Multi-station Processing Module and Reactor Architecture

Abstract

A multi-station processing module for processing substrates includes at least one substrate transfer station disposed on a first transfer surface. The at least one substrate transfer station is configured to perform a transfer of at least one substrate of the plurality of substrates. The multi-station processing module further includes a plurality of substrate processing stations disposed on a second transfer surface around the substrate transfer region. The second transfer surface is disposed parallel to and offset from the first transfer surface. Each of the plurality of substrate processing stations is configured to process one or more of the plurality of substrates. The multi-station processing module further includes a robot disposed on the substrate transfer region. The robot is configured to move one or more of the plurality of substrates between the first transfer surface and the second transfer surface during a transfer.

Description

[Technical field]

[0001] Claiming priority This application claims the benefit of priority to U.S. Patent Application No. 63 / 253,932, filed October 8, 2021, which is incorporated herein by reference in its entirety.

[0002] The subject matter disclosed herein relates generally to substrate processing systems, and more particularly to multi-station processing module (MSPM) based substrate processing tools. [Background technology]

[0003] Semiconductor substrate processing systems are used to process semiconductor substrates by techniques including etching, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), plasma-enhanced atomic layer deposition (PEALD), pulsed deposition layer (PDL), plasma-enhanced pulsed deposition layer (PEPDL), resist stripping, or other plasma-based processes. Substrate processing systems can include one or more processing stations. In substrate processing systems, substrate handling can have a significant impact on cost and throughput. To increase throughput and reduce cost, substrates need to be processed through various processing steps in the most efficient manner and with minimal or no contamination. However, existing substrate processing systems suffer from some degree of processing efficiency degradation. Exemplary processing efficiency degradations include lack of station isolation, the presence of station crosstalk (e.g., from thermal or coupled plasma), process non-uniformity resulting from the use of integrated spindle transport mechanisms, etc.

[0004] The background description provided herein is intended to provide a general overview of the contents of the present disclosure. Please note that the information described in this section is presented to provide those skilled in the art with some context regarding the subject matter disclosed below, and should not be considered as admitted prior art. More specifically, the work of the currently named inventors within the scope described in this Background section, as well as aspects of the description that may not otherwise be considered prior art at the time of filing, are not admitted, expressly or impliedly, as prior art against the present disclosure. Summary of the Invention

[0005] One general aspect of the present disclosure is a multi-station processing module for processing substrates. The multi-station processing module includes at least one substrate transfer station disposed on a first transfer surface. The at least one substrate transfer station is configured to perform a transfer of at least one substrate of the plurality of substrates. The multi-station processing module further includes a plurality of substrate processing stations disposed on a second transfer surface around the substrate transfer region. The second transfer surface is disposed parallel to and offset from the first transfer surface. Each of the plurality of substrate processing stations is configured to process one or more of the plurality of substrates. The multi-station processing module further includes a robot disposed on the substrate transfer region. The robot is configured to move one or more of the plurality of substrates between the first transfer surface and the second transfer surface during a transfer.

[0006] Another general aspect includes a substrate processing tool including a vacuum transfer module and a plurality of multi-station processing modules for processing a substrate received from the vacuum transfer module. The plurality of multi-station processing modules are disposed along a periphery of the vacuum transfer module. Each of the plurality of multi-station processing modules includes at least one substrate transfer station disposed on a first transfer surface. The at least one substrate transfer station is configured to perform a transfer of at least one substrate of the plurality of substrates received from the vacuum transfer module. Each of the plurality of multi-station processing modules further includes a plurality of substrate processing stations disposed on a second transfer surface around the substrate transfer region. Each of the plurality of substrate processing stations is configured to process one or more of the plurality of substrates. Each of the plurality of multi-station processing modules further includes a robot disposed in the substrate transfer region. The robot is configured to move one or more of the plurality of substrates between the at least one substrate transfer station and the plurality of substrate processing stations during a transfer.

[0007] An additional general aspect includes a multi-station processing module for processing substrates, the multi-station processing module including at least one substrate transfer station disposed on a first transfer surface. The at least one substrate transfer station is configured to perform a transfer of at least one substrate of the plurality of substrates. The multi-station processing module further includes a plurality of substrate processing stations disposed on a second transfer surface around a substrate transfer region. Each of the plurality of substrate processing stations is configured to process one or more of the plurality of substrates using a substantially axially symmetric body portion. The multi-station processing module further includes a robot disposed on the substrate transfer region. The robot is configured to move one or more of the plurality of substrates between the at least one substrate transfer station and the plurality of substrate processing stations during a transfer. [Brief description of the drawings]

[0008] The various accompanying drawings merely illustrate exemplary embodiments of the present disclosure and are not to be considered as limiting its scope.

[0009] [Figure 1] FIG. 1 is a top view of a multi-station processing module (MSPM) using multiple transfer surfaces, according to some illustrative embodiments.

[0010] [Diagram 2] FIG. 2 is a rear view of the MSPM of FIG. 1, according to some exemplary embodiments.

[0011] [Diagram 3] FIG. 3 is a side view of the MSPM of FIG. 1, according to some illustrative embodiments.

[0012] [Figure 4] FIG. 4 is a perspective view of the MSPM of FIG. 1, according to some illustrative embodiments.

[0013] [Diagram 5] FIG. 5 illustrates a substrate processing tool including a cluster tool arrangement based on the MSPM of FIG. 1, in accordance with some illustrative embodiments.

[0014] [Figure 6] FIG. 6 illustrates a substrate processing tool including a second cluster tool arrangement based on the MSPM of FIG. 1, in accordance with some illustrative embodiments.

[0015] [Figure 7] FIG. 7 illustrates a substrate processing tool including a third cluster tool arrangement based on the MSPM of FIG. 1, in accordance with some illustrative embodiments.

[0016] [Figure 8] FIG. 8 is a diagram illustrating an MSPM using a single transfer surface, according to some exemplary embodiments. [Figure 9] FIG. 9 is a diagram illustrating an MSPM using a single transfer surface, according to some exemplary embodiments. [Figure 10] FIG. 10 illustrates an MSPM using a single transfer surface, according to some exemplary embodiments. [Figure 11] FIG. 11 is a diagram illustrating an MSPM using a single transfer surface, according to some exemplary embodiments.

[0017] [Figure 12] FIG. 12 illustrates a multi-level MSPM using multiple transfer surfaces where the transfer stations are positioned higher than the substrate processing stations, according to some example embodiments.

[0018] [Figure 13] FIG. 13 is a diagram illustrating a vacuum chamber, such as an etch chamber for fabricating substrates, that can be used in the MSPMs disclosed herein, according to some exemplary embodiments.

