Electronic control device

The electronic control device uses conductive convex portions to guide noise away from components to the ground pattern, addressing the challenge of electromagnetic radiation suppression with minimal components and maintaining board design flexibility.

JP2025008150APending Publication Date: 2025-01-20ASTEMO LTD
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Patent Information

Application Number
JP2023110074
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-07-04
Publication Date
2025-01-20

AI Technical Summary

Technical Problem

Existing electronic control devices for driving support systems and autonomous driving face challenges in efficiently suppressing unnecessary electromagnetic radiation with a small number of components without interfering with wiring or component mounting, leading to increased costs and board size.

Method used

The electronic control device incorporates a casing with conductive convex portions that guide noise away from electronic components to a ground pattern, using a minimal number of components and allowing for efficient electromagnetic shielding without obstructing wiring or component placement.

Benefits of technology

This configuration effectively suppresses electromagnetic radiation while minimizing the use of components, reducing costs and board size, and maintaining flexibility in board design.

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Abstract

To provide an electronic control device capable of efficiently suppressing unnecessary radio wave radiation with a small number of components without hindering wiring and component mounting at a circumference of electronic components.SOLUTION: An electronic control device 101 has a circuit board 102 mounted with an electronic component 201 and casings 103, 104 housing the circuit board 102. The circuit board 102 has a GND pattern, and the casing 103 has a first conductive projection 301 and a second projection 302 which project to the side of the circuit board 102. The first projection 301 is connected to the electronic component 201, and the second projection 302 has a first connection part connected to an outer peripheral surface of the first projection 301 and a second connection part 303 connected to the GND pattern directly or through the connection member 203, wherein the second projection 302 is so shaped that the projection surface of the second projection 302 is as close or closer to the circuit board 102 as or than the projection surface of the first projection part 301 between the electronic component 201 and second connection part 303.SELECTED DRAWING: Figure 1
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Description

[Technical field]

[0001] The present invention relates to an electronic control device. [Background technology]

[0002] Electronic control devices for driver assistance systems and autonomous driving need to process large volumes of information from sensor modules such as cameras at high speed, so they tend to be equipped with high-performance LSIs.

[0003] In addition to the increase in high-frequency noise accompanying the high performance of LSIs, noise is more easily transmitted via heat dissipation paths, which has led to an increase in unwanted electromagnetic radiation. In addition, the reverse transmission of external noise via these paths has also led to a decrease in noise resistance, which has also become an issue.

[0004] Figure 2 of Patent Document 1 shows a structure that confines noise within a metal housing and suppresses unnecessary electromagnetic radiation by providing a structure that connects the housing and the GND pattern of the board near an external connection connector, which is a likely path for noise to be transmitted from inside the device to the outside.

[0005] Moreover, FIG. 3 and other figures of Patent Document 2 show a structure in which a conductive point between a metal housing and a substrate is provided so as to surround electronic components including an LSI, thereby enhancing the electromagnetic shielding effect. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2022-173233 A [Patent Document 2] JP 2005-294627 A Summary of the Invention [Problem to be solved by the invention]

[0007] The technology of Patent Document 1 prevents noise transmitted from the LSI to the housing via the heat dissipation path from reaching the area around the connector, which is an opening in the housing, by surrounding the area around the connector with a structure, thereby preventing noise from escaping through the opening in the housing around the connector.

[0008] However, the technology of Patent Document 1 requires that the GND pattern of the board be joined to the housing so as to surround the connector. Therefore, when the number of connectors increases along with an increase in the number of sensors and other devices connected to the device, a large number of parts and materials such as EMI gaskets are required to surround all the connectors, resulting in a problem of increased costs.

[0009] To achieve electromagnetic shielding using fewer components, it is desirable to configure a shielding structure near the noise source before the noise from the LSI spreads inside the housing. The technology disclosed in Patent Document 2 is one example of such a technique.

