Fluid compression device

Abstract

A fluid compression device, said device comprising a housing (6) defining first and second compartments (14, 16), said second compartment (16) housing one or more heat-generating components (18) configured for controlling the compression of the fluid in the first compartment (14), said housing (6) comprising a partition (12) separating the first and second compartments (14, 16), said device comprising one or more heat sinks (102) attached to a zone of said partition (12) located at least partially opposite said heat-generating component(s) (18), said heat sink(s) (105) being configured to be at least partially in contact with said fluid. Figure for abbreviation: Figure 7

Description

Title of the invention: Fluid compression device

[0001] The invention relates to a device for compressing a fluid, in particular a refrigerant. It is intended, for example, for applications in thermoregulation systems, particularly in the automotive field.

[0002] In this field, compression devices comprising a housing defining a main compartment for an electric motor and compression elements driven by the motor are known. The housing also includes another compartment housing a motor control system. This control system includes a power module equipped with electronic switches for regulating the motor's supply current. Such a power module generates significant heat, which must be dissipated to prevent excessive heating of the control system and limit the risk of failure of the compression devices.

[0003] For this purpose, it is known to circulate the refrigerant to be compressed in the main housing in contact with a partition separating said main housing from the housing in which said control system is located. The heat released by said control system can thus be transferred to the refrigerant by conduction through said partition.

[0004] However, with the increasing power of compressors and their control system, the amount of heat to be dissipated increases and there remains a need to strengthen the cooling of said control systems.

[0005] The invention aims to overcome at least in part the previous drawbacks and proposes for this purpose a fluid compression device, said device comprising a housing defining first and second compartments, said second compartment housing one or more heat-generating components, configured for controlling the compression of the fluid in the first compartment, said housing comprising a partition separating the first and second compartments, said device comprising one or more heat sinks attached to an area of ​​said partition located at least in part opposite said heat-generating component(s), said heat sink(s) being configured to be at least in part in contact with said fluid.

[0006] Thanks to their location, the heat sink(s) facilitate the cooling of the heat-generating component(s) using said fluid, either directly or through the partition. Furthermore, using attached heat sinks allows for greater design flexibility compared to fins made from solid material.

[0007] According to various additional features of the invention, which may be taken together or separately and which constitute so many embodiments of the invention:

[0008] - the said heat sink(s) comprise a base and first fins,

[0009] - said partition comprises one or more openings between said first and second dwellings,

[0010] - the said heat sink(s) are housed in the said orifice(s),

[0011] - said base is in a heat exchange relationship with said component(s) heat generator,

[0012] - said first fins are configured to be in contact with said fluid,

[0013] - said device has a thermal interface layer between said partition and the or said heat-generating components,

[0014] - said device has a thermal interface layer between said heat sinks and the aforementioned heat-generating component(s),

[0015] - the said heat sink(s) are made of copper and / or copper alloy,

[0016] - the casing is made of aluminium and / or aluminium alloy,

[0017] - said partition has a projecting shape towards the second dwelling, the or said heat-generating components being located opposite said protruding shape,

[0018] - said protruding shape has a flattened apex, said component(s) heat generators being located opposite said summit,

[0019] - the said opening orifice(s) are located at the level of said protruding shape, including said summit,

[0020] - said partition has second heat dissipation fins, originating from material of the casing, on the side of the first housing,

[0021] - said second fins are located near and / or opposite said shape projecting,

[0022] - the heat-generating component(s) include a power module.

[0023] - said power module includes electronic switches and / or diodes,

[0024] - said device comprises a printed circuit board,

[0025] - the said heat-generating component(s) are fixed and / or connected to said card,

[0026] - said device includes means for fixing said power module on said case,

[0027] - said partition includes raised sections of material in the form of bosses equipped bores to accommodate said fastening components.

