Measuring method of center of rotation of stage

Abstract

To accurately measure the position of the center of rotation of a stage used in a 3D mounting device.SOLUTION: A measuring method of the center of rotation of a stage, which is used in a three-dimensional mounting device and can rotate while supporting a mounting substrate, includes rotating the stage supporting a fixture substrate through each of a plurality of angles, detecting the position of a portion of the surface of the fixture substrate at each of the plurality of angles, and calculating the position of the center of rotation of the stage relative to the origin of a machine coordinate system defined in the three-dimensional mounting device on the basis of the detection results of the position of the portion.SELECTED DRAWING: Figure 11

Description

[Technical field]

[0001] The technology disclosed in this specification relates to a method for measuring the center of rotation of a stage used in a three-dimensional mounting device. [Background technology]

[0002] 2. Description of the Related Art In the technical field relating to mounting apparatuses, a three-dimensional mounting apparatus that mounts components on a three-dimensional substrate, as disclosed in Patent Document 1, is known. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2018 / 207313 Summary of the Invention [Problem to be solved by the invention]

[0004] The three-dimensional mounting device has a swingable stage (swing unit). The three-dimensional mounting device mounts components by tilting the three-dimensional substrate (mounting substrate) on the stage so that the mounting position of the components on the surface of the substrate is kept horizontal, and the mounting head is moved to an XYZ position that takes into account the rotation angle of the stage. For this reason, the XYZ movement amount of the mounting position is calculated from the rotation angle of the stage and added to the XYZ position of the mounting position for correction. However, if the position of the center of rotation of the stage is calculated as the design position, there is a possibility that the XYZ position will contain errors and the mounting position cannot be determined accurately. Therefore, a means is required to accurately determine the position of the center of rotation of the stage.

[0005] The technology disclosed in this specification aims to accurately measure the position of the center of rotation of a stage used in a three-dimensional mounting device. [Means for solving the problem]

[0006] According to the technology disclosed in this specification, there is provided a method for measuring the rotation center of a stage used in a three-dimensional mounting device and capable of rotating while supporting a mounting substrate, the method including: rotating the stage supporting the fixture substrate through each of a plurality of angles; detecting the position of a portion of the surface of the fixture substrate at each of the plurality of angles; and calculating the position of the rotation center of the stage relative to the origin of a machine coordinate system defined in the three-dimensional mounting device based on the detection results of the position of the portion. Effect of the Invention

[0007] According to the technology disclosed in this specification, the position of the center of rotation of the stage in a three-dimensional mounting device can be accurately determined. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing a substrate and a component according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view showing a pallet for holding substrates according to the first embodiment. [Diagram 3] FIG. 3 is an exploded perspective view showing the substrate and pallet according to the first embodiment. [Figure 4] FIG. 4 is a diagram illustrating a production system for electronic devices according to the first embodiment. [Diagram 5] FIG. 5 is a plan view illustrating the mounting apparatus according to the first embodiment. [Figure 6] FIG. 6 is a perspective view showing a pallet and a stage according to the first embodiment. [Figure 7] FIG. 7 is an exploded perspective view showing a pallet and a stage according to the first embodiment. [Figure 8] FIG. 8 is a diagram illustrating a schematic diagram of the mounting head according to the first embodiment. [Figure 9] FIG. 9 is a diagram for explaining board data and NC data according to the first embodiment. [Figure 10]FIG. 10 is a diagram for explaining the board data and the NC data according to the first embodiment. [Figure 11] FIG. 11 is a diagram for explaining a method for measuring the rotation center of a stage according to the first embodiment. [Figure 12] FIG. 12 is a block diagram showing a processing device 16 used to measure the center of rotation of the stage according to the first embodiment. [Figure 13] FIG. 13 is a diagram showing the operation of the mounting device when measuring the center of rotation of the stage according to the first embodiment. [Figure 14] FIG. 14 is a diagram showing the operation of the mounting device when measuring the center of rotation of the stage according to the first embodiment. [Figure 15] FIG. 15 is a diagram showing the operation of the mounting device when measuring the center of rotation of the stage according to the first embodiment. [Figure 16] FIG. 16 is a diagram showing the operation of the mounting device when measuring the center of rotation of the stage according to the first embodiment. [Figure 17] FIG. 17 is a diagram showing the operation of the mounting device when measuring the center of rotation of the stage according to the first embodiment. [Figure 18] FIG. 18 is a diagram showing the operation of the mounting device when measuring the center of rotation of the stage according to the first embodiment. [Figure 19] FIG. 19 is a diagram for explaining a method of measuring the rotation center of a stage according to the second embodiment. [Figure 20] FIG. 20 is a diagram showing the operation of the mounting device when measuring the center of rotation of the stage according to the second embodiment. [Figure 21] FIG. 21 is a diagram showing the operation of the mounting device when measuring the center of rotation of the stage according to the second embodiment. [Figure 22] FIG. 22 is a diagram showing coordinates of a first portion and coordinates of a second portion according to the second embodiment. [Figure 23] FIG. 23 is a diagram for explaining a method of measuring the rotation center of a stage according to the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiment will be described with reference to the drawings. In the embodiment, an XYZ orthogonal coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X axis of a predetermined surface is defined as the X axis direction. The direction parallel to the Y axis of a predetermined surface perpendicular to the X axis is defined as the Y axis direction. The direction parallel to the Z axis perpendicular to the predetermined surface is defined as the Z axis direction. The rotation direction or tilt direction centered on the X axis direction is defined as the θX direction. The rotation direction or tilt direction centered on the Y axis direction is defined as the θY direction. The rotation direction or tilt direction centered on the Z axis direction is defined as the θZ direction. In the embodiment, the predetermined surface and the horizontal plane are parallel. The Z axis is parallel to the vertical axis, and the Z axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. The predetermined surface may be inclined with respect to the horizontal plane. In the embodiment, the predetermined surface including the X axis and the Y axis is appropriately referred to as the XY plane.

[0010] [First embodiment] A first embodiment will be described.

[0011] <Substrate> FIG. 1 is a perspective view showing a substrate 1 and a component 2 according to an embodiment. Substrate 1 is a mounting substrate on which component 2 is mounted. In the embodiment, substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of substrate 1 includes a curved surface. At least a portion of the surface of substrate 1 is curved. The surface of substrate 1 may include corners. A protrusion may be provided on the surface of substrate 1.