[0019] [Figure 14] FIG. 14 is a block diagram illustrating an example of a machine capable of implementing one or more exemplary method embodiments or controlling one or more exemplary embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] The following description includes systems, methods, and techniques that embody exemplary embodiments of the present invention. Examples are merely representative of possible variations. Unless expressly stated otherwise, components and functions are optional and may be combined or sub-divided. In addition, operations may be reordered, combined, or sub-divided. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the exemplary embodiments. However, it will be apparent to one skilled in the art that the subject matter of the present invention may be practiced without these specific details.

[0021] As used herein, the term "plasma-based process" can include a deposition process, an etch process, or a multi-step process (e.g., a deposition process followed by an etch process). As used herein, the term "reactor," "reactor arrangement," or "constellation reactor" can include a cluster tool arrangement for processing substrates, including an arrangement of multi-station processing modules (MSPMs), where each MSPM is configured to process multiple substrates. Exemplary MSPMs are described with reference to FIGS. 1-12.

[0022] The disclosed MSPMs can be used to overcome deficiencies associated with some existing substrate processing modules, such as lack of processing station isolation, presence of crosstalk between stations (e.g., thermal crosstalk as well as crosstalk from coupled plasma), non-uniformity resulting from integrated spindle transfer mechanisms, extended processing times due to synchronous substrate transfer, and reduced service access due to the size of the spindle transfer mechanism housing. More specifically, the disclosed MSPMs include multiple substrate processing stations and substrate transfer stations, each of which is housed in its axisymmetric body portion. In some embodiments, the multiple substrate processing stations and substrate transfer stations are configured on different levels (or transfer planes) or at the same level. Additionally, the MSPMs include a robot (e.g., a vacuum robot) instead of a spindle mechanism to address asynchronous transfer of substrates between the substrate transfer stations and the substrate processing stations.

[0023] Figures 1-4 show a multi-level MSPM in which the substrate transfer station is in a lower transfer plane than the substrate processing station. Figures 5-7 show different substrate processing tools (e.g., cluster tool arrangements) based on the MSPM of Figure 1. Figures 8-11 show different single level MSPMs in which the substrate transfer station is in the same transfer plane (or level) as the substrate processing station. Figure 12 shows a multi-level MSPM in which the substrate transfer station is in a higher transfer plane than the substrate processing station. Figure 13 is an exemplary vacuum chamber that can be used as a substrate processing station in the disclosed MSPM.

[0024] FIG. 1 illustrates a top view of a multi-station processing module (MSPM) 100 using multiple transfer surfaces, according to some exemplary embodiments. With reference to FIG. 1, the MSPM 100 includes at least one substrate transfer station (e.g., substrate transfer stations 108 and 110) disposed on a first transfer surface (or first level) 102 and configured to perform transfer of at least one substrate of the multiple substrates. The MSPM 100 further includes multiple substrate processing stations (e.g., substrate processing stations 114, 116, 118, and 120) disposed on a second transfer surface (or second level) 104 around a substrate transfer region 105 (e.g., symmetric or asymmetric). The substrate processing stations 114, 116, 118, and 120 are configured to process one or more of the multiple substrates. The MSPM 100 further includes a robot 106 (e.g., a vacuum robot) disposed on the substrate transfer region 105. The robot 106 is configured to move one or more of the plurality of substrates between the first transfer surface 102 and the second transfer surface 104 during a handoff. The robot 106 may include at least radial position control in addition to theta position control.

[0025] Figures 2, 3, and 4 provide additional views of MSPM 100. For example, Figure 2 shows a rear view 200 of MSPM 100 according to an exemplary embodiment, Figure 3 shows a side view 300 of MSPM 100 according to an exemplary embodiment, and Figure 4 shows a perspective view 400 of the MSPM of Figure 1 according to an exemplary embodiment.

[0026] 1-4, the substrate processing stations 114-120 may be configured in an upper MSPM section 202 in the second transfer surface 104 of the MSPM 100. The substrate transfer stations 108, 110 may be configured in a lower MSPM section 204 in the first transfer surface 102 of the MSPM 100. As shown in FIG. 2, the upper MSPM section 202 and the lower MSPM section 204 are disposed opposite each other across a separation surface 212.

[0027] The upper MSPM section 202 includes substrate processing stations 114, 116, 118, and 120 and corresponding substrate passing slots 122, 124, 126, and 128. The substrate passing slots 122-128 connect corresponding substrate processing stations with a vertical passageway 210 in the substrate transfer region 105.

[0028] The lower MSPM section 204 includes substrate transfer stations 108 and 110, a substrate pass-through slot 121, an isolation valve 112, a slide arrangement 206, and a robot enclosure 208. The isolation valve isolates the MSPM 100 from an external robot (e.g., as may be used in connection with a vacuum transfer module) of a substrate processing tool (e.g., a cluster tool arrangement of MSPMs as shown in connection with Figures 5-7). The substrate pass-through slot 121 connects the substrate transfer stations 108 and 110 with a vertical passageway 210 in the substrate transfer region 105. In this regard, the vertical passageway 210 extends between the lower MSPM section 204 at the first transfer surface 102 and the upper MSPM section 202 at the second transfer surface 104, enabling the robot 106 to move substrates between the substrate transfer stations 108, 110 and the substrate processing stations 114-120 during a transfer.

[0029] The robot enclosure 208 is configured to house the robot actuators and control circuitry for the robot 106. Additionally, the robot enclosure 208 houses a linear slide (not referenced in FIGS. 1-4 ) that effects vertical movement of the robot 106 (e.g., within a vertical passage 210), such as when transferring / moving substrates between the lower MSPM section 204 in the first transport surface 102 and the upper MSPM section 202 in the second transport surface 104.

[0030] In some embodiments, the slide arrangement 206 is configured to move the upper MSPM section 202 (or second transport surface 104) in a vertical (e.g., axial) and / or horizontal (e.g., azimuthal) direction relative to the lower MSPM section 204 (or first transport surface 102) to provide servicing access to components of the MSPM 100. An exemplary movement trajectory 302 is shown in FIG. 3, although other movement trajectories are possible.

[0031] In some embodiments, each of the substrate processing stations 114-120 can be fabricated using substantially axisymmetric body portions (e.g., body portion 214 of substrate processing station 116). More specifically, as shown in Figures 1-4, each of the substrate processing stations 114-120 can be fabricated having substantially cylindrical (and axisymmetric) body portions that are substantially isolated from one another and connected to the substrate transfer region 105 via corresponding substrate passing slots 122-128. In this regard, the substrate processing stations 114-120 may also be referred to as "junction components" that form the upper MSPM section 202.

