Device and method for producing a component

Abstract

A device (100) for producing a component (101) comprises a receiving device (110) which is designed to receive a first component (102), a second component (104) and a reactive multilayer system (106), a preparation device (112) which is designed to form a stack using the first component (102), the second component (104) and the reactive multilayer system (106), wherein the components (102, 104) are arranged externally, and an activation device (114) which is designed to trigger a reaction of the reactive multilayer system (106) in order to connect the components (102, 104) to the component (101) by means of a material-to-material connection.

Description

The present invention relates to an apparatus and a method for producing a component using a reactive multilayer system.A reactive multilayer system (RMS), for example a reactive multilayer film, can be used to bond elements. CN 1 01 621 920 A discloses automatic placement machines. DE 10 2010 010 193 A1 describes apparatuses for thermal bonding and methods for checking a thermal bond with reactive exothermic fuel. US 2011 / 0 284 975 A1 describes bonding methods with RMS film.Against this background, the present invention provides an improved device and an improved method for producing a component according to the main claim and the dependent claim 9.Process steps required for producing the component can advantageously be carried out automatically.An apparatus for producing a component has the following features:a receiving device configured to receive a first component, a second component and a reactive multilayer system;a preparation device configured to remove the first component, the second component and the reactive multilayer system from the receiving device and to form a stack using the first component, the second component and the reactive multilayer system, wherein the components are arranged on the outside; andan activation device configured to trigger a reaction of material of the reactive multilayer system arranged in the stack in order to connect the components to the component by a cohesive connection.Using the device, the component can be produced in an automated manner. The devices of the devices together may form a unit, for example in the form of a manufacturing apparatus or a manufacturing line. The receiving device can serve as a magazine, which can be stored or temporarily stored in the individual parts required for producing the component. The preparation device can comprise, for example, a component placement robot in order to form the stack of individual parts. According to various embodiments, the preparation device may be configured to use the reactive multilayer system directly or after preprocessing to form the stack. Thus, the reactive multilayer system received by the receiving device may be an element prepared for direct arrangement in the stack or a raw element which is still prepared using the preparation device before arrangement in the stack. For example, the reactive multilayer system accommodated by the receiving device can be an already cut-to-size film piece or a film which is still to be cut to size. The activation device can be designed to introduce an activation energy required for triggering the reaction of the removed or removed and adapted reactive multilayer system into the stack.The component can be a connection of components. The first component can be an electronic component or a sensor. For example, the first component may be a semiconductor component or a power semiconductor component, a chip or a wafer. For example, the first component can be embodied as a transistor or diode or as a force sensor. The second component may be a carrier for the first component. For example, the second component may be a carrier for electronic components, for example a printed circuit board or a substrate, for example a copper substrate or ceramic substrate. The second component can also be a machine element, for example a connecting element or an element for transmitting forces or movements, for example a shaft.The reactive multilayer system can be a reactive multilayer film, RMS for short, which can provide immediate heat for a variety of applications in many industries. The reactive multilayer system, for example in the form of a film, can be produced by vapor deposition of thousands of alternating nanoscale layers, for example of aluminum and nickel. The reactive multilayer system can be arranged as a film between the components. The reactive multilayer system can be used to bring about a mechanical and electrically conductive connection between the first component and the second component in response to activation of the reactive multilayer system triggered by the reaction. To initiate the reaction, sufficient thermal energy can be generated in the region of the reactive multilayer system to achieve a temperature required to initiate the reaction of the reactive multilayer system. The cohesive connection can also be referred to as a multilayer bond connection and can be realized by multilayer bonding in response to the initiation of the reaction.The device can be designed as a machine. The devices of the apparatus, here the receiving device, the preparation device and the activation device, and optionally further devices of the apparatus, can represent components of the machine. In this way, the interfaces of the devices with one another can be optimally