[0012] An electric circuit is provided on the surface of the substrate 1. In an embodiment, the substrate 1 is formed by an in-mold molding technique. The substrate 1 includes a base material 1A having a curved surface and a film 1B bonded to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes an electric circuit. The surface of the substrate 1 includes the surface of the film 1B.

[0013] The component 2 includes an electronic component. The component 2 may be a lead-type electronic component having leads protruding from a body. The component 2 may be a chip-type electronic component having no leads. By mounting the component 2 on the surface of the substrate 1, an electronic device is manufactured.

[0014] <Palette> Fig. 2 is a perspective view showing a pallet 3 that holds a substrate 1 according to an embodiment. Fig. 3 is an exploded perspective view showing a substrate 1 and a pallet 3 according to an embodiment. The pallet 3 holds the substrate 1. In the embodiment, the substrate 1 is handled while being held by the pallet 3. The pallet 3 has a support member 4 that supports the substrate 1, and a clamp mechanism 5 that fixes the substrate 1.

[0015] The support member 4 includes a base portion 4A that supports the substrate 1 from the -Z side, guard portions 4B provided on each of the +Y side and -Y side of the base portion 4A, and a plurality of pin portions 4C that support the substrate 1 from each of the +Y side and -Y side.

[0016] The base portion 4A is in the form of a plate having a plurality of openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the upper and lower surfaces of the base portion 4A.

[0017] The guard portion 4B is long in the X-axis direction. A pair of guard portions 4B are provided. The pair of guard portions 4B are spaced apart from each other in the Y-axis direction. One guard portion 4B protrudes to the +Z side from the end portion on the +Y side of the upper surface of the base portion 4A. The other guard portion 4B protrudes to the +Z side from the end portion on the -Y side of the upper surface of the base portion 4A.

[0018] Each of the multiple pin portions 4C protrudes from the top surface of the base portion 4A to the +Z side. Some of the pin portions 4C are arranged on the +Y side of the center of the base portion 4A. Some of the pin portions 4C are arranged on the -Y side of the center of the base portion 4A. The multiple pin portions 4C arranged on the +Y side of the center of the base portion 4A support the end of the substrate 1 on the +Y side. The multiple pin portions 4C arranged on the -Y side of the center of the base portion 4A support the end of the substrate 1 on the -Y side.

[0019] The clamp mechanism 5 is provided on the support member 4. The clamp mechanism 5 fixes the substrate 1 to the support member 4. The clamp mechanism 5 includes a pair of support parts 5A that support an end part of the substrate 1 on the -X side, and a movable part 5B that supports an end part of the substrate 1 on the +X side. The movable part 5B is movable in the X-axis direction on the upper surface of the base part 4A. With the substrate 1 disposed between the support parts 5A and the movable part 5B, the movable part 5B moves in the -X direction, whereby the substrate 1 is sandwiched between the support parts 5A and the movable part 5B. The substrate 1 is fixed to the pallet 3 by being sandwiched between the support parts 5A and the movable part 5B.

[0020] <Production System> Fig. 4 is a diagram illustrating a schematic diagram of an electronic device production system 10 according to an embodiment. As illustrated in Fig. 4, the production system 10 includes a mounting device 12, a preheating device 13, and a laser irradiation device 14. The mounting device 12, the preheating device 13, and the laser irradiation device 14 constitute a production line for electronic devices.

[0021] The mounting device 12 mounts the components 2 on the board 1. At least one mounting device 12 is provided in the production line. Note that a plurality of mounting devices 12 may be provided.

[0022] 5 is a plan view showing a schematic diagram of the mounting apparatus 12 according to the embodiment. The mounting apparatus 12 includes a base member 18, a transport device 19, a stage 20, a stage moving device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a board camera 25, a height sensor 26, a head moving device 27, and a chamber 29.

[0023] The base member 18 supports the transport device 19 , the stage 20 , the stage moving device 21 , the component supply device 22 , the mounting head 24 , and the head moving device 27 .

[0024] The transport device 19 transports the pallet 3 holding the substrate 1 in the X-axis direction. The transport device 19 transports the pallet 3 to a processing position of the mounting device 12. The processing position is defined by a transport path of the transport device 19.

[0025] The conveying device 19 includes a conveying belt 19A that conveys the pallet 3 in the X-axis direction, and a guide member 19B that guides the pallet 3.

[0026] Guide member 19B is long in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are spaced apart from each other in the Y-axis direction. One guide member 19B is disposed on the +Y side of pallet 3. The other guide member 19B is disposed on the -Y side of pallet 3.

[0027] The conveyor belt 19A is circular. A pair of conveyor belts 19A are provided. The conveyor belts 19A are supported by a guide member 19B via a driving pulley and a driven pulley. The conveyor belts 19A are hung on the driving pulley and the driven pulley. One of the conveyor belts 19A is supported by one of the guide members 19B. The other conveyor belt 19A is supported by the other guide member 19B.

[0028] Of the pair of conveyor belts 19A, the conveyor belt 19A arranged on the +Y side supports the +Y side end of the underside of pallet 3. The conveyor belt 19A arranged on the -Y side supports the -Y side end of the underside of pallet 3. The pallet 3 is conveyed in the X-axis direction by the drive pulley rotating due to a drive motor (not shown).

[0029] An actuator (not shown) allows one guide member 19B to move in the Y-axis direction relative to the other guide member 19B. When one guide member 19B and the other guide member 19B move away from each other in the Y-axis direction, support of the pallet 3 by the conveyor belt 19A is released.

[0030] Fig. 6 is a perspective view showing the pallet 3 and the stage 20 according to the embodiment. Fig. 7 is an exploded perspective view showing the pallet 3 and the stage 20 according to the embodiment.

[0031] The stage 20 supports the substrate 1 via the pallet 3. The stage 20 supports the pallet 3 from the -Z side that has been transported to the processing position. Two positioning members 20A are provided on the upper surface of the stage 20. The positioning members 20A are inserted into holes 4D of the pallet 3. The positioning members 20A are inserted into the holes 4D from the -Z side of the pallet 3, thereby positioning the stage 20 and the pallet 3. A hook is provided on the upper end of the positioning member 20A. The hook is hung on the pallet 3. The hook includes a ball that moves by air pressure. After the positioning member 20A is inserted into the hole 4D from the -Z side of the pallet 3, the ball is hung on the pallet 3, thereby fixing the stage 20 and the pallet 3.

[0032] The stage moving device 21 moves the stage 20. In the embodiment, the stage moving device 21 moves the stage 20 in each of the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The stage moving device 21 includes a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, a Z-axis motor that generates power to move the stage 20 in the Z-axis direction, a θX motor that generates power to rotate the stage 20 in the θX direction, and a θY motor that generates power to rotate the stage 20 in the θY direction.

