Bump formation device, bump formation method, solder ball repair device, and solder ball repair method

Abstract

To provide a highly reliable soldering device and method in extremely fine solder bump formation.SOLUTION: A bump forming device for supplying a solder ball onto an electrode pad formed on a substrate includes: a plasma generation device for irradiating the supplied solder ball with plasma to remove an oxide film of the solder ball; and a laser generation device for irradiating the solder ball with laser to melt the solder ball. By removing the oxide film of the solder ball by plasma irradiation means and at the same time melting the solder ball by laser irradiation means, a solder bump is formed on the electrode pad.SELECTED DRAWING: Figure 14

Description

[Technical field]

[0001] The present invention relates to a bump forming apparatus and a bump forming method for mounting solder balls on a substrate in an electrode manufacturing process for a package substrate used in a semiconductor device, and a solder ball repair apparatus and a solder ball repair method for inspecting the formed electrodes and repairing defective portions. [Background technology]

[0002] In recent years, bump formation techniques using solder have been used for electrical connections in semiconductor devices. For example, there is a solder paste printing method in which a high-precision screen printing device is used to print solder paste on electrodes on a substrate and then reflow the solder paste to form solder bump electrodes with a diameter of 80 to 100 μm at a pitch of 150 to 180 μm.

[0003] Additionally, with the trend toward finer electrodes due to the miniaturization and high performance of semiconductor devices, a new method is available in which solder balls are inserted into a jig with highly accurate micro-holes, aligned at a specified pitch, and then directly mounted on a substrate and reflowed to form solder bump electrodes.

[0004] In this background art, Japanese Patent Laid-Open Publication No. 2000-049183 (Patent Document 1) discloses a method in which solder balls are supplied from an air nozzle onto a mask, the mask is swung and vibrated while filling predetermined openings with the solder balls, and furthermore, the solder balls are filled by the translational motion of a brush or squeegee, and then heated. However, not all solder balls are necessarily mounted correctly on each bump formation position, and in some cases mounting defects may occur.

[0005] Therefore, JP 2003-309139 A (Patent Document 2) discloses a technology in which a solder ball repair device is installed, the defective solder ball is sucked into a tubular member, and then removed. A new good solder ball is then adsorbed onto the tubular member, which is then transported and re-mounted on the defective part, and a laser light irradiation unit irradiates laser light from the inside of the tubular member to melt the solder ball and temporarily fix it.

[0006] Furthermore, Japanese Patent Laid-Open Publication No. 2008-288515 (Patent Document 3) and Japanese Patent Laid-Open Publication No. 2009-177015 (Patent Document 4) disclose a solder ball printing device that includes an inspection and repair unit that inspects the condition of a board on which solder balls are printed and repairs the board if there is a defect.

[0007] Furthermore, JP 2010-010565 A (Patent Document 5) discloses a solder ball inspection and repair device that inspects the condition of solder balls mounted on electrode pads of a substrate and is equipped with a repair dispenser that supplies solder balls to electrode pads where defects are detected.

[0008] Further, there are Patent No. 3173338 (Patent Document 6), Patent No. 3822834 (Patent Document 7), and Patent No. 5098648 (Patent Document 8) which are methods for heating solder balls, JP 2015-103688 A (Patent Document 9) which is methods for removing oxide films using plasma, and JP 2003-309139 A (Patent Document 10) which is methods for heating and melting using a laser. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] JP 2000-049183 A [Patent Document 2] JP 2003-309139 A [Patent Document 3] JP 2008-288515 A [Patent Document 4] JP 2009-177015 A [Patent Document 5] JP 2010-010565 A [Patent Document 6] Patent No. 3173338 [Patent Document 7] Patent No. 3822834 [Patent Document 8] Patent No. 5098648 [Patent Document 9] JP 2015-103688 A [Patent Document 10] JP 2003-309139 A Summary of the Invention [Problem to be solved by the invention]

[0010] Currently, technologies compatible with 5G (fifth generation mobile communication system) are beginning to be put into practical use. In addition, the diameter of the solder balls used to form the bump electrodes is also becoming extremely small, from 70 to 80 μm to 30 to 50 μm or less. As the bump electrodes become extremely fine due to the miniaturization, high speed, and large capacity of semiconductor devices used in 5G, even when reflow is performed using the technologies and devices disclosed in the above-mentioned patent documents, problems such as solder wettability and intermetallic compound (IMC) layers cause problems such as soldering defects and cracks, which can lead to reduced reliability of the solder joint interface and defects in the solder bump electrodes.

[0011] With the technology disclosed in Patent Document 2, there is a high probability that the amount of remaining flux will be small after repair. If the solder wettability is poor during reflow, there is a risk of poor wetting occurring, resulting in incomplete soldering to the electrode pad when the solder ball melts.

[0012] In addition, in the solder ball inspection and repair device for the solder ball printer disclosed in Patent Documents 3 to 5, and the technology disclosed in Patent Documents 6 to 10, when reinspection is performed after reflow, solder balls are mounted, and repair is performed, even if the newly resupplied solder balls are coated with flux, the electrode pads are damaged (affected) by the oxidizing effect of the preceding reflow process, so there is a high probability of soldering defects occurring. Also, compared to normal soldering, there is a possibility that problems will occur in the soldering reliability.

[0013] Therefore, the present invention aims to provide an apparatus that inspects bump defects that occur on electrode pads of a substrate, resupplies and repairs solder balls to the defective electrode portion, and solders the defective electrode portion. Another object of the present invention is to provide a highly reliable repair soldering apparatus and method for repairing and soldering defective portions of bump electrodes after reflow in ultra-fine solder bumps. Another object of the present invention is to provide a highly reliable soldering apparatus and method for forming ultra-fine solder bumps. [Means for solving the problem]

[0014] In order to solve the above-mentioned problems, the bump forming apparatus of the present invention is a bump forming apparatus that supplies solder balls onto electrode pads formed on a substrate, and is equipped with a plasma generating device (plasma irradiation means) that irradiates the supplied solder balls with plasma to remove the oxide film of the solder balls, and a laser generating device (laser irradiation means) that irradiates the solder balls with a laser to melt the solder balls, and is characterized in that the oxide film of the solder balls is removed by the plasma irradiated from the plasma irradiation means, and at the same time, the solder balls are melted by the laser irradiated from the laser irradiation means, thereby forming solder bumps on the electrode pads.

[0015] Furthermore, the bump formation method of the present invention is a bump formation method in which a solder ball is supplied onto an electrode pad formed on a substrate, and is characterized in that after the solder ball is supplied to the electrode pad, the solder ball is irradiated with plasma and a laser to remove the oxide film on the solder ball and at the same time melt the solder ball and solder it to the electrode pad.

[0016] In addition, the solder ball repair apparatus of the present invention is characterized in that it comprises a repair dispenser that inspects the condition of solder bumps formed on electrode pads of a substrate and supplies solder balls to electrode pads where defects are detected, a plasma generating device that irradiates the solder balls supplied by the repair dispenser with plasma to remove the oxide film of the solder balls, and a laser generating device that irradiates the solder balls with a laser to melt the solder balls, and removes the oxide film of the solder balls while melting the solder balls and forming solder bumps on the electrode pads.

