Expansion device, method for manufacturing semiconductor chips, and semiconductor chip

Abstract

An expansion device 2 comprises an expansion element 208, a cooling device 206 (207), a doctor blade unit 213, and a movement mechanism 214c. The expansion element 208, the cooling device 206 (207), and / or a heating device 211, as well as the doctor blade unit 213, are linearly aligned in a top view.

Description

Technical area

[0001] The present invention relates to an expansion device, a method for manufacturing semiconductor chips, and a semiconductor chip, and more particularly, it relates to an expansion device having an expansion element for dividing a wafer into a plurality of semiconductor chips, a method for manufacturing semiconductor chips, and a semiconductor chip. Technical background

[0002] An expansion device with an expansion element for dividing a wafer into a plurality of semiconductor chips is known from the prior art. Such an expansion device is disclosed, for example, in Japanese Patent No. 6298635.

[0003] Japanese Patent No. 6298635 discloses a dividing device (expanding device) with an expanding member for dividing a wafer into a plurality of chips. The dividing device includes a linear motion mechanism, a conveyor unit with an arm, a cassette table, the expanding member, and a cooling box.

[0004] The linear motion mechanism disclosed in Japanese Patent No. 6298635 is a motion mechanism that extends in a horizontal direction perpendicular to a direction in which the expansion member and the cooling box are aligned. The linear motion mechanism linearly moves the single-arm conveyor unit in the horizontal direction perpendicular to the direction in which the expansion member and the cooling box are aligned. The single-arm conveyor unit includes an arm with a multi-joint link and a holder. The single-arm conveyor unit drives the arm with the multi-joint link to change the position and posture of the holder for holding a ring frame surrounding the wafer mounted on an expandable platen. A wafer is fed to the cassette table. The cooler cools the expandable platen to which the wafer is mounted.The expansion element expands the cooled expandable plate to divide the wafer into a plurality of chips.

[0005] In the dividing apparatus disclosed in Japanese Patent No. 6298635, the single-arm conveying unit, which has been moved to the cassette table by the linear motion mechanism, holds the wafer supplied to the cassette table and is then moved to the cooling device by the linear motion mechanism to supply the wafer to the cooling device. In the dividing apparatus, the cooled wafer in the cooling box is held by the single-arm conveying unit, and then the single-arm conveying unit transports the wafer to the expansion member, where the wafer is divided. State of the artPatent document

[0006] Patent Document 1: Japanese Patent No. 6298635 Description of the invention Problems to be solved by the invention

[0007] Although not clearly described in Patent Document 1, in a dividing apparatus as described in Patent Document 1, a squeegee unit may be provided to divide a wafer that has not been divided during expansion after the expandable plate is expanded by the expansion member, in addition to dividing the wafer into a plurality of chips by expanding the expandable plate by the expansion member. In such a case, the squeegee unit divides the wafer that has not been divided by locally pressing a portion of the expandable plate corresponding to the wafer after the expansion member expands the expandable plate.

[0008] When the squeegee unit is provided in the dividing apparatus as described above, the wafer can be fed to the squeegee unit by the linear motion mechanism and the single-arm conveying unit if the squeegee unit is arranged within a range where the wafer can be fed by the linear motion mechanism and the single-arm conveying unit. However, it is necessary to move the single-arm conveying unit by the linear motion mechanism and drive the arm of the single-arm conveying unit to change the position and posture of the holder of the single-arm conveying unit, and thus the structure of the moving mechanism that feeds the wafer to the squeegee unit becomes complex. Therefore, in the dividing apparatus having the squeegee unit described above, the moving mechanism that feeds the wafer between a plurality of devices such as the expanding member and the squeegee unit is conceivably complex.Therefore, in the dividing device (expansion device) including the squeegee unit as described above, it is desirable to simplify the structure of the moving mechanism that feeds the wafer between a plurality of devices such as the expansion member and the squeegee unit.

[0009] The present invention has been proposed to solve the above-mentioned problems, and an object of the present invention is to provide an expansion apparatus, a method for manufacturing semiconductor chips, and a semiconductor chip, each enabling a simple structure of a moving mechanism that feeds a wafer between a plurality of devices such as an expansion unit and a doctor unit. Means to solve the problems

[0010] An expansion device according to a first aspect of the present invention includes an expansion member for expanding an elastic plate member to divide a wafer into a plurality of semiconductor chips along a dividing line, a cooling device for cooling the plate member before the plate member is expanded by the expansion member, and / or a heating device for heating and shrinking the plate member expanded by the expansion member while maintaining a gap between the plurality of semiconductor chips, a squeegee unit for locally pressing the wafer after the expansion member expands the plate member to divide the wafer into the plurality of semiconductor chips, and a moving mechanism for feeding the wafer to the expansion member, the cooling device and / or the heating device, and the squeegee unit.The expansion element, the cooling device and / or the heating device and the doctor unit are linearly aligned in a plan view.

[0011] As described above, the expansion device according to the first aspect of the present invention includes the moving mechanism for feeding the wafer to the expansion element, the cooling device, and / or the heating device, and the squeegee unit in plan view. In plan view, the expansion element, the cooling device, and / or the heating device, and the squeegee unit are linearly aligned.Accordingly, the wafer is supplied to the squeegee unit, the expansion member, and the cooling device and / or the heating device that are linearly aligned using the moving mechanism, so that a mechanism that conveys the wafer to the squeegee unit, the expansion member, and the cooling device and / or the heating device can be achieved using a linear moving mechanism, and thus the structure of a moving mechanism that conveys the wafer between a plurality of devices such as the expansion member and the squeegee unit can be simplified.

[0012] The expansion device according to the first aspect preferably comprises both the cooling device and the heating device, the expansion element is preferably below the heating device, the cooling device and the expansion element below the heating device are preferably linearly aligned in plan view, the squeegee unit is preferably in a straight line with the cooling device and the expansion element in a direction in which the cooling device and the expansion element are aligned in plan view, and the moving mechanism is preferably operable to feed the wafer to the cooling device, the expansion element and the squeegee unit, which are linearly aligned in plan view.Accordingly, the expansion member is arranged below the heater, so that an increase in the size of the expansion device in a horizontal direction can be reduced or prevented compared to a case where the expansion member is deviated from the heater in the horizontal direction. Furthermore, the wafer is fed using the moving mechanism, so that a mechanism that conveys the wafer to the squeegee unit, the expansion member, and the cooling device can be achieved using a linear motion mechanism, and thus the structure of the moving mechanism that conveys the wafer between a plurality of devices such as the expansion member and the squeegee unit can be simplified.Consequently, an increase in the size of the expansion device can be reduced or prevented, and the structure of the moving mechanism that feeds the wafer between a plurality of devices such as the expansion member and the doctor unit can be simplified.

[0013] The expansion device according to the first aspect preferably includes both the cooling device and the heating device, the expansion member preferably includes an expansion ring having a ring shape for expanding the plate member to divide the wafer along the dividing line, the squeegee unit is preferably located within an inner peripheral surface of the expansion ring, the cooling device and the heating device are preferably linearly aligned in plan view, the squeegee unit is preferably in a straight line with the cooling device in a direction in which the cooling device and the heating device are aligned in plan view, and the moving mechanism is preferably operable to feed the wafer to the cooling device, the heating device, and the squeegee unit, which are linearly aligned in plan view.Accordingly, the squeegee unit can be disposed within the inner peripheral surface of the expansion ring, effectively utilizing a space within the inner peripheral surface of the expansion ring, and thus, an increase in the size of the expansion device can be further reduced or prevented. Furthermore, the wafer is fed using the moving mechanism, so that a mechanism that conveys the wafer to the squeegee unit, the cooling device, and the heating device can be achieved using a linear motion mechanism, and thus the structure of the moving mechanism that feeds the wafer between a plurality of devices such as the expansion member and the squeegee unit can be simplified.Consequently, an increase in the size of the expansion device can be reduced or prevented, and the structure of the moving mechanism that feeds the wafer between a plurality of devices such as the expansion member and the doctor unit can be simplified.

[0014] In this case, the expansion member and the squeegee unit are preferably located within the inner peripheral surface of the expansion ring below the heating device, the squeegee unit is preferably in a straight line with the cooling device in the direction in which the cooling device and the heating device are aligned in plan view, and the moving mechanism is preferably operable to feed the wafer to the cooling device, the expansion member and the squeegee unit within the inner peripheral surface of the expansion ring, which are linearly aligned in plan view.Accordingly, the squeegee unit disposed within the inner peripheral surface of the expansion ring is arranged below the heater, so that an increase in the size of the expansion device in the horizontal direction can be reduced or prevented compared to a case where the squeegee unit disposed within the inner peripheral surface of the expansion ring deviates from the heater in the horizontal direction. Consequently, the structure of the moving mechanism that feeds the wafer between a plurality of devices such as the expansion member and the squeegee unit can be simplified, and an increase in the size of the expansion device can be further reduced or prevented.

[0015] The expansion device according to the first aspect preferably comprises, in addition to the cooling device and the heating device, an ultraviolet irradiation device for irradiating a portion of the plate member expanded by the expansion member, which corresponds to a position of the wafer, with ultraviolet rays. The cooling device and the heating device are preferably aligned linearly in plan view, the squeegee unit and the ultraviolet irradiation device are preferably arranged in a straight line with the cooling device and the heating device in a direction in which the cooling device and the heating device are aligned in plan view, and the moving mechanism is preferably operable to feed the wafer to the cooling device, the heating device, the squeegee unit, and the ultraviolet irradiation device, which are aligned linearly in plan view.Accordingly, the wafer is fed using the moving mechanism, so that a mechanism that conveys the wafer to the cooling device, the heating device, the squeegee unit, and the ultraviolet irradiation device can be achieved using a linear moving mechanism, and thus the structure of the moving mechanism that feeds the wafer between a plurality of devices such as the expanding member and the squeegee unit can be simplified.

[0016] In this case, the expansion member preferably comprises an expansion ring for expanding the plate member to divide the wafer along the dividing line, the squeegee unit and the ultraviolet irradiation device are preferably within an inner peripheral surface of the expansion ring, the squeegee unit and the ultraviolet irradiation device are preferably in a straight line with the cooling device and the heating device in the direction in which the cooling device and the heating device are aligned in plan view, and the moving mechanism is preferably operable to feed the wafer to the cooling device, the heating device, the squeegee unit, and the ultraviolet irradiation device, wherein the cooling device, the heating device, the squeegee unit, and the ultraviolet irradiation device are linearly aligned in plan view,The squeegee unit and the ultraviolet irradiation device are located within the inner peripheral surface of the expansion ring. Accordingly, the squeegee unit and the ultraviolet irradiation device can be arranged within the inner peripheral surface of the expansion ring, effectively utilizing the space within the inner peripheral surface of the expansion ring, and thus, an increase in the size of the expansion device can be further reduced or prevented. Furthermore, the wafer W1 is fed using the moving mechanism, so that a mechanism that conveys the wafer to the squeegee unit, the ultraviolet irradiation device, the cooling device, and the heating device can be achieved using a linear motion mechanism, and thus the structure of the moving mechanism that feeds the wafer between a plurality of devices such as the expansion member and the squeegee unit can be simplified.and an increase in the size of the expansion device can be further reduced or prevented.

[0017] The expansion device according to the first aspect preferably comprises, in addition to the cooling device, a clamp unit having a gripper for holding an annular member fixed to the plate member while surrounding the wafer, and a linear motion mechanism as a moving mechanism for moving the gripper holding the annular member. In plan view, a center of a cooling working area in which the plate member is cooled by the cooling device and a center of a pressing working area in which the squeegee unit presses the wafer over the plate member are preferably located on a moving path of a center point of the wafer held by the gripper when the gripper is moved by the linear motion mechanism, and the linear motion mechanism is preferably operable to supply the wafer to the cooling device, the expansion member, and the squeegee unit, which are linearly aligned in plan view.Accordingly, when the plate member is cooled by the cooling device and when the wafer is pressed by the squeegee unit, the center of the cooling work area and the center of the pressing work area are not shifted in position in a direction perpendicular to the horizontal direction in which the linear motion mechanism extends with respect to the wafer held by the gripper. Thus, even without a separate linear motion mechanism extending in the direction perpendicular to the horizontal direction in which the linear motion mechanism extends, both the cooling work by the cooling device and the pressing work by the squeegee unit can be performed. Consequently, an increase in the number of moving mechanisms required in the expansion device can be reduced or prevented, and thus an increase in the size of the expansion device can be further reduced or prevented.

[0018] A method for manufacturing semiconductor chips according to a second aspect of the present invention comprises forming a modified layer in a wafer having a plurality of semiconductor chips by emitting a laser beam onto the wafer from a laser irradiation device operable to emit the laser beam, feeding the wafer to an expansion member operable to expand an elastic plate member by a moving mechanism operable to feed the wafer to the expansion member, a cooling device operable to cool the plate member and / or a heating device operable to heat and shrink the plate member while maintaining a gap between the plurality of semiconductor chips, and a squeegee unit operable to locally press the wafer, wherein the expansion member,the cooling device and / or the heating device and the doctor unit are linearly aligned in a plan view, and expanding the plate element to divide the wafer into the plurality of semiconductor chips along a dividing line by the expansion element.