[0033] After the pallet 3 is transported to the processing position by the transport device 19, the guide member 19B on the +Y side moves in the +Y direction away from the other guide member 19B, and the stage moving device 21 moves the stage 20 in the +Z direction. The support of the pallet 3 by the transport belt 19A is released by the guide member 19B on the +Y side moving in the Y-axis direction away from the other guide member 19B. The support of the pallet 3 by the transport belt 19A is released and the stage 20 moves in the +Z direction, so that the pallet 3 is transferred from the transport device 19 to the stage 20. With the pallet 3 supported by the stage 20, the stage moving device 21 moves the stage 20 in the +Y direction so that it is located at the center of the two guide members 19B, making it possible to move the stage 20 in each of the Z-axis direction, the θX direction, and the θY direction.

[0034] When transferring the pallet 3 from the stage 20 to the transport device 19, the stage 20 moves in the -Y direction until one side of the pallet 3 comes onto the transport belt 19A, and the guide member 19B on the +Y side moves to the -Y side until the other side of the pallet 3 comes onto the transport belt 19A. After the hook provided at the upper end of the positioning member 20A is released from its fastening, the stage 20 moves in the -Z direction by the stage movement device 21. As a result, support of the pallet 3 by the stage 20 is released, and the pallet 3 is supported by the transport belt 19A.

[0035] The component supplying device 22 supplies the components 2. The component supplying device 22 includes a plurality of tape feeders. The tape feeders hold a plurality of components 2. The component supplying device 22 supplies at least one component 2 of the plurality of components 2 to a supply position. The component supplying device 22 is disposed on the -Y side of the conveying device 19. Note that the component supplying device 22 may be disposed on both the +Y side and the -Y side of the conveying device 19.

[0036] The mounting head 24 mounts the components 2 on the board 1. The mounting head 24 supports a plurality of nozzles 23. The mounting head 24 holds the components 2 supplied from the component supply device 22 with the nozzles 23 and mounts them on the board 1. The mounting head 24 is movable between a supply position where the components 2 are supplied from the component supply device 22 and a processing position where the board 1 is placed. The mounting head 24 holds the components 2 supplied to the supply position with the nozzles 23, moves to the processing position, and then mounts the components 2 on the surface of the board 1 placed at the processing position.

[0037] The head moving device 27 moves the mounting head 24. In the embodiment, the head moving device 27 moves the mounting head 24 in each of the X-axis direction and the Y-axis direction. The head moving device 27 has an X-axis moving device 27X that moves the mounting head 24 in the X-axis direction, and a Y-axis moving device 27Y that moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. The mounting head 24 moves in the X-axis direction by the operation of the X-axis moving device 27X. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. The mounting head 24 moves in the Y-axis direction by the operation of the Y-axis moving device 27Y.

[0038] FIG. 8 is a schematic diagram of a mounting head 24 according to an embodiment. As shown in FIG. 8, the mounting head 24 has a plurality of nozzles 23. The nozzles 23 detachably hold the component 2. The nozzles 23 are suction nozzles that suction and hold the component 2. An opening is provided at the lower end of the nozzle 23. The opening of the nozzle 23 is connected to a vacuum system. With the lower end of the nozzle 23 and the component 2 in contact with each other, a suction operation is performed from the opening provided at the lower end of the nozzle 23, so that the component 2 is suctioned and held at the lower end of the nozzle 23. The suction operation from the opening is released, so that the component 2 is released from the nozzle 23. The nozzle 23 may be a gripper nozzle that pinches and holds the component 2.

[0039] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in each of the Z-axis direction and the θZ direction. The nozzle moving device 28 is supported by the mounting head 24. The nozzle 23 is connected to a lower end of the shaft 23A. A plurality of shafts 23A are provided. The plurality of nozzles 23 are connected to each of the plurality of shafts 23A. A plurality of nozzle moving devices 28 are provided. The plurality of nozzle moving devices 28 are connected to each of the plurality of shafts 23A. The nozzle 23 is supported by the mounting head 24 via the shaft 23A and the nozzle moving device 28. The nozzle moving device 28 moves the shaft 23A in the Z-axis direction and the θZ direction to move the nozzle 23.

[0040] Nozzle 23 can be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction by head moving device 27 and nozzle moving device 28. By moving nozzle 23, component 2 held by nozzle 23 can also be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction.

[0041] The board camera 25 images the board 1. In the embodiment, the board camera 25 images the surface of the board 1 from the +Z side of the board 1. The board camera 25 is provided on the mounting head 24. The board camera 25 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. The board camera 25 can image an alignment mark provided on the surface of the board 1.

[0042] The height sensor 26 detects a height indicating the position of the surface of the substrate 1 in the Z-axis direction. The height sensor 26 is provided on the mounting head 24. The height sensor 26 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. In the embodiment, the height sensor 26 is a laser positioning sensor. The height sensor 26 can detect the distance from the mounting head 24 to the substrate 1 by irradiating the surface of the substrate 1 with laser light from the +Z side of the substrate 1 and receiving the laser light reflected by the surface of the substrate 1. By detecting the distance from the mounting head 24 to the substrate 1, the height of the surface of the substrate 1 is detected.

[0043] The chamber 29 has an internal space in which the base member 18, the transport device 19, the stage 20, the stage moving device 21, the component supply device 22, the mounting head 24, the head moving device 27, and the nozzle moving device 28 are housed.

[0044] In the embodiment, the mounting device 12 has a dispenser 34 that applies cream solder to the board 1. The dispenser 34 moves in each of the X-axis direction, the Y-axis direction, and the Z-axis direction on the +Z side of the transport device 19. The dispenser 34 and the mounting head 24 are capable of moving separately. After the cream solder is applied to the surface of the board 1 by the dispenser 34, the components 2 are mounted on the board 1 by the mounting head 24. The board 1 on which the components 2 have been mounted by the mounting device 12 is transported to the preheating device 13 while being fixed to the pallet 3.

[0045] The preheating device 13 reduces the liquid component of the cream solder applied to the board 1. The cream solder includes flux and metallic solder balls dispersed in the flux. The preheating device 13 reduces the liquid component of the cream solder by activating the flux and vaporizing at least a part of the liquid component.

[0046] The preheating device 13 includes a base member 35, a transport device 36 for transporting the pallet 3, a heater 37 for heating the substrate 1, and a chamber 38.

