Electromagnetic wave resonance structure, manufacturing method for electromagnetic wave resonance structure and electronic component

Abstract

To provide an electromagnetic wave resonance structure that absorbs a terahertz wave.SOLUTION: An electromagnetic wave resonance structure has a conductive part and a non-conductive part, and the non-conductive part has a region where an insulator is mixed into the conductive part.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present invention relates to an electromagnetic wave resonant structure, a method for manufacturing an electromagnetic wave resonant structure, an electronic component, and a conductive structure. [Background technology]

[0002] The frequencies of electromagnetic waves used in 6G communications and imaging fields are between 0.1 THz and 10 THz, and the split-ring resonator (SRR), one of the representative resonator elements used in metamaterials, is known as a pattern structure that can absorb electromagnetic waves in the terahertz band (also called terahertz waves). The unit cell size of the SRR is approximately 100 μm, and the line width that forms the SRR is several μm to several tens of μm.

[0003] A structure with such a line width can be created by using the super inkjet, but it generally uses a single nozzle with a capillary, which is less productive than the inkjet.In addition, it is necessary to control the gap (electric potential difference) between the nozzle and the object to be coated more precisely than with the inkjet.

[0004] On the other hand, a method is known in which a ring-shaped pattern having a line width of 10 μm or less is formed by an inkjet method by utilizing the coffee stain phenomenon (for example, Patent Document 1). Summary of the Invention [Problem to be solved by the invention]

[0005] Resonator elements such as SRRs have ring and split sections to absorb electromagnetic waves, but the ring formation method using the coffee stain phenomenon does not form a split section, so a structure that absorbs terahertz waves cannot be obtained.

[0006] An object of the present invention is to provide an electromagnetic wave resonant structure capable of absorbing terahertz waves. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems, an electromagnetic wave resonant structure according to one embodiment of the present invention has a conductive part and a non-conductive part, and the non-conductive part has an area in which an insulator is mixed into a part of the conductive part. Effect of the Invention

[0008] According to one aspect of the present invention, it is possible to provide an electromagnetic wave resonant structure capable of absorbing terahertz waves. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 illustrates a split ring resonator (SRR). [Diagram 2] 11A and 11B are diagrams illustrating a method for checking the conductivity of a mixed region where a metal region and a resin region overlap each other. [Diagram 3] FIG. 1 is a schematic diagram of an inkjet device. [Figure 4] 1A and 1B are diagrams illustrating a state in which resin ink is ejected onto a substrate. [Diagram 5] FIG. 4 is a diagram showing resin ink ejected onto a substrate. [Figure 6] 13A and 13B are diagrams showing a state in which metal ink is ejected onto a substrate on which resin ink has been ejected. [Figure 7] 1A and 1B are diagrams showing resin ink and metal ink ejected onto a substrate. [Figure 8] 13 is a diagram showing a state in which a part of a metal ink overlaps a part of a resin ink on a substrate. FIG. [Figure 9] FIG. 1 is a diagram illustrating a first embodiment. [Figure 10] 10 is a cross-sectional view taken along line AA in FIG. 9. [Figure 11] 1A and 1B are diagrams illustrating a state in which metal ink is ejected onto a substrate. [Figure 12] FIG. 2 is a diagram showing metal ink ejected onto a substrate. [Figure 13] 13A and 13B are diagrams showing a state in which resin ink is ejected onto a substrate onto which metal ink has been ejected. [Figure 14]1A and 1B are diagrams showing metal ink and resin ink ejected onto a substrate. [Figure 15] 13 is a diagram showing a state in which a part of the resin ink overlaps a part of the metal ink on a substrate. FIG. [Figure 16] FIG. 13 is a diagram illustrating a second embodiment. [Figure 17] 16 is a cross-sectional view of FIG. 15 taken along line B-B. [Figure 18] FIG. 2 is a diagram showing a hydrophilic portion obtained by subjecting a part of a substrate to hydrophilic treatment. [Figure 19] 13A and 13B are diagrams illustrating resin ink ejected onto a hydrophilic portion of a substrate. [Figure 20] FIG. 13 is a diagram illustrating a third embodiment. [Figure 21] FIG. 13 is a diagram illustrating a fourth embodiment. [Figure 22] FIG. 13 is a diagram showing the state in which multiple SRRs are solidified with resin. [Figure 23] FIG. 13 is a diagram illustrating a fifth embodiment. [Figure 24] FIG. 13 is a diagram illustrating a sixth embodiment. [Diagram 25] FIG. 1 shows an SRR having two non-conductive parts. [Figure 26] FIG. 13 is a diagram showing a seventh embodiment. [Figure 27] FIG. 13 is a diagram illustrating an eighth embodiment. [Figure 28] FIG. [Figure 29] 29 is a cross-sectional view taken along CC in FIG. 28. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings, common parts are denoted by the same or corresponding reference numerals, and the description thereof may be omitted.