[0028] The invention will be better understood, and other objects, details, features and advantages thereof will become more apparent during the explanatory description detailed description that follows, of at least one embodiment of the invention given by way of purely illustrative and non-limiting example, with reference to the attached schematic drawings, among which:

[0029] [Fig.1] schematically illustrates in cross-section a compression device to which the invention applies;

[0030] [Fig.2] schematically illustrates in perspective from above a first example of a compression device according to the invention during one of its assembly stages;

[0031] [Fig.3] schematically illustrates in cross-section a part, identified as D in [Fig.2], of said compression device, during a later assembly step;

[0032] [Fig.4] schematically illustrates, from below, the part marked D in [Fig.2]

[0033] [Fig.5] schematically illustrates, from a bottom view, an alternative embodiment from one of the parts of the first example of the realization of the compression device shown in figures 2 to 4;

[0034] [Fig.6] schematically illustrates in perspective from above a second example of a compression device according to the invention during one of its assembly stages;

[0035] [Fig.7] schematically illustrates in cross-section a part, identified as D' in [Fig.6], of said compression device, during a later assembly step.

[0036] It should first be noted that the terms "first", "second", "third", ... are used only to distinguish the components concerned from each other and do not imply any order or possible importance of said components.

[0037] As illustrated in [Fig. 1], the invention relates to a fluid compression device. It will find applications, for example, in a motor vehicle for compressing a refrigerant fluid in a thermoregulation system for areas of the vehicle, such as a vehicle passenger compartment, and / or for vehicle components, such as an electrical energy storage device, an electric motor for the vehicle and / or an electronic control device for said electric motor.

[0038] Said fluid comprises, for example, a refrigerant and a lubricating fluid. Said refrigerant is composed, in particular, of a hydrofluorocarbon, such as that known as R-134a. Alternatively, it is, in particular, the fluid known as R1234yf or carbon dioxide, also known as R744.

[0039] Said device comprises a housing 6 defining first and second compartments 14, 16. Said housing further comprises a partition 12 separating the first and second compartments 14, 16. The housing, including said partition 12, is preferably made of aluminum and / or aluminum alloy. It is, for example, cast and / or forged.

[0040] Said second housing 16 accommodates one or more heat-generating components, not illustrated in this figure, configured for controlling the compression of the fluid in the first housing 14. An example of such heat-generating components will be detailed later.

[0041] In the illustrated embodiment, said device comprises a control system 10, located in said second housing 16. Said control system 10 advantageously integrates said heat-generating component(s). Said device, more particularly said control system 10, comprises a printed circuit board 8. Said heat-generating component(s) are fixed and / or electrically connected to said board 8.

[0042] In the first housing 14, said device includes here a compressor 2 of said fluid and an electric motor 4 for driving said compressor 2. Said or said heat-generating component(s) are intended for controlling the motor 4 in particular by means of said control system 10.

[0043] Advantageously, said housing 6 is configured so that said fluid passes through said first housing 14, allowing cooling of said control system 10, or at least of said heat-generating component(s).

[0044] In more detail, here, said housing 6 is configured so that said fluid passing through said first housing 14 is in contact with said partition 12, in particular before passing through said motor 8. In this way, by heat exchange through said partition 12, said fluid cools said control system 10, at least said heat-generating component(s).

[0045] Said device has, for example, an inlet 22 of said fluid in said first housing 14, in particular located near said partition 12, and / or an outlet 24 of said fluid, in particular located at an opposite longitudinal end of said first housing 14. The fluid thus enters the first housing 14 through said inlet 22, at low pressure, passes over the partition 22, passes axially through said motor 4 and then through said compressor 2 to exit, at high pressure, through said outlet 24.

[0046] As illustrated in Figures 2 and 6, the device here comprises a single heat-generating component, intended to be located at a position 100.

[0047] Advantageously, said partition 12 has a projecting shape 42 in the direction of the second housing 16. Said projecting shape 42 is made, for example, in the form of a boss. Said projecting shape 42 here has a flattened apex 44. Said heat-generating component is intended to be located opposite said projecting shape 42, more particularly opposite said apex 44.

[0048] As illustrated in Figures 3 and 7, in the embodiments shown, said heat-generating component, designated 18, forms a power module 20, that is to say, here, a module intended to supply said motor 4 with electric currents alternating currents, also called power currents, are generated from a direct current and control currents. For this purpose, the power module 20 includes, for example, electronic switches and / or diodes. These switches are formed, in particular, from insulated-gate bipolar transistors or IGBTs (insulated-gate bipolar transistors).

[0049] The power module 20 here takes the form of a resin block. The resin block encases active components, defining in particular the switch(es), as well as electrical conductors connected, on the one hand, to the active components and, on the other hand, to connection terminals of the module 20. The resin block defines the external faces of the power module 20. The heat emitted by the heat-generating component 18 is dissipated through at least one of the faces, namely, a first large face 34 of the power module 20 opposite a second large face 26.