[0017] In addition, the solder ball repair method of the present invention is characterized in that it inspects the condition of a solder bump formed on an electrode pad of a substrate by a solder ball inspection process, supplies a solder ball by a repair dispenser to the electrode pad in which a defect is detected by the solder ball inspection process, and after supplying the solder ball to the electrode pad in which a defect is detected by the repair dispenser, irradiates the solder ball with plasma and irradiates it with a laser to remove the oxide film of the solder ball while melting the solder ball and soldering it to the electrode pad. Effect of the Invention

[0018] The present invention can provide an apparatus for inspecting bump defects that have occurred on electrode pads of a substrate, resupplying and repairing solder balls to the defective electrode portions, and soldering. It can also provide a highly reliable repair soldering apparatus and method for repairing and soldering defective portions of bump electrodes after reflow in ultrafine solder bumps. It can also provide a highly reliable soldering apparatus and method for forming ultrafine solder bumps.

[0019] Problems, configurations and effects other than those described above will become apparent from the description of the embodiments. [Brief description of the drawings]

[0020] [Figure 1] FIG. 1 is a schematic diagram showing the flux printing and solder ball mounting / printing processes. [Diagram 2] FIG. 1 is a schematic diagram illustrating the process from flux printing to solder ball inspection and repair. [Diagram 3] 1 is a flowchart showing a bump formation process. [Figure 4] FIG. 2 is a side view showing the overall structure of the solder ball supply head. [Diagram 5] FIG. 1 is a schematic diagram illustrating the solder ball mounting and printing operations. [Figure 6] FIG. 1 is a plan view showing an example of the state of a board after solder balls have been mounted and printed. [Figure 7] This is a schematic diagram showing a typical example of a defect after solder ball mounting and printing. [Figure 8] FIG. 1 is a schematic diagram explaining the repair work after solder ball mounting and printing. [Figure 9] FIG. 2 is a plan view illustrating a schematic configuration of the inspection and repair apparatus. [Figure 10] FIG. 2 is a side view showing the configuration of a repair dispenser. [Figure 11] 11 is an enlarged view for explaining the suction and separation operation of the solder ball at the tip of the repair dispenser. FIG. [Figure 12] 1 is an external view showing a plasma laser repair system according to an embodiment of the present invention; [Figure 13] FIG. 1 is an explanatory diagram illustrating a plasma laser repair device. [Figure 14] FIG. 2 is an explanatory diagram illustrating a plasma laser repair head portion. [Figure 15] 13 is a flowchart showing a plasma laser repair operation. [Figure 16] FIG. 11 is an explanatory diagram for explaining a plasma laser head part of the second embodiment. [Figure 17] FIG. 11 is an explanatory diagram for explaining the principle of a plasma laser head part in the second embodiment. [Figure 18] FIG. 11 is an explanatory diagram for explaining the configuration of a plasma laser head part of the second embodiment. [Figure 19] FIG. 11 is an explanatory diagram for explaining pulse irradiation in Example 2. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the apparatus and method according to the present invention will be described with reference to the accompanying drawings. EXAMPLES

[0022] Figure 1 shows an overview of the flux printing and solder ball mounting / printing processes.

[0023] As shown in FIG. 1(a), first, a predetermined amount of flux 23 is transferred onto electrode pads 22 of a substrate 21 by screen printing. In this embodiment, a metal screen manufactured by an additive method is used for the screen 20 to ensure high pattern position accuracy. Any of a square squeegee, a sword squeegee, and a flat squeegee may be used as the squeegee 3. First, conditions such as the screen gap, printing pressure, and squeegee speed are set according to the viscosity and thixotropy of the flux 23. Then, printing of the flux is performed under the set conditions.

[0024] If the amount of printed flux 23 is small, there is a risk that the solder balls will not be able to adhere to the electrode pads 22 when they are filled in. This will also cause poor solder wetting during reflow, making it impossible to form bumps with a good shape, resulting in poor bump height and insufficient solder connection strength.

[0025] Conversely, if there is too much flux, and excess flux adheres to the screen openings during solder ball mounting and printing, the solder balls will also adhere to the screen openings, making it impossible to transfer the solder balls onto the board. Thus, flux printing is a very important factor in maintaining the quality of solder ball mounting.

[0026] 1(b), solder balls 24 are mounted / printed on the electrode pads 22 of the substrate 21 on which the flux 23 has been printed. In this embodiment, solder balls with a diameter of about 30 μm are used. Note that as the bump electrodes become increasingly finer due to the miniaturization, speedup, and capacity increase of semiconductor devices, the diameter of solder balls is becoming increasingly small, down to 25 μm to 30 μm. The screen 20b used in mounting the solder balls 24 is a metal screen manufactured by an additive method so as to ensure high pattern position accuracy.

[0027] The screen 20b is made of a magnetic material such as nickel. This allows the screen 20b to be attracted by the magnetic force of the magnet 10s provided on the stage 10, making it possible to eliminate the gap between the substrate 21 and the screen 20b. This prevents the solder balls 24 from slipping between the substrate 21 and the screen 20b, which would otherwise cause excess balls.

[0028] In addition, minute resin or metal supports 20a are provided on the back surface of the screen 20b, forming an escape area in case the flux 23 bleeds. Therefore, when the substrate 21 on which the flux 23 is printed is brought into close contact with the screen 20b, the bleed of the flux 23 can be prevented from adhering to the inside of the opening of the screen.

[0029] Positioning marks (not shown) are provided at the four corners of the substrate 21. The positioning marks on the substrate 21 and the positioning marks (not shown) on the screen 20b side are visually recognized by a camera 15f (see FIG. 2) and aligned with high precision. This makes it possible to supply the solder balls 24 onto the specified electrode pads 22 with high precision.

[0030] The slit-shaped body 63 shown on the screen 20b is one element constituting a filling unit (see FIG. 4) for supplying solder balls. The filling unit moves in the direction of the arrow 60V while swinging the slit-shaped body 63, whereby the solder balls 24 are pushed and rolled, and are filled one after another into the openings 20d of the screen 20b.

[0031] FIG. 2 is a schematic diagram showing an embodiment of the process from flux printing to solder ball inspection and repair.

[0032] The device shown in FIG. 2 is configured by integrating a flux printing section 101, a solder ball mounting / printing section 103, and an inspection / repair section 104. Each section is connected by a belt conveyor 25, and the board is transported by the belt conveyor 25. The flux printing section 101 and the solder ball mounting / printing section 103 are provided with tables 10f and 10b for work. The tables 10f and 10b are moved up and down to deliver and receive the board. The tables 10f and 10b are also configured to be movable in the horizontal direction (XYθ direction). In addition, the screens 20 and 20b are configured to be aligned with the board by capturing images of alignment marks (not shown) of the screens 20 and 20b and the board by the cameras 15f and 15b. The board that has passed the inspection and repair section 104 is sent to the next process, a reflow section (not shown), where the solder balls mounted on the board are melted by heating and soldered onto the electrode pads to form bumps.

[0033] FIG. 3 shows a flow chart of the bump formation process in this embodiment.

[0034] First, the board is carried into the flux printing section (STEP 1). After that, a specified amount of flux is printed on the electrode pads (STEP 2). Next, the screen opening condition after flux printing is inspected (STEP 3). If the inspection results in NG (defective), the screen is automatically cleaned using the plate cleaning device installed in the printing device, and flux is supplied and replenished as necessary. Furthermore, NG boards are made to wait on the conveyor for the post-process together with an NG signal and discharged off the line so that they do not go through any processes after solder ball printing. It is also possible to discharge the entire magazine at once by using an in-line NG board stocker, etc. NG boards are cleaned in a process outside the line and can be used again for flux printing (STEP 4).

