Microscanner system comprising a microscanner and a reflective surface combined in an encapsulation of the microscanner for redirecting radiation onto the microscanner

Abstract

A microscanner system comprising: a microscanner formed in a substrate, in particular in a semiconductor chip, with a deflection element rotatably suspended about at least one axis of oscillation, the deflection element having a surface designed as a mirror for deflecting electromagnetic radiation incident on the mirror surface; a radiation source, in particular a laser radiation source, for emitting an electromagnetic beam to be reflected at the deflection element; an encapsulation for encapsulating, in particular vacuum encapsulating, the microscanner, wherein the encapsulation has a window area that is at least partially transparent to the beam after its deflection at the deflection element; and a deflection device with an at least partially reflective reflective surface for deflecting the electromagnetic beam emitted by the radiation source onto the mirror surface.Here, the radiation source is arranged and oriented such that at least part of the beam path passes through a radiation transmission zone in the substrate to the deflection device. Furthermore, the deflection device is located in or on the encapsulation or is integrally formed with it.

Description

[0001] The present invention relates to a microscanner system for projecting electromagnetic radiation onto an observation field, in particular for imaging purposes.

[0002] Microscanners, also known in technical terminology as "MEMS scanners," "MEMS mirrors," or "micromirrors," are micro-electromechanical systems (MEMS), more precisely micro-optoelectromechanical systems (MOEMS), belonging to the class of micromirror actuators for the dynamic modulation of electromagnetic radiation, particularly visible light. Depending on their design, the modulating movement of a single mirror can be translational or rotational around at least one axis. In the first case, a phase-shifting effect is achieved; in the second, the incident electromagnetic radiation is deflected in a direction dependent on the mirror's current orientation. The following discussion focuses on microscanners in which the modulating movement of a single mirror is, at least in part, rotational.In contrast to mirror arrays, where the modulation of incident light is achieved through the interaction of several mirrors on a single MEMS device, the modulation in microscanners is typically generated via a single mirror per MEMS device (microscanner).

[0003] Microscanners can therefore be used, in particular, to deflect electromagnetic radiation in order to modulate an incident electromagnetic beam, especially a laser beam, with respect to its deflection direction by means of a deflection element (a "mirror"). This can be used, in particular, to create a Lissajous projection of the beam into an observation field. This allows, for example, the solution of imaging and sensory tasks, as well as the implementation of display functionalities. Furthermore, such microscanners can also be used to advantageously irradiate materials, especially for their processing. Other possible applications include the illumination of specific open or closed spaces or areas with electromagnetic radiation, for example, in the context of spotlight applications.

[0004] A microscanner can be integrated into a substrate, usually a plate, particularly a semiconductor chip. Microscanners often feature a mirror plate (deflection plate) suspended laterally by elastically deformable springs. A distinction is made between uniaxial mirrors, which are preferably rotatable about only one axis, and biaxial and multiaxial mirrors, in which rotations (especially rotational oscillations) about a corresponding number of different axes (oscillation axes) are possible, particularly simultaneously.

[0005] A microscanner system for deflecting an electromagnetic beam can thus, in particular, comprise a biaxial microscanner, i.e., a microscanner with two different non-parallel, and especially mutually orthogonal, axes of oscillation. However, it is also possible for the microscanner system to comprise a combination of two or more individual microscanners, especially uniaxial microscanners, arranged such that the incident beam can be deflected successively by the different individual microscanners of the microscanner system to generate a two-dimensional deflection pattern, such as a raster scan or a Lissajous figure. In a microscanner system with a combination of two or three uniaxial microscanners, their non-parallel axes of oscillation can, in particular, be pairwise orthogonal to each other.In the present case, a microscanner system has, in addition to at least one microscanner, a radiation source for providing electromagnetic radiation to be deflected by the microscanner(s).

[0006] For a variety of microscanner applications, particularly in the field of wearables (electronics worn on the body), very compact and cost-effective laser projectors are required. A key design incorporates one or more microscanners for beam deflection and one or more laser sources. Wearable applications include virtual reality (VR) glasses, augmented reality (AR) glasses, mixed reality (MR) glasses, and other body-worn imaging devices. The colors of the light generated by the light sources can be primary colors of a color model within the optical spectrum. For example, in the case of an RGB color model, this could be achieved using three laser sources: one each for red, yellow, and blue light.

[0007] One object of the invention is to provide a microscanner system with a particularly compact design.

[0008] The solution to this problem is achieved according to the teaching of claim 1. Various embodiments and further developments of the solution are the subject of the dependent claims.

[0009] The solution presented here concerns a microscanner system, comprising: (i) a microscanner formed in a substrate, in particular in a semiconductor chip, comprising a deflection element suspended rotatorably about at least one axis of oscillation, which has a surface designed as a mirror surface for deflecting electromagnetic radiation incident on the mirror surface; (ii) a radiation source, in particular a laser radiation source, for emitting an electromagnetic beam to be reflected at the deflection element; and (iii) an encapsulation for the, in particular at least partial, gas-tight encapsulation, in particular vacuum encapsulation, of the microscanner, wherein the encapsulation has a window area that is at least partially transparent to the beam after its deflection at the deflection element; and (iv) A deflecting device (145) with a reflecting surface that is at least partially reflective for deflecting the electromagnetic beam (140) emitted by the radiation source (125) onto the mirror surface; the radiation source (125) is arranged and oriented such that the beam path of the beam (140) passes at least partially through a radiation transmission area (135) in the substrate (105) to the deflecting device (145). Furthermore, the deflecting device is arranged in or on the encapsulation or is integrally (in one piece) formed with it. In particular, the deflecting device and the encapsulation can be formed together as an assembly.

[0010] The term "substrate," as used herein, refers to a homogeneous or heterogeneous solid (i.e., in a solid state at standard temperature 20 °C and standard pressure 1013 hPa) suitable for forming a microscanner. The substrate may, in particular, have a plate-like shape, at least in sections, and, depending on its function, may be made of a semiconductor wafer or a material that is at least partially optically transparent in the wavelength range used by the microscanner system for projection, such as a glass wafer or a partially transparent plastic wafer.

[0011] The term "deflection element," as used here, refers in particular to a body that has a reflective surface (mirror surface) smooth enough that reflected electromagnetic radiation, e.g., visible light, retains its parallelism according to the law of reflection, thus allowing an image to form. For this to occur, the roughness of the mirror surface must be less than approximately half the wavelength of the electromagnetic radiation. Specifically, roughnesses with a mean roughness value R are a ≤ 1000 nm, preferably R a ≤ 100 nm, especially preferred R a Suitable for surface roughness values ​​of < 5 nm. The mean roughness value indicates the average distance of a measurement point on the surface from the center line. The mean roughness value thus corresponds to the arithmetic mean of the absolute value of the deviation from the center line and is defined in particular in the standard DIN EN ISO 4287:2010.