[0019] As described above, the method for manufacturing semiconductor chips according to the second aspect of the present invention includes supplying the wafer to the expansion member that expands the elastic plate member by the moving mechanism that supplies the wafer to the expansion member, a cooling device that cools the plate member, and / or a heating device that heats and shrinks the plate member while maintaining the gap between the plurality of semiconductor chips, and the squeegee unit that locally presses the wafer. The expansion member, the cooling device and / or the heating device, and the squeegee unit are linearly aligned with each other in plan view.Accordingly, the wafer is supplied to the squeegee unit, the expansion member, and the cooling device and / or the heating device that are linearly aligned using the moving mechanism, so that a mechanism that conveys the wafer to the squeegee unit, the expansion member, and the cooling device and / or the heating device can be achieved using a linear moving mechanism, and thus the method for manufacturing semiconductor chips that enables a simple structure of a moving mechanism that conveys the wafer between a plurality of devices such as the expansion member and the squeegee unit can be achieved.

[0020] A semiconductor chip according to a third aspect of the present invention is manufactured by an expansion device comprising an expansion element for expanding an elastic plate member to divide a wafer along a dividing line into a plurality of semiconductor chips, a cooling device for cooling the plate member before the plate member is expanded by the expansion element, and / or a heating device for heating and shrinking the plate member expanded by the expansion element while maintaining a gap between the plurality of semiconductor chips, a squeegee unit for locally pressing the wafer after the expansion element has expanded the plate member to divide the wafer into the plurality of semiconductor chips, and a moving mechanism for supplying the wafer to the expansion element, the cooling device and / or the heating device, and the squeegee unit, wherein the expansion element,the cooling device and / or the heating device and the doctor unit are linearly aligned in a plan view.,

[0021] Regarding the semiconductor chip according to the third aspect of the present invention, the expansion device, as described above, comprises the moving mechanism for feeding the wafer to the expansion element, the cooling device and / or the heating device, and the squeegee unit. The expansion element, the cooling device and / or the heating device, and the squeegee are linearly aligned in plan view.Accordingly, the wafer is supplied to the squeegee unit, the expansion member, and the cooling device and / or the heating device that are linearly aligned using the moving mechanism, so that a mechanism that conveys the wafer to the squeegee unit, the expansion member, and the cooling device and / or the heating device can be achieved using a linear moving mechanism, and thus the semiconductor chip of the expansion device can be achieved, which enables a simple structure of a moving mechanism that feeds the wafer between a plurality of devices such as the expansion member and the squeegee unit. Advantageous effect of the invention

[0022] According to the present invention, as described above, it is possible to simplify the structure of the moving mechanism that transports the wafer between a plurality of devices such as the expansion member and the squeegee. Brief description of the drawings [ Fig. 1]: A plan view showing a semiconductor wafer processing apparatus including a dicing device and an expanding device according to a first embodiment. [ Fig. 2] A plan view showing a wafer ring structure to be processed in the semiconductor wafer processing apparatus according to the first embodiment. [ Fig. 3] A sectional view taken along the line III-III in Fig. 2. [ Fig. 4: A plan view of the separating device arranged next to the expanding device according to the first embodiment. [ Fig. 5] A side view showing the separating device arranged next to the expanding device according to the first embodiment, viewed from the Y2 direction side. [ Fig. 6] A plan view of the expansion device according to the first embodiment. [ Fig. 7] A side view showing the expansion device according to the first embodiment as seen from the Y2 direction side. [ Fig. 8] A side view showing the expansion device according to the first embodiment, viewed from the X1 direction side. [ Fig. 9] A block diagram showing the control configuration of the semiconductor wafer processing apparatus according to the first embodiment. [ Fig. 10] A flowchart of the first half of a semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the first embodiment. [ Fig. 11] A flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the first embodiment. [ Fig. 12] A side view showing a state in which a plate member is cooled by a cold air supply and a cooling unit of the expansion device according to the first embodiment. [ Fig. 13] A side view showing a state in which a wafer is moved to an expansion member by a clamp unit of the expansion device according to the first embodiment. [ Fig. 14] A side view showing a state in which the plate member is expanded by the expansion member of the expansion device according to the first embodiment. [ Fig. 15] A plan view showing a relationship among a moving path of the center of the wafer, the center of the cooling unit, the center of the cold air supply, the center of a heat shrink device, the center of an expansion holding member, the center of an ultraviolet irradiation device, the center of a squeegee, and the center of the expansion member in the expansion device according to the first embodiment. [ Fig. 16] A plan view showing a semiconductor wafer processing apparatus including a dicing apparatus and an expanding apparatus according to a second embodiment. [ Fig. 17] A side view showing the semiconductor wafer processing apparatus having the dicing apparatus and the expanding apparatus according to the second embodiment, as seen from the Y2 direction side. [ Fig. 18] A side view showing the semiconductor wafer processing apparatus having the dicing apparatus and the expanding apparatus according to the second embodiment, as seen from the X1 direction side. [ Fig. 19] A block diagram showing the control configuration of the semiconductor wafer processing apparatus according to the second embodiment. [ Fig. 20]A flowchart of the first half of a semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the second embodiment. [ Fig. 21]A flowchart of the second half of the semiconductor chip manufacturing process of the semiconductor wafer processing apparatus according to the second embodiment. [ Fig. 22] A side view showing a state in which a plate member is cooled by a cooling air supply device and a cooling unit of the expansion device according to the second embodiment. [ Fig. 23] A side view showing a state in which the plate member is expanded by an expanding member of the expanding device according to the second embodiment. [ Fig. 24] A side view showing a state in which a wafer is locally pressed by a squeegee unit of the expansion apparatus according to the second embodiment. [ Fig. 25] A plan view showing a relationship among a moving path of the center of the wafer, the center of the cooling unit, the center of the cooling air supply means, the center of a heat shrinking means, the center of an expansion holding member, the center of an ultraviolet irradiation means, the center of the squeegee, and the center of the expansion member in the expansion apparatus according to the second embodiment. Modes for carrying out the invention

[0023] Some embodiments of the present invention are described below with reference to the drawings. First embodiment

[0024] The configuration of a semiconductor wafer processing apparatus 100 according to a first embodiment of the present invention will now be described with reference to FIG. Fig. 1 to 15 described. Semiconductor wafer processing device

[0025] As in Fig. 1, the semiconductor wafer processing apparatus 100 is an apparatus that processes a wafer W1 provided on a wafer ring structure W. The semiconductor wafer processing apparatus 100 forms a modified layer in the wafer W1 and divides the wafer W1 along the modified layer to form a plurality of semiconductor chips Ch.

[0026] The wafer ring structure W is now described with reference to the Fig. 2 and Fig. 3. The wafer ring structure W comprises the wafer W1, a plate element W2, and an annular element W3.

[0027] The wafer W1 is a circular, thin plate made of a crystal of a semiconductor material used as a material for a semiconductor integrated circuit. The modified layer is formed inside the wafer W1 by modifying the inside along a dividing line through processing in the semiconductor wafer processing apparatus 100. This means that the wafer W1 is processed so that it can be divided along the dividing line. The plate member W2 is an elastic adhesive tape. An adhesive layer is provided on the top surface W21 of the plate member W2. The wafer W1 is bonded to the adhesive layer on the plate member W2. The annular member W3 is a ring-shaped metal frame in plan view. The annular member W3 is attached to the adhesive layer on the plate member W2 and surrounds the wafer W1.

[0028] The semiconductor wafer processing apparatus 100 includes a dicing device 1 and an expanding device 2. Hereinafter, an up-down direction is defined as the Z direction, an upward direction as the Z1 direction, and a downward direction as the Z2 direction. In a horizontal direction perpendicular to the Z direction, a direction in which the dicing device 1 and the expanding device 2 are aligned is defined as the X direction, a direction from the dicing device 1 to the expanding device 2 in the X direction is defined as the X1 direction, and a direction from the expanding device 2 to the dicing device 1 in the X direction is defined as the X2 direction. A direction perpendicular to the X direction in the horizontal direction is defined as the Y direction, a direction in the Y direction is defined as the Y1 direction, and the other direction in the Y direction is defined as the Y2 direction. Separation device

[0029] As in the Fig. 1, Fig. 4 and Fig. As shown in Figure 5, the dicing device 1 emits a laser beam having a wavelength that is transparent to the wafer W1 along the separation line (street Ws) to form the modified layer. The modified layer refers to a crack, gap, or the like formed within the wafer W1 by the laser beam. A method for forming the modified layer in the wafer W1 in this way is called dicing.

[0030] The separation device 1 has a base 11, a chuck table unit 12, a laser 13 and an image generator 14.

[0031] The base 11 is a base on which the chuck table unit 12 is installed. The base 11 has a rectangular shape in plan view. Chuck table unit

[0032] The chuck table unit 12 includes a suction unit 12a, clamps 12b, a rotating mechanism 12c, and a table moving mechanism 12d. The suction unit 12a sucks the wafer ring structure W onto the upper surface of the suction unit 12a on the Z1 direction side. The suction unit 12a is a table with a suction hole, a suction piping, etc., for sucking the lower surface of the annular member W3 of the wafer ring structure W on the Z2 direction side. The suction unit 12a is supported by the table moving mechanism 12d via the rotating mechanism 12c. The clamps 12b are provided at an upper end of the suction unit 12a. The clamps 12b hold the wafer ring structure W sucked by the suction unit 12a. The clamps 12b hold the annular element W3 of the wafer ring structure W sucked by the suction unit 12a from the Z1 direction side. In this way, the wafer ring structure W is held by the suction unit 12a and the clamps 12b.

[0033] The rotation mechanism 12c rotates the suction unit 12a in a circumferential direction about a rotation center axis C parallel to the Z direction. The rotation mechanism 12c is attached to an upper end of the table movement mechanism 12d. The table movement mechanism 12d moves the wafer ring structure W in the X and Y directions. The table movement mechanism 12d includes an X-direction movement mechanism 121 and a Y-direction movement mechanism 122. The X-direction movement mechanism 121 moves the rotation mechanism 12c in the X1 direction or the X2 direction. The X-direction movement mechanism 121 includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder. The Y-direction movement mechanism 122 moves the rotation mechanism 12c in the Y1 direction or the Y2 direction.The Y-direction motion mechanism 122 includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder. Laser

[0034] The laser 13 emits a laser beam onto the wafer W1 of the wafer ring structure W held by the chuck table unit 12. The laser 13 is arranged on the Z1 direction side of the chuck table unit 12. The laser 13 includes a laser irradiation device 13a, a fixture 13b, and a Z-direction movement mechanism 13c. The laser irradiation device 13a emits a pulsed laser beam. The fixture 13b is a frame to which the laser 13 and the imager 14 are attached. The Z-direction movement mechanism 13c moves the laser 13 in the Z1 or Z2 direction. The Z-direction movement mechanism 13c includes a linear feed module or a ball screw and a drive, which includes, for example, a motor with an encoder.The laser irradiation device 13a may be a laser irradiation device that oscillates a continuous wave laser beam as a laser beam as long as a modified layer can be formed by multiphoton absorption. Image provider

[0035] The imager 14 images the wafer W1 of the wafer ring structure W held by the chuck table unit 12. The imager 14 is arranged on the Z1 direction side of the chuck table unit 12. The imager 14 includes a high-resolution camera 14a, a wide-angle camera 14b, a Z-direction movement mechanism 14c, and a Z-direction movement mechanism 14d.

[0036] The high-resolution camera 14a and the wide-angle camera 14b are near-infrared imaging cameras. The high-resolution camera 14a has a narrower viewing angle than the wide-angle camera 14b. The high-resolution camera 14a has a higher resolution than the wide-angle camera 14b. The wide-angle camera 14b has a wider viewing angle than the high-resolution camera 14a. The wide-angle camera 14b has a lower resolution than the high-resolution camera 14a. The high-resolution camera 14a is arranged on the X1 direction side of the laser irradiation device 13a. The wide-angle camera 14b is arranged on the X2 direction side of the laser irradiation device 13a. Thus, the high-resolution camera 14a, the laser irradiation device 13a, and the wide-angle camera 14b are arranged side by side in this order from the X1 direction side to the X2 direction side.

[0037] The Z-direction movement mechanism 14c moves the high-resolution camera 14a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14c includes a linear conveyor module or a ball screw and a drive, which, for example, has a motor with an encoder. The Z-direction movement mechanism 14d moves the wide-angle camera 14b in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 14d includes a linear conveyor module or a ball screw and a drive, which, for example, has a motor with an encoder. Expansion device

[0038] As in the Fig. 1, Fig. 6 and Fig. 7, the expansion device 2 divides the wafer W1 to form the plurality of semiconductor chips Ch (see FIG. Fig. 14). The expansion device 2 forms a sufficient gap between the plurality of semiconductor chips Ch. A modified layer is formed in the wafer W1 by emitting a laser beam having a wavelength transparent to the wafer W1 along the separation line (street Ws) in the dicing device 1. In the expansion device 2, the plurality of semiconductor chips Ch are formed by dividing the wafer W1 along the modified layer previously formed in the dicing device 1.