[0035] Solder ball mounting and printing are performed on non-defective boards (STEP 5). Once solder ball mounting and printing is complete, the filling status of the solder balls within the screen openings is inspected from above the screen before the screen is released (STEP 6). If any areas are found to be insufficiently filled, the solder ball mounting and printing operation is performed again (STEP 7). This makes it possible to improve the solder ball filling rate.

[0036] If the inspection in STEP 6 is OK, the plate is removed (STEP 8), and the mounting status of the solder balls is inspected using an inspection and repair device (STEP 9). If the inspection of the solder ball mounting status indicates NG, flux is supplied and then the solder balls are resupplied to the defective electrode pads (STEP 10). If the inspection of the mounting status indicates OK, the solder balls are melted in a reflow device (not shown) located in the next process (STEP 11), and the solder bumps are completed.

[0037] FIG. 4 is a side view showing the overall structure of the solder ball supply head, and is a diagram showing the configuration of the solder ball supply head (filling unit) for mounting solder balls on a substrate in the solder ball mounting / printing section.

[0038] The solder ball supply head 60 includes a ball case that stores the solder balls 24 in a space formed by a housing 61, a lid 64, and a slit-shaped body 63 that is provided below the slit-shaped body 62 at intervals. The slit-shaped body 62 is formed of an extremely thin metal plate having openings such as mesh-like openings or continuous rectangular slits so as to fit the diameter of the solder balls 24 to be supplied. The slit-shaped body 63 is disposed below the slit-shaped body 62 and is configured to come into surface contact with the screen 20b.

[0039] In addition, the degree of contact and gap of the slit-shaped body 63 with the screen 20b can be finely adjusted by the print head lifting mechanism 4 provided above the lid 64. The slit-shaped body 63 is formed of an extremely thin metal plate made of a magnetic material. By using a magnetic material, the slit-shaped body 63 can be attracted to the screen 20b made of a magnetic material by the magnetic force from the stage 10 provided with a magnet. The slit-shaped body 63 has, for example, a mesh-like opening or a continuous rectangular slit portion so as to fit the diameter of the target solder ball 24 and the dimensions of the opening 20d of the screen 20b.

[0040] Furthermore, the solder ball supply head 60 is equipped with a horizontal vibration mechanism that vibrates the septum-shaped body 62 provided in the ball case in the horizontal direction. The horizontal vibration mechanism is configured by attaching a vibration means 65 to a member formed in a position parallel to the side of the ball case, and providing a support member 70 to which the member is attached on the upper surface of the lid 64. With this configuration, the septum-shaped body 62 can be vibrated by vibrating the ball case from its side surface with the vibration means 65. By vibrating the septum-shaped body 62, the slit-shaped opening provided in the septum-shaped body 62 can be opened larger than the diameter of the solder ball 24. As a result, the solder ball 24 stored in the ball case falls from the slit portion of the septum-shaped body 62 onto the slit-shaped body 63. The number of solder balls 24 dropped onto the slit-shaped body 63, that is, the supply amount of the solder balls 24, can be adjusted by controlling the vibration energy applied by the vibration means 65.

[0041] The vibration means 65 uses an air rotary vibrator, and the vibration frequency can be controlled by finely adjusting the compressed air pressure by digital control. Alternatively, the vibration frequency can be varied by controlling the compressed air flow rate. The vibration means 65 causes the solder ball 62 and the ball case to vibrate the solder balls 24 housed in the ball case, counteracting and dispersing the suction force due to the van der Waals force acting between the solder balls 24. This dispersion effect makes it possible to prevent the amount of solder ball supply from changing due to the material of the solder balls 24 and the temperature and humidity in the production environment. This makes it possible to make adjustments taking production efficiency into consideration.

[0042] The solder ball supply head 60 is also provided with a horizontal swing mechanism for swinging the ball case in the horizontal direction. The horizontal swing mechanism is configured as follows. A linear guide 67 is provided on the upper part of a support member 70, and a filling head support member 71 is provided with a linear rail so that the linear guide 67 can move. A driving motor 68 is provided on this filling head support member 71, and an eccentric cam 66 is attached to the shaft of this driving motor 68. When the eccentric cam 66 rotates, the support member 70 moves (swings) in the horizontal direction. The filling head support member 71 is supported by the motor support member 2 and is configured not to move in the left-right direction relative to the motor support member 2.

[0043] That is, the horizontal swing mechanism rotates the eccentric cam 66 by the driving motor 68 to give a swinging motion to the slit-shaped body 63 in the horizontal direction with an arbitrary stroke amount. The slit-shaped body 63 swings while being attracted to the screen 20b by magnetic force, so that the solder balls 24 can be reliably rolled between the slit-shaped body 63 and the screen 20b without any gaps. In addition, the opening size of the slit-shaped body 63 allows efficient filling operation while reliably replenishing the solder balls 24 in the openings of the slit-shaped body 63. The cycle speed of the screen 20b and the swinging operation can be arbitrarily changed by controlling the speed of the driving motor 68, and the filling tact of the solder balls 24 can be set in consideration of the line balance. In addition, the filling rate can be controlled by adjusting the cycle speed according to the type of material of the solder balls 24, the openings of the screen 20b, and the environmental conditions.

[0044] Furthermore, the solder ball supply head 60 is provided with a spatula-shaped body 69. After the solder ball supply head 60 supplies the solder balls 24 onto the substrate 21, when the screen 20b is separated from the substrate 21 surface, that is, when the screen is separated and the solder balls are transferred onto the substrate, if there are any solder balls 24 remaining on the screen surface of the screen 20b, the solder balls 24 will fall onto the substrate 21 through the openings 20d of the screen 20b, causing excessive solder balls to be supplied. For this reason, in this embodiment, the spatula-shaped body 69 is provided at approximately the same height as the slit-shaped body 63, with a gap from the ball case in the direction of travel of the solder ball supply head 60. The tip of the spatula-shaped body 69 is polished to be extremely thin and highly flat, so that the solder balls 24 do not protrude outside the solder ball supply head 60 when in close contact with the screen 20b.

[0045] Furthermore, the spatula-shaped body 69 is made of a magnetic material and adheres to the screen 20b by magnetic force in the same manner as the slit-shaped body 63, preventing the solder balls 24 from protruding outside the solder ball supply head 60. The spatula-shaped body 69 may be configured to be provided over the entire outer periphery of the ball case. The spatula-shaped body 69 can minimize the number of balls remaining on the surface of the screen 20b.

[0046] However, the influence of the remaining balls due to minute displacement of the plate surface of the screen 20b is still conceivable. Therefore, in this embodiment, in order to further reduce defects due to excess solder balls, the solder ball supply head 60 is provided with an air blowing mechanism 75 for forming an air curtain.

[0047] That is, an air blowing mechanism 75 is provided on the motor support member 2 that supports the print head lifting mechanism 4, so as to form an air curtain around the filling unit. This air blowing mechanism 75 is configured so that compressed air is supplied from a compressed air supply source (not shown). When the air blowing mechanism 75 is used, when the solder ball supply head 60 moves toward the edge face of the board, the compressed air pushes and rolls the protruding solder balls toward the moving direction of the solder ball supply head 60. This makes it possible to prevent solder balls from remaining on the plate surface.

[0048] Next, the operation of mounting and printing the solder balls on the substrate will be described.

[0049] 5 is a schematic diagram for explaining the solder ball mounting and printing operation. In the solder ball mounting and printing operation, the solder ball supply head 60 and the sweeper 130 are mainly used.