[0047] The base member 35 supports a conveying device 36. The conveying device 36 conveys the pallet 3 supporting the substrate 1 in the X-axis direction. The conveying device 36 has a conveyor belt 36A that conveys the pallet 3, and a guide member 36B that guides the pallet 3.

[0048] The heater 37 heats the substrate 1 so that at least a part of the liquid component of the flux of the cream solder is vaporized.

[0049] The chamber 38 has an internal space in which the base member 35, the transport device 36, and the heater 37 are respectively housed.

[0050] Preheating device 13 heats substrate 1 held on pallet 3 so as to reduce the liquid component of the cream solder. Preheating device 13 heats substrate 1 to a temperature lower than the melting point of the cream solder. Preheating device 13 heats substrate 1, for example, at a temperature of 80°C or higher and 100°C or lower for 10 minutes. Substrate 1 preheated by preheating device 13 is transported to laser irradiation device 14 while being fixed to pallet 3.

[0051] The laser irradiation device 14 irradiates the cream solder with a laser beam so as to melt the cream solder. The laser irradiation device 14 includes a base member 39, a transport device 40 that transports the pallet 3, a stage 41 that supports the pallet 3, a stage moving device 42 that moves the stage 41, a laser head 43 that emits a laser beam, and a chamber 44.

[0052] The base member 39 supports a transport device 40 , a stage 41 , a stage moving device 42 , and a laser head 43 .

[0053] The transport device 40 transports the pallet 3 supporting the substrate 1 in the X-axis direction. The transport device 40 has a transport belt 40A that transports the pallet 3, and a guide member 40B that guides the pallet 3. The structure and function of the transport device 40 are substantially the same as the structure and function of the transport device 19.

[0054] The stage 41 supports the pallet 3 from the -Z side. The stage movement device 42 moves the stage 41 in the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The structure and function of the stage 41 are substantially the same as the structure and function of the stage 20.

[0055] The laser head 43 irradiates the cream solder with a laser beam to melt the cream solder. The laser head 43 moves on the +Z side of the conveying device 40 in each of the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0056] The chamber 44 has an internal space in which the base member 39, the transport device 40, the stage 41, the stage moving device 42, and the laser head 43 are housed.

[0057] In the laser irradiation device 14, the cream solder is irradiated with the laser light emitted from the laser head 43. The cream solder is heated by the laser light and melts. The melted cream solder is cooled, and the component 2 is soldered to the board 1. In the embodiment, the cream solder is irradiated with the laser light after the liquid component of the cream solder is reduced in the preheating device 13. Since the cream solder is irradiated with the laser light in a state in which the liquid component of the cream solder has been reduced, solder balls due to bumping of the cream solder are suppressed.

[0058] <Board data and NC data> 9 and 10 are diagrams for explaining board data and NC data according to the embodiment. The board data includes the mounting position Pp (xp, yp, zp) of the component 2 on the surface of the board 1, the normal vector (u, v, w) of the surface of the board 1 at the mounting position Pp, surface data of the surface of the board 1, and texture data of the circuit pattern on the surface data. The board data is expressed in a board coordinate system (Xp, Yp, Zp) with the board coordinate reference point Pr fixed to the board 1 or the pallet 3 as the origin. In addition to the above, the board data includes the part number to be mounted, the land position to apply the cream solder, the preheating temperature, the preheating time, the laser power, the laser irradiation time, etc., and is used by each device on the production line.

[0059] The stage 20 is used in the mounting device 12. The mounting device 12 is a three-dimensional mounting device. The stage 20 is rotatable while supporting the substrate 1. The stage 20 can rotate in the θX direction around the rotation axis Xt. The stage 20 can rotate in the θY direction around the rotation axis Yt. The stage 20 supports the substrate 1 via a pallet 3. When the stage 20 rotates in the θX direction and the θY direction around the rotation axis Xt and the rotation axis Yt to tilt the substrate 1, the mounting position Pp rotates around the rotation axis Xt and the rotation axis Yt. The rotation axis Xt and the rotation axis Yt are perpendicular to each other.

[0060] The machine coordinate system (Xm, Ym, Zm) is defined in the mounting device 12. The machine coordinate system (Xm, Ym, Zm) is a coordinate system fixed to the mounting device 12, and serves as a reference when the mounting head 24 moves. The origin of the machine coordinate system may be anywhere in the mounting device 12. When the stage 20 rotates in the θX direction and the θY direction around the rotation axis Xt and the rotation axis Yt and the board 1 is tilted, the mounting position Pp rotates around the rotation axis Xt and the rotation axis Yt. The mounting position Pm (xm, ym, zm) in the machine coordinate system of the rotated mounting position Pp is calculated, and the board camera 25, the height sensor 26, and the nozzle 23 of the mounting head 24 move using this mounting position Pm (xm, ym, zm). The mounting position Pm (xm, ym, zm) in the machine coordinate system and the rotation angle of the stage 20 are stored as NC data, and are used as command positions for the drive motor when the mounting device 12 is operated. Similarly, NC data is created and used by each device on the production line other than the mounting device 12. Since the NC data is calculated based on mechanical parameters such as the positions of the rotation axis Xt and rotation axis Yt of the stage 20, the NC data for each device will be different.

[0061] It is necessary to find the center of rotation of the stage 20 in the machine coordinate system (Xm, Ym, Zm). The position of the center of rotation of the stage 20 is the position of the rotation axis Xt and the position of the rotation axis Yt. If the position of the center of rotation of the stage 20 is calculated as the design position, there is a possibility that an accurate mounting position cannot be determined due to errors in the XYZ positions.

[0062] In the embodiment, the position of the rotation center (rotation axis Xt, Yt) of the stage 20 relative to the origin of the machine coordinate system (Xm, Ym, Zm) is accurately determined by measurement. In the following description, the position in the Xm axis direction of the machine coordinate system will be appropriately referred to as the X position, the position in the Ym axis direction will be appropriately referred to as the Y position, and the position in the Zm axis direction will be appropriately referred to as the Z position.

[0063] <How to measure the stage rotation center> FIG. 11 is a diagram for explaining a method for measuring the rotation center of the stage 20 according to the embodiment. FIG. 11 shows a method for measuring the position of the rotation axis Yt of the stage 20 relative to the origin of the machine coordinate system. The rotation axis Yt is the rotation center of the stage 20. Measuring the rotation center of the stage 20 includes measuring the position of the rotation axis Yt relative to the origin of the machine coordinate system. When measuring the position of the rotation axis Yt relative to the origin of the machine coordinate system, the board camera 25 and the height sensor 26 are used. Moreover, when measuring the position of the rotation axis Yt, the stage 20 is rotated only in the θY direction.