[0039] Therefore, in the expansion device 2, the wafer W1 is divided along the modified layer by expanding the plate member W2. Furthermore, in the expansion device 2, the gap between the plurality of semiconductor chips Ch formed by the division is increased by expanding the plate member W2.

[0040] The expansion device 2 includes a base 201, a cassette unit 202, a lifting hand unit 203, a suction hand unit 204, a base 205, a cooling air supply device 206, a cooling unit 207, an expansion member 208, a base 209, an expansion holding member 210, a heat shrink device 211, an ultraviolet irradiation device 212, a squeegee unit 213, and a clamping unit 214. The cooling air supply device 206 and the cooling unit 207 are examples of a "cooling device" in the claims. The heat shrink device 211 is an example of a "heating device" in the claims. base

[0041] The base 201 is a base on which the cassette unit 202 and the lifting hand unit 203 are installed. The base 201 has a rectangular shape in plan view. Cassette unit

[0042] The cassette unit 202 can accommodate a plurality of wafer ring structures W. The cassette unit 202 includes wafer cassettes 202a, a Z-direction moving mechanism 202b, and pairs of placement sections 202c.

[0043] A plurality of (three) wafer cassettes 202a are arranged in the Z direction. Each of the wafer cassettes 202a has a receiving space that can accommodate a plurality of (five) wafer ring structures W. The wafer ring structure W is manually fed and inserted into the wafer cassette 202a. The wafer cassette 202a can accommodate one to four wafer ring structures W or six or more wafer ring structures W. Furthermore, one, two, or four or more wafer cassettes 202a can be arranged in the Z direction.

[0044] The Z-direction movement mechanism 202b moves the wafer cassettes 202a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 202b includes a linear conveyor module or a ball screw and a drive, for example, a motor with an encoder. The Z-direction movement mechanism 202b also includes mounting tables 202d that support the wafer cassettes 202a from below. A plurality of (three) mounting tables 202d are arranged according to the positions of the plurality of wafer cassettes 202a.

[0045] A plurality of (five) pairs of placement sections 202c are arranged within the wafer cassette 202a. The annular element W3 of the wafer ring structure W is placed on the pair of placement sections 202c from the Z1 direction side. One of the pair of placement sections 202c protrudes in the X2 direction from the inner surface of the wafer cassette 202a on the X1 direction side. The other of the pair of placement sections 202c protrudes in the X1 direction from the inner surface of the wafer cassette 202a on the X2 direction side. Lifting hand unit

[0046] The lifting hand unit 203 can remove the wafer ring structure W from the cassette unit 202. Furthermore, the lifting hand unit 203 can pick up the wafer ring structure W into the cassette unit 202.

[0047] Specifically, the lifting hand unit 203 includes a Y-direction movement mechanism 203a and a lifting hand 203b. The Y-direction movement mechanism 203a includes a linear conveyor module or a ball screw and a drive, for example, a motor with an encoder. The lifting hand 203b supports the annular element W3 of the wafer ring structure W from the Z2 direction side. Suction hand unit

[0048] The suction hand unit 204 sucks the ring-shaped element W3 of the wafer ring structure W from the Z1 direction side.

[0049] Specifically, the suction hand unit 204 includes an X-direction movement mechanism 204a, a Z-direction movement mechanism 204b, and a suction hand 204c. The X-direction movement mechanism 204a moves the suction hand 204c in the X-direction. The Z-direction movement mechanism 204b moves the suction hand 204c in the Z-direction. The X-direction movement mechanism 204a and the Z-direction movement mechanism 204b each include a linear conveyor module or a ball screw and a drive, for example, a motor with an encoder. The suction hand 204c sucks and supports the annular element W3 of the wafer ring structure W from the Z1-direction side. The suction hand 204c supports the annular element W3 of the wafer ring structure W by generating a negative pressure. base

[0050] As in the Fig. 7 and Fig. As shown in Figure 8, the base 205 is a base on which the expansion element 208, the cooling unit 207, the ultraviolet irradiation device 212, and the doctor blade unit 213 are installed. The base 205 has a rectangular shape in plan view. Fig. 8, the clamping unit 214, which is arranged on the side of the cooling unit 207 in the Z1 direction, is shown by dotted lines. Cooling air supply device

[0051] The cooling air supply device 206 supplies cooling air to the plate element W2 from the Z1 direction side when the plate element W2 is expanded by the expansion element 208.

[0052] The cooling air supply device 206 specifically includes a supply device main body 206a, a cooling air supply port 206b, and a moving mechanism 206c. Cooling air supplied from a cooling air supply device can flow out through the cooling air supply port 206b. The cooling air supply port 206b is provided at one end of the supply device main body 206a on the Z2 direction side. The cooling air supply port 206b is arranged in a central portion of the end of the supply device main body 206a on the Z2 direction side. The moving mechanism 206c includes, for example, a linear conveyor module or a ball screw and a motor with an encoder.

[0053] The cooling air supply device is a device that generates cool air. The cooling air supply device supplies cooled air, for example, by a heat pump. Such a cooling air supply device is installed on the base 205. The cooling air supply device 206 and the

[0054] Cooling air supply device are connected to each other by a hose (not shown). Cooling unit

[0055] The cooling unit 207 cools the plate element W2 from the Z2 direction side.

[0056] Specifically, the cooling unit 207 includes a cooling element 207a, which includes a heat sink 271 and a Peltier element 272, and a Z-direction movement mechanism 207b. The heat sink 271 is made of a member with a large heat capacity and high thermal conductivity. The heat sink 271 is made of a metal such as aluminum. The Peltier element 272 cools the heat sink 271. The heat sink 271 is not limited to aluminum and can also be made of another member with a large heat capacity and high thermal conductivity. The Z-direction movement mechanism 207b is a cylinder.

[0057] The cooling unit 207 is movable in the Z1 direction or the Z2 direction by the Z-direction moving mechanism 207b. Thus, the cooling unit 207 is movable to a position where it contacts the plate member W2 and to a position spaced apart from the plate member W2. Expansion element

[0058] The expansion element 208 expands the plate element W2 of the wafer ring structure W to divide the wafer W1 along the separation line.

[0059] Specifically, the expansion element 208 includes an expansion ring 281. The expansion ring 281 expands the plate element W2 by supporting the plate element W2 from the Z2 direction. The expansion ring 281 has a ring shape in plan view. base

[0060] The base 209 is a support material to which the cooling air supply device 206, the expansion holding element 210 and the shrink tube 211 are attached. Expansion holding element

[0061] As in the Fig. 7 and Fig. 8, the expansion holding member 210 holds the plate member W2 from the Z1 direction side so that the plate member W2 does not shrink near the wafer W1 due to heating by a heater ring 211a.

[0062] Specifically, the expansion holding member 210 includes a pressing ring 210a, a lid 210b, and an inlet 210c. The pressing ring 210a has a ring shape in plan view. The lid 210b is provided on the pressing ring 210a to cover an opening of the pressing ring 210a. The inlet 210c is an inlet ring with a ring shape in plan view. A plurality of inlet openings are formed in the lower surface of the inlet 210c on the Z2 direction side. The pressing ring 210a is moved in the Z direction by a Z-direction moving mechanism 210d. That is, the Z-direction moving mechanism 210d moves the pressing ring 210a to a position where the plate member W2 is held down and to a position away from the plate member W2. The Z-direction movement mechanism 210d includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder. Heat shrink device

[0063] The heat shrinking device 211 shrinks the plate member W2 expanded by the expansion member 208 by heating, maintaining the gap between the plurality of semiconductor chips Ch.

[0064] The heat shrink device 211 includes the heating ring 211a and a Z-direction movement mechanism 211b. The heating ring 211a has a ring shape in plan view. The heating ring 211a has a jacketed heater that heats the plate member W2. The Z-direction movement mechanism 211b moves the heating ring 211a in the Z direction. The Z-direction movement mechanism 211b includes a linear conveyor module or a ball screw and a drive, which includes, for example, a motor with an encoder. Ultraviolet irradiation facility

[0065] The ultraviolet irradiation device 212 emits ultraviolet rays onto the plate member W2 to reduce the adhesive force of the adhesive layer of the plate member W2. Specifically, the ultraviolet irradiation device 212 includes an ultraviolet illumination device. The ultraviolet irradiation device 212 is arranged at one end of a press 213a of the squeegee unit 213, described below, on the Z1 direction side. The ultraviolet irradiation device 212 radiates the ultraviolet rays Ut onto the plate member W2 while moving together with the squeegee unit 213. Squeegee unit

[0066] The squeegee unit 213 divides the wafer W1 along the modified layer by locally pressing the wafer W1 from the side in the Z2 direction after the plate member W2 is expanded. Specifically, the squeegee unit 213 includes the press 213a, a Z-direction moving mechanism 213b, an X-direction moving mechanism 213c, and a rotation mechanism 213d.

[0067] The press 213a generates bending stress in the wafer W1 to divide the wafer W1 along the modified layer by being moved by the rotation mechanism 213d and the X-direction movement mechanism 213c, while pressing the wafer W1 from the Z2-direction side via the plate member W2. The press 213a presses the wafer W1 over the plate member W2 by being raised to a raised position on the Z1-direction side by the Z-direction movement mechanism 213b. When the press 213a is lowered to a lowered position on the Z2-direction side by the Z-direction movement mechanism 213b, the wafer W1 is no longer pressed. The press 213a is a squeegee.

[0068] The press 213a is attached to one end of the Z-direction movement mechanism 213b on the Z1 direction side. The Z-direction movement mechanism 213b moves the press 213a linearly in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 213b is, for example, a cylinder. The Z-direction movement mechanism 213b is attached to one end of the X-direction movement mechanism 213c on the Z1 direction side.

[0069] The X-direction movement mechanism 213c is mounted on one end of the rotary mechanism 213d on the Z1 direction side. The X-direction movement mechanism 213c linearly moves the press 213a in one direction. The X-direction movement mechanism 213c includes a linear feed module or a ball screw and a drive, for example, a motor with an encoder.

[0070] In the squeegee unit 213, the press 213a is raised by the Z-direction movement mechanism 213b. In the squeegee unit 213, the press 213a is moved in the Y direction by the X-direction movement mechanism 213c while locally compressing the wafer W1 from the Z2 direction side via the plate member W2, so that the wafer W1 is divided. In the squeegee unit 213, the press 213a is lowered to the lowered position by the Z-direction movement mechanism 213b. After the press 213a completes its movement in the Y direction, the press 213a is rotated 90 degrees in the squeegee unit 213 by the rotation mechanism 213d.

[0071] In the squeegee unit 213, the press 213a is raised by the Z-direction movement mechanism 213b. After the press 213a is rotated 90 degrees in the squeegee unit 213, the press 213a is moved by the X-direction movement mechanism 213c while locally pressing the wafer W1 from the Z2 direction side via the plate member W2, so that the wafer W1 is divided. clamping unit

[0072] The clamping unit 214 holds the annular member W3 of the wafer ring structure W. Specifically, the clamping unit 214 includes a gripper 214a, a Z-direction movement mechanism 214b, and a Y-direction movement mechanism 214c. The gripper 214a supports the annular member W3 from the Z2 direction side and holds down the annular member W3 from the Z1 direction side. Thus, the annular member W3 is held by the gripper 214a. The gripper 214a is connected to the Z-direction movement mechanism 214b. The Y-direction movement mechanism 214c is an example of a "linear movement mechanism" in the claims.

[0073] The Z-direction movement mechanism 214b moves the clamping unit 214 in the Z-direction. Specifically, the Z-direction movement mechanism 214b moves the gripper 214a in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 214b includes a linear conveyor module or a ball screw and a drive, which has, for example, a motor with an encoder. The Z-direction movement mechanism 214b is connected to the Y-direction movement mechanism 214c. The Y-direction movement mechanism 214c moves the Z-direction movement mechanism 214b in the Y1 direction or the Y2 direction. The Y-direction movement mechanism 214c includes a linear conveyor module or a ball screw and a drive, which has, for example, a motor with an encoder. Control configuration of a semiconductor wafer processing apparatus

[0074] As in Fig. 9, the semiconductor wafer processing apparatus 100 includes a first controller 101, a second controller 102, a third controller 103, a fourth controller 104, a fifth controller 105, a sixth controller 106, a seventh controller 107, an eighth controller 108, a stretch control computer 109, a handling control computer 110, a singulation control computer 111, and a memory 112.