[0010] However, a large number of signal wiring and components need to be placed near the LSI, and creating a conductive point with the housing near the LSI, as in the technology of Patent Document 2, impedes the placement of wiring and components, resulting in restrictions on board design, increasing the board size and the number of board layers, and increasing costs.

[0011] An object of the present invention is to provide an electronic control device that can efficiently suppress unwanted electromagnetic radiation with a small number of components without interfering with wiring around the electronic components or component mounting. [Means for solving the problem]

[0012] In order to solve the above-mentioned problems, the electronic control device of the present invention is an electronic control device having a circuit board mounted with electronic components and a housing that houses the circuit board, wherein the circuit board has a GND pattern, and the housing has a conductive first convex portion and a second convex portion that are convex toward the circuit board side, the first convex portion is connected to the electronic component, the second convex portion has a first connection portion connected to the outer peripheral surface of the first convex portion and a second connection portion connected to the GND pattern directly or via a connecting member, and the second convex portion has a shape such that, between the electronic component and the second connection portion, the convex surface of the second convex portion is as close to the circuit board as or closer to the convex surface of the first convex portion. Effect of the Invention

[0013] According to the electronic control device of the present invention, it is possible to efficiently suppress unwanted electromagnetic radiation with a small number of components without interfering with wiring around electronic components or component mounting. [Brief description of the drawings]

[0014] [Figure 1] FIG. 2 is a cross-sectional view of the electronic control device of the first embodiment. [Diagram 2] FIG. 2 is a plan view of a housing base of the electronic control device according to the first embodiment. [Diagram 3] FIG. 2 is a perspective view of a housing base of the electronic control device according to the first embodiment. [Figure 4] FIG. 1 is a perspective view of an electronic control device according to a first embodiment. [Diagram 5] FIG. 11 is a plan view of a housing base of an electronic control device according to a second embodiment. [Figure 6] FIG. 11 is a cross-sectional view of an electronic control device according to a third embodiment. [Figure 7] FIG. 13 is a plan view of a housing base of the electronic control device according to the fourth embodiment. [Figure 8] FIG. 11 is a cross-sectional view of an electronic control device according to a fifth embodiment. [Figure 9] FIG. 23 is a plan view of a housing base of the electronic control device according to the sixth embodiment. [Figure 10] FIG. 13 is a perspective view of a noise guide structure of an electronic control device according to a seventh embodiment. [Figure 11] FIG. 13 is a cross-sectional view of an electronic control device according to an eighth embodiment. [Figure 12] FIG. 13 is a plan view of a housing base of the electronic control device according to the ninth embodiment. [Figure 13] FIG. 23 is a plan view of the housing base of the electronic control device of the tenth embodiment. [Figure 14] FIG. 23 is a cross-sectional view of an electronic control device according to a tenth embodiment. [Figure 15] FIG. 23 is a cross-sectional view of an electronic control device according to an eleventh embodiment. [Figure 16] FIG. 23 is a cross-sectional view of an electronic control device according to a twelfth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each drawing and each embodiment, the same or similar components are designated by the same reference numerals, and duplicated explanations will be omitted. EXAMPLES

[0016] FIG. 1 is a cross-sectional view of the electronic control device of the first embodiment. FIG. 2 is a plan view of the housing base of the electronic control device of the first embodiment. FIG. 3 is a perspective view of the housing base of the electronic control device of the first embodiment. FIG. 4 is a perspective view of the electronic control device of the first embodiment. In FIGS. 1 and 2, the parts other than the main parts in this embodiment are shown in a simplified manner. The cross-sectional view in FIG. 1 corresponds to the A-A' portion in FIG. 2. FIG. 2 is a plan view of the inside of the housing base 103, which corresponds to a view from below in FIG. 1 and from above in FIG. 3.

[0017] As shown in FIG. 1, an electronic control device 101 of this embodiment has a circuit board 102 on which an electronic component 201 is mounted, and a housing that houses the circuit board 102.