[0012] The deflection element can be designed, in particular, as a mirror plate with at least one mirror surface, or can have one. In particular, the mirror surface itself can be made of a different material, e.g., a metal, especially a deposited one, than the rest of the deflection element.

[0013] The term "radiation source," as used herein, refers to a source of electromagnetic radiation that is deflected, and in particular scanned, by the microscanner system. It can, in particular, be a source of laser radiation. The wavelength range of the radiation can, in principle, be selected from the entire spectrum, from short-wave UV radiation, through the visible, near-infrared, infrared, and far-infrared ranges, up to long-wave terahertz and radar radiation. The radiation source can have one or more identical or different radiation emitters, e.g., laser diodes.

[0014] The term "deflection device," as used herein, refers to an optical device capable of changing the direction of an incident electromagnetic beam. It may, in particular, be designed as a reflector, especially a mirror, for at least partially reflecting the incident beam. The deflection device may, in particular, also be an imaging device that subjects the incident beam to a defined optical imaging process, in particular reflection and / or collimation.

[0015] The term "encapsulation," as used herein, refers to a device that encloses the microscanner, in particular its deflection element and suspension, at least partially, i.e., with respect to at least a limited solid angle region, in particular a half-space, in particular in a gas-tight (e.g., airtight) manner. In the case of a gas-tight seal, a negative pressure, in particular a vacuum, can then be established in the space enclosed by the encapsulation (in which the microscanner is located), relative to a gas pressure, in particular atmospheric pressure, prevailing outside the enclosed space. Insofar as the encapsulation alone does not yet completely enclose the microscanner, it can be combined with one or more other bodies in such a way that, together with these bodies, it effects a complete, in particular gas-tight, enclosure of the microscanner.

[0016] The encapsulation can, in particular, be a vacuum encapsulation, i.e., an encapsulation that seals a vacuum gas-tight. A vacuum is the state of a gas when, inside a container, the pressure of the gas, and thus the particle number density, is lower than outside, or when the pressure of the gas is lower than 300 mbar, i.e., lower than the lowest atmospheric pressure found on the Earth's surface – DIN 28400 Part 1 (May 1990). This allows the deflection element to be held in a vacuum, so that its oscillations can proceed, at least to a large extent, without gas friction.

[0017] The term "radiation transmission region," as used herein, refers in particular to a region of the substrate that is at least partially transparent to the radiation provided by the radiation source. The radiation transmission region may, in particular, be configured wholly or partially as a continuous opening, especially as an opening extending entirely through the substrate ("transmission aperture") or as an opening in or on which a material is located that mechanically closes at least partially but is at least partially transparent to the radiation (e.g., made of a (partially) transparent glass material or plastic, such as an optical fiber). The radiation transmission region may, in particular, be located away from the edges of the substrate, especially centrally within the substrate, or directly adjacent to (at least) one substrate edge.

[0018] Any terms used herein, such as "comprises," "includes," "includes," "features," "has," "with," or any other variant thereof, are intended to cover non-exclusive inclusion. For example, a method or apparatus that includes or features a list of elements is not necessarily limited to those elements but may include other elements not expressly listed or inherent in such method or apparatus.

[0019] Furthermore, unless explicitly stated otherwise, "or" refers to an inclusive "or" and not an exclusive "or". For example, a condition A or B is satisfied by one of the following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present).

[0020] The terms "ein" or "eine," as used here, are defined as "one or more." The terms "ein anderer" and "ein Weitere," as well as any other variant thereof, are to be understood as "at least one more."

[0021] The term "plural", as it may be used here, is to be understood in the sense of "two or more".

[0022] The terms “first”, “second”, “third”, and similar terms in the description and in the claims are used, where appropriate, to distinguish between similar or otherwise identically named elements and not necessarily to describe a sequential, spatial, or chronological order. It is understood that the terms used in this way are interchangeable under suitable circumstances and that the embodiments of the solution described herein may also function in orders other than those described or illustrated here.

[0023] The terms "configured" or "set up" to perform a specific function (and their respective variations), as used here, mean that a device or component thereof already exists in a configuration or setting capable of performing the function, or at least is adjustable—i.e., configurable—so that it can perform the function after appropriate adjustment. Configuration can be achieved, for example, by adjusting process parameters or by using switches or similar devices to activate or deactivate functionalities or settings. In particular, the device may have several predefined configurations or operating modes, allowing configuration by selecting one of these.

[0024] In the aforementioned microscanner system, the integration of the radiation source into the microscanner system itself, in combination with the beam path running through the radiation transmission area in the substrate and the deflection device with the encapsulation arranged in or on it or integrally formed therein, enables a particularly compact design.

[0025] In particular, the beam path through the substrate allows the radiation emitted by the radiation source, in combination with the deflection device, to be positioned so that the radiation source does not have to be arranged laterally to (i.e. next to) the substrate as in conventional microscanners, but can be arranged in particular within the substrate or in a vertical stacking arrangement on or behind the side of the substrate facing away from the mirror side of the microscanner.

[0026] The beam path allows the radiation emitted by the radiation source to pass through the substrate from the (first) hemisphere, in which the radiation source is located, into the (second) hemisphere, into which the radiation is to be deflected by the microscanner. The deflection device enables the necessary redirection of the radiation passing through the substrate onto the mirror area of ​​the microscanner, where the deflection of the radiation, redirected by the deflection device, can then take place into the observation field located in the second hemisphere.

[0027] Since the deflection device is located in or on the encapsulation, or is integrally formed with it—which is already regularly present in microscanners, particularly to avoid gas friction (especially air friction) during the oscillating movement of the deflection element—the space required for the deflection device can be kept very small. In particular, it can be applied as a very thin layer to a surface of the encapsulation or embedded within the encapsulation, so that it does not have to support itself.

[0028] Overall, this ensures that the radiation path within the microscanner system remains within the circumscribing space (in the sense of the mathematical concept of an enclosing surface) at least until it leaves the reflective surface of the deflection element. This allows for particularly compact designs with very small maximum dimensions, especially less than 10 mm or even 5 mm or less, which are small enough to allow the integration of the microscanner system into small devices, particularly wearables such as AR / VR glasses, for example as microprojectors.

[0029] The following section describes various exemplary embodiments of the microscanner system, which can be combined with each other as desired, unless expressly excluded or technically impossible.

[0030] In some embodiments, the microscanner system is configured such that the reflective surface of the deflection device simultaneously acts as a collimator for collimating the beam emitted by the radiation source during operation of the microscanner system and incident on the deflection device. In this way, the beam incident on the deflection element, or more precisely its mirror surface, and previously deflected by the deflection device, can be shaped into a beam that is at least substantially parallel. If the mirror surface is flat, the beam deflected by the deflection element can also be described as a substantially parallel beam, so that the resulting projection image depends, at least approximately, not on the distance of a projection surface from the deflection element, or at least only minimally.

