Cleaning Functionality in Handheld Laser Systems

Abstract

Methods and systems are provided for cleaning a surface using laser radiation. In one example, the system for cleaning a surface using laser radiation includes a laser source configured to generate laser radiation and configured to emit the laser radiation in a cleaning mode characterized as a modulated continuous wave (CW) mode having a duty cycle of less than 100%, a pulse repetition frequency of at least 10 kilohertz (kHz) and a FWHM pulse duration in the range of 1 microsecond (μs) to 10 (millisecond) ms, a housing configured as a handheld device that directs the laser radiation to the surface, and an optical fiber coupling the handheld device to the laser source.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Provisional Patent Application No. 63 / 212,280, entitled "CLEANING FUNCTIONALITY IN HANDHELD LASER SYSTEM," filed June 18, 2021, and U.S. Provisional Patent Application No. 63 / 242,175, entitled "CLEANING FUNCTIONALITY IN HANDHELD LASER SYSTEM," filed September 9, 2021, the contents of which are incorporated by reference herein in their entireties.

[0002] This application is related to PCT International Application No. PCT / US2021 / 047498, filed August 25, 2021, and entitled "HANDHELD LASER SYSTEM," and U.S. Provisional Patent Application No. 63 / 212,290, filed June 18, 2021, and entitled "MATERIAL PROCESSING FUNCTIONALITY IN HANDHELD LASER SYSTEM," the contents of which are incorporated by reference herein in their entireties.

[0003] The technical field relates generally to handheld laser devices that may be used for material processing operations, and more particularly to handheld laser devices configured with cleaning functionality. [Background technology]

[0004] Material processing performed on the surface may require a cleaning process to remove contaminants such as oxides, organic or inorganic materials, or weld marks from the surface. Laser irradiation may be used to provide a heat input to the surface that evaporates the top layer of the surface.

[0005] Laser-based material processing equipment with high power capabilities (e.g., at least 1 kW) has traditionally been used for industrial cutting and welding, but has typically been too expensive for many smaller machine shops or other smaller scale end users. Over time, however, the average power of laser diodes has increased considerably, while their average price per watt has dropped dramatically. Also, technological advances have been made in higher power laser systems. These factors make it more feasible to implement higher power lasers into smaller material processing systems, such as handheld laser devices. Not only are such systems desirable for smaller industrial shops, but these devices are particularly useful in applications where larger laser systems are impractical or impossible to use.

[0006] Besides cutting and welding, other laser-based material processing includes drilling, brazing, soldering, cladding, and other thermal processes such as cleaning. In particular, fiber laser technology offers several advantages over other laser technologies such as excimer or CO2 systems. Besides relatively low maintenance costs, fiber laser technology also offers high wall plug efficiency, long diode life, and is more easily transportable. In particular, fiber laser cleaning offers considerable advantages over other cleaning methods such as blasting, cold jet, chemical cleaning, and thermal cleaning. However, conventional fiber laser cleaning methods to date have not provided a high quality, economical form of cleaning using fiber-based handheld laser devices. Summary of the Invention [Means for solving the problem]

[0007] Aspects and embodiments are directed to methods and systems for cleaning and / or passivating a surface using laser radiation.

[0008] According to an exemplary embodiment, a system for cleaning a surface using laser radiation is provided. In one example, the system includes a laser source configured to generate laser radiation and configured to emit the laser radiation in a cleaning mode characterized as a modulated continuous wave (CW) mode having a duty cycle of less than 100%, a pulse repetition frequency of at least 10 kilohertz (kHz), and a FWHM pulse duration in the range of 1 microsecond (μs) to 10 milliseconds (ms), a housing configured as a handheld device that directs the laser radiation to the surface, and an optical fiber coupling the handheld device to the laser source.

[0009] In one example, the pulse repetition frequency is in the range of 10 to 55 kHz.

[0010] In one example, the cleaning mode has a maximum output of 1500 watts (W).

[0011] In one example, the duty cycle is in the range of 10-95%.

[0012] In one example, the system further comprises a controller configured to control the laser source.

[0013] In one example, the system further comprises at least one movable mirror positioned within the housing, the at least one movable mirror configured to wobble the laser beam of laser radiation such that the laser beam has a wobble amplitude greater than 5 mm.

[0014] In one example, the system further comprises a cleaning nozzle configured to be attached to the housing and configured to deliver the emitted laser radiation in the cleaning mode to the surface to be cleaned.

[0015] In one example, the cleaning nozzle is configured with an opening that allows the passage of laser radiation. In a further example, the laser radiation forms a scan line on the surface. In a further example, the opening is further configured to deliver gas to the surface. In one example, the opening is further configured such that the laser beam of laser radiation has a wobble amplitude of 15 mm. In another example, the cleaning nozzle has a nozzle tip configured with one of a single point configuration, a two point configuration, or a groove. In one example, the nozzle tip is configured to be press fit into a tubular body portion of the cleaning nozzle.