[0075] The first controller 101 controls the squeegee unit 213. The first controller 101 includes a central processing unit (CPU) and a memory, which includes, for example, a read-only memory (ROM) and a random access memory (RAM). The first controller 101 may include a hard disk drive (HDD) as memory, which retains the stored information even after the power is turned off. The hard disk drive may be provided jointly for the first controller 101, the second controller 102, the third controller 103, the fourth controller 104, the fifth controller 105, the sixth controller 106, the seventh controller 107, and the eighth controller 108. The second controller 102 controls the

[0076] Cooling air supply device 206 and the cooling unit 207. The second controller 102 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The third controller 103 controls the heat shrink device 211 and the ultraviolet irradiation device 212. The third controller 103 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The second controller 102 and the third controller 103 can include a hard disk as storage, which retains stored information even after the power is turned off.

[0077] The fourth controller 104 controls the cassette unit 202 and the lifting hand unit 203. The fourth controller 104 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The fifth controller 105 controls the suction hand unit 204. The fifth controller 105 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The fourth controller 104 and the fifth controller 105 can include a hard disk as storage, which retains stored information, for example, even after the power is turned off.

[0078] The sixth controller 106 controls the chuck table unit 12. The sixth controller 106 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The seventh controller 107 controls the laser 13. The seventh controller 107 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The eighth controller 108 controls the imager 14. The eighth controller 108 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The sixth controller 106, the seventh controller 107, and the eighth controller 108 can include, for example, a hard disk as storage, which retains stored information even after the power is turned off.

[0079] The expansion control computer 109 performs calculations regarding a process for expanding the plate member W2 based on the processing results of the first controller 101, the second controller 102, and the third controller 103. The expansion control computer 109 includes a CPU and a memory, for example, a ROM and a RAM.

[0080] The handling control computer 110 performs calculations regarding a process for moving the wafer ring structure W based on the processing results of the fourth controller 104 and the fifth controller 105. The handling control computer 110 includes a CPU and a memory, for example, a ROM and a RAM.

[0081] The singulation control computer 111 performs calculations related to a process for singulating the wafer W1 based on the processing results of the sixth controller 106, the seventh controller 107, and the eighth controller 108. The singulation control computer 111 includes a CPU and a memory, for example, a ROM and a RAM.

[0082] The memory 112 stores programs for operating the separating device 1 and the expanding device 2. The memory 112 includes, for example, a ROM, a RAM, and an HDD. Manufacturing process of semiconductor chips

[0083] The overall operation of the semiconductor wafer processing apparatus 100 will be described below with reference to the Fig. 10 and Fig. 11 described.

[0084] In step S1, the wafer ring structure W is removed from the cassette unit 202. That is, after the wafer ring structure W stored in the cassette unit 202 is supported by the lifting hand 203b, the lifting hand 203b is moved in the Y1 direction by the Y-direction moving mechanism 203a, so that the wafer ring structure W is removed from the cassette unit 202. In step S2, the wafer ring structure W is transferred to the chuck table unit 12 of the dicing device 1 by the suction hand 204c. That is, the wafer ring structure W removed from the cassette unit 202 is moved in the X2 direction by the X-direction moving mechanism 204a while being sucked by the suction hand 204c. The wafer ring structure W, which has been moved in the X2 direction, is brought to the chuck table unit 12 by the suction hand 204c and then held by the chuck table unit 12.

[0085] In step S3, a modified layer is formed in the wafer W1 by the laser 13. In step S4, the wafer ring structure W containing the wafer W1 in which the modified layer has been formed is transferred from the suction hand 204c to the clamping unit 214. In step S5, the plate member W2 is cooled by the cooling air supply device 206 and the cooling unit 207. That is, the wafer ring structure W held by the clamping unit 214 is moved (lowered) in the Z2 direction by the Z-direction moving mechanism 214b to contact the cooling unit 207, and the cooling air supply device 206 supplies cooling air from the Z1 direction side to cool the plate member W2.

[0086] In step S6, the wafer ring structure W is moved from the clamping unit 214 to the expansion member 208. That is, the wafer ring structure W with the cooled plate member W2 is moved in the Y1 direction by the Y-direction moving mechanism 214c while being held by the clamping unit 214. In step S7, the plate member W2 is expanded by the expansion member 208. That is, the wafer ring structure W is moved in the Z2 direction 214b by the Z-direction moving mechanism while being held by the clamping unit 214. Then, the plate member W2 contacts the expansion ring 281 and is expanded by pulling the expansion ring 281. In this way, the wafer W1 is divided along the dividing line (modified layer).

[0087] In step S8, the expanded plate member W2 is held downward from the Z1 direction side by the expansion holding member 210. That is, the pressing ring 210a is moved (lowered) in the Z2 direction by the Z-direction moving mechanism 210d until it touches the plate member W2. Then, the process proceeds from a point A in Fig. 10 over a point A in Fig. 11 proceed to step S9.

[0088] As in Fig. As shown in Figure 11, in step S9, after the plate member W2 is held down by the expansion holding member 210, the plate member W2 is irradiated with ultraviolet rays Ut by the ultraviolet irradiation device 212 while the wafer W1 is pressed by the squeegee unit 213. In this way, the wafer W1 is further divided by the squeegee unit 213. Furthermore, the adhesive force of the plate member W2 is reduced by the ultraviolet rays Ut emitted by the ultraviolet irradiation device.

[0089] In step S10, while the heat shrinking device 211 heats and shrinks the plate member W2, the clamping unit 214 is lifted. At this time, the inlet 210c sucks air near the heated plate member W2. In step S11, the wafer ring structure W is transferred from the clamping unit 214 to the suction hand 204c. That is, the wafer ring structure W is moved in the Y2 direction by the Y-direction moving mechanism 214c while being held by the clamping unit 214. Then, the wafer ring structure W is sucked by the suction hand 204c after the holding by the clamping unit 214 on the cooling unit 207 side is released in the Z1 direction.

[0090] In step S12, the wafer ring structure W is transferred from the suction hand 204c to the lifting hand 203b. In step S13, the wafer ring structure W is stored in the cassette unit 202. That is, the wafer ring structure W carried by the lifting hand 203b is moved in the Y1 direction by the Y-direction moving mechanism 203a to be stored in the cassette unit 202. This completes the process performed on one wafer ring structure W. Then, the process returns from a point B in Fig. 11 via a point B in Fig. 10 back to step S1.

[0091] Arrangement positions of cooling air supply, cooling unit, expansion element, expansion holding element, heat shrink device, ultraviolet irradiation device and squeegee unit

[0092] The arrangement positions of the cooling air supply device 206, the cooling unit 207, the expansion member 208, the expansion holding member 210, the heat shrink device 211, the ultraviolet irradiation device and the doctor unit 213 in the plan view will now be described with reference to the Fig. 12 to 15 described.

[0093] As in Fig. 12, the expansion device 2 comprises the cooling air supply device 206, the cooling unit 207, the expansion element 208, the expansion holding element 210, the heat shrink device 211, the ultraviolet irradiation device 212, the doctor unit 213 and the clamping unit 214. In Fig. 12, the suction hand unit 204 is not shown for better illustration.

[0094] As in the Fig. 12 and Fig. As shown in Figure 13, the cooling air supply device 206 cools the plate member W2 before the plate member W2 is expanded by the expansion member 208. Specifically, the cooling air supply device 206 includes the supply device main body 206a, the cooling air supply opening 206b, and the moving mechanism 206c.

[0095] In the cooling air supply device 206, the supply device main body 206a is lowered to a lowered position by the moving mechanism 206c, and then the cooling air is discharged through the cooling air supply port 206b. At this time, the cooling air discharged through the cooling air supply port 206b accumulates in a cooling working area Ac1 on the wafer W1 side (inside) of the annular member W3 of the wafer ring structure W, and thus a part of the plate member W2 corresponding to the cooling working area Ac1 is cooled. In the horizontal direction perpendicular to the Z direction, the center of the cooling working area Ac1 of the cooling air supply device 206 is a center point Cc1.

[0096] After the cooling air supply device 206 has finished cooling the portion of the plate member W2 corresponding to the cooling working area Ac1, the supply of cooling air from the cooling air supply device 206 is stopped, and the supply device main body 206a is lifted to a lifted position by the moving mechanism 206c.

[0097] The cooling air supply device 206 can move up and down so as not to interfere with the expansion element 208, the heat shrink device 211, and the clamping unit 214. In particular, the cooling air supply device 206 can move downward to a working position in which the cooling air supply device 206 does not collide with the adjacent expansion element 208, the heat shrink device 211, and the clamping unit 214. The cooling air supply device 206 can move upward to a retracted position in which the cooling air supply device 206 does not collide with the adjacent expansion element 208 and the heat shrink device 211, as well as the clamping unit 214. Cooling unit

[0098] The cooling unit 207, which cools the plate element W2 before the plate element W2 is expanded by the expansion element 208, includes the cooling element 207a having the heat sink 271 and the Peltier element 272, and the Z-direction moving mechanism 207b.

[0099] In the cooling unit 207, the cooling element 207a is raised to a raised position Upc by the Z-direction moving mechanism 207b, and then the heat sink 271 is cooled by the Peltier element 272, so that a portion of the plate member W2 that contacts the heat sink 271 in the Z direction is cooled. Thus, the portion of the plate member W2 that contacts the heat sink 271 in the Z direction is a cooling working area Ac2 of the cooling unit 207. In the horizontal direction perpendicular to the Z direction, the center of the cooling working area Ac2 of the cooling unit 207 is a center point Cc2. In the Z direction, the centers Cc1 and Cc2 intersect.

[0100] After the cooling unit 207 finishes cooling a portion of the plate member W2 corresponding to the cooling working area Ac2, the cooling by the cooling unit 207 is stopped, and the cooling member 207a is lowered to a lowered position Lwc by the Z-direction moving mechanism 207b.

[0101] The cooling unit 207 can move up and down to avoid interference with the expansion member 208, the heat shrink device 211, and the clamping unit 214. Specifically, the cooling unit 207 can move upward to a working position (raised position Upc) in which the cooling unit 207 does not interfere with the adjacent expansion member 208, the heat shrink device 211, and the clamping unit 214. The cooling unit 207 can move downward to a retracted position (lowered position Lwc) in which the cooling unit 207 does not interfere with the adjacent expansion member 208, the heat shrink device 211, and the clamping unit 214. Expansion element

[0102] As in the Fig. 13 and Fig. As shown in Figure 14, the expansion member 208 divides the wafer W1 into a plurality of semiconductor chips Ch along the dividing line (street Ws) by expanding the elastic plate member W2. Specifically, the expansion member 208 includes the expansion ring 281. The expansion ring 281 is an annular member that divides the wafer W1 along the dividing line by expanding the plate member W2.

[0103] The expansion ring 281 is fixed to the base 205. The expansion member 208 has no movement mechanism for moving the expansion ring 281 in the Z1 direction or the Z2 direction. The arrangement position of the expansion ring 281 is fixed in the Z direction and the horizontal direction. The expansion member 208 is arranged below the heat shrink device 211. That is, the expansion ring 281 is arranged below the heat shrink device 211. In the plan view, the center of the annular expansion ring 281 is a center point Ec1. Expansion holding element

[0104] The expansion holding member 210 includes the pressing ring 210a, the cover 210b, the inlet 210c, and the Z-direction moving mechanism 210d. The pressing ring 210a is an annular member. In plan view, the center of the annular pressing ring 210a is a center point Ec2.

[0105] In the expansion holding member 210, the pressing ring 210a is lowered to a lowered position by the Z-direction moving mechanism 210d, so that the plate member W2 of the wafer ring structure W is held down. After the heat shrink device 211 finishes heating the plate member W2, the pressing ring 210a is raised to a raised position by the Z-direction moving mechanism 210d.

[0106] The expansion support member 210 can move up and down to avoid interference with the cooling unit 207 and the clamping unit 214. Specifically, the expansion support member 210 can move downward to a working position where the expansion support member 210 does not interfere with the adjacent cooling unit 207 and the clamping unit 214. The expansion support member 210 can move upward to a retracted position where the expansion support member 210 does not interfere with the adjacent cooling unit 207 and the clamping unit 214. Heat shrink device

[0107] The heat shrink device 211 heats and shrinks the plate member W2 expanded by the expansion member 208 while maintaining the gap between the plurality of semiconductor chips Ch. Specifically, the heat shrink device 211 includes the heating ring 211a and the Z-direction moving mechanism 211b. The heating ring 211a has a ring shape in plan view. In the plan view, the center of the ring-shaped heating ring 211a is a center point Hc.

[0108] In the heat shrink device 211, the heating ring 211a is lowered to a lowered position by the Z-direction movement mechanism 211b, so that the plate member W2 is heated. After the heat shrink device 211 finishes heating the plate member W2, the heating ring 211a is raised to a raised position by the Z-direction movement mechanism 211b.

[0109] The heat shrink device 211 can move up and down to avoid interference with the cooling unit 207 and the clamping unit 214. Specifically, the heat shrink device 211 can be moved downward to a working position where the heat shrink device 211 does not interfere with the adjacent cooling unit 207 and the clamping unit 214. The heat shrink device 211 can move upward to a retracted position where the heat shrink device 211 does not interfere with the adjacent cooling unit 207 and the clamping unit 214. Ultraviolet irradiation facility

[0110] As in the Fig. 14 and Fig. As shown in Figure 15, the ultraviolet irradiation device 212 irradiates a portion of the plate member W2 expanded by the expansion member 208, corresponding to the position of the wafer W1, with ultraviolet rays Ut. Specifically, the ultraviolet irradiation device 212 includes an ultraviolet illumination device. The ultraviolet irradiation device 212 is arranged at the end of the press 213a (see below) of the squeegee unit 213 on the Z1 direction side.