[0018] The housing is made of metal and has electrical conductivity, and is composed of a housing base 103 and a housing cover 104. The circuit board 102 is covered from above and below by the housing base 103 and the housing cover 104.

[0019] An electronic component 201, which is both a heat source and a noise source, is mounted on the circuit board 102. The electronic component is, for example, an LSI or an IC. Note that, in addition to the electronic component 201 shown in FIG. 1, other electronic components 201 are mounted on the circuit board 102, but are not shown.

[0020] The circuit board 102 has a wiring pattern (not shown). This wiring pattern includes a pattern for routing signal wiring and a GND pattern (ground pattern) that serves as a reference potential. The GND pattern may include a pattern that is DC-isolated via a capacitor or the like.

[0021] An external connector 204 is mounted on an end of the circuit board 102. A plurality of external connectors 204 of different shapes may be mounted. A part of the external connector 204 is exposed to the outside of the housing through a housing opening 306 for connector provided in the housing base 103 as shown in FIG.

[0022] The circuit board 102 is fixed to the housing base 103 by screws 105. The housing cover 104 is also fixed to the housing base 103 by screws 105. To this end, the housing base 103 has, as shown in Fig. 3, board fixing screw bosses 310 in which board fixing screw holes 305 are formed, into which the screws 105 for fixing the circuit board 102 are inserted, and cover fixing screw bosses 311 in which housing cover fixing screw holes are formed, into which the screws 105 for fixing the housing cover 104 are inserted.

[0023] 1, the housing base 103 of this embodiment has a conductive first convex portion (heat dissipation convex portion 301) and a second convex portion (noise guide convex portion 302) that are convex toward the circuit board 102. In this embodiment, the heat dissipation convex portion 301 and the noise guide convex portion 302 are formed integrally with the housing base 103, but the present invention is not limited to this.

[0024] The heat dissipation convex portion 301, which is the first convex portion, is connected to the electronic component 201. This allows heat to be dissipated from the electronic component 201 to the housing base 103 via the heat dissipation convex portion 301. Note that it is preferable that heat dissipation grease 202 is inserted between the heat dissipation convex portion 301 and the electronic component 201.

[0025] As shown in Figs. 1, 2 and 3, noise guide protrusion 302, which is the second protrusion, has a first connection part connected to the outer peripheral surface of heat dissipation protrusion 301 and a second connection part (GND pattern connection part 303) connected to the GND pattern of circuit board 102 directly or via a connection member. Fig. 1 shows an example in which EMI gasket 203 is used as the connection member. EMI gasket 203 is an elastic conductive member. Note that a conductive metal member such as a screw may be used as the connection member instead of EMI gasket 203. In addition, in order to avoid the generation of an unintended DC current path due to conduction between housing base 103 and the GND pattern of circuit board 102, the GND pattern to which EMI gasket 203 is connected may be a pattern that is DC-separated via a capacitor from the GND pattern to which the circuit on circuit board 102 is connected.

[0026] 1, 2 and 3, noise guiding protrusions 302 extend outward from the corners of heat dissipation protrusions 301 and are connected to the GND pattern of circuit board 102 at GND pattern connection parts 303. By extending outward from the corners of heat dissipation protrusions 301, noise guiding protrusions 302 have a part that extends in a direction away from electronic component 201, starting from the corner of electronic component 201 to which heat dissipation protrusions 301 are connected.

[0027] The noise guide protrusion 302 is shaped so that the convex surface of the noise guide protrusion 302 is as close to the circuit board 102 as the convex surface of the heat dissipation protrusion 301 or closer to the circuit board 102 between the electronic component 201 and the GND pattern connection portion 303.