[0011] <Electromagnetic wave resonant structure> <<First embodiment>> The electromagnetic wave resonant structure 100 of the first embodiment has a conductive portion and a non-conductive portion.

[0012] An example of an electromagnetic wave resonant structure is a split-ring resonator (SRR) (Fig. 1). The SRR has a ring-shaped ring portion (conductive portion) CP in a plan view and a split portion (non-conductive portion) NC formed between both ends of the ring portion CP, where the ring portion CP is reactance L and the split portion NC is capacitance C (capacitor), forming a closed circuit of LC resonance. In the SRR, incident electromagnetic waves undergo LC resonance, and the electromagnetic waves are absorbed.

[0013] Specifically, as shown in Figure 1, when an electromagnetic wave (incident magnetic field) IM with a magnetic field component oscillating vertically is irradiated onto a plane including the SRR, an induced current J flows along the ring section CP, which creates a counter magnetic field RM that cancels out the incident magnetic field through electromagnetic induction. Meanwhile, positive and negative charges accumulate in the division section NC. These charges flow to the ring section CP via the capacitance C, forming a closed LC resonance circuit within the SRR structure.

[0014] In this case, the resonant frequency f0 of the SRR is given by Equation 1.

number

[0015] The conductive portion is a region made of a conductor. A metal is preferably used as the conductor constituting the conductive portion. That is, the conductive portion is preferably made of a metal. In this way, when the conductive portion is made of a metal, it becomes possible to apply the conductive portion of the electromagnetic wave resonant structure to the ring portion (conductive portion) of the SRR.

[0016] The type of metal is not particularly limited, and examples thereof include silver (Ag), copper (Cu), gold (Au), aluminum (Al), magnesium (Mg), tungsten (W), molybdenum (Mo), zinc (Zn), nickel (Ni), and alloys of two or more of these metals. Among these, silver or a silver alloy is preferred because of its high electrical conductivity.

[0017] In addition, the material used for the conductor constituting the conductive portion is not limited to metal, and conductive materials other than metal may be used. Examples of conductive materials other than metal include ferroelectrics such as PZT (lead zirconate titanate), conductive carbons such as graphene and carbon nanotubes, conductive complex oxides such as ITO (indium tin oxide), and conductive polymers such as PEDOT (polyethylenedioxythiophene).

[0018] The conductive portion is preferably ring-shaped in a plan view. By forming the conductive portion into such a ring shape, when an electromagnetic wave resonant structure including the conductive portion is applied to an SRR, the conductive portion can form the ring portion of the SRR.

[0019] Moreover, the conductive portion having a ring shape in plan view is preferably formed by utilizing the coffee stain phenomenon. In this specification, the coffee stain phenomenon refers to a phenomenon in which, when a droplet of coffee or the like dries, the amount of evaporation from the outer edge (periphery) of the droplet is greater than that of other parts, so that the liquid flows toward the periphery to compensate for this, resulting in the formation of a film on the periphery after drying (see Figs. 9 and 16).

[0020] When a metal particle ink containing Ag particles (hereinafter referred to as metal ink) is ejected by inkjet onto a substrate (e.g., a glass substrate) heated to 120°C, a ring-shaped thin line is formed in a planar view due to the coffee stain phenomenon. The line width of this thin line is about several tens of μm, and it was found that a dimension capable of absorbing electromagnetic waves in the terahertz band (terahertz waves) can be realized.

[0021] The conductive portion is formed by ejecting conductive ink. In this embodiment, metal ink 31 is ejected onto the substrate 10, and the metal ink 31 is cured to form a metal region 30 containing a metal M on the substrate 10 (see FIGS. 6 to 8). Here, the metal region 30 is an example of a conductive portion, and the metal ink 31 is an example of a conductive ink.

[0022] The non-conductive portion is a region that does not exhibit electrical conductivity. The material constituting the non-conductive portion is an insulating material such as resin or glass, and preferably resin.

[0023] The type of resin is not particularly limited, and examples thereof include curable resins such as acrylic, epoxy, polyimide, polyamide, polyimideamide, etc. These resins may be used alone or in combination of two or more kinds.

[0024] The thickness of the non-conductive portion is not particularly limited and can be appropriately selected depending on the purpose. It is preferable that the thickness of the non-conductive portion is controlled to a thickness that allows a part of the resin ink 21 to be in an uncured state when the resin ink 21 is cured to form the resin region 20 and the metal ink 31 is cured to form the metal region 30, as described later.

[0025] The non-conductive portion optionally contains other components such as a filler, a polymerization initiator, a polymerization inhibitor, a surfactant, and a colorant.