[0016] According to another exemplary embodiment, a method for laser cleaning a surface is provided, in one example, the method includes providing a laser source configured to emit laser radiation in a cleaning mode characterized as a modulated continuous wave (CW) mode having a duty cycle of less than 100%, a pulse repetition frequency of at least 10 kilohertz (kHz), and a FWHM pulse duration in the range of 1 microsecond (μs) to 10 milliseconds (ms), generating laser radiation from the laser source in the cleaning mode, and directing the laser radiation emitted from the laser source toward the surface to be cleaned.

[0017] In one example, the pulse repetition frequency is in the range of 10 to 55 kHz.

[0018] In one example, the cleaning mode has a maximum output of 1500 watts (W).

[0019] In one example, the duty cycle is in the range of 10-95%.

[0020] In one example, the method further includes the step of wobbling a laser beam of the emitted laser radiation such that the laser beam has a wobble length greater than 5 mm.

[0021] In one example, the method further includes providing a handheld device that emits laser radiation.

[0022] In one example, the method further includes providing a cleaning nozzle configured to be attached to the handheld device and configured to deliver the emitted laser radiation in the cleaning mode to the surface to be cleaned.

[0023] According to another example embodiment, a cleaning nozzle for use with a laser processing head configured to deliver laser radiation emitted from a laser source to a surface to be cleaned is provided. In one example, the cleaning nozzle includes an opening configured to accept the laser radiation and a gas delivered to the surface.

[0024] In one example, the cleaning nozzle has a nozzle tip configured with one of a single point configuration, a double point configuration, or a groove. In another example, the nozzle tip is configured to couple to a tubular body portion of the cleaning nozzle. In another example, the tubular body portion is configured to couple to a laser processing head. In another example, the tubular body portion is coupled to the laser processing head with an attachment mechanism. In one example, the laser radiation delivered to the surface forms a scan line. In one example, the laser processing head is configured to wobble a laser beam of the laser radiation delivered to the surface, and the aperture is configured to accommodate a wobble amplitude of the laser beam.

[0025] According to another exemplary embodiment, a system for passivating a surface using laser radiation is provided. In one example, the system includes a laser source configured to generate laser radiation, the laser source configured to emit laser radiation in a modulated continuous wave (CW) mode having a duty cycle of less than 100%, a pulse repetition frequency in the range of 30-55 kilohertz (kHz), and a FWHM pulse duration on the order of nanoseconds or greater, a housing configured as a handheld device to direct the laser radiation to the surface, and an optical fiber coupling the handheld device to the laser source.

[0026] In one example, the modulated CW mode has a maximum output power of 1500 Watts (W).

[0027] In one example, the duty cycle is in the range of 10-95%.

[0028] In one example, the FWHM pulse duration is up to a few milliseconds.

[0029] In one example, the system further comprises at least one movable mirror positioned within the housing, the at least one movable mirror configured to wobble the laser beam of laser radiation such that the laser beam has a wobble amplitude greater than 5 mm.

[0030] In one example, the system further comprises a cleaning nozzle configured to be mounted to the housing and configured to deliver the laser radiation emitted in the passivation mode to the surface to be passivated.

[0031] In one example, the cleaning nozzle is configured with an opening that allows the passage of laser radiation and delivers gas to the surface.

[0032] In one example, the laser radiation forms a scan line on a surface.

[0033] In one example, the aperture is further configured such that the laser beam of laser radiation has a wobble amplitude of 15 mm.

[0034] According to another embodiment, a method for laser passivating a surface is provided, in one example, the method includes providing a laser source configured to emit laser radiation in a modulated continuous wave (CW) mode with a duty cycle of less than 100%, a pulse repetition frequency in the range of 30-55 kilohertz (kHz), and a FWHM pulse duration on the order of nanoseconds or greater, generating laser radiation from the laser source in the modulated CW mode, and directing the laser radiation emitted from the laser source towards the surface to be passivated.

[0035] In one example, the modulated CW mode has a maximum output power of 1500 Watts (W).

[0036] In one example, the duty cycle is in the range of 10-95%.

[0037] In one example, the FWHM pulse duration is up to a few milliseconds.

[0038] In one example, the method further includes the step of wobbling a laser beam of the emitted laser radiation such that the laser beam has a wobble length greater than 5 mm.

[0039] In one example, the method further includes providing a handheld device that emits laser radiation. In a further example, the method further includes providing a cleaning nozzle configured to be attached to the handheld device and configured to deliver the modulated CW mode emitted laser radiation to the surface to be passivated.

[0040] In one example, the surface includes a weld line and the laser radiation is directed toward the weld line.

[0041] In one example, the surface is a metallic material including one of nickel, a nickel alloy, Inconel, titanium, a titanium alloy, and stainless steel.

[0042] According to another exemplary embodiment, a system for passivating a surface using laser radiation is provided. In one example, the system includes a laser source configured to generate laser radiation, the laser source configured to emit laser radiation in a continuous wave (CW) mode having a maximum power output of 1500 watts (W), a housing configured as a handheld device to direct the laser radiation to the surface, and an optical fiber coupling the handheld device to the laser source.