matched to one another and the apparatus can be made compact.The receiving device can be configured to receive at least one further first component and additionally or alternatively at least one further second component and additionally or alternatively at least one further reactive multilayer system and to store it together with the first component, the second component and the reactive multilayer system. In this way, a plurality of components can be produced in an assembly line.The preparation device is designed according to the invention to form a shape-matched reactive multilayer system using the reactive multilayer system and to arrange it between the components in order to form the stack. As a result, for example, reactive multilayer systems having a standard shape can be accommodated by the accommodation device and can be directly packaged by the preparation device for producing different components. The reactive multilayer system can also be accommodated by the accommodation device in this way, for example, as an endless film or as a part dimensioned sufficiently large for producing a plurality of components. In this case, the activation device can be designed to trigger the reaction of the form-matched reactive multilayer system in order to connect the components to the component.For example, the receiving device can be designed to receive the reactive multilayer system in the form of a film. The preparation device can be configured to trim the film for forming the shape-adjusted reactive multilayer system. In this way, a common shaping of the reactive multilayer system can be processed in an automated manner.The preparation device can be designed to perform cleaning of the first component and additionally or alternatively of the second component and additionally or alternatively of the reactive multilayer system or of the shape-adjusted reactive multilayer system. In this way, the receiving device can be implemented less complex, since any contamination of one of the parts within the receiving device can be removed by means of the preparation device. If the reactive multilayer system is adjusted in its shape by means of the preparation device, cleaning can likewise be expedient in order to remove possible residues of a shaping process.The activation device can be configured to trigger the reaction by an electrical pulse and additionally or alternatively by an optical pulse and additionally or alternatively by a thermal pulse. As a result, different formations of the stack can be activated in a suitable manner in each case. An optical pulse is suitable, for example, if a point to which the pulse is applied is not covered by one of the components. Electrical or thermal activation also enables activation of a reactive multilayer system which is not accessible or is difficult to access from outside the stack.The activation device can be designed to apply a pressure to the stack. The pressure allows the components to be pressed against one another during the reaction of the reactive multilayer system. The formation of the materially bonded connection can thereby be optimized.The apparatus can have a cleaning device. The cleaning device can be designed to clean the component. This makes it possible to remove, for example, impurities caused by the reaction.The apparatus can have a testing device. The testing device can be designed to test a quality of the component and to provide a test signal which indicates a low or high quality of the component under test. In this way, a final check can be carried out automatically.The checking device can be configured to check the quality using an optical and additionally or alternatively electrical and additionally or alternatively tactile checking method. As a result, different properties can be checked reliably.For example, the test device can be designed to sort out the component if the test signal indicates the low quality. This makes it possible to ensure that only fault-free components are processed further.A method for producing a component comprises the following steps:accommodating a first component, a second component and a reactive multilayer system using an accommodating device of an apparatus for producing the component;taking the first component, the second component and the reactive multilayer system from the receiving device and forming a stack using the first component, the second component and the reactive multilayer system, wherein the components are arranged on the outside, using a preparation device of the device for producing the component; andtriggering a reaction of material of the reactive multilayer system located in the stack using an activation device of the device for producing the component in order to connect the components to the component by a cohesive connection.By recourse to devices of a previously mentioned device, the component can be produced in an automated manner.The invention is explained in more detail by way of example with reference to the appended drawings. The following are shown: FIG. 1 shows a schematic illustration of an exemplary embodiment of a device for producing a component; FIG. 2 shows a schematic illustration of a function of an exemplary embodiment of a recording device; FIG. 3 shows a schematic illustration of a function of an exemplary embodiment of a preparation device; FIG. 4 shows a schematic illustration of a function of an exemplary embodiment of an activation device; FIG. 5 shows a schematic