[0026] The non-conductive portion is formed by ejecting a non-conductive ink. In this embodiment, a resin ink 21 is ejected onto the substrate 10, and the resin ink 21 is cured to form a resin region 20 on the substrate 10, and a portion 23 of the resin region 20 constitutes the non-conductive portion (see FIGS. 6 to 9). Here, the resin region 20 is an example of an insulator, the portion 23 of the resin region 20 is an example of a non-conductive portion, and the resin ink 21 is an example of a non-conductive ink.

[0027] The non-conductive portion has a region where an insulator is mixed into a part of a conductive portion (hereinafter, referred to as a mixed region).

[0028] The material of the insulator is not particularly limited, but is preferably a resin. The type of resin is not particularly limited, but examples thereof include curable resins such as acrylic, epoxy, polyimide, polyamide, and polyimideamide. These resins may be used alone or in combination of two or more.

[0029] By using a resin as the insulator, it becomes possible to apply the non-conductive portion of the electromagnetic wave resonant structure to the division portion (non-conductive portion) of the SRR.

[0030] In this embodiment, the mixed region 40 is configured with a region in which a conductive portion having a ring shape in a plan view and an insulator having a circular shape in a plan view overlap each other.

[0031] An example of a mixed region 40 is a region in which a part 33 (metal M1) of a metal region 30 which is ring-shaped in a planar view is laminated onto a part 23 of a resin region 20 which is circular in a planar view, and the metal M1 laminated onto the resin region 20 is insulated from a metal region 32 (metal M2) which is not laminated onto the resin region 20 (Figures 10 and 11).

[0032] In addition, in another example of a mixed region 40, a portion 33 (metal M1) of the metal region 30 is incorporated into the resin region 20, and the metal M1 incorporated into the resin region 20 is insulated from a metal region 32 (metal M2) that is not laminated to the resin region 20 (Figures 16 and 17).

[0033] The conductivity of such a mixed region was confirmed. As shown in Fig. 2, a substrate 10 (e.g., a glass substrate) was placed on a heater H (e.g., a stage heater), and a resin ink containing an acrylic resin was dropped onto the substrate 10 heated to 120°C. Furthermore, a metal ink containing Ag particles was dropped onto the resin ink, and the metal ink was also heated at 120°C to harden it, forming a mixed region 40 in which a metal region 30 was laminated on a resin region 20. The resin regions 20 were prepared in both thick and thin thicknesses.

[0034] A tester was connected to the metal region 30 to check the conductivity. As a result, it was found that the mixed region 40 of the resin region 20 and the metal region 30 was non-conductive. It was also found that a thicker resin region 20 was less likely to achieve conductivity than a thinner resin region. The thicker the resin region, the more heat energy is required for curing (harder to cure), so there are many uncured parts of the resin region, and the resin gets between the metal particles, inhibiting the conductivity between the metal particles, which is thought to have caused the mixed region 40 to become non-conductive.

[0035] This result suggests that it is possible to make the metal region 30 non-conductive by providing the uncured resin portion 21 in the resin region 20 of the mixed region 40. Also, in this experiment, the metal region 30 was formed on the resin region 20, but even if the resin region 20 is formed on the metal region 30, it is predicted that the mixed region 40 will be non-conductive if the metal region 30 is left uncured and the resin region 20 is formed on it.

[0036] As a result, the metal region 32 excluding the mixed region 40 constitutes a conductive portion, and the mixed region 40 constitutes a non-conductive portion. Specifically, the metal region 32 (conductive portion) constitutes a ring portion CP in the SRR, and becomes reactance L. Also, the mixed region 40 (non-conductive portion) constitutes a division portion NC in the SRR, and becomes capacitance C (capacitor) (FIGS. 1, 9, 17).

[0037] <Method of manufacturing an electromagnetic wave resonator structure> The electromagnetic wave resonant structure may be manufactured by any method, but may be manufactured by discharging a conductive ink to form a conductive portion and a non-conductive ink to form a non-conductive portion. In this case, it is preferable to form the conductive portion and / or the non-conductive portion by inkjet printing. It is also preferable to form the conductive portion by utilizing the coffee stain phenomenon.

[0038] For example, as shown in Fig. 3, an inkjet device is used that has a resin ink ejection head V1 and a metal ink ejection head V2 and a transport mechanism capable of printing on the entire substrate 10. This inkjet device has a heater H for drying the ink that has been ejected and landed on the substrate 10. From the viewpoint of drying efficiency, a stage heater is preferable as the heater H, but a hot air heater, an IR heater, a UV lamp, or a flash lamp may also be used.

[0039] A resin ink 21 containing a resin (e.g., a thermoplastic resin) that constitutes the resin region 20 is ejected from an ejection head V1 by an inkjet method (FIGS. 3, 4, and 5) onto a substrate 10 heated by a heater H. Also, a metal ink 31 containing metal particles that constitute the metal region 30 is ejected from an ejection head V2 by an inkjet method (FIGS. 3, 6, and 7).