[0043] In one example, the system further comprises at least one movable mirror positioned within the housing, the at least one movable mirror configured to wobble the laser beam of laser radiation such that the laser beam has a wobble amplitude greater than 5 mm.

[0044] In one example, the system further comprises a cleaning nozzle configured to be mounted to the housing and configured to deliver laser radiation emitted in CW mode to the surface to be passivated. In another example, the cleaning nozzle is configured with an aperture to allow passage of the laser radiation and to deliver gas to the surface. In one example, the laser radiation forms a scan line on the surface. In one example, the aperture is further configured such that the laser beam of the laser radiation has a wobble amplitude of 15 mm.

[0045] According to another exemplary embodiment, a method for laser passivating a surface is provided, in one example, the method includes providing a laser source configured to emit laser radiation in a continuous wave (CW) mode having a maximum power of 1500 Watts (W), generating laser radiation from the laser source in the CW mode, and directing the laser radiation emitted from the laser source towards the surface to be passivated.

[0046] In one example, the method further includes the step of wobbling a laser beam of the emitted laser radiation such that the laser beam has a wobble length greater than 5 mm.

[0047] In one example, the method further includes providing a handheld device that emits laser radiation.

[0048] In one example, the method further includes providing a cleaning nozzle configured to be attached to the handheld device and configured to deliver laser radiation emitted in CW mode to the surface to be passivated.

[0049] In one example, the surface includes a weld line and the laser radiation is directed toward the weld line.

[0050] In one example, the surface is a metallic material including one of nickel, a nickel alloy, Inconel, titanium, a titanium alloy, and stainless steel.

[0051] Still other aspects, embodiments, and advantages of these example aspects and embodiments are discussed in detail below. Furthermore, it should be understood that both the preceding information and the following detailed description are merely illustrative examples of various aspects and embodiments, and are intended to provide an overview or framework for understanding the nature and characteristics of the claimed aspects and embodiments. The embodiments disclosed herein can be combined with other embodiments, and references to "embodiments," "examples," "some embodiments," "some examples," "alternative embodiments," "various embodiments," "one embodiment," "at least one embodiment," "this embodiment and other embodiments," "particular embodiments," and the like are not necessarily mutually exclusive and are intended to indicate that a particular feature, structure, or characteristic described may be included in at least one embodiment. Appearances of such terms in this specification are not necessarily all referring to the same embodiment.

[0052] Various aspects of at least one embodiment are discussed below with reference to the accompanying figures, which are not intended to be drawn to scale. The figures are included to provide illustration and further understanding of the various aspects and embodiments, and are incorporated in and constitute a part of this specification, but are not intended as a definition of the limitations of any particular embodiment. The drawings, together with the remainder of the specification, serve to explain the principles and operation of the described and claimed aspects and embodiments. In the figures, each identical or nearly identical component shown in the various figures is represented by a similar reference numeral. For purposes of clarity, not all components may be labeled in every figure. [Brief description of the drawings]

[0053] [Figure 1] FIG. 1 is a schematic diagram of an example of a handheld laser system according to aspects of the present disclosure. [Figure 2A] 1 is a photograph of one non-limiting example of a cleaning nozzle attached to a handheld laser according to an embodiment of the present disclosure. [Figure 2B] FIG. 1 is a perspective view of an example of a cleaning nozzle attached to a handheld laser according to aspects of the present disclosure. [Diagram 3] FIG. 2 is a perspective view of one non-limiting example of a two-point wash nozzle according to an embodiment of the present disclosure. [Figure 3A] 1 is a photograph of one non-limiting example of a dual-point cleaning nozzle attached to a handheld laser according to an embodiment of the present disclosure. [Figure 3B] 1 is a front view of a cleaning nozzle emitting laser radiation in a cleaning procedure according to an aspect of the present disclosure. [Figure 3C] 1 is a perspective view of a cleaning nozzle emitting laser radiation in a cleaning procedure according to an aspect of the present disclosure. [Figure 4] FIG. 2 is a perspective view of one non-limiting example of a cleaning nozzle configured with a fluted tip according to an embodiment of the present disclosure. [Diagram 5] FIG. 1 is a perspective view of one non-limiting example of a single point wash nozzle configured with a ball-ended tip in accordance with an aspect of the present disclosure. [Figure 6] FIG. 1 is a schematic diagram of a cleaning nozzle attached to a laser head in accordance with an aspect of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0054] Reference is made herein to PCT International Application No. PCT / US2021 / 047498, hereafter referred to as the "Basic Handheld Laser Application", which is owned by the present applicant and is incorporated herein by reference in its entirety. The Basic Handheld Laser Application describes a handheld laser system that includes an air-cooled laser source coupled to a handheld component via an optical fiber. The handheld laser system has a power capability that is on the order of at least 1 kW and is configured with the ability to wobble the beam.

