Method for attaching highly wear-resistant materials to borehole wear components

Abstract

Drilling tool set, including: a plug section (306) located within an outer surface of the borehole tool; and a construct (202) of the bonded diamond die (BDC), including: a BDC element (104); and an encapsulation layer (106) that at least partially encapsulates the BDC element (104), wherein the BDC construct (202) is arranged within the plug section (306) of the borehole tool, characterized in that the drilling tool further comprises: a tungsten carbide binder fabric (510) that is chemically coupled to a surface of the plug section (306) and forms a first layer thereon; and a metal matrix fabric that is chemically coupled to the first layer and forms a second layer on the surface of the plug section (306).

Description

AREA OF REVELATION

[0001] This disclosure relates to the improvement of the thermal stability of superhard bonded diamond cutting elements used in wear, drilling, drawing, and other downhole tools where superhard properties are required. In particular, this disclosure generally relates to systems and methods for hard coating (mounting) and brazing fully or partially encapsulated thermally stable bonded diamond onto downhole tool components. BACKGROUND

[0002] A variety of bonded diamond compacts (BDCs) can be used in downhole tooling components. BDCs are commonly used in drill string mud motor bearings, push-the-bit pads, and drill cutting elements. Generally, these earlier BDC designs lack a thermally stable element in the area adjacent to the cutting surface. Consequently, they tend to have a thermal expansion mismatch, which can cause the interstitial metal to exert high stress on the diamond lattice. This, in turn, can lead to diamond-to-diamond bond failure and shorten the compact's lifespan. Furthermore, earlier BDC designs tend to incorporate a non-thermally stable element that readily leachs carbon from the diamond surface at elevated temperatures, resulting in the conversion of diamond to graphite, which again leads to a reduced compact lifespan.

[0003] Conventional BDCs are formed by subjecting diamond or other superhard particles (such as cubic boron nitride (CBN) and the like) to high temperatures and pressures in the presence of a metallic catalyst to form a polycrystalline matrix of interconnected particles. This bonding process is typically referred to as "sintering." The metallic catalyst typically remains within the polycrystalline diamond matrix. Well-known polycrystalline diamond (PCD) elements typically consist of an opposing array of polycrystalline diamond integrally bonded to a substrate of a less hard material, such as cemented tungsten carbide. This material is often referred to as a polycrystalline diamond compact (PDC).PDC is commonly used in borehole tools such as borehole drills (including drag drills, also known as fixed cutters; impact drills and gear drills, also known as rock drills), reamers, stabilizers and tool assemblies.

[0004] Thermal stability is desirable in a polycrystalline diamond (PDC) drill bit for hard rock drilling applications. High temperatures are generated at the leading edge of the PDC tool when cutting rock. These high temperatures can lead to tool degradation through various mechanisms, two of which are graphitization of the polycrystalline diamond in contact with the interstitial metal catalyst and thermal expansion of the interstitial metal catalyst. In the graphitization mechanism, carbon readily dissolves from the diamond surface when the cutting tip temperature rises above approximately 450 °C. This carbon dissolution is due to the increased saturation of carbon in the metallic catalyst with increasing temperature. The dissolved carbon takes the form of graphite because the PDC tool is operating outside the thermodynamic stability range of diamond.In this thermal expansion mechanism, the thermal expansion of the metallic catalyst is many times greater than that of diamond for a given temperature increase. This mismatch in thermal expansion causes the interstitial metal to exert high stress on the diamond lattice. These stresses can lead to the failure of diamond-to-diamond bonds at or above approximately 700 °C and a shortened lifespan of the catalyst body.

[0005] When BDCs are mounted in plugs located in the outer surface of drill bit components, a process known as hard plating (mounting) is used. Typical hard and induction brazing temperatures for mud motor bearings, push-the-bit pads, and drill bits exceed 800°C. These high temperatures can affect the seat and lead to significant thermal degradation of the BDC.

[0006] US 2011 / 0056753A1 describes an ultra-hard insert for use in a drill bit and discloses features that fall under the preamble of claim 1.

[0007] The invention is defined by the independent claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 contains a perspective view and three orthographic views of an exemplary BDC construct with a BDC element that is completely encapsulated by an encapsulation layer. Fig. 2A is a cross-sectional view of a BDC construct that has a generally cylindrical geometry. Fig. 2B is a perspective view of the BDC construct of Fig. 2A. Fig. Figure 3 is a perspective view of a push-the-bit pad containing BDC constructs according to various embodiments. Fig. Figure 4 is a schematic perspective view of a mud engine bearing containing BDC constructs according to various embodiments. Fig. Figure 5A is a cross-sectional view of a push-the-bit pad incorporating a tungsten carbide binder fabric, a matrix fabric, and BDC constructs according to various embodiments. Fig. 5B and Fig. 5C are perspective views of the push-the-bit pad or matrix fabric of the Fig. 5A. Fig. Figure 6 is a flowchart of a process for manufacturing a wear-resistant component of a borehole tool. Fig. Figure 7 is a perspective view of BDC constructs, representing different degrees of partial encapsulation according to various embodiments. Description of the illustrative embodiments

[0008] Embodiments of the present disclosure relate to the encapsulation of superhard compact materials such as bonded diamond powder or bonded cubic boron nitride powder with an encapsulation layer to improve thermal stability. The combination of the encapsulation layer and the bonded compact results in a bonded compact structure that can be more easily attached to mud motor bearings, push-the-bit pad assemblies, and drill assemblies. In some embodiments, the bonded compact structure may be formed from a bonded diamond compact (BDC). In some embodiments, the bonded compact structure may be formed from a bonded cubic boron nitride compact (boron nitride compact).

