Machining device and method for machining flat material

Abstract

Machining device (10) for machining flat material (12) extending along a material plane (11), the machining device (10) comprising: - at least one holding device (200) for holding the flat material (12), - at least one clamping device (400) for fixing the flat material (12) and for clamping the flat material (12) along the material plane (11), - at least one laser device (600) for cutting at least one piece (1) from the flat material (12), wherein the holding device (200) is designed such that after the laser cutting the at least one cut piece (1) is held by the holding device (200), characterized in that the holding device (200) is designed as a vacuum holding device (200) for suctioning the flat material (12).

Description

[0001] The invention relates to a processing device and a method for processing flat material.

[0002] In the electronics industry, and especially in the production of batteries for e-mobility, flat materials, especially anode and cathode foils, are required.

[0003] AT 518 742 B1 discloses a laser cell for processing sheet-shaped workpieces with a gripping chain comprising gripping elements. US 11,273,524 B2 discloses a device for cutting pieces of laminar material wound in rolls.

[0004] For the purposes of this application, flat materials are understood to mean single- or multi-layered sheets or films, where the layers or films have a significantly greater longitudinal and transverse extent than their thickness. Furthermore, the flat material is designed to be pliable, so that without support, the flat material deviates significantly from a flat shape across its longitudinal and transverse extent. Furthermore, the flat material is at least substantially impermeable to gases, so that it can be sucked in.

[0005] Furthermore, the flat material or its layers are monolithic. The flat materials can, in particular, comprise plastic or metal, although metal-coated plastics or plastic-coated metals are also conceivable. The flat material can be formed as a flat material strip section. The flat material can, for example, be a current-collecting foil measuring 200 mm x 280 mm, wherein the foil comprises graphite and is coated with aluminum or copper.

[0006] The handling, fixing and processing of such flat materials, in particular the production of cut pieces from the flat material, are complex due to the thin and flexible nature of the flat material.

[0007] The flat material represents a semi-finished product from which at least one cut piece is manufactured. The cut pieces have the outer contour required for the application and are smaller than the flat material in terms of their longitudinal and transverse dimensions. The remaining portion of the flat material not allocated to the cut pieces is referred to as offcuts.

[0008] Accordingly, the object of the present invention is to produce a cut piece from a flat material safely, reliably and reproducibly.

[0009] The object underlying the invention is achieved by a processing device for processing flat material extending along a material plane, having the features of claim 1. The processing device has at least one holding device for holding the flat material, and at least one clamping device, in particular designed separately from the holding device, for securing the flat material and for clamping the flat material along the material plane. During clamping, an internal tension is to be built up within the flat material, which extends in the material plane, wherein the clamping is intended to counteract the flexurally flexible formation of the flat material. In this way, the flat material should be able to be processed reliably, and in particular, unwanted distortions or overlaps in the flat material are to be prevented.

[0010] In addition, at least one laser device is provided for cutting at least one cut piece from the flat material. In the processing state, the material plane of the flat material extends along an x-axis (longitudinal extent) and along a y-axis (transverse extent), with the thickness of the flat material running along a z-axis perpendicular to the material plane. The laser device is configured such that a laser beam emitted by the laser device is directed onto the flat material and energy is introduced into the flat material at an impact point, such that the flat material is cut at the impact point. The laser device is configured such that the laser beam can be moved over a working area that extends over a substantial part of the flat material.During cutting, the laser can trace the entire contour of the cut piece or, alternatively, only a significant portion of the contour of the cut piece. The uncut portion must then be separated by some other means to completely separate the cut piece from the waste. Because the flat material is cut, no mechanical stress is placed on the flat material, such as during cutting, sawing, or punching. Thermal stress is negligible. It is conceivable that a laser guard could be provided to protect the surrounding components. This shield surrounds the working area of ​​the laser beam and counteracts any reflection of the laser beam.

[0011] Furthermore, the holding device is designed such that after the laser cut, i.e., after the cut piece and the offcuts or their layers are no longer monolithic, at least the cut piece is held by the holding device. Thus, despite the laser cut, the cut piece remains in a defined position, enabling or facilitating subsequent gripping and removal.