[0055] FIG. 1 shows a schematic of one example of a handheld laser system 100 that is similar to the handheld laser system disclosed in the Basic Handheld Laser Application. These similarities include a laser source 115, a controller or control system 150, a housing configured as a handheld device 120 (also referred to herein as a handheld device), an optical fiber 130 that couples the laser source 115 to the handheld device 120, and a laser module 110 that houses the laser source 115, the controller 150, and an air cooling system 140 that cools the laser source 115. The laser module 110 may be mounted on a movable cart 160. The laser source 115 emits laser light at a wavelength (e.g., 1030-1090 nm for Yb) for performing a material processing operation on a workpiece 105 in a laser beam 122 of emitted laser light. The handheld device 120 is also configured with the ability to wobble the beam.

[0056] The housing, configured as a handheld device 120, has an outlet 123 or exit for the laser beam 122. Throughout this description, the term "handheld" is understood to refer to a laser device that is both small and light enough to be easily held and operated by one or both hands of a user. Additionally, a handheld laser device should be portable so that it can be easily moved from place to place by a user during laser processing. However, while embodiments of the present invention are referred to as "handheld" and can be used as freestanding portable devices, handheld laser devices may in some embodiments be connected to and used in combination with fixed equipment.

[0057] Cleaning Mode The particular embodiments described herein include some additional functionality developed for the handheld laser system associated with the basic handheld laser application. Specifically, one additional functionality relates to performing a cleaning mode of operation.

[0058] According to at least one embodiment, the cleaning mode is characterized as a modulated continuous wave (CW) mode having a duty cycle of less than 100%, a pulse repetition frequency of at least 10 kilohertz (kHz), and a FWHM pulse duration in the range of 1 microsecond (μs) to 10 milliseconds (ms). The cleaning mode of operation is implemented through a controller 150 that controls the laser source 115.

[0059] In some embodiments, the cleaning mode operates with a laser pulse frequency in the range of 10-60 kHz, and in further embodiments, the pulse frequency is in the range of about 10-55 kHz. The modulated CW mode configuration provides a sufficiently high repetition rate (e.g., tens of kHz) to cause the CW to appear at the cleaning surface.

[0060] The cleaning mode may be characterized as having a maximum power of 1500 watts (W). In some embodiments, the cleaning mode has a power of at least 1 kilowatt (kW). In some embodiments, the cleaning mode has a power of about 1500 W. Cleaning at greater than 1 kW provides a higher quality and faster cleaning process than cleaning at relatively low laser powers, which are the powers provided by many conventional laser cleaning techniques. Furthermore, the inventors have found that relatively high laser powers, including pulsed laser radiation with high peak powers, do not add any additional cleaning benefit. For example, cleaning at kHz level frequencies and 2500 W peak power did not clean significantly better than the same level of frequency and 1500 W maximum power.

[0061] The cleaning mode also operates at a duty cycle of up to 100%. In some embodiments, the duty cycle ranges from 10-99%, and in other embodiments, the duty cycle ranges from 10-95%. A relatively low duty cycle can be used in cleaning applications requiring only light cleaning, such as light surface contamination with oil, while a relatively high duty cycle can be used in certain applications where speed is important and / or where more vigorous cleaning is required, such as in instances where a film of undesirable material (e.g., paint, rust) is present on the surface being cleaned.

[0062] The cleaning mode of operation using modulated CW is distinguishable from other cleaning modes, such as CW or pulsed modes of cleaning. For one, modulated CW output allows for increased flexibility in the cleaning process. Some cleaning applications benefit from using a relatively low duty cycle, which also means a relatively low cleaning speed, while other applications benefit from a relatively high cleaning speed provided by a relatively high duty cycle. For example, a cleaning operation performed with a 100% duty cycle will be 10 times faster than a cleaning operation performed with a 10% duty cycle. Also, a "pure" pulsed mode of cleaning is much slower than the modulated CW cleaning mode described herein.

[0063] The handheld system 100 is also configured with a wobbling capability. At least one movable mirror may be positioned within the housing 120 configured to wobble the laser beam 122. The movable mirror reflects and moves the laser beam, i.e., wobbles the laser beam in one axis. The cleaning mode is also configured to perform beam wobbling, but is distinguishable from other modes of operation that use wobbling. For example, in modes of operation other than the cleaning mode, the wobble motion oscillates the laser beam 122 back and forth and has a maximum wobble length (also referred to as wobble amplitude) of 5 mm. For the cleaning mode, the wobble amplitude has the capability to be greater than 5 mm. This allows the laser radiation to treat a larger surface area on the workpiece. In one embodiment, the wobble amplitude can be greater than 5 mm, up to a maximum of 15 mm. In at least one embodiment, the wobble amplitude is greater than 5 mm, up to a maximum of 23 mm. According to other embodiments, the wobble amplitude is greater than 5 mm, up to a maximum of 25 mm.