[0040] In the first embodiment, the resin ink 21 is ejected from the ejection head V1 and made to land on the substrate 10. Next, the metal ink 31 is ejected from the ejection head V2 and patterned so that part of the metal ink 31 overlaps part of the resin ink 21 (FIGS. 7 and 8).

[0041] At this time, the metal ink 31 lands so as to overlap the incompletely cured resin ink 21, and the resin ink 21 penetrates between the metal particles (metal M1) in the metal ink 31, inhibiting conductivity, thereby forming a non-conductive mixed region 40 (a region where a portion 33 of the metal region 30 overlaps a portion 23 of the resin region 20).

[0042] In addition, the heated metal ink 31 has particles gather at the periphery due to the coffee stain phenomenon, resulting in SRR patterning with a mixed region 40 (FIGS. 9 and 10).

[0043] The heating temperatures of the resin ink 21 and the metal ink 31 are not particularly limited as long as they are temperatures at which the resin regions 20 and metal regions 30 are formed by the resin ink 21 and metal ink 31 used, but it is preferable that the resin regions 20 are formed at a temperature such that a portion of the resin ink 21 remains uncured when the metal ink 31 hardens to form the metal regions 30.

[0044] Furthermore, in order to completely cure the resin region 20 (to remove any uncured portions), it is further dried in an oven or the like. The drying temperature is arbitrary, but is, for example, 100°C to 300°C. Furthermore, the drying time is arbitrary, but is, for example, 10 minutes to 3 hours. When a photocurable (for example, UV-curable) resin ink is used, UV irradiation is performed. The irradiation time is determined arbitrarily depending on the type of resin ink.

[0045] In the first embodiment, the resin ink 21 discharged onto the substrate 10 is partially overlapped with a portion of the metal ink 31 in an uncured state. In this state, the metal ink 31 becomes a ring-shaped metal region 30 that has hardened due to the coffee stain phenomenon, and the resin ink becomes a resin region (cured portion) 20 consisting of a portion 22 that does not constitute the mixed region 40, a portion 33 of the metal region 30, and a portion 23 that constitutes the mixed region 40 (FIGS. 9 and 10).

[0046] In the electromagnetic wave resonant structure 100 of the first embodiment, the metal ink 31 is ejected after the resin ink 21 is ejected (FIGS. 4 to 10), but the timing of ejecting the resin ink 21 and the metal ink 31 is not limited to this. For example, the resin ink 21 may be ejected after the metal ink 31 is ejected, or the resin ink 21 and the metal ink 31 may be ejected simultaneously.

[0047] <<Second embodiment>> In the electromagnetic wave resonant structure 200 of the second embodiment, after the metal ink 31 is ejected, the resin ink 21 is ejected to produce an electromagnetic wave resonant structure in which a part 33 of the metal region 30 is incorporated into the resin region 20 (FIGS. 11 to 17).

[0048] In the second embodiment, metal ink 31 is ejected from ejection head V2 and landed on substrate 10. Next, resin ink 21 is ejected from ejection head V1 and patterned so that part of the resin ink 21 overlaps part of the metal ink 31. At this time, the resin ink 21 lands so as to overlap the uncured metal ink 31, so that the resin ink 21 gets into between metal particles M1 in the metal ink 31 and inhibits conductivity, forming a non-conductive mixed region 40 (a region where part 33 of the metal region 30 is incorporated into part 23 of the resin region 20).

[0049] Furthermore, when the metal ink 31 is heated, particles gather at the periphery due to the coffee stain phenomenon, resulting in an SRR pattern with a mixed region 40 (FIGS. 16 and 17).

[0050] In the second embodiment, the heating temperature of the resin ink 21 and the metal ink 31 is not particularly limited, but it is preferable that the temperature be such that the resin region 20 is formed such that a portion of the resin ink 21 remains uncured when the metal ink 31 hardens to form the metal region 30.

[0051] Also in the second embodiment, the resin region 20 is fully cured (to a state in which there is no uncured portion).

[0052] As described above, the electromagnetic wave resonant structure 100 of the first embodiment and the electromagnetic wave resonant structure 200 of the second embodiment have conductive parts and non-conductive parts, and the non-conductive parts have a region (mixed region 40) in which a part 33 (part of the conductive part) of the metal region 30 is mixed with a part 23 (insulator) of the resin region 20.

[0053] This allows the conductive parts of the electromagnetic wave resonant structures 100 and 200 to be applied to the ring parts (conductive parts) of the SRR, and the non-conductive parts of the electromagnetic wave resonant structures to be applied to the division parts (non-conductive parts) of the SRR. Therefore, the electromagnetic wave resonant structure of this embodiment can constitute a resonator element such as an SRR that absorbs terahertz waves, and is expected to be used as a metamaterial.