[0032] During operation, a substrate may be deposited (e.g., by a vacuum transfer module of a substrate processing tool including the MSPM 100) at the substrate transfer stations 108 and 110. The robot 106 is configured to move the substrate horizontally in the substrate passing slot 121 from the substrate transfer station to the vertical passage 210 of the substrate transfer region 105. The robot 106 moves the substrate vertically from the first transfer surface to at least one of the substrate processing stations 114-120 in the second transfer surface 104 for processing. The vertical movement may use the vertical passage 210 and at least one of the substrate passing slots 122-128. In some embodiments, each of the substrate processing stations 114-120 may include a vacuum chamber (e.g., vacuum chamber 1300 of FIG. 13) that is used to process the substrate (e.g., using a deposition or etching process). In some embodiments, different processes (or different stages of a process) may be performed (e.g., independently of each other) at the substrate processing stations 114-120. After the substrate has been processed, the robot 106 can transfer the substrate between the substrate processing stations 114-120, or to the substrate transfer stations 108 and 110 (if no additional processing is required).

[0033] In some embodiments, the MSPM 100 can use one or more dedicated load stations (e.g., substrate transfer stations 108 and 110) to enable fast swapping with a vacuum transfer module. Once loaded / unloaded, the MSPM's centralized vacuum robot (e.g., robot 106) can asynchronously transfer substrates to individual substrate processing stations. Such transfers can significantly reduce wait times and therefore enable high utilization of processing stations.

[0034] Some example advantages of using the disclosed configuration of the MSPM 100 include: (a) reduction in overall processing module size (e.g., through the use of two offset transfer faces); (b) efficient fabrication of processing stations characterized only by thermal anomalies resulting from station crosstalk through pass-through slots (e.g., a substantially axisymmetric body portion can be fabricated from large diameter aluminum pipe); (c) use of individual station lids for the substrate processing stations (instead of a single module lid that results in station crosstalk and process inefficiencies); (d) efficient process kit design using coaxial components to service the axisymmetric body portion of the substrate processing station; and (e) efficient configuration of a substrate processing tool as a cluster tool arrangement of multiple MSPMs (e.g., as shown in Figures 5-7).

[0035] Although FIGS. 1-4 show the MSPM 100 configured with a first transport surface 102 that is offset from (and lower than) the second transport surface 104, the disclosure is not limited in this respect. In some embodiments, the first and second transport surfaces of the MSPM are coincident (or coplanar) with one another. For example (as shown in FIGS. 8-11), the MSPM can be configured with different numbers of substrate transfer stations and substrate processing stations all located on the same transport surface. In yet another embodiment (as shown in FIG. 12, for example), the MSPM can be configured with a first transport surface (having one or more substrate transfer stations) that is offset from (and higher than) the second transport surface 104 (having multiple substrate processing stations).

[0036] 1-4 depict MSPM 100 including two substrate transfer stations 108 and 110 and four substrate processing stations 114-120, the disclosure is not limited in this respect and a different number of substrate transfer stations and substrate processing stations may be used in a single MSPM. In some embodiments, MSPM 100 may not include a substrate transfer station and robot 106 may be configured to perform a direct transfer to a vacuum transfer module (e.g., vacuum transfer module 608 of substrate processing tool 600 of FIG. 6).

[0037] In some embodiments, the substrate processing stations 114-120 can be further isolated from one another using at least one purge gas curtain. For example, as shown in FIG. 1, a purge gas curtain 107 can be used to isolate the substrate passing slot 122. Isolating the substrate passing slot 122 can improve isolation of the substrate processing station 114 from the remaining substrate processing stations of the MSPM 100.

[0038] In some embodiments, each of the substrate transfer stations 108 and 110 is configured to perform a transfer during processing of a substrate by at least one of the substrate processing stations 114-120. In some embodiments, each of the plurality of substrate processing stations 114-120 includes a corresponding plurality of substantially axisymmetric body portions (e.g., similar to the axisymmetric body portion 214 of the substrate processing station 116). In some embodiments, the substantially axisymmetric body portions are isolated from one another via at least one purge gas curtain. In some embodiments, the MSPM 100 includes a slide arrangement 206 disposed on the first transport surface 102. The slide arrangement 206 may be configured to move the second transport surface 104 vertically and / or horizontally relative to the first transport surface 102.

[0039] In some embodiments, the substrate transfer station can be configured as a substrate transfer station (e.g., station 108) and a pre-treatment station (e.g., station 110) disposed on the first transport surface 102. The substrate transfer station 110 can be configured to perform substrate transfer, and the pre-treatment station 110 is configured to perform pre-treatment of the substrate. For example, the pre-treatment can include at least one of degassing, pre-cleaning, or pre-heating the substrate.

[0040] In some embodiments, the substrate transfer stations can be configured as a pre-treatment station (e.g., station 108) and a post-treatment station (e.g., station 110). The pre-treatment station 108 is configured to perform pre-treatment (e.g., degassing, pre-cleaning, or pre-heating) of the substrates. The post-treatment station 110 is configured to perform post-treatment (e.g., cooling or annealing) of the substrates.

[0041] In some embodiments, the plurality of substrates processed by the MSPM 100 includes a plurality of semiconductor wafers. In some embodiments, the substrate processing stations 114-120 are configured to perform the same deposition or etch process or different deposition or etch processes while processing substrates. In some embodiments, the substrate processing stations 114-120 are symmetrically positioned around the substrate transfer region 105. In some embodiments, the substrate processing stations 114-120 are asymmetrically positioned around the substrate transfer region 105.

[0042] In some embodiments, the substrate processing stations 114-120 need not perform the same process. For example, the substrate processing stations 114-120 may be used to apply different films, or to apply a nucleation layer or liner film in one substrate processing station followed by bulk film deposition in a subsequent substrate processing station. Alternatively, the substrate processing stations 114-120 may be used to apply the same film based on different chemistries. Alternatively, the substrate processing stations 114-120 may be used for the same or different films deposited at different temperatures or different pressures. Those skilled in the art will recognize that many sequenced processes in which the disclosed reactor arrangements may be used are of interest.

[0043] Figure 5 illustrates a substrate processing tool 500 including a cluster tool arrangement based on the MSPM of Figure 1, in accordance with some example embodiments. With reference to Figure 5, the substrate processing tool 500 includes a vacuum transfer module 510 and a plurality of multi-station processing modules (MSPMs) 502, 504, 506, and 508 for processing substrates received from the vacuum transfer module 510. The plurality of MSPMs 502-508 are disposed along the periphery of the vacuum transfer module 510. Each of the plurality of MSPMs 502-508 may be similar to the MSPM 100 of Figure 1.

