A material inspection tray for semiconductor chip processing

By introducing cross grooves and limiting placement grooves into the inspection tray for semiconductor chip processing, combined with assembly blocks, assembly sleeves and threaded holes, the problems of chip displacement collision and unstable tray connection are solved, achieving precise positioning and efficient inspection.

CN224936043UActive Publication Date: 2026-11-03NANTONG YINGERJIE SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202522544049.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-01
Publication Date
2026-11-03
Estimated Expiration
2035-12-01

AI Technical Summary

Technical Problem

Existing semiconductor chip processing inspection trays lack reliable limiting structures, which makes chips prone to displacement and collision. Furthermore, the connection between tray stacking and external equipment is unstable, affecting inspection efficiency and safety.

Method used

The design incorporates a cross groove and a limiting placement groove for the main tray component, as well as a combination block, combination sleeve, and combination groove for the outer frame component. This design enables precise chip positioning and stable multi-layer stacking, and allows connection to external devices via threaded holes.

Benefits of technology

It achieves precise chip positioning, avoids displacement and collision, improves inspection accuracy and safety, and enhances inspection efficiency through multi-layer stacking and stable connection.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductor chip processing, and disclose a kind of material inspection supporting plate for semiconductor chip processing, including supporting plate main component and outer frame assembly, supporting plate main component is adapted to be clamped in outer frame assembly, supporting plate main component includes supporting plate plate body, several cross grooves are set up on supporting plate plate body, cross groove four corner positions form a limit placement groove, through groove is set up in the center position of inner bottom wall of cross groove. The utility model can accurately limit semiconductor chip through the cross groove and limit placement groove of supporting plate main component, avoid chip displacement, collision in the process of material inspection, effectively protect chip and improve material inspection accuracy.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip processing technology, specifically a material inspection tray for semiconductor chip processing. Background Technology

[0002] In the semiconductor chip manufacturing process, chip inspection is required, and inspection trays are used to hold the chips to be inspected. Existing inspection trays for semiconductor chip manufacturing have the following problems: First, the chips lack reliable positioning structures on the tray, making them prone to displacement and collisions, leading to chip damage or inspection errors; second, multi-layer stacking of the trays is inconvenient, and the connection stability with external processing equipment is insufficient, affecting the efficiency and safety of the inspection operation. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a material inspection tray for semiconductor chip processing, which is provided with a cross groove and a limiting placement groove in the main body of the tray, as well as a combination block, a combination sleeve and a combination groove in the outer frame assembly, thus solving the problems of easy chip displacement and collision, and inconvenient tray stacking and installation mentioned in the background technology.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a material inspection tray for semiconductor chip processing, comprising a tray body assembly and an outer frame assembly, wherein the tray body assembly is adapted and fitted into the outer frame assembly.

[0005] The main component of the tray includes a tray body, on which several cross grooves are formed. The four corners of the cross grooves form a positioning groove for precise positioning of the semiconductor chip and to prevent the chip from shifting during the inspection process. A through groove is formed at the center of the bottom wall of the cross groove, which can reduce the weight of the tray and facilitate the inspection and observation of the chip.

[0006] The outer frame assembly includes an outer frame with a through slot in the middle for securing the pallet body, ensuring stable installation of the pallet body assembly. Grooves are located at the middle of both ends of the outer frame, with gripping grooves at both the top and bottom of each groove for easy handling by operators. First and second threaded holes are also located at the corners of the outer frame for connection to external equipment or fasteners. A combination block and a combination sleeve are fixedly connected to the top and bottom of the outer frame, respectively. A matching groove for the combination block is located at the center of the combination sleeve, enabling the stacking of multiple pallets.

[0007] As a further improvement of this utility model: the number of limiting placement slots is adapted to the number of semiconductor chips to be inspected, and the shape of the limiting placement slots is adapted to and fits the shape of the semiconductor chips, ensuring that chips of different specifications can be placed stably.

[0008] As a further improvement of this utility model, the through groove is located at the center below the limiting placement groove, which ensures the support of the chip while providing space for the testing operation and improving the convenience of material inspection.