[0028] Generally, the noise current transmitted from the electronic component 201 to the housing base 103 through the thermal grease 202 returns to the electronic component 201 on the circuit board 102 through somewhere according to Kirchhoff's current law, but the wider the area the noise current spreads before returning, the more it leads to electromagnetic radiation into space. In this embodiment, the noise guide protrusion 302 is formed close to the circuit board 102 and is connected to the GND pattern of the circuit board 102 at the GND pattern connection part 303 beyond it, so that the current loop 400 can be made small. As a result, the impedance of the current loop 400 seen from the electronic component 201 is reduced, and the noise current is concentrated on this path, and it is possible to suppress the noise current from spreading over a wide area. This makes it possible to suppress unnecessary electromagnetic radiation. At the same time, the reciprocity theorem also makes it possible to reduce the effect of external noise on the electronic component 201.

[0029] In addition, since EMI gasket 203 for connecting to the GND pattern can be disposed at a position away from electronic component 201, it does not interfere with the routing of signal wiring connected to electronic component 201 or the arrangement of components around electronic component 201, and therefore it is possible to avoid an increase in the number of board layers and size of circuit board 102, and it is also effective in reducing costs. In addition, since a shield structure can be formed near the noise source, unnecessary electromagnetic radiation can be efficiently suppressed with a small number of EMI gaskets 203. Furthermore, since signal wiring and peripheral components connected to electronic component 201 are mostly disposed on the sides of electronic component 201, it is possible to further avoid an influence on the arrangement of signal wiring and peripheral components by drawing noise guide protrusion 302 obliquely from the corners of electronic component 201.

[0030] In this embodiment, four noise guiding protrusions 302 and EMI gaskets 203 are arranged for one electronic component 201, but the number may be increased or decreased as necessary.

[0031] In addition, in this embodiment, an example has been described in which electronic component 201 is mounted on the housing base 103 side, but this is not limited to this. If electronic component 201 is mounted on the housing cover 104 side, housing cover 104 may be configured to have heat dissipation protrusions 301 and noise guiding protrusions 302. EXAMPLES

[0032] The second and subsequent embodiments are modifications of the first embodiment, and the following description will focus on the differences from the first embodiment. Other than that, the description is the same as the first embodiment, and therefore will not be repeated.

[0033] Fig. 5 is a plan view of a housing base of an electronic control device according to a second embodiment of the present invention, and is a view corresponding to Fig. 2.

[0034] In this embodiment, noise guiding protrusion 302 has a bent portion whose extension direction changes when viewed in a plane, and noise guiding protrusion 302 is extended from a side of electronic component 201 rather than from a corner of electronic component 201.

[0035] In this embodiment, the noise guide protrusions 302 are not extended obliquely from the four corners of the electronic component 201, but are extended from the center of a side at a right angle to the side, or extended from the end of the side at a right angle to the side, or extended obliquely but bent at a right angle to the side, etc.

[0036] When it is difficult to pull out electronic component 201 obliquely from the four corners as in Example 1 due to the positional relationship with the ends of circuit board 102 and screws 105, the positional relationship with the wiring pattern on circuit board 102, and the like, the effect of reducing unwanted radiation can be obtained by adopting the configuration as in this example. EXAMPLES

[0037] Fig. 6 is a cross-sectional view of an electronic control device according to a third embodiment of the present invention, and corresponds to Fig. 1 .

[0038] In this embodiment, noise guide protrusion 302 has notch 307 at a portion where it overlaps with a component mounted on circuit board 102 (for example, surface mount component 205).

[0039] In this embodiment, in cases where surface mount components 205 are arranged directly below noise guiding protrusions 302, by providing notches 307 in noise guiding protrusions 302 to avoid interference, it is possible to avoid impeding the arrangement of components on circuit board 102. Note that by shaping notches 307 to be as close to circuit board 102 as the convex surface of heat dissipation protrusions 301 or closer, current loop 400 can be made small as in the case of FIG. EXAMPLES

[0040] 7 is a plan view of a housing base of an electronic control device according to a fourth embodiment of the present invention, and corresponds to FIG.

[0041] This embodiment has a plurality of heat dissipation protrusions 301, and the noise guide protrusions 302 connected to one heat dissipation protrusion 301 and the noise guide protrusions 302 connected to the other heat dissipation protrusion 301 have a common GND pattern connection portion 303.