[0009] Fig. Figure 1 contains a perspective view and three orthographic views of an exemplary BDC construct 102 with a BDC element 104 that is completely encapsulated by an encapsulation layer 106. The BDC construct 102 contains a BDC element 104 with an outer surface 104a. In one or more embodiments, the material composition of the BDC element 104 comprises silicon carbide (SiC)-bonded diamonds or polycrystalline diamonds. In one or more embodiments, the encapsulation layer 106 completely encapsulates the outer surface 104a of the BDC element 104. In one or more embodiments, the encapsulation layer 106 comprises tungsten carbide (WC) with a variety of other binder matrices (such as Cu, Ni, Zn, Sn, etc.).In one or more embodiments, the encapsulation layer 106 can contain a mixture of boron nitride and diamond, a mixture of tungsten and carbon, a mixture of two different metals, or a mixture of a polymer and a metal. In one or more embodiments, the encapsulation layer 106 can form an insulating layer or a thermal barrier over the BDC element 104. In one or more embodiments, the encapsulation layer 106 can have a lower thermal conductivity or a higher specific heat capacity compared to the BDC element 104.

[0010] The encapsulation layer 106 comprises an outer surface 106a, as shown. In one or more embodiments, the encapsulation layer 106 can have a thickness T1 of about 1.0 mm to 1.5 mm. In one or more embodiments, the thickness T1 can be in the range of about 0.5 mm to about 2.0 mm. In one or more embodiments, the thickness T1 can be scaled to a dimension of the BDC structure 102, for example, in the range of about 10% to about 25% of a length L1, width W1, or height H1 of the BDC structure 102, as shown. In one or more embodiments, the thickness T1 can vary over the outer surface 104a. In one or more embodiments, a portion of the encapsulation layer 106 adjacent to an edge 104b can be thinner than portions of the encapsulation layer 106 adjacent to edges 104c and 104d.In one or more embodiments, the encapsulation layer 106 can be thicker on one side of the BDC construct 102 than on an opposite side of the BDC construct 102.

[0011] Fig. Figure 2A shows a cross-sectional view of a fully encapsulated BDC construct 202 under high isostatic pressure. Fig. Figure 2B shows a perspective view of the cut BDC construct 202 from Fig. 2A. The BDC construct 202 comprises a BDC 204 with an outer surface 204a, which is surrounded by an encapsulation layer 206 with an outer surface 206a. The BDC constructs 202 can contain any of the features described for the BDC constructs 102. Likewise, the encapsulation layer 206 can contain any of the materials or other features described for the encapsulation layer 106.

[0012] In one or more embodiments, the outer surface 204a comprises a surface feature to enhance the surface contact between the outer surface 204a and the encapsulation layer 206. The surface feature can, without limitation, comprise a pattern, texture, topography, surface finish, or surface chemistry. In one or more embodiments, the surface feature can improve the bond between the encapsulation layer 206 and the outer surface 204a, thereby helping to secure the encapsulation layer 206 to the outer surface 204a. This results in an interface between the outer surface 204a and the encapsulation layer 206 with improved bonding compared to a flat outer surface 204a without the surface feature.In one or more embodiments, the surface feature may include a physical roughness or other topographic feature to enhance surface contact, one or more notches, a surface chemistry, or a combination thereof. In one or more embodiments, the surface chemistry may form at least one ionic, covalent, or metallic bond between the outer surface 204a and the encapsulation layer 206. In one or more embodiments, the BDC construct 202 may have a cylindrical shape. Although the BDC construct 202 is shown to have a cylindrical shape with a diameter D1, it is understood that the BDC construct 202 can be manufactured and / or processed to have a variety of shapes, including, but not limited to, ovals, spheres, cylinders, trapezoids, rectangles, and squares.The encapsulation layer 206 can have a thickness T2, and the outer surface 206a can have an outer diameter D2. In one or more embodiments, the thickness T2 of the encapsulation layer 206 can be non-uniform along a longitudinal central axis. In other embodiments, the thickness T2 can be non-uniform along a radial axis.

[0013] Fig. Figure 3 shows an application using BDC constructs 202. In this embodiment, a push-the-bit pad 304 is equipped with fully or partially encapsulated BDC constructs 202. The push-the-bit pad 304 has a plug section 306 with a first surface 306a. The plug section 306 contains cavities into which the BDC constructs 202 are received, as described in more detail below. The BDC constructs 202 can be arranged on the first surface 306a and / or in the cavities. The plug section 306 can generally define a radial outer surface of a push-the-bit pad 304 and is thus oriented towards the borehole wall when used in a drilling operation. Additionally, the first surface 306a can be located on the plug section 306 facing the borehole wall during drilling. In one or more embodiments, the BDC constructs 202 exhibit a high packing density.In one or more embodiments, the BDC constructs 202 can have a round shape. In one or more embodiments, the BDC constructs 202 can substantially cover the entire first surface 306a. In one or more embodiments, the encapsulation layer 106 on the BDC constructs 202 can promote the adhesion of the BDC constructs 202 to the first surface 306a. In one or more embodiments, furnace brazing can be used to bond the BDC constructs 202 to the first surface 306a.

