Electronic device

Abstract

The present disclosure provides an electronic device, belonging to the technical field of pressure relief. The electronic device comprises a middle frame, a screen, a pressure relief valve, a loudspeaker assembly and a back cover. The middle frame is located between the screen and the back cover, and a first accommodating cavity is formed between the middle frame and the screen. At least part of the loudspeaker assembly communicates with the first accommodating cavity. The screen and / or the middle frame has a loudspeaker hole, which communicates with the first accommodating cavity and the outside of the electronic device. A second accommodating cavity is formed between the middle frame and the back cover, and a through hole is formed between the first accommodating cavity and the second accommodating cavity. The pressure relief valve covers the through hole and has a plurality of micropores. When the pressure in the second accommodating cavity is relatively high, the air in the second accommodating cavity can flow to the first accommodating cavity through the micropores and the through hole, and then be discharged from the loudspeaker hole, so as to maintain the stability of the internal pressure of the electronic device. In this way, an additional pressure relief hole does not need to be arranged on the middle frame, thereby improving the sealing performance of the middle frame and the delicacy of the appearance of the electronic device.

Description

Technical Field

[0001] This disclosure relates to the field of pressure relief technology, and in particular to an electronic device. Background Technology

[0002] As the sealing performance of electronic devices gradually improves, pressure relief valves are required, and pressure relief holes are also needed on the surface of these devices. When the internal pressure of an electronic device increases due to rising temperature, the air inside the device can be discharged to the outside through the pressure relief valves and holes, thereby maintaining a stable internal pressure. Summary of the Invention

[0003] This disclosure provides an electronic device that eliminates the need for pressure relief holes on the surface of the electronic device, thereby improving the sealing performance of the electronic device. The technical solution of the electronic device is as follows.

[0004] This disclosure provides an electronic device, which includes a mid-frame, a screen, a pressure relief valve, a speaker assembly, and a rear cover;

[0005] The mid-frame is located between the screen and the back cover, and a first receiving cavity is provided between the mid-frame and the screen. At least a portion of the speaker assembly communicates with the first receiving cavity, and the first receiving cavity has a speaker hole that communicates with the outside of the electronic device.

[0006] A second receiving cavity is provided between the middle frame and the rear cover. The first receiving cavity and the second receiving cavity are connected by a through hole. The pressure relief valve covers the through hole and has multiple micropores.

[0007] In one possible implementation, the first receiving cavity includes a first cavity and a second cavity that are in communication.

[0008] The speaker assembly is opposite to the first cavity, and the through hole is located in the second cavity. This design prevents the through hole from being opposite to the speaker assembly, thus avoiding the influence of airflow at the through hole on the sound waves emitted by the speaker assembly and preventing a decrease in sound quality. Furthermore, it also prevents the speaker assembly from obstructing the airflow at the through hole.

[0009] In one possible implementation, let D be the distance between the end of the through-hole closest to the screen and the speaker assembly, then 4mm ≤ D ≤ 6mm. This makes it less likely for airflow at the through-hole to affect the sound waves emitted by the speaker assembly, and also makes it less likely for the through-hole to be blocked by other components in the electronic device.

[0010] In one possible implementation, let H be the distance between the bottom wall of the second cavity and the screen, then 1mm ≤ H ≤ 2mm. This facilitates airflow through the second cavity to the speaker holes while also providing the mid-frame with high support strength for the screen.

[0011] In one possible implementation, the end of the through-hole near the screen is located on the bottom wall of the second cavity, wherein the bottom wall is opposite to the screen. This does not reduce the supporting strength of the sidewalls of the second cavity for the screen.

[0012] In one possible implementation, the pressure relief valve is located in the second receiving cavity. This reduces the likelihood of the pressure relief valve interfering with other components in the electronic device.

[0013] In one possible implementation, the through hole includes a first hole body and a second hole body;

[0014] The two ends of the second hole are connected to the first hole and the first receiving cavity, respectively, and the diameter of the second hole is smaller than that of the first hole. This allows more gas in the second receiving cavity to pass through the pressure relief valve, while also providing the middle frame with higher support strength for the screen.

[0015] In one possible implementation, the diameter of the first aperture is 4mm-6mm, and the diameter of the second aperture is 2mm-3mm. This allows more gas to pass through the pressure relief valve in the second receiving cavity, and also provides the mid-frame with higher support strength for the screen.

[0016] In one possible implementation, let L be the distance between the second aperture and the speaker aperture, then 15mm ≤ L ≤ 20mm. This ensures both high airtightness of the electronic device and prevents the second aperture from being obstructed by other components within the device.

[0017] In one possible implementation, the pore size of the micropores is 0.1 μm-10 μm. This allows the micropores to achieve both pressure relief and waterproofing.