illustration of a function of an exemplary embodiment of a cleaning device; FIG. 6 shows a schematic illustration of a function of an exemplary embodiment of a checking device; FIG. 7 shows a schematic illustration of a reaction of an exemplary embodiment of a reactive multilayer system; and FIG. 8 shows a flow diagram of an exemplary embodiment of a method for producing a component.In the following description of preferred exemplary embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the different figures and acting in a similar manner, wherein a repeated description of these elements is omitted.FIG. 1 shows a schematic illustration of an exemplary embodiment of a device 100 for producing a component 101.According to one exemplary embodiment, a first component 102, a second component 104 and a reactive multilayer system 106 are supplied to the device 100. The device 100 is designed to connect the components 102, 104 to the component 101 in an automated manner using the reactive multilayer system 106.According to an embodiment, the first device 102 is an electronic device, for example a semiconductor device, and the second device 104 is a carrier for the first device 102. For example, the second component 104 is a printed circuit board or a substrate, for example a copper substrate. For example, the first component 102 is a chip, merely by way of example a transistor or a diode. According to one exemplary embodiment, after an ignition of the reactive multilayer system 106 and a complete combination of the first component 102, the reactive multilayer system 106 and the second component to form a stack, at least one electrical connection of the first component 102 is permanently electrically and mechanically connected to an electrical contact of the second component 104.According to an alternative exemplary embodiment, the first component 102 is a sensor and the second component 104 is a machine element, for example a shaft for an electric drive or a transmission. For example, the first component 102 is a force sensor which, after the reactive multilayer system 106 has been ignited and the first component 102, the reactive multilayer system 106 and the second component have been completely combined to form a stack, is firmly connected to the second component 104 in order to detect a deformation of the second component 104.According to one exemplary embodiment, the reactive multilayer system 106 has a plurality of alternating nanoscale layers, and is designed to react exothermically in response to the ignition and thereby produce a cohesive connection between the components 102, 104. For example, the reactive multilayer system 106 is embodied as a reactive multilayer film which is placed between the components 102, 104.The apparatus 100 has a recording device 110, a preparation device 112 and an activation device 114.The receiving device 110 is configured to receive the first component 102, the second component 104 and the reactive multilayer system 106. Optionally, the receiving device 110 is designed to receive a plurality of first components 102 and a plurality of second components 104. In this case, it is also possible for different first components 102 and additionally or alternatively different second components 104 to be accommodated, with the result that different components 101 can be produced. Optionally, the receiving device 110 is designed to receive a plurality of reactive multilayer systems 106 or a reactive multilayer system 106 sufficient for producing a plurality of components 101.The preparation device 112 is configured to remove the first component 102, the second component 104 and the reactive multilayer system 106 from the receiving device and to form a stack using the first component 102, the second component 104 and the reactive multilayer system 106. In the stack, the devices 102, 104 are disposed outboard so that the devices 102, 104 can be connected using the reactive multilayer system 106. For this purpose, the preparation device 112 according to an exemplary embodiment comprises a stacking device, for example in the form of a placement robot.If the first component 102, the second component 104 and the reactive multilayer system 106 are already present in the receiving device 110 in a directly processable form, the preparation device 112 is configured to stack the first component 102, the second component 104 and the reactive multilayer system 106 directly one on top of the other after optional cleaning in order to produce a stack of the first component 102, the second component 104 and the reactive multilayer system 106 arranged between the components 102, 104.If, for example, the reactive multilayer system 106 is not yet present in the receiving device 110 in a directly processable form, for example because it has a non-matching form, the preparation device 112 is configured, according to one exemplary embodiment, to form the reactive multilayer system 106 into a matched reactive multilayer system and, after optional cleaning, to arrange it directly between the components 102, 104 in order to produce the stack. For this purpose, the preparation device 112 has, for example, a forming device. If the reactive multilayer system 106 is present in the receiving device 110 in the form of a film, the preparation device 112 is configured, according to one exemplary embodiment, to trim the film for forming the shape-adjusted reactive multilayer system. According to one exemplary