[0044] In some embodiments, each of the MSPMs 502-508 includes at least one substrate transfer station disposed in a first transfer surface. The at least one substrate transfer station is configured to perform a transfer of at least one of the plurality of substrates received from the vacuum transfer module 510. Each of the MSPMs 502-508 further includes a plurality of substrate processing stations disposed in a second transfer surface around the substrate transfer region. Each of the plurality of substrate processing stations is configured to process one or more of the plurality of substrates. Each of the MSPMs 502-508 further includes a robot disposed in the substrate transfer region. The robot is configured to move one or more of the plurality of substrates between the at least one substrate transfer station and the plurality of substrate processing stations during a transfer.

[0045] In some embodiments, the vacuum transfer module 510 further includes a second robot configured to perform a transfer of the at least one substrate to the at least one substrate transfer station and also configured to retrieve the at least one substrate from the at least one substrate transfer station after the at least one substrate is processed by at least one of the plurality of substrate processing stations.

[0046] In some embodiments, the vacuum transfer module 510 further includes at least one pre-treatment station and at least one post-treatment station. The at least one pre-treatment station is configured to perform pre-treatment of the plurality of substrates. The pre-treatment includes degassing (e.g., shown as DG in FIG. 5), pre-cleaning (e.g., shown as PC in FIG. 5), or pre-heating of the plurality of substrates. In some embodiments, the at least one post-treatment station is configured to perform post-treatment (e.g., cooling or annealing) of the plurality of substrates.

[0047] In some embodiments, the first and second transport surfaces are coincident with one another, hi some embodiments, the second transport surface is disposed parallel to and offset from the first transport surface.

[0048] Figure 6 illustrates a substrate processing tool 600 including a second cluster tool arrangement based on the MSPM of Figure 1, according to some example embodiments. With reference to Figure 6, the substrate processing tool 600 includes a vacuum transfer module 608 and multiple MSPMs 602, 604, and 606 for processing substrates received from the vacuum transfer module 608. The multiple MSPMs 602-606 are disposed along the periphery of the vacuum transfer module 608. Each of the multiple MSPMs 602-606 can be similar to the MSPM 100 of Figure 1.

[0049] FIG. 7 illustrates a substrate processing tool 700 including a third cluster tool arrangement based on the MSPM of FIG. 1, according to some illustrative embodiments. With reference to FIG. 7, the substrate processing tool 700 includes a vacuum transfer module 710 and multiple MSPMs 702, 704, 706, and 708 for processing substrates received from the vacuum transfer module 710. The multiple MSPMs 702-708 are disposed along the periphery of the vacuum transfer module 710. Each of the multiple MSPMs 702-708 can be similar to the MSPM 100 of FIG. 1. In some embodiments, the vacuum transfer module includes one or more substrate transfer stations 710 that are used to transfer substrates between the MSPMs 702-708.

[0050] 8, 9, 10, and 11 show an MSPM that uses a single transfer surface for the substrate transfer stations and the substrate processing stations, according to some example embodiments. With reference to FIG. 8, a six-station MSPM 800 is shown that uses a single transfer surface for the substrate transfer stations and the substrate processing stations. For example, MSPM 800 includes substrate transfer stations 810 and 812 located at the same level (or in the same transfer surface) as substrate processing stations 802, 804, 806, and 808, and a robot 814.

[0051] 9, a seven-station MSPM 900 is shown that uses a single transfer plane for the substrate transfer and substrate processing stations. For example, the MSPM 900 includes substrate transfer stations 912 and 914 located at the same level (or in the same transfer plane) as substrate processing stations 902, 904, 906, 908, and 910, and a robot 916.

[0052] 10, there is shown a six-station MSPM 1000 that uses a single transfer plane for the substrate transfer stations and the substrate processing stations. For example, the MSPM 1000 includes substrate transfer stations 1010 and 1012 located at the same level (or in the same transfer plane) as substrate processing stations 1002, 1004, 1006, and 1008, and a robot 1014.

[0053] 11, an eight-station MSPM 1100 is shown that uses a single transfer plane for the substrate transfer stations and the substrate processing stations. For example, the MSPM 1100 includes substrate transfer stations 1114 and 1116 located at the same level (or in the same transfer plane) as substrate processing stations 1102, 1104, 1106, 1108, 1110, and 1112, and a robot 1118.

[0054] Figure 12 shows a multi-level MSPM 1200 using multiple transfer surfaces with transfer stations located higher than the substrate processing stations, according to some example embodiments. With reference to Figure 12, the multi-level MSPM 1200 is a seven-station MSPM using multiple transfer surfaces 1202 and 1204. More specifically, the MSPM 1200 includes substrate transfer stations 1206 and 1208 located on a first transfer surface 1202, and substrate processing stations 1210, 1212, 1214, 1216, and 1218 located on a second transfer surface 1204 that is lower than the first transfer surface 1202.

[0055] FIG. 13 shows a vacuum chamber 1300, such as an etch chamber for manufacturing substrates, that can be used in the MSPM disclosed herein, according to some exemplary embodiments. Exciting an electric field between two electrodes is one way to obtain a radio frequency (RF) gas discharge in the vacuum chamber. The discharge obtained when an oscillating voltage is applied between the electrodes is called a CCP discharge. In some embodiments, the substrate processing station disclosed herein can be based on the vacuum chamber 1300.

[0056] A plasma 1302 can be generated in the processing zone 1330 of the vacuum chamber 1300 utilizing one or more process gases to obtain a wide variety of chemically reactive by-products generated by dissociation of various molecules caused by electron-neutral collisions. The chemical aspect of etching involves the reaction of neutral gas molecules and their dissociated by-products with molecules of the surface to be etched, as well as the generation of volatile molecules that can be expelled. When the plasma is generated, positive ions are accelerated from the plasma across a space charge sheath that separates the plasma from the chamber walls and impact the substrate surface with sufficient energy to remove material from the substrate surface. The process of selectively and anisotropically removing material from a substrate surface using highly energetic and chemically reactive ions is called reactive ion etching (RIE). In some embodiments, the vacuum chamber 1300 may be used in conjunction with PECVD or PEALD deposition processes.

[0057] A controller 1316 manages the operation of the vacuum chamber 1300 by controlling different elements in the chamber, such as an RF generator 1318, a gas source 1322, and a gas pump 1320. In one embodiment, fluorocarbon gases such as CF4 and C4F8 are used in the dielectric etch process for their anisotropic and selective etching capabilities, although the principles described herein may be applied to other plasma generating gases. Fluorocarbon gases readily dissociate into chemically reactive by-products, including smaller molecular and atomic radicals. These chemically reactive by-products etch away the dielectric material.