[0018] The technical solution provided in this disclosure includes at least the following beneficial effects:

[0019] This disclosure provides an electronic device in which, when the pressure in the second receiving cavity is high, air in the second receiving cavity can flow through the micro-holes and through-holes of the pressure relief valve to the first receiving cavity, and then be discharged from the speaker hole. This reduces the pressure in the second receiving cavity, thereby maintaining the stability of the internal pressure of the electronic device. The speaker hole serves as both a sound outlet and a pressure relief port for the electronic device. Therefore, there is no need to provide an additional pressure relief port on the mid-frame, thereby improving the sealing performance of the mid-frame and enhancing the aesthetic appearance of the electronic device.

[0020] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. In the drawings:

[0022] Figure 1 This is a partial structural schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0023] Figure 2 This is a partial exploded view of an electronic device shown in an embodiment of this disclosure;

[0024] Figure 3 This is a partial structural schematic diagram of a middle frame according to an embodiment of the present disclosure;

[0025] Figure 4 This is a partial enlarged view of a pressure relief valve shown in an embodiment of this disclosure;

[0026] Figure 5 This is a partial cross-sectional view of an electronic device shown in an embodiment of this disclosure;

[0027] Figure 6 This is a partial structural diagram of a middle frame shown in an embodiment of this disclosure;

[0028] Figure 7 This is a partial enlarged view of an electronic device shown in an embodiment of this disclosure.

[0029] Legend:

[0030] 1. Middle frame; 10. Speaker hole; 11. First receiving cavity; 111. First cavity body; 112. Second cavity body; 12. Second receiving cavity; 13. Through hole; 131. First hole body; 132. Second hole body;

[0031] 2. Screen;

[0032] 3. Pressure relief valve, 30mm, micro-orifice;

[0033] 4. Speaker assembly.

[0034] The accompanying drawings have illustrated specific embodiments of this disclosure, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this disclosure to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings.

[0036] The terminology used in the embodiments of this disclosure is for illustrative purposes only and is not intended to limit the disclosure. Unless otherwise defined, the technical or scientific terms used herein should be understood in their ordinary sense by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “a” or “one,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising,” “including,” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The terms “connected,” “linked,” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0037] As the sealing performance of electronic devices gradually improves (electronic devices are typically IP68 rated), pressure relief valves are required, and pressure relief holes are needed on the surface of the devices. When the internal pressure of the electronic device increases due to temperature rise, the internal air can be discharged to the outside of the device through the pressure relief valve and pressure relief holes, thereby maintaining a stable internal pressure.

[0038] In related technologies, electronic devices often have speaker holes in addition to pressure relief holes on their surface. This results in a large number of holes on the surface of the electronic device, leading to poor sealing and allowing dust or water to easily enter the pressure relief holes. Furthermore, it also reduces the overall aesthetic appeal of the electronic device.

[0039] In view of the above-mentioned technical problems, embodiments of this disclosure provide an electronic device, such as... Figures 1-3The illustrated electronic device includes a mid-frame 1, a screen 2, a pressure relief valve 3, a speaker assembly 4, and a back cover (not shown). The mid-frame 1 is located between the screen 2 and the back cover, and a first receiving cavity 11 is formed between the mid-frame 1 and the screen 2. At least a portion of the speaker assembly 4 communicates with the first receiving cavity 11. The first receiving cavity 11 has a speaker hole 10, which communicates with the outside of the electronic device. A second receiving cavity 12 is formed between the mid-frame 1 and the back cover, and the first receiving cavity 11 and the second receiving cavity 12 are connected by a through hole 13, which is covered by the pressure relief valve 3. Figure 4 As shown ( Figure 4 (This is a partial enlarged view of the pressure relief valve 3), which has multiple micro-holes 30.

[0040] The screen 2 can be attached to the middle frame 1 with adhesive backing.

[0041] The pressure relief valve 3 is a thin film with multiple micropores 30. The micropores 30 allow air molecules to pass through while blocking water droplets, thus making the electronic device waterproof. The pressure relief valve 3 can be fixed to the middle frame 1 with adhesive.

[0042] The sound emitted by the speaker assembly 4 can be transmitted to the outside of the electronic device through the speaker hole 10. The speaker hole 10 can be located on the side wall of the middle frame 1, or the edge of the screen 2 has a groove, and the speaker hole 10 is formed between the groove and the inner wall of the middle frame 1. The speaker hole 10 can be located at the top or bottom of the electronic device. The speaker assembly 4 can be located in the second receiving cavity 12, and the housing of the second speaker assembly 4 is sealed to the middle frame 1. The middle frame 1 has a through hole at the position opposite to the speaker assembly 4, and the interior of the housing of the speaker assembly 4 communicates with the first receiving cavity 11 through the through hole.

[0043] Electronic devices can be terminal devices such as mobile phones or tablets.