[0014] Fig. Figure 4 is a schematic perspective view of a mud motor bearing 404 containing BDC structures 202. As stated above, the BDC structures 202 can incorporate any of the features of the BDC structures 102. In this embodiment, a mud motor bearing 404 is equipped using fully or partially encapsulated BDC structures 202. The mud motor bearing 404 has a bearing section 406 with a bearing surface 406a. The BDC structures 202 can be arranged on the bearing surface 406a. In one or more embodiments, the BDC structures 202 can have a high packing density. In one or more embodiments, the BDC structures 202 can have a round shape. In one or more embodiments, the BDC structures 202 can substantially cover the entire bearing surface 406a.In one or more embodiments, the encapsulation layer 106 on the BDC structures 202 can promote the adhesion of the BDC structures 202 to the bearing surface 406a.

[0015] The Fig. Figures 5A-5C show another application using BDC constructs 202. In this embodiment, a push-the-bit pad 504 is populated using fully or partially encapsulated BDC constructs 202. The push-the-bit pad 504 has a plug section 506 comprising a first surface 506a and a second surface 506b. The second surface 506b may be located adjacent to the first surface 506a. The second surface 506b may form an edge of the plug section 506. The first surface 506a may be recessed relative to the second surface 506b. The plug section 506 may be located in a portion of the push-the-bit pad 504 adjacent to the bore. The first and second surfaces 506a, 506b can be arranged on the plug section 506 facing the borehole wall during drilling.

[0016] In one or more embodiments, as shown in 5A, the plug section 506 comprises plugs 508 formed by the first surface 506a. It is understood that the plugs 508 can be formed using a variety of manufacturing processes, including, without limitation, molding, casting, machining, welding, and additive manufacturing. In one or more embodiments, the plugs 508 can be produced by recessing the first surface 506a. The plugs 508 can have a circular or polygonal shape. The plugs 508 comprise a first or bottom surface 508a and a second or side surface 508b. As shown in Fig. As shown in Figure 5A, the BDC constructs 202 are arranged in the plugs 508. In one or more embodiments, the BDC constructs 202 and the plugs 508 can each have a circular shape. In one or more embodiments, the BDC constructs 202 and the plugs 508 can substantially cover the entire first surface 506a. In one or more embodiments, the encapsulation layer 106 on the BDC constructs 202 can promote the adhesion of the BDC constructs 202 to the first and second surfaces 508a, 508b of the plugs 508. In one or more embodiments, furnace brazing can be used to bond the BDC constructs 202 to the first and second surfaces 508a, 508b.

[0017] In the Fig. In the embodiment shown in Figures 5A to 5C, the hard coating process can be carried out similarly to a conformal cladding (fabric-based) process to make batch processing of the Best Push-the-Bit Pad 504 more practical. During a conformal cladding process, both a WC-based material or binder and a metal matrix material can each be preformed as a fabric. The binder and the metal matrix material can be applied to wear surfaces, with the metal matrix material positioned over the binder. The resulting construct can be furnace brazed to produce fully metallurgically bonded, hard opposing layers consisting of hard WC particles surrounded by a relatively tough and wear-resistant metal matrix.

[0018] With renewed reference to Fig. 5A After the BDC structures 202 are installed in the plugs 508, a binder fabric 510 can be arranged on the first surface 506a. In one or more embodiments, the binder fabric 510 can contain holes 510a that contact a side surface 202a of the BDC structures 202. In one or more embodiments, the holes 510a can correspond to a shape of the BDC structures 202 and / or the plugs 508. In one or more embodiments, the binder fabric can be made of tungsten carbide. After the binder fabric 510 is installed, a matrix fabric 512 can be arranged over the binder fabric 510. In one or more embodiments, the matrix fabric 512 can contain holes 512a that contact the side surface 202a of the BDC structures 202. In one or more embodiments, the holes 512a can match the shape of the BDC constructs 202, the plugs 508 and / or the holes 510a.In one or more embodiments, the matrix fabric can be made of a metal. After the matrix fabric 512 is installed, the push-the-bit pad 504 can be placed in an oven. High temperatures in the oven can chemically bond the BDC constructs 202, the push-the-bit pad 504, the binder fabric 510, and the matrix fabric 512 together, as shown in the perspective view in Figure 1. Fig. 5B shown. Fig. Figure 5C shows an embodiment of the matrix fabric 512.

[0019] Using the above with reference to the Fig. The batch-based stack processing process described in sections 5A-5C can be used to manufacture wear-resistant push-the-bit pads 504, which offer lower costs, improved reliability, and longer service life compared to push-the-bit pads manufactured using other processes. The same process can be applied in other applications, including, without limitation, mud motor bearings and stabilizer wear surfaces.

[0020] Other placement methods can be used to attach the BDC constructs 202 to the push-the-bit pad 504 while the first surface 506a is being populated. For example, laser, rope and rod placement, induction soldering, and infiltration processes can be employed.