[0012] The holding device is designed as a vacuum holding device for sucking in the flat material. The holding device advantageously has nozzles for creating the vacuum. The nozzles are arranged such that they suck in the flat material, and in particular the cut pieces. The holding device is preferably designed such that the flat material can be placed on the holding device. In this case, the flat material is sucked in from below and thus held in a defined position.

[0013] Furthermore, it is conceivable for the holding and / or clamping device to be accessible from above, so that the flat material can be placed onto the holding device and / or into the clamping device from above. The laser beam direction is directed from the laser device to the holding device. Accordingly, "from above" means coming from the direction of the laser device or directed in the laser beam direction.

[0014] It is advantageous if the clamping device has at least two opposing pairs of clamping jaws for securing and / or clamping one side of the flat material in each case. The clamping device is preferably designed such that a first side of the flat material can be gripped by means of the first pair of clamping jaws and a second side of the flat material can be gripped by means of the second pair of clamping jaws. In the clamped state, the flat material is arranged between the pairs of clamping jaws. The clamping device and / or the clamping jaws are designed such that when the flat material is secured, the flat material is simultaneously clamped and / or that after securing, the clamping jaws are displaced away from the flat material along the x-axis in order to clamp the flat material.The clamping device, in particular the pairs of clamping jaws, are preferably arranged outside the working area of ​​the laser device, so that the laser beam only moves between the clamping devices.

[0015] An advantageous further development of the invention provides that the laser device is displaceable at least along the x-axis and the y-axis. The x-axis and the y-axis run parallel to the material plane when the flat material is secured in the clamping device and / or placed on the holding device. It is also conceivable for the laser device to be displaceable along the z-axis, i.e., perpendicular to the material axis. Accordingly, at least the majority of the flat material can be processed by the laser device.

[0016] Preferably, a transport device is provided for handling the flat material. The transport device is preferably configured to provide the flat material to the holding and / or clamping device. The transport device is further preferably configured to grip or remove the cut piece and / or the offcuts from the holding and / or clamping device. Accordingly, the flat material, the cut piece, and / or the offcuts can be handled safely and repeatably before and after laser cutting.

[0017] It is advantageous if the transport device has a first handling device, in particular in the form of a robot arm, with a first gripping tool. The first gripping tool is preferably designed as a vacuum gripping tool. The first handling device serves to provide a flat material to the holding and / or clamping device by placing the flat material on the holding device and then securing it in place by the clamping device. To handle the flat material, a vacuum can be provided at the first gripping tool, which sucks the flat material onto the first handling device. To release the flat material from the first handling device, in particular when placing it on the holding device, the vacuum can be switched off and, preferably, an overpressure or air blast can additionally be generated.Furthermore, the first handling device serves to remove the at least one cut piece from the holding device.

[0018] It is further advantageous if the transport device has a second handling device, designed separately from the first handling device, in particular in the form of a SCARA robot arm, with a second gripping tool. The second gripping tool is preferably designed as a vacuum gripping tool. The second handling device serves to remove the offcuts from the holding and / clamping device; a vacuum is provided at the second gripping tool, which sucks the offcuts onto the second handling device. To release the offcuts from the second handling device, in particular when placing them on the holding device, the vacuum can be switched off and preferably an overpressure or air blast can also be generated. The second handling device can remove the offcuts after laser cutting, so that the first handling device can pick up the at least one cut piece with the first gripping tool.Accordingly, the first handling device with the first gripping tool can both supply the flat material and remove at least one cut piece. Alternatively, the transport device can have only a single handling device with two different gripping tools, whereby the gripping tools must be changed for removing the offcut and the cut piece. Furthermore, the different gripping tools can also be arranged simultaneously on one handling device.