[0044] The technical solutions provided in the embodiments of this disclosure, such as Figure 5 As shown, when the pressure in the second cavity 12 is high, the air in the second cavity 12 can flow through the micropores 30 and the through-holes 13 to the first cavity 11, and then be discharged from the speaker hole 10. This reduces the pressure in the second cavity 12, thereby maintaining the stability of the internal pressure of the electronic device. Figure 5 The dashed arrows in the diagram indicate the airflow path. Since the speaker hole 10 serves as both a sound outlet and a pressure relief vent for the electronic device, there is no need for additional pressure relief vents on the middle frame 1. This improves the sealing performance of the middle frame 1 and enhances the aesthetic appeal of the electronic device.

[0045] In some examples, such as Figure 2As shown, the first receiving cavity 11 includes a first cavity 111 and a second cavity 112 that are connected. The speaker assembly 4 is opposite to the first cavity 111, and the through hole 13 is located in the second cavity 112. This design prevents the through hole 11 from being opposite to the speaker assembly 4, thus avoiding the sound waves emitted by the speaker assembly 4 being affected by the airflow at the through hole 11, and consequently preventing a decrease in the sound quality of the speaker assembly 4. Furthermore, it also prevents the speaker assembly 4 from obstructing the airflow at the through hole 11. This design allows the electronic device to have better sound quality and also helps stabilize the internal pressure of the electronic device.

[0046] In some examples, such as Figure 6 As shown, let D be the distance between the end of the through hole 13 near the screen 2 and the speaker assembly 4, then 4mm≤D≤6mm.

[0047] If D is too small, the airflow at the through-hole 13 will easily affect the sound waves emitted by the speaker assembly 4, thus affecting the sound quality of the electronic device. Since there are many components in the electronic device and the internal space of the electronic device is small, if D is too large, the through-hole 13 will be easily blocked by other components in the electronic device, making it difficult for the air in the second receiving cavity 12 to escape, thus making the electronic device prone to damage due to excessive internal pressure.

[0048] In some examples, such as Figure 7 As shown, let H be the distance between the bottom wall of the second cavity 112 and the screen 2, then 1mm≤H≤2mm.

[0049] If H is too small, the airflow speed in the second cavity 112 will be slow, which will hinder the rapid discharge of gas from the second cavity 12 to the outside of the electronic device when the internal pressure is high. If H is too large, it will reduce the supporting strength of the middle frame 1 for the screen 2. When the part of the screen 2 opposite to the second cavity 112 is impacted, the screen 2 is easily damaged.

[0050] In some examples, such as Figure 7 As shown, the end of the through-hole 13 near the screen 2 is located on the bottom wall of the second cavity 112. The bottom wall is opposite to the screen 2. The side wall of the second cavity 112 can support the screen 2. If the end of the through-hole 13 near the screen 2 is located on the side wall of the second cavity 112, the structural strength of the side wall of the second cavity 112 will be reduced, thereby reducing the support strength of the side wall of the second cavity 112 for the screen 2, and consequently making the screen 2 more susceptible to damage.

[0051] In some examples, such as Figure 7As shown, the pressure relief valve 3 is located in the second receiving cavity 12. There is a large space between the middle frame 1 and the back cover, while the space between the middle frame 1 and the screen 2 is smaller. That is, the volume of the second receiving cavity 12 is large, so the pressure relief valve 3 is placed in the second receiving cavity 12. In this way, it is less likely for the pressure relief valve 3 to interfere with other components in the electronic device.

[0052] In some examples, such as Figure 7 As shown, the through hole 13 includes a first hole body 131 and a second hole body 132. The two ends of the second hole body 132 are connected to the first hole body 131 and the first receiving cavity 11, respectively, and the diameter of the second hole body 132 is smaller than the diameter of the first hole body 131.

[0053] The pressure relief valve 3 is located in the second receiving cavity 12. The absence of micropores 30 in the pressure relief valve 3 would obstruct airflow. To allow more gas to quickly exit the second receiving cavity 12, the first orifice 131 is designed with a larger diameter, enabling it to align with more micropores 30, thus allowing more gas to pass through the pressure relief valve 3 in the second receiving cavity 12. Since the second orifice 132 is close to the screen 2, its diameter is smaller, resulting in higher structural strength for the middle frame 1 near the screen 2, and consequently, higher support strength for the screen 2.

[0054] In some examples, the diameter of the first orifice 131 is 4mm-6mm. If the diameter of the first orifice 131 is too small, it will be difficult for a large amount of air in the second receiving cavity 12 to pass through the pressure relief valve 3. If the diameter of the first orifice 131 is too large, the size of the pressure relief valve 3 will also increase accordingly, making the pressure relief valve 3 prone to interference with other devices in the second receiving cavity 12.