[0031] In some embodiments, the reflective surface is specially shaped to collimate the beam incident upon it during operation of the microscanner system, such that at least 90%, and in particular at least 99%, of the cross-sectional area of ​​the collimated beam does not extend beyond the mirror surface of the deflecting element, optionally including the radiation transmission area at the deflecting element, upon its impact. This ensures that the beam striking the deflecting element is largely or even substantially completely reflected by the mirror surface and can thus be used to generate a projected image in the observation field. Radiation losses can therefore be largely avoided.

[0032] In some embodiments, the reflective surface is designed, at least in sections, as a vault that at least partially spans the deflecting element. Viewed from the deflecting element, the reflective surface, or where applicable, the relevant section thereof, is concave. This has the advantage that, due to this shape, the aforementioned collimating effect of the deflecting element can be achieved or enhanced, since the reflective surface acts like a concave mirror. As already explained, the reflective surface does not necessarily have to be self-supporting, although this is also possible.

[0033] In some such embodiments, a virtual circle of curvature (also called an osculating circle or osculating circle, i.e., the circle that best approximates the shape of the arch at the vertex) located at a vertex of the arch has a focus that lies on the mirror surface of the deflecting element or is located no more than 10%, and in particular no more than 1%, away from it, of the radius of curvature R of the circle of curvature. This allows for good collimation.

[0034] Instead of a (two-dimensional) circle of curvature, a virtual sphere (sphere of curvature) located at the vertex can be considered as a corresponding extension to three-dimensional space, which best approximates the shape of the arch at the vertex. The circle of curvature can then be obtained as the line of intersection of the sphere of curvature with a virtual plane passing through the vertex. At least in the area of ​​the surface immediately adjacent to the vertex, a mirror surface according to these embodiments therefore represents a concave spherical mirror.

[0035] Spherical concave mirror surfaces are generally easier to manufacture than other types of concave mirrors, especially parabolic mirrors. The use of a spherical concave mirror is particularly advantageous when the divergence center of the beam incident on the reflecting surface lies, at least approximately, on a surface defined by the mirror surface of the deflecting element. This is especially true when the radiation transmission region lies within the deflecting element, so that the divergence center can then lie, at least approximately, in or on the radiation transmission region. The divergence center can be considered, in particular, as an approximate point source of radiation if the beam diameter there is very small, corresponding approximately to the beam diameter of the beam (especially a laser beam) as it leaves the radiation source, or even smaller due to prior focusing.

[0036] In some embodiments, a virtual two-dimensional circle of curvature (or, correspondingly, a sphere of curvature) adjacent to a vertex of the vault has a radius of curvature R that satisfies the condition R = a·d, where d represents the distance (i.e., minimum distance) of the reflecting surface from a divergence center of the beam emitted by the radiation source during its operation, and 1.9 ≤ a ≤ 2.1. In these embodiments, the radius of curvature R thus corresponds, at least approximately, to twice the distance of the reflecting surface from the divergence center. In this way, a good collimation effect can be achieved, at least approximately, particularly if the divergence center lies, at least approximately, in or at the radiation transmission region in the substrate, especially at or in the deflection element.

[0037] It should be noted that every real radiation source (especially light source) is a surface radiator, so that it has a non-zero opening angle of its beam path and at least a small divergence of its beam path is always unavoidable.

[0038] In some embodiments, the vault is designed as a dome in the area surrounding the apex (i.e., with a central apex, and can in particular be rotationally symmetrical about an axis of symmetry passing through the apex). Thus, good collimation can be achieved over the entire cross-sectional area of ​​the beam incident on the reflecting surface and to be collimated.

[0039] In particular, the dome can be designed as a spherical dome or as an elliptically paraboloid dome (i.e., as a parabolic mirror), especially in the area surrounding the apex. While spherical domes are generally easier to manufacture, parabolic mirrors have the advantage of being able to best transform (collimate) a divergent beam of radiation emanating from a point source located at their focus into a (largely) parallel beam of radiation.

[0040] In some embodiments, the arch in a region surrounding the apex, particularly in its entirety, is designed as a prismatic paraboloid or as a partial ellipsoid. With a prismatic paraboloid, the collimating effect is achieved primarily along one cross-sectional direction of the beam. In applications where the projection beam emitted by the deflecting element into the observation field is to be focused at a distance close to the microscanner system, for example, when the microscanner system is to be used as a picoprojector to generate a real intermediate image at a short distance, as can be the case particularly when used in AR / VR / MR glasses, the ellipsoidal shape is advantageous.

[0041] In some embodiments, the radiation transmission area in the substrate is located at least partially within the deflection element, particularly centrally. It can extend through the deflection element, for example as a through-opening. This allows for a particularly compact design, as the lateral extent of the substrate can be kept especially small. This is because, if the substrate is completely located within the deflection element, no space is required; if it is partially located within the deflection element, only a small amount of space is needed. In each case, space outside the deflection element (i.e., next to it) is required to accommodate the radiation transmission area.

[0042] In some embodiments, the reflective surface overlaps the window area and, at least in the overlap area, has a transmittance T > 0, in particular T > 40%, for the beam incident upon it during operation of the microscanner system. This allows the reflective surface in the overlap area to both deflect the beam coming from the radiation source onto the mirror surface of the deflecting element and, at the same time, allow at least a portion of the radiation reflected from the mirror surface to pass through the overlap area as part of the window area, so that radiation can also be projected through the overlap area by the microscanner.These embodiments are particularly advantageous in combination with the aforementioned embodiments in which the radiation transmission area in the substrate lies at least partially in the deflection element, since here the reflection surface is usually located centrally "above" the mirror surface, especially when the radiation transmission area is arranged centrally in the mirror surface.

[0043] In some embodiments, the reflective surface is arranged at least partially on an inner or outer surface of the encapsulation. This particularly simplifies the production of the reflective surface. It can be applied to the inner or outer surface of the encapsulation as a very thin layer, thus occupying hardly any space, especially by means of a coating process, e.g., vapor deposition.

[0044] In some embodiments, the reflective surface is embedded, at least partially, within the encapsulation. It is thus particularly well protected against external influences. Specifically, it can be embedded, at least partially, between two or more components or layers of the encapsulation that are at least partially transparent to the deflected beam incident upon it from the deflecting element during operation of the microscanner system. This offers, on the one hand, the aforementioned advantages in manufacturing (simple application as a coating) and, on the other hand, the aforementioned protective effect during embedding. The components or layers can be in contact over a surface area, particularly within the framework of a form-fit or material-fit connection. It is also conceivable that they are separated from each other, at least partially, by a gap. Depending on the geometry of the components or layers,Furthermore, with multiple layers, the imaging effect of the reflective surface can be complemented by the imaging effect of the component(s) / layer(s) located between it and the deflecting element, resulting in an overall imaging effect that differs from the individual imaging effect of the reflective surface itself (especially catadioptric arrangements or catadioptric dialytes). In particular, this allows incident divergent radiation, whose divergence center lies below the deflecting element, to be collimated by the deflection. The optically effective surfaces (reflective and transmitting) of such an optical arrangement, composed of several components or layers, can be spherical or aspherical.Insofar as the term "center of curvature" introduced above in relation to a single optically effective surface is relevant in such arrangements, it must be replaced by "focal point" (of the catadioptric arrangement) or interpreted as such, since the image is produced here by the interaction of different surfaces or optically effective components or layers.