embodiment, the preparation device 112 is designed to form a plurality of shape-matched reactive multilayer systems from the film and to arrange them between the components 102, 104. As a result, the components 102, 104 can be connected to one another via a plurality of separate materially bonded connections.According to one exemplary embodiment, the preparation device 112 comprises a cleaning device which enables cleaning of the parts removed from the receiving device 110 or cleaning of a shape-adjusted reactive multilayer system created by the preparation device 112 before the stack is created.The activation device 114 is designed to trigger a reaction of the reactive multilayer system located within the stack. For example, the activation device 114 comprises a voltage source and electrical contacts via which a voltage generated by the voltage source can be applied to the stack in order to bring about a current flow and thus heating of the reactive multilayer system 106 or an ignition spark in the region of the reactive multilayer system 106. Additionally or alternatively, the activation device 114 comprises, for example, a laser source in order to direct a laser beam onto the reactive multilayer system 106. Additionally or alternatively, the activation device 114 comprises, for example, a heating device in order to heat the reactive multilayer system 106 so strongly that the reaction starts.According to one exemplary embodiment, the activation device 114 is designed to apply a pressure to the stack during the reaction of the reactive multilayer system 106 in order to press the components 102, 104 against one another. For example, the activation device 114 comprises for this purpose a suitable application device, for example a plunger, which presses against one of the components 102, 104.According to one exemplary embodiment, the apparatus 100 comprises a cleaning device 116, which is designed to clean the component 101 after the components 102, 104 have been bonded together in a materially integral manner.According to one exemplary embodiment, the apparatus 100 comprises a checking device 118 which is designed to check a quality of the component 101. For example, the test device 118 is designed to provide a test signal which indicates a low or high quality of the component 101 which is being manufactured. For testing the component 101, the testing device 118 is designed, for example, to carry out an optical, electrical or tactile test method. If the component 101 does not pass the test, the testing device 118 is designed, according to one exemplary embodiment, to sort out the corresponding component 101.According to one exemplary embodiment, the devices 110, 112, 114 together with the optional devices 116, 118 represent a composite and are combined, for example, into one machine. Such a machine is distinguished, for example, by a housing, by which the devices 110, 112, 114, 116, 118 are accommodated, or by a carrier frame, by which the devices 110, 112, 114, 116, 118 are held.According to one exemplary embodiment, the device 100 is designed to use reactive multilayer systems for connecting two parts, here the components 102, 104, to solderable surfaces. Such a bonding process, for example in power electronics or when pressure sensors or force sensors are used, consists of many individual production steps. The device 100, for example in the form of a machine, enables a combination of these steps required for the RMS bond production method.In order to establish a corresponding establishment of an electrically and thermally conductive RMS connection between the components 102, 104, the apparatus 100 is configured to automatically execute all or at least some of the following steps according to various exemplary embodiments.forming a shape-matched reactive multilayer system, for example by cutting an RMS film to the required size.Joining together the parts to be joined, here the components 102, 104 and the reactive multilayer system 106, for example by bonding a bare chip in electronics to a substrate using an RMS film.applying a bonding pressure.Activation of the reactive multilayer system 106, for example in the form of a reactive multilayer film, by a small local energy pulse.Optionally, cleaning and testing of the manufactured component 101.Using the apparatus 100, it is advantageously possible to avoid the individual processes having to be carried out manually and individually. By carrying out the individual processes in an automated manner instead, the time required can be kept low. By means of the automated execution, labor-intensive processes can also be carried out cost-effectively, without errors and reliably. The automated execution can avoid the individual processes varying from beginning to end, as a result of which the resulting connection quality is reproducible. Overall, the production of the RMS connection using a machine for carrying out an optimized RMS bond production process is very cost-effective.With reference to the following FIGS. 2 to 6, exemplary embodiments of individual devices of the device 100 are illustrated by way of example for an exemplary embodiment in which the first component 102, e.g. a bare chip, which is connected to the reactive multilayer system 106, for example an RMS foil, is connected to the second component 104, for example a substrate. In this case, the devices of the device 100 designed as a machine according to an exemplary embodiment fulfil the