller, ETC chip, PSAM circuit, RF amplifier circuit, communication module, and SIM card are connected to the PCB board respectively using ground isolation. A heat dissipation window is provided on the back of the PCB board in the area of ​​the RF amplifier circuit.

[0009] As a preferred embodiment: the power module includes a power supply and a power protection circuit; the power supply and the power protection circuit are electrically connected.

[0010] As a preferred embodiment, the power module is located on the right side of the PCB board.

[0011] As a preferred embodiment, the PSAM circuit is a PSAM card.

[0012] As a preferred embodiment: the radio frequency amplifier circuit includes a radio frequency switch, a BPF, an FEM, and an attenuator; the radio frequency switch is interconnected with the BPF and the attenuator, and the BPF and the attenuator are interconnected with the FEM.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: I. It integrates the two functions of the traditional ETC RSU device into one, making it easy to install and use, and suitable for use on highways and urban roads.

[0014] II. Reducing Electromagnetic Interference (EMI): By placing the radio frequency (RF) unit on the left and the digital processing unit in the middle, their regional arrangement reduces mutual electromagnetic radiation interference. Simultaneously, the ground isolation structure in the middle acts as a barrier, preventing electromagnetic radiation from the RF unit from propagating to the digital processing unit, thus avoiding interference with the digital circuitry and problems such as bit errors and data transmission errors.

[0015] 3. Suppress power supply noise interference: Placing the power supply module on the right and isolating it from other modules through ground isolation can effectively reduce the conducted interference of power supply noise on radio frequency units, digital processing units, etc., ensuring that these modules can work in a clean power supply environment and improving the accuracy and stability of signal processing.

[0016] IV. Avoiding Signal Crosstalk: After functional modules are partitioned and laid out, signal traces within the same functional module can be arranged relatively centrally, while traces from different functional modules should be kept as separate as possible to reduce trace crossings and proximity. Ground isolation structures further enhance this isolation effect, reducing the possibility of signal crosstalk and ensuring the purity of signal transmission between modules.

[0017] Fifth, it improves the stability and reliability of the system, facilitates fault location and troubleshooting, and enhances module independence.

[0018] VI. Simplify wiring complexity and improve manufacturing efficiency. Attached Figure Description

[0019] For ease of explanation, the present invention will be described in detail below with reference to specific embodiments and accompanying drawings.

[0020] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a front view of the PCB board layout in this utility model; Figure 3 This is a rear view of the PCB board layout in this utility model.

[0021] In the diagram: 1-Power supply module; 2-Voltage regulator circuit; 3-Microcontroller; 4-ETC chip; 5-PSAM circuit; 6-RF amplifier circuit; 7-Communication module; 8-SIM card; 9-Heat dissipation window; 1-1-Power supply; 1-2-Power supply protection circuit; 6-1-RF switch; 6-2-BPF; 6-3-FEM; 6-4-Attenuator. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model is described below with reference to specific embodiments shown in the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and not intended to limit the scope of this utility model. The structures, proportions, sizes, etc., illustrated in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this utility model, should still fall within the scope of the technical content disclosed in this utility model. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of this utility model.

[0023] It should also be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and / or processing steps closely related to the solution according to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0024] Specific implementation method one: Combining Figures 1 to 3 The illustration describes this specific embodiment, which employs ground isolation to avoid signal interference. The specific technical solution includes: a power module 1, a voltage regulator circuit 2, a microcontroller 3, an ETC chip 4, a PSAM circuit 5, an RF amplifier circuit 6, a communication module 7, and a SIM card 8. The power module 1 is electrically connected to the voltage regulator circuit 2, providing power protection. The voltage regulator circuit 2 provides voltage reduction and regulation. Both the voltage regulator circuit 2 and the PSAM circuit 5 are electrically connected to the microcontroller 3. The microcontroller 3 is interconnected with the ETC chip 4. The ARM0 core microcontroller and the ETC chip process ETC information in real time. The microcontroller 3 controls the ETC chip 4 and the RF amplifier unit 6, transmitting and receiving ETC signals from the vehicle unit via a 5.8GHz antenna, while simultaneously transmitting through the physical PSAM 1. The key (PSAM1 / PSMA2) or the key system (cloud PSAM) connected to the backend of the communication module is used to implement communication and payment through the vehicle's on-board unit, enabling non-stop payment. The ETC chip 4 is interconnected with the RF amplifier circuit 6, the microcontroller 3 is electrically connected to the communication module 7, and the communication module 7 is electrically connected to the SIM card 8. The power module 1, voltage regulator circuit 2, microcontroller 3, ETC chip 4, PSAM circuit 5, RF amplifier circuit 6, communication module 7, and SIM card 8 are connected to the PCB board in a ground-isolated manner. This layout and isolation method can effectively reduce signal interference between different functional areas and improve the overall stability and reliability of the PCB. The PCB board of the area of ​​the RF amplifier circuit 6 is provided with a heat dissipation window 9. The back of the window adopts a large-area opening design to enhance heat dissipation, and a shielding cover is also configured. The large-area opening can quickly dissipate the heat generated by the RF amplifier unit, avoiding heat accumulation that affects performance. The shielding cover can further shield the RF signal from external radiation and the influence of external interference signals on the RF unit, ensuring the stability and anti-interference capability of RF signal processing.