[0111] The ultraviolet irradiation device 212 irradiates the plate member W2 corresponding to the position of the wafer W1 with ultraviolet rays Ut while moving together with the squeegee unit 213. Therefore, when the press 213a is moved from the Y2 direction side to the Y1 direction by the moving mechanism 213c, the ultraviolet irradiation device 212 moves together with the press 213a from the Y2 direction side to the Y1 direction. When the press 213a is moved in the X1 direction from the X2 direction side by the X-direction moving mechanism 213c, the ultraviolet irradiation device 212 moves together with the press 213a in the X1 direction from the X2 direction side. Thus, an ultraviolet irradiation working area Au in which ultraviolet rays are irradiated by the ultraviolet irradiation device 212 has an X-shape in plan view.In the plan view, the center of the ultraviolet irradiation working area Au is a center point Uc. Squeegee unit

[0112] The squeegee unit 213 locally presses the wafer W1 after the expansion member 208 expands the plate member W2 to divide the wafer W1 into a plurality of semiconductor chips Ch. Specifically, the squeegee unit 213 includes the press 213a, the Z-direction moving mechanism 213b, the X-direction moving mechanism 213c, and the rotation mechanism 213d.

[0113] The squeegee unit 213 is arranged within the inner peripheral surface of the expansion ring 281. That is, the press 213a, the Z-direction moving mechanism 213b, the X-direction moving mechanism 213c, and the rotating mechanism 213d are arranged within the inner peripheral surface of the expansion ring 281 in plan view.

[0114] When the press 213a in the squeegee unit 213 is moved by the X-direction moving mechanism 213c from the Y2 direction side to the Y1 direction, the press 213a locally presses the plate member W2 corresponding to the position of the wafer W1. When the press 213a in the squeegee unit 213 is moved by the X-direction moving mechanism 213c from the X2 direction side to the X1 direction, the press 213a locally presses the plate member W2 corresponding to the position of the wafer W1. Thus, a pressing work area As in which the squeegee unit 213 locally presses the wafer W1 has a cross shape in plan view. In plan view, the center of the pressing work area As is a center point Sc. In the Z direction, the center points Hc (in Fig. 15 by a dashed circle), the center Ec1 (in Fig. 15 by a dashed circle), the center Ec2 (in Fig. 15 by a dashed circle), the center Uc (in Fig. 15 represented by a dashed circle) and the center Sc mutually. In Fig. 15, the sizes of the points showing the center Hc, the center Ec1, the center Ec2, the center Uc and the center Sc are different from each other for better illustration. clamping unit

[0115] The clamping unit 214 holds the annular member W3 of the wafer ring structure W. Specifically, the clamping unit 214 includes the gripper 214a, the Z-direction moving mechanism 214b, and the Y-direction moving mechanism 214c. The Z-direction moving mechanism 214b and the Y-direction moving mechanism 214c are common conveying mechanisms for conveying the wafer W1 to the cooling air supply device 206, the cooling unit 207, the expansion member 208, the expansion holding member 210, the heat shrink device 211, the ultraviolet irradiation device 212, and the squeegee unit 213. Linear position relationship

[0116] As in Fig. As shown in Figure 15, in the expansion device 2 according to the first embodiment, the expansion member 208, the cooling air supply device 206, the cooling unit 207, the heat shrink device 211, and the squeegee unit 213 are linearly aligned in plan view. Thus, the Y-direction moving mechanism 214c feeds the wafer W1 to the expansion member 208, the cooling air supply device 206, the cooling unit 207, the heat shrink device 211, and the squeegee unit 213, which are linearly aligned in plan view.

[0117] The cooling unit 207 is arranged below the cooling air supply device 206. The expansion element 208 is arranged below the heat shrink device 211. The squeegee unit 213 and the ultraviolet irradiation device 212 are arranged within the inner peripheral surface of the expansion ring 281. The expansion element 208, the squeegee unit 213, and the ultraviolet irradiation device 212, which are arranged within the inner peripheral surface of the expansion ring 281, are arranged below the heat shrink device 211.

[0118] The cooling air supply device 206, the cooling unit 207, and the expansion element 208 arranged below the heat shrink device 211 are linearly aligned in plan view. Furthermore, the squeegee unit 213 is arranged in a straight line with the cooling air supply device 206, the cooling unit 207, and the expansion element 208 in a direction (Y direction) in which the cooling air supply device 206, the cooling unit 207, and the expansion element 208 are aligned in plan view.

[0119] This means that the center point Sc of the pressing working area As of the doctor unit 213 is located on a movement path Wr of the center point Wc of the wafer W1 together with the center point Cc1 of the cooling air supply device 206, the center point Cc2 (in Fig. 15) of the cooling unit 207 and the center point Ec1 of the expansion member 208. The movement path Wr of the center point Wc of the wafer W1 refers to a path along which the center point Wc of the wafer W1 held by the gripper 214a moves when the gripper 214a is moved by the Y-direction movement mechanism 214c. The movement path Wr of the center point Wc of the wafer W1 extends along the Y direction.

[0120] In this way, the Y-direction moving mechanism 214c supplies the wafer W1 to the expansion member 208, the cooling air supply device 206, the cooling unit 207, and the squeegee unit 213, which are linearly aligned in the plan view.

[0121] The cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 are linearly aligned in plan view. The squeegee unit 213 is arranged linearly with the cooling air supply device 206 and the cooling unit 207 in a direction (Y direction) in which the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 are aligned in plan view.

[0122] That is, the center point Sc of the pressing working area As of the squeegee unit 213 is located together with the center point Cc1 of the cooling air supply device 206, the center point Cc2 of the cooling unit 207 and the center point Hc of the heat shrink device 211 on the movement path Wr of the center point Wc of the wafer W1.

[0123] In this way, the Y-direction moving mechanism 214c supplies the wafer W1 to the cooling air supply device 206, the cooling unit 207, the heat shrink device 211, and the squeegee unit 213, which are linearly aligned in the plan view.

[0124] The squeegee unit 213 is arranged in a straight line with the cooling air supply device 206 and the cooling unit 207 in the direction (Y direction) in which the cooling air supply device 206, the cooling unit 207 and the heat shrink device 211 are aligned in plan view.

[0125] That is, in the plan view, the center point Cc1 of the cooling work area Ac1 in which the plate member W2 is cooled by the cooling air supply device 206, the center point Cc2 of the cooling work area Ac2 in which the plate member W2 is cooled by the cooling unit 207, and the center point Sc of the pressing work area As in which the squeegee unit 213 presses the wafer W1 over the plate member W2 are located on the movement path Wr of the center point Wc of the wafer W1.

[0126] In this way, the Y-direction moving mechanism 214c supplies the wafer W1 to the cooling air supply device 206, the cooling unit 207, and the squeegee unit 213, which are linearly aligned in the plan view.

[0127] The squeegee unit 213 and the ultraviolet irradiation device 212 are arranged in a straight line with the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 in the direction (Y direction) in which the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 are aligned in plan view.

[0128] That is, the center point Sc of the pressing working area As of the squeegee unit 213 and the center point Uc of the ultraviolet irradiation working area Au of the ultraviolet irradiation device 212, together with the center point Cc1 of the cooling air supply device 206, the center point Cc2 of the cooling unit 207, and the center point Hc of the heat shrink device 211, are located on the moving path Wr of the center point Wc of the wafer W1.

[0129] Therefore, the Y-direction moving mechanism 214c supplies the wafer W1 to the cooling air supply device 206, the cooling unit 207, the heat shrink device 211, the ultraviolet irradiation device 212, and the squeegee unit 213, which are linearly aligned in the plan view.

[0130] In a method of manufacturing the semiconductor chip Ch (above-described semiconductor chip manufacturing process), which is a manufacturing method of manufacturing the semiconductor chip Ch, the dicing control computer 111 performs a step of forming a modified layer in the wafer W1 by emitting a laser beam onto the wafer W1 from the laser irradiation device 13a that emits the laser beam.Furthermore, the expansion control computer 109 performs a step of supplying the wafer W1 to the expansion member 208 through the Y-direction moving mechanism 214c, which supplies the wafer W1 to the expansion member 208 that expands the elastic plate member W2, the cooling air supply device 206 and / or the cooling unit 207 that cools the plate member W2, and / or the heat shrinking device 211 that heats and shrinks the plate member W2 while maintaining the gap between the plurality of semiconductor chips Ch, and the squeegee unit 213 that locally presses the wafer W1, all of which are linearly aligned in the plan view.Furthermore, the expansion control computer 109 performs a step of expanding the plate member W2 to divide the wafer W1 into the plurality of semiconductor chips Ch along the dividing line by using the expansion member 208 linearly aligned together with the cooling air supply device 206, the cooling unit 207, and the squeegee unit 213.

[0131] The semiconductor chip Ch manufactured by such a method for manufacturing the semiconductor chip Ch is manufactured by the expansion device 2 having the Y-direction moving mechanism 214c for supplying the wafer W1 to the expansion member 208, the cooling air supply device 206, the cooling unit 207, the heat shrinking device 211, and the squeegee unit 213, all of which are linearly aligned in plan view.

[0132] Advantageous Effects of the First Embodiment According to the first embodiment, the following advantageous effects are achieved.

[0133] According to the first embodiment, as described above, the expansion device 2 includes, in plan view, the Y-direction movement mechanism 214c for supplying the wafer W1 to the expansion member 208, at least one of the cooling air supply device 206, the cooling unit 207, the heat shrink device 211, and the squeegee unit 213. In the plan view, the expansion member 208, the cooling air supply device 206, the cooling unit 207, the heat shrink device 211, and the squeegee unit 213 are linearly aligned.Accordingly, the wafer W1 is supplied to the squeegee unit 213, the expansion member 208, the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211, which are linearly aligned, using the Y-direction moving mechanism 214c, so that a mechanism that supplies the wafer W1 to the squeegee unit 213, the expansion member 208, the cooling air supply device 206, and / or the cooling unit 207 and / or the heat shrink device 211 can be achieved using a linear moving mechanism, and thus the structure of a moving mechanism that supplies the wafer W1 between a plurality of devices such as the expansion member 208 and the squeegee unit 213 can be simplified.

[0134] According to the first embodiment, the expansion device 2, as described above, includes the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211. The expansion member 208 is located below the heat shrink device 211. The cooling air supply device 206 and the cooling unit 207, as well as the expansion member 208 located below the heat shrink device 211, are linearly aligned in plan view. The squeegee unit 213 is arranged in a straight line with the cooling air supply device 206, the cooling unit 207, and the expansion member 208 in the direction in which the cooling air supply device 206, the cooling unit 207, and the expansion member 208 are aligned in plan view. The Y-direction moving mechanism 214c can supply the wafer W1 to the cooling air supply device 206, the cooling unit 207, the expansion member 208, and the squeegee unit 213, which are linearly aligned in plan view.Accordingly, the expansion member 208 is arranged below the heat shrink device 211, so that an increase in the size of the expansion device 2 in the horizontal direction can be reduced or prevented compared to a case where the expansion member 208 deviates in the horizontal direction from the heat shrink device 211. Moreover, the wafer W1 is fed using the Y-direction moving mechanism 214c, so that a mechanism that conveys the wafer W1 to the squeegee unit 213, the expansion member 208, the cooling air supply device 206, and the cooling unit 207 can be achieved using a linear movement mechanism, and thus the structure of the moving mechanism that conveys the wafer W1 between a plurality of devices such as the expansion member 208 and the squeegee unit 213 can be simplified.Consequently, an increase in the size of the expansion device 2 can be reduced or prevented, and the structure of the moving mechanism that feeds the wafer W1 between a plurality of devices such as the expansion member 208 and the squeegee unit 213 can be simplified.

[0135] According to the first embodiment, as described above, the expansion device 2 includes the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211. The expansion member 208 includes the annular expansion ring 281 for expanding the plate member W2 to divide the wafer W1 along the dividing line. The squeegee unit 213 is arranged inside the inner peripheral surface of the expansion ring 281. The cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 are linearly aligned in plan view. The squeegee unit 213 is arranged in a straight line with the cooling air supply device 206 and the cooling unit 207 in the direction in which the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 are aligned in plan view.The Y-direction moving mechanism 214c can supply the wafer W1 to the cooling air supply device 206, the cooling unit 207, the heat shrink device 211, and the squeegee unit 213, which are linearly aligned in plan view. Accordingly, the squeegee unit 213 can be arranged within the inner peripheral surface of the expansion ring 281, effectively utilizing a space within the inner peripheral surface of the expansion ring 281, and thus, an increase in the size of the expansion device 2 can be further reduced or prevented.Furthermore, the wafer W1 is fed using the Y-direction moving mechanism 214c, so that a mechanism that conveys the wafer W1 to the squeegee unit 213, the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 can be achieved using a linear moving mechanism, and thus the structure of the moving mechanism that feeds the wafer W1 between a plurality of devices such as the expansion member 208 and the squeegee unit 213 can be simplified. Consequently, an increase in the size of the expansion device 2 can be reduced or prevented, and the structure of the moving mechanism that feeds the wafer W1 between a plurality of devices such as the expansion member 208 and the squeegee unit 213 can be simplified.