[0058] The vacuum chamber 1300 illustrates a processing chamber having multiple electrodes, such as an upper (or top) electrode 1304 and a lower (or bottom) electrode 1308. The upper electrode 1304 may be grounded or coupled to an RF generator (not shown), and the lower electrode 1308 is coupled to an RF generator 1318 via a matching network 1314. The RF generator 1318 provides an RF signal between the upper electrode 1304 and the lower electrode 1308 to generate RF power at one or more (e.g., two or three) different RF frequencies. At least one of the multiple RF frequencies can be turned on or off according to the desired configuration of the vacuum chamber 1300 for a particular operation. In the embodiment illustrated in FIG. 13, the RF generator 1318 is configured to provide at least three different frequencies, e.g., 400 kHz, 2 MHz, 27 MHz, and 60 MHz, although other frequencies are possible.

[0059] The vacuum chamber 1300 includes a gas showerhead on the top electrode 1304 that inputs process gases supplied by a gas source 1322 into the vacuum chamber 1300, and a perforated confinement ring 1312 that allows gases to be pumped out of the vacuum chamber 1300 by a gas pump 1320. In some exemplary embodiments, the gas pump 1320 is a turbomolecular pump, although other types of gas pumps may be utilized.

[0060] When a substrate 1306 is present in the vacuum chamber 1300, a silicon focus ring 1310 is positioned next to the substrate 1306 such that a uniform RF field exists at the bottom of the plasma 1302 for uniform etching (or deposition) on the surface of the substrate 1306. The embodiment of Figure 13 shows a triode reactor configuration in which a top electrode 1304 is surrounded by a symmetric RF ground electrode 1324. An insulator 1326 is a dielectric that insulates the ground electrode 1324 from the top electrode 1304. Other implementations of the vacuum chamber 1300 are also possible, including ICP-based implementations, without changing the scope of the disclosed embodiments.

[0061] As used herein, the term "substrate" refers to a support material on or within which elements of a semiconductor device are fabricated or attached. Substrates (e.g., substrate 1306) may include, for example, wafers (e.g., having diameters of 100 mm, 150 mm, 200 mm, 300 mm, 450 mm, or more) composed of elemental semiconductor materials (e.g., silicon (Si) or germanium (Ge)) or compound semiconductor materials (e.g., silicon germanium (SiGe) or gallium arsenide (GaAs)). In addition, other substrates include, for example, dielectric materials such as quartz or sapphire (on which semiconductor materials may be applied). Exemplary substrates include blanket substrates and patterned substrates. A blanket substrate is a substrate that includes a low surface (or flat) top surface. A patterned substrate is a substrate that includes a high surface (or structured) top surface. The structured top surface of the substrate may include different high surface area structures such as 3D NAND memory holes or other structures.

[0062] Each frequency generated by the RF generator 1318 can be selected for a specific purpose in the substrate fabrication process. In the example of FIG. 13, where RF power is provided at 400 kHz, 2 MHz, 27 MHz, and 60 MHz, the 400 kHz or 2 MHz RF power provides ion energy control, while the 27 MHz and 60 MHz powers provide control of the plasma density and dissociation pattern of the chemical. This configuration, where each RF power can be turned on or off, allows for certain processes that use ultra-low ion energy on the substrate, and certain processes where the ion energy must be low (e.g., less than 700 or 200 eV) (e.g., soft etching for low-k materials).

[0063] In another embodiment, 60 MHz RF power is used for the top electrode 1304 to obtain very low energy and very high density. This configuration allows for chamber cleaning with high density plasma while minimizing sputtering on the electrostatic chuck (ESC) surface when the substrate 1306 is not in the vacuum chamber 1300. The bottom 2 MHz and 27 MHz power supplies may be turned off during cleaning since the ESC surface is exposed in the absence of the substrate 1306 and any ion energy on the surface should be avoided.

[0064] FIG. 14 is a block diagram illustrating an example of a machine 1400 that can implement or control one or more exemplary process embodiments described herein. In alternative embodiments, the machine 1400 may operate as a standalone device or may be connected (e.g., networked) to other machines. In a network deployment, the machine 1400 can operate in the capacity of a server machine, a client machine, or both, in a server-client network environment. In one example, the machine 1400 can operate as a peer machine in a peer-to-peer (P2P) (or other distributed) network environment. Furthermore, although only a single machine 1400 is shown, the term "machine" should also be construed to include any collection of machines that individually or jointly execute a set (or sets) of instructions to implement any one or more of the methodologies described herein, such as via cloud computing, software as a service (SaaS), or other computer cluster configurations.

[0065] The examples described herein may include or operate by logic, some components, or mechanisms. A circuit set is a collection of circuits implemented in a tangible entity that includes hardware (e.g., simple circuits, gates, logic, etc.). The membership of a circuit set can flexibly accommodate the passage of time and the variability of the underlying hardware. A circuit set includes members that, alone or in combination, can perform a particular operation when operated. In one example, the hardware of a circuit set may be immutably designed (e.g., hardwired) to perform a particular operation. In one example, the hardware of a circuit set may include variably connected physical components (e.g., execution units, transistors, simple circuits) that include a computer-readable medium that has been physically modified (e.g., magnetically, electrically, by a movable arrangement of immutable mass particles, etc.) to encode instructions for a particular operation. In connecting the physical components, the underlying electrical properties of the hardware components are changed (e.g., from insulator to conductor or vice versa). The instructions enable the built-in hardware (e.g., execution units or loading mechanisms) to create the members of the circuit set in the hardware through the variable connections to perform some of the particular operations when operated. Thus, the computer-readable medium is communicatively coupled to other components of the circuit set when the device is operating. In some aspects, any of the physical components may be used in multiple members of multiple circuit sets. For example, during operation, an execution unit may be used in a first circuit of a first circuit set at one time and reused at another time by a second circuit in the first circuit set or by a third circuit in the second circuit set.

[0066] The machine (e.g., computer system) 1400 may include a hardware processor 1402 (e.g., a central processing unit (CPU), a hardware processor core, or any combination thereof), a graphics processing unit (GPU) 1403, a main memory 1404, and a static memory 1406, some or all of which may communicate with each other via an interlink (e.g., a bus) 1408. The machine 1400 may further include a display device 1410, an alphanumeric input device 1412 (e.g., a keyboard), and a user interface (UI) navigation device 1414 (e.g., a mouse). In one example, the display device 1410, the alphanumeric input device 1412, and the UI navigation device 1414 may be touch screen displays. The machine 1400 may further include a mass storage device (e.g., a drive unit) 1416, a signal generating device 1418 (e.g., a speaker), a network interface device 1420, and one or more sensors 1421 (such as a Global Positioning System (GPS) sensor, a compass, an accelerometer, or another sensor). The machine 1400 may include an output controller 1428, such as a serial (e.g., Universal Serial Bus (USB)), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC)) connection, for communicating with or controlling one or more peripheral devices (e.g., printer, card reader).

