Electrical component

Abstract

Electrical component, with a housing part (100) made of a first plastic compound, in which the housing part (100) has a first trench-shaped form (110), in which a first semiconductor body (200) with an integrated circuit is arranged in the first trench-shaped form (110), in which at least two conducting channels (310, 320, 330) are arranged on a surface (120) of the first trench-shaped formation (110) and are led to an outer surface (130) of the housing part (100), including at least two conductive paths (310, 320, 330), and the conducting pathways (310, 320, 330) are routed from the first trench-shaped protrusion (110) of the casing part (100) to the outside (130) of the casing part (100), and where at least two conductor tracks (310, 320, 330) are connected to the integrated circuit, in which the first trench-shaped formation (110) is at least partially filled with a filling mass (400) of a second plastic compound to cover the first semiconductor body (200), and the housing part (100) is formed in one piece and the first trench-shaped form (110) is trough-shaped with a circumferential rim (105), and the edge (105) of the trench is higher than the thickness of a component lying in the trench, wherein notches (140, 150) are arranged on a bottom side and the notches (140, 150) do not extend to an outer edge on the bottom side, and A mechanical decoupling of the conductor tracks (310, 320, 330) on the outside (130) facing the circuit carrier is achieved by straight or u-shaped notches (140, 150) around the conductor tracks (310, 320, 330).

Description

[0001] The present invention relates to an electrical component.

[0002] Quad Flat No Leads Package (QFN), also known as Micro Lead Frame (MLF), is a common chip package design for integrated circuits (ICs) in electronics. The term encompasses various sizes of IC packages, all of which are surface-mounted components soldered onto printed circuit boards. Different arrangements of ICs in various package types are known from US 2009 / 0014822A1, JP 2006-294983A, DE 19626082A1, EP 2688094A1, DE 102008007682B4, US 2005 / 0001230A1, and US 2004 / 0016873A1.

[0003] From US patent 2009 / 0 014 822 A1, a chip encased in a potting compound and arranged in a recess of a housing unit is known. Also known from JP 2006-294 983 A is a housing with a trough-shaped recess, wherein a chip with electrical connections is arranged in the recess and encased in potting compound. From DE 196 26 082 A1, another component housing with a trough-shaped recess for receiving a chip is known. Several contacts for electrical connection to a chip are arranged on the bottom of the plastic housing. From DE 10 2008 007 682 B4, a generic housing for receiving a micromechanical component with contacts is known. Furthermore, from US patent 2005 / 0 001 230 A1, a housing with a trough-shaped recess for receiving an LED with a lens is known.A housing for holding an LED is also known from US 2004 / 0 016 873 A1, in which conductor tracks lead from the inside of the recess of the housing to the outside of the housing.

[0004] Another generic package containing a chip is also known from EP 2 688 094 A1. In this package, several electrical contacts for electrical connection of the semiconductor component arranged in the package are formed in the surrounding side wall. Several trench-shaped recesses for stress reduction are arranged on the underside of the package.

[0005] These enclosures are sold under various, mostly manufacturer-specific names. Typical names include DFN (Dual Flat No-lead Package) or QFN (Quad Flat No-lead Package).

[0006] Molded Interconnect Devices (MIDs) are injection-molded plastic components with metallic conductive traces applied using specialized processes. They serve as circuit carriers for electronic and mechatronic assemblies. Key application areas for MID technology include automotive engineering, industrial automation, medical technology, the household appliance industry, telecommunications, measurement and analysis technology, and aerospace. MIDs can be manufactured using a variety of methods. The most important processes for applying the conductive traces and transmitting or shielding surfaces are two-component injection molding, hot stamping, mask exposure, laser structuring, and film injection molding. A fundamental distinction is made between subtractive structuring and additive metallization processes.

[0007] The invention is based on the objective of improving an electrical component as much as possible.

[0008] This problem is solved by an electrical component having the features of independent claim 1. Advantageous further developments are the subject of dependent claims and are included in the description.

[0009] Therefore, an electrical component is provided.

[0010] The electrical component comprises a first housing part made of a first plastic compound. The plastic compound includes thermoplastic or thermosetting compounds and, in particular, silicones and resins.

[0011] The first part of the casing has an initial trench-like shape.

[0012] The first trench-shaped section contains a first semiconductor body with an integrated circuit.