[0042] According to this embodiment, the GND pattern connection portion 303 can be shared, so that unnecessary radiation can be reduced with a smaller number of EMI gaskets 203 . EXAMPLES

[0043] 8 is a cross-sectional view of an electronic control device according to a fifth embodiment of the present invention, and corresponds to FIG.

[0044] In this embodiment, circuit board 102 has electronic components 201 mounted on both sides, and the housing has housing base 103 (first housing) facing one main surface of circuit board 102 and having heat dissipation protrusions 301 and noise guiding protrusions 302, and housing cover 104 (second housing) facing the other main surface of circuit board 102 and having heat dissipation protrusions 301 and noise guiding protrusions 302.

[0045] This embodiment can also be used when electronic components 201, which are noise sources, are arranged on both sides of circuit board 102. Note that Fig. 8 shows an example in which heat dissipation protrusions 301 and noise guiding protrusions 302 have a hollow structure, since housing cover 104 is manufactured by pressing a plate-like member. Therefore, heat dissipation protrusions 301 look like recesses compared to noise guiding protrusions 302, but are protrusions when viewed from other parts of housing cover 104. EXAMPLES

[0046] 9 is a plan view of a housing base of an electronic control device according to a sixth embodiment of the present invention, and corresponds to FIG.

[0047] In this embodiment, the width of the noise guide protrusion 302 narrows from the connection portion (first connection portion) with the heat dissipation protrusion 301 toward the GND pattern connection portion 303 (second connection portion).

[0048] In this embodiment, the noise guiding protrusions 302 are wide near the heat dissipation protrusions 301 and have a tapered shape that narrows toward the GND pattern connection portion 303. In this case, like the noise guiding protrusions 302 on the lower side of FIG. 9, the noise guiding protrusions 302 may be connected to each other near the heat dissipation protrusions 301.

[0049] According to this embodiment, it is possible to more efficiently improve the shielding effect by making the noise guiding protrusion 302 wider on the side of the electronic component 201, which is the noise source, and narrowing it so as to guide it to the GND pattern connection part 303 side. This makes it possible to suppress unnecessary electromagnetic radiation and reduce the EMI gasket 203. EXAMPLES

[0050] FIG. 10 is a perspective view of a noise guide structure of an electronic control device according to the seventh embodiment.

[0051] In this embodiment, the noise guide protrusion 302 is thinner on the side close to the circuit board 102 than on the side farther from the circuit board 102 .

[0052] According to this embodiment, the cross-sectional shape of the noise guiding protrusion 302 is tapered at the tip, so that the effect of preventing interference with components on the circuit board 102 is obtained. EXAMPLES

[0053] 11 is a cross-sectional view of an electronic control device according to an eighth embodiment of the present invention, and corresponds to FIG.

[0054] In this embodiment, the GND pattern connection portion 303 (second connection portion) is a protrusion 308 formed on the surface of the noise guide convex portion 302, and this protrusion 308 is connected to the GND pattern of the circuit board 102 directly or via a connection member composed of a dielectric 206.

[0055] In this embodiment, for example, a resist material or a fixing adhesive on the circuit board 102 can be used as the dielectric 206. When the dielectric 206 is used, the capacitive coupling via the dielectric 206 provides an effect equivalent to that of electrical continuity at high frequencies.

[0056] According to this embodiment, the number of conductive connecting members such as the EMI gasket 203 and screws can be reduced, and the effect of reducing costs can be expected. EXAMPLES

[0057] 12 is a plan view of a housing base of an electronic control device according to a ninth embodiment of the present invention, and is a view corresponding to FIG.

[0058] In this embodiment, the noise guide protrusion 302 has a wall-like portion arranged in a position that blocks at least one side of the heat dissipation protrusion 301 when viewed in the direction of the heat dissipation protrusion 301 from a position away from the heat dissipation protrusion 301.

