Electronic Module
JP1816379SActive Publication Date: 2026-01-13SHINDENGEN ELECTRIC MANUFACTURING CO LTD
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Patent Information
- Application Number
- JP2025001522D
- Authority / Receiving Office
- JP · JP
- Patent Type
- Designs
- Current Assignee / Owner
- Filing Date
- 2025-01-28
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2050-01-28
Smart Images
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Abstract
This product is an electronic module in which electronic components are resin-encapsulated. The electronic module has a lead frame protruding from the front and multiple signal terminals on the back. The electronic module also has curved surfaces on both sides. The ceramic substrate of the electronic module is partially exposed on the top and bottom surfaces.
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