[0064] Although the cleaning modes described herein refer to cleaning the workpiece surface, in some examples, the cleaning process may include polishing the surface. This may depend on the type of surface as well as the operational parameters for the cleaning mode. In some examples, target metrics for Rms surface roughness and / or water contact angle may be used as target values ​​when controlling the cleaning mode of operation. This may be implemented with either a feedback mechanism or a predefined set of operational parameters that achieve the desired target values.

[0065] Example of a cleaning nozzle According to at least one embodiment, the cleaning nozzle may include a handheld laser for performing the cleaning operation. Figures 3, 4, and 5 are perspective views of three non-limiting examples of cleaning nozzles 170, 180, and 190 that may include or be paired with a handheld laser for performing the cleaning operation.

[0066] The cleaning nozzles 170, 180, 190 are each configured to be mounted to the handheld laser housing 120 and each configured to deliver laser radiation emitted by a laser source to a surface to be cleaned. The cleaning nozzles 170, 180, 190 are mounted to the handheld laser housing 120 with a mounting mechanism 165 (see, e.g., FIGS. 2A and 2B ) as described in co-pending U.S. Provisional Patent Application No. 63 / 212,290, which is owned by the applicant and incorporated by reference in its entirety.

[0067] Each of the cleaning nozzles 170, 180, and 190 comprises a tubular body portion 172 (also referred to as a main body portion). One end of the tubular body portion 172 is attached to the housing 120 (see, e.g., FIGS. 2A and 2B) and configured with an inlet port 176 through which laser radiation and gas enter the nozzle. The other end of the tubular body portion 172 is configured with a nozzle tip (also referred to as a contact tip), with three different examples of nozzle tips 175, 185, and 195 shown in FIGS. 3, 4, and 5, respectively. The nozzle tips 175, 185, 195 can be coupled or attached to the tubular body portion 172 in any one of several different ways, including a press-fit attachment. Other attachment mechanisms are within the scope of the present disclosure, including threaded or mechanical attachment. In some embodiments, the nozzle tips 175, 185, and 195 are interchangeable with the tubular body portion 172, facilitating a user to change nozzle tips when performing different cleaning configurations. The tubular body portion 172 and nozzle tips 175, 185, 195 can be constructed from any one of a number of different materials, including metals or metal alloys. In some embodiments, the nozzles are made from aluminum, aluminum alloys, or steel. The cleaning nozzles can be constructed from any material that does not detrimentally interfere with the cleaning process and may be application specific.

[0068] A first example of a nozzle tip 175 is shown in FIG. 3. The nozzle tip 175 is configured with a two-point (also referred to as two-prong) configuration. Each contact point 174 has a rounded shape to prevent damage (e.g., scratching or marring) to the surface of the workpiece being cleaned or otherwise processed. Also, according to some embodiments, the contact points 174 may be fabricated from a material that is softer than the material of the workpiece to prevent damage to the workpiece. According to one embodiment, the nozzle tip 175 is constructed from an aluminum alloy.

[0069] The nozzle tip 175 includes an exit port 178 (also referred to as an exit or opening at the end) configured to deliver the laser radiation and gas to the surface being treated. According to at least one embodiment, the gas can be air, and in other examples, an inert or semi-inert gas (e.g., a shielding gas) may be used. The nozzle tip 175 may be used for pre-weld and / or post-weld cleaning. An example of a cleaning nozzle similar to the nozzle 170 used in a cleaning operation is shown in FIG. 3A. The contact points rest on the surface to be cleaned, and the laser radiation is emitted through the exit port between the two contact tips. The contact tips make it easier for the user to guide the handheld laser along the surface as it is being processed.

[0070] In some embodiments, the laser radiation forms a scan line 167 on the surface. For example, the laser radiation forms a scan line between two contact points, as shown in FIG. 3B and FIG. 3C. In certain embodiments, the exit port 178 is configured such that the laser radiation delivered to the surface forms a scan line. For example, the distance 179 between the contact points 174 can be dimensioned to allow for a scan line. A laser processing head, such as a handheld laser device, can be configured to oscillate or wobble a laser beam of laser radiation delivered to the surface, and the distance 179 between the contact points 174 of the exit port 178 is configured to accommodate a wobble amplitude of the laser beam. For example, the laser radiation delivered during the cleaning mode described above can be performed with a wobble amplitude of greater than 5 mm. The exit dimension 179 is configured to accommodate this amplitude. According to some embodiments, the distance or dimension 179 between the contact points 174 is configured to accommodate a wobble amplitude of 15 mm. In other embodiments, the distance 179 is configured to accommodate a wobble amplitude of 25 mm.

[0071] According to at least one embodiment, the cleaning nozzle 170 (as well as cleaning nozzles 180 and 190 described below) are also compatible with or enable the functionality of at least one safety interlock, such as a safety conductive interlock (SCI). For example, a laser interlock system comprising one or more sensors, a controller 150, a laser source, a processing head (e.g., handheld device 120), and the nozzle 170 can be used to ensure that laser radiation does not emanate from the laser source unless the nozzle 170 is touching a workpiece surface. In use, the controller only activates output to the laser source if the safety interlock is engaged, e.g., the nozzle is touching a surface. As will be appreciated, this means that (in most cases) the contact characteristics at the nozzle 170 are conductive.