subfunctions for producing an RMS bond described with reference to FIGS. 2 to 6.FIG. 2 shows a schematic illustration of a function of an exemplary embodiment of a receiving device 110 which is part of an exemplary embodiment of the apparatus described with reference to FIG. 1, for example.According to one exemplary embodiment, the receiving device 110 comprises a first magazine 222 from which at least one first component 102, here a plurality of first components 102, 202, 203, have been received, a second magazine 224 from which at least one second component 104, here a plurality of second components 104, 204, 205, have been received, and a third magazine 226 from which at least one reactive multilayer system 106, here a plurality of reactive multilayer systems 106, 206, 207, have been received. As indicated by arrows, the corresponding parts can be output to the downstream preparation device if necessary.According to one exemplary embodiment, the individual parts required for producing the component are handled by means of the receiving device 110. For this purpose, the receiving device 110 comprises, as part of the machine mentioned with reference to FIG. 1, via an inlet for the individual parts of the RMS bonding process, here the first component 102, for example a solderable part, e.g. a naked chip (engl. Bare Die), the reactive multilayer system 106, for example an RMS foil, and the second component 104, for example a solderable substrate. These parts can be stored in a defined manner in a magazine or magazines 222, 224, 226.FIG. 3 shows a schematic illustration of a function of an exemplary embodiment of a preparation device 112, which is part of an exemplary embodiment of the apparatus described with reference to FIG. 1, for example.The preparation device 112 is designed to form a stack of a first component 102 removed from the receiving device, a second component 104 removed from the receiving device and a shape-adjusted reactive multilayer system 306. In this case, the shape-matched reactive multilayer system 306 is arranged between the components 102, 104. According to one exemplary embodiment, the preparation device 112 for producing the stack comprises a stacking device 330, for example in the form of a pick and place robot.In order to form the shape-adjusted reactive multilayer system 306, the preparation device 112 has a forming device 332 which is designed to form a reactive multilayer system removed from the receiving device in such a way that it is suitable for arrangement in the stack.For example, the forming device 332 includes a cutting tool or punch to cut the reactive multilayer system removed from the receiving device to a suitable size.According to an embodiment, the preparation device 112 comprises a cleaning device 334 configured to clean the adjusted reactive multilayer system 306 before the adjusted reactive multilayer system 306 is arranged in the stack. Additionally or alternatively, the cleaning device 334 is designed to clean at least one of the components 102, 104 removed from the receiving device.If the reactive multilayer system removed from the receiver already has the appropriate shape, the reactive multilayer system can be arranged directly in the stack using the stacking device 330. In this case, the forming device 332 is not required.According to an embodiment, the stacking device 330 is configured to select and place the individual parts suitable for the stack.According to one exemplary embodiment, a preparation process takes place by means of the preparation device 112. The preparation facility 112 as part of the machine takes over the preparation of the RMS bond manufacturing process. This preparation can consist of the following steps: Automated cutting of the reactive multilayer system, for example of the RMS film, to the required size. Surface cleaning and inspection of the first component 102, for example the solderable part, the reactive multilayer system or the shape-matched reactive multilayer system 306, and of the second component 104, for example in the form of a solderable target substrate. Carrying out an automated placement process for the mounting of the parts, here the first component 102, the reactive multilayer system or the shape-matched reactive multilayer system 306 and the second component 104, for example by the placement robot.FIG. 4 shows a schematic illustration of a function of an exemplary embodiment of an activation device 114, which is part of an exemplary embodiment of the apparatus described with reference to FIG. 1, for example.The activation device 114 is configured to form the component 101 from the stack of the first component 102, the reactive multilayer system or the shape-matched reactive multilayer system 306 and the second component 104, in which the components 102, 104 are bonded together using an activated reactive multilayer system 406. The activated reactive multilayer system 406 has thereby originated from a reaction of the reactive multilayer system arranged between the components 102, 104 or of the shape-adjusted reactive multilayer system 306.For triggering the reaction, the activation device 114 has an ignition device 440, which is designed to generate, for example, an electrical, optical or thermal pulse 442, by means of which sufficient heat is provided for activating the reactive multilayer system or the shape-matched reactive multilayer system 306.According to one exemplary embodiment, the preparation