[0067] In an exemplary embodiment, the hardware processor 1402 is capable of performing at least the functionality of the controller 1316 described above in connection with Figure 13. In some embodiments, the hardware processor 1402 is configured to control the functionality of one or more MSPMs described herein (e.g., as a controller for an individual MSPM, as a controller for an individual substrate processing station, as a controller for a substrate processing tool including multiple MSPMs, or a combination thereof).

[0068] The mass storage device 1416 may include a machine-readable medium 1422. The machine-readable medium 1422 stores one or more sets of data structures or instructions 1424 (e.g., software) that embody or are utilized by any one or more of the techniques or functions described herein. The instructions 1424 may also reside, completely or at least partially, within the main memory 1404, within the static memory 1406, within the hardware processor 1402, or within the GPU 1403 during execution by the machine 1400. In one example, the machine-readable medium may be constituted by any one of the hardware processor 1402, the GPU 1403, the main memory 1404, the static memory 1406, or the mass storage device 1416, or any combination thereof.

[0069] Although the machine-readable medium 1422 is depicted as a single medium, the term “machine-readable medium” may include a single medium or multiple media (e.g., a centralized or distributed database, and / or associated caches and servers) configured to store one or more instructions 1424.

[0070] The term "machine-readable medium" may include any medium capable of storing, encoding, or carrying instructions 1424 for execution by the machine 1400 and causing the machine 1400 to perform any one or more of the techniques of this disclosure, or any medium capable of storing, encoding, or carrying data structures used by or related to such instructions 1424. Non-limiting examples of machine-readable media may include solid-state memory, optical media, and magnetic media. In one example, a high-capacity machine-readable medium includes a machine-readable medium 1422 with a plurality of particles having an unchanging (e.g., stationary) mass. Thus, a high-capacity machine-readable medium is not a signal that propagates temporarily. Specific examples of high-capacity machine-readable media may include non-volatile memories such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices, magnetic disks such as internal hard disks and removable disks, magneto-optical disks, and CD-ROM and DVD-ROM disks.

[0071] The instructions 1424 may further be transmitted or received over a communications network 1426 via the network interface device 1420 using a transmission medium.

[0072] The implementation of the aforementioned techniques can be achieved through any number of specifications, configurations, or exemplary deployments of hardware and software. It should be understood that functional units or capabilities described herein may be referred to or labeled as components or modules to particularly emphasize the independence of their implementation. Such components can be embodied by any number of software or hardware forms. For example, a component or module may be implemented as a hardware circuit comprising custom very large scale integrated (VLSI) circuits or gate arrays, off-the-shelf semiconductors such as logic chips, transistors, or other discrete components. A component or module may also be implemented in programmable hardware devices such as field programmable gate arrays, programmable array logic, programmable logic devices, etc. A component or module may also be implemented in software for execution by various types of processors. An identified component or module of executable code may include, for example, one or more physical or logical blocks of computer instructions, which may be structured as, for example, an object, a procedure, or a function. Nonetheless, the executable files of an identified component or module need not be physically located together and may comprise disparate instructions stored in different locations which, when logically linked together, constitute the component or module and achieve the stated purpose of the component or module.

[0073] Indeed, an executable code component or module may be a single instruction or many instructions, and may be distributed across several different code segments, among different programs, and across several memory devices or processing systems. In particular, some aspects of the described process (such as code rewriting and code analysis) may be performed on a processing system (e.g., a computer in a data center) different from the processing system on which the code is deployed (e.g., a computer embedded in a sensor or robot). Similarly, operational data is identified and exemplified herein within components or modules, and may be embodied in any suitable form and structured within any suitable type of data structure. Operational data may be collected as a single data set or may be distributed across different locations, such as across different storage devices, or may exist, at least in part, simply as electronic signals on a system or network. A component or module may be passive or active, such as an agent operable to perform a desired function.

[0074] Additional Notes and Examples

[0075] Example 1 is a multi-station processing module for processing substrates, comprising: at least one substrate transfer station disposed on a first transport surface, the at least one substrate transfer station configured to perform a transfer of at least one substrate of a plurality of substrates; a plurality of substrate processing stations disposed on a second transport surface around a substrate transfer region, the second transport surface being disposed parallel to and offset from the first transport surface, each of the plurality of substrate processing stations configured to process one or more of the plurality of substrates; and a robot disposed in the substrate transfer region, the robot configured to move one or more of the plurality of substrates between the first transport surface and the second transport surface during a transfer.

[0076] In Example 2, the subject matter of Example 1 includes subject matter where the robot is configured to move one or more of a plurality of substrates between at least one substrate transfer station and a plurality of substrate processing stations via a corresponding plurality of substrate passing slots.

[0077] In Example 3, the subject matter of Example 2 includes subject matter where the robot is configured to move one or more of a plurality of substrates horizontally within a first substrate passing slot of a plurality of substrate passing slots, the first substrate passing slot being disposed in a first transfer surface between at least one substrate transfer station and a vertical passage of the substrate transport region.

[0078] In Example 4, the subject matter of Example 3 includes subject matter where the robot is configured to vertically move one or more of the plurality of substrates from a first transport surface to at least one of the plurality of substrate processing stations in a second transport surface using a vertical passage and at least a second substrate passing slot of the plurality of substrate passing slots, the at least second substrate passing slot being disposed in the second transport surface.

[0079] In Example 5, the subject matter of Examples 1-4 includes subject matter where at least one substrate transfer station is configured to perform a transfer during processing of one or more of the plurality of substrates by at least one of the plurality of substrate processing stations.

[0080] In Example 6, the subject matter of Examples 1-5 includes subject matter where the plurality of substrate processing stations comprises a corresponding plurality of substantially axisymmetric body portions.

[0081] In Example 7, the subject matter of Example 6 includes subject matter where the plurality of substantially axisymmetric body portions are isolated from one another via at least one purge gas curtain.

[0082] In Example 8, the subject matter of Examples 1-7 includes a slide arrangement disposed on a first transport surface, the slide arrangement configured to move a second transport surface vertically and horizontally relative to the first transport surface.

[0083] In Example 9, the subject matter of Examples 1-8 includes subject matter where the at least one substrate transfer station comprises a substrate transfer station and a pre-processing station disposed on the first transport surface, and the substrate transfer station is configured to perform transfer of at least one substrate of the plurality of substrates.

[0084] In Example 10, the subject matter of Example 9 includes subject matter where the pre-treatment station is configured to perform pre-treatment of the plurality of substrates, the pre-treatment including at least one of pre-cleaning or pre-heating the plurality of substrates.