[0025] Specific Implementation Method Two: Combining Figures 1 to 3The following describes this specific embodiment, which is a further limitation of Specific Embodiment 1. The power module 1 of this specific embodiment can achieve power protection and stable power supply, and specifically adopts the following technical solution: The power module 1 includes a power supply 1-1 and a power protection circuit 1-2; the power supply 1-1 and the power protection circuit 1-2 are electrically connected. The power module 1 is arranged on the right side of the PCB board, which facilitates the dissipation of its own heat to the edge of the PCB; on the other hand, the digital processing unit in the middle can isolate the power module from other areas (such as the radio frequency area), reduce the interference of power supply noise on other functional areas, and at the same time prevent excessive heat from other areas from being transferred to the power module, thus ensuring stable power supply to the power module.

[0026] Specific implementation method three: Combining Figures 1 to 3 The illustration shows this specific embodiment, which is a further limitation of embodiment one or two. In this specific embodiment, the PSAM circuit 5 realizes non-stop payment, and the specific technical solution adopted is as follows: The PSAM circuit 5 is one or two PSAM cards, which realize non-stop payment by implementing communication and payment through the vehicle's on-board unit through the physical PSAM1 key (PSAM1 / PSMA2) or the key system (cloud PSAM) connected to the backend of the communication module.

[0027] Specific implementation method four: Combination Figures 1 to 3 The illustration shows this specific embodiment, which is a further limitation of embodiment one, two or three. This specific embodiment uses a radio frequency amplifier circuit 6 to realize the transmission of radio frequency signals. The specific technical solution adopted is as follows: The radio frequency amplifier circuit 6 includes a radio frequency switch 6-1, a BPF 6-2, an FEM 6-3, and an attenuator 6-4; the radio frequency switch 6-1 is connected to the BPF 6-2 and the attenuator 6-4 respectively, and the BPF 6-2 and the attenuator 6-4 are connected to the FEM 6-3 respectively.

[0028] This specific implementation method has the following advantages: 1. Reduce signal interference: 1.1 Reducing Electromagnetic Interference (EMI): By placing the radio frequency (RF) unit on the left and the digital processing unit in the middle, their regional arrangement reduces mutual electromagnetic radiation interference. Simultaneously, the ground isolation structure in the middle acts as a barrier, preventing electromagnetic radiation from the RF unit from propagating to the digital processing unit, thus avoiding interference with the digital circuitry and problems such as bit errors and data transmission errors.

[0029] 1.2 Suppressing power supply noise interference: Placing the power supply module on the right and isolating it from other modules through ground isolation can effectively reduce the conducted interference of power supply noise on the radio frequency unit, digital processing unit, etc., ensuring that these modules can work in a clean power supply environment and improving the accuracy and stability of signal processing.

[0030] 1.3 Avoiding Signal Crosstalk: After functional modules are partitioned and laid out, signal traces within the same functional module can be arranged relatively centrally, while traces from different functional modules should be kept as separate as possible to reduce trace crossings and proximity. Ground isolation structures further enhance this isolation effect, reducing the possibility of signal crosstalk and ensuring the purity of signal transmission between modules.

[0031] II. Improve system stability and reliability: 2.1 Convenient Fault Location and Troubleshooting: When a PCB malfunctions, the functional module partitioning layout makes it easier to pinpoint the fault area. For example, if an abnormal RF signal is detected, because the RF unit is independently partitioned, engineers can quickly focus their troubleshooting efforts on the RF area, rather than blindly searching the entire PCB. This significantly shortens the time for fault location and repair, improves product maintenance efficiency, and ensures the normal operation of the system.