[0019] An advantageous development provides that the second handling device or the second gripping tool has handling elements, in particular nozzles. The handling elements are arranged such that the handling elements only grip the offcuts. Thus, the at least one cut piece remains on the holding device. It is further advantageous if the handling elements are arranged such that the handling elements grip the offcuts in the region of the pairs of clamping jaws. By gripping the offcuts in the region of the first side and the second side of the flat material, it can be ensured that the at least one cut piece is not displaced. Furthermore, the offcuts can be released from the clamping device and remain securely gripped by the second handling device.

[0020] An advantageous development of the invention provides for a magazine with magazine locations. Each magazine location has a clamping device and, in particular, a holding device. Accordingly, a flat material can be accommodated at each magazine location.

[0021] Preferably, the magazine is rotatably mounted such that the magazine can rotate about a magazine axis. The magazine can be rotated such that at least one magazine location is arranged in at least one processing position and at least one magazine location can be arranged in at least one loading position. When a first magazine location is arranged in the processing position, the holding and / or clamping device is arranged below the laser device. Thus, a flat material held in the first magazine location can be processed by means of the laser device. Furthermore, a flat material in the first magazine location can be processed simultaneously using the laser device, while the offcuts and the cut piece can be removed from a second magazine location in the loading position and then the second magazine location can be loaded with another flat material. Accordingly, setup times can be reduced.

[0022] It is also advantageous if a container for receiving the offcuts from the flat material is provided in the loading position. When the second magazine location is in the loading position, the container is located below the holding device. This allows the offcuts to be removed and stored quickly and easily. If the second magazine location at least partially covers the container in the loading position, the second magazine location can be rotated into an intermediate position to release the container.

[0023] It is further conceivable that at least one sensor device is provided which is designed to detect whether a flat material is provided on the holding and / or clamping device and / or whether the flat material and / or the cut piece and / or the offcut is in a suitable position for processing or gripping.

[0024] The object underlying the invention is further achieved by a method for processing flat material extending along a material plane with the features of claim 11. The method comprises the following steps: First, a flat material is provided by placing the flat material on a holding device. The holding device is activated and secures the flat material. The flat material is then secured and tensioned by means of a tensioning device. This builds up internal tension acting along the material plane, which counteracts distortions or overlaps. Since the flat material is first held and then tensioned, it can be ensured that the flat material is in a defined position during tensioning. Subsequently, at least one cutting piece is cut from the tensioned flat material using a laser beam.This ensures that the cut piece is cut gently and precisely from the flat material. During and after laser cutting, the offcuts are secured and clamped by the clamping device. During and after laser cutting, at least one cut piece is held in place by the holding device using negative pressure. This ensures that the cut piece remains in a defined position even after it has been completely separated from the offcuts.

[0025] It is advantageous if the flat material or the flat material and the cut piece are held by means of negative pressure.

[0026] It is also advantageous if the flat material is lifted from the holding device during clamping. This allows the holding device, in particular the vacuum, to be temporarily deactivated. The holding device can be reactivated shortly before or as soon as at least one cut piece has been completely released from the flat material.

[0027] Preferably, after the cutting piece has been cut from the flat material, the cutting piece is gripped and removed by means of a first handling device.

[0028] Preferably, after the cut piece has been cut from the flat material, the scrap of the flat material is released and gripped and removed by means of a second handling device.

[0029] It is advantageous if, after cutting the cut piece from the flat material, the offcuts are first grasped and removed, followed by the cut piece itself. Thus, the same handling device can be used to remove the cut piece as to prepare the flat material.

[0030] It is further advantageous if the method according to the invention is carried out by means of a processing device according to the invention.

[0031] Further details and advantageous embodiments of the invention can be found in the following description, on the basis of which an embodiment of the invention is further described and explained.

[0032] They show: Fig. 1 a perspective view of a processing device according to the invention; Fig. 2 a perspective detailed view of the processing device according to Fig. 1 with a focus on a magazine; Fig. 3 a perspective view of a magazine according to the invention; Fig. 4 a top view of the magazine according to Fig. 3; Fig. 5 a perspective detailed view of the processing device according to Fig. 1 with focus on a magazine slot in a loading position; Fig. 6 a perspective view of a first holding device according to the invention; Fig. 7a a perspective view of a second holding device according to the invention; Fig. 7b is a schematic plan view of a flat material with the trajectory of the laser beam and the vacuum devices and support modules used; Fig. 8 is a perspective view of a pair of clamping jaws of a clamping device according to the invention; Fig. 9 a side view of the pair of clamping jaws according to Fig. 8; Fig. 10 is a perspective top view of a second handling device according to the invention; Fig. 11 a perspective bottom view of the second handling device according to Fig. 10; and Fig. 12 a schematic representation of the steps of the method according to the invention.