[0054] Furthermore, in the electromagnetic wave resonant structures 100 and 200, the mixed region 40 is a region where the metal region 30 (conductive portion) which is ring-shaped in a planar view and the resin region 20 (insulator) which is circular in a planar view overlap each other, making it possible to apply an electromagnetic wave resonant structure having a metal region 32 (conductive portion) and the mixed region 40 (non-conductive portion) to an SRR having a ring portion (conductive portion) and a division portion (non-conductive portion).

[0055] In addition, in the manufacturing method of the electromagnetic wave resonant structure of this embodiment, as described above, a conductive portion is formed by ejecting a conductive ink, and a non-conductive portion is formed by ejecting a non-conductive ink, so that a conductive portion and a non-conductive portion can be formed in the obtained electromagnetic wave resonant structure. In addition, in the non-conductive portion provided in the electromagnetic wave resonant structure, a region (mixed region 40) can be formed in which a part 23 (insulator) of the resin region 20 is mixed with a part 33 (part of the conductive portion) of the metal region 30.

[0056] As a result, in the obtained electromagnetic wave resonant structure, the conductive portion can be applied to the ring portion (conductive portion) of the SRR, and the non-conductive portion can be applied to the division portion (non-conductive portion) of the SRR. Therefore, according to the manufacturing method of the electromagnetic wave resonant structure of this embodiment, it is possible to manufacture a resonator element such as an SRR that absorbs terahertz waves.

[0057] In addition, in the manufacturing method of the electromagnetic wave resonant structure of the present embodiment, as described above, the conductive portion is formed by utilizing the coffee stain phenomenon, and thus it is possible to provide an electromagnetic wave resonant structure capable of absorbing electromagnetic waves with a structure utilizing the coffee stain phenomenon. Therefore, the obtained electromagnetic wave resonant structure can constitute a resonator element such as an SRR that absorbs terahertz waves, and is expected to be used as a metamaterial.

[0058] SRRs are generally fabricated using optical lithography, which requires large-scale equipment because it is performed in a vacuum, and also requires multiple expensive masks to change the diameter of the SRR ring or the distance between the segments.

[0059] In contrast, in the manufacturing method of the electromagnetic wave resonant structure of the present embodiment, the conductive and / or non-conductive parts are formed by inkjet printing as described above, so that the SRR structure can be fabricated at room temperature in the atmosphere, and no large-scale equipment is required. In addition, inkjet printing is maskless and does not require complicated processes, and SRRs designed on a computer can be printed on demand.

[0060] <<Third embodiment>> The electromagnetic wave resonant structure 300 of the third embodiment further includes a substrate 10 (FIGS. 18 to 20). On the substrate 10, the above-mentioned metal region 30, resin region 20, and mixed region 40 are formed.

[0061] The shape, structure, and size of the substrate 10 are not particularly limited and can be appropriately selected depending on the purpose. The material of the substrate 10 is not particularly limited and can be appropriately selected depending on the purpose, and examples of the material that can be used include glass substrates, ceramic substrates, plastic substrates, and film substrates.

[0062] The glass substrate is not particularly limited and can be appropriately selected depending on the purpose, and examples thereof include non-alkali glass, silica glass, etc. The plastic substrate or film substrate is not particularly limited and can be appropriately selected depending on the purpose, and examples thereof include polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc.

[0063] The surface of the substrate 10 on which the mixed region 40 (non-conductive portion) is formed is subjected to a hydrophilic treatment. The hydrophilic agent used in the hydrophilic treatment is not particularly limited, but examples thereof include silicate compounds, silica-based hydrophilizing agents, fluorine-based hydrophilic agents, titanium oxide-based photocatalysts, and polymers containing quaternary ammonium salts.

[0064] In this embodiment, the region 50 on the surface of the substrate 10 where the mixed region 40 (non-conductive portion) is formed is hydrophilically treated in advance, and the resin ink 21 is ejected (landed) so that the non-conductive portion (division portion NC of SRR) is located in this region 50 (hydrophilic portion), and the resin ink 21 can be patterned in the non-conductive portion by capillary action (FIGS. 19 and 20). This makes it easy to control the distance (spacing) of the non-conductive portion NC (division portion of SRR) in the third embodiment, that is, the capacitance C component.

[0065] <<Fourth embodiment>> The electromagnetic wave resonant structure 400 of the fourth embodiment further includes a covering layer 60 (FIG. 21). The covering layer 60 covers the above-mentioned electromagnetic wave resonant structure 100 or the electromagnetic wave resonant structure 200. In this embodiment, the entire electromagnetic wave resonant structure is covered with the covering layer 60, but the form of the covering layer 60 is not limited thereto, and only a part of the electromagnetic wave resonant structure may be covered with the covering layer 60.

[0066] The thickness of the covering layer 60 is not particularly limited and can be appropriately selected depending on the purpose.