[0064] The stage moving device 21 has a θX motor that generates power to rotate the stage 20 about the rotation axis Xt, and a θY motor that generates power to rotate the stage 20 about the rotation axis Yt. The stage moving device 21 also has a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, and a Z-axis motor that generates power to move the stage 20 in the Z-axis direction. The stage 20 is rotatable while supporting the substrate 1.

[0065] When measuring the position of the rotation axis Yt of the stage 20, the stage 20 is rotated only in the θY direction. That is, when measuring the position of the rotation axis Yt of the stage 20, only the θY motor of the stage moving device 21 is driven, and the other motors (θX motor, Y-axis motor, Z-axis motor) are stopped.

[0066] When measuring the rotation center of the stage 20, the jig substrate 100 is supported on the stage 20 via the pallet 3. The stage 20 supports the pallet 3 holding the jig substrate 100. The surface of the jig substrate 100 is a flat surface. The jig substrate 100 is a parallel plate. A mark 70 is provided on a part of the surface of the jig substrate 100. The position of the mark 70 in the machine coordinate system is detected while changing the angle of the jig substrate 100 in the θY direction. The position of the mark 70 is a position on a predetermined plane perpendicular to the rotation axis Yt. When the rotation axis Yt and the Ym axis of the machine coordinate system are parallel, the predetermined plane perpendicular to the rotation axis Yt is the XmZm plane including the Xm axis and the Zm axis. The substrate camera 25 can detect the X position and the Y position of the mark 70 in the machine coordinate system by capturing an image of the mark 70. The height sensor 26 can detect the Z position of the mark 70 in the machine coordinate system by detecting the height of the mark 70. The position of the mark 70 is calculated based on the detection data of the board camera 25 and the height sensor 26, respectively.

[0067] 11 , when measuring the position of the rotation axis Yt, the X position and Z position of the mark 70 are detected at each of at least three mutually different angles of the jig substrate 100. When the jig substrate 100 is at a first angle, the X position of the mark 70 is detected by the substrate camera 25, and the Z position of the mark 70 is detected by the height sensor 26. When the jig substrate 100 is at a second angle, the X position of the mark 70 is detected by the substrate camera 25, and the Z position of the mark 70 is detected by the height sensor 26. When the jig substrate 100 is at a third angle, the X position of the mark 70 is detected by the substrate camera 25, and the Z position of the mark 70 is detected by the height sensor 26.

[0068] That is, the positions (X position and Z position) of the three marks 70 on the XmZm plane are detected. Based on the positions of the three marks 70, the position of the rotation axis Yt on the XmZm plane is calculated as the center of rotation. The X position and Z position of the rotation axis Yt are calculated from a circle that passes through the three marks 70 on the XmZm plane. That is, the coordinates (x0, z0) of the rotation axis Yt on the XmZm plane are calculated from the circle that passes through the three marks 70. From the above, the position of the rotation axis Yt in the machine coordinate system is calculated as the center of rotation of the stage 20.

[0069] Although not shown in the figure, when measuring the position of the rotation axis Xt of the stage 20, the stage 20 is rotated only in the θX direction. That is, when measuring the position of the rotation axis Xt of the stage 20, only the θX motor of the stage moving device 21 is driven, and the other motors (θY motor, Y-axis motor, Z-axis motor) are stopped.

[0070] When measuring the position of the rotation axis Xt, the Y position and Z position of the mark 70 are detected at each of at least three mutually different angles of the jig substrate 100. When the jig substrate 100 is at a first angle, the Y position of the mark 70 is detected by the substrate camera 25, and the Z position of the mark 70 is detected by the height sensor 26. When the jig substrate 100 is at a second angle, the Y position of the mark 70 is detected by the substrate camera 25, and the Z position of the mark 70 is detected by the height sensor 26. When the jig substrate 100 is at a third angle, the Y position of the mark 70 is detected by the substrate camera 25, and the Z position of the mark 70 is detected by the height sensor 26.

[0071] That is, the three positions (Y positions and Z positions) of the mark 70 on the YmZm plane are detected. The Y position and Z position of the rotation axis Xt are obtained from a circle that passes through the three marks 70 on the YmZm plane. That is, the coordinates (y0, z0) of the rotation axis Xt on the YmZm plane are calculated from the circle that passes through the three marks 70. As a result, the position of the rotation axis Xt in the machine coordinate system is calculated.

[0072] <Processing equipment> FIG. 12 is a block diagram showing the processing device 16 used to measure the rotation center of the stage 20 according to the embodiment. The processing device 16 includes a computer system. The processing device 16 has at least one processor 47, a main memory 48, a storage 49, and an interface 50. The processor 47 is a central processing unit (CPU). The main memory 48 includes a non-volatile memory such as a read only memory (ROM) and a volatile memory such as a random access memory (RAM). Examples of the storage 49 include a hard disk drive (HDD), a solid state drive (SSD), a magnetic disk, a magneto-optical disk, a CD-ROM, and a DVD-ROM. The interface 50 includes an input / output circuit. The functions of the processor 47 are stored in the storage 49 as a program. The processor 47 reads the program from the storage 49, expands it in the main memory 48, and executes processing according to the program. The program may be distributed to the processing device 16 via a network.

[0073] <Mounting equipment operation> Each of Fig. 13 to Fig. 18 is a diagram showing the operation of the mounting device 12 when measuring the rotation center of the stage 20 according to the embodiment. Each of Fig. 13 to Fig. 18 shows the operation of the mounting device 12 when measuring the position of the rotation axis Yt of the stage 20 relative to the origin of the machine coordinate system.

[0074] 13, a jig substrate 100 is supported on a stage 20 via a pallet 3. The stage 20 supports the pallet 3 which holds the jig substrate 100. A mark 70 is provided on the surface of the jig substrate 100.

[0075] As shown in FIG. 13, the processing device 16 controls the stage 20 so that the jig substrate 100 is at a first angle in the rotation direction around the rotation axis Yt. The processing device 16 detects the X position of the mark 70 with the substrate camera 25 when the jig substrate 100 is at the first angle. The processing device 16 can calculate the X position (x1) of the mark 70 relative to the origin of the machine coordinate system based on the detection data of the substrate camera 25. Also, as shown in FIG. 14, the processing device 16 detects the Z position of the mark 70 with the height sensor 26 when the jig substrate 100 is at the first angle. The processing device 16 can calculate the Z position (z1) of the mark 70 relative to the origin of the machine coordinate system based on the detection data of the height sensor 26.