[0059] In this embodiment, the noise guiding protrusion 302 is arranged like a wall so as to block at least a part of the direction of the heat dissipation protrusion 301, and is connected to the GND pattern connection part 303 at or along the way. The noise guiding protrusion 302 may have a branched part or a bent part.

[0060] According to this embodiment, the area shielded by the noise guiding protrusions 302 can be expanded, thereby effectively suppressing unnecessary electromagnetic radiation, and the countermeasure can be implemented with a smaller number of EMI gaskets 203, which has the advantage of reducing costs. EXAMPLES

[0061] Fig. 13 is a plan view of a housing base of the electronic control device of Example 10. Fig. 14 is a cross-sectional view of the electronic control device of Example 10. Fig. 13 is a view corresponding to Fig. 2, and Fig. 14 is a view corresponding to Fig. 1.

[0062] In this embodiment, the noise guide protrusion 302 is connected to the screw 105 that fixes the circuit board 102, or to a structure that connects the housing base 103 and the circuit board 102 (the gasket connection portion 309 around the connector and the EMI gasket 203). In this embodiment, the noise guiding protrusion 302 is connected to the boss 310 for the board fixing screw, and is thereby connected to the screw 105 that fixes the circuit board 102. This allows the screw 105 to be used in place of the EMI gasket 203.

[0063] In this embodiment, the housing base 103 has a gasket connection portion 309 around the connector, which is a convex portion surrounding the periphery of the external connector 204, and the gasket connection portion 309 around the connector is connected to the GND pattern of the circuit board 102 directly or via a connecting member such as an EMI gasket 203 or a screw. This makes it possible to shield noise from the external connector 204. Furthermore, the noise guide convex portion 302 is connected to the gasket connection portion 309 around the connector. This makes it possible to share the EMI gasket 203 used to connect the gasket connection portion 309 around the connector and the EMI gasket 203 used to connect the GND pattern connection portion 303, so that a smaller number of EMI gaskets 203 can be used for the entire device. EXAMPLES

[0064] 15 is a cross-sectional view of an electronic control device according to an eleventh embodiment of the present invention, and corresponds to FIG.

[0065] In this embodiment, the noise guide protrusion 302 is formed of a separate member (a noise guide protrusion member 312) from the housing base 103.

[0066] In this embodiment, the noise guide portion is formed by a noise guide protrusion member 312 formed by bending a plate-like member, instead of the noise guide protrusion 302 formed integrally with the housing base 103. By not forming it as an integral member, there is an advantage that the position of the protrusion can be easily changed in response to changes in the design of the circuit board 102, etc.

[0067] In this embodiment, the noise guide protrusion member 312 is formed of a member obtained by bending a plate-like member, but it may be formed of a member other than a plate-like member. EXAMPLES

[0068] 16 is a cross-sectional view of an electronic control device according to a twelfth embodiment of the present invention, which corresponds to FIG.

[0069] This embodiment has a plurality of circuit boards 102, and at least one of the circuit boards 102 is connected to a noise guide protrusion 302.

[0070] In this embodiment, the electronic control device 101 has a plurality of circuit boards 102, each of which is mounted with an electronic component 201. The circuit boards 102 are connected to each other by a board-to-board connector 207. The housing base 103 has a water passage 313 for cooling by water, and dissipates heat from the electronic components 201 by the heat dissipation protrusions 301 and the heat dissipation grease 202. The housing base 103 has noise guide protrusions 302 connected to each heat dissipation protrusion 301, and the noise guide protrusions 302 are connected to the GND pattern of the circuit board 102 at GND pattern connection parts 303 via the EMI gasket 203.

[0071] According to this embodiment, in order to improve the performance of the electronic control device 101, it is possible to accommodate a configuration having a plurality of circuit boards 102. Note that the cooling method may be forced air cooling or natural air cooling instead of water cooling. Also, the number of circuit boards 102 may be further increased.

