Curing mechanism and dispensing apparatus

Abstract

The application relates to a curing mechanism and a dispensing device. The curing mechanism comprises a machine table, a cooling assembly, a curing box, a bearing table and a curing assembly, which are arranged on the machine table. The bearing table is used for bearing a product to be cured and can move between a material taking position and a curing position. The curing assembly is used for supplying curing heat to the product to be cured. The cooling assembly is arranged on the curing assembly and is used for leading out heat generated by the curing assembly. When the bearing table moves to the curing position, the bearing table can be matched with the curing box, and a curing chamber is formed between the bearing table and the curing box. The curing mechanism provided by the application can timely lead out heat generated by the curing assembly, improve the cooling effect of the curing assembly, reduce the space occupation of the cooling assembly, make the curing chamber larger, and be compatible with curing operations of different specifications of products to be cured.

Description

Technical Field

[0001] This application relates to the field of curing equipment technology, and in particular to a curing mechanism and dispensing equipment. Background Technology

[0002] With the continuous advancement of technology, display modules have developed rapidly in today's society and are widely used in mobile phones, watches, computers, televisions, and other fields. The manufacturing process of display modules typically involves dispensing and curing.

[0003] Currently, display modules are typically placed in a curing chamber for curing. Since the display module requires heat during curing, the curing chamber needs to be cooled to prevent prolonged heat accumulation from affecting the curing environment. Generally, the cooling system is located within the curing chamber. However, this cooling system occupies a significant amount of space within the curing chamber, resulting in a larger overall curing mechanism and hindering the compatibility and expansion of the curing chamber. Utility Model Content

[0004] Therefore, it is necessary to provide a curing mechanism and dispensing equipment to address the problems of existing curing mechanisms being large in size and having poor compatibility.

[0005] A curing mechanism, the curing mechanism comprising a machine base, a cooling assembly, and a curing chamber, a support platform, and a curing assembly, all disposed on the machine base;

[0006] The support platform is used to support the product to be cured and can move between the material feeding position and the curing position. The curing component is used to supply the curing heat to the product to be cured. The cooling component is disposed on the curing component and is used to dissipate the heat generated by the curing component.

[0007] When the support platform moves to the curing position, the support platform can cooperate with the curing box, and a curing chamber is formed between the support platform and the curing box.

[0008] In one embodiment, the curing assembly includes a curing lamp and a mounting base for fixing the curing lamp, the mounting base being disposed on the machine base;

[0009] The cooling assembly includes at least one cooling channel, which is formed in the mounting base.

[0010] In one embodiment, the cooling channel has a cooling inlet and a cooling outlet at opposite ends, and the cooling inlet and the cooling outlet are located on opposite sides of the mounting base.

[0011] In one embodiment, there are multiple curing components and multiple cooling components, with the multiple curing components distributed at intervals along the circumferential direction of the curing chamber, and the multiple cooling components correspondingly disposed on the multiple curing components.

[0012] In one embodiment, the curing component is disposed outside the curing chamber, and the curing chamber is a transparent component.

[0013] In one embodiment, the curing mechanism further includes a linear module and a lifting module, both of which are disposed on the machine base and are connected to the support platform in a driving manner. The linear module is used to drive the support platform to move between the material picking position and the curing position, and the lifting module is used to drive the support platform to move toward or away from the curing chamber. When the support platform moves toward the curing chamber, the support platform and the curing chamber can form the curing chamber.

[0014] In one embodiment, the lifting module is slidably disposed on the linear module, and the support platform is disposed on the lifting module.

[0015] In one embodiment, the support platform is provided with a seal on the side near the curing chamber, and when the curing chamber is formed between the support platform and the curing chamber, the seal is located between the support platform and the curing chamber.

[0016] In one embodiment, the curing mechanism further includes an inflation module disposed on the machine base for filling the curing chamber with inert gas.

[0017] A dispensing device, the dispensing device comprising:

[0018] A dispensing mechanism for applying an adhesive layer to the surface of the product to be cured; and

[0019] The curing mechanism as described in any of the above technical solutions is located downstream of the dispensing mechanism.

[0020] The aforementioned curing mechanism and dispensing equipment include a support platform that can move to the material picking position and pick up the product to be cured. After the product is picked up, the support platform moves from the material picking position towards the curing position. When the support platform reaches the curing position, it cooperates with the curing chamber to form a curing chamber. Heat is supplied to the product to be cured through the curing components to achieve the curing operation. The cooling components are integrated into the curing components, which can promptly dissipate the heat generated by the curing components, improving the cooling effect of the curing components and reducing the space occupied by the cooling components. This allows for a larger curing chamber to accommodate curing operations of products of different specifications. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the curing mechanism provided in some embodiments.