[0076] Next, as shown in FIG. 15, the processing device 16 controls the stage 20 so that the jig substrate 100 is at a second angle in the rotation direction around the rotation axis Yt. The processing device 16 detects the X position of the mark 70 with the substrate camera 25 when the jig substrate 100 is at the second angle. The processing device 16 can calculate the X position (x2) of the mark 70 relative to the origin of the machine coordinate system based on the detection data of the substrate camera 25. Also, as shown in FIG. 16, the processing device 16 detects the Z position of the mark 70 with the height sensor 26 when the jig substrate 100 is at the second angle. The processing device 16 can calculate the Z position (z2) of the mark 70 relative to the origin of the machine coordinate system based on the detection data of the height sensor 26.

[0077] Next, as shown in FIG. 17, the processing device 16 controls the stage 20 so that the jig substrate 100 is at a third angle in the rotation direction around the rotation axis Yt. The processing device 16 detects the X position of the mark 70 with the substrate camera 25 when the jig substrate 100 is at the third angle. The processing device 16 can calculate the X position (x3) of the mark 70 relative to the origin of the machine coordinate system based on the detection data of the substrate camera 25. Also, as shown in FIG. 18, the processing device 16 detects the Z position of the mark 70 with the height sensor 26 when the jig substrate 100 is at the third angle. The processing device 16 can calculate the Z position (z3) of the mark 70 relative to the origin of the machine coordinate system based on the detection data of the height sensor 26.

[0078] The X-position (x1, x2, x3) of the mark 70 indicates the distance in the horizontal direction (Xm axis direction) from the origin of the machine coordinate system. The Z-position (z1, z2, z3) of the mark 70 indicates the distance in the height direction (Zm axis direction) from the origin of the machine coordinate system.

[0079] From the above, the first position (x1, z1), second position (x2, z2), and third position (x3, z3) of mark 70 on the XmZm plane are detected. The X and Z positions of the rotation axis Yt are obtained from a circle that passes through mark 70 at the three positions on the XmZm plane. In other words, the coordinates (x0, z0) of the rotation axis Yt on the XmZm plane are calculated from the circle that passes through mark 70 at the three positions. From the above, the position of the rotation axis Yt in the machine coordinate system is calculated.

[0080] Although not shown in the drawing, the processing device 16 can calculate the position of the rotation axis Xt from the three positions of the mark 70 on the YmZm plane.

[0081] [Second embodiment] A second embodiment will be described below. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description of those components will be simplified or omitted.

[0082] <How to measure the stage rotation center> Fig. 19 is a diagram for explaining a method for measuring the rotation center of the stage 20 according to the embodiment. Fig. 19 shows a method for measuring the position of the rotation axis Yt of the stage 20 relative to the origin of the machine coordinate system. In the embodiment, when measuring the position of the rotation axis Yt relative to the origin of the machine coordinate system, the height sensor 26 is used. In the embodiment, the board camera 25 is not used. Furthermore, when measuring the position of the rotation axis Yt, the stage 20 is rotated only in the θY direction.

[0083] When measuring the center of rotation of the stage 20, the jig substrate 100 is supported on the stage 20 via the pallet 3. The stage 20 supports the pallet 3 which holds the jig substrate 100. In the embodiment, no mark 70 is provided on the jig substrate 100. The position of the surface of the jig substrate 100 in the machine coordinate system is detected while changing the angle of the jig substrate 100 in the θY direction. The height sensor 26 detects the Z position of the surface of the jig substrate 100 in the machine coordinate system.

[0084] 19, when measuring the position of the rotation axis Yt, the Z positions of two portions on the surface of the jig substrate 100 are detected at each of at least two mutually different angles of the jig substrate 100. When the jig substrate 100 is at a first angle, the Z position of a first portion 81 on the surface of the jig substrate 100 and the Z position of a second portion 82 are detected by the height sensor 26. When the jig substrate 100 is at a second angle, the Z position of the first portion 81 on the surface of the jig substrate 100 and the Z position of the second portion 82 are detected by the height sensor 26.

[0085] That is, the positions (Z positions) of two parts of the jig substrate 100 on the XmZm plane are detected for each of at least two mutually different angles of the jig substrate 100. Based on the positions of the four parts, the position of the rotation axis Yt on the XmZm plane is calculated as the rotation center.

[0086] In the XmZm plane, a first triangle 83 is defined by a line connecting the first portion 81 and the second portion 82 when the jig substrate 100 is at a first angle, a line connecting the first portion 81 and the second portion 82 when the jig substrate 100 is at a second angle, and a line connecting the first portion 81 when the jig substrate 100 is at the first angle and the first portion 81 when the jig substrate 100 is at the second angle.

[0087] In the XmZm plane, a second triangle 84 is defined by a line connecting the first portion 81 and the second portion 82 when the jig substrate 100 is at a first angle, a line connecting the first portion 81 and the second portion 82 when the jig substrate 100 is at a second angle, and a line connecting the second portion 82 when the jig substrate 100 is at the first angle and the second portion 82 when the jig substrate 100 is at the second angle.

[0088] The first triangle 83 and the second triangle 84 are similar figures. The X and Z positions of the rotation axis Yt are found from the first triangle 83 and the second triangle 84. That is, the coordinates (x0, z0) of the rotation axis Yt on the XmZm plane are calculated from the first triangle 83 and the second triangle 84. In this way, the position of the rotation axis Yt in the machine coordinate system is calculated.

[0089] Although not shown, when measuring the position of the rotation axis Xt of the stage 20, the stage 20 is rotated only in the θX direction. At least two mutually different angles of the jig substrate 100, the positions (Z positions) of two parts of the jig substrate 100 in the YmZm plane are detected. In the YmZm plane, a first triangle 83 and a second triangle 84 are defined. From the first triangle 83 and the second triangle 84, the Y position and the Z position of the rotation axis Xt are obtained. That is, from the first triangle 83 and the second triangle 84, the coordinates (y0, z0) of the rotation axis Xt in the YmZm plane are calculated. From the above, the position of the rotation axis Xt in the machine coordinate system is calculated.

[0090] <Mounting equipment operation> 20 and 21 are diagrams illustrating the operation of the mounting device 12 when measuring the rotation center of the stage 20 according to the embodiment. Fig. 20 and Fig. 21 show the operation of the mounting device 12 when measuring the position of the rotation axis Yt of the stage 20 relative to the origin of the machine coordinate system.