[0136] According to the first embodiment, as described above, the expansion member 208 and the squeegee unit 213 disposed within the inner peripheral surface of the expansion ring 281 are arranged below the heat shrink device 211. The squeegee unit 213 is arranged in a straight line with the cooling air supply device 206 and the cooling unit 207 in the direction in which the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 are aligned in plan view. The Y-direction moving mechanism 214c can supply the wafer W1 to the cooling air supply device 206, the cooling unit 207, the expansion member 208, and the squeegee unit 213 disposed within the inner peripheral surface of the expansion ring 281, which are linearly aligned in plan view.Accordingly, the squeegee unit 213 disposed within the inner peripheral surface of the expansion ring 281 is arranged below the heat shrink device 211, so that an increase in the size of the expansion device 2 in the horizontal direction can be reduced or prevented compared to a case where the squeegee unit 213 disposed within the inner peripheral surface of the expansion ring 281 deviates from the heat shrink device 211 in the horizontal direction. Consequently, the structure of the moving mechanism that feeds the wafer W1 between a plurality of devices such as the expansion member 208 and the squeegee unit 213 can be simplified, and an increase in the size of the expansion device 2 can be further reduced or prevented.

[0137] According to the first embodiment, as described above, the expansion device 2 includes, in addition to the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211, the ultraviolet irradiation device 212 for irradiating the part of the plate member W2 expanded by the expansion member 208 and corresponding to the position of the wafer W1 with ultraviolet rays Ut. The cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 are linearly aligned in plan view. The squeegee unit 213 and the ultraviolet irradiation device 212 are arranged in a straight line with the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 in the direction in which the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 are aligned in plan view.The Y-direction moving mechanism 214c can supply the wafer W1 to the cooling air supply device 206, the cooling unit 207, the heat shrink device 211, the squeegee unit 213, and the ultraviolet irradiation device 212, which are linearly aligned in plan view. Accordingly, the wafer W1 is supplied using the Y-direction moving mechanism 214c, so that a mechanism that conveys the wafer W1 to the cooling air supply device 206, the cooling unit 207, the heat shrink device 211, the squeegee unit 213, and the ultraviolet irradiation device 212 can be achieved using a linear movement mechanism, and thus the structure of the moving mechanism that supplies the wafer W1 between a plurality of devices such as the expansion member 208 and the squeegee unit 213 can be simplified.

[0138] According to the first embodiment, as described above, the expansion member 208 includes the expansion ring 281 for expanding the plate member W2 to divide the wafer W1 along the dividing line. The squeegee unit 213 and the ultraviolet irradiation device 212 are arranged within the inner peripheral surface of the expansion ring 281. The squeegee unit 213 and the ultraviolet irradiation device 212 are arranged in a straight line with the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 in the direction in which the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 are aligned in plan view.The Y-direction moving mechanism 214c is operable to supply the wafer W1 to the cooling air supply device 206, the cooling unit 207, the heat shrink device 211, the squeegee unit 213, and the ultraviolet irradiation device 212, which are arranged within the inner peripheral surface of the expansion ring 281 and are linearly aligned in plan view. Accordingly, the squeegee unit 213 and the ultraviolet irradiation device 212 can be arranged within the inner peripheral surface of the expansion ring 281, effectively utilizing the space within the inner peripheral surface of the expansion ring 281, and thus, an increase in the size of the expansion device 2 can be further reduced or prevented.Furthermore, the wafer W1 is fed using the Y-direction moving mechanism 214c, so that a mechanism that feeds the wafer W1 to the squeegee unit 213, the ultraviolet irradiation device 212, the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 can be achieved using a linear moving mechanism, and thus the structure of the moving mechanism that feeds the wafer W1 between a plurality of devices such as the expansion member 208 and the squeegee unit 213 can be simplified, and an increase in the size of the expansion device 2 can be further reduced or prevented.

[0139] According to the first embodiment, as described above, the expansion device 2 includes, in addition to the cooling air supply device 206 and the cooling unit 207, the clamp unit 214 having the gripper 214a for holding the annular member W3 fixed to the plate member W2 while surrounding the wafer W1, and the Y-direction moving mechanism 214c for moving the gripper 214a holding the annular member W3. In the plan view, the center point Cc1 and the center point Cc2 of the cooling working areas Ac1 and Ac2 in which the plate member W2 is cooled by the cooling air supply device 206 and the cooling unit 207, and the center point Sc of the pressing working area As in which the squeegee unit 213 presses the wafer W1 over the plate member W2, are located on the moving path Wr of the center point Wc of the wafer W1 held by the gripper 214a when the gripper 214a is moved by the Y-direction moving mechanism 214c.Accordingly, when the plate member W2 is cooled by the cooling air supply device 206 and the cooling unit 207, and when the wafer W1 is pressed by the squeegee unit 213, the center points Cc1 and Cc2 of the cooling work areas Ac1 and Ac2 and the center point Sc of the pressing work area As are not shifted in position in the X direction with respect to the wafer W1 held by the gripper 214a. Thus, even without a separate linear motion mechanism extending in the X direction, both the cooling work by the cooling air supply device 206 and the cooling unit 207 and the pressing work by the squeegee unit 213 can be performed. Consequently, an increase in the number of moving mechanisms required in the expansion device 2 can be reduced or prevented, and thus an increase in the size of the expansion device 2 can be further reduced or prevented.

[0140] According to the first embodiment, as described above, the method for manufacturing the semiconductor chip Ch includes a step of supplying the wafer W1 to the expansion member 208 operable to expand the elastic plate member W2 by the Y-direction moving mechanism 214c operable to supply the wafer W1 to the expansion member 208, the cooling air supply device 206 and / or the cooling unit 207 operable to cool the plate member W2, or the heat shrinking device 211 operable to heat and shrink the plate member W2 while maintaining the gap between the plurality of semiconductor chips Ch, and the squeegee unit 213 operable to locally press the wafer W1.The expansion element 208, the cooling air supply device 206, the cooling unit 207 and / or the heat shrink device 211 as well as the doctor unit 213 are aligned linearly with each other in the plan view.Accordingly, the wafer W1 is fed to the squeegee unit 213, the expansion member 208, and the cooling air supply device 206, and / or the cooling unit 207, and / or the heat shrink device 211, which are linearly aligned, using the Y-direction moving mechanism 214c, so that a mechanism that feeds the wafer W1 to the squeegee unit 213, the expansion member 208, and the cooling air supply device 206, and / or the cooling unit 207, and / or the heat shrink device 211 using a linear moving mechanism can be achieved, and thus the method for manufacturing the semiconductor chip Ch can be achieved in which the structure of the moving mechanism that feeds the wafer W1 between a plurality of devices such as the expansion member 208 and the squeegee unit 213 can be simplified.

[0141] According to the first embodiment, as described above, the semiconductor chip Ch is manufactured by the expansion device 2, which has the Y-direction moving mechanism 214c for supplying the wafer W1 to the expansion member 208, the cooling air supply device 206, the cooling unit 207, the heat shrink device 211, and the squeegee unit 213. In the expansion device 2, the expansion member 208, the cooling unit 207, the heat shrink device 211, and the squeegee unit 213 are linearly aligned in plan view.Accordingly, the wafer W1 is fed to the squeegee unit 213, the expansion member 208, and the cooling unit 207 and / or the heat shrink device 211, which are linearly aligned, using the Y-direction moving mechanism 214c, so that a mechanism that feeds the wafer W1 to the squeegee unit 213, the expansion member 208, and the cooling unit 207 and / or the heat shrink device 211 using a linear moving mechanism can be achieved, and thus the semiconductor chip Ch can be obtained from the expansion device 2, which enables a simple structure of the moving mechanism that feeds the wafer W1 between a plurality of devices such as the expansion member 208 and the squeegee unit 213. Second embodiment

[0142] The configuration of a semiconductor wafer processing apparatus 300 according to a second embodiment will now be described with reference to FIG. Fig. 16 to 25. In the second embodiment, unlike the first embodiment, a doctor unit 3213 is arranged outside an expansion ring 3281. In the second embodiment, a detailed description of the same or similar configurations as in the first embodiment will be omitted. Semiconductor wafer processing device

[0143] As in Fig. 16 and Fig. 17, the semiconductor wafer processing apparatus 300 is an apparatus that processes a wafer W1 provided on a wafer ring structure W.

[0144] The semiconductor wafer processing apparatus 300 includes a dicing device 1 and an expanding device 302. An up-down direction is defined as the Z direction, an upward direction is defined as the Z1 direction, and a downward direction is defined as the Z2 direction. In a horizontal direction perpendicular to the Z direction, a direction in which the dicing device 1 and the expanding device 302 are aligned is defined as the X direction, a direction from the dicing device 1 to the expanding device 302 in the X direction is defined as the X1 direction, and a direction from the expanding device 302 to the dicing device 1 in the X direction is defined as the X2 direction.A direction perpendicular to the X direction in the horizontal direction is defined as the Y direction, a direction in the Y direction is defined as the Y1 direction, and the other direction in the Y direction is defined as the Y2 direction. Separation device

[0145] The dicing device 1 emits a laser beam having a wavelength transparent to the wafer W1 along a separation line (street Ws) to form a modified layer.

[0146] The separation device 1 specifically comprises a base 11, a chuck table unit 12, a laser 13 and an image generator 14. Expansion device

[0147] As in the Fig. 17 and Fig. 18, the expansion device 302 divides the wafer W1 to form a plurality of semiconductor chips Ch.

[0148] The expansion device 302 includes a base 201, a cassette unit 202, a lifting hand unit 203, a suction hand unit 204, a base 205, a cooling air supply device 206, a cooling unit 207, an expansion member 3208, a base 209, an expansion holding member 210, a heat shrink device 211, an ultraviolet irradiation device 212, a squeegee unit 3213, and a clamping unit 214. Expansion element

[0149] The expansion element 3208 expands a plate element W2 of the wafer ring structure W to divide the wafer W1 along the separation line.

[0150] The expansion element 3208 has an expansion ring 3281 and a Z-direction movement mechanism 3282.

[0151] The expansion ring 3281 expands the plate member W2 by supporting the plate member W2 from the Z2 direction side. The expansion ring 3281 has a ring shape in plan view. The Z-direction movement mechanism 3282 moves the expansion ring 3281 in the Z1 direction or the Z2 direction. The Z-direction movement mechanism 3282 includes a linear conveyor module or a ball screw and a drive, such as a motor with an encoder. The Z-direction movement mechanism 3282 is fixed to the base 201. In the expanded state, an upper end 3281a of the expansion ring 3281 is held at a predetermined height position Hd by the Z-direction movement mechanism 3282. Squeegee unit

[0152] The squeegee unit 3213 further divides the wafer W1 along the modified layer by pressing the wafer W1 from the side in the Z2 direction after the plate member W2 is stretched. Specifically, the squeegee unit 3213 includes a press 3213a, an X-direction moving mechanism 3213b, a Z-direction moving mechanism 3213c, and a rotation mechanism 3213d.

[0153] The press 3213a generates bending stress in the wafer W1 to divide the wafer W1 along the modified layer by being moved by the rotating mechanism 3213d and the X-direction moving mechanism 3213b, while pressing the wafer W1 from the Z2 direction side over the plate member W2 after being moved by the Z-direction moving mechanism 3213c. The press 3213a is a squeegee roller. The press 3213a is attached to one end of the rotating mechanism 3213d on the Z1 direction side. The Z-direction moving mechanism 3213c moves the rotating mechanism 3213d in the Z1 direction or the Z2 direction. The Z-direction moving mechanism 3213c includes, for example, a cylinder. The Z-direction moving mechanism 3213c is fixed to one end of the X-direction moving mechanism 3213b on the Z1 direction side.The X-direction movement mechanism 3213b includes a linear motion module or a ball screw and a drive, such as a motor with an encoder. The X-direction movement mechanism 3213b is mounted on one end of the base 205 on the Z1 direction side.

[0154] In the squeegee unit 3213, the press 3213a divides the wafer W1 by moving in the Y direction by the X-direction moving mechanism 3213b, while pressing the wafer W1 from the Z2 direction side over the plate member W2 after being moved in the Z1 direction by the Z-direction moving mechanism 3213c. Furthermore, in the squeegee unit 3213, after the press 3213a completes its movement in the Y direction, the press 3213a is rotated 90 degrees by the rotation mechanism 3213d. Moreover, the press 3213a in the squeegee unit 3213 divides the wafer W1 by being moved in the X direction by the X direction moving mechanism 3213b while pressing the wafer W1 from the Z2 direction side over the plate member W2 after being rotated by 90 degrees.