[0033] The Fig. 1, Fig. 2 and Fig. The processing device 10 shown in Figure 5 is used to process flat materials 12 extending along a material plane 11, which are in particular pliable and essentially gas-impermeable. Such flat materials 12 are, for example, paper or foils. The flat materials 12 can be single-layer or multi-layer, wherein the base material and / or the coating material can be made of plastic or metal. In particular, for battery production, foils with a base material based on graphite and with a coating material based on copper or aluminum are to be produced. Due to the small thickness and pliable properties of the flat material 12, special requirements must be placed on the processing device 10.

[0034] The processing device 10 has according to Fig. 1 comprises a device housing 14 and a control cabinet 16. In the device housing 14, the processing device 10 has a processing area 18 and a loading area 20. Furthermore, the processing device 10 has an x-axis X, a y-axis Y running perpendicular to the x-axis X, and a z-axis Z running perpendicular to the x- and y-axes. In the loaded state, the material plane 11 of the flat material 12 runs parallel to the x-axis and the y-axis.

[0035] The processing device 10 has according to the Fig. 1-5, a magazine 22 with a first magazine location 24 and a second magazine location 26. The magazine 22 is rotatable by means of a rotary drive 28 about a magazine axis 30 running parallel to the z-axis, so that one magazine location 24, 26 can be pivoted into a processing position in the processing area 18 and the other magazine location 24, 26 can be pivoted into a loading position in the loading area 20. The processing position and the loading position are arranged opposite one another along the y-axis. Furthermore, the magazine 22 is rotatable such that both the first magazine location 24 and the second magazine location 26 can be pivoted outside the processing area 18 and outside the loading area 20 into an intermediate position.

[0036] Each magazine location 24, 26 has a holding device 200 and a clamping device 400. Accordingly, the holding device 200 and the clamping device 400 are pivoted together with the associated magazine location 24, 26 into the processing position, the loading position, or the intermediate position.

[0037] The respective holding device 200 according to Fig. 6 and Fig. 7 forms a base 32 of the associated magazine location 24, 26. The clamping device 400 is arranged laterally on the magazine location 24, 26 along the x-axis and thus forms a lateral edge region 34 of the associated magazine location 24, 26.

[0038] The holding device 200 has according to Fig. 6 and Fig. 7, a base plate 202 and a work plate 204 arranged in the base plate 202. The work plate 204 comprises a ferromagnetic material, preferably iron. The base plate 202 and / or the work plate 204 preferably have the outer dimensions of the flat material 12 to be processed along the x-axis and the y-axis. A plurality of magnetic vacuum devices 206 are provided on the work plate 204.

[0039] After Fig. 6 and Fig. 7, the vacuum devices 206 are preferably circular-cylindrical, extend along the z-axis, and each have a base base 210 with a base bottom 212 and a base top 214. A magnet receptacle 216 for releasably receiving a permanent magnet 217 is provided on the base bottom 212. The vacuum device 206 can be arranged and fixed anywhere on the worktop 204 using the permanent magnet 217, with the ferromagnetic material in the worktop 204 interacting with the permanent magnet 217. On the base top 214, the base base 210 has an adapter receptacle 218 for releasably receiving an adapter piece 220. The adapter piece 220 has a nozzle interface 224 for connecting a nozzle head 226 on an adapter top 222 opposite the adapter receptacle 218. Depending on the nozzle head 226, a different size of the adapter piece 220 can be selected.The nozzle head 226 has a line outlet 230 on a nozzle top side 228 opposite the adapter piece 220.