[0050] First, as shown in (1), the solder ball supply head 60 moves in the longitudinal direction of the substrate 21 while vibrating the ball case with the horizontal vibration mechanism, and fills the openings in the screen 20b with solder balls. Also, as shown in (2), the solder ball supply head 60 moves back and forth in the horizontal direction (the direction of the arrow A) while also using the swinging action of the horizontal swinging mechanism to roll the solder balls and reliably fill the openings.

[0051] When the operation of filling the screen openings with solder balls is completed, the solder ball supply head 60 rises as shown by arrow B in (3). It then moves longitudinally above the substrate 21 as shown by arrow C in (4), and after returning to its original position, it descends to a position where it comes into contact with the screen 20b as shown by arrow D, where it stops.

[0052] Next, the sweeping operation by the sweeper 130 will be described.

[0053] The sweeper 130 is used to collect solder balls that unintentionally remain on the screen after the above-mentioned filling operation. As shown in Fig. 5, a plurality of squeegees 131 are formed on the bottom of the sweeper 130. The squeegees 131 are attached at a certain angle in the opposite direction to the moving direction of the sweeper 130 (details not shown). The squeegee 131 moves over the screen and strokes its surface, thereby sweeping up and collecting the solder balls on the screen like a broom.

[0054] When the filling operation by the solder ball supply head 60 is completed, as shown in (5), the sweeper 130 moves in the horizontal direction indicated by the arrow E while in contact with the screen 20b. That is, a plurality of squeegees 131 attached to the bottom of the sweeper 130 advances horizontally along the upper surface of the screen 20b. At this time, the solder balls remaining on the screen 20b are collected and dropped into the open openings of the screen 20b. This makes it possible to eliminate the no-ball defect as shown in Figs. 6 and 7 described later. Furthermore, all the solder balls on the screen 20b are swept out, so that finally no excess solder balls remain on the screen 20b.

[0055] When the sweeper 130 moves to the vicinity of the end of the screen 20b where the opening is present, it rises once as indicated by arrow F. It then returns in the longitudinal direction above the substrate 21 as indicated by arrow G in (6), and again descends to a position where it comes into contact with the screen 20b as indicated by arrow H. It then repeats a similar sweeping operation. This sweeping operation is performed several times until the solder balls on the screen 20b are completely swept away. In some cases, the sweeping operation may be limited to a portion of the screen 20b and then moved to another portion as indicated by arrow I in (7).

[0056] The above sweeping operation allows solder balls to be filled into all open openings, eliminating "no ball" defects. In addition, all excess solder balls on the screen 20b are eventually removed, preventing excess solder balls from getting into the openings of the screen 20b when the screen 20b is separated from the substrate 21. This makes it possible to eliminate double ball defects as shown in Figures 6 and 7, which will be described later.

[0057] Figure 6 shows an example of the state of solder balls on the board after solder ball mounting and printing.

[0058] When the board 21 is photographed with a camera, if the solder balls are filled well on all the electrodes, the state shown in (a) can be observed. (b) shows a state where the filling of some of the solder balls is incomplete (no ball defect). (c) shows a double ball state where the solder balls are stuck together, and a state where the excess solder balls protrude from the electrodes.

[0059] Figure 7 shows typical examples of defects after solder ball mounting and printing. As shown in Figure 7, examples of solder ball filling defects include a "no ball state" where no solder balls are filled, a "double ball state" where adjacent solder balls overlap, and a "misaligned ball state" where the solder ball is displaced from the flux application position of the electrode part.

[0060] If the board is sent to the next process (reflow process) in these conditions, a rejected product will be produced. Therefore, by inspecting the filling status on the board and retrying the mounting and printing operations using the above-mentioned filling unit (solder ball supply head), it is possible to correct the defective product to a good product. This detection can be made by pattern matching, which compares with a good product model. After solder ball mounting and printing, a line sensor camera (not shown) attached to the filling unit performs collective recognition on an area-by-area basis. If it is NG, solder ball mounting and printing are performed again. If it is pass, the mask is released and the board is discharged to the next process.

[0061] Figure 8 is a diagram explaining the repair work in the inspection and repair department after solder ball mounting and printing.

[0062] In the inspection and repair department, first, after the mounting and printing of the solder balls is completed, the filling status on the board is confirmed with a CCD (Charge Coupled Device) camera. Then, if a defect is detected, the position coordinates of the defective part are obtained. In the case of defects such as double balls, misaligned balls, and excess balls, as shown in (1), a vacuum suction nozzle 86, which is a removal dispenser, moves to the position of the defective solder ball 24x. Then, the defective solder ball 24x is vacuum-sucked and moved to a defective ball disposal station (not shown). At the defective ball disposal station, the ball is dropped and disposed of in a disposal box 83 (see Figure 9) by blocking the vacuum.

[0063] When an electrode pad portion to which a solder ball 24 has not been supplied is detected, or when a defective solder ball is removed by a vacuum suction nozzle 86, a normal solder ball 24 stored in a solder ball storage portion 84 is sucked by negative pressure using a repair dispenser 87, as shown in (2). Then, as shown in (3), the repair dispenser 87 that has sucked the normal solder ball 24 moves from the solder ball storage portion 84 to a flux supply portion 85. As shown in (4), the repair dispenser 87 that has sucked the solder ball 24 is moved to the flux 23 stored in the flux supply portion 85, and the solder ball 24 is immersed in the flux 23 (or the flux 23 is attached to the solder ball 24), thereby adding the flux 23 to the solder ball 24. After that, as shown in (5), the repair dispenser 87 that has sucked the solder ball 24 is moved to a defective portion on the board. Finally, as shown in (6), a solder ball 24 is supplied to the defective portion. The repair work is completed through steps (1) to (6) above.

[0064] In the above process, the removal dispenser can also be used as a flux supply dispenser, so that after removing the defective solder balls, flux can be supplied to the defective parts. In this case, the step of attaching flux does not need to be performed when supplying new solder balls.

[0065] If the above-mentioned inspection removes defective balls such as misaligned balls, it is possible to repair the defects by supplying normal solder balls to the correct positions through the above-mentioned repair work.

[0066] FIG. 9 is a diagram for explaining a schematic configuration of the inspection and repair device, and is a plan view of the inspection and repair unit as seen from above as a single independent device.

[0067] As shown in Fig. 9, when the substrate 21 to be inspected is carried in from the carry-in conveyor 81, it is transferred onto the inspection section conveyor 82 and transported in the direction of the arrow J. A gate-shaped frame 80 is provided above the inspection section conveyor 82. On the side of the carry-in conveyor 81 of the gate-shaped frame 80, a line sensor 79 is arranged perpendicular to the substrate transport direction (the direction of the arrow J). This line sensor 79 detects the state of the solder balls 24 printed on the electrode pads 22 on the substrate 21. Note that, although the line sensor 79 is provided as a solder ball state detector here, an imaging camera may be provided and moved in the longitudinal direction of the gate-shaped frame 80 to image the state of the solder balls and detect defects.

[0068] A solder ball storage section 84 that stores normal solder balls, and a flux supply section 85 are provided on one leg side supporting gate-shaped frame 80. A disposal box 83 is provided on the other leg side. Gate-shaped frame 80 is provided with a vacuum suction nozzle 86, which is a removal dispenser for sucking and removing defective solder balls, and a repair dispenser 87 for repairing defects on the board, which are movable horizontally (in the direction of arrow K) by linear motors.

[0069] The inspection section conveyor 82 is configured to be able to reciprocate in the direction of arrow J and in the opposite direction, and is configured so that the position of a repair dispenser 87 or a vacuum suction nozzle 86 can be aligned with the position of a defect in the board 21 depending on the position of the defect. After inspection and repair, the board 21 is carried out by an unloading conveyor 88 and sent to a reflow device. With the above configuration, it is possible to perform inspection and repair by the operations described in FIG. 8.