[0009] As a further improvement of this utility model: the outer frame is made of aluminum alloy, and the surface of the outer frame is anodized, which has good rust prevention and wear resistance, and extends the service life of the pallet.

[0010] As a further improvement of this utility model: the inner wall of the grip groove is provided with anti-slip texture, which is a wave-shaped structure or a sawtooth structure, to increase grip friction and prevent the tray from slipping.

[0011] As a further embodiment of this utility model: the combination block is fixedly connected to the four corners of the top of the outer frame, and the combination sleeve is fixedly connected to the four corners of the bottom of the outer frame. The combination slots of the combination block and the combination sleeve are matched by snap-fit ​​to realize the stacking combination of multiple inspection trays, which facilitates the space utilization of batch chip inspection.

[0012] As a further improvement of this utility model: the first threaded hole is opened on the front and rear sides of both ends of the outer frame, and the second threaded hole is opened on both sides of the front and rear ends of the outer frame, providing installation points for multi-directional connection between the tray and external equipment, and improving connection stability.

[0013] Compared with the prior art, the beneficial effects of this utility model are: In this invention, the cross groove and limiting placement groove of the tray main component can accurately limit the semiconductor chip, avoid chip displacement and collision during the inspection process, effectively protect the chip and improve the inspection accuracy.

[0014] In this invention, multiple inspection trays can be stably stacked and combined through the combination blocks, combination sleeves and combination grooves of the outer frame components. At the same time, the connection stability between the trays and external equipment is improved by cooperating with the first threaded hole and the second threaded hole, which facilitates batch chip inspection operations and improves inspection efficiency and safety. Attached Figure Description

[0015] Figure 1 The overall three-dimensional structure of this utility model Figure 1 ; Figure 2 The overall three-dimensional structure of this utility model Figure 2 ; Figure 3 This is a perspective view of the main component of the pallet of this utility model; Figure 4 This is a perspective view of the outer frame component of this utility model.

[0016] In the diagram: 1. Pallet main body assembly; 2. Outer frame assembly; 11. Pallet body; 12. Cross groove; 13. Limiting placement groove; 14. Through groove; 21. Outer frame; 22. Through groove; 23. Groove; 24. Grip groove; 25. First threaded hole; 26. Second threaded hole; 27. Combination block; 28. Combination sleeve; 29. ​​Combination groove. Detailed Implementation

[0017] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0018] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0019] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] Please see Figures 1-4 In this embodiment of the present invention, a material inspection tray for semiconductor chip processing includes a tray body assembly 1 and an outer frame assembly 2, wherein the tray body assembly 1 is adapted to be installed in the outer frame assembly 2.

[0021] The tray main body assembly 1 includes a tray body 11, on which a plurality of cross grooves 12 are formed. The four corners of the cross grooves 12 form a limiting placement groove 13, which is used to precisely limit the semiconductor chip and prevent the chip from shifting during the inspection process. A through groove 14 is formed at the center of the bottom wall of the cross groove 12, which can reduce the weight of the tray and facilitate the inspection and observation of the chip.

[0022] The outer frame assembly 2 includes an outer frame 21. The outer frame 21 has a through groove 22 in the middle for fixing the pallet body 11, thus achieving a stable installation of the pallet body assembly 1. The outer frame 21 has grooves 23 in the middle of both ends. The upper and lower ends of the grooves 23 have grip grooves 24, which facilitate the operator to grip the pallet for handling. The outer frame 21 also has a first threaded hole 25 and a second threaded hole 26 at the corners for connecting with external equipment or fasteners. The upper and lower ends of the outer frame 21 are respectively fixedly connected to a combination block 27 and a combination sleeve 28. The combination sleeve 28 has a combination groove 29 at the center to match the combination block 27, so as to realize the stacking combination of multiple pallets.

[0023] The number of limiting placement slots 13 is adapted to the number of semiconductor chips to be inspected, and the shape of the limiting placement slots 13 is adapted to the shape of the semiconductor chips to ensure that chips of different specifications can be placed stably.