[0013] At least two conduction pathways are provided on one surface of the first trench-shaped feature. These at least two conduction pathways are routed to an outer surface of the first housing section.

[0014] At least two conductive traces are connected to the integrated circuit.

[0015] The first trench-shaped depression is at least partially filled with a filler material made of a second plastic compound to cover the first semiconductor body.

[0016] Investigations by the applicant have shown that the features described above enable the creation of a universal, flexibly applicable, leadframe-free package with a standardized footprint. The footprint is preferably standardized according to the JEDEC Solid State Technology Association. Eliminating the leadframe allows for more cost-effective manufacturing of the package. Delamination of the semiconductor substrate is significantly reduced or can be completely prevented. Through a concrete implementation, as illustrated in the figures, previously conflicting requirements are simultaneously optimized. Good mechanical rigidity of the package is achieved. The conductive traces are securely anchored in the package. The encapsulation of the semiconductor body and, if applicable, other components such as passive elements, is optimized.

[0017] According to an advantageous further development, a fixing layer made of a third plastic compound is introduced between the first semiconductor body and the first housing part to create a material-bonded connection with the first semiconductor body and with the first housing part.

[0018] According to an advantageous embodiment, the first housing part is manufactured as an injection-molded part. The at least two conductive tracks are incorporated into the injection-molded part. Advantageously, the at least two conductive tracks are introduced using subtractive structuring MID processes and / or additive metallizing MID processes. For example, the conductive tracks are introduced as metallic inserts.

[0019] According to an advantageous embodiment, a second semiconductor body with a further integrated circuit and / or a passive element is arranged in the first trench-shaped configuration. It is understood that the passive element is preferably a capacitor and / or resistor. Advantageously, the further integrated circuit and / or the passive element is electrically connected to the integrated circuit. The passive element is, for example, a capacitor, an inductor, or a resistor.

[0020] According to an advantageous embodiment, the first housing part has a second trench-shaped recess. Advantageously, a permanent magnet and / or magnetically conductive material is arranged in the second trench-shaped recess.

[0021] According to an advantageous further development, the first trench-shaped formation is formed on the outside of the first housing part with at least two conducting channels.

[0022] According to an advantageous further development, the outside of the first housing part with the at least two conducting channels on one side of the first housing part is opposite the first trench-shaped formation.

[0023] According to an advantageous further development, the at least two conductive traces on the outside of the first housing part are arranged according to a standardized connection diagram (JEDEC).

[0024] In the claimed embodiment, straight or U-shaped indentations are formed to mechanically decouple the conductor tracks from the conductor tracks on the outside, which are facing the circuit carrier.

[0025] In a preferred further development, at least two conduction pathways are present on the outside of the casing, laterally to the trench-shaped form.

[0026] It should be noted that the first housing part is formed in one piece and the first trench-shaped recess is trough-shaped with a circumferential rim. Preferably, the circumferential rim has a thickness in the range of 0.1 mm to 1.0 mm, preferably 0.5 mm, wherein the first housing part has a height of at least 0.8 mm. It is understood that the rim of the trench is preferably higher than the thickness of the component lying in the trench in order to completely encase the component and thus protect it from environmental influences.

[0027] In a further development, exactly two parallel indentations are provided, each indentation being located a distance of the thickness of the circumferential edge, preferably 0.5 mm, from the respective outer edge running parallel to the indentations on the underside. Preferably, the indentations do not extend to the outer edge on the underside, in which case the outer edge runs perpendicular to the longitudinal direction of the indentations.

[0028] The previously described advanced training variants are particularly advantageous both individually and in combination. All advanced training variants can be combined with one another. Some possible combinations are explained in the description of the exemplary embodiments shown in the figures. However, the combinations of advanced training variants presented there are not exhaustive.

[0029] The invention will now be explained in more detail by means of exemplary embodiments based on graphic representations.

[0030] This shows Fig. 1a to 1d Views of an electrical component of a first embodiment, Fig. 2a to 2d Views of an electrical component of a second embodiment, Fig. 3a to 3e Views of an electrical component of a third embodiment, and Fig. 4a to 4e Views of an electrical component of a fourth embodiment.

[0031] In Fig. 1a is a schematic representation of an electrical component in a three-dimensional view. Fig. Figure 1b shows a schematic view of the top side of the electrical component, whereas Figure 2 shows Fig. 1d a schematic view of an outer surface 130, which forms the underside. Fig. Figure 1c shows a schematic sectional view along line AA.

