Reflow soldering apparatus
CN309632465SActive Publication Date: 2025-11-25HUAWEI THERMAL TECHNOLOGY (SHENZHEN) CO LTD
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Patent Information
- Application Number
- CN202530190201.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-10
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2040-04-10
Smart Images
Figure 000006_ABST
Abstract
1. The name of the design product: reflow soldering equipment. 2. The use of the design product: the design product is used for soldering electronic components on a circuit board, and is a large-scale soldering automation equipment. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1. 5. The bottom surface of the design product is the part that is not easy to see or cannot be seen during use, and the top view is omitted.
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