[0070] FIG. 10 is a side view showing the configuration of the repair dispenser, and FIG. 11 is an enlarged view explaining the solder ball suction and separation operation at the tip of the repair dispenser.

[0071] 10, the repair dispenser 87 is formed with a suction nozzle 90, for example made of plastic, for holding and moving solder balls (however, the material is not limited to plastic). The suction nozzle 90 is tapered upward from a tip end 98. In other words, the suction nozzle 90 is shaped so that its width increases from the tip end 98 toward a base end 99. A through hole 92 is formed in the suction nozzle 90.

[0072] 11, the through-hole 92 is also tapered upward (although not as much as the shape of the suction nozzle 90). That is, the through-hole 92 is formed so that it becomes wider toward the upper part and narrower toward the lower part. More specifically, the through-hole 92 is formed so that the inner diameter of an opening end 92a provided at the lower end of the through-hole 92 is approximately the same as the outer diameter of a shaft 91 described below. A negative pressure is applied to the internal space of the through-hole 92 by a negative pressure application mechanism (not shown).

[0073] The suction nozzle 90 is fixed to a nozzle support frame 94 by bolts or the like. The nozzle support frame 94 is connected to a drive unit 96. Therefore, the suction nozzle 90 can freely move up and down together with the drive unit 96.

[0074] A mandrel 91 is inserted into and held in a through hole 92 in the suction nozzle 90 via a seal member (not shown). The mandrel 91 is, for example, a cylindrical metal rod with a diameter of about 10 μm, and is made of a material that is strong and difficult to be charged (however, the shape (diameter) and material of the mandrel 91 are not limited to the above, and it is preferable that the shape (diameter) and material of the mandrel 91 are smaller than the diameter of the solder ball 24). Except for the opening end 92a of the through hole 92, the outer diameter of the mandrel 91 is smaller than the inner diameter of the through hole 92, and the mandrel 91 can freely move up and down in the axial direction of the suction nozzle 90. An upper end 91a of the mandrel 91 is fixed to a support member 93. The support member 93 is connected to a motor 95, and can freely move up and down together with the mandrel 91.

[0075] The support member 93 and the drive unit 96 are connected via a linear rail 97, so that the support member 93 and the drive unit 96 can move up and down independently of each other. That is, the spindle 91 attached to the support member 93 and the suction nozzle 90 connected to the drive unit 96 can move up and down independently of each other.

[0076] In this manner, the support member 93, the nozzle support frame 94, the motor 95, the drive unit 96, the linear rail 97, etc. constitute a drive mechanism.

[0077] 10(b), the lower end surface of the support member 93 comes into contact with the upper end surface of the suction nozzle 90. In this contact state, the lower end portion 91b of the spindle 91 protrudes downward from the tip portion 98 of the suction nozzle 90. In order to achieve the above function, the total length A of the spindle 91 is configured to be longer than the total length B of the suction nozzle 90.

[0078] As shown enlarged in Fig. 11, the tip 98 of the suction nozzle 90 is machined into a tapered groove shape so as to easily hold the solder ball 24. Because the tip 98 of the suction nozzle 90 is machined into a tapered groove shape, when the solder ball 24 is vacuum-sucked, the solder ball 24 fits snugly and well into the tapered groove, making it difficult for the solder ball 24 to come off from the tip 98. By making the groove of the tip 98 spherical like the shape of the solder ball 24, even better suction is possible. However, the shape of the tip 98 is not limited to the above.

[0079] Next, the operation of repairing a defect in a solder ball using the repair dispenser configured as above will be described.

[0080] First, a new solder ball 24 (diameter approximately 30 μm) to be repaired is sucked by the suction nozzle 90 of the repair dispenser 87. At this time, negative pressure is supplied into the suction nozzle 90 via the through hole 92, so that the solder ball 24 is vacuum-sucked to the tip 98 of the suction nozzle 90. Although not shown, a structure is provided to prevent negative pressure from leaking from the upper part of the through hole 92 into which the mandrel 91 is inserted. At this time, the mandrel 91 is retracted inward (upward) from the tip 98 of the suction nozzle 90, as shown in FIG. 10(a).

[0081] In this suction state, the solder ball 24 is transported above the electrode pad 120 at the defective location, and the repair dispenser 87 is lowered toward the electrode pad 120 to place the solder ball 24 in the flux 121 on the electrode pad 120, as shown in FIG. 11(a).

[0082] Next, the motor 95 is driven to move the mandrel 91 down through the through hole 92 of the suction nozzle 90 until the lower end 91b of the mandrel 91 abuts against the solder ball 24. As a result, the mandrel 91 presses the solder ball 24 against the electrode pad 120, as shown in FIG. 11(b). As described above, the outer diameter of the mandrel 91 and the inner diameter of the opening end 92a of the through hole 92 are substantially the same, so that the mandrel 91 blocks the opening end 92a of the through hole 92 during the movement of the mandrel 91. As a result, the gap in the through hole 92 becomes narrow, and even if negative pressure is applied, the resulting vacuum suction (negative pressure) force becomes small, and the solder ball 24 becomes freely detachable from the suction nozzle 90.

[0083] Therefore, with the above configuration, there is no need to provide a separate vacuum pump valve for blocking negative pressure, which leads to cost reduction.

[0084] Next, while the solder ball 24 is pressed against the electrode pad 120 by the mandrel 91 as shown in FIG. 10(b), the suction nozzle 90 is raised as shown in FIG. 11(b) to separate it from the solder ball 24.

[0085] Finally, the motor 95 is driven to raise the mandrel 91 again and separate it from the solder ball 24. At this time, the contact area between the mandrel 91 and the solder ball 24 is very small, so even if static electricity is generated, it is so small that it can be ignored, and the mandrel 91 and the solder ball 24 are smoothly separated without any problems.

[0086] As described above, the solder ball inspection and repair device according to an embodiment of the present invention (hereinafter sometimes referred to as the solder ball repair device) is provided with a mandrel 91 that can move up and down within the repair dispenser 87, and when the solder ball 24 is supplied to a defective portion, the mandrel 91 physically presses the solder ball 24 against the electrode pad 120 while the suction nozzle 91 is pulled up and away from the solder ball 24, thereby enabling the solder ball to be mounted efficiently and reliably on the electrode pad.

[0087] Furthermore, since the above-mentioned functions are realized with a simple configuration without using expensive equipment such as a laser light irradiation device for mounting the solder balls, it is possible to keep the manufacturing costs of the device low.

[0088] Next, a plasma laser repair system according to an embodiment of the present invention will be described below. Fig. 12 is an external view showing the plasma laser repair system according to an embodiment of the present invention.

[0089] As the bump electrodes become finer due to the miniaturization, speedup, and capacity increase of semiconductor devices, for example, when defects in the solder bump electrodes are inspected and repaired by the inspection and repair unit 104 shown in FIG. 2, even after reflow, there may be cases where there are improper solder ball filling, such as a "no ball state" where no solder ball is filled, a "double ball state" where adjacent solder balls overlap, and a "misaligned ball state" where the solder ball is displaced from the position where the flux is applied to the electrode part, as shown in FIG. 7.

[0090] In these cases, even if there is only one defective solder ball, the product is rejected, so the filling status on the board is inspected again (for a second time) and the loading operation is tried again by the filling unit (solder ball supply head), making it possible to repair the defective product to a good product. This detection can be done by pattern matching, which compares with a good product model.