[0022] Figure 2 This is a top view of the curing mechanism provided in some embodiments.

[0023] Figure 3 This is a schematic diagram of the structure of the cooling component and curing component module provided in some embodiments.

[0024] Figure label:

[0025] 100. Curing mechanism;

[0026] 110. Machine base; 111. Material handling position; 112. Curing position; 120. Cooling assembly; 121. Cooling channel; 122. Cooling inlet; 123. Cooling outlet; 130. Curing chamber; 140. Support platform; 141. Seal; 150. Curing assembly; 151. Fixing base; 160. Linear module; 170. Lifting module; 180. Inflation module. Detailed Implementation

[0027] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0028] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0032] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0033] The technical solutions provided by the embodiments of this application are described below with reference to the accompanying drawings.

[0034] See Figures 1-3 As shown, this application provides a curing mechanism 100, which includes a machine base 110, a cooling component 120, a curing chamber 130, a support platform 140, and a curing component 150. The curing mechanism 100 is used to perform a curing operation on the adhesive layer coated on the surface of the product to be cured.

[0035] The support platform 140 is used to support the product to be cured. If the support platform 140 has a support cavity, the support cavity is used to support the product to be cured. Preferably, the support cavity is integrally formed into the support platform 140 by injection molding, extrusion, or other methods to simplify the molding process of creating the support cavity in the support platform 140. The support platform 140 can move between the material picking position 111 and the curing position 112. For example, when the support platform 140 moves to the material picking position 111, it can complete the material picking operation of the product to be cured at the material picking position 111. Similarly, when the support platform 140 moves to the curing position 112, it can support the product to be cured and perform the curing operation at the curing position 112. Furthermore, when the support platform 140 moves to the curing position 112, it can cooperate with the curing chamber 130, and a curing chamber is formed between the support platform 140 and the curing chamber 130. The curing component 150 is used to supply the curing heat to the product to be cured. For example, the curing component 150 projects heat into the curing chamber, where the product undergoes a high-temperature curing operation. The cooling component 120 is disposed in the curing component 150 and is used to dissipate the heat generated by the curing component 150.

[0036] The aforementioned curing mechanism 100 includes a support platform 140 that can move to the material handling position 111 to pick up the product to be cured. After the product is picked up, the support platform 140 moves from the material handling position 111 towards the curing position 112. When the support platform 140 reaches the curing position 112, it cooperates with the curing chamber 130 to form a curing chamber. Heat is supplied to the product to be cured through the curing component 150 to achieve the curing operation. The cooling component 120 is integrated into the curing component 150. The cooling component 120 can effectively dissipate the heat generated by the curing component 150, improving the cooling effect of the curing component 150 and reducing its space occupation. This allows for a larger curing chamber to accommodate curing operations of products of different specifications.

[0037] In one embodiment, see Figures 1-3As shown, the curing assembly 150 includes a curing lamp (such as an Ultraviolet Lamp) and a mounting base 151. The curing lamp is fixed to the mounting base 151, such as by embedding or snapping. The mounting base 151 is mounted on the machine tool 110 to house the curing assembly 150. The cooling assembly 120 includes at least one cooling channel 121, which is formed in the mounting base 151. The cooling channel 121 is integrally formed in the mounting base 151 by injection molding, extrusion, or other methods to simplify the molding process of forming the cooling channel 121 in the mounting base 151. Thus, by introducing a cooling medium (such as cooling water or ethanol) into the cooling channel 121, the cooling medium flowing inside the cooling channel 121 can dissipate the heat generated by the curing assembly 150. Since the cooling channel 121 is formed in the mounting base 151, the cooling assembly 120 does not need to occupy the internal space of the curing chamber, reducing the space occupied by the cooling assembly 120.

[0038] Preferably, the cooling assembly 120 includes multiple cooling channels 121. These multiple cooling channels 121 can increase the flow rate of the cooling medium. By increasing the flow rate of the cooling medium, the heat generated by the curing assembly 150 can be quickly dissipated, thereby improving the cooling efficiency of the curing assembly 150. Furthermore, the cooling channels 121 can be straight, serpentine, or other shapes. This application does not limit the specific shape of the cooling channels 121.

[0039] Further, see Figures 1-3 As shown, the cooling channel 121 has a cooling inlet 122 and a cooling outlet 123 at opposite ends. The cooling inlet 122 is connected to a cooling medium supply source, and the cooling outlet 123 is connected to a cooling medium recovery source. Cooling medium is introduced through the cooling inlet 122, flows within the cooling channel 121, carrying away the heat generated by the curing component 150, and flows to the outside at the cooling outlet 123, thus dissipating the heat generated by the curing component 150 to the outside. The cooling inlet 122 and cooling outlet 123 are located on opposite sides of the mounting base 151. This relatively distant placement of the cooling inlet 122 and cooling outlet 123 ensures that the cooling medium has a sufficiently long flow path within the cooling channel 121, further improving the cooling effect of the cooling component 120 on the curing component 150.

[0040] In one embodiment, see Figures 1-3As shown, there are multiple curing components 150 and multiple cooling components 120. The multiple curing components 150 are spaced apart along the circumferential direction of the curing chamber 130. This allows for zoned curing of the product within the curing chamber by the multiple curing components 150, improving the curing effect. Furthermore, the multiple curing components 150 provide more curing heat and act on the product, thereby increasing the curing efficiency. Multiple cooling components 120 are correspondingly disposed on the multiple curing components 150. For example, there may be five curing components 150 and five cooling components 120, with each cooling component 120 disposed on one of the five curing components 150. Thus, each cooling component 120 independently handles the heat dissipation of its corresponding curing component 150, improving the cooling effect of the curing component 150.

[0041] Of course, in other feasible embodiments, the number of curing components 150 and cooling components 120 can be two, three, four or other numbers. This application does not limit the specific number of curing components 150 and cooling components 120, as long as the number of curing components 150 and cooling components 120 is consistent.

[0042] Further, see Figures 1-3 As shown, the curing component 150 is located on the outside of the curing chamber 130. The curing component 150 does not occupy the internal space of the curing chamber 130, allowing the curing chamber to be made larger to accommodate curing operations of products of different specifications. The curing chamber 130 is a transparent component, such as one enclosed by a glass plate. The curing chamber 130 allows the curing lamp to shine through the curing chamber 130 into the curing chamber to perform the curing operation on the products to be cured within the curing chamber.

[0043] In one embodiment, see Figure 1 and Figure 2 As shown, the curing mechanism 100 also includes a linear module 160 and a lifting module 170. Both the linear module 160 and the lifting module 170 are mounted on the machine base 110 and are connected to the support platform 140 via a transmission connection. The linear module 160 drives the support platform 140 to move between the material picking position 111 and the curing position 112, enabling the support platform 140 to pick up the product to be cured at the material picking position 111 and to move the product to be cured to the curing position 112 for curing. The lifting module 170 drives the support platform 140 to move towards or away from the curing chamber 130, and when the support platform 140 moves towards the curing chamber 130, a curing chamber can be formed between the support platform 140 and the curing chamber 130.

[0044] In this embodiment, the linear module 160 is an automated unit composed of components such as linear guides and ball screws. The lifting module 170 can be a linear cylinder, linear motor, or other power-output components. This application does not limit the specific component types of the lifting module 170.

[0045] When the curing mechanism 100 needs to perform a curing operation on the product to be cured, firstly, the linear module 160 drives the carrier platform 140 to move to the material picking position 111, where the carrier platform 140 completes the material picking operation on the product to be cured; then, the linear module 160 drives the carrier platform 140 from the material picking position 111 to the curing position 112, where the carrier platform 140 carries the product to be cured to the curing position 112; next, the lifting module 170 drives the carrier platform 140 to move toward the curing chamber 130, where the carrier platform 140 and the curing chamber 130 are attached to form a curing chamber; finally, the curing component 150 performs a curing operation on the product to be cured in the curing chamber. Conversely, after the curing operation of the product to be cured is completed, firstly, the lifting module 170 drives the support platform 140 to move away from the curing chamber 130; then, the linear module 160 drives the support platform 140 to move from the curing position 112 to the material picking position 111; finally, the product to be cured is unloaded at the material picking position 111 after curing.

[0046] Specifically, see Figure 1 and Figure 2 As shown, the lifting module 170 is slidably mounted on the linear module 160, and the support platform 140 is mounted on the lifting module 170. The lifting module 170 slides the support platform 140 onto the linear module 160. Thus, the cooperation between the linear module 160 and the lifting module 170 drives the support platform 140 to move, thereby realizing the picking, curing, and unloading operations of the product to be cured.

[0047] Of course, in other feasible embodiments, the linear module 160 can be disposed on the lifting module 170, and the support platform 140 can be slidably disposed on the linear module 160. In this way, the cooperation between the linear module 160 and the lifting module 170 can also drive the support platform 140 to move, so as to realize the material picking, curing and unloading operations of the product to be cured.

[0048] Further, see Figure 1 and Figure 2As shown, the support platform 140 is provided with a sealing element 141 on the side near the curing chamber 130. The sealing element 141 may include, but is not limited to, sealing rings, sealing gaskets, or other sealing elements. When a curing chamber is formed between the support platform 140 and the curing chamber 130, the sealing element 141 is located between the support platform 140 and the curing chamber 130, such as at the contact position between the support platform 140 and the curing chamber 130. The sealing element 141 seals the curing chamber to ensure the reliability of the sealing environment within the curing chamber, prevent heat leakage from the inside of the curing chamber, ensure the stability of the curing environment for the product to be cured, and guarantee the curing effect of the product.

[0049] In one embodiment, see Figure 1 and Figure 2 As shown, the curing mechanism 100 also includes a gas filling module 180. The gas filling module 180 is disposed on the machine base 110 and is used to fill the curing chamber with inert gas. For example, if the gas filling module 180 is a gas source, it can fill the curing chamber with inert gases such as nitrogen or argon. Thus, curing the product to be cured in an inert gas environment can protect organic light-emitting materials and metal motors that are extremely sensitive to oxygen and moisture, ensuring that the product to be cured (such as a display panel) can achieve the required brightness, color, uniformity, and a sufficiently long service life.

[0050] Additionally, see Figures 1-3 As shown, this application also provides a dispensing device, which includes a dispensing mechanism and a curing mechanism 100 as described above. The dispensing mechanism is used to coat an adhesive layer on the surface of a product to be cured, and the curing mechanism 100 is located downstream of the dispensing mechanism, where downstream refers to the flow direction of the product to be cured.

[0051] In the aforementioned dispensing equipment, the dispensing mechanism coats the surface of the product to be cured with an adhesive layer. The product with the adhesive layer is then transferred to the curing mechanism 100, where the adhesive layer is cured. During the curing process, the support platform 140 moves to the material picking position 111 to pick up the product. After picking up the product, the support platform 140 moves from the material picking position 111 towards the curing position 112. When the support platform 140 reaches the curing position 112, it cooperates with the curing chamber 130 to form a curing chamber. Heat is supplied to the product to be cured through the curing component 150 to achieve the curing operation. The cooling component 120 is integrated into the curing component 150. The cooling component 120 can effectively dissipate the heat generated by the curing component 150, improving the cooling effect of the curing component 150 and reducing its space occupation. This allows for a larger curing chamber to accommodate curing operations of products of different specifications.

[0052] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A curing mechanism, characterized in that, The curing mechanism includes a machine base, a cooling assembly, and a curing chamber, a support platform, and a curing assembly, all of which are installed on the machine base. The support platform is used to support the product to be cured and can move between the material feeding position and the curing position. The curing component is used to supply the curing heat to the product to be cured. The cooling component is disposed on the curing component and is used to dissipate the heat generated by the curing component. When the support platform moves to the curing position, the support platform can cooperate with the curing box, and a curing chamber is formed between the support platform and the curing box.

2. The curing mechanism according to claim 1, characterized in that, The curing assembly includes a curing lamp and a mounting base for fixing the curing lamp, the mounting base being disposed on the machine base; The cooling assembly includes at least one cooling channel, which is formed in the mounting base.

3. The curing mechanism according to claim 2, characterized in that, The cooling channel has a cooling inlet and a cooling outlet at opposite ends, and the cooling inlet and the cooling outlet are located on opposite sides of the fixed base.

4. The curing mechanism according to any one of claims 1 or 3, characterized in that, There are multiple curing components and multiple cooling components. The multiple curing components are distributed at intervals along the circumferential direction of the curing chamber, and the multiple cooling components are correspondingly arranged on the multiple curing components.

5. The curing mechanism according to claim 4, characterized in that, The curing component is located on the outside of the curing chamber, and the curing chamber is a transparent component.

6. The curing mechanism according to claim 1, characterized in that, The curing mechanism further includes a linear module and a lifting module. Both the linear module and the lifting module are disposed on the machine base and are connected to the support platform in a transmission manner. The linear module is used to drive the support platform to move between the material picking position and the curing position. The lifting module is used to drive the support platform to move toward or away from the curing chamber. When the support platform moves toward the curing chamber, the support platform can form the curing chamber with the curing chamber.

7. The curing mechanism according to claim 6, characterized in that, The lifting module is slidably disposed on the linear module, and the support platform is disposed on the lifting module.

8. The curing mechanism according to any one of claims 6 or 7, characterized in that, The support platform is provided with a seal on the side near the curing chamber, and when the curing chamber is formed between the support platform and the curing chamber, the seal is located between the support platform and the curing chamber.

9. The curing mechanism according to claim 1, characterized in that, The curing mechanism also includes an inflation module, which is disposed on the machine base and is used to fill the curing chamber with inert gas.

10. A dispensing device, characterized in that, The dispensing equipment includes: A dispensing mechanism for applying an adhesive layer to the surface of the product to be cured; and The curing mechanism as described in any one of claims 1-9, wherein the curing mechanism is disposed downstream of the dispensing mechanism.

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