[0021] In a laser placement process, a laser beam can be focused onto a specific spot size on the first surface 506a. A hard metal powder, e.g., a WC powder, can be conveyed in an inert gas stream to the focused spot to be deposited through nozzles onto the first surface 506a. The laser beam and nozzles can be moved across the first surface 506a in a specific pattern that cuts the constructs 202 into the plug 508. The laser energy binds the powder to itself, the constructs 202, and the first surface 506a of the pad 504.

[0022] In a rope placement process, a rope is constructed with a metal wire core and an outer sheath material comprising a component mixture of tungsten carbide particles, alloying elements, and binders. The first surface 506a and the BDC constructs 202 can be populated by progressively melting the rope and allowing the molten material to solidify. An oxyacetylene torch can be used to heat the rope, the pad 504, and the constructs 202. In a rod placement process, the component materials can be supplied in the form of an elongated rod. The component materials can be deposited onto the pad 504 by brazing or welding.For example, in some embodiments the rod can be used as an electrode in an arc welding process in which an arc is induced between the rod and the pad 504 to provide heat for melting and bonding the surface materials to the pad.

[0023] In an induction soldering process, an induction coil can be used to provide an electromagnetic field without touching the pad 504. The electromagnetic field can heat ferrous material in a binder matrix applied to the first surface 506a and the constructs 202. In an infiltration process, a mold can be formed around the pad 504, and a pick-and-place powder can be placed into a cavity defined between the pad and the mold. Subsequently, a molten binder can be allowed to flow into the mold to bond the pick-and-place powder to the first surface 506a and the constructs 202. In other embodiments, a spray-and-melt process as described below can be used.

[0024] In Fig. 6 is a method 600 for forming a wear surface for a borehole tool in conjunction with the preceding Fig. 1, Fig. 2, Fig. 3, Fig. 4 to Fig. 5 shown. Without limiting the foregoing, the wear surface can be a push-the-bit pad 304, 504, a bearing of a mud motor 404, or a surface of a drill assembly. In a first step 602, which relates jointly to the Fig. Referring to 2A-2B and 6, a diamond powder matrix is ​​formed into the BDC element 204. The formation of the BDC element 204 can be achieved by sintering the diamond powder matrix. While a diamond powder matrix is ​​described, other materials can be used to form the BDC element 204 in other embodiments. In a second step 604, the BDC element 204 is placed into a mold, and a metallic encapsulation material is added to the mold. The mold forms the shape of the encapsulation material around the BDC element 204, forming the encapsulation layer 206. Next, the encapsulation layer 206 is integrally bonded to the BDC element 204 using high isostatic pressure (HIP), as shown in step 606, thereby forming the BDC construct 202, as shown in the Fig. Figures 2A-2B show that in some embodiments, the BDC element 204 is completely encapsulated by the encapsulation layer 206. In other embodiments, the BDC element 204 is partially encapsulated by the encapsulation layer 206. In one or more embodiments, the degree of encapsulation of the BDC construct 202 can be selected based on the density of the BDC constructs 202 on the wear surface and on the temperature used during attachment. The degree of partial encapsulation of the BDC element 204 can vary, for example, greater than 66%, greater than 75%, greater than 80%, or greater than 90%, with only a top or distal largest portion exposed. The exposed portion can be the least likely part to be affected by temperatures applied adjacent to the base of the BDC construct 202 during attachment to the drill tool.In step 608, the BDC structure 202 is formed and prepared for attachment to the wear surface of the drill tool. Step 608 may include forming the encapsulation layer 206 using a mill, a laser, or electrostatic discharge. In one or more embodiments, the forming step 608 may be combined with the HIP process 606. In step 610, the BDC structure 202 is positioned on the wear surface of the drill tool, for example, on the first surface 306a of the push-the-bit pad 304. Fig. 3) or on the support surface 406a of the mud motor bearing 404 ( Fig. 4) In one or more embodiments, the process can proceed through optional steps 612 and 614, which complement the one described in the Fig. Figures 5A to 5C describe a similar process using conformal clothing. In step 612, the binder fabric 510 is positioned on the wear surface of the drill tool, such as the first surface 506a of the push-the-bit pad 504. In step 614, the matrix fabric 512 is positioned over the binder fabric 510. Finally, in step 616, the drill tool component is preferably tightened and / or brazed to permanently attach the BDC construct 202 to the wear surface of the drill tool component, such as with respect to the first surface 306a of the push-the-bit pad 304 ( Fig. 3) or the bearing surface 406a of the mud motor bearing 404 ( Fig. 4) In one or more embodiments, such as the one described in the Fig. As shown in Figures 5A to 5C, the wear surface can be the first surface 506a of the push-the-bit pad 504 and the binder fabric 510, and a matrix fabric 512 can be added to the BDC construct 202. In one or more embodiments, the WC-based material and the matrix material can be sprayed onto the wear surface of the drill tool component. Spraying can combine steps 612 and 614, allowing the WC-based material and the matrix material to be applied simultaneously. The above is referred to as the spray-and-melt process. In a spray-and-melt process, a combustion powder spray gun is generally used to deposit a wide variety of powders or other materials onto a substrate, first surface 506a ( Fig. 5A). The powders can contain compositions of Ni, Cr, Co, Bo, Fe, W, WC, and diamond powders in various mixtures with each other and with a binder matrix powder such as Cu, Ni, Zn, Sn, etc. Once the powder has been deposited onto a component to a predetermined thickness, a burner or furnace can be used to heat the component, in some cases to approximately 2000 degrees Fahrenheit. The heat causes the powdered materials to fuse with each other and with the substrate, thereby forming a metallurgical bond.