[0072] Turning now to FIG. 4, a perspective view of a cleaning nozzle 180 having a nozzle tip 185 configured with grooves 186 is shown for use with a handheld laser to perform cleaning operations. The grooved configuration can be used with exterior corner surface geometries. For example, the grooved configuration of the nozzle tip 185 can be used to position the nozzle 180 at an exterior corner of a workpiece for cleaning with emitted laser energy coming through the nozzle exit port 188 (also referred to herein simply as an exit or an aperture). Similar to the exit port 178 of FIG. 3, the exit port 188 is also configured to emit gas. According to some embodiments, the exit port 188 is also configured to accommodate a wobble amplitude (e.g., 15 mm) of the laser beam, and in some embodiments, is configured such that the laser radiation delivered to the surface forms a scan line. For example, the diameter 189 of the exit port 188 may be configured to accommodate the wobble amplitude of the laser beam.

[0073] FIG. 5 is a perspective view of a nozzle 190 with a nozzle tip 195 having a single point (also referred to as a single prong) configuration. In some embodiments, the tip has a ball or rounded end configuration 196 as shown in FIG. 5. In certain embodiments, the rounded end 196 can be used to position the cleaning nozzle inside a corner of a workpiece surface. In some embodiments, the tip of the single point configuration has a tip configured to break through and / or scratch (or remove) a layer of material, such as a coating (e.g., powder coating), paint, rust, etc., that at least partially covers the workpiece surface. This single point configuration can be used to break through these coating materials to contact the workpiece surface so that the emitted laser radiation coming through the nozzle 185 can clean the surface. In some examples, the nozzle tip 195 can be constructed from a material that is harder than the material to be removed, such as a paint or oxide layer. Similar to cleaning nozzles 170 and 180, cleaning nozzle 190 is configured to mount to handheld laser housing 120 and is configured to deliver laser radiation and gas to a surface through exit port 198 (also referred to simply as an exit or aperture). In some embodiments, exit port 198 is also configured to accommodate a wobble amplitude of the laser beam, for example a wobble amplitude of 15 mm, such that the laser radiation delivered to the surface forms a scan line. For example, diameter 199 of exit port 198 may be configured to accommodate the wobble amplitude of the laser beam.

[0074] Although the examples described herein refer to a cleaning nozzle used in combination with a handheld laser device, it is understood that the cleaning nozzle can be used with any one of several different laser processing heads, not just handheld ones. An example of a laser system 200 with a laser head 1020 is shown in the schematic diagram of FIG. 6. The laser processing head 1020 (also simply referred to as the laser head) is configured to deliver laser radiation emitted from a laser source 115 to a surface 105 to be cleaned. The laser head 1020 directs the laser radiation from the laser source out of an output end of the laser head. The laser head 1020 may not include the laser source 115, but includes optics and beam guiding components contained in a housing to direct the laser radiation emitted from the laser source 115. The nozzles 170, 180, and 190 couple to the laser processing head 1020 using a mounting mechanism 165. Gas also exits the output end of the laser head 1020 and is directed to the workpiece, such as through a nozzle as described herein. The laser radiation exits the nozzle as a laser beam 122. Additionally, passivation processing (discussed in more detail below) may be performed using the laser processing head 1020 and is therefore also not limited to handheld laser devices. A controller 150 is also coupled to the laser head 1020 and the laser source 115 for purposes of sending control signals and, in some instances, receiving feedback and / or input signals.

[0075] passivation According to another aspect, a handheld laser may be used to perform passivation on a metal surface. Passivation can be considered as a form of cleaning. Passivation creates a corrosion-resistant surface that prevents both corrosion from occurring and from migrating to the treated area. Using a laser to perform passivation offers several advantages over other passivation processes, such as chemical passivation, which affects the entire workpiece surface and creates chemical waste. The laser can be used to passivate a targeted area, and there is no use of chemicals that need to be disposed of. The effect of the laser energy in the passivation process serves to remove free iron from the workpiece surface so that the iron cannot react with oxygen in the air and form rust. Similar to welding, passivation may be performed in the presence of a gas, such as argon or nitrogen.

[0076] Passivation may be performed on any one of several metal surfaces. In some embodiments, the metal material includes one of nickel, nickel alloy, Inconel, titanium, titanium alloy, and stainless steel. It is understood that this list is not exhaustive and that in fact the metal material may extend to any metal having iron content or may be contaminated with iron. According to at least one embodiment, laser radiation configured to perform passivation may be applied to the weld line. For example, the surface to be treated may comprise a weld line (e.g., a butt joint of a metallic material) and laser radiation is directed to the weld line to passivate the weld line. In some examples, the laser radiation may be passed over the weld line two or more times, such as a forward and a backward pass. In some examples, passivation may be performed immediately after welding or within a short period of time after welding so that oxidation does not have a chance to occur. It is understood that passivation may be performed on metal surfaces (other than the weld line) to protect the metal surface from corrosion.