[0055] The aperture of the second hole 132 is 2mm-3mm. If the aperture of the second hole 132 is too small, it will obstruct the airflow into the first receiving cavity 11, which will be detrimental to the stability of the internal pressure of the electronic device. If the aperture of the second hole 132 is too large, it will result in lower strength of the middle frame 1, which will reduce the support strength of the middle frame 1 for the screen 2, making the screen 2 more susceptible to damage.

[0056] For example, the first hole 131 and the second hole 132 can be circular holes or rectangular holes, and this embodiment does not specifically limit them. If the first hole 131 is a circular hole, then the diameter of the first hole 131 is the diameter of the circular hole. If the first hole 131 is a rectangular hole, then the diameter of the first hole 131 is the length of the longer sidewall of the rectangular hole.

[0057] In some examples, such as Figure 6 As shown, let L be the distance between the second hole 132 and the speaker hole 10, then 15mm≤L≤20mm.

[0058] If L is too small, the distance between the second cavity 132 and the speaker hole 10 will be too close. When small external impurities (such as high-temperature water vapor) enter the speaker hole 10, these impurities can easily enter the through hole 13, increasing the risk of small impurities entering the second cavity 12. This will reduce the sealing performance of the electronic device.

[0059] Since there are many components in electronic devices and the internal space of electronic devices is small, if L is too large, the second hole 132 will be easily blocked by other components in the electronic device, making it difficult for the air in the second receiving cavity 12 to be discharged, which will make the electronic device easily damaged due to excessive internal pressure.

[0060] Of course, in other examples, the pressure relief valve 3 may also be located in the first receiving cavity 11, and this disclosure does not specifically limit this.

[0061] In some examples, the pore size of the micropore 30 is 0.1 μm-10 μm. Since the diameter of an air molecule is approximately 0.0004 μm, the pore size of the micropore 30 is much larger than the diameter of an air molecule, allowing air molecules to easily pass through. Conversely, the diameter of a water droplet is typically about 200 μm, so the pore size of the micropore 30 is much smaller than the diameter of a water droplet, making it difficult for water droplets to pass through. Thus, the micropore 30 achieves both pressure relief and waterproofing.

[0062] If the aperture of the micropore 30 is too small, air molecules will have difficulty passing through. As a result, when the temperature of the electronic device rises, the air in the second receiving cavity 12 will not be able to escape, making the electronic device prone to damage due to excessive internal pressure. If the aperture of the micropore 30 is too large, when water enters the first receiving cavity 11 through the speaker hole 10, water droplets can easily pass through the micropore 30 and enter the second receiving cavity 12, which can easily damage the devices in the second receiving cavity 12.

[0063] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. An electronic device, characterized in that, The electronic device includes a mid-frame (1), a screen (2), a pressure relief valve (3), a speaker assembly (4), and a back cover; The middle frame (1) is located between the screen (2) and the back cover, and a first receiving cavity (11) is provided between the middle frame (1) and the screen (2). At least a portion of the speaker assembly (4) communicates with the first receiving cavity (11), and the first receiving cavity (11) has a speaker hole (10) that communicates with the outside of the electronic device. There is a second receiving cavity (12) between the middle frame (1) and the rear cover. The first receiving cavity (11) and the second receiving cavity (12) are connected by a through hole (13). The pressure relief valve (3) covers the through hole (13) and has a plurality of micropores (30).

2. The electronic device of claim 1, wherein, The first receiving cavity (11) includes a first cavity (111) and a second cavity (112) that are connected. The speaker assembly (4) is opposite to the first cavity (111), and the through hole (13) is located in the second cavity (112).

3. The electronic device of claim 2, wherein, Let D be the distance between the end of the through hole (13) near the screen (2) and the speaker assembly (4), then 4mm≤D≤6mm.

4. The electronic device of claim 2, wherein, Let H be the distance between the bottom wall of the second cavity (112) and the screen (2), then 1mm≤H≤2mm.

5. The electronic device of claim 2, wherein, The end of the through hole (13) near the screen (2) is located on the bottom wall of the second cavity (112), wherein the bottom wall is opposite to the screen (2).

6. The electronic device of any of claims 1-5, wherein, The pressure relief valve (3) is located in the second receiving cavity (12).

7. The electronic device of claim 6, wherein, The through hole (13) includes a first hole body (131) and a second hole body (132); The two ends of the second hole (132) are connected to the first hole (131) and the first receiving cavity (11) respectively. The diameter of the second hole (132) is smaller than the diameter of the first hole (131).

8. The electronic device of claim 7, wherein, The diameter of the first hole (131) is 4mm-6mm, and the diameter of the second hole (132) is 2mm-3mm.

9. The electronic device of claim 7, wherein, Let L be the distance between the second hole (132) and the speaker hole (10), then 15mm≤L≤20mm.

10. The electronic device according to any one of claims 1-5, characterized in that, The pore size of the micropore (30) is 0.1μm-10μm.

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