[0085] In Example 11, the subject matter of Examples 1-10 includes subject matter where at least one substrate transfer station comprises at least one pre-treatment station and at least one post-treatment station, where the at least one pre-treatment station is configured to perform pre-treatment of the plurality of substrates, the pre-treatment including degassing, pre-cleaning, or pre-heating the plurality of substrates, and where the at least one post-treatment station is configured to perform post-treatment of the plurality of substrates, the post-treatment including performing cooling or annealing.

[0086] In Example 12, the subject matter of Examples 1-11 includes subject matter where the plurality of substrates comprises a plurality of semiconductor wafers.

[0087] In Example 13, the subject matter of Examples 1-12 includes subject matter where multiple substrate processing stations are configured to process one or more of a plurality of substrates while performing the same deposition or etch process.

[0088] In Example 14, the subject matter of Examples 1-13 includes subject matter where multiple substrate processing stations are configured to perform different deposition or etch processes while processing one or more of the multiple substrates.

[0089] In Example 15, the subject matter of Examples 1-14 includes subject matter where multiple substrate processing stations are symmetrically arranged around a substrate transfer region.

[0090] In Example 16, the subject matter of Examples 1-15 includes subject matter where the multiple substrate processing stations are asymmetrically positioned around the substrate transfer region.

[0091] Example 17 is a substrate processing tool comprising: a vacuum transfer module; and a plurality of multi-station processing modules for processing substrates received from the vacuum transfer module, the plurality of multi-station processing modules arranged along an outer periphery of the vacuum transfer module, each of the plurality of multi-station processing modules having at least one substrate transfer station arranged on a first transfer surface configured to perform a transfer of at least one substrate of the plurality of substrates received from the vacuum transfer module; a plurality of substrate processing stations arranged on a second transfer surface around a substrate transfer region, each of the plurality of substrate processing stations configured to process one or more of the plurality of substrates; and a robot arranged in the substrate transfer region, the robot configured to move one or more of the plurality of substrates between the at least one substrate transfer station and the plurality of substrate processing stations during a transfer.

[0092] In Example 18, the subject matter of Example 17 includes subject matter wherein the vacuum transfer module further comprises a second robot, the second robot configured to transfer at least one substrate to the at least one substrate transfer station and retrieve at least one substrate from the at least one substrate transfer station after processing the at least one substrate by at least one of the plurality of substrate processing stations.

[0093] In Example 19, the subject matter of Examples 17-18 includes subject matter where the vacuum transfer module further comprises at least one pre-treatment station and at least one post-treatment station.

[0094] In Example 20, the subject matter of Examples 17-19 includes subject matter wherein the first transfer surface and the second transfer surface are coincident with one another.

[0095] In Example 21, the subject matter of Examples 17-20 includes subject matter wherein the second transfer surface is positioned parallel to and offset from the first transfer surface.

[0096] Example 22 is a multi-station processing module for processing substrates, comprising: at least one substrate transfer station disposed on a first transport surface, the at least one substrate transfer station configured to perform a transfer of at least one substrate of a plurality of substrates; a plurality of substrate processing stations disposed on a second transport surface around a substrate transfer region, each of the plurality of substrate processing stations configured to process one or more of the plurality of substrates using a substantially axially symmetric body portion; and a robot disposed in the substrate transfer region, the robot configured to move one or more of the plurality of substrates between the at least one substrate transfer station and the plurality of substrate processing stations during a transfer.

[0097] In Example 23, the subject matter of Example 22 includes subject matter wherein the first transfer surface and the second transfer surface are coincident with one another.

[0098] In Example 24, the subject matter of Examples 22-23 includes subject matter wherein the second transfer surface is positioned parallel to and offset from the first transfer surface.

[0099] In Example 25, the subject matter of Example 24 includes a slide arrangement disposed on a first transport surface, the slide arrangement configured to move a second transport surface vertically and horizontally relative to the first transport surface.

[0100] Example 26 is at least one machine-readable medium including instructions that, when executed by a processing circuit, cause the processing circuit to perform operations that implement any of Examples 1-25.

[0101] Example 27 is an apparatus comprising means for implementing any of Examples 1 to 25.

[0102] Example 28 is a system that implements any of Examples 1 to 25.

[0103] Example 29 is a method for implementing any of Examples 1 to 25.

[0104] Throughout this specification, components, operations, or structures described as a single instance may be implemented by multiple instances. Although individual operations of one or more methods are illustrated and described as separate operations, one or more of the individual operations may be performed simultaneously, and each operation need not be performed in the order illustrated. Structures and functions presented as separate components in example configurations may be implemented as combined structures or components. Similarly, structures and functions presented as single components may be implemented as separate components. These and other variations, modifications, additions, and improvements are included within the scope of the subject matter of this specification.

[0105] The illustrated embodiments have been described in sufficient detail to enable those skilled in the art to practice the disclosed teachings. Other embodiments may be utilized and derived from the teachings disclosed herein, such that structural and logical substitutions and changes can be made without departing from the scope of the disclosure. Therefore, this detailed description is not to be taken in a limiting sense, and the scope of the various embodiments is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled.

[0106] The claims do not recite all of the features disclosed herein, as an embodiment may feature a subset of said features. Moreover, an embodiment may include fewer features than are disclosed in a particular example. Thus, the following claims are hereby incorporated into the Detailed Description, and the claims stand on their own as separate embodiments.

[0107] As used herein, the term "or" may be interpreted in an inclusive or exclusive sense. Moreover, multiple instances may be provided for a resource, operation, or structure described herein as a single instance. In addition, boundaries between various resources, operations, modules, engines, and data stores are somewhat arbitrary, and certain operations are illustrated in the context of certain exemplary configurations. Other allocations of functionality are contemplated and may be included within the scope of various embodiments of the disclosure. In general, structures and functions presented as separate resources in an exemplary configuration may be implemented as a combined structure or resource. Similarly, structures and functions presented as a single resource may be implemented as separate resources. These and other variations, modifications, additions, and improvements are included within the scope of the embodiments of the disclosure as expressed by the appended claims. The specification and drawings are therefore to be regarded in an illustrative sense, and not in a restrictive sense.