[0091] 20, the jig substrate 100 is supported by the stage 20 via the pallet 3. The stage 20 supports the pallet 3 which holds the jig substrate 100. No mark 70 is provided on the jig substrate 100.

[0092] As shown in Fig. 20, the processing device 16 controls the stage 20 so that the jig substrate 100 is at a first angle in the rotation direction around the rotation axis Yt. The processing device 16 detects the Z position of the first portion 81 on the surface of the jig substrate 100 with the height sensor 26 when the jig substrate 100 is at a first angle -θ with respect to a horizontal plane. The distance between the origin of the machine coordinate system and the first portion 81 in the Xm-axis direction is x1. That is, the Xm coordinate of the first portion 81 is x1. The processing device 16 can calculate the X position (x1) and the Z position (z11) of the first portion 81 relative to the origin of the machine coordinate system when the jig substrate 100 is at the first angle based on the detection data of the height sensor 26.

[0093] Furthermore, the processing device 16 detects the Z position of the second portion 82 on the surface of the jig substrate 100 with the height sensor 26 when the jig substrate 100 is at the first angle -θ. The distance between the origin of the machine coordinate system and the second portion 82 in the Xm-axis direction is x2. In other words, the Xm coordinate of the second portion 82 is x2. Based on the detection data of the height sensor 26, the processing device 16 can calculate the X position (x2) and Z position (z21) of the second portion 82 relative to the origin of the machine coordinate system when the jig substrate 100 is at the first angle -θ.

[0094] Next, as shown in FIG. 21, the processing device 16 controls the stage 20 so that the jig substrate 100 is at a second angle θ with respect to the horizontal plane in the rotation direction around the rotation axis Yt. The processing device 16 detects the Z position of the first portion 81 on the surface of the jig substrate 100 with the height sensor 26 when the jig substrate 100 is at the second angle θ. The distance between the origin of the machine coordinate system and the first portion 81 in the Xm-axis direction is x1. That is, the Xm coordinate of the first portion 81 is x1. The processing device 16 can calculate the X position (x1) and the Z position (z12) of the first portion 81 relative to the origin of the machine coordinate system when the jig substrate 100 is at the second angle based on the detection data of the height sensor 26.

[0095] Furthermore, the processing device 16 detects the Z position of the second portion 82 on the surface of the jig substrate 100 with the height sensor 26 when the jig substrate 100 is at the second angle θ. The distance between the origin of the machine coordinate system and the second portion 82 in the Xm-axis direction is x2. In other words, the Xm coordinate of the second portion 82 is x2. Based on the detection data of the height sensor 26, the processing device 16 can calculate the X position (x2) and Z position (z22) of the second portion 82 relative to the origin of the machine coordinate system when the jig substrate 100 is at the second angle.

[0096] Fig. 22 is a diagram showing the coordinates of a first portion 81 and the coordinates of a second portion 82 according to the embodiment. It is assumed that the Z position (z3) when the jig substrate 100 is parallel to the horizontal plane is acquired in advance. As described with reference to Fig. 19, a first triangle 83 and a second triangle 84, which are in a similar relationship, are defined. The coordinates (x0, z0) of the rotation axis Yt on the XmZm plane are expressed by the following equations (1), (2), and (3).

[0097]

number

number

number

[0098] In this way, the X and Z positions of the rotation axis Yt in the machine coordinate system are found. That is, the coordinates (x0, z0) of the rotation axis Yt on the XmZm plane are calculated.

[0099] Although not shown in the drawing, the processing device 16 can calculate the Y position and the Z position of the rotation axis Xt from the first triangle 83 and the second triangle on the YmZm plane.

[0100] [Third embodiment] A third embodiment will be described below. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description of those components will be simplified or omitted.

[0101] Fig. 23 is a diagram for explaining a method for measuring the rotation center of the stage 20 according to the embodiment. As shown in Fig. 23, when considering the inclination between the rotation axis Xt and the rotation axis Yt of the stage 20 and the Xm-axis and the Ym-axis of the machine coordinate system, the rotation center may be obtained at two points and the straight line connecting the two points may be set as the rotation center.

[0102] For example, as shown in Fig. 23, by rotating in a direction around the Xm axis, the rotation center e is found from positions a and b, and the rotation center f is found from positions c and d. A rotation center line Lx in the Xm axis direction is determined from rotation centers e and f. Similarly, by rotating in a direction around the Ym axis, the rotation center g is found from positions a and c, and the rotation center h is found from positions b and d. A rotation center line Ly in the Ym axis direction is determined from rotation centers g and h.

[0103] [Modification of the embodiment] In the first and second embodiments described above, the center of rotation of the stage 20 is measured using a mark 70 provided on a portion of the surface of the jig substrate 100 supported by the stage 20 via the pallet 3 or a portion of the jig substrate 100. According to the above-described embodiments, the center of rotation of the stage 20 may be measured using a portion of the surface of the stage 20 or a mark provided on a portion of the stage 20. The portion of the surface of the stage 20 for measuring the center of rotation may be a flat surface. Also, according to the above-described embodiments, the center of rotation of the stage 20 may be measured using a portion of the surface of the pallet 3 supported by the stage 20 or a mark provided on a portion of the pallet 3. The portion of the surface of the pallet 3 for measuring the center of rotation may be a flat surface.

[0104] When measuring the center of rotation using the mark 70 as in the first embodiment described above, the surface of the jig substrate 100 does not have to be a flat surface. Therefore, even if the jig substrate 100 is not used, when a mark is provided on the substrate 1 (three-dimensional substrate, mounting substrate), the center of rotation of the stage 20 may be measured using the mark on the substrate 1.

