Thermal conductor for antenna (solder-free and splicable)
CN309462541SActive Publication Date: 2025-08-26THE 54TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
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Patent Information
- Application Number
- CN202430793195.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2039-12-13
Smart Images
Figure 000007_ABST
Abstract
1. Name of this design product: Thermal conduction device for antenna (solder-free and splicable). 2. Purpose of this design product: Used for communication payloads, to achieve multi-sided antenna installation and fixation, and to achieve efficient heat conduction between RF components and channel circuits. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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