[0045] In some embodiments, the radiation transmission area in the substrate is located at least partially outside the deflection element. Therefore, it is unnecessary to house it within the deflection element, particularly by means of a through-hole, or, if it is only partially located within the element, the required space within the deflection element can be minimized. This can be particularly advantageous for increasing the effective reflective surface area of ​​the deflection element.

[0046] In some embodiments, the window area is designed as a flat window, at least in one section. It can, in particular, run parallel to the substrate or be tilted at an acute angle to it. Embodiments with flat windows are especially advantageous in combination with the aforementioned embodiments in which the radiation transmission area in the substrate is located at least partially outside the deflecting element, since, due to the radiation path past the deflecting element, the reflective surface and the window area can be easily separated spatially, so that the window area does not have to perform any deflection, and in particular no collimation. This highlights the significant advantage of the easier manufacturing of flat windows compared to curved window areas.

[0047] In some embodiments, the reflective surface lies at least partially within the window area and is partially transparent to the incident beam. These applications are particularly advantageous when the radiation transmission area lies at least partially within the deflection element. The reflective surface can thus partially deflect the beam coming from the radiation source onto the deflection element by reflection and subsequently allow the beam reflected from the deflection element onto the window area to pass partially into the observation field. This also facilitates the construction of very compact designs for the microscanner system.

[0048] In some embodiments, the window area has a constant thickness across its surface. This generally makes encapsulation easier to manufacture and results in largely distortion-free imaging characteristics, particularly transmission characteristics, of the window area.

[0049] In some embodiments, the microscanner system further comprises a polarization modifier arranged in the beam path between the deflecting element and the deflecting element. Here, the microscanner system is configured to impart a first, particularly linear, polarization to the beam incident on the reflecting surface from the radiation source. When one or more laser diodes are used as the radiation emitters of the radiation source, this is generally already the case in the form of pre-polarization. Typical laser diodes can have a polarization ratio of approximately 100:1. However, it is also possible, either instead or in addition, to arrange one or more (additional) polarization filters in the microscanner system for this purpose.

[0050] The polarization modifier is configured to impart a second polarization, different from the first, to the beam as it travels from the reflecting surface to the deflecting element and back. Specifically, in the case of linear polarization, the second polarization can correspond to a linear polarization with a polarization direction different from that of the first polarization (in particular, an orthogonal polarization direction). The polarization modifier can then be designed, in particular, as a retarder plate (polarization rotator).

[0051] Furthermore, the reflective surface has a higher reflectance with respect to the first polarization than with respect to the second polarization.

[0052] Specifically, according to some embodiments, the polarization modifier can be designed such that the beam coming from the radiation source can pass through it before striking the reflecting surface without being subjected to any polarization modification. In particular, it can have an opening (hole) in the region of space where the (divergent) beam coming from the radiation source passes through it in the direction of the deflecting element, so that this beam can pass through undisturbed, in particular without being subjected to polarization.

[0053] The polarization technique described here can be used to further increase the overall achievable transmittance of the optical arrangement of the microscanner system. Since the first polarization results in a higher reflectance (relative to the second polarization) and thus a lower transmittance, radiation losses during deflection can be minimized. Conversely, the second polarization of the beam reflected by the deflecting element results in a lower reflectance (relative to the first polarization) and therefore a higher transmittance at the reflecting surface.Overall, this allows for an increase in the total transmittance (intensity of the beam from the radiation source in relation to the intensity of the beam emitted into the observation field after transmission through the window area) of the optical arrangement compared to a corresponding arrangement but without using polarization, in particular without a polarization modifier, while maintaining the same intensity of the beam coming from the radiation source.

[0054] In some embodiments, the substrate delineates a first and a second spatial region. The first spatial region is at least partially bounded by the mirror surface and contains the deflection device, while the second spatial region is bounded by the side of the substrate facing away from the mirror surface and contains at least a portion of the radiation source. These spatial regions can be understood, in particular, as two half-spaces of three-dimensional space delineated by a virtual plane passing through the substrate, especially through its geometric center of mass or center of gravity. The radiation source and the deflection device are thus located on opposite sides of the virtual plane in different half-spaces.This allows the radiation source and the substrate to be manufactured independently of each other using the microscanner, and then combined, in particular joined, in a very compact installation space together with the deflection device and, if necessary, other components to form the microscanner system.

[0055] In some embodiments, the microscanner system comprises a layer stack consisting of several substrate layers stacked on top of each other. This allows for simplified and throughput-enhancing manufacturing, particularly in the sense of wafer-level processing.

[0056] Specifically, the substrate and the encapsulation can each be formed as a single substrate layer or as a group of interconnected, adjacent substrate layers within the layer stack, with no substrate layer being part of both the substrate and the encapsulation. This allows these layers to be produced separately, particularly sequentially, and optionally from different materials.

[0057] According to some embodiments, the layer stack can include a substrate layer that belongs neither to the substrate nor to the encapsulation, and in or on which the radiation source is arranged. Such a substrate layer can, in particular, serve as a support substrate for the radiation source, and optionally also for the other substrate layers above it, for example, to provide the layer stack with the necessary mechanical robustness and / or stiffness.

[0058] In some embodiments, the radiation source is arranged, at least partially, in a cavity formed in the substrate. In particular, it can be partially located within the cavity and extend from there into the second spatial region. By integrating it, at least partially, within the substrate, the (circumscribing) installation space required for the microscanner system can be further reduced. The cavity can be located, in particular, in a section of the substrate outside the deflection element. This means that the moment of inertia, and thus its influence on the resonance frequency(ies) of the oscillations about the axis(es) of oscillation that can be performed by the deflection element, is not affected, or at least not significantly.

[0059] In some embodiments, the radiation source comprises multiple electromagnetic emitters and a radiation combining device for combining the radiation emitted by the various emitters, particularly those of different wavelengths, into a single electromagnetic beam. This allows the intensity of the beam to be increased and / or its color to be adjusted, especially over time. For this purpose, various controllable emitters, such as laser diodes, can be used, the respective radiation intensity of which can be varied by control. With a suitable selection of emitters, a color space, such as an RGB color space by selecting a red, a yellow, and a blue laser diode, can be defined, within which the color of the combined beam can be set.In particular, colored projection images can be created using the microscanner system. When using multiple radiation emitters, the overall data rate or modulation density that can be transmitted by the beam can also be increased if the radiation emitters, or their respective radiation, are modulated out of phase with each other by the control signal.