[0105] When the rotation axis Xt and the rotation axis Yt intersect, that is, when the jig substrate 100 is rotated and the mark 70 of the jig substrate 100 moves on a sphere centered on the intersection point where the rotation axis Xt and the rotation axis Yt intersect, instead of sequentially determining the rotation centers Xt, Yt, it is possible to determine the position of the rotation center from the equation of a sphere passing through the four points by detecting any four positions of the mark 70 on the three-dimensional coordinate system. [Explanation of symbols]

[0106] 1...Substrate (mounting substrate), 1A...Base material, 1B...Film, 2...Component, 3...Pallet, 4...Support member, 4A...Base portion, 4B...Guard portion, 4C...Pin portion, 4D...Hole, 5...Clamp mechanism, 5A...Support portion, 5B...Moveable portion, 10...Production system, 12...Mounting device, 13...Preheating device, 14...Laser irradiation device, 16...Processing device, 18...Base member, 19...Conveying device, 19A...Conveying belt, 19B...Guide member, 20...Stage, 20A...Positioning member, 21...Stage moving device, 22...Component supply device, 23...Nozzle, 23A...Shaft, 24...Mounting head, 25...Substrate camera, 26...Height sensor, 27...Head moving device, 27X...X-axis moving device, 27Y...Y-axis moving device, 28...nozzle moving device, 29...chamber, 34...dispenser, 35...base member, 36...transport device, 36A...transport belt, 36B...guide member, 37...heater, 38...chamber, 39...base member, 40...transport device, 40A...transport belt, 40B...guide member, 41...stage, 42...stage moving device, 43...laser head, 44...chamber, 47...processor, 48...main memory, 49...storage, 50...interface, 70...mark, 81...first part, 82...second part, 100...jig board, Pp...mounting position, Xt...rotation axis, Yt...rotation axis.

Claims

1. A method for measuring a rotation center of a stage that is used in a three-dimensional mounting device and that can rotate while supporting a mounting substrate, comprising the steps of: rotating the stage on which the jig substrate is supported to each of a plurality of angles; Detecting a position of a portion of a surface of the fixture substrate at each of the plurality of angles; calculating a position of a rotation center of the stage relative to an origin of a machine coordinate system defined in the three-dimensional mounting device based on a detection result of the position of the part. How to measure the center of rotation of a stage.

2. The stage is rotatable around a rotation axis; Detecting the position of the part means detecting the position of the part in a predetermined plane perpendicular to the rotation axis.

2. A method for measuring a rotation center of a stage according to claim 1.

3. the position of the part includes a lateral position indicating a lateral distance from an origin of the machine coordinate system, and a height position indicating a height distance from the origin, 3. The method for measuring the center of rotation of a stage according to claim 2.

4. A mark is provided on the site, the three-dimensional mounting apparatus includes a board camera that captures an image of the mark and a height sensor that detects a height of the mark; A position of the part is calculated based on the detection data of the board camera and the height sensor.

4. The method for measuring the center of rotation of a stage according to claim 3.

5. The mark is detected at each of at least three mutually different angles of the jig substrate; A position of the rotation axis on the predetermined plane is calculated as the rotation center based on the positions of the three marks.

5. The method for measuring the center of rotation of a stage according to claim 4.

6. the three-dimensional mounting device has a height sensor that detects a height of the portion; The position of the part is calculated based on the detection data of the height sensor.

4. The method for measuring the center of rotation of a stage according to claim 3.

7. a first portion and a second portion of a surface of the jig substrate are detected at each of at least two mutually different angles of the jig substrate; The position of the rotation axis on the predetermined plane is calculated as the rotation center based on the positions of the four parts.

7. The method for measuring the center of rotation of a stage according to claim 6.

8. A method for measuring a rotation center of a stage that is used in a three-dimensional mounting device and that can rotate while supporting a mounting substrate, comprising the steps of: rotating the stage through each of a plurality of angles; Detecting a position of a portion of a surface of the stage at each of a plurality of angles; calculating a position of a rotation center of the stage relative to an origin of a machine coordinate system defined in the three-dimensional mounting device based on a detection result of the position of the part. How to measure the center of rotation of a stage.

9. The stage is rotatable around a rotation axis; Detecting the position of the part means detecting the position of the part in a predetermined plane perpendicular to the rotation axis. The method for measuring the center of rotation of a stage according to claim 8.

10. the position of the part includes a lateral position indicating a lateral distance from an origin of the machine coordinate system, and a height position indicating a height distance from the origin, The method for measuring the center of rotation of a stage according to claim 9.

11. A mark is provided on the site, the three-dimensional mounting apparatus includes a board camera that captures an image of the mark and a height sensor that detects a height of the mark; A position of the part is calculated based on the detection data of the board camera and the height sensor. The method for measuring the center of rotation of a stage according to claim 10.

12. the mark is detected at each of at least three mutually different angles of the stage; A position of the rotation axis on the predetermined plane is calculated as the rotation center based on the positions of the three marks. The method for measuring the center of rotation of a stage according to claim 11.

13. the three-dimensional mounting device has a height sensor that detects a height of the portion; The position of the part is calculated based on the detection data of the height sensor. The method for measuring the center of rotation of a stage according to claim 10.

14. a first portion and a second portion of a surface of the stage are detected at each of at least two mutually different angles of the stage; The position of the rotation axis on the predetermined plane is calculated as the rotation center based on the positions of the four parts. The method for measuring a rotation center of a stage according to claim 13.

15. A method for measuring a rotation center of a stage that is used in a three-dimensional mounting device and that can rotate while supporting a mounting substrate, comprising the steps of: rotating the stage, on which a pallet for holding the mounting substrate or the jig substrate is supported, to each of a plurality of angles; Detecting a position of a portion of a surface of the pallet at each of a plurality of said angles; calculating a position of a rotation center of the stage relative to an origin of a machine coordinate system defined in the three-dimensional mounting device based on a detection result of the position of the part. How to measure the center of rotation of a stage.

16. The stage is rotatable around a rotation axis; Detecting the position of the part means detecting the position of the part in a predetermined plane perpendicular to the rotation axis. The method for measuring the center of rotation of a stage according to claim 15.

17. the position of the part includes a lateral position indicating a lateral distance from an origin of the machine coordinate system, and a height position indicating a height distance from the origin, The method for measuring the center of rotation of a stage according to claim 16.

18. A mark is provided on the site, the three-dimensional mounting apparatus includes a board camera that captures an image of the mark and a height sensor that detects a height of the mark; A position of the part is calculated based on the detection data of the board camera and the height sensor. The method for measuring the center of rotation of a stage according to claim 17.

19. the mark is detected at each of at least three mutually different angles of the stage; A position of the rotation axis on the predetermined plane is calculated as the rotation center based on the positions of the three marks. The method for measuring a rotation center of a stage according to claim 18.

20. the three-dimensional mounting device has a height sensor that detects a height of the portion; The position of the part is calculated based on the detection data of the height sensor. The method for measuring the center of rotation of a stage according to claim 17.

21. a first portion and a second portion of a surface of the pallet are detected at each of at least two mutually different angles of the stage; The position of the rotation axis on the predetermined plane is calculated as the rotation center based on the positions of the four parts. The method for measuring a rotation center of a stage according to claim 20.

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