[0025] Silicon carbide-bonded diamond (ScD) as a BDC material offers several advantages over other materials. Although ScD elements offer good thermal stability compared to PCD elements, they can be susceptible to temperature degradation when exposed to the very high temperatures required for hard coating (assembly). Using the disclosed method, BDC constructs 202 can now be applied using induction brazing without causing material degradation on the wear surfaces of drill tools. Furthermore, the packing density of the BDC constructs 202 can be improved to increase the wear resistance of the tool components. In addition, the disclosed method enables the use of BDC constructs 202 in spray and fuse applications and in plasma-transferred arc processes.Although the pellets mainly described herein were formed using bonded diamond powder or bonded cubic boron nitride powder, it is understood that the disclosure need not be limited to such pellets and includes bonded pellets formed from superhard materials.

[0026] In one or more embodiments, the hard coating process can be automated and / or carried out using batch / mass processing. For example, the BDC structures 202 can be arranged in a predefined pattern, after which a thermal spray mist can be applied to the BDC structures 202. The process can then incorporate a furnace brazing step into a batch process without concerns about heat damage.

[0027] Fig.Figure 7 shows various embodiments of partially encapsulated BDC elements 704a-d with respect to a wear surface 714. Each BDC element 704a-d shown is partially encapsulated by an encapsulation layer 706 to form a BDC construct 702a-d, which can be attached to the wear surface 714 by inserting the BDC constructs 702a-d into plugs or reservoirs 708 formed in the wear surface 714. As described above, the wear surface 714 can be the surface of a borehole tool component, such as a mud motor bearing, a push pad, or a drill bit surface. While the plugs 708 for receiving a circular BDC construct 702a-d can be round, in other embodiments the BDC constructs 702a-d can have a polygonal shape and the plug 708 can also have a similar polygonal shape for receiving the polygonal BDC constructs 702a-d.

[0028] In each case, it is shown that the BDC constructs 702a-d have a proximal end 718 and a distal end 720 with a surface 722 formed at the distal end 720. BDC constructs 702a and 702c each have a generally flat surface 722, while BDC constructs 702b and 702d have a shaped surface, such as the curved surfaces shown.

[0029] As indicated above, the degree of partial encapsulation of the BDC elements 704a-d can vary, with only the upper or most distal portions of the BDC constructs 702a-d (relative to the proximal end 718) being exposed. It is understood that the exposed portions are the least likely part to be affected by temperatures applied adjacent to the proximal end 718 of the BDC constructs 702a-d during application to the wear surface 714. Thus, the encapsulation layer 706 is shown, which encapsulates the BDC elements 704a-d at the proximal end 718 of the BDC constructs 702a-d and extends at least partially along the length of the BDC elements 704a-d to the distal end 720 of the BDC constructs 702a-d.In BDC construct 702a, the encapsulation layer 706 extends approximately 50% of the length of BDC element 704a, while in BDC construct 702b, the encapsulation layer 706 extends approximately 90% of the length of BDC element 704b. On BDC construct 702c, the encapsulation layer 706 encapsulates or covers all but the surface 722 of BDC construct 702c. Finally, on BDC construct 702d, the encapsulation layer 706 encapsulates or covers the entire body of BDC element 704d and part of surface 722 of BDC construct 702d, leaving a portion of the surface exposed and not covered by the encapsulation layer 706.

[0030] It is desirable to provide improved thermal stability in BDCs. It is particularly desirable to provide such improved stability by incorporating an encapsulation layer into the design of the BDC structure. This encapsulation layer contains a thermally stable metal element, wherein the encapsulation layer surrounds an outer surface of the BDC, encapsulating the BDC and forming a chemically bonded interface. In some embodiments, the BDC is completely encapsulated, while in other embodiments, the BDC is sufficiently encapsulated to prevent heat damage to the BDC during its application to a downhole tool wear component, such as mud motor bearings, push-the-bit pads, and drill cutting edges.

[0031] Typically, borehole tool components contain wear or cutting elements that are best placed on various parts that bear against the formation. These parts may include brake pads or pistons. One challenge is that the wear on these parts can be extreme, thus requiring a very effective hard coating. Technologies using laser coating and tungsten carbide (WC) tiles with spray and fuse (PTA) suffer from accelerated wear. Other hard materials (such as silicon carbide (SiC)-bonded diamond, polycrystalline diamond) can exhibit excellent wear characteristics but suffer from a variety of problems, such as brazing wettability and temperature sensitivity. For example, thermal damage to a PDC during hard-coating processes is common and can cause the diamond matrix to crack and lose its integrity under thermal stress.

[0032] Furthermore, bonding BDCs to drill tool components can be challenging. It is often necessary to employ multiple bonding techniques. For example, silicon-carbon-bonded diamond (ScD) can utilize nickel plating, CVD-based tungsten coatings, nanostructured W-WC coatings, titanium plating, foil wrapping, carbide shoe encapsulation, and so on. Most of these techniques either perform inadequately during brazing / hard plating or have field problems due to insufficient interfacial strength. For instance, a mud engine bearing may contain embedded wear elements. A mud engine bearing typically requires bearings with superior wear resistance, thermal stability, and a low dynamic coefficient of friction to extend service life.Current bearings with WC tile or laser coating suffer from heat damage, accelerated wear, and relatively high dynamic coefficients of friction. Therefore, failures can occur at the wear surfaces of the bearing due to insufficient interfacial strength. When WC tiles are used to create a wear surface on a bearing, the wear tile can crack under thermal stress during the hard coating process or be thermally damaged during operation by higher dynamic coefficients of friction between WC-based mating surfaces. BDCs, on the other hand, can provide much better thermal stability and significantly lower dynamic coefficients of friction. However, they are difficult to fasten, weld, and / or braze due to their lack of electrical conductivity and / or wettability.