[0024] The through slot 14 is located at the center below the limiting placement slot 13. While ensuring the support of the chip, it provides space for the testing operation and improves the convenience of material inspection.

[0025] The outer frame 21 is made of aluminum alloy and its surface is anodized, which has good rust prevention and wear resistance, and extends the service life of the pallet.

[0026] The inner wall of the grip groove 24 is provided with anti-slip texture, which is a wave-shaped or sawtooth structure to increase grip friction and prevent the tray from slipping.

[0027] The combination block 27 is fixedly connected to the four corners of the top of the outer frame 21, and the combination sleeve 28 is fixedly connected to the four corners of the bottom of the outer frame 21. The combination slots 29 of the combination block 27 and the combination sleeve 28 are matched by snap-fit ​​to realize the stacking combination of multiple inspection trays, which facilitates the space utilization of batch chip inspection.

[0028] The first threaded hole 25 is opened on the front and rear sides of both ends of the outer frame 21, and the second threaded hole 26 is opened on both sides of the front and rear ends of the outer frame 21, providing installation points for multi-directional connection between the tray and external equipment, and improving connection stability.

[0029] The working principle of this utility model is as follows: In use, the semiconductor chip is placed in the limiting placement groove 13 of the tray main body assembly 1, the cross groove 12 provides auxiliary limiting for the chip, and the through groove 14 facilitates the detection operation; the tray main body assembly 1 is snapped into the through groove 22 of the outer frame assembly 2, and the tray can be easily moved through the grip groove 24; when multiple layers need to be stacked, the combination block 27 of one tray is snapped into the combination groove 29 of another tray to achieve stacking; the tray can be connected and fixed to the external inspection equipment through the first threaded hole 25 and the second threaded hole 26, thereby performing a stable chip inspection operation.

[0030] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. A material inspection tray for semiconductor chip processing, comprising a tray body assembly (1) and an outer frame assembly (2), wherein the tray body assembly (1) is adapted to be fitted into the outer frame assembly (2), characterized in that: The pallet main body assembly (1) includes a pallet body (11), and a plurality of cross grooves (12) are provided on the pallet body (11). Limiting placement grooves (13) are formed at the four corners of the cross grooves (12), and a through groove (14) is provided at the center of the bottom wall of the cross grooves (12). The outer frame assembly (2) includes an outer frame (21). The outer frame (21) has a through groove (22) in the middle for fixing the tray body (11). The outer frame (21) has grooves (23) in the middle of both ends. The grooves (23) have gripping grooves (24) at both the upper and lower ends. The outer frame (21) also has a first threaded hole (25) and a second threaded hole (26) at the corners. The upper and lower ends of the outer frame (21) are respectively fixedly connected to a combination block (27) and a combination sleeve (28). The combination sleeve (28) has a combination groove (29) for matching the combination block (27) at its center.

2. The semiconductor chip processing inspection tray according to claim 1, characterized in that: The number of the limiting placement slots (13) is adapted to the number of semiconductor chips to be inspected, and the shape of the limiting placement slots (13) is adapted to fit the shape of the semiconductor chips.

3. The semiconductor chip processing inspection tray according to claim 1, characterized in that: The through groove (14) is located at the center below the limiting placement groove (13).

4. The semiconductor chip processing inspection tray according to claim 1, characterized in that: The outer frame (21) is made of aluminum alloy, and the surface of the outer frame (21) is anodized.

5. A material inspection tray for semiconductor chip processing according to claim 1, characterized in that: The inner wall of the grip groove (24) is provided with anti-slip texture, which is a wave-shaped structure or a sawtooth structure.

6. The inspection tray for semiconductor chip processing according to claim 1, characterized in that: The combination block (27) is fixedly connected to the four corners at the top of the outer frame (21), and the combination sleeve (28) is fixedly connected to the four corners at the bottom of the outer frame (21).

7. A material inspection tray for semiconductor chip processing according to claim 1, characterized in that: The first threaded hole (25) is opened on the front and rear sides of both ends of the outer frame (21), and the second threaded hole (26) is opened on both sides of the front and rear ends of the outer frame (21).