[0040] The base base 210, the adapter piece 220, and the nozzle head 226 each have a cavity 232 inside, which forms a line 233. The line 233 fluidically connects a line inlet 234 arranged on the base base 210 with the line outlet 230. The base base 210 has a line recess 238 with a flat recess base 240 in a base surface 236 running parallel to the z-axis. Accordingly, the line inlet 234 is arranged on a flat recess base 240.

[0041] A vacuum supply (not shown) can be connected to the line inlet 234. Cable hoses (not shown) can be used to connect the vacuum supply to the vacuum devices 206, with hose clamps 242 being provided to secure the cable hoses to the base plate 202 and / or the worktop 204. The hose clamps 242 can be screwed into pre-drilled holes on the base plate 202 or, similar to the vacuum device 206, can be arranged and secured anywhere on the worktop 204 using a permanent magnet (not shown). By means of the vacuum supply and the line 233, a vacuum can be created at the line outlet 230, by means of which the flat material 12 placed on the holding device 200 can be sucked in and held.

[0042] To improve the holding capacity of the holding device 200, it is advisable to provide as many vacuum devices 206 as possible so that both the flat material 12 and the cut piece 1 can be held securely. However, this is counteracted by the fact that the flat material 12 is processed using a laser, and the vacuum devices 206 are worn by the laser. For this reason, in addition to the vacuum devices 206, a plurality of magnetic support modules 244 are provided. The support modules 244 serve as wearing parts. The support modules 244 have a module base 246, a module web 250 arranged on the module base 246, and a brush holder 252 arranged on the module web 250. The module base 246 is designed corresponding to the base base 210 and also has a permanent magnet, so that the support modules 244 can be arranged anywhere on the worktop 204.

[0043] The brush holder 252 extends along the x-axis or the y-axis and has a plurality of brush hairs 254, wherein the brush hairs 254 of a support module 244 form a brush 256. The brush 256 also extends along the x-axis or the y-axis, wherein the brush 256 can also hold the flat material 12 or the cut piece 1. The brush 256 comprises a plurality of brush hairs 254, wherein the brush hairs 254 can come into contact with the laser beam. In this case, although a few brush hairs 254 are destroyed, the brush 256 does not lose its holding capacity overall due to the additional brush hairs 254. After several cutting processes, the brush 256 can be replaced easily, inexpensively, and quickly.Accordingly, the vacuum devices 206 can be arranged on the worktop 204 such that they are not in the path of the laser beam, and the support modules 244 can be arranged such that they are in the path of the laser beam. The combination of vacuum devices 206 and support modules 244 thus provides an optimal balance between the holding capacity and durability of the holding device 200.

[0044] The Fig. 6 and Fig. 7 differ in the number and arrangement of the vacuum devices 206, the support modules 244 and the hose clamps 242.

[0045] Furthermore, in Fig. 7a shows a trajectory 280 of a laser beam, which also corresponds to the outer contour of a cut piece 1. Furthermore, vacuum devices 206 and support modules 244 are shown in dashed lines. It can be seen that the trajectory 280 of the laser beam does not cross the vacuum device 206, but can cross the support modules 244. Due to this distribution, it is ensured that the flat material 12 is securely held by the holding device 200 before the cut and that the cut piece 1 and the offcut 2 are securely held after the cut.

[0046] The clamping device 400 comprises according to Fig. 5, Fig. 8 and Fig. 9 two opposing pairs of clamping jaws 402, each pair of clamping jaws 402 having an upper clamping jaw 404 and a lower clamping jaw 406. The upper clamping jaw 404 and the lower clamping jaw 406 are each rotatably displaceable about a common clamping rotation axis 407 by means of a clamping rotation drive 409 between an open position and a closed position. In the open position, a flat material 12 can be inserted into the clamping device 400, and in the closed position, the flat material 12 is fixed and clamped in the clamping device 400. In the Fig. 8 and Fig. 9 shows the opening position (parallel to the z-axis), the closing position (parallel to the x-axis) and an intermediate position (45° to the x-axis) of the clamping jaws 404, 406, wherein the upper clamping jaw 404 pivots upwards into the opening position and the lower clamping jaw 406 pivots downwards into the opening position.