[0033] Illustrative embodiments disclose a method for processing these hard materials, such as BDCs, with encapsulation material using a high-isostatic pressure process. In one or more embodiments, the encapsulation of the BDCs creates an effective thermal barrier against heat damage either during hard coating or during soldering.

[0034] In one or more embodiments, the high isostatic pressure process provides significantly improved interfacial strength between the BDC and the encapsulation material compared to current encapsulation techniques that employ either low-strength brazing or ineffective nickel or titanium plating. Additionally, the disclosed encapsulated BDC structures offer improved interfacial strength compared to commonly used foil, coating, or carbide shoe techniques. The encapsulation process also enhances weldability and solderability through a fully customizable chemistry within the encapsulation layer.

[0035] In one or more embodiments, the dynamic coefficient of friction for mud engine bearing applications is increased as a result of the installation of the BDC structures on the bearing surfaces.

[0036] In one or more embodiments, encapsulating the BDC structure significantly improves its formability. BDCs can be very difficult to grind and may exhibit cracking defects during grinding. Due to their limited electrical conductivity, BDCs can also be very difficult to electrostatically form and machine. The encapsulation can be optimized to provide the necessary thermal stability to facilitate grinding and electrostatic forming / finishing, as the encapsulation layer is adaptable. The embodiments presented here demonstrate various encapsulation options, with the encapsulation layer completely or partially encasing the BDC.As used herein, “complete” encapsulation refers to a BDC that is completely enclosed within the encapsulation layer, while “partial” encapsulation refers to a BDC where the encapsulation layer encloses at least the portion of the BDC that is most susceptible to thermal degradation during attachment to a substrate. For example, a base or proximal end of the BDC may be enclosed within the encapsulation layer, and the encapsulation layer may extend upward and around the BDC, exposing only a portion of the uppermost or most distal end or face of the BDC. The encapsulation of the BDC could be arranged symmetrically around the outer surface of the BDC along the central longitudinal axis of the BDC Compact. In one or more embodiments, the encapsulation layer could be arranged asymmetrically on the outer surface of the BDC along the central longitudinal axis of the BDC.In one or more embodiments, the encapsulation layer could be arranged symmetrically on the outer surface of the BDC along the central longitudinal axis of the BDC and asymmetrically along the transverse axis of the BDC.

[0037] The above specific exemplary embodiments are not intended to limit the scope of the claims. The exemplary embodiments can be modified by including, excluding, or combining one or more features or functions described in the disclosure.

[0038] Thus, a wear component for a drill bit tool has been described. The drill bit tool can be a drill assembly and include a drill bit, a plug section located within an outer surface of the drill bit, or a push-the-bit pad; a diamond material mold body; a substrate arranged on the bonded diamond material mold body; an encapsulation material bonded to the substrate using high isostatic pressure, the encapsulation material completely encasing the bonded diamond material mold body; and the completely encasing diamond material mold body arranged within the plug section of the drill bit or a push-the-bit pad.The drill bit tool may be a drill assembly and include a drill bit, a plug section located within an outer surface of the drill bit, or a push-the-bit pad; a diamond material die; a substrate arranged on the bonded diamond material die; an encapsulation material bonded to the substrate using high isostatic pressure, the encapsulation material at least partially enclosing the bonded diamond material die. and the at least partially encapsulated diamond material compact is arranged within the plug section of the drill bit or a push-the-bit pad. In other embodiments, the downhole tool can be a mud motor assembly comprising a mud motor bearing; a plug section located within an outer surface of the mud motor bearing; a diamond material compact; a substrate arranged on the bonded diamond material compact; an encapsulation material bonded to the substrate using high isostatic pressure, the encapsulation material fully encapsulating the bonded diamond material compact; and the fully encapsulated diamond material compact being arranged within the plug section of the mud motor bearing.In other embodiments, the borehole tool can be a mud motor assembly comprising a mud motor bearing; a plug section located within an outer surface of the mud motor bearing; a diamond material press body; a substrate arranged on the bonded diamond material press body; an encapsulation material bonded to the substrate using high isostatic pressure, wherein the encapsulation material at least partially encloses the bonded diamond material press body; and the at least partially enclosed diamond material press body is arranged within the plug section of the mud motor bearing.In other embodiments, the borehole tool can be a mud motor assembly comprising a mud motor bearing; a plug section located within an outer surface of the mud motor bearing; a bonded material press body; a substrate arranged on the bonded material press body; an encapsulation material bonded to the substrate using high isostatic pressure, wherein the encapsulation material at least partially encloses the bonded material press body; and the at least partially enclosed bonded material press body is arranged within the plug section of the mud motor bearing.The drilling tool may be a drill assembly and may include a drill bit or push pad, a plug section located within an outer surface of the drill bit or push pad; a superhard material press body; a substrate arranged on the superhard material press body; an encapsulation material bonded to the substrate using high isostatic pressure, the encapsulation material fully or partially enclosing the superhard material press body; and the fully or partially encapsulated superhard material press body arranged within the plug section of the drill bit or push-the-bit pad.The borehole tool can be a device for drilling an underground formation, wherein the device comprises a plug section located within an outer surface of the device; a superhard material press body; a substrate arranged on the superhard material press body; an encapsulation material bonded to the substrate using high isostatic pressure, wherein the encapsulation material wholly or partially encases the superhard material press body; and the wholly or partially encased superhard material press body is arranged within the plug section of the outer surface of the device.