device 112 comprises a loading device 444, with which a pressure 446 is exerted on the stack already before or at least during the reaction of the reactive multilayer system or the shape-adjusted reactive multilayer system 306, by means of which pressure the components 102, 104 are pressed against one another.According to one exemplary embodiment, an adhesion and activation process takes place by means of the activation device 114. The activator 114 as part of the machine may perform the bonding / activation process of the RMS bond fabrication process. This gluing / activation process can consist of the following steps: defined and controlled application of a bonding pressure, here the pressure 446. RMS activation by the small pulse 442 of local energy from electrical, optical or thermal sources, here the igniter 440.According to one embodiment, the machine or specifically the activation means 114 comprises suitable means or sub-function for preventing splashing during the reactive multi-layer bonding.FIG. 5 shows a schematic illustration of a function of an exemplary embodiment of a cleaning device 116, which is part of an exemplary embodiment of the apparatus described with reference to FIG. 1, for example.According to one exemplary embodiment, the cleaning device 116 is designed to clean the component manufactured using the activation device using a cleaning agent 550 and additionally or alternatively using compressed air 552.According to one exemplary embodiment, a cleaning process takes place by means of the cleaning device 116: the cleaning device 116 as part of the machine can assume the post-processing, e.g. the cleaning of the RMS bond. This cleaning can be effected, for example, with the compressed air 552, for example with compressed air and / or with the cleaning agent 550.FIG. 6 shows a schematic illustration of a function of an exemplary embodiment of a checking device 118 which is part of an exemplary embodiment of the apparatus described with reference to FIG. 1, for example.The testing device 118 is designed to test the component manufactured using the activation device and optionally cleaned using the cleaning device. For example, the checking device 118 is designed to provide either a checking signal which indicates a high quality 660 or a low quality 662 of the component depending on a result of the checking. For example, the testing device 118 is designed to test the component using an optical, electrical or tactile test method.According to one exemplary embodiment, a process of quality control takes place by means of the checking device 118: the checking device 118 as part of the machine can take over the process of quality control. This process may include inspection methods such as optical inspection, electrical function inspection, tactile inspection, scanning acoustic tomography (SAT), and / or X-ray. The measured quality features can be assigned to the product, here to the component, and waste parts can be automatically sorted out.Advantageously, the machine for optimizing the RMS bond production process can combine all the sub-functions described with reference to FIGS. 2 to 6 and thus offer a high efficiency, an automated production, a high process safety, a good reproducibility, a good scalability and a high cost efficiency in mass production.FIG. 7 shows a schematic illustration of a reaction of an embodiment of a reactive multilayer system 106 to an activated reactive multilayer system 406, as is used for example for producing a component as shown in FIG. 1. The reactive multilayer system 106 is constructed, for example, from a plurality of first layers 770 and a plurality of second layers 772, which are arranged alternately, wherein optionally respectively mixed regions 774 are located between adjacent layers 770, 772.Schematically shown is a position of activation, exemplarily in the form of a spark representative pulse 442. Starting from the position of activation, the material of the reactive multilayer system 106 reacts to form the reacted material of the activated reactive multilayer system 406. A corresponding propagation direction 776 is indicated by an arrow.The reactive multilayer system 106 is a reactive multilayer film, according to one embodiment. This is a film that provides immediate heat for a variety of applications in many industries. This reactive multilayer film is produced by vapor deposition of thousands of alternating nanoscale layers, which are schematically represented in FIG. 7 by the layers 770, 772 and consist, for example, of aluminum (Al) and nickel (Ni). Activation is triggered by a small local energy pulse from an electrical, optical, or thermal source, as schematically illustrated by pulse 442 in FIG. 7. The reactive multilayer system 106 reacts exothermically to generate precise local heat up to 1500° C. in fractions of a second.In this way, a both electrically and thermally conductive connection can be established, e.g. between a bare chip in electronics and a leadframe, a packaged chip and a circuit board, etc.