[0060] In some embodiments, the radiation source comprises at least one VCSEL laser diode (vertical-cavity surface-emitting laser) and / or an edge-emitting laser diode as the radiation emitter. Due to the small size and high radiant power of such emitters, as well as the largely parallel nature of the laser beam, very space-saving yet powerful radiation sources can be implemented. Specifically, when using one or more VCSEL laser diodes, the fact that they can be plate-shaped and emit from one of their main surfaces can be exploited. This allows for a particularly space-saving combination with the substrate, especially in terms of stacking, eliminating the need for additional beam deflection in front of or within the substrate.Furthermore, VCSELs have the advantage of directly generating a round beam profile, which is usually desirable or advantageous for a microscanner system, without requiring additional beam shaping and thus without having to compensate for intensity losses caused by such shaping. Edge emitters, on the other hand, have the advantage of high availability, especially for wavelengths in the visible (VIS) range.

[0061] In some embodiments, the laser diode, or at least one of the laser diodes, is designed as a single-mode laser diode. This allows for a particularly high pixel resolution in the images projected by the microscanner.

[0062] Further advantages, features and application possibilities of the present solution will become apparent from the following detailed description in conjunction with the figures.

[0063] This shows(s): Fig. 1 a microscanner system according to a (symmetrical) first variant; Fig. 2A-G various embodiments of the microscanner system according to the variant from Fig. 1; Fig. 3 a microscanner system according to an (asymmetric) second variant; Fig. 4A-C different embodiments of the microscanner system according to the variant from Fig. 1; and Fig. 5 a microscanner system according to a third variant.

[0064] In the figures, identical reference symbols denote identical, similar, or corresponding elements. Elements depicted in the figures are not necessarily shown to scale. Rather, the various elements depicted in the figures are represented in such a way that their function and general purpose are understandable to a person skilled in the art.

[0065] During a Fig. The first variant 100 of a microscanner system shown in Figure 1, which represents a first possible basic concept for implementing the present solution, consists of, on the one hand, a substrate 105, in particular made of a semiconductor material such as silicon, or of a glass material, and, on the other hand, a support substrate 110, in particular a semiconductor substrate, stacked on top of each other and connected to form a component, e.g., by a wafer bonding connection or a die bonding connection. The side of the substrate 105 facing away from the support substrate 110 is hereinafter referred to as the "top side" 115. It also defines a virtual plane that coincides with the top side in the region of the top side.

[0066] The substrate 105 contains a microscanner with a deflection element 130, in particular a disk that is completely or partially mirrored on its side facing away from the support substrate 110 ("top side"), and which is suspended in a cavity 120 of the substrate 105 and on a spring suspension (not shown) such that it can perform a rotational oscillation about at least one axis of oscillation. In particular, the microscanner can be designed as a two-axis oscillator, so that the deflection element 130 can oscillate rotationally about two axes of oscillation that are orthogonal to each other and each run in or parallel to its top side. For driving the oscillations, the microscanner has a drive unit (not shown), which can in particular have one or more piezoelectric actuators per axis of oscillation.The deflection element 130 is shown here in two different positions simultaneously for illustrative purposes; however, in reality, these positions can only be assumed sequentially, as the deflection element is deflected from its rest position in each instance. Corresponding simultaneous representations of several different beam paths can also be found in the other figures.

[0067] On the support substrate 110 and simultaneously within the cavity 120 surrounding the deflection element, a radiation source 125, for example a laser diode designed as a VCSEL or edge emitter, is arranged such that, during its operation, it can emit an electromagnetic beam 140, in particular a laser beam, through a radiation transmission area 135 provided in the deflection element 130, preferably centrally. The radiation transmission area 135 can in particular be designed as a through-opening ("hole") through which the beam 140 can pass. If the three-dimensional space is divided into two hemispheres delimited from each other by the aforementioned virtual plane, it can be said that the radiation source 125 emits the beam 140 from the lower (first) hemisphere in the drawing, through the radiation transmission area 135, into the upper (second) hemisphere.

[0068] In the second hemisphere, a deflecting device 145 (shown only partially) is arranged in the beam path of beam 140. This device is configured to deflect the incident beam 140 onto the deflecting element 130 and collimate it, so that the beam deflected to the deflecting element 130 can be described, at least to a good approximation, as a parallel beam. The deflecting device 145 is combined with an encapsulation of the microscanner (i.e., at least of the deflecting element 139 with its suspension on the substrate 105), which provides a gas-tight enclosure, particularly a vacuum-encapsulated one, to form a single component, and is particularly integrally designed with it.

[0069] The beam path of beam 140 can be divided into several sections: a first beam section 140a between the radiation source 125 and the deflecting device 145, a second beam section 140b between the deflecting device 145 and the deflecting element 130, and a third beam section 140c after the deflecting element 130. During the first beam section 140a, the beam 140, depending on the emission characteristics of the radiation source 125 and any intermediate optical elements (in Fig. Since the beam can also appear as a divergent beam (1 not present), the collimating property of the deflecting element 145 results in the beam sections 140b and 140c appearing essentially as parallel beams when the deflecting element 130 has a flat mirror surface. The emission angle of the beam section 140c depends on the instantaneous orientation of the deflecting element 130a, i.e., on the instantaneous phase of its oscillations about the axes of oscillation.

[0070] The reflective surface 145a of the deflecting element is preferably shaped such that it collimates the beam 140 incident on it during the operation of the microscanner system when transitioning from the beam section 140a to the beam section 140b in such a way that at least 90%, and in particular at least 99%, of the cross-sectional area of ​​the collimated beam does not extend beyond the mirror surface of the deflecting element 130, optionally including the radiation transmission area 135 at the deflecting element, when it hits the deflecting element.

[0071] The shape of the reflecting surface 145a of the deflecting element can be designed such that the focus of the concave mirror formed by the reflecting surface 145a lies, at least to a good approximation, at the location (of the image) of the source, i.e., in the plane defined by the deflecting element, in particular by its mirror surface. The center of curvature of the reflecting surface 145a is then located at a distance from it that is at least approximately twice the distance of the mirror surface of the deflecting element 130 from the reflecting surface 145a. In particular, this distance can be determined such that it deviates by no more than 10%, and in particular no more than 1%, from twice the distance of the mirror surface of the deflecting element 130 from the reflecting surface 145a.

[0072] Overall, the Microscannersystem 100 has a particularly compact design for a microprojector, making it suitable for use in very small devices such as AR / VR glasses.

[0073] The Fig. Figures 2A to 2G illustrate different embodiments of the Microscanner System 100. Fig. 1.