Claims

1. 1. A multi-station processing module for processing a substrate, comprising: at least one substrate transfer station disposed on the first transport surface, the at least one substrate transfer station configured to perform a transfer of at least one substrate of a plurality of substrates; a plurality of substrate processing stations arranged on a second transfer surface around a substrate transfer region, the second transfer surface being arranged parallel to and offset from the first transfer surface, each of the plurality of substrate processing stations being configured to process one or more of the plurality of substrates; a robot disposed in the substrate transfer region, the robot configured to move the one or more of the plurality of substrates between the first transfer surface and the second transfer surface during the transfer; A multi-station processing module comprising:

2. 2. The multi-station processing module of claim 1, A multi-station processing module, wherein the robot is configured to move the one or more of the plurality of substrates between the at least one substrate transfer station and the plurality of substrate processing stations via a corresponding plurality of substrate pass-through slots.

3. 3. A multi-station processing module according to claim 2, comprising: a multi-station processing module, the multi-station processing module being configured to horizontally move the one or more of the plurality of substrates within a first substrate passing slot of the plurality of substrate passing slots, the first substrate passing slot being disposed on the first transfer surface between the at least one substrate transfer station and a vertical passage of the substrate transfer region.

4. 4. A multi-station processing module according to claim 3, comprising: A multi-station processing module, wherein the robot is configured to vertically move the one or more of the plurality of substrates from the first transport surface to at least one of the plurality of substrate processing stations in the second transport surface using the vertical passage and at least a second substrate passing slot of the plurality of substrate passing slots, the at least a second substrate passing slot being disposed in the second transport surface.

5. 2. The multi-station processing module of claim 1, A multi-station processing module, wherein the at least one substrate transfer station is configured to effect the transfer during processing of the one or more of the plurality of substrates by at least one of the plurality of substrate processing stations.

6. 2. The multi-station processing module of claim 1, A multi-station processing module, wherein the plurality of substrate processing stations comprises a corresponding plurality of substantially axisymmetric body portions.

7. 7. A multi-station processing module according to claim 6, comprising: The plurality of substantially axisymmetric body portions are isolated from one another via at least one purge gas curtain.

8. 2. The multi-station processing module of claim 1, a slide arrangement disposed on the first transport surface, the slide arrangement configured to move the second transport surface vertically and horizontally relative to the first transport surface; The multi-station processing module further comprises:

9. 2. The multi-station processing module of claim 1, a substrate transfer station disposed on the first transport surface and configured to transfer the at least one substrate of the plurality of substrates;

10. 10. A multi-station processing module according to claim 9, comprising: A multi-station processing module, wherein the pre-treatment station is configured to perform a pre-treatment of the plurality of substrates, the pre-treatment including at least one of pre-cleaning or pre-heating the plurality of substrates.

11. 2. The multi-station processing module of claim 1, the at least one substrate transfer station comprises at least one pre-treatment station and at least one post-treatment station; the at least one pre-treatment station is configured to perform a pre-treatment of the plurality of substrates, the pre-treatment including degassing, pre-cleaning, or pre-heating the plurality of substrates; the at least one post-treatment station is configured to perform a post-treatment of the plurality of substrates, the post-treatment comprising performing cooling or annealing; Multi-station processing module.

12. 2. The multi-station processing module of claim 1, The plurality of substrates comprises a plurality of semiconductor wafers.

13. 2. The multi-station processing module of claim 1, A multi-station processing module, wherein the plurality of substrate processing stations are configured to perform the same deposition or etch process while processing the one or more of the plurality of substrates.

14. 2. The multi-station processing module of claim 1, A multi-station processing module, wherein the plurality of substrate processing stations are configured to perform different deposition or etch processes while processing the one or more of the plurality of substrates.

15. 2. The multi-station processing module of claim 1, A multi-station processing module, wherein the plurality of substrate processing stations are symmetrically arranged around the substrate transfer region.

16. 2. The multi-station processing module of claim 1, A multi-station processing module, wherein the plurality of substrate processing stations are asymmetrically positioned around the substrate transfer region.

17. 1. A substrate processing tool comprising: a vacuum transfer module; a plurality of multi-station processing modules for processing substrates received from the vacuum transfer module, the plurality of multi-station processing modules being disposed about a periphery of the vacuum transfer module, each of the plurality of multi-station processing modules comprising: at least one substrate transfer station disposed on a first transfer surface, the at least one substrate transfer station configured to perform a transfer of at least one substrate of the plurality of substrates received from the vacuum transfer module; a plurality of substrate processing stations disposed on a second transfer surface about a substrate transfer region, each of the plurality of substrate processing stations configured to process one or more of the plurality of substrates; and a robot disposed in the substrate transfer region, the robot configured to move the one or more of the plurality of substrates between the at least one substrate transfer station and the plurality of substrate processing stations during the transfer; a plurality of multi-station processing modules comprising: A substrate processing tool comprising:

18. 20. A substrate processing tool according to claim 17, comprising: The vacuum transfer module further comprises a second robot, the second robot comprising: transferring the at least one substrate to the at least one substrate transfer station; and recovering the at least one substrate from the at least one substrate transfer station after processing the at least one substrate by at least one of the plurality of substrate processing stations. The substrate processing tool is configured as follows:

19. 20. A substrate processing tool according to claim 17, comprising: the vacuum transfer module further comprises at least one pre-treatment station and at least one post-treatment station; the at least one pre-treatment station is configured to perform a pre-treatment of the plurality of substrates, the pre-treatment including degassing, pre-cleaning, or pre-heating the plurality of substrates; the at least one post-treatment station is configured to perform a post-treatment of the plurality of substrates, the post-treatment comprising performing cooling or annealing; Substrate processing tools.

20. 20. A substrate processing tool according to claim 17, comprising: A substrate processing tool, wherein the first transfer surface and the second transfer surface are coincident with one another.

21. 20. A substrate processing tool according to claim 17, comprising: A substrate processing tool, wherein the second transport surface is disposed parallel to and offset from the first transport surface.

22. 1. A multi-station processing module for processing a substrate, comprising: at least one substrate transfer station disposed on the first transport surface, the at least one substrate transfer station configured to perform a transfer of at least one substrate of a plurality of substrates; a plurality of substrate processing stations disposed in a second transfer surface about a substrate transfer region, each of the plurality of substrate processing stations configured to process one or more of the plurality of substrates using a substantially axially symmetric body portion; a robot disposed in the substrate transfer region, the robot configured to move the one or more of the plurality of substrates between the at least one substrate transfer station and the plurality of substrate processing stations during the transfer; A multi-station processing module comprising:

23. 23. A multi-station processing module according to claim 22, comprising: The first transfer surface and the second transfer surface are coincident with one another.

24. 23. A multi-station processing module according to claim 22, comprising: The second transport surface is disposed parallel to and offset from the first transport surface.

25. 25. A multi-station processing module according to claim 24, comprising: a slide arrangement disposed on the first transport surface, the slide arrangement configured to move the second transport surface vertically and horizontally relative to the first transport surface; The multi-station processing module further comprises:

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