[0077] According to some embodiments, the laser source 115 is controlled by the controller 150 to emit laser radiation in passivation mode. According to certain embodiments, a cleaning nozzle, as described above with reference to the cleaning nozzles 170, 180, and / or 190, may be used to perform the passivation operation. The cleaning nozzle is thereby configured to be attached to a housing of a handheld device or a laser head to deliver the laser radiation emitted in the passivation mode to the surface to be passivated. The cleaning nozzle is configured with an aperture (e.g., apertures 178, 188, 198) that allows the passage of the laser radiation and gas, as described above. The laser radiation may also form a scan line at the surface, such as the scan line 167 in Figures 3B and 3C. As also discussed above, the aperture (e.g., apertures 178, 188, 198) is configured to accommodate a wobble amplitude of the laser beam. In some embodiments, the wobble amplitude is 15 mm.

[0078] The passivation modes can be further classified into delicate passivation and fast passivation. In the delicate passivation mode, the laser source 115 is configured to emit laser radiation in a modulated CW mode with a duty cycle of less than 100%, a pulse repetition frequency in the range of 30-55 kHz, and a FWHM pulse duration on the order of nanoseconds or more. In some embodiments, the duty cycle of the modulated CW mode is in the range of 10-99%, and in other embodiments, the duty cycle is in the range of 10-95%. In some embodiments, the pulse repetition frequency for the modulated CW mode is in the range of 30-50 kHz. In some embodiments, the pulse duration is on the order of microseconds (μs) or more. In some embodiments, the FWHM pulse duration is on the order of microseconds up to the order of milliseconds. In one embodiment, the FWHM pulse duration is in the range of 0.5-10 ms, and in other embodiments, the FWHM pulse duration is in the range of 0.5-5 ms. Experiments in which delicate passivation was performed on different metal surfaces are described below. In the fast passivation mode, the laser source 115 is configured to emit laser radiation in continuous wave (CW) mode with a maximum output power of 1500W.

[0079] Experiments in delicate passivation mode A series of butt joint welds performed on different materials were exposed to laser radiation configured in delicate passivation mode and the results were compared against a control group (i.e., no passivation was applied after welding) in salt spray test conditions. The laser power for delicate passivation mode was performed at two settings: a first setting at 650 W with a pulse repetition frequency of 55 kHz (pulse duration of 1.2 ms) and a second setting at 800 W with a pulse repetition frequency of 60 kHz (pulse duration of 1.1 ms). In both examples, the duty cycle was 65%, the wobble amplitude was 8 mm, and two passes were made across each weld seam. The salt spray test (i.e., in accordance with ASTM B117-19) was performed at 95 degrees Fahrenheit and an angle of 30 degrees for 2 hours.

[0080] Table 1 below lists the materials that were treated and their thicknesses, which showed improved protection from the passivation treatment (i.e., little or no oxide formation) compared to the respective controls (in both settings).

[0081] [Table 1]

[0082] The present disclosure, aspects and embodiments provide methods and systems for cleaning and / or passivating surfaces using laser radiation. For example, the pre-weld cleaning systems and methods disclosed herein provide the ability to remove oxides, rust, oil, and grease, while the post-weld cleaning systems and methods provide the ability to polish welds or remove soot or debris. Both cleaning applications eliminate the need for harmful chemicals or abrasives and require minimal material preparation or post-finishing.

[0083] The aspects disclosed herein according to the present invention are not limited in their application to the details of construction and the arrangement of components set forth in the following description or illustrated in the accompanying drawings. These aspects may take other embodiments and be practiced and carried out in various ways. Examples of specific implementations are provided herein for illustrative purposes only and are not intended to be limiting. In particular, acts, components, elements, and features discussed in connection with any one or more embodiments are not intended to be excluded from a similar role in any other embodiment.

[0084] Additionally, the language and terms used herein are for purposes of description and should not be construed as limiting. Any reference to examples, embodiments, components, elements, or acts of the systems and methods referred to herein in the singular also includes embodiments including the plural, and any reference to any embodiment, component, element, or act herein in the plural can also include embodiments including only the singular. References in the singular or plural forms are not intended to limit the presently disclosed systems or methods, their components, acts, or elements. The use herein of "including," "comprising," "having," "containing," "involving," and variations thereof are meant to encompass the items listed thereafter and their equivalents as well as additional items. References to "or" can be construed as inclusive, such that items described using "or" can refer to either only one, more than one, or all of the listed items. Also, in the event of a conflict in the use of a term between this document and a document incorporated herein by reference, the use of the term in the incorporated reference is supplementary to the use of the term in this document, and to the extent of any conflict, the use of the term in this document will control. Additionally, headings or subheadings may be used herein for the convenience of the reader, but they have no effect on the scope of the invention.