[0050] After assembly, said vertex 44, and / or said first large face 34 of the power module 20 present substantially the same surface so that their contour stacks up coincidentally.

[0051] According to the invention, said device comprises one or more heat sinks 102, located at the level of an area of ​​said partition 12 situated at least partially opposite said heat-generating component(s) 18. Here, a single heat sink 102 is provided, at said location 100. In addition, said heat sink(s) 102 are configured to be at least partially in contact with said fluid circulating in the first housing 14.

[0052] Thanks to such a location, the heat sink(s) 102 make it possible to promote the cooling of the heat-generating component(s) using said fluid, either directly or through the partition 12. In addition, providing added heat sinks allows greater freedom of configuration compared to fins made from the material of a housing.

[0053] Preferably, the said heat sink(s) 102 are made of copper and / or copper alloy.

[0054] Advantageously, the device has a thermal interface layer 32 between the partition 12 and the heat-generating component 18, more particularly its first large face 34. The thermal interface layer 32 is formed, for example, of a paste-like material. By virtue of its viscosity, such a thermal interface layer has the advantage of being able to fill any surface defects in the partition 12 and / or the power module 20.

[0055] The heat sink(s) 102 comprise a base 104 and first fins 106. The first fins 106 are configured to be in contact with the fluid circulating in the first housing 14.

[0056] In the embodiment shown in Figures 3 and 4, said partition 12 is continuous and unperforated, at least at the level of said heat-generating component 18, and the heat sink 102 is attached to said partition 12, on one of its faces, referred to as the inner face, located opposite the first housing 14. Here, said base 104 of said heat sink 102 is fixed, with contact, to said inner face of the partition 12, for example by screwing. The first fins 106 extend from the base 104 towards the interior of the first housing 14, in particular perpendicularly to said base 104.

[0057] Still according to the same example, as illustrated in figures 4 and 5, said heat sink 102 includes tabs 108 for fixing to the partition 12. Said fixing tabs 108 have, for example, bores 110 allowing passage of a screw 112 for fixing said heat sink 102 to said partition 12.

[0058] Preferably, said fixing lugs 108 extend here from said base 104 so as to be in contact with said internal surface of the partition 12. Said base 104 and / or said fixing lugs 108 here follow said internal surface of the partition 12, in particular an internal contour of the boss defining said protruding shape 42.

[0059] Said heat sink 102 extends, for example, transversely, in particular perpendicularly to a longitudinal extension direction of said protruding shape 42. Said base 104 is housed, for example, in a groove 114 defined in relief by said protruding shape 42 and / or said fixing tabs 108 extend on either side of said groove 114.

[0060] In the embodiment of [Fig.4], at least some of said first fins 106 are perpendicular to said longitudinal extension direction of said protruding shape 42 and therefore follow a longitudinal extension direction of said heat sink 102. One of the first fins has a curved profile, configured to follow an internal wall 116 of the housing 6.

[0061] In the embodiment of [Fig.5], said first fins 106 are parallel to said longitudinal extension direction of said protruding form 42 and are therefore here perpendicular to a longitudinal extension direction of said heat sink 102.

[0062] In the embodiment shown in Figures 6 and 7, said partition 12 includes one or more orifices 120, here only one, opening between said first and second housings 14, 16. The said heat sink(s) 102 are housed in said orifice(s) 120, in particular so as to ensure a seal between the first and second housings 14, 16.

[0063] As is particularly visible in [Fig. 6], the orifice(s) 120 are located, for example, at the protruding shape 42, in particular at the apex 44. This figure shows that the heat sink 102 is distinguished through said orifice 120. Said orifice 120 here presents a side 124 following the internal wall 116 of the housing 6.

[0064] As can be seen from [Fig.7], said base 104 is in a thermal exchange relationship with said heat-generating component(s) 18. For this purpose, here, said thermal interface layer 32 extends between said heat sink(s) 102, in particular between its base(s) 104, and said heat-generating component(s) 18. Alternatively, said base 104 is in a thermal exchange relationship with said heat-generating component(s) 18 by being in direct contact with said heat-generating component(s) 18.