[0072] Although the embodiments of the present invention have been described above, the present invention is not limited to the configurations described in the embodiments, and various modifications are possible within the scope of the technical idea of ​​the present invention. In addition, some or all of the configurations described in each embodiment may be combined and applied. For example, the embodiments may be combined and applied, such as applying the embodiment 1 in combination with the embodiment 2 and the embodiment 3. [Explanation of symbols]

[0073] 101: Electronic control device 102: Circuit board 103: Chassis base 104: Case cover 105: Screw 201: Electronic parts 202: Thermal grease 203: EMI gasket (connecting material) 204: External connection connector 205: Surface mount components 206: Dielectric (connecting material) 207: Board-to-board connector 301: Heat dissipation protrusion (first protrusion) 302: Noise guide protrusion (second protrusion) 303: GND pattern connection part (second connection part) 304: Housing cover fixing screw hole 305: Board fixing screw hole 306: Housing opening for connector 307:Notch 308: Protrusion (second connection part) 309: Gasket joints around connectors 310:Boss for fixing screws on board 311: Boss for cover fixing screw 312: Noise guide protrusion member (second protrusion) 313: Waterway 400: Current loop

Claims

1. An electronic control device having a circuit board on which electronic components are mounted and a housing for accommodating the circuit board, the circuit board has a GND pattern; the housing has a conductive first convex portion and a conductive second convex portion that are convex toward the circuit board, the first protrusion is connected to the electronic component, the second protrusion has a first connection portion connected to an outer circumferential surface of the first protrusion, and a second connection portion connected to the GND pattern directly or via a connection member; The electronic control device is characterized in that the second convex portion has a shape such that the convex surface of the second convex portion is as close to the circuit board as or closer to the circuit board than the convex surface of the first convex portion between the electronic component and the second connection portion.

2. In claim 1, The electronic control device, wherein the connecting member is an EMI gasket or a screw.

3. In claim 1, The electronic control device, characterized in that the second protrusion has a portion that extends from a corner portion of the electronic component to which the first protrusion is connected in a direction away from the electronic component.

4. In claim 1, The electronic control device according to claim 1, wherein the second protrusion has a bent portion whose extension direction changes when viewed in a plan view.

5. In claim 1, The electronic control device according to claim 1, wherein the second protrusion has a notch at a position that overlaps with a component mounted on the circuit board.

6. In claim 1, The first projection is provided in a plurality of portions, An electronic control device, characterized in that the second convex portion connected to one of the first convex portions and the second convex portion connected to the other of the first convex portions have a common second connection portion.

7. In claim 1, the circuit board has the electronic components mounted on both sides; The electronic control device characterized in that the housing has a first housing facing one main surface of the circuit board and having the first convex portion and the second convex portion, and a second housing facing the other main surface of the circuit board and having the first convex portion and the second convex portion.

8. In claim 1, The electronic control device, wherein the second protrusion has a width that narrows from the first connection portion toward the second connection portion.

9. In claim 1, The electronic control device, wherein the second protrusion is thinner on a side closer to the circuit board than on a side farther from the circuit board.

10. In claim 1, the second connection portion is a protrusion formed on a surface of the second protrusion, The electronic control device, wherein the second connection portion is connected to the GND pattern directly or via the connection member made of a dielectric.

11. In claim 1, The electronic control device is characterized in that the second convex portion has a wall-like portion arranged in a position that blocks at least one side of the first convex portion when viewed in the direction of the first convex portion from a position away from the first convex portion.

12. In claim 1, The electronic control device, wherein the second protrusion is connected to a screw that fixes the circuit board or to a structure that connects the housing and the circuit board.

13. In claim 1, The electronic control device, wherein the second protrusion is formed of a separate member from the housing.

14. In claim 1, A plurality of the circuit boards are provided, At least one of the circuit boards is connected to the second protrusion.

Citation Information

Patent Citations

  • Shield structure of case

    JP2005294627A

  • Electronic control unit

    JP2022173233A