[0091] Therefore, the plasma laser repair system shown in this embodiment re-inspects the board that has passed through the reflow device, and re-supplies and re-repairs the defective electrode part where the bump on the electrode pad of the board has a defect. For such ultra-fine solder bumps, the plasma laser repair system shown in this embodiment is a highly reliable repair soldering device that repairs and solders the defective part of the bump electrode after reflow.

[0092] The plasma laser repair system shown in this embodiment is installed in the post-process of the inspection and repair section 104 shown in FIG. 2 and in the post-process of a reflow device (not shown). The plasma laser repair system is not limited to being installed in the post-process of the inspection and repair section 104 shown in FIG. 2 or in the post-process of a reflow device, and may be installed as a single system. For convenience, the plasma laser repair system installed as a single system, such as offline, may be referred to as a bump forming device, and a method of forming bumps using this device may be referred to as a bump forming method. The bump forming device mounts solder balls on each of a plurality of electrode pads formed on a substrate, and reflows the solder balls to form bumps on the electrode pads.

[0093] In this embodiment, the plasma laser repair system is described as being installed in the process following the reflow section, which is located after the inspection and repair section 104 shown in FIG. 2. In this case, the plasma laser repair system may be installed either online or offline. That is, substrates having bump electrodes on which defective portions have been detected after reflow may be distributed to this plasma laser repair system online, and substrates having bump electrodes on which defective portions have been detected after reflow may be stocked and distributed to this plasma laser repair system offline. In this embodiment, the offline case will be described.

[0094] In addition, when the plasma laser repair system is used as the next process of the reflow section located after the inspection and repair section 104 shown in Fig. 2, that is, when it is online, each section may be controlled so that boards in which no defective portions are detected simply pass through this plasma laser repair system. In this case, the series of devices, that is, the so-called manufacturing line configuration, can be simplified.

[0095] The plasma laser repair system has an input stage (BF(LD)) for inputting a substrate (a substrate having a bump electrode in which a defective portion was detected after reflow), an inspection and repair unit (IR) for performing inspection and repair work on the substrate after reflow, a laser repair unit (LR) for fixing (soldering or welding) the repaired solder ball to the electrode pad, and an output stage (BF(ULD)) for outputting the repaired substrate. The control unit (control unit (hereinafter CON) or control means) is a control unit that controls the input stage (BF(LD)), inspection and repair unit (IR), laser repair unit (LR), and output stage (BF(ULD)) to a predetermined state as a whole.

[0096] The devices shown in Fig. 2, i.e., the flux printing unit 101, the solder ball mounting / printing unit 103, and the inspection / repair unit 104, are also controlled by a series of control flows as shown in Fig. 3, and the series of control flows and the CON may be linked by connecting individual control devices with dedicated communication means or the like, or may be configured as an integrated control device. (See Fig. 12 for a configuration diagram of the series of systems.) Of course, when the flux printing unit 101, the solder ball mounting / printing unit 103, and the inspection / repair unit 104 shown in Fig. 2, the reflow unit (not shown) arranged in the next process, and the carry-in stage (BF(LD)), the inspection / repair unit (IR), the laser repair unit (LR), and the carry-out stage (BF(ULD)) shown in Fig. 12 are configured as a series of systems, they may all be controlled by one control device.

[0097] The inspection and repair unit (IR) also has the function of a solder ball inspection device that inspects the condition of the solder balls, such as the inspection and repair section 104 shown in Figure 2. If the inspection of the solder ball mounting condition results in an NG (defects are detected), flux is supplied to the solder balls and then the solder balls are resupplied to the electrode pad portion of the defective area using a repair dispenser such as that shown in Figure 10.

[0098] As a basic example, the repair work is performed in steps (1) to (6) shown in Fig. 8. As a basic example of the device configuration, the device configuration shown in Fig. 9 and Fig. 10 is applied. At this time, position data of where the solder balls are resupplied is acquired, and this position data may be linked to an inspection and repair unit (IR) or a laser repair unit (LR) by transmitting the position data to the inspection and repair unit (IR) or a laser repair unit (LR) by a dedicated communication means or the like.

[0099] Next, a plasma laser repair device, which is the laser repair unit (LR), will be described with reference to FIG.

[0100] The plasma laser repair device has a plasma laser repair head unit 200, an alignment stage 216 on which a substrate 215 is placed, and a stage movement axis 218 for moving the alignment stage 216 in the horizontal direction (XYθ direction). The plasma laser repair head unit 200 may be movable in the horizontal direction (XYθ direction). This allows the repaired solder ball (solder ball position) to be pinpoint (locally) irradiated with plasma and laser. The plasma can also be expressed as emission or radiation, but in this embodiment, both are referred to as irradiation.

[0101] The plasma laser repair device then moves the alignment stage 216 in the horizontal direction (XYθ direction) based on the position data transmitted from the inspection and repair unit (IR). The plasma laser repair head unit 200 may also be moved based on this position data.

[0102] In the embodiment, the case where the alignment stage 216 is moved in the horizontal direction (XYθ direction) is described, but the plasma laser repair head unit 200 may be configured to be movable in the X and Y directions, and the alignment stage 216 may be configured to be movable in the θ direction. Alternatively, the repair head may be configured to move in the X, Y, and θ directions relative to the stage on which the substrate 215 is placed.

[0103] Next, the plasma laser repair head 200 will be described with reference to FIG.

[0104] The plasma laser repair head unit (which also functions as a bump forming device) 200 moves to the location of the repaired solder ball, pinpoints and preheats the solder ball, irradiates the solder ball with plasma to remove (oxidize and reduce) the oxide film (e.g., with a thickness of several nm to several μm) on the solder ball, and after removing the oxide film (oxide coating), irradiates it with a laser (laser light) to cause localized reflow.

[0105] The plasma laser repair head 200 has a laser unit (sometimes called a laser head or a laser generator (meaning a laser irradiation means)) 205 that irradiates the solder balls with a laser in a spot manner to heat and melt the solder balls, a plasma unit (sometimes called a microplasma head or a plasma generator (meaning a plasma irradiation means)) that irradiates the solder balls with plasma in a spot manner, and a spot heater 210 that applies spot preheating to the solder balls (the substrate or electrode pad (e.g., copper pad) on which the solder balls are arranged).The unit also has a unit fixing plate 219 that fixes at least the laser unit 205 and the plasma unit.

[0106] In this embodiment, for example, a spot heater 210 using infrared rays or the like is used to apply preheating in a spot, but a hot plate that preheats the substrate 215 to a predetermined temperature (for example, about 150 to 180° C.) may also be used.

[0107] Also, a defocused laser may be used instead of the spot heater 210 to preheat the periphery of the solder ball. The defocused laser heats the periphery of the solder ball, and an infrared laser, for example, may be used as the defocused laser. Note that the focus of the defocused laser is preferably larger than the focus of the laser irradiated from the laser unit 205.

[0108] Moreover, the laser emitted from the laser unit 205 is preferably irradiated in a pulsed manner (15 to 25 KHz, for example, microwave). By irradiating the solder balls with a pulsed laser, the oxide film on the solder balls can be efficiently removed. This is because the impact of irradiating the laser in a pulsed manner and using the thermoacoustic effect can efficiently crack the oxide film formed on the surface of the solder ball.

[0109] The plasma laser repair head 200 also has an actuator 202 for moving the unit fixing plate 219 in the vertical direction (Z-axis direction), and a motor 201 for driving the actuator 202. This allows at least the laser unit 205 and the plasma unit to move in the vertical direction, and to match the laser irradiation direction and the plasma irradiation direction with the mounted solder balls. The actuator 202 is fixed to the head frame 203.