[0032] Three conductive traces 310, 320, 330 are routed along the outer surface 130 of a first housing part 100. These conductive traces are arranged on the outer surface 130 for electrical connection to conductive traces of a circuit carrier, e.g., a circuit board. By routing the conductive traces around the sides of the housing part 100, the proper wetting of the solder joint between the component and the circuit board can also be inspected after the soldering process. In the design of the Fig. In section 1d, the conductors 310, 320, and 330 are arranged according to the standardized SOT23 connection pattern. Depending on the number of conductors, other standardized connection patterns – e.g., SOT323, QFN, etc. – may be used.

[0033] The first housing part 100 in the Fig. Components 1a to 1d are preferably formed from a thermoplastic or thermosetting first polymer compound. The first polymer compound is, for example, acrylonitrile butadiene styrene (ABS), polyamides (PA), polylactate (PLA), polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), polystyrene (PS), polyetheretherketone (PEEK), polyvinyl chloride (PVC), celluloid, or polyolefins such as polyethylene or polypropylene, or epoxy resin-based. The use of the thermoplastic polymer compound can reduce material costs, shorten processing times, and minimize injection losses (hot runner injection molding).

[0034] According to the Fig. In figures 1a to 1c, the first housing part 100 has a first trench-shaped recess 110. The trench shape is preferably rectangular with sloping trench walls. Alternatively, other trench shapes, such as oval or round trench shapes, may be provided. It is understood that the first housing part 100 is formed in one piece and that the first trench-shaped recess 110 is trough-shaped with a circumferential rim 105. The circumferential rim 105 has a thickness of preferably 0.5 mm. The first housing part 100 has a height of at least 0.8 mm.

[0035] In the first trench-shaped form 110 of the execution of the Fig. 1a, Fig. 1b, Fig. 1c is a first semiconductor body 200 with an integrated circuit arranged. The integrated circuit comprises, for example, a number of transistors and / or diodes and / or other elements, such as sensor elements, which are interconnected in the integrated circuit. Preferably, the semiconductor body 200 is arranged on the base of the first trench-shaped formation 110.

[0036] Three conductive traces 310, 320, and 330 are provided on a surface 120 of the trench-shaped recess 110. These traces are connected to the integrated circuit. The connection is made, for example, via bond wires or solder balls. The conductive traces 310, 320, and 330 establish the connection from the integrated circuit to the outer surface 130 of the housing. This connection is achieved, in particular, through a bonding process and / or a "flipping" process. For this purpose, the conductive traces 310, 320, and 330 are routed to the outer surface 130 of the first housing part 100. The conductive traces 310, 320, and 330 are formed by an electrically conductive material. An electrically conductive material is, for example, a metal such as copper, aluminum, nickel, or gold. The conductive tracks 310, 320, 330 can, for example, be completely guided over surfaces 120, 130 of the first housing part 100. The conductive tracks 310, 320, 330 are manufactured, for example, using MID technology.The conductor tracks 310, 320, 330 are advantageously produced by means of a subtractive structuring process and / or an additive metallizing process.

[0037] In the execution of the Fig. In 1c, the first trench-shaped recess 110 is at least partially filled with a filler 400 to cover the first semiconductor body 200. The filler 400 comprises a second polymer compound. Preferably, the second polymer compound also includes silicones and / or resins. The first polymer compound and the second polymer compound can be of the same or different materials. By separating the first housing part 100 and the filler 400, the properties for covering the semiconductor body 200 can be optimized independently of the first housing part 100. For example, the filler 400 can be optimized with regard to reducing delamination. The mechanical stress acting on the semiconductor body 200 is reduced by an optimized filler 400. At the same time, the first housing part 100 can be optimized with regard to the required stiffness.

[0038] As in Fig. As shown in Figure 1c, a fixing layer 500 made of a third plastic compound is introduced between the semiconductor body 200 and the first housing part 100 to provide a metallurgical bond between the semiconductor body 200 and the first housing part 100. Preferably, the third plastic compound also comprises silicones and / or resins. The conductive tracks 310, 320, 330 are mechanically movable and mechanically decoupled from the rest of the housing. Mechanical decoupling of the conductive tracks 310, 320, 330 on the outer side 130 facing the circuit carrier is provided in the embodiment shown. Fig. 1c and Fig. 1d is achieved by, in particular, straight or U-shaped indentations 140, 150 on this outer surface 130. The two indentations 140, 150 run parallel to each other and are each preferably 0.5 mm from the outer edge on the underside 130. Furthermore, the two indentations 140, 150 do not extend to the outer edge on the underside.