[0047] To realize the tension of the flat material 12, according to Fig. 9, each clamping jaw 404, 406 has a clamping surface 408 with a surface recess 410, and the other clamping jaw 404, 406 has a clamping element 412 protruding from the clamping surface 408. In the closed position, the clamping element 412 is at least partially received by the surface recess 410. Preferably, the surface recess 410 (concave) is complementary to the clamping element 412 (convex). Due to the longer path that the flat material 12 travels when clamped in the clamping device 400, the flat material 12 is simultaneously clamped for processing when clamped.

[0048] In addition, the clamping device 400 can be Fig. 8 can be designed to be displaceable along a clamping linear axis 414 by means of a clamping linear drive 416 between a near position and a far position. In the near position, the pair of clamping jaws 402 are displaced toward the flat material 12 to reduce the tension of the clamped flat material 12. In the far position, the pair of clamping jaws 402 are displaced away from the flat material 12 to increase the tension of the clamped flat material 12.

[0049] In processing area 18, according to Fig. 1 and Fig. 2, the processing device 10 has a laser device 600. The laser device 600 is configured such that a laser beam emitted by the laser device 600 and running substantially parallel to the z-axis is directed at the flat material 12, and at an impact point, energy is introduced into the flat material 12, so that the flat material can be cut into a cut piece 1 and a scrap 2 at the impact point. The cut piece 1 is the product ultimately to be produced. The laser beam can preferably be moved across a working area, wherein the working area substantially corresponds to the longitudinal and transverse extension of the flat material 12. The laser device 600 preferably has an axis system 602 for displacing the laser beam along the x-axis by means of a first linear axis 604 and along the y-axis by means of a second linear axis 606.Furthermore, it is conceivable that the axis system 602 has a third linear axis (not shown) for displacement along the z-axis.

[0050] To improve safety, the holding device 200 can be Fig. 7 may include a protective plate 258. The protective plate 258 serves to protect the holding device 200 from the laser beam. The protective plate 258 can preferably be arranged on the vacuum devices 206 and / or the support modules 244.

[0051] The protective plate 258 preferably has a grid with grid recesses 260, wherein the vacuum devices 206 and / or the support modules 244 can be arranged in the grid recesses 260. The protective plate 258 can be prefabricated, and the vacuum devices 206 and / or the support modules 244 can then be positioned on the worktop 204 at the grid recesses 260. The grid recesses 260 can correspond to the outer contour of the base base 210 and module base 246 or the outer contour of the adapter pieces 220 and module webs 250. The protective plate 258 can preferably be supported on the base base 210 and the module base 246 and is thus arranged at a distance from the worktop 204.

[0052] For providing the flat material 12 and for removing the cut piece 1 in the loading area 20 as well as for removing the offcut 2 in the loading area 20, the processing device 10 has a transport device 800. The processing device 800 has according to Fig. 1, a first handling device 802 with a first vacuum gripping tool 804. The flat material 12 is sucked onto the first handling device 802 by means of vacuum and placed on the holding device 200.

[0053] After the laser cutting of the flat material 12 in the processing area 18, the magazine 22 is rotated so that the processed flat material 12, in particular the separated cut piece 1 and the remaining offcut 2, is moved into the loading area 20. To remove the offcut from the loading area 20, the transport device 800 has a second handling device 806 with a second vacuum gripping tool 808 according to Fig. 10 and Fig. 11. By means of negative pressure, the flat material 12 is sucked onto the second handling device 806 and thus removed from the holding device 200 in the loading area 20. For this purpose, the second negative pressure gripping tool 808 has a pressure distribution plate 810 and handling elements 812, in particular in the form of nozzles, arranged on the pressure distribution plate 801. The handling elements 812 are arranged such that the handling elements 812 only grip the offcuts. For this purpose, the handling elements 812 are arranged along the outer contour of the pressure distribution plate 810. Thus, the at least one cut piece 1 remains on the holding device 200. As soon as the offcuts have been gripped by the second handling device 806, the clamping device 400 can be moved into the release position. A container 262 for receiving the offcuts 2 is also arranged below the loading area 20.