[0067] The material of the coating layer 60 is not particularly limited, and examples thereof include urethane-based resins, acrylic-based resins, epoxy-based resins, polyimide-based resins, polyamide-based resins, polyimideamide-based resins, etc. These resins may be used alone or in combination of two or more.

[0068] When an electromagnetic wave resonant structure having an SRR structure formed on a substrate 10 warps due to a difference in linear expansion coefficient from the substrate 10, it is difficult to keep the distance between the divided parts of the SRR (component of capacitance C) constant. In contrast, in the electromagnetic wave resonant structure 400 of the fourth embodiment, the warping of the electromagnetic wave resonant structure can be suppressed by covering it with the covering layer 60, so that it is easy to control the distance between the divided parts of the SRR (component of capacitance C).

[0069] <<Fifth embodiment>> In the electromagnetic wave resonant structure 500 of the fifth embodiment, a plurality of electromagnetic wave resonant structures are randomly arranged (FIG. 22). In this embodiment, a plurality of electromagnetic wave resonant structures are molded by a molding resin 80 filled in a metal mold 70. After molding, the electromagnetic wave resonant structure 500 is released from the metal mold 70.

[0070] The electromagnetic wave resonant structure to be molded may be the above-mentioned electromagnetic wave resonant structure 100 or electromagnetic wave resonant structure 200, but from the viewpoint of product stability, it is preferable to use the electromagnetic wave resonant structure 400, which has reduced warping.

[0071] The material of the mold resin 80 is not particularly limited, and examples thereof include unsaturated polyester, epoxy resin, and silicone resin.

[0072] In the electromagnetic wave resonant structure 500 of the fifth embodiment, a plurality of electromagnetic wave resonant structures are randomly arranged in this manner, thereby making it possible to suppress the incidence angle dependency of the electromagnetic wave. Moreover, such suppression of the incidence angle dependency of the electromagnetic wave can be performed on demand.

[0073] <<Sixth embodiment>> An electromagnetic wave resonant structure 600 of the sixth embodiment has two mixed regions 40 (FIGS. 24 and 25). In this embodiment, one electromagnetic wave resonant structure 600 is provided with conductive parts CP1 and CP2 as two metal regions 32, and non-conductive parts NC1 and NC2 (capacitances C) as two mixed regions 40.

[0074] The electromagnetic wave resonator structure 600 is manufactured in the same manner as the electromagnetic wave resonator structures 100 and 200 (FIGS. 4 to 17), except that two drops of resin ink 21 are ejected and landed on the substrate 10 for one drop of metal ink 31.

[0075] In the electromagnetic wave resonant structure 600 of the sixth embodiment, by having two mixed regions 40 (non-conductive parts) in this way, it is possible to improve the arrangement efficiency when arranging a plurality of electromagnetic wave resonant structures on the same plane. In addition, since two capacitances C can be provided in one electromagnetic wave resonant structure 600, it is possible to deal with frequency deviations.

[0076] <<Seventh embodiment>> In an electromagnetic wave resonant structure 700 of the seventh embodiment, a plurality of electromagnetic wave resonant structures 100 are arranged on the same surface (FIG. 26). In the seventh embodiment, a plurality of electromagnetic wave resonant structures 100 are regularly arranged on a substrate 10 at equal intervals in the front-rear and left-right directions, but may be irregularly arranged.

[0077] In the electromagnetic wave resonant structure 700 of the seventh embodiment, the amount of electromagnetic waves absorbed can be increased by arranging a plurality of electromagnetic wave resonant structures 100 on the same surface. In addition, by regularly arranging a plurality of electromagnetic wave resonant structures 100 on the same surface, electromagnetic waves in a periodic pattern can be absorbed.

[0078] <<Eighth embodiment>> In an electromagnetic wave resonant structure 800 of the eighth embodiment, a plurality of electromagnetic wave resonant structures 100 are arranged in a vertical direction (FIG. 27). In the eighth embodiment, a plurality of electromagnetic wave resonant structures 700 are further stacked on top of the plurality of electromagnetic wave resonant structures 700 in the seventh embodiment via an isolation layer 90. Note that, in the eighth embodiment, a plurality of electromagnetic wave resonant structures 100 are regularly arranged at equal intervals in the vertical, front-rear and left-right directions on the substrate 10, but they may be irregularly arranged.

[0079] The thickness of the isolation layer 90 is not particularly limited, and may be any thickness that does not allow the electromagnetic wave resonant structures 700 to be connected to each other above and below.

[0080] The material of the isolation layer 90 is not particularly limited, and examples thereof include urethane-based resins, acrylic-based resins, epoxy-based resins, polyimide-based resins, polyamide-based resins, polyimideamide-based resins, etc. These resins may be used alone or in combination of two or more kinds.