[0085] Having thus described several aspects of at least one example, it is to be understood that various changes, modifications, and improvements will readily occur to those skilled in the art. For example, the examples disclosed herein may be used in other contexts. Such changes, modifications, and improvements are intended to be part of this disclosure and are intended to be within the scope of the examples discussed herein. Accordingly, the foregoing description and drawings are by way of example only. [Explanation of symbols]

[0086] 100 Handheld Laser System 105 Workpieces, surfaces to be cleaned 110 Laser module 115 Laser Source 120 Handheld equipment, handheld devices, housings 122 Laser Beam 123 Exit 130 Optical Fiber 140 Air Cooling System 150 Control device, control system 165 Attachment mechanism 167 scan lines 170 Cleaning nozzle 172 Tubular body part 174 contact points 175 Nozzle tip 176 Inlet Port 178 Exit port, opening 179 Distance, exit dimensions 180 Cleaning nozzle 185 Nozzle tip 186 Groove 188 Nozzle exit port, opening 189 diameter 190 Cleaning nozzle 195 Nozzle tip 196 Rounded Edges 198 Exit port, opening 199 diameter 200 Laser System 1020 Laser Head

Claims

1. A system for cleaning a surface using laser radiation, comprising: a laser source configured to generate laser radiation and to emit the laser radiation in a cleaning mode, the cleaning mode being characterized as a modulated continuous wave (CW) mode having a duty cycle of less than 100%, a pulse repetition frequency of at least 10 kilohertz (kHz), and a FWHM pulse duration in the range from 1 microsecond (μs) to 10 milliseconds (ms); a housing configured as a handheld device for directing the laser radiation onto the surface; an optical fiber connecting the handheld device to the laser source; The system comprising the above components.

2. The system according to claim 1, wherein the pulse repetition frequency is in the range of 10 kHz to 55 kHz.

3. The system according to claim 1, wherein the cleaning mode has a maximum output of 1500 watts (W).

4. The system according to claim 1, wherein the duty cycle is in the range of 10% to 95%.

5. The system according to claim 1, further comprising at least one movable mirror positioned within the housing and configured to wobble the laser beam of the laser radiation such that the laser beam has a wobble amplitude greater than 5 mm.

6. The system according to claim 1, further comprising a cleaning nozzle configured to be attached to the housing and to deliver the laser radiation emitted in the cleaning mode onto the surface to be cleaned.

7. The system according to claim 6, wherein the cleaning nozzle is configured with an aperture that allows passage of the laser radiation.

8. The system according to claim 7, wherein the laser radiation forms scan lines on the surface.

9. The system according to claim 7, wherein the aperture is further configured to deliver gas onto the surface.

10. A method for cleaning a surface with a laser, comprising: Providing a laser source, wherein the laser source is configured to emit laser radiation in a cleaning mode, and the cleaning mode is characterized as a modulated continuous wave (CW) mode having a duty cycle of less than 100%, a pulse repetition frequency of at least 10 kilohertz (kHz), and a FWHM pulse duration in the range from 1 microsecond (μs) to 10 milliseconds (ms), a step; Generating the laser radiation from the laser source in the cleaning mode; Directing the laser radiation emitted from the laser source towards the surface to be cleaned; A method comprising the above.

11. The method according to claim 10, wherein the pulse repetition frequency is in the range of 10 to 55 kHz.

12. The method according to claim 10, wherein the cleaning mode has a maximum output of 1500 watts (W).

13. The method according to claim 10, wherein the duty cycle is in the range of 10 to 95%.

14. The method according to claim 10, further comprising the step of wobbling the laser beam of the emitted laser radiation, whereby the laser beam has a wobble length greater than 5 mm.

15. The method according to claim 10, further comprising providing a hand-held device that emits the laser radiation.

16. The method according to claim 15, further comprising providing a cleaning nozzle configured to be attached to the hand-held device and configured to deliver the laser radiation emitted in the cleaning mode to the surface to be cleaned.

17. A cleaning nozzle used in a laser processing head configured to deliver laser radiation emitted from a laser source to a surface to be cleaned, the cleaning nozzle comprising an aperture configured to allow the laser radiation and a gas delivered to the surface.

18. The cleaning nozzle is a single-point configuration, a two-point configuration, or a groove, The cleaning nozzle according to claim 17, having a nozzle tip configured with one of the above.

19. The cleaning nozzle according to claim 18, wherein the nozzle tip is configured to be connected to a tubular body portion of the cleaning nozzle, and the tubular body portion is configured to be connected to the laser processing head.

20. The cleaning nozzle according to claim 17, wherein the laser radiation delivered to the surface forms a scanning line.

21. The laser processing head is configured to wobble a laser beam of the laser emission delivered to the surface, and the opening is configured to receive a wobbling amplitude of the laser beam, the cleaning nozzle according to claim 17.

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