[0155] Control configuration of a semiconductor wafer processing apparatus

[0156] As in Fig. 19, the semiconductor wafer processing apparatus 300 includes a first controller 101, a second controller 102, a third controller 103, a fourth controller 3104, a fifth controller 3105, a sixth controller 3106, a seventh controller 3107, an eighth controller 3108, a ninth controller 3109, a stretch control computer 3110, a handling control computer 3111, a dicing control computer 3112, and a memory 3113.The first controller 101, the second controller 102, the third controller 103, the fifth controller 3105, the sixth controller 3106, the seventh controller 3107, the eighth controller 3108, the ninth controller 3109, the stretch control computer 3110, the handling control computer 3111, the singulation control computer 3112, and the memory 3113 have the same configurations as the first controller 101, the second controller 102, the third controller 103, the fourth controller 104, the fifth controller 105, the sixth controller 106, the seventh controller 107, the eighth controller 108, the stretch control computer 109, the handling control computer 110, the singulation control computer 111, and the memory 112 according to the first embodiment, and therefore its description is omitted.

[0157] The fourth controller 3104 controls the expansion element 3208. The fourth controller 3104 includes a CPU and a memory, which includes, for example, a ROM and a RAM. The fourth controller 3104 may include, for example, a hard disk as memory, which retains stored information even after the power is turned off. Process for manufacturing semiconductor chips

[0158] The overall operation of the semiconductor wafer processing apparatus 300 will be described below with reference to the Fig. 20 and Fig. 21 described.

[0159] The processes in step S1 to step S6, step S8 and step S11 are respectively the same as the processes in step S1 to step S6, step S8 and step S11 in the method for manufacturing semiconductor chips according to the first embodiment, so the description thereof is omitted.

[0160] In step S307, the plate member W2 is expanded by the expansion member 3208. That is, the expansion ring 3281 is moved in the Z1 direction by the Z-direction moving mechanism 3282. The wafer ring structure W is moved in the Z2 direction by a Z-direction moving mechanism 214b while being held by the clamp unit 214. Then, the plate member W2 is expanded by contact with the expansion ring 3281 and pulled by the expansion ring 3281. In this way, the wafer W1 is divided along the dividing line (modified layer).

[0161] As in Fig. As shown in Fig. 21, in step S309, while the heat shrinking device 211 heats and shrinks the plate member W2 and the ultraviolet irradiation device 212 irradiates the plate member W2 with ultraviolet rays Ut, the clamp unit 214 is lifted. At this time, an inlet 210c sucks in air near the heated plate member W2. In step S310, the wafer ring structure W is moved by the clamp unit 214 to the squeegee unit 3213. That is, the wafer ring structure W is moved in the Y2 direction by a Y-direction moving mechanism 214c while being held by the clamp unit 214.

[0162] In step S311, after the wafer ring structure W is moved to the squeegee unit 3213, the wafer W1 is pressed by the squeegee unit 3213. Thus, the wafer W1 is further divided by the squeegee unit 3213.

[0163] Arrangement positions of cooling air supply, cooling unit, expansion element, expansion holding element, heat shrink device, ultraviolet irradiation device and squeegee unit

[0164] The arrangement positions of the cooling air supply device 206, the cooling unit 207, the expansion member 3208, the expansion holding member 210, the heat shrink device 211, the ultraviolet irradiation device 212 and the doctor unit 3213 in the plan view will now be described with reference to the Fig. 22 to 25 described.

[0165] As in Fig. 22, the expansion device 2 comprises the cooling air supply device 206, the cooling unit 207, the expansion element 3208, the expansion holding element 210, the heat shrink device 211, the ultraviolet irradiation device, the doctor unit 3213 and the clamping unit 214. In the Fig. 22 to 24, the suction hand unit 204 is not shown for better illustration.

[0166] As in the Fig. 22 and Fig. As shown in Figure 23, the cooling air supply device 206 cools the plate member W2 before the plate member W2 is expanded by the expansion member 3208. Specifically, the cooling air supply device 206 includes a supply device main body 206a, a cooling air supply opening 206b, and a moving mechanism 206c.

[0167] In the cooling air supply device 206, the supply device main body 206a is lowered to a lowered position by the moving mechanism 206c, and then cooling air is discharged through the cooling air supply port 206b. At this time, the cooling air discharged through the cooling air supply port 206b is accumulated in a cooling working area Ac1 on the wafer W1 side (inside) of an annular member W3 of the wafer ring structure W, and thus a part of the plate member W2 corresponding to the cooling working area Ac1 is cooled. In the horizontal direction perpendicular to the Z direction, the center of the cooling working area Ac1 of the cooling air supply device 206 is a center point Cc1.

[0168] After the cooling air supply device 206 has finished cooling the portion of the plate member W2 corresponding to the cooling working area Ac1, the supply of cooling air from the cooling air supply device 206 is stopped, and the supply device main body 206a is lifted to a lifted position by the moving mechanism 206c.

[0169] The cooling air supply device 206 can move up and down so as not to interfere with the expansion element 3208, the heat shrink device 211, the squeegee unit 3213, and the clamping unit 214. Specifically, the cooling air supply device 206 can move downward to a working position in which the cooling air supply device 206 does not collide with the adjacent expansion element 3208, the heat shrink device 211, and the squeegee unit 3213. The cooling air supply device 206 can move upward to a retracted position in which the cooling air supply device 206 does not collide with the adjacent expansion element 3208, the heat shrink device 211, and the squeegee unit 3213. Cooling unit

[0170] The cooling unit 207 cools the plate element W2 before the plate element W2 is expanded by the expansion element 3208. Specifically, the cooling unit 207 includes a cooling element 207a having a heat sink 271 and a Peltier element 272, as well as a Z-direction movement mechanism 207b.

[0171] In the cooling unit 207, the cooling element 207a is raised to a raised position Upc by the Z-direction moving mechanism 207b, and then the heat sink 271 is cooled by the Peltier element 272, so that a portion of the plate member W2 that contacts the heat sink 271 in the Z direction is cooled. Thus, the portion of the plate member W2 that contacts the heat sink 271 in the Z direction is a cooling working area Ac2 of the cooling unit 207. In the horizontal direction perpendicular to the Z direction, the center of the cooling working area Ac2 of the cooling unit 207 is a center point Cc2. In the Z direction, the centers Cc1 and Cc2 intersect.

[0172] After the cooling unit 207 has finished cooling a portion of the plate member W2 corresponding to the cooling working area Ac2, the cooling by the cooling unit 207 is stopped, and the cooling member 207a is lowered to a lowered position Lwc by the Z-direction moving mechanism 207b.

[0173] The cooling unit 207 can move up and down so as not to collide with the expansion member 3208, the heat shrink device 211, the squeegee unit 3213, and the clamping unit 214. Specifically, the cooling unit 207 can move upward to a working position (raised position Upc) in which the cooling unit 207 does not collide with the adjacent expansion member 3208, the heat shrink device 211, the squeegee unit 3213, and the clamping unit 214. The cooling unit 207 can move downward to a retracted position (lowered position Lwc) in which the cooling unit 207 does not collide with the adjacent expansion member 3208, the heat shrink device 211, the squeegee unit 3213, and the clamping unit 214. Expansion element

[0174] As in the Fig. 23 and Fig. As shown in Figure 24, the expansion member 3208 divides the wafer W1 into a plurality of semiconductor chips Ch along the dividing line (road Ws) by expanding the elastic plate member W2. Specifically, the expansion member 3208 includes the expansion ring 3281 and the Z-direction moving mechanism 3282. The expansion ring 3281 is an annular member that divides the wafer W1 along the dividing line by expanding the plate member W2.

[0175] The expansion element 3208 is arranged below the heat shrink device 211. That is, the expansion ring 3281 is arranged below the heat shrink device 211. In the plan view, the center of the annular expansion ring 3281 is a center point Ec1.

[0176] In the expansion member 3208, the expansion ring 3281 is raised to an upper position Upe by the Z-direction movement mechanism 3282 to expand the plate member W2. After the expansion ring 3281 finishes expanding or spreading the plate member W2, the expansion ring 3281 is lowered to a lowered position Lwe by the Z-direction movement mechanism 3282.

[0177] The expansion member 3208 can move up and down to avoid interference with the squeegee unit 3213 and the clamping unit 214. Specifically, the expansion member 3208 can move upward to a working position (upward position Upe) where the expansion member 3208 does not interfere with the adjacent squeegee unit 3213 and the clamping unit 214. The expansion member 3208 can move downward to a retracted position (lowered position Lwe) where the expansion member 3208 does not interfere with the adjacent squeegee unit 3213 and the clamping unit 214. Expansion holding element

[0178] The expansion holding member 210 includes a pressing ring 210a, a lid 210b, an inlet 210c, and a Z-direction moving mechanism 210d. The pressing ring 210a is an annular member. In plan view, the center of the annular pressing ring 210a is a center point Ec2. The configuration of the expansion holding member 210 is the same as the configuration of the expansion holding member 210 according to the first embodiment, and therefore, the description thereof is omitted. Heat shrink device

[0179] The heat shrink device 211 heats and shrinks the plate member W2 expanded by the expansion member 3208 while maintaining a gap between the plurality of semiconductor chips Ch. Specifically, the heat shrink device 211 includes a heater ring 211a and a Z-direction moving mechanism 211b. The heater ring 211a has a ring shape in plan view. In the plan view, the center of the ring-shaped heater ring 211a is a center point Hc. The structure of the heat shrink device 211 is the same as the structure of the heat shrink device 211 according to the first embodiment, so a description thereof is omitted. Ultraviolet irradiation facility

[0180] As in the Fig. 24 and Fig. As shown in Figure 25, the ultraviolet irradiation device 212 irradiates a portion of the plate member W2 expanded by the expansion member 3208, which corresponds to the position of the wafer W1, with ultraviolet rays Ut. Specifically, the ultraviolet irradiation device 212 includes an ultraviolet illumination device. The ultraviolet irradiation device 212 is arranged within the inner peripheral surface of the expansion ring 3281 in plan view.

[0181] The ultraviolet irradiation device 212 irradiates the plate element W2 corresponding to the position of the wafer W1 with ultraviolet rays Ut without moving. This means that the ultraviolet irradiation working area Au, in which the ultraviolet irradiation is carried out by the ultraviolet irradiation device, has a circular shape in plan view. In plan view, the center of the ultraviolet irradiation working area Au is a center point Uc. In the Z direction, the centers Hc, Ec1, Ec2, and Uc overlap. Fig. 25, the sizes of the points showing the center Hc, the center Ec1, the center Ec2, the center Uc and the center Sc are different from each other for better illustration. Squeegee unit

[0182] The squeegee unit 3213 locally presses the wafer W1 after the expansion member 3208 expands the plate member W2 to divide the wafer W1 into the plurality of semiconductor chips Ch. Specifically, the squeegee unit 3213 includes the press 3213a, the X-direction moving mechanism 3213b, the Z-direction moving mechanism 3213c, and the rotation mechanism 3213d.

[0183] The squeegee unit 3213 is arranged between the expansion ring 281 and the cooling unit 207 on the base 205. When the press 3213a in the squeegee unit 3213 is moved from the Y2 direction side to the Y1 direction by the X-direction moving mechanism 3213b, the press 3213a locally presses the plate member W2 according to the position of the wafer W1. When the press 3213a in the squeegee unit 3213 is moved from the X2 direction side to the X1 direction by the X-direction moving mechanism 3213b, the press 3213a locally presses the plate member W2 according to the position of the wafer W1. Thus, a pressing working area As in which the squeegee unit 3213 locally presses the wafer W1 has a cross shape in plan view. In the plan view, the center of the pressing working area As is a center point Sc.

[0184] In the squeegee unit 3213, the press 3213a is raised to a raised position Ups by the Z-direction movement mechanism 3213c to locally press the wafer W1. Further, in the squeegee unit 3213, after the press 3213a has finished locally pressing the wafer W1, the press 3213a is lowered to a lowered position Lws by the Z-direction movement mechanism 3213c (see Fig. 23) lowered.

[0185] The squeegee unit 3213 can move up and down to avoid interference with the expansion member 3208, the cooling unit 207, and the clamping unit 214. Specifically, the squeegee unit 3213 can move upward to a working position (upper position Ups) in which the squeegee unit 3213 does not interfere with the adjacent expansion member 3208, the cooling unit 207, and the clamping unit 214. The squeegee unit 3213 can move downward to a retracted position (lowered position Lws) in which the squeegee unit 3213 does not interfere with the adjacent expansion member 3208, the cooling unit 207, and the clamping unit 214. clamping unit

[0186] The clamping unit 214 holds the annular member W3 of the wafer ring structure W. Specifically, the clamping unit 214 includes a gripper 214a, the Z-direction moving mechanism 214b, and the Y-direction moving mechanism 214c. The Z-direction moving mechanism 214b and the Y-direction moving mechanism 214c are common conveying mechanisms for conveying the wafer W1 to the cooling air supply device 206, the cooling unit 207, the expansion member 3208, the expansion holding member 210, the heat shrink device 211, the ultraviolet irradiation device 212, and the squeegee unit 3213. Linear position relationship

[0187] As in Fig.As shown in Figure 25, in the expansion device 2 according to the second embodiment, the expansion member 3208, at least one of the cooling air supply device 206, the cooling unit 207, and / or the heat shrink device 211, and the squeegee unit 3213 are linearly aligned in plan view. Thus, the Y-direction moving mechanism 214c guides the wafer W1 to the expansion member 3208, the cooling air supply device 206, the cooling unit 207, and / or the heat shrink device 211, and the squeegee unit 3213, which are linearly aligned in plan view.