[0039] In the Fig. Figures 2a to 2d show schematic views of an electrical component of a different design. The electrical component comprises a first housing part 101 with a first trench-shaped recess 111, a semiconductor body 201, and conductive traces 311, 321, 331, wherein the conductive traces 311, 321, 331 are electrically connected to an integrated circuit of the semiconductor body 201. The semiconductor body 201 is fixed to the first housing part 101 by means of a fixative layer 501 on a surface 121 in the trench-shaped recess 111. The trench-shaped recess 111 is filled with a filler material 401.

[0040] In contrast to the execution of the Fig. 1a to 1d is in the execution of the Fig. 2a to 2d in the first housing part 100, a second trench-shaped recess is provided. In the second trench-shaped recess, the design of Fig. 2c and Fig. 2d a permanent magnet 601 is provided. Alternatively or in combination, a magnetically conductive material is arranged in the second trench-shaped recess. The design of the Fig. 2d has two notches 141, 151 on an outer surface 131 of the first housing part 101 for the mechanical decoupling of the conductor tracks 311, 321, 331 from the permanent magnet 601. Alternatively, instead of the permanent magnet 601, a passive element (not shown), such as a capacitor or a resistor, can be arranged in the second trench-shaped recess, which is electrically connected to the conductor tracks 311, 321, 331.

[0041] In the execution of the Fig. 1a to 1d, the outer surface 130 of the first housing part 100 with the three conductive tracks 310, 320, 330, which form the SOT23 connection pattern, is opposite a side of the first housing part 100 with the first trench-shaped projection 110. In contrast, in the design of the Fig. 3a to 3e, the trench-shaped projection 110 on the outer surface 130 of the first housing part 100 is formed with at least two conductive tracks 310, 320, 330. For contact on a circuit carrier, the electrical component is designed according to Fig. 3a therefore to turn around (face down).

[0042] In Fig. Figure 3a shows a schematic representation of the electrical component in a three-dimensional view. Fig. Figure 3b shows a schematic view of the top side of the electrical component, whereas Figure 3b shows Fig. 3D schematic side view. Fig. Figure 3c shows a schematic sectional view along line BB. Fig. Figure 3e shows a schematic sectional view along line AA.

[0043] The electrical component comprises a first housing part 102 with a trench-shaped recess 112, a semiconductor body 202, and conductive tracks 312, 322, 332, wherein the conductive tracks 312, 322, 332 are electrically connected to an integrated circuit of the semiconductor body 202. The semiconductor body 202 is fixed to the first housing part 102 by means of a fixative layer 502 on a surface 122 in a first trench-shaped recess 112. The trench-shaped recess 112 is filled with a filler material 402. The conductive tracks 312, 322, 332 extend to the outer surface 132. The design of the Fig. 3a to 3e enables mechanical decoupling for mechanical stress reduction across the wall thickness of the first housing part 102 in the area of ​​the first trench-shaped formation 112.

[0044] In the Fig. Figures 4a to 4e schematically depict another embodiment of an electrical component. In this embodiment, the semiconductor body 203 and at least one further element 703 are arranged in a first trench-shaped recess. The electrical component comprises a first housing part 103 with a first trench-shaped recess 113, the semiconductor body 203, and conductive traces 313, 323, 333, wherein the conductive traces 313, 323, 333 are electrically connected to an integrated circuit of the semiconductor body 203. The further element 703 is electrically connected to the integrated circuit of the semiconductor body 203 and / or to the conductive traces 313, 323, 333. The semiconductor body 203 is fixed to the first housing part 103 by means of a fixative layer 503 on a surface 123 in the first trench-shaped recess 113. The further element 703 can also be fixed to the surface 123 in the first trench-shaped formation 113 by means of a fixing layer.The first trench-shaped depression 113 is filled with a filling material 403. The conductors 313, 323, 333 are routed to the outer surface 133.

[0045] The additional element 703 is, for example, another semiconductor body with another integrated circuit. Both semiconductor bodies can be wired two-dimensionally for contact. The arrangement of the additional element 703 enables the integration of several identical (intelligent) semiconductor sensors with overlapping axes of action. Preferably, the additional element 703 is a passive element, such as a capacitor, an inductor, or a resistor.