-i.e. generally a connection between two parts, which are here exemplarily referred to as devices.FIG. 8 shows a flow diagram of an exemplary embodiment of a method for producing a component. The method can be implemented, for example, using the apparatus described with reference to the preceding figures, for example in the form of a machine, in order to produce a component, as is shown, for example, in FIG. 1.In a step 801, a first component, a second component and a reactive multilayer system are picked up for this purpose using a pick-up device, as described, for example, with reference to FIG. 2.In a step 803, the first component, the second component and the reactive multilayer system are removed from the receiving device, a stack is formed using these parts and a preparation device, as described, for example, with reference to FIG. 3. Optionally, the reactive multilayer system is processed, for example transformed, before it is used to form the stack.In a step 805, a reaction of the material of the reactive multilayer system located in the stack is triggered using an activation device, as described, for example, with reference to FIG. 4. As a result, the components are connected to form the component in a materially integral manner.Optionally, the component is subsequently cleaned in a step 807 and likewise optionally subjected to quality control in a step 809.Reference numerals denote reference numerals100 Apparatus 101 component 102 first component 104 second component 106 reactive multilayer system 110 receiving device 112 preparation device 114 activation device 116 cleaning device 118 checking device 202, 203 further first components 204, 205 further second components 206, 207 further reactive multilayer systems 222 first magazine 224 second magazine 226 third magazine 306 shape-matched reactive multilayer system 330 stacking device 332 forming device 334 cleaning device 406 activated reactive multilayer system 440 ignition device 442 pulse 444 application device 446 pressure 550 cleaning means 552 compressed air 660 high quality 662 low quality 770 first layer 772 second layer 774 mixed regions 776 spreading direction 801 step of receiving 803 step of removing 805 step of triggering 807 step of cleaning 809 step of checking

Claims

Apparatus (100) for producing a component (101), wherein the apparatus (100) has the following features: a receiving device (110) which is designed to receive a first component (102), a second component (104) and a reactive multilayer system (106); a preparation device (112) which is designed to remove the first component (102), the second component (104) and the reactive multilayer system (106) from the receiving device (110) and to form a stack using the first component (102), the second component (104) and the reactive multilayer system (106), wherein the components (102, 104) are arranged on the outside; and an activation device (114) which is designed to trigger a reaction of material of the reactive multilayer system (106) arranged in the stack in order to connect the components (102, 104) to the component (101) by a cohesive connection, characterized in that the preparation device (112) is designed to form a shape-matched reactive multilayer system (306) using the reactive multilayer system (106) and to arrange said reactive multilayer system between the components (102, 104) in order to form the stack.The apparatus (100) according to claim 1, wherein the apparatus (100) is designed as a machine and the receiving device (110), the preparation device (112) and the activation device (114) represent components of the machine.Device (100) according to one of the preceding claims, wherein the receiving device (110) is configured to receive and store at least one further first component (202) and / or at least one further second component (204) and / or at least one further reactive multilayer system (206) together with the first component (102), the second component (104) and the reactive multilayer system (106).Apparatus (100) according to one of the preceding claims, wherein the receiving device (110) is configured to receive the reactive multilayer system (106) in the form of a film, and wherein the preparation device (112) is configured to cut the film for forming the shape-adjusted reactive multilayer system (306).The device (100) according to any one of the preceding claims, wherein the activation device (114) is configured to trigger the reaction by an electrical, optical or thermal pulse (442).The apparatus (100) according to any one of the preceding claims, wherein the activation means (114) is configured to apply a pressure (446) to the stack.Apparatus (100) according to one of the preceding claims, having a cleaning device (116) which is designed to clean the component (101).Apparatus (100) according to one of the preceding claims, having a checking device (118) which is designed to check a quality of the component (101) and to provide a checking signal indicating a low quality (662) or high quality (660).Method for producing a component (101), the method comprising the following steps: receiving (801) a first component (102), a second component (104) and a reactive multilayer system (106) using a receiving device (110) of an apparatus (100) for producing the component (102); removing (803) the first component (102), the second component (104) and the reactive multilayer system (106) from the receiving device (110) and forming a stack using the first component (102), the second component (104) and the reactive multilayer system (106), wherein the components (102, 104) are arranged on the outside, using a preparation device (112); and triggering (805) a reaction of material of the reactive multilayer system (106) located in the stack using an activation device (114) in order to connect the components (102, 104) to the component (101) by a cohesive connection.

Images