[0039] One or more of the above-described embodiments of the drill bit may include one or more of the following elements, alone or in combination: The diamond material die is a sintered bonded diamond material die. The substrate has a bottom surface, a top surface, and a circumferential edge on the top surface. The superhard material die is a bonded diamond die.

[0040] The super-hard material die is a bonded cubic boron nitride die.

[0041] The bonded material die is a bonded diamond die.

[0042] The bonded material impression body is a bonded cubic boron nitride impression body. The material impression body consists of powder of a superhard material.

[0043] The super-hard material is diamond powder.

[0044] The super-hard material is cubic boron nitride powder.

[0045] The bonded diamond material impression body has a proximal end and a distal end with a defined surface at the distal end.

[0046] The encapsulation material encapsulates everything except the surface of the bonded diamond material impression body.

[0047] The surface of the diamond material die is essentially flat.

[0048] The surface of the bonded diamond material die is shaped.

[0049] The surface of the diamond material die is curved.

[0050] Part of the area is covered by the encapsulation material and part of the area is exposed.

[0051] Part of the length of the bonded diamond material impression body is covered by the encapsulation material.

[0052] Part of the curved surface is covered by the encapsulation material and part of the curved surface is exposed.

[0053] A topographic feature of the substrate surface is located on the substrate to increase the surface contact between the substrate and the encapsulation material.

[0054] The encapsulation material and the substrate form an interface between the encapsulation material and the substrate in order to attach the encapsulation material to the substrate.

[0055] The interface between the encapsulation material and the substrate is a chemical bond.

[0056] The sintered bonded diamond material die is a polycrystalline diamond composite.

[0057] The sintered bonded diamond material die is a silicon carbide-diamond composite material.

[0058] The encapsulation material is a mixture of boron nitride and diamond.

[0059] The encapsulation material is a mixture of tungsten and carbon.

[0060] The encapsulation material is a mixture of two different metals.

[0061] The encapsulation material is a mixture of a polymer and a metal.

[0062] The thickness of the encapsulation material is varied to create a thermal barrier. The fully encapsulated bonded diamond material is best suited for application to the drill bit, mud motor bearing, or push-the-bit pad.

[0063] The fully encapsulated bonded diamond material is soldered to the drill bit, mud motor bearing, or push-the-bit pad.

[0064] The plug section consists of at least one plug made up of several plugs.

[0065] At least one of the many connectors is antisymmetric.

[0066] The encapsulation material is shaped to match the dimensions of at least one of the multiple plugs.

[0067] The encapsulation material is shaped by electrostatic discharge.

[0068] The encapsulation material is shaped using a grinding machine.

[0069] The potting material is shaped using a laser.

[0070] The high isostatic pressure process is automated.

[0071] The numerous plugs are tightly packed.

[0072] The plug section is surrounded by a tungsten carbide binder fabric that is chemically coupled to an outer surface of the drill bit, mud motor bearing, or push-the-bit pad.

[0073] The plug section is surrounded by a matrix fabric that is chemically bonded to an outer surface of the drill bit, mud motor bearing, or push-the-bit pad. The plug section is surrounded by a tungsten carbide bonding fabric, forming a first layer that is chemically bonded to the outer surface of the drill bit, mud motor bearing, or push-the-bit pad, and a matrix fabric forms a second layer that is chemically bonded to the first layer around the outer surface of the drill bit, mud motor bearing, or push-the-bit pad.

[0074] An encapsulation material is thicker on one side of the bonded diamond die than on the opposite side of the bonded diamond die.

[0075] The thickness of the encapsulation material along the longitudinal center axis, extending radially outwards from the longitudinal center axis, is uneven.

[0076] The thickness of the encapsulation material along the radial axis is uneven.

[0077] The outer surface of the encapsulation material is notched.

[0078] Likewise, a method for producing a diamond construct for attachment to a wellhead tool component was described. In one or more embodiments, the method may comprise the following steps: sintering a diamond matrix powder to form a bonded diamond die; completely or partially encapsulating the bonded diamond die with a metallic material; bonding the encapsulation material to the bonded diamond die using high isostatic pressure to form a diamond construct; inserting the diamond construct into a plug section on the outside of the wellhead tool component; and mounting and / or brazing the wellhead tool component.In other embodiments, the method may include the following steps: providing a bonded diamond die; completely or partially encapsulating the bonded diamond die with a metallic material; bonding the encapsulation material to the bonded diamond die to form a diamond construct; inserting the diamond construct into a plug section of the drill bit component; and attaching the diamond construct to the drill bit component.In other embodiments, the method may include the following steps: providing a bonded press body made of superhard material; completely or partially encapsulating the bonded press body with a metallic material; bonding the encapsulation material to the bonded press body to form a construct; inserting the construct into a plug section of the borehole tool component; and attaching the construct to the borehole tool component.

