Electronic Module
JP1816378SActive Publication Date: 2026-01-13SHINDENGEN ELECTRIC MANUFACTURING CO LTD
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Patent Information
- Application Number
- JP2025001521D
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2025-01-28
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2050-01-28
Smart Images
Figure 0001816378000001 
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Abstract
The article is an electronic module in which electronic components are resin-encapsulated. The electronic module has multiple signal terminals on its top surface, lead frames protruding from its front and back surfaces, and a ceramic substrate partially exposed on its bottom surface.
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