[0054] Only the cut piece 1 remains on the holding device 200, so that the cut piece 1 can be removed by means of the first handling device 802.

[0055] Furthermore, the method for operating the processing device 10 is described below with reference to Fig. 12 described.

[0056] Information about the properties of the flat material 12 and the outer contour of the cut pieces 1 is provided to the processing device 10 (S10). Furthermore, a protective plate 258 without grid recesses 260 is preferably provided in the processing area 18 (S12). The processing device 10 preferably has a controller 13 and a memory 15 to determine and store, among other things, the movement path 280 of the laser beam (S14). The position of the vacuum devices 206 and / or the support modules 244 is preferably determined depending on the movement path 280 of the laser beam, wherein, on the one hand, the flat material 12 and the at least one cut piece 1 are to be held securely and, on the other hand, the movement path 280 is not to run along the vacuum devices 206 (S16).At the specific positions of the vacuum devices 206 and / or the support modules 244, grid recesses 260 are preferably machined into the protective plate 258 using the laser device 600 (S18). The vacuum devices 206 and / or the support modules 244 can be manually positioned using the grid recesses 260. Alternatively, it is conceivable that the transport device 800 can place the vacuum devices 206 and / or the support modules 244 on the worktop 204 (S20).

[0057] Subsequently, a flat material 12 to be processed is placed onto the holding device 200 of the magazine location 24, 26, which is arranged in the loading position (S22), by means of the first handling device 802. The flat material 12 placed on the holding device 200 is gripped, secured, and simultaneously clamped by the clamping device 400 (S24). The magazine 22 is then pivoted so that the loaded magazine location 24, 26 with the clamped flat material 12 is brought into the processing area 18 (S26).

[0058] The laser device 600 can now generate a laser beam that moves along the predetermined movement path 280. Upon completion of the laser cutting, the at least one cut piece 1 is separated from the offcut 2 of the flat material 12 (S28). During the laser cutting, a processed flat material 12 can be removed from the opposite magazine location 24, 26 and another flat material 12 to be processed can be provided (S30).

[0059] After further rotation of the magazine 22, the flat material 12 to be processed is pivoted into the processing area 18 and the processed flat material into the loading area 20. While the further flat material 12 is being laser cut in the processing area 18 (S28), the processed flat material 12 can be removed so that the magazine location 24, 26 can be equipped with a new flat material 12 (S30). For this purpose, the offcut 2 is first removed by means of the second handling device 806 and deposited in the container 262 (S32). It is conceivable that in order to deposit the offcut in the container 262, the magazine locations 24, 26 must be in an intermediate position in order to release the container 262. Subsequently, the cut piece 1 is removed by means of the first handling device 802 and transported to the next production location (S34). List of reference symbols X x-axis Y y-axis Z z-axis 1 cut piece 2 Blend 10 Processing device 11 Material level 12 flat material 13 Control 14 Device housing 15 storage 16 Control cabinet 18 Editing area 20 loading area 22 Magazine 24 first magazine position 26 second magazine position 28 rotary drive 30 magazine axis 32 Floor 34 Marginal area 200 holding device 202 base plate 204 worktop 206 Vacuum device 210 base 212 Base bottom 214 Base top 216 Magnetic holder 217 permanent magnet 218 adapter holder 220 adapter piece 222 adapter top 224 nozzle interface 226 nozzle head 258 protective plate 228 Nozzle top 230 line output 232 cavity 233 Line 234 Line input 236 Base shell surface 238 Cable recess 240 recess base 242 hose clamp 244 Support module 246 module sockets 250 module bridge 252 brush holder 254 brush hairs 256 brush 260 grid recess 262 containers 280 trajectory 400 clamping device 402 pairs of clamping jaws 404 first clamping jaw 406 second clamping jaw 407 Clamping rotation axis 408 clamping surface 409 Clamping rotation drive 410 Surface recess 412 clamping element 414 clamping linear axis 416 clamping linear drive 600 laser device 602 axle system 604 Linear axis 800 transport device 802 first handling device 804 first gripping tool 806 second handling device 808 second gripping tool 810 pressure distribution plate 812 Handling element