[0074] In Fig. Figure 2A shows a first embodiment 200 of the microscanner system 100. Here, an annular intermediate layer 150 is arranged between the upper surface 115 of the substrate 105 and the deflecting element 145, which is designed as a dome. The deflecting element 145 rests on this intermediate layer. The dome has a vertex 145e and the area surrounding it is designed as a dome, in particular as a spherical dome or as an elliptically paraboloid dome.

[0075] The deflection element 145, in conjunction with the intermediate layer 150 and the substrate in the second hemisphere, thus forms a gas-tight encapsulation of the microscanner. On the rear side, i.e., in the first hemisphere, the support substrate 110 also seals the cavity surrounding the deflection element 130 in a gas-tight manner, so that the entire cavity is sealed gas-tight, in particular airtight, and can be evacuated to allow largely undamped oscillations of the deflection element 130.

[0076] On its concave inner surface, facing the deflecting element 130, the dome-shaped deflecting element 145 has a reflective layer 145 that is partially transparent to the incident beam 140 (see beam section 140a) for the partial deflection, including collimation of the beam 140 onto the deflecting element 130 (see beam section 140b). The deflecting element 145 can, in particular, be made of a glass or plastic material that is largely transparent to the beam 140, on which the reflective layer is applied as a beam splitter (i.e., as a mirror with a transmittance T > 0), especially by means of metallization, e.g., with aluminum. The deflecting element can, in particular, be designed in the region of the reflective layer such that it has a transmittance T > 40% for the incident beam 240.

[0077] At the deflection element, the beam 140 coming from the deflection element 145 (see beam section 140b) is reflected and, depending on the instantaneous deflection of the deflection element 130, reflected back to the deflection element 145 in a corresponding direction (see beam section 140c) and can be seen there in a window area 145f (in the following) due to the partial transparency of the deflection element 145. Fig. (2B to 2G no longer marked for clarity) the microscanner system 201 leaves the observation field (partially, since T < 100%).

[0078] In Fig. Figure 2B shows a second embodiment 201 of the microscanner system 100. It largely corresponds to embodiment 200. Fig. 2A is the same, but differs in that the reflective layer 145a is formed not on the inside, but on the outside of the dome-shaped deflecting element 145.

[0079] In Fig. Figure 2C shows a third embodiment 202 of the microscanner system 100. It largely corresponds to embodiment 201. Fig. 2B is identical, but differs in that here the deflecting element 145 is multilayered, with two (or more) layers 145b and 145c, each made of a glass or plastic material that is largely transparent to the beam 140, and the reflective layer 145a is embedded between two of the layers. The layers 145b and 145c can, in particular, each have a constant thickness across their respective layers. In particular, these thicknesses of the layers 145b and 145c can also be the same for each other.

[0080] In Fig. 2D shows a fourth embodiment 203 of the microscanner system 100. It largely corresponds to embodiment 202. Fig. This is similar to 2C, but differs in that the two layers 145b and 145c embedding the reflective layer 145a are each meniscus-shaped, specifically designed as a meniscus lens. The concave inner surface of layer 145b and the convex outer surface of layer 145c define an intermediate interface where the reflective surface 145a is embedded between the layers. The respective concave inner surfaces of the two layers 145b and 145c each have at least an approximately paraboloid shape. Together, layers 145b and 145c thus form a (partially transparent) meniscus lens ("thick meniscus"). The focus of this meniscus lens lies, at least to a good approximation, on the plane defined by the deflecting element, in particular its mirror surface, in order to ensure good imaging properties.

[0081] In Fig. Figure 2E shows a fifth embodiment 204 of the microscanner system 100. It largely corresponds to embodiment 203. Fig. The 2D design is similar, but differs in that, in addition to the reflective layer, a slit 145 is provided between layers 145b and 145d. This slit can be air-filled or evacuated. It is also conceivable to provide several separate slits, either arranged side-by-side between layers 145b and 145d or (in the case of more than two layers) located between different layers of the deflecting element 145. Furthermore, this allows the elements to have different radii, creating degrees of freedom in the optical design that enable better correction of aberrations.

[0082] In Fig. 2F is a sixth embodiment 205 of the microscanner system 100. It largely corresponds to embodiment 204. Fig. 2E is identical, but differs in that layer 145b has a ring shape at its edge, with which it rests on a similarly ring-shaped contact surface on layer 145c, forming a gas-tight connection. Within this ring-shaped contact surface, layers 145b and 145c are separated, at least partially, by a gap 145d. The reflective surface 145a can optionally be located on the concave side of layer 145b (design 145a') or on the convex side of layer 145c (design 145a''). Furthermore, it is indicated how lenses with monolithically manufactured edge shapes can be assembled into a lens stack. A wafer-level process can thus be used to manufacture the components and the projectors.

[0083] In Fig. 2G is a seventh embodiment 206 of the microscanner system 100. It largely corresponds to embodiment 203. Fig. The 2D configuration is similar, but differs in that the two layers 145b and 145c are planar on their respective outer surfaces, so that the combination of both layers 145b and 145c with the reflective layer 145a embedded between them has a plate shape bounded by parallel planar outer surfaces. An advantage of this embodiment is that it is particularly suitable for wafer-level processing, where a plurality of microscanner systems are initially manufactured simultaneously by means of joint wafer-level processing and subsequently singulated, and the geometry is compared to Fig. 2F is simplified.

[0084] Fig. Figure 3 shows a second variant, 300, of a microscanner system. It largely corresponds to microscanner system 100. Fig. 1. Therefore, only the essential features will be discussed below. One of these features is that the radiation transmission area is not located in the deflection element 130, but instead in a different section of the substrate 105. Thus, the beam 140 emitted by the radiation source 125, which is arranged offset on the support substrate 110 and simultaneously within the radiation transmission area 135 itself, can pass the cavity 120 and the deflection element 105 from the first hemisphere to the deflection device 145, which is also arranged offset accordingly, in the second hemisphere.

[0085] An advantage here is that the point of passage of the beam segment 145c through the deflecting element 145, which depends on the current orientation of the deflecting element 130, can regularly be located at a different position than the reflective surface 145a. Thus, the reflective surface can, in particular, be designed as a highly reflective mirror with negligible transmission. In the areas of the deflecting element 145 not affected by the reflective surface 145a, the transmission coefficient can be maximized. Overall, the total transmission coefficient of the microscanner system for the beam 140 can be significantly increased by using either one or a combination of these two configurations.

[0086] The radiation from the radiation source 125 (not shown) is directed via a (light) waveguide 155, in particular an optical fiber, through the radiation transmission area 135 onto the reflection surface 145a of the deflecting element 145.

[0087] Overall, the MicroScanner System 300 also features a particularly compact microprojector design, making it suitable for integration into very small devices such as AR / VR glasses. Compared to the MicroScanner System 100... Fig. However, sufficient space must be provided next to the cavity 120 for the lateral arrangement of the radiation transmission area 135 with the radiation source 125 and for the offset position of the deflection device 145.