[0081] In the electromagnetic wave resonant structure 800 of the eighth embodiment, the amount of electromagnetic waves absorbed can be increased by arranging a plurality of electromagnetic wave resonant structures 100 in a vertical direction. Also, by arranging a plurality of electromagnetic wave resonant structures 100 regularly on the same plane, electromagnetic waves in a periodic pattern can be absorbed.

[0082] <Electronic components> In the electromagnetic wave resonant structures 100, 200, 300, 400, 500, 600, 700, and 800, as described above, the metal region 32 (conductive portion) can form the reactance L, and the mixed region 40 (non-conductive portion) can form the capacitance C (capacitor) (FIGS. 1, 9, and 17). Therefore, these electromagnetic wave resonant structures can be applied to electronic components such as SRRs.

[0083] <Conductive structure> 28 shows a conductive structure 900 of this embodiment. The conductive structure 900 has a conductive portion and a non-conductive portion on a circuit board 10. The circuit board 10 is not particularly limited, and for example, a printed circuit board is used.

[0084] The conductive portion is a region made of a conductor, similar to the above-mentioned electromagnetic wave resonant structure, and a metal is preferably used. In this embodiment, for example, the above-mentioned conductive ink (metal ink 31) is discharged onto the circuit board 10, and the conductive ink is cured to form a metal region 30 containing a metal M as an example of the conductive portion (FIGS. 28 and 29).

[0085] The form of the conductive portion is not particularly limited. In this embodiment, for example, the conductive portion (metal region 30) is formed in stripes on the circuit board 10 at intervals of a pitch d1.

[0086] The non-conductive portion is a region that does not exhibit conductivity, similar to the above-mentioned electromagnetic wave resonant structure, and is preferably made of a resin. In this embodiment, for example, the above-mentioned non-conductive ink (resin ink 21) is discharged onto the circuit board 10, and the non-conductive ink is cured to form a resin region 20 as an example of the non-conductive portion (FIGS. 28 and 29).

[0087] The form of the non-conductive portion is not particularly limited. In this embodiment, for example, the non-conductive portion (resin region 20) is formed in stripes at intervals of pitch d2 on the circuit board 10. At this time, the non-conductive portion (resin region 20) is formed so that a part 33 of the conductive portion (metal region 30) overlaps a part 23 of the non-conductive portion (resin region 20) (FIG. 29).

[0088] The non-conductive portion has a region (mixed region 40) in which an insulator is mixed with a part of a conductive portion. Specifically, similar to the above-described electromagnetic wave resonant structure, the non-conductive portion (resin region 20) has a region (mixed region 40) in which a part 23 (insulator) of the resin region 20 is mixed with a part 33 of the conductive portion (metal region 30) (FIG. 29).

[0089] In addition, the form of the mixed region in the conductive structure is not limited to the form of mixed region 40 of conductive structure 900 shown in Figure 29, and the mixed region may be formed so that a portion 23 of the non-conductive portion (resin region 20) overlaps a portion 33 of the conductive portion (metal region 30).

[0090] The conductive structure 900 of this embodiment has a conductive portion and a non-conductive portion on the circuit board 10, and the non-conductive portion has a region (mixed region 40) in which a part 23 (insulator) of the resin region 20 is mixed with a part 33 (part of the conductive portion) of the metal region 30, making it applicable to various uses. For example, applications to electronic circuits and electronic devices manufactured by printed electronics, storage batteries and capacitors manufactured by inkjet printing technology, etc. are expected.