Claims

[1] Processing device (10) for processing flat material (12) extending along a material plane (11), the processing device (10) comprising: - at least one holding device (200) for holding the flat material (12), - at least one clamping device (400) for fixing the flat material (12) and for clamping the flat material (12) along the material plane (11), - at least one laser device (600) for cutting at least one cut piece (1) from the flat material (12), wherein the holding device (200) is designed such that after the laser cut, the at least one cut piece (1) is held by the holding device (200), characterized by that the holding device (200) is designed as a vacuum holding device (200) for sucking the flat material (12). [2] Processing device (10) according to claim 1, wherein the clamping device (400) has at least two opposite pairs of clamping jaws (22) for fixing and / or clamping one side of the flat material (12) in each case. [3] Processing device (10) according to one of the preceding claims, wherein the laser device (600) is displaceable at least along an x-axis (X) and a y-axis (Y), wherein the x-axis (X) and the y-axis (Y) run parallel to the material plane (11) in the fixed state of the flat material (12). [4] Processing device (10) according to one of the preceding claims, wherein a transport device (800) is provided for providing the flat material (12) to the holding device (200) and / or clamping device (400) and / or for removing the cut piece (1) and / or offcut (2) from the holding device (200) and / or clamping device (400). [5] Processing device (10) according to claim 4, wherein the transport device (800) has a first handling device (802) for placing the flat material (12) on the holding device (200) and / or for removing the at least one cut piece (1) from the holding device (200). [6] Processing device (10) according to claim 4 or 5, wherein the transport device (800) has a second handling device (806) for removing the offcut (2) of the flat material (12) from the holding device (200). [7] Processing device (10) according to claim 6, wherein the second handling device (806) has handling elements (812), wherein the handling elements (812) are arranged such that the handling elements (812) grip the offcut (2) and not the at least one cut piece (1). [8] Machining device (10) according to one of the preceding claims, wherein a magazine (22) with magazine locations (24, 26) is provided, wherein each magazine location (24, 26) has a clamping device (400) and a holding device (200). [9] Processing device (10) according to claim 8, wherein the magazine (22) is rotatable about a magazine axis (30) such that the magazine locations (24, 26) can be arranged in at least one processing position and in at least one loading position, wherein a first magazine location (24) is arranged in the processing position below the laser device (600). [10] Processing device (10) according to claim 9, wherein a second magazine location (26) is provided in the loading position above a container (262) for receiving the scrap (2) of the flat material (12). [11] Method for processing flat material (12) extending along a material plane (11), comprising the following steps: a) providing at least one flat material (12) on a holding device (200); b) holding the flat material (12) by means of the holding device (200); c) clamping the flat material (12) along the material plane (11) by means of a clamping device (400); d) cutting at least one cut piece (1) from the flat material (12) by means of a laser beam, wherein during and after the laser cutting, the offcut (2) of the flat material is fixed and tensioned by means of the tensioning device (400), and wherein after the laser cutting at least the at least one cut piece (1) is held by the holding device (200) by means of negative pressure. [12] Method according to claim 11, wherein the flat material (12) is released from the holding device (200) by the clamping according to step c). [13] Method according to one of claims 11 to 12, wherein after cutting the cut piece (1) from the flat material (12) according to step d), the cut piece (1) is gripped and removed by means of a first handling device (802). [14] Method according to one of claims 11 to 13, wherein after cutting the cut piece from the flat material (12) according to step d), the offcut (2) of the flat material (12) is released and is gripped and removed by means of a second handling device (806). [15] Method according to one of claims 11 to 14, wherein after cutting the cut piece (1) from the flat material (12) according to step d), first the offcut (2) and then the cut piece (1) are gripped and removed. [16] Method according to one of claims 11 to 15 by means of a processing device (10) according to one of claims 1 to 10.

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