[0110] The plasma unit includes a plasma electrode 213 that applies a high-frequency voltage to generate plasma, a plasma antenna 211 to which the high-frequency voltage is applied and which generates an electric field, a plasma capillary 212 which is a plasma discharge tube into which gas is introduced, and a plasma nozzle 214 which ejects the generated plasma. This allows the plasma to be irradiated in a spot manner onto the solder ball. In this embodiment, the plasma electrode 213, the plasma antenna 211, the plasma capillary 212, and the plasma nozzle 214 are arranged in a straight line. The arrangement of these is arbitrary, and is not limited as long as the arrangement allows the plasma to be irradiated in a spot manner onto the solder ball.

[0111] Then, the medium gas is used to generate plasma, and in this embodiment, a mixture gas of 97-97.5% argon and 3-2.5% hydrogen by weight is used as the gas to be plasma. The type and mixture ratio of these gases are arbitrary, and the type and mixture ratio of the gas may be appropriately selected depending on the device configuration or the electrode pad or solder ball to be irradiated. This gas is introduced into the plasma capillary 212 from the plasma electrode 213 side. It is preferable that the plasma unit irradiates the electrode pad and / or solder ball with plasma containing argon gas. It is also preferable that the medium gas is argon gas containing 1-4% hydrogen by weight.

[0112] In this case, the hydrogen becomes radical and is activated, which removes the oxide film formed on the surface of the solder ball. In principle, the oxygen in the oxide film combines with the hydrogen, turning into water vapor, which removes the oxide film.

[0113] Laser unit 205 also has observation camera 206 for observing the state of the solder ball, laser light guiding port 207 for introducing laser light, collimating lens 208 for correcting aberration to obtain parallel laser light, and condensing lens 209 for condensing the parallel laser light. In this embodiment, observation camera 206 and condensing lens 209 are arranged in a straight line, and are arranged perpendicular to the linear axis of laser light guiding port 207, collimating lens 208, and observation camera 206 and condensing lens 209.

[0114] That is, the state of the solder ball is observed in a straight line by the observation camera 206, and the laser light is refracted by 90 degrees and irradiated onto the solder ball. This allows the solder ball to be irradiated with the laser in a spot manner. Note that this device configuration is one example, and the arrangement is not limited to these configurations. Also, the observation camera 206 is not necessarily required as a device configuration.

[0115] It is preferable that the linear axis of the plasma unit, the linear axis of the laser unit 205, and the axis of the spot heater 210 converge to one point so as to face one solder ball. In other words, the plasma unit and the laser unit 205 are arranged so that the intersection (focal point) of the plasma irradiation axis of the plasma unit (linear axis of the plasma unit) and the laser irradiation axis of the laser unit 205 (linear axis of the laser unit 205) is located at a position that is approximately the center of the solder ball, and the placement position of the board is controlled so that the solder ball to be repaired is located at this intersection. Of course, the control of the board placement position is relative, and the plasma laser head may be moved and controlled to a predetermined position.

[0116] The angle between the laser irradiation axis of the laser unit 205 and the plasma irradiation axis of the plasma unit is not particularly limited, but it is sufficient as long as the solder ball to be repaired can be irradiated with laser and plasma, and it is preferable to adjust it to about 0 to 180 degrees, depending on the device configuration or the state of the solder ball to be repaired. In other words, when this angle is 0 degrees, the laser irradiation axis and the plasma irradiation axis are in the same direction, which means that, for example, the laser and plasma are irradiated to the solder ball from above, and when this angle is 180 degrees, the laser irradiation axis and the plasma irradiation axis are opposed to each other, which means, for example, the laser and plasma are irradiated to the solder ball from the left and right directions, respectively.

[0117] In this embodiment, the linear axis of the plasma unit, the linear axis of the laser unit 205, and the axis of the spot heater 210 are each disposed at a predetermined angle with respect to the Z axis, and are disposed at an angle of 90°. In other words, the plasma unit and the laser unit 205 irradiate the solder ball supplied to the electrode pad with plasma or laser substantially at the center.

[0118] In addition, the plasma unit and laser unit 205 preferably irradiates approximately the upper half of the solder ball supplied to the electrode pad with plasma or laser, i.e., preferably irradiates the solder ball with plasma or laser from above.

[0119] The linear axis of the plasma unit, the linear axis of the laser unit 205, and the axis of the spot heater 210 do not necessarily have to be arranged at a predetermined angle with respect to the Z axis. For example, the linear axis of the laser unit 205 may be parallel to the Z axis (coaxial with the Z axis), and the linear axis of the plasma unit and the axis of the spot heater 210 may be arranged at a predetermined angle with respect to this. The linear axis of the plasma unit and the axis of the spot heater 210 may also be parallel to the Z axis. The axis of the laser unit 205 and the axis of the plasma unit may be parallel, or these axes may be coaxial.

[0120] Furthermore, the plasma laser repair head unit 200 may be provided with a substrate height displacement meter 204 for measuring the height (GAP height) from the tip (substrate side) of the laser unit 205 to the substrate, and an alignment camera 217 for observing solder ball filling defects on the substrate. The substrate height displacement meter 204 and the alignment camera 217 may be fixed to a unit fixing plate 219, and the spot heater 210 may also be fixed to the unit fixing plate 219.

[0121] This makes it possible to spot irradiate the substrate 215 placed on the alignment stage 216 and the solder balls arranged on the substrate 215 with a laser, spot irradiate with plasma, and spot preheat the substrate 215.

[0122] Also, by using the spot heater 210 to preheat the spot, it is not necessary to preheat the entire board, and thermal damage to the board can be suppressed. Also, by using the laser unit 205 to irradiate the spot with the laser, it is not necessary to reflow the entire board, and thermal damage to the board and healthy solder balls can be suppressed.

[0123] That is, this embodiment is a solder ball repair device or bump formation device equipped with a laser unit 205 that irradiates a solder ball with a laser and a plasma unit that irradiates a solder ball with plasma, and irradiates a specific solder ball with plasma and laser together or simultaneously. Here, "together" or "simultaneously" irradiation includes irradiating plasma prior to laser irradiation in time, and means that the times of irradiation of each overlap.

[0124] That is, if the oxide film of the solder ball is removed by irradiating the plasma and then irradiating the laser, the solder ball is activated by the plasma, and due to this time difference, an oxide film is formed on the solder ball before the laser is irradiated. However, by irradiating them together or simultaneously, it is possible to suppress the generation of the oxide film on the solder ball. Therefore, it is not necessarily required to fill the processing chamber with an inert gas such as nitrogen gas and perform the removal processing of the oxide film of the solder ball under an inert gas atmosphere. In this embodiment, the environment in which the plasma laser repair device is installed is an atmospheric environment. Note that this embodiment does not prevent the plasma laser repair device from being covered and the inside of the covered device being made into a nitrogen environment.

[0125] The plasma laser repair system uses a control unit (CON) to control the simultaneous irradiation of plasma from the plasma unit and laser from the laser unit. The CON also controls the irradiation of plasma to the solder balls prior to the laser irradiation of the solder balls supplied by the repair dispenser. The CON also controls the preheating of the solder balls by a spot heater 210 prior to the plasma irradiation and laser irradiation.