[0079] One or more of the process implementation methods described above may include one or more of the following, alone or in combination:

[0080] Providing a bonded diamond die involves sintering a diamond matrix powder to form a bonded diamond die.

[0081] The bonding of the encapsulation material to the bonded diamond die involves the use of high isostatic pressure to form a diamond construct.

[0082] The application of the diamond construct involves hardfacing the diamond construct onto the drill tool component.

[0083] Attaching the diamond construct involves brazing the diamond construct to the drill tool component.

[0084] Varying the thickness of the encapsulation material to create a thermal barrier. Shaping the encapsulation material to adapt it to the dimensions of at least one plug or multiple plugs.

[0085] Shape the encapsulation material once the diamond construct has been formed.

[0086] Shaping of the encapsulation material by electrostatic discharge.

[0087] Shaping the encapsulation material by grinding it. Using a laser to shape the encapsulation material.

[0088] The high isostatic pressure process is automated.

[0089] Forming a plug in a surface of the borehole tool component.

[0090] Forming a multitude of plugs in a surface of the borehole component.

[0091] The numerous plugs are tightly packed.

[0092] Applying a metal mesh to the outer surface of the drill bit component. Positioning a matrix mesh on the outer surface of the drill bit component.

[0093] Positioning a tungsten carbide binder to form a first layer chemically coupled to a surface of the borehole tool component, and positioning a matrix fabric over the tungsten carbide binder to form a second layer chemically coupled to the first layer.

Claims

[1] Drilling tool, comprising: a plug section (306) located within an outer surface of the borehole tool; and a construct (202) of the bonded diamond die (BDC), including: a BDC element (104); and an encapsulation layer (106) that at least partially encapsulates the BDC element (104), wherein the BDC construct (202) is arranged within the plug section (306) of the borehole tool, characterized by , that the drilling tool further features: a tungsten carbide binder fabric (510) that is chemically coupled to a surface of the plug section (306) and forms a first layer thereon; and a metal matrix fabric that is chemically coupled to the first layer and forms a second layer on the surface of the plug section (306). [2] Drilling tool according to claim 1, wherein the encapsulation layer (106) completely encapsulates the BDC element (104). [3] Drilling tool according to claim 1, comprising at least one from the group consisting of a drill, a push-the-bit pad and a mud motor bearing arrangement. [4] Drilling tool according to claim 1, wherein the BDC element (104) and the encapsulation layer (106) form an interface between them to secure the encapsulation layer (106) to the BDC element (104). [5] Drilling tool according to claim 4, wherein the interface between the BDC element (104) and the encapsulation layer (106) comprises a chemical bond. [6] Drilling tool according to claim 1, wherein the encapsulation layer (106) contains at least one of a mixture of boron nitride and diamond, a mixture of tungsten and carbon and combinations thereof. [7] Drilling tool according to one of the preceding claims, wherein the first and second layers are chemically coupled to the BDC construct (202). [8] Drilling tool according to claim 1, comprising: a wear surface defined on one of the group consisting of a drill bit, a push-the-bit pad and a mud motor bearing assembly, wherein the wear surface includes a plug section (306) with multiple plugs; and wherein the BDC construct (202) is attached to the wear surface, wherein the BDC construct (202) is attached to the bottom and side surfaces of the plug section (306) with multiple plugs, wherein the BDC construct (202) includes the BDC element (104) and the encapsulation layer (106) which completely encapsulates the BDC element (104), wherein the encapsulation layer (106) forms an insulating layer over the BDC element (104). [9] Drilling tool according to claim 8, wherein the encapsulation layer (106) has a lower thermal conductivity than the BDC element (104). [10] Drilling tool according to claim 8, wherein the encapsulation layer (106) has a higher specific heat than the BDC element (104). [11] Drilling tool according to claim 8, wherein the BDC construct (202) has a cylindrical shape. [12] Drilling tool according to claim 8, wherein the encapsulation layer (106) has a uniform thickness. [13] Drilling tool according to claim 8, wherein the encapsulation layer (106) contains a mixture of a polymer and a metal. [14] Drilling tool according to claim 1: wherein the plug section (306) has several cavities, the tool furthermore with - several BDC constructs (202), wherein each BDC construct (202) is contained in a cavity of the several cavities, and wherein each BDC construct (202) is formed from a bonded diamond press body that is completely enclosed and chemically bonded to an encapsulation layer (106). [15] Drilling tool according to claim 14, wherein the drilling tool is at least one of the group consisting of a drill, a push-the-bit pad and a mud motor bearing arrangement. [16] Drilling tool according to claim 14, wherein the BDC construct (202) has a convexly shaped surface that protrudes from the outer surface of the drilling tool. [17] Drilling tool according to claim 14, wherein the encapsulation layer (106) has a lower thermal conductivity than the BDC element (104). [18] Drilling tool according to claim 14, wherein the encapsulation layer (106) is provided asymmetrically on an outer surface of the BDC element (104) along the central longitudinal axis of the BDC element (104). [19] Drilling tool according to claim 14, wherein the encapsulation layer (106) is made of a mixture of a polymer and a metal.

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