[0088] The Fig. Figures 4A to 4C illustrate different embodiments of the 300 microscanner system. Fig. 3.

[0089] In Fig. Figure 4A shows a first embodiment 400 of the microscanner system 300. Here, instead of a dome-shaped vault, a largely planar deflecting element 145 is provided as an encapsulation or part thereof, containing a concave cavity whose concave inner wall forms the reflective surface 145a, which is thus integrated into the deflecting element 145. Furthermore, the waveguide 155 is tilted relative to the substrate 105, so that the beam 140 is directed obliquely through the encapsulated cavity onto the reflective surface. The planar region of the deflecting element 145 runs, at least substantially, parallel to the substrate 105, resulting in an overall, at least largely cuboid, shape.

[0090] In Fig. Figure 4B shows a second embodiment 401 of the microscanner system 300. It largely corresponds to embodiment 400. Fig. 4A is identical, but differs in that here the largely planar deflecting element 145 is tilted at an acute angle relative to the substrate 105. To form the reflective surface 145a, the deflecting element 145 has a projection containing a concave cavity, the concave inner wall of which forms the reflective surface 145a, thus integrating it into the deflecting element 145.

[0091] In Fig. Figure 4C shows a third embodiment 402 of the microscanner system 300. It largely corresponds to embodiment 400. Fig. 4A is identical, but differs in that the deflecting element 145 is designed as a vault, specifically with two apexes. To form the reflective surface 145a, the deflecting element 145 has a concave cavity, the concave inner wall of which forms the reflective surface 145a, thus integrating it into the deflecting element 145. Due to the vault shape, the intermediate layer 150 can optionally be omitted.

[0092] Fig. Figure 5 shows a third variant, 500, of a microscanner system. It largely corresponds to microscanner system 100. Fig. 1. Therefore, only the essential features and the partially differing polarization of the beam will be discussed below. The microscanner system 500 is configured to impart a first polarization, in particular a linear polarization aligned along a first transverse direction “x”, to the beam incident on the reflective surface 145a from the radiation source 125 (see beam section 140a). This can also optionally be applied to the beams described above with reference to the Fig. The embodiments described in sections 1 to 4C must be the case in each instance.

[0093] The same applies to one or more optical elements 160, particularly focusing elements, such as one or more converging lenses, which may be arranged in the beam path of the beam section 140a to focus the beam 140 at a focal point in the region of the radiation transmission area 135 such that its cross-section has a minimum there. Ideally, this minimum cross-section is smaller than the smallest cross-section of the radiation transmission area 135 when viewed in the direction of the beam path, so that the beam 140 is not partially shielded by the edge of the radiation transmission area 135.

[0094] The first polarization can be caused in the radiation source 125 itself (especially a laser diode) and / or by a polarization filter (not shown) located downstream in the beam path. Depending on the design, it is also possible that the polarization modifier 165 contributes to the formation of the first polarization. In the present example, Fig. However, in 5 the polarization modifier 165 has a continuous opening at the point where the beam path passes through it in the beam section 140a, so that it can pass through the polarization modifier 165 before hitting the reflection surface 145a without being subjected to a polarization modification.

[0095] Among the aforementioned special features of the microscanner system 500 is, above all, the fact that a polarization modifier 165 is additionally arranged in the beam path between the deflecting element 145 and the deflecting element 130. This modifier is configured to impart a second polarization to the beam 140 as it travels from the reflecting surface 145a to the deflecting element 130 (see beam section 140b) and back again (see beam section 140c). This second polarization is different from the first polarization and is specifically a linear polarization aligned along a second transverse direction "y". Thus, the beam 140, coming from the radiation source 125, exhibits the first polarization when it first encounters the deflecting element 145, more precisely its reflecting surface 145a (see beam section 140a), while subsequently, coming from the deflecting element (see beam section 140c), it exhibits the second polarization.Beam section 140c) exhibits the second polarization upon its second impact, which differs from the first polarization.

[0096] As a further special feature, the reflective surface 145a exhibits a higher reflectance (and thus a lower transmittance) with respect to the first polarization than with respect to the second polarization. As a result, the transmission-related radiation loss of the beam coming from beam section 140a at the reflective surface 145a, as well as the reflection-related radiation loss of the beam coming from the deflecting element (see beam section 140c) at the reflective surface 145a, are also reduced. This results in a higher usable transmittance of the entire arrangement, which can be used for brighter projections into the observation field or to reduce the required radiant power of the radiation source 125. LIST OF REFERENCE SYMBOLS 100 microscanner systems, first variant (basic concept) 105 (microscanner) substrate with deflection element 110 carrier substrate 115 Top surface of the substrate 105, defines virtual plane as the boundary between two spatial regions 120 Cavity in substrate 105 for receiving the deflection element 125 Radiation source, e.g. laser diode 130 deflection element with mirror surface 135 Radiation transmission area, in particular passage opening 140 beam or beam path 140a Beam section between radiation passage area and deflection device 140b Beam section between deflection device and deflection element 140c Beam section after deflection element, scan beam 145 Deflection device, also encapsulation or part thereof 145a Reflecting surface of the deflecting device 145b first layer of the deflection element 145c second layer of the deflection element 145d Gap, in particular air gap or vacuum gap 145e vertex 145f Window area 150 Intermediate shift 155 optical fiber as (light) waveguide 160 optical elements, especially converging lenses 165 Polarization modifier, in particular delay plate 200 microscanner system, first embodiment of the microscanner system 100 201 Microscanner system, second embodiment of the microscanner system 100 202 Microscanner system, third embodiment of the microscanner system 100 203 Microscanner system, fourth embodiment of the microscanner system 100 204 Microscanner system, fifth embodiment of the microscanner system 100 205 Microscanner system, sixth embodiment of the microscanner system 100 206 Microscanner system, seventh embodiment of the microscanner system 100 300 microscanner system, second variant (basic concept) 400 microscanner system, first embodiment of the microscanner system 300 401 Microscanner system, second embodiment of the microscanner system 300 402 Microscanner system, third embodiment of the microscanner system 300 500 microscanner system, third variant QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited non-patent literature

[0000] DIN 28400

[0016]