[0065] Said base 104 is fixed to said partition 12. To achieve the seal between said first and second housings 14, 16, said module includes here a seal 122, located, for example, between a peripheral wall of said base 104 and a wall formed by a thickness of the partition 12, at the level of said orifice 120. In an alternative, not illustrated, said base 104 is, for example, brazed and / or welded to said partition 12 at the level of said orifice 120.

[0066] Referring again to Figures 3 and 7, it can be seen that, in the illustrated embodiments, the device comprises fasteners 36 for securing the power module 20 to the housing 6. These fasteners 36 are formed, in particular, of screws and / or nuts. The power module 20 has openings 38 for the passage of these fasteners 36. The partition 12 is provided with bores 41 for engaging the fasteners 36 in the partition 12. These bores 41 are located in line with the openings 38. The fasteners 36 thus allow the power module 20 to be held on the partition 12 at the location 100.

[0067] Said fastening members 36 are here located at two longitudinally opposite sides of said power module 20.

[0068] In these figures, we can further distinguish at least some of the terminals of said power module 20. They are identified as 21. They are oriented towards said card 8, not shown in these figures, in order to be electrically connected to the latter by one of their ends.

[0069] Advantageously, said partition 12 has second heat dissipation fins on the side of the first housing 14. Said second fins are located, for example, near and / or opposite said projecting shape 42. They extend substantially perpendicularly to said apex 44.

[0070] The said partition 12 further includes here overthicknesses of material in the form of a boss 48 provided with bores 41 intended to accommodate the said fixing members 36.

[0071] Said device further includes herein washers 50 intended to cooperate with said fastening members 36 by being located between heads 52 of said members of fixing 36 and said power module 20. Said washers 50 are, for example, cup-shaped.

[0072] As already mentioned, although not illustrated, said card 8 is, for example, mounted in said second housing 16 above said power module 20. Recesses are provided in said card 8 to allow access to said washers 50 and / or said fixing members 36.

[0073] According to a variant not illustrated, said device comprises, between said partition 12 and said heat-generating component(s) 18, one or more plates having heat conduction properties superior to the heat conduction properties of the housing 6. In the case of the embodiment of Figures 6 and 7, said plate(s) are understood to be opposite said heat sink(s) 102.

[0074] Thanks to the use of the material chosen for the plate(s), heat conduction between the first housing 14 and the heat-generating component(s) 18 is enhanced compared to a material thickness consisting solely of the partition 12, for the same total thickness. Furthermore, the plate construction increases the compressive strength of the partition 12 compared to a layer of material consisting solely of a paste-like material.

[0075] The said plate(s) are preferably made of copper and / or copper alloy.

Claims

Demands

1. Fluid compression device, said device comprising a housing (6) defining first and second housings (14, 16), said second housing (16) housing one or more heat-generating components (18), configured for controlling the compression of the fluid in the first housing (14), said housing (6) comprising a partition (12) separating the first and second housings (4, 16), said device comprising one or more heat sinks (102) attached to an area of ​​said partition (12) located at least partially opposite said heat-generating component(s) (18), said heat sink(s) (105) being configured to be at least partially in contact with said fluid.

2. Device according to the preceding claim in which said partition (12) comprises one or more openings (120) opening between said first and second housings (14, 16), the said heat sink(s) (102) being housed in said opening(s) (120).

3. Device according to the preceding claim in which said heat sink(s) (102) comprise a base (104) and first fins (106).

4. Device according to the preceding claim, wherein said base (104) is in heat exchange relationship with said heat-generating component(s) (18) and / or said first fins (106) are configured to be in contact with said fluid.

5. Device according to any one of claims 2 to 4 comprising a thermal interface layer (32) between said partition (12) and said heat-generating component(s) (18) and / or between said heat sink(s) (102) and said heat-generating component(s) (18).

6. Device according to any one of claims 2 to 5 in which said partition (12) has a projecting shape (42) in the direction of the second housing (16), said projecting shape (42) having a flattened apex (44), said heat-generating component(s) (18) being located opposite said apex (44)

7. Device according to the preceding claim in which the opening orifice(s) (120) are located at the level of said protruding form (42), in particular of said apex (44).

8. Device according to any one of the preceding claims wherein said heat sink(s) (102) are made of copper and / or copper alloy.

9. Device according to any one of the preceding claims wherein the housing (6) is made of aluminum and / or aluminum alloy.

10. Device according to any one of the preceding claims wherein the heat-generating component(s) (18) comprise a power module (20).

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