[0126] In addition, the CON is a control unit that controls the plasma irradiation by the plasma unit and the laser irradiation by the laser unit in the bump formation process, and controls so that a time period is secured (a time period exists) during which the plasma irradiation by the plasma unit and the laser irradiation by the laser unit are simultaneously performed. In addition, in the bump formation process, the CON controls so that the plasma irradiation by the plasma unit is performed prior to the laser irradiation by the laser unit. In addition, in the bump formation process, the CON controls so that the solder balls and the surroundings of the solder balls are preheated prior to the plasma irradiation and laser irradiation.

[0127] A flowchart of the plasma laser repair operation is shown in Figure 15. The CON appropriately controls each part according to this operation flowchart.

[0128] First, the substrate 215 is carried into the carrying stage of the plasma laser repair device (STEP 1). Thereafter, position data is received from the inspection and repair unit (IR) (STEP 2). Then, the substrate 215 is placed on the alignment stage 216 (STEP 3). Based on the received position data, for example, the alignment stage 216 is moved to place the substrate 215 at a predetermined position (STEP 4).

[0129] Thereafter, when the positioning is completed, the motor 201 is driven to move the actuator 202 downward (in the Z-axis direction) so that the tip of the laser unit 205 is at the set GAP height (gap height) (STEP 5). This GAP height is checked by the substrate height displacement meter 204 (STEP 6). If there is no problem with this GAP height (OK), proceed to the next STEP. If there is a problem with this GAP height, the actuator 202 is moved downward so that the tip of the laser unit 205 is at the set GAP height (gap height), and this GAP height is checked again by the substrate height displacement meter 204.

[0130] The GAP height is checked by the board height displacement meter 204, and if there is no problem, the spot heater 210 preheats the solder balls (board 215 and electrode pads on which the solder balls are arranged) to, for example, about 150 to 180° C. (STEP 7). Then, it is checked by, for example, a thermometer (not shown) whether the temperature of the solder balls (board 215 and electrode pads on which the solder balls are arranged), particularly the temperature of the board 215, has reached a set temperature (STEP 8). If this temperature has reached the set temperature, proceed to the next STEP. If this temperature has not reached the set temperature, preheating is continued by the spot heater 210. Or, the output of the spot heater 210 is increased to promote a temperature rise. Then, it is checked again whether this temperature has reached the set temperature.

[0131] Furthermore, the GAP height is checked using the substrate height displacement meter 204, and if there is no problem, the plasma unit irradiates plasma onto the solder balls in spots (STEP 9). Then, it is checked, for example, by the observation camera 206 whether the solder balls and / or electrode pads have been oxidized and reduced (the oxide film formed on the surface of the solder balls has been removed) (STEP 10). In this case, when the oxide film formed on the surface of the solder ball is removed, the solder ball appears to shine purple. This makes it possible to confirm that the oxide film has been removed. If the oxidation-reduction is complete, the process proceeds to the next step. If the oxidation-reduction is not complete, the plasma continues to be irradiated. Then, it is confirmed again whether the oxidation-reduction is complete or not. This also includes the case where the oxide film on the electrode pad is removed, and then the oxide film on the solder ball is removed. If the observation camera 206 is not installed, the time at which the oxidation-reduction is completed may be set in advance, and the process may proceed to the next step based on the set time.

[0132] After confirming that the temperature of the substrate 215 has reached the set temperature and that the solder balls have been oxidized and reduced, the laser unit 205 irradiates the solder balls with a laser, raising the temperature of the solder balls to, for example, about 250°C in about 2 seconds, melting the solder balls and fixing (soldering or welding) them to the electrode pads (STEP 11). This makes it possible to eliminate solder ball filling defects.

[0133] Thereafter, the repaired substrate 215, which has no more solder ball filling defects, is unloaded from the unloading stage (STEP 12).

[0134] In this way, it is preferable that the timing of the plasma irradiation by the plasma unit to irradiate the solder balls with plasma is earlier than the timing of the laser irradiation by the laser unit 205 to irradiate the solder balls with a laser, and that the plasma continues to be irradiated while the laser is being irradiated. In other words, it is preferable that there is a time period during which the plasma and the laser are irradiated together or simultaneously. It is also preferable that the timing of the preheating by the spot heater 210 to preheat the solder balls is earlier than the timing of the laser irradiation by the laser unit 205 to irradiate the solder balls with a laser, and that the preheating continues while the laser is being irradiated.

[0135] That is, simultaneously or together, the solder ball is irradiated with plasma, the solder ball is irradiated with a laser, the oxide film on the solder ball is removed, and the solder ball is melted and soldered to the electrode pad. It is also possible to simultaneously or together preheat the solder ball, irradiate the solder ball with plasma, irradiate the solder ball with a laser, remove the oxide film on the solder ball, melt the solder ball and solder the solder ball to the electrode pad. In other words, "together or simultaneously" means that there is an overlapping time period.

[0136] Also, before placing the solder ball, the electrode pad may be irradiated with plasma to remove the oxide film on the electrode pad, and then the solder ball may be placed, the solder ball may be irradiated with plasma to remove the oxide film on the solder ball, and at the same time, a laser may be irradiated onto the solder ball to melt the solder ball and solder it to the electrode pad.

[0137] In this manner, the solder ball repair method or bump formation method described in this embodiment is a method in which the condition of the solder bumps formed on the electrode pads of the substrate 215 is inspected by a solder ball inspection process, and a solder ball is supplied by a repair dispenser to the electrode pads in which defects are detected by the solder ball inspection process.

[0138] In the solder ball repair method or bump formation method, a solder ball is supplied to an electrode pad where a defect has been detected by a repair dispenser, and then the solder ball is irradiated with plasma and a laser to remove the oxide film of the solder ball while melting the solder ball and soldering the solder ball to the electrode pad. In the solder ball repair method or bump formation method, a plasma is irradiated to an electrode pad where a defect has been detected by a repair dispenser to remove the oxide film of the electrode pad, and then a solder ball is supplied to the electrode pad, and the plasma and laser are irradiated to the solder ball to remove the oxide film of the solder ball while melting the solder ball, and the solder ball is fixed (soldered or welded) to the electrode pad.

[0139] The bump forming apparatus or bump forming method can also be considered as supplying solder balls 24 onto electrode pads 22 formed on a substrate 21.

[0140] This makes it possible to inspect bump defects that occur on the electrode pads of the substrate, resupply and repair the defective electrode with solder balls, and perform soldering. In addition, for ultra-fine solder bumps, highly reliable repair soldering can be performed as repair and soldering to defective parts of the bump electrodes after reflow.

[0141] Thus, the solder ball repair device or bump forming device described in this embodiment targets solder balls on electrode pads 22 of substrate 215, and is equipped with a repair dispenser that inspects the condition of the solder bumps formed on electrode pads 22 of substrate 215 and supplies solder balls to electrode pads where defects are detected.

[0142] The solder ball repair device or bump forming device is equipped with a plasma unit (plasma generating device) that irradiates the solder balls supplied by the repair dispenser with plasma to remove the oxide film on the solder balls, and a laser unit (laser generating device) 205 that irradiates the solder balls with a laser to melt the solder balls, and while removing the oxide film on the solder balls or at the same time, melts the solder balls and forms solder bumps on the electrode pads (soldering the solder balls to the electrode pads).

[0143] The solder ball repair device or bump forming device also includes a plasma unit (plasma generating device) that irradiates plasma onto an electrode pad where a defect has been detected to remove the oxide film, and also irradiates plasma onto a solder ball supplied by a repair dispenser to remove the oxide film from the solder ball, and a laser unit (laser generating device) 205 that irradiates the solder ball with a laