Graphene ultra-thin copper foil adhesive tape with good shielding performance

Abstract

The utility model provides a kind of graphene ultra-thin copper foil adhesive tape with good shielding effectiveness, it relates to copper foil adhesive tape technical field, including composite conductive adhesive layer, the upper surface of composite conductive adhesive layer is equipped with protective layer, the upper surface of protective layer is equipped with copper foil layer, the lattice buffer of graphene and copper foil is realized by quantum dot composite transition layer, makes interface bonding strength greatly promote, avoids delamination failure in use process, gradient conductive path constructed by multilayer graphene and high crystallinity copper foil makes the broadband shielding effectiveness of low frequency to high frequency all significantly enhanced, by micro-nano convex point array design, it can preferential exhaust, active spreading when fitting, eliminate micro gap to avoid electromagnetic wave from adhesive layer interface leakage, by sawtooth microstructure and protective layer form mechanical occlusion, improve the adhesion and interface tightness of composite conductive adhesive layer, adopt arc edge and cover conductive adhesive, so that the edge of adhesive tape forms continuous conductive loop, improve shielding continuity and edge sealing performance as a whole.

Description

Technical Field

[0001] This utility model relates to the field of copper foil tape technology, and in particular to a graphene ultrathin copper foil tape with good shielding performance. Background Technology

[0002] According to Chinese Patent Publication No. CN212669598U, a thermally conductive graphene copper foil tape is disclosed, comprising a tape body and a tape core. The tape body is wound around the outside of the tape core. The tape body includes a flame-retardant PET layer, a graphene coating, a copper foil layer, an adhesive layer, and a transparent PET release film layer. The tape core includes several spokes and buckles. The spokes are arranged in a ring around the center of the tape core. Buckles are fixedly connected at the intersection points of the spokes. A cutting blade is engaged on one side of the buckle. The beneficial effects of this utility model are: the flame-retardant PET layer effectively improves the flame-retardant performance of the copper foil tape; the graphene coating provides high thermal conductivity and heat dissipation, making the heat dissipation effect more ideal; the copper foil layer uses ultra-thin copper foil as the substrate, which reduces the space occupation rate; and the adhesive layer and transparent PET release film layer provide good flexibility and adhesion performance.

[0003] The above-mentioned documents and existing technologies have the following technical problems: the graphene in the existing copper foil tape has poor bonding with the copper foil interface and is easy to delaminate, resulting in insufficient high-frequency shielding ability. The adhesive layer is an insulating or low-conductivity material, which generates bubbles or micro-gap after bonding, forming electromagnetic leakage points. The tape edge is cut at a right angle, and the edge can easily become an electromagnetic wave escape channel, resulting in a significant decrease in the overall shielding performance. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a graphene ultrathin copper foil tape with good shielding performance.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a graphene ultrathin copper foil tape with good shielding performance, comprising a composite conductive adhesive layer, a protective layer on the upper surface of the composite conductive adhesive layer, a copper foil layer on the upper surface of the protective layer, a composite transition layer on the upper surface of the copper foil layer, a graphene shielding layer on the upper surface of the composite transition layer, a micro-nano bump array on the side of the composite conductive adhesive layer away from the copper foil layer, a sawtooth microstructure on the side of the composite conductive adhesive layer close to the copper foil layer, and a sealing edge on the outer edge of the composite conductive adhesive layer, the copper foil layer, the composite transition layer, and the graphene shielding layer, the surface of which is covered with conductive adhesive.

[0006] Preferably, the micro-nano bump array includes multiple linearly arranged regularly spaced bumps, and the sawtooth microstructure is interlocked with a protective layer disposed on the lower surface of the copper foil layer.

[0007] Preferably, the protective layer is a Ni-P amorphous coating, and the surface of the protective layer has a micro-rough structure.

[0008] Preferably, the composite transition layer is a quantum dot composite layer, and the graphene shielding layer is multilayer graphene.

[0009] Preferably, the sealing edge has an arc-shaped edge structure and is arranged axially symmetrically.

[0010] Preferably, the protective layer is attached to the lower surface of the copper foil layer by chemical plating, and the shape and position of the conductive adhesive are matched with the sealing edge.

[0011] Preferably, the composite transition layer is bonded to the copper foil layer via metallic bonds, and the graphene shielding layer is bonded to the composite transition layer via atomic-level deposition.

[0012] Beneficial effects This invention employs a gradient composite structure consisting of a composite conductive adhesive layer, a protective layer, a copper foil layer, a composite transition layer, and a graphene shielding layer. It also constructs a micro / nano bump array and a sawtooth microstructure. Furthermore, a closed boundary design with arc-shaped edge sealing and conductive adhesive coating is used around the tape. A quantum dot composite transition layer buffers the lattice between graphene and copper foil, significantly improving interfacial bonding strength and preventing delamination failure during use. The gradient conductive path constructed from multiple layers of graphene and highly crystalline copper foil significantly enhances broadband shielding effectiveness from low to high frequencies. The micro / nano bump array design at the bottom of the composite conductive adhesive layer allows for preferential air venting and active spreading during bonding, eliminating micro-gaps and preventing electromagnetic wave leakage from the adhesive layer interface. The sawtooth microstructure on the upper surface forms a mechanical interlock with the protective layer, improving the adhesion and interfacial sealing of the composite conductive adhesive layer for higher reliability. In addition, the arc-shaped edge sealing and conductive adhesive coating create a continuous conductive loop at the tape edge, eliminating the wave-transmitting channels of traditional right-angled edges and improving overall shielding continuity and edge sealing performance. Attached Figure Description

[0013] Figure 1 This is an isometric view of the present invention; Figure 2 This is a perspective view of the present utility model; Figure 3 This is a side view of the present invention; Figure 4 This is a split view of the composite conductive adhesive layer of this utility model.

[0014] Legend: 1. Composite conductive adhesive layer; 2. Protective layer; 3. Copper foil layer; 4. Composite transition layer; 5. Graphene shielding layer; 6. Edge sealing; 7. Conductive adhesive; 8. Micro-nano bump array; 9. Sawtooth microstructure. Detailed Implementation

[0015] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments and accompanying drawings. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the implementation plan without creative effort are all within the protection scope of this utility model.

[0016] The specific embodiments of this utility model are described below with reference to the accompanying drawings. Specific Implementation Example 1: Reference Figure 1-4A graphene-coated ultrathin copper foil tape with good shielding performance includes a composite conductive adhesive layer 1, a protective layer 2 on the upper surface of the composite conductive adhesive layer 1, the protective layer 2 being a Ni-P amorphous plating layer with a micro-roughened structure on its surface, the protective layer 2 being attached to the lower surface of a copper foil layer 3 by chemical plating, a copper foil layer 3 on the upper surface of the protective layer 2, a composite transition layer 4 on the upper surface of the copper foil layer 3, the composite transition layer 4 being a quantum dot composite layer, a graphene shielding layer 5 on the upper surface of the composite transition layer 4, the composite transition layer 4 being bonded to the copper foil layer 3 by metallic bonds, and the graphene shielding layer 5 being bonded to the composite transition layer 4 by atomic-level deposition, the graphene shielding layer 5 being a multilayer graphene layer. The adhesive layer 1 employs a three-dimensional conductive network of graphene and silver nanowires, providing a stable conductive path between the tape and the object being adhered to. It exhibits flexibility and high adhesion, enabling low-resistance bonding across various material surfaces. The micro-nano bump array 8 at the bottom facilitates automatic air venting, prevents air bubbles, and improves interface sealing. The serrated microstructure 9 on the upper surface provides a mechanical locking effect, enhancing the peel strength of the adhesive layer. A Ni-P amorphous protective layer 2 is uniformly plated on the lower surface of the copper foil, forming an antioxidant, corrosion-resistant, and migration-resistant protective layer. Its surface micro-roughness enhances the interlocking with the serrated structure of the composite conductive adhesive layer 1, improving interface stability. Serving as a mechanical transition layer between the composite conductive adhesive layer 1 and the copper foil layer 3, it eliminates... In addition to interfacial stress, in copper foil layer 3, the highly crystalline ultrathin copper foil serves as the main conductive layer and shielding body of the tape, providing extremely low sheet resistance and achieving strong electromagnetic reflection capability. It is the core conductive framework of the entire shielding system. Composite transition layer 4 acts as a lattice matching layer between copper foil and graphene, solving the problems of differences in thermal expansion coefficients and lattice constant mismatch between them. It forms metallic bonds, improves interfacial bonding, prevents delamination of copper foil and graphene, and provides electron transition channels, making the high-frequency response of the shielding tape faster. The multilayer graphene in graphene shielding layer 5 is a highly efficient high-frequency shielding layer, especially exhibiting excellent absorption and reflection performance in the frequency band above GHz, strengthening the mechanical strength, wear resistance, and conductivity of the surface layer. The continuity enhances the overall bandwidth characteristics of the shielding band, providing excellent attenuation from low to high frequencies. The connection between the protective layer 2 and the copper foil layer 3 is achieved by chemically plating a Ni-P amorphous layer, which is directly deposited on the lower surface of the copper foil layer 3. This chemical metallurgical bonding results in high bonding strength. The protective layer 2 completely covers the bottom surface of the copper foil layer 3, forming a continuous interface. The composite transition layer 4 is a quantum dot composite layer, which is attached to the surface of the copper foil layer 3 through metal bonding and in-situ deposition, providing strong interface adhesion and highly conductive channels. The graphene shielding layer 5 is deposited on the surface of the composite transition layer 4 through atomic-level CVD. The two form an atomically compact layer with enhanced van der Waals forces, achieving a strong bond with high consistency, stress, and lattice matching.

[0018] The composite conductive adhesive layer 1 has a micro-nano bump array 8 on the side away from the copper foil layer 3. The micro-nano bump array 8 includes multiple linearly arranged, equidistant regular bumps. The composite conductive adhesive layer 1 has a serrated microstructure 9 on the side close to the copper foil layer 3. The serrated microstructure 9 is interlocked with the protective layer 2 located on the lower surface of the copper foil layer 3. The outer edges of the composite conductive adhesive layer 1, copper foil layer 3, composite transition layer 4, and graphene shielding layer 5 are provided with a sealing edge 6. The sealing edge 6 has an arc-shaped edge structure and is axially symmetrical. The surface of the sealing edge 6 is covered with conductive adhesive 7. The shape and position of the conductive adhesive 7 match the sealing edge 6. The arc-shaped sealing edge 6 changes the traditional right-angle cut edge to a continuous arc-shaped edge, avoiding edge cracks and electric field concentration, directly eliminating electromagnetic leakage channels at the edge, and improving edge shielding performance. The arc structure makes force More uniform distribution and enhanced tear resistance: Conductive adhesive 7 covers the arc-shaped sealing edge 6, forming a continuous conductive closed loop, providing conductive stability at the edge, further blocking electromagnetic waves from leaking from the edge. As a reinforcing layer, it makes the sealing edge 6 more compact. The micro-nano bump array 8 makes preferential contact in the initial stage of pasting, and collapses and releases air when compressed, avoiding air bubbles and interface gaps, promoting the uniform spreading of the composite conductive adhesive layer 1, making the interface thickness consistent, and the shielding effect more stable. The regular arrangement of bumps helps to maintain a uniform distribution of conductive paths. The sawtooth microstructure 9 directly mechanically locks with the micro-rough structure on the surface of the Ni-P protective layer 2, significantly improving the peel strength and impact resistance of the composite conductive adhesive layer 1 to the copper foil layer 3, preventing interface movement, displacement or peeling, and ensuring long-term reliability and electromagnetic sealing. Specific Implementation Example 2: A graphene ultrathin copper foil tape with good shielding effectiveness, based on the basic structure in Specific Embodiment 1, further discloses the following: When using this graphene ultrathin copper foil tape, firstly, the side of the composite conductive adhesive layer 1 with the micro-nano bump array 8 is facing the surface to be adhered, so that the bump array preferentially contacts the substrate under initial light pressure and automatically expels interfacial air. Then, uniform pressure is applied along the length of the tape, causing the bumps to gradually collapse and promoting the formation of a uniform and continuous conductive bonding interface in the composite conductive adhesive layer 1. At the same time, the sawtooth microstructure 9 and the micro-rough surface of the Ni-P amorphous protective layer 2 mechanically interlock, achieving firm fixation. As the pressure increases... As the application continues, the protective layer 2, copper foil layer 3, composite transition layer 4, and graphene shielding layer 5 are sequentially and completely bonded together, forming a stable multi-layered shielding pathway in the gradient composite structure. After bonding, the arc-shaped sealing edge 6 of the tape's outer edge and the conductive adhesive 7 on its surface together form an annular conductive sealing edge 6 structure, automatically closing the electromagnetic leakage channel at the edge, further enhancing the overall shielding continuity and sealing performance. The entire operation requires no additional heating or treatment, achieving fully automated completion of the entire process from interface venting, mechanical locking, shielding layer construction to edge sealing, thereby quickly obtaining a wide-bandwidth, high-intensity, and long-term stable electromagnetic shielding coverage effect.

[0020] In summary: 1. A gradient composite structure is adopted, consisting of a composite conductive adhesive layer 1, a protective layer 2, a copper foil layer 3, a composite transition layer 4, and a graphene shielding layer 5. A micro / nano bump array 8 and a sawtooth microstructure 9 are constructed. Simultaneously, a closed boundary design is used around the adhesive tape, employing an arc-shaped sealing edge 6 and conductive adhesive 7. The quantum dot composite transition layer 4 acts as a lattice buffer between the graphene and copper foil, significantly improving the interfacial bonding strength and preventing delamination failure during use. The gradient conductive path constructed through multiple layers of graphene and highly crystalline copper foil significantly enhances the broadband shielding effectiveness from low to high frequencies. The composite conductive adhesive layer 1 is designed with a micro-nano bump array 8 at the bottom, which can preferentially expel air and actively spread during bonding, eliminating micro-gaps and thus preventing electromagnetic waves from leaking from the interface of the composite conductive adhesive layer 1. The sawtooth microstructure 9 on the upper surface forms a mechanical interlock with the protective layer 2, improving the adhesion and interface sealing of the composite conductive adhesive layer 1 and achieving higher reliability. In addition, the use of arc-shaped sealing edge 6 and covering with conductive adhesive 7 makes the edge of the tape form a continuous conductive circuit, eliminating the wave transmission channel of the traditional right-angle edge, and improving the overall shielding continuity and edge sealing performance.

[0021] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0022] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A graphene ultrathin copper foil tape with good shielding performance, comprising a composite conductive adhesive layer (1), characterized in that: The upper surface of the composite conductive adhesive layer (1) is provided with a protective layer (2), the upper surface of the protective layer (2) is provided with a copper foil layer (3), the upper surface of the copper foil layer (3) is provided with a composite transition layer (4), the upper surface of the composite transition layer (4) is provided with a graphene shielding layer (5), the side of the composite conductive adhesive layer (1) away from the copper foil layer (3) is provided with a micro-nano bump array (8), the side of the composite conductive adhesive layer (1) close to the copper foil layer (3) is provided with a sawtooth microstructure (9), the outer edges of the composite conductive adhesive layer (1), the copper foil layer (3), the composite transition layer (4) and the graphene shielding layer (5) are provided with a sealing edge (6), and the surface of the sealing edge (6) is covered with conductive adhesive (7).

2. The graphene ultrathin copper foil tape with good shielding effectiveness according to claim 1, characterized in that: The micro-nano bump array (8) includes multiple linear arrays of regularly spaced bumps, and the sawtooth microstructure (9) is engaged with the protective layer (2) disposed on the lower surface of the copper foil layer (3).

3. The graphene ultrathin copper foil tape with good shielding effectiveness according to claim 1, characterized in that: The protective layer (2) is a Ni-P amorphous coating, and the surface of the protective layer (2) has a micro-rough structure.

4. The graphene ultrathin copper foil tape with good shielding effectiveness according to claim 1, characterized in that: The composite transition layer (4) is a quantum dot composite layer, and the graphene shielding layer (5) is a multilayer graphene.

5. The graphene ultrathin copper foil tape with good shielding effectiveness according to claim 1, characterized in that: The edge sealing (6) has an arc-shaped edge structure and is arranged axially symmetrically.

6. The graphene ultrathin copper foil tape with good shielding effectiveness according to claim 1, characterized in that: The protective layer (2) is attached to the lower surface of the copper foil layer (3) by chemical plating, and the shape and position of the conductive adhesive (7) are matched with the sealing edge (6).

7. The graphene ultrathin copper foil tape with good shielding effectiveness according to claim 1, characterized in that: The composite transition layer (4) is bonded to the copper foil layer (3) by metallic bonds, and the graphene shielding layer (5) is bonded to the composite transition layer (4) by atomic-level deposition.

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