[0032] 2.2 Enhanced Module Independence: Each functional module is separated by ground isolation, making each module more electrically independent. This means that when a module fails (e.g., short circuit, overcurrent), the impact is limited to that module, making it less likely to spread to other modules, reducing the possibility of a cascading failure, and thus improving the overall system reliability. For example, if a power module experiences a short circuit, ground isolation can prevent the fault current from spreading to other functional modules, avoiding damage to other modules due to abnormal current surges.

[0033] III. Optimize cabling design and manufacturing: 3.1 Simplified Routing Complexity: After functional module partitioning, the signal lines connecting components within the same module are relatively concentrated. This makes it easier to plan routing, reducing detours and intersections, and resulting in neater and more orderly routing. This not only helps improve PCB routing efficiency but also reduces signal integrity issues caused by improper routing, such as reflections and delays. For example, in the digital processing area, the signal lines between the MCU and surrounding memory chips, interface chips, etc., can be centrally planned within this area, reducing conflicts with routing in other areas.

[0034] 3.2 Improved Manufacturing Efficiency: Zonal layout allows for relatively independent processing and assembly of each functional module during PCB manufacturing. For example, in surface mount technology (SMT) processes, components in the power module area can be mounted first, followed by other modules sequentially, facilitating production line arrangement and management. Simultaneously, optimized layout and routing reduce the probability of manufacturing defects such as poor soldering and short circuits during production, improving product yield and lowering production costs.

[0035] IV. Facilitates system upgrades and expansions: 4.1 Modular Upgrade: With technological advancements and changing demands, it may be necessary to upgrade certain functional modules of a single-board PCB. The modular layout facilitates such upgrades. For example, to upgrade the performance of a radio frequency (RF) unit, the left-hand RF area can be directly replaced or improved without significantly impacting the normal operation of other modules. The ground isolation structure ensures electrical compatibility and signal independence between the new and existing modules during the upgrade process.

[0036] 4.2 Flexibility in Functional Expansion: When adding new functional modules to a single-board PCB, the partitioned layout offers more space planning possibilities. Appropriate areas can be selected for addition based on the functional characteristics of the new module, and through reasonable wiring and isolation design, it can work collaboratively with existing modules. For example, to add a new sensor interface module, it can be placed in a suitable location near the peripheral interface area and isolated from other modules using ground isolation, ensuring stable operation of both new and old functional modules.

[0037] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.

[0038] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An RSU device, characterized in that: The system includes a power supply module (1), a voltage regulator circuit (2), a microcontroller (3), an ETC chip (4), a PSAM circuit (5), an RF amplifier circuit (6), a communication module (7), and a SIM card (8). The power supply module (1) is electrically connected to the voltage regulator circuit (2). The voltage regulator circuit (2) and the PSAM circuit (5) are both electrically connected to the microcontroller (3). The microcontroller (3) is interconnected with the ETC chip (4). The microcontroller (3) is used to control the ETC chip (4) and the RF amplifier circuit (6), and transmits and receives signals via a 5.8GHz antenna. The ETC signal of the carrier unit, the ETC chip (4) and the radio frequency amplifier circuit (6) are interconnected, the microcontroller (3) is electrically connected to the communication module (7), the communication module (7) is electrically connected to the SIM card (8), the power module (1), the voltage regulator circuit (2), the microcontroller (3), the ETC chip (4), the PSAM circuit (5), the radio frequency amplifier circuit (6), the communication module (7), and the SIM card (8) are connected to the PCB board respectively in a ground isolation manner, and a heat dissipation window (9) is provided on the back of the PCB board in the area of ​​the radio frequency amplifier circuit (6).

2. The RSU device according to claim 1, characterized in that: The power module (1) includes a power supply (1-1) and a power protection circuit (1-2); the power supply (1-1) and the power protection circuit (1-2) are electrically connected.

3. An RSU device according to claim 2, characterized in that: The power module (1) is located on the right side of the PCB board.

4. An RSU device according to claim 1, characterized in that: The PSAM circuit (5) is a PSAM card.

5. An RSU device according to claim 1, characterized in that: The radio frequency amplifier circuit (6) includes a radio frequency switch (6-1), a BPF (6-2), an FEM (6-3), and an attenuator (6-4); the radio frequency switch (6-1) is connected to the BPF (6-2) and the attenuator (6-4) respectively, and the BPF (6-2) and the attenuator (6-4) are connected to the FEM (6-3) respectively.

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