[0188] The cooling unit 207 is arranged below the cooling air supply 206. The expansion element 3208 is arranged below the heat shrink device 211. The ultraviolet irradiation device 212 is arranged within the inner peripheral surface of the expansion ring 281. The expansion element 3208 and the ultraviolet irradiation device 212, which are arranged within the inner peripheral surface of the expansion ring 281, are arranged below the heat shrink device 211. The squeegee unit 3213 is arranged between the cooling unit 207 and the expansion ring 281.

[0189] The cooling air supply device 206, the cooling unit 207, and the expansion element 3208 arranged below the heat shrink device 211 are linearly aligned in plan view. Furthermore, the squeegee unit 3213 is arranged in a straight line with the cooling air supply device 206, the cooling unit 207, and the expansion element 3208 in a direction (Y direction) in which the cooling air supply device 206, the cooling unit 207, and the expansion element 3208 are aligned in plan view.

[0190] That is, the center point Sc of the pressing working area As of the squeegee unit 3213, along with the center point Cc1 of the cooling air supply device 206, the center point Cc2 of the cooling unit 207, and the center point Ec1 of the expansion member 3208, is located on a movement path Wr of the center point Wc of the wafer W1. The movement path Wr of the center point Wc of the wafer W1 refers to a path along which the center point Wc of the wafer W1 held by the gripper 214a moves when the gripper 214a is moved by the Y-direction movement mechanism 214c. The movement path Wr of the center point Wc of the wafer W1 extends along the Y direction.

[0191] The cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 are aligned linearly in plan view. The squeegee unit 3213 is arranged in a straight line with the cooling air supply device 206 and the cooling unit 207 in a direction (Y direction) in which the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 are aligned in plan view.

[0192] That is, the center point Sc of the pressing working area As of the squeegee unit 3213 is located together with the center point Cc1 of the cooling air supply device 206, the center point Cc2 of the cooling unit 207 and the center point Hc of the heat shrink device 211 on the movement path Wr of the center point Wc of the wafer W1.

[0193] In this way, the Y-direction moving mechanism 214c supplies the wafer W1 to the cooling air supply device 206, the cooling unit 207, the heat shrink device 211, and the squeegee unit 3213, which are linearly aligned in the plan view.

[0194] The squeegee unit 3213 is arranged in a straight line with the cooling air supply device 206 and the cooling unit 207 in the direction (Y direction) in which the cooling air supply device 206, the cooling unit 207 and the heat shrink device 211 are aligned in plan view.

[0195] That is, the center point Cc1 of the cooling working area Ac1 in which the plate member W2 is cooled by the cooling air supply device 206, the center point Cc2 of the cooling working area Ac2 in which the plate member W2 is cooled by the cooling unit 207, and the center point Sc of the pressing working area As in which the squeegee unit 3213 presses the wafer W1 over the plate member W2 are located on the movement path Wr of the center point Wc of the wafer W1 in the plan view.

[0196] In this way, the Y-direction moving mechanism 214c supplies the wafer W1 to the cooling air supply device 206, the cooling unit 207, and the squeegee unit 213, which are linearly aligned in the plan view.

[0197] The squeegee unit 3213 and the ultraviolet irradiation device 212 are arranged in a straight line with the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 in the direction (Y direction) in which the cooling air supply device 206, the cooling unit 207, and the heat shrink device 211 are aligned in plan view.

[0198] That is, the center point Sc of the pressing working area As of the squeegee unit 3213 and the center point Uc of the ultraviolet irradiation working area Au of the ultraviolet irradiation device 212 are located on the moving path Wr of the center point Wc of the wafer W1, together with the center point Cc1 of the cooling air supply device 206, the center point Cc2 of the cooling unit 207, and the center point Hc of the heat shrink device 211.

[0199] In this way, the Y-direction moving mechanism 214c feeds the wafer W1 to the cooling air supply device 206, the cooling unit 207, the heat shrink device 211, the ultraviolet irradiation device, and the squeegee unit 213, which are linearly aligned in plan view. The other configurations of the second embodiment are similar to those of the first embodiment, so their description is omitted. Advantageous effects of the second embodiment

[0200] According to the second embodiment, the following advantageous effects are achieved.

[0201] According to the second embodiment, the expansion device 302, similar to the first embodiment, includes the Y-direction moving mechanism 214c for supplying the wafer W1 to the expansion member 3208, the cooling air supply device 206, the cooling unit 207, and / or the heat shrink device 211, and the squeegee unit 3213, which are linearly aligned in plan view. Accordingly, the structure of a moving mechanism that transports the wafer W1 between a plurality of devices such as the expansion member 3208 and the squeegee unit 3213 can be simplified. The other advantageous effects of the second embodiment are similar to those of the first embodiment, so their description is omitted. Modification examples

[0202] The embodiments disclosed at this time are to be considered as illustrative and not restrictive in all respects. The scope of the present invention is not indicated by the above description of the embodiments, but by the scope of the claims. Furthermore, all modifications (modification examples) are included within the meaning and scope corresponding to the scope of the claims.

[0203] For example, although the example in which the expansion member 208 (3208) is arranged below the shrinking device 211 (heating device) was shown in each of the aforementioned first and second embodiments, the present invention is not limited thereto. In the present invention, the expansion member may also be arranged without being arranged below the heating device.

[0204] Although in each of the aforementioned first and second embodiments, the example in which the cooling air supply device 206 and the cooling unit 207 (cooling device) and the expansion member 208 (3208) arranged below the heat shrink device 211 (heating device) are linearly aligned in plan view was shown, the present invention is not limited thereto. In the present invention, the cooling device and the expansion member arranged below the heating device may not be linearly aligned in plan view.

[0205] Although the example in which the ultraviolet irradiation device 212 is disposed within the inner peripheral surface of the expansion ring 281 (3281) was shown in each of the aforementioned first and second embodiments, the present invention is not limited thereto. In the present invention, the ultraviolet irradiation device may not be disposed within the inner peripheral surface of the expansion ring.

[0206] Although the example in which the expansion device 2 (302) includes the ultraviolet irradiation device 212 was shown in each of the above-mentioned first and second embodiments, the present invention is not limited thereto. In the present invention, the expansion device may not include the ultraviolet irradiation device. List of reference symbols 2, 302 expansion device 13a Laser irradiation device 206 Cooling air supply device (cooling device) 207 Cooling unit (cooling device) 208, 3208 expansion element 211 Heat shrink tubing (heating device) 212 Ultraviolet irradiation facility 213, 3213 doctor blade unit 214 clamping unit 214a gripper 214c Y-direction motion mechanism (linear motion mechanism) 281, 3281 expansion ring Ac1 cooling work area Ac2 cooling work area As press work area Cc1 center Cc2 center Ch semiconductor chip Sc center Ut ultraviolet rays W1 wafer W2 plate element W3 annular element Toilet Center Wr movement path QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 6298635 [0002, 0003, 0004, 0005, 0006]

Claims

[1] Expansion device, comprising: an expansion member for expanding an elastic plate member to divide a wafer into a plurality of semiconductor chips along a dividing line; a cooling device for cooling the plate member before the plate member is expanded by the expansion element and / or a heating device for heating and shrinking the plate member expanded by the expansion element while maintaining a gap between the plurality of semiconductor chips; a doctor unit for locally pressing the wafer after the expansion member expands the plate member to divide the wafer into the plurality of semiconductor chips; and a moving mechanism for feeding the wafer to the expansion element, the cooling device and / or the heating device and the doctor unit; wherein the expansion element, the cooling device and / or the heating device and the doctor unit are linearly aligned in a plan view. [2] Expansion device according to claim 1, comprising: both the cooling device and the heating device; where the expansion element is under the heating device; the cooling device and the expansion element are linearly aligned under the heating device in plan view; the doctor blade unit is in a straight line with the cooling device and the expansion element in a direction in which the cooling device and the expansion element are aligned in plan view; and the movement mechanism is operable to feed the wafer to the cooling device, the expansion element and the doctor unit, which are linearly aligned in plan view. [3] Expansion device according to claim 1, comprising: both the cooling device and the heating device; where the expansion member comprises an expansion ring having a ring shape for expanding the plate member to divide the wafer along the separation line; the doctor unit is within an inner peripheral surface of the expansion ring; the cooling device and the heating device are aligned linearly in plan view; the doctor blade unit is in a straight line with the cooling device and the expansion element in a direction in which the cooling device and the expansion element are aligned in plan view; and the movement mechanism is operable to feed the wafer to the cooling device, the heating device and the doctor unit, which are linearly aligned in plan view. [4] Expansion device according to claim 3, wherein the expansion element and the doctor unit are within the inner peripheral surface of the expansion ring under the heating device; the doctor blade unit is in a straight line with the cooling device in a direction in which the cooling device and the heating device are aligned in plan view; and the moving mechanism is operable to feed the wafer to the cooling device, the expansion element and the doctor unit within the inner peripheral surface of the expansion ring, which are linearly aligned in plan view. [5] The expansion device according to claim 1, further comprising: in addition to the cooling device and the heating device, an ultraviolet irradiation device for irradiating a portion of the plate member extended by the expansion member, which corresponds to a position of the wafer, with ultraviolet rays; wherein the cooling device and the heating device are aligned linearly in plan view; the doctor unit and the ultraviolet irradiation device are in a straight line with the cooling device and the heating device in a direction in which the cooling device and the heating device are aligned in plan view; and the moving mechanism is operable to feed the wafer to the cooling device, the heating device, the doctor unit and the ultraviolet irradiation device, which are linearly aligned in plan view. [6] Expansion device according to claim 5, wherein the expansion member comprises an expansion ring for expanding the plate member to divide the wafer along the separation line; the doctor unit and the ultraviolet irradiation device are located within an inner peripheral surface of the expansion ring; the doctor blade unit and the ultraviolet irradiation device are in a straight line with the cooling device and the heating device in the direction in which the cooling device and the heating device are aligned in plan view; and the moving mechanism is operable to feed the wafer to the cooling device, the heating device, the doctor unit and the ultraviolet irradiation device, wherein the cooling device, the heating device, the doctor unit and the ultraviolet irradiation device are linearly aligned in plan view, wherein the doctor unit and the ultraviolet irradiation device are within the inner peripheral surface of the expansion ring. [7] The expansion device according to claim 1, further comprising: in addition to the cooling device, a clamping unit having a gripper for holding an annular member fixed to the plate member while surrounding the wafer, and a linear motion mechanism as a moving mechanism for moving the gripper holding the annular member; wherein in plan view, a center of a cooling working area in which the plate member is cooled by the cooling device and a center of a pressing working area in which the doctor unit presses the wafer over the plate member lie on a movement path of a center point of the wafer held by the gripper when the gripper is moved by the linear movement mechanism; and the linear motion mechanism is operable to feed the wafer to the cooling device, the expansion element and the doctor unit, which are linearly aligned in plan view. [8] A method for manufacturing a semiconductor chip, comprising: Forming a modified layer in a wafer having a plurality of semiconductor chips by emitting a laser beam onto the wafer from a laser irradiation device operable to emit the laser beam; Feeding the wafer to an expansion element operable to expand an elastic plate member by a moving mechanism operable to feed the wafer to the expansion element, a cooling device operable to cool the plate member, and / or a heating device operable to heat and shrink the plate member while maintaining a gap between the plurality of semiconductor chips, and a squeegee unit operable to locally press the wafer, wherein the expansion element, the cooling device, and / or the heating device, and the squeegee unit are linearly aligned in a plan view; and Expanding the plate member to divide the wafer into the plurality of semiconductor chips along a dividing line by the expanding member. [9] A semiconductor chip manufactured by an expansion device, the expansion device comprising: an expansion member for expanding an elastic plate member to divide a wafer into a plurality of semiconductor chips along a dividing line; a cooling device for cooling the plate member before the plate member is expanded by the expansion element, and / or a heating device for heating and shrinking the plate member expanded by the expansion element while maintaining a gap between the plurality of semiconductor chips; a doctor unit for locally pressing the wafer after the expansion member expands the plate member to divide the wafer into the plurality of semiconductor chips; and a moving mechanism for feeding the wafer to the expansion element, the cooling device and / or the heating device, and the doctor unit; wherein the expansion element, the cooling device and / or the heating device, as well as the doctor unit are linearly aligned in a plan view.

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