[0091] The above disclosed embodiments include, for example, the following aspects. (Appendix 1) An electromagnetic wave resonant structure comprising a conductive portion and a non-conductive portion, the non-conductive portion having a region in which an insulator is mixed with a part of the conductive portion. (Appendix 2) 2. The electromagnetic wave resonant structure according to claim 1, wherein the conductive portion is ring-shaped in a plan view. (Appendix 3) 3. The electromagnetic wave resonant structure according to claim 1, wherein the conductive portion is a metal. (Appendix 4) 4. The electromagnetic wave resonant structure according to claim 1, wherein the insulator is a resin. (Appendix 5) 5. The electromagnetic wave resonant structure according to claim 1, wherein the non-conductive portion is a region where the conductive portion, which is ring-shaped in a planar view, and an insulator, which is ring-shaped in a planar view, overlap each other. (Appendix 6) An electromagnetic wave resonant structure described in any one of Appendix 1 to 5, comprising a substrate on which the conductive portion and the non-conductive portion are formed, and the surface of the substrate on which the non-conductive portion is formed is hydrophilically treated. (Appendix 7) 7. The electromagnetic wave resonant structure according to claim 1, further comprising a coating layer that covers the electromagnetic wave resonant structure. (Appendix 8) 8. The electromagnetic wave resonant structure according to claim 1, wherein a plurality of the electromagnetic wave resonant structures are randomly arranged. (Appendix 9) 9. An electromagnetic wave resonant structure according to any one of claims 1 to 8, comprising two of the non-conductive parts. (Appendix 10) 10. The electromagnetic wave resonant structure according to claim 1, wherein a plurality of the electromagnetic wave resonant structures are arranged on the same plane. (Appendix 11) 11. The electromagnetic wave resonant structure according to claim 1, wherein a plurality of the electromagnetic wave resonant structures are arranged in a vertical direction. (Appendix 12) A method for manufacturing an electromagnetic wave resonant structure as described in any one of Appendix 1 to 11, comprising ejecting a conductive ink to form the conductive portion and ejecting a non-conductive ink to form the non-conductive portion. (Appendix 13) 13. A method for manufacturing an electromagnetic wave resonant structure according to claim 12, wherein the conductive portion is formed by utilizing the coffee stain phenomenon. (Appendix 14) A method for manufacturing an electromagnetic wave resonant structure according to claim 13, wherein the conductive portion and / or the non-conductive portion are formed by inkjet. (Appendix 15) 12. An electronic component having an electromagnetic wave resonance structure according to any one of claims 1 to 11. (Appendix 16) A circuit board having a conductive portion and a non-conductive portion, A conductive structure, wherein the non-conductive portion has a region in which an insulator is mixed in part of the conductive portion.

[0092] Although an embodiment of the present invention has been described above, the present invention is not limited to a specific embodiment, and various modifications and changes are possible within the scope of the invention described in the claims. [Explanation of symbols]

[0093] 100, 200, 300, 400, 500, 600, 700, 800 Electromagnetic wave resonant structure SRR split ring resonator CP ring part (conductive part) NC split part (non-conductive part) L reactance C Capacitance IM incident magnetic field RM Rebelling magnetic field 10 Substrate 20 Resin area 21 Resin ink (uncured area) 22 Hardened part 23 Part of the resin area (mixed area) 30 Metal area 31 Metallic Ink 32 Metallic regions (excluding mixed regions) 33 Part of the metal area (mixed area) M1, M2 metal 40 Mixed area 50 area (hydrophilic part) 60 Covering layer 70 Mold 80 Molding resin 90 isolation layer V1 Resin ink ejection head V2 Metal Ink Ejection Head H Heater (Stage Heater) [Prior art documents] [Patent documents]

[0094] [Patent Document 1] Patent No. 6331457

Claims

1. It has a conductive portion and a non-conductive portion, The non-conductive portion has a region in which an insulator is mixed into a part of the conductive portion.

2. The electromagnetic wave resonant structure according to claim 1 , wherein the conductive portion is ring-shaped in a plan view.

3. The electromagnetic wave resonant structure according to claim 1 , wherein the conductive portion is a metal.

4. The electromagnetic wave resonant structure according to claim 1 , wherein the insulator is a resin.

5. The electromagnetic wave resonant structure according to claim 1 , wherein the non-conductive portion is a region where the conductive portion, which is ring-shaped in a plan view, and an insulator, which is ring-shaped in a plan view, overlap each other.

6. a substrate on which the conductive portion and the non-conductive portion are formed, 2. The electromagnetic wave resonant structure according to claim 1, wherein the surface of the substrate on which the non-conductive portion is formed is subjected to a hydrophilic treatment.

7. A coating layer that covers the electromagnetic wave resonant structure.

2. The electromagnetic wave resonant structure according to claim 1.

8. The electromagnetic wave resonant structure of claim 1 , wherein a plurality of the electromagnetic wave resonant structures are randomly arranged.

9. The electromagnetic wave resonant structure of claim 1 having two of said non-conductive portions.

10. The electromagnetic wave resonant structure according to claim 1 , wherein a plurality of the electromagnetic wave resonant structures are arranged on the same plane.

11. The electromagnetic wave resonant structure of claim 1 , wherein a plurality of the electromagnetic wave resonant structures are arranged in a vertical direction.

12. A method for manufacturing an electromagnetic wave resonant structure according to any one of claims 1 to 11, comprising the steps of: A conductive ink is ejected to form the conductive portion; A method for manufacturing an electromagnetic wave resonator structure, comprising ejecting a non-conductive ink to form the non-conductive portion.

13. The method for manufacturing an electromagnetic wave resonant structure according to claim 12, wherein the conductive portion is formed by utilizing a coffee stain phenomenon.

14. The method for manufacturing an electromagnetic wave resonant structure according to claim 13 , wherein the conductive portion and / or the non-conductive portion is formed by inkjet.

15. An electronic component comprising the electromagnetic wave resonance structure according to claim 1 .

16. A circuit board having a conductive portion and a non-conductive portion, A conductive structure, wherein the non-conductive portion has a region in which an insulator is mixed in part of the conductive portion.

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