[0046] The invention is not limited to the illustrated embodiments of the Fig. 1a to 4e limited. In the figures, the filling material 400, 401, 402, 403 is shown as transparent. Preferably, the filling material 400, 401, 402, 403 is opaque. It is also possible to design the shape of the first trench-shaped recess differently. It is also possible for several trench-shaped recesses to be provided on the same side of the first housing part. The functionality of the electrical component according to Fig. 1a can be used particularly advantageously for a magnetic field sensor. Reference symbol list 100, 101, 102, 103 Housing part 110, 111, 112, 113 Trench-shaped design 120, 121, 122, 123 Surface 130, 131, 132, 133 Outdoor area 140, 150 Trench-shaped design 200, 201, 202, 203 Semiconductor bodies 310, 320, 330, 311, guideway 321, 331, 312, 322, 332, 313, 323, 333, 400, 401, 402, 403 Filling mass 500, 501, 502, 503 Fixing layer 601 Permanent magnet 703 Passive Element

Claims

[1] Electrical component, with a housing part (100) made of a first plastic compound, in which the housing part (100) has a first trench-shaped formation (110), in which a first semiconductor body (200) with an integrated circuit is arranged in the first trench-shaped formation (110), in which at least two conductive paths (310, 320, 330) are arranged on a surface (120) of the first trench-shaped formation (110), which are guided to an outer side (130) of the housing part (100), wherein the at least two conductive paths (310, 320, 330) are incorporated, and the conductor tracks (310, 320, 330) are guided from the first trench-shaped formation (110) of the housing part (100) to the outer side (130) of the housing part (100), and in which the at least two interconnects (310, 320, 330) are connected to the integrated circuit, in which the first trench-shaped formation (110) is at least partially filled with a filling compound (400) made of a second plastic compound for covering the first semiconductor body (200), and the housing part (100) is formed in one piece and the first trench-shaped formation (110) is trough-shaped with a peripheral edge (105), and the edge (105) of the trench is higher than the thickness of a component lying in the trench, wherein Notches (140, 150) are arranged on a bottom side and the notches (140, 150) are not formed up to an outer edge on the bottom side, and a mechanical decoupling of the conductor tracks (310, 320, 330) on the outer side (130) facing the circuit carrier is achieved by straight or U-shaped notches (140, 150) around the conductor tracks (310, 320, 330). [2] Electrical component according to claim 1, wherein a fixing layer (500) made of a third plastic compound is introduced between the first semiconductor body (200) and the housing part (100) for the material connection to the first semiconductor body (200) and to the housing part (100). [3] Electrical component according to one of the preceding claims, in which the housing part (100) is produced as an injection-molded part. [4] Electrical component according to one of the preceding claims, in which a second semiconductor body with a further integrated circuit and / or a passive element (703) is arranged in the first trench-shaped formation (110). [5] Electrical component according to one of the preceding claims, in which the housing part (100) has a second trench-shaped formation, and in which a permanent magnet (601) and / or magnetically conductive material is arranged in the second trench-shaped formation. [6] Electrical component according to one of the preceding claims, in which the first trench-shaped formation (110) is formed on the outer side (130) of the housing part (100) with the at least two conductive tracks (310, 320, 330). [7] Electrical component according to one of the preceding claims, in which the outer side (130) of the housing part (100) with the at least two conductive tracks (310, 320, 330) is opposite a side of the housing part (100) with the first trench-shaped formation (110). [8] Electrical component according to one of the preceding claims, in which the at least two conductive paths (310, 320, 330) are arranged on the outer side (130) of the housing part (100) according to a standardized connection pattern. [9] Electrical component according to claim 1, wherein the peripheral edge (105) has a thickness in a range of 0.1 mm to 1.0 mm and the housing part (100) has a height of at least 0.8 mm. [10] Electrical component according to claim 8, wherein two mutually parallel notches (140, 150) are provided and the notches (140, 150) are each in a range of 0.1 mm to 1.0 mm away from the outer edge on the underside. [11] Electrical component according to one of claims 5 to 8, wherein the second trench-shaped formation is trough-shaped with a circumferential edge and the permanent magnet (601) and / or the magnetically conductive material fills the second trench-shaped formation.

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