Claims

[1] Micro scanner system (100; 200,..., 206; 300; 400, ... , 402; 500), comprising: a microscanner formed in a substrate (105), in particular in a semiconductor chip, with a deflection element (130) suspended in a rotationally oscillating manner about at least one oscillation axis, which deflection element has a surface formed as a mirror surface for deflecting electromagnetic radiation incident on the mirror surface; a radiation source (125) for emitting an electromagnetic beam (140) to be reflected at the deflection element (130); an encapsulation for encapsulating the microscanner, wherein the encapsulation has a window region (145f) that is at least partially transparent to the beam (140) after its deflection at the deflection element (130); and a deflection device (145) with an at least partially reflecting reflection surface (145a) for deflecting the electromagnetic beam (140) emitted by the radiation source (125) onto the mirror surface; wherein the radiation source (125) is arranged and oriented such that a beam path of the beam (140) extends at least partially through a radiation passage region (135) in the substrate (105) to the deflection device (145); and wherein the deflection device (145) is arranged in or on the encapsulation or is formed integrally therewith. [2] Microscanner system (100; 200,...,206; 300; 400,...,402; 500) according to claim 1, wherein the microscanner system (100; 200,...,206; 300; 400,...,402; 500) is configured such that the reflection surface (145a) of the deflection device (145) is simultaneously designed as a collimator for collimating the beam (140) emitted by the radiation source (125) and incident on the deflection device (145) during the operation of the microscanner system (100; 200,...,206; 300; 400,...,402; 500) during the deflection of the beam. [3] Microscanner system (100; 200,...,206; 300; 400,...,402; 500) according to claim 2, wherein the reflection surface (145a) is shaped such that it collimates the beam (140) incident on it during operation of the microscanner system (100; 200,...,206; 300; 400,...,402; 500) such that at least 90%, in particular at least 99% of the cross-sectional area of ​​the collimated beam (140) when it strikes the deflection element (130) does not extend beyond the mirror surface of the deflection element (130), optionally including the radiation passage region (135) on the deflection element (130). [4] Microscanner system (100; 200,...,206; 300; 400,...,402; 500) according to one of the preceding claims, wherein the reflection surface (145a) is formed at least in sections as a vault at least partially spanning the deflection element (130). [5] Microscanner system (100; 200,...,206; 300; 400,...,402; 500) according to claim 4, wherein a virtual circle of curvature adjacent to a vertex of the vault has a focus which lies on the mirror surface of the deflection element (130) or is located away from it by not more than 10%, in particular not more than 1%, of the radius of curvature R of the circle of curvature. [6] Microscanner system (100; 200,...,206; 300; 400,...,402; 500) according to claim 4, wherein a virtual two-dimensional circle of curvature adjacent to a vertex of the vault has a radius of curvature R which satisfies the condition R = a d, where d indicates the distance of the reflection surface (145a) from a center of divergence of the beam (140) emitted by the radiation source (125) during its operation and 1.9 ≤ a ≤ 2.

1. [7] Microscanner system (100; 200,...,206; 500) according to one of claims 4 to 6, wherein the vault is formed as a dome in a region surrounding the apex. [8] Microscanner system (100; 200,...,206; 500) according to claim 7, wherein the dome is formed as a spherical dome or as an elliptical paraboloidal dome in the region surrounding the vertex. [9] Microscanner system (100) according to one of claims 4 to 6, wherein the vault is formed as a prismatic paraboloid or as a partial ellipsoid in a region surrounding the vertex. [10] Microscanner system (100; 200,...,206; 500) according to one of the preceding claims, wherein the radiation passage region (135) in the substrate (105) is located at least partially in the deflection element (130). [11] Microscanner system (100; 200,...,206; 500) according to claim 10, wherein the reflection surface (145a) overlaps with the window region (145f) and has a transmittance T > 0, in particular T > 40%, at least in the overlap region for the beam (140) impinging on it during operation of the microscanner system (100; 200,...,206; 500). [12] Microscanner system (100; 200; 201; 300; 400,...,402; 500) according to one of the preceding claims, wherein the reflection surface (145a) is arranged at least in sections on an inner side or on an outer side of the encapsulation. [13] Microscanner system (100; 202,...,206; 300) according to one of the preceding claims, wherein the reflection surface (145a) is arranged at least partially embedded in the interior of the encapsulation. [14] Microscanner system (100; 202,...,206; 300) according to claim 13, wherein the reflection surface (145a) is embedded at least partially between two or more components or layers (145b, 145c) of the encapsulation which are at least partially transparent for the respective deflected beam (140) incident on it from the deflection element (130) during operation of the microscanner system (100; 202,...,206; 300). [15] Microscanner system (300; 400,...,402) according to one of the preceding claims, wherein the radiation passage region (135) in the substrate (105) is located at least partially outside the deflection element (130). [16] Microscanner system (400; 401) according to one of the preceding claims, wherein the window region (145f) is formed as a plan window at least in one section. [17] Microscanner system (400) according to claim 16, wherein the section of the window region (145f) formed as a planar window runs parallel to the substrate (105). [18] Microscanner system (401) according to claim 16, wherein the section of the window region (145f) formed as a plane window is tilted at an acute angle relative to the substrate (105). [19] Microscanner system (100; 200,...,206; 500) according to one of the preceding claims, wherein the reflection surface (145a) lies at least partially in the window region (145f) and is partially transparent to the beam (140) incident on it. [20] Microscanner system (100; 200,...,206; 300; 400,...,402; 500) according to one of the preceding claims, wherein the window region (145f) has a constant window thickness over its area. [21] Microscanner system (500) according to one of the preceding claims, further comprising a polarization modifier (165) arranged in the beam path between the deflection element and the deflection element (130); wherein: the microscanner system (500) is configured to impart a first polarization to the beam (140) coming from the radiation source (125) and incident on the reflection surface (145a); the polarization modifier (165) is configured to impart a second polarization different from the first polarization to the beam (140) as it travels from the reflection surface (145a) to the deflection element (130) and back again; and the reflection surface (145a) has a higher reflectance with respect to the first polarization than with respect to the second polarization. [22] Microscanner system (500) according to claim 21, wherein the polarization modifier (165) is designed such that the beam (140) coming from the radiation source (125) can pass through it before impinging on the reflection surface (145a) without being subjected to a polarization modification. [23] Microscanner system (100; 200,...,206; 300; 400,...,402; 500) according to one of the preceding claims, wherein the substrate (105) delimits a first spatial region and a second spatial region from one another and the first spatial region is at least partially delimited by the mirror surface and contains the deflection device (145), while the second spatial region is delimited by the side of the substrate (105) facing away from the mirror surface and at least partially contains the radiation source (125). [24] Microscanner system (100; 200,...,206; 300; 400) according to one of the preceding claims, wherein the microscanner system (100; 200,...,206; 300; 400) comprises a layer stack of several substrate layers stacked one above the other. [25] Microscanner system (100; 200,...,206; 300; 400) according to claim 24, wherein the substrate (105) and the encapsulation are each formed as a single substrate layer or as a group of interconnected, adjacent substrate layers of the layer stack and no substrate layer is both part of the substrate and part of the encapsulation. [26] Microscanner system (100; 200,...,206; 300; 400) according to claim 24 or 25, wherein the layer stack comprises a substrate layer (110) belonging neither to the substrate (105) nor to the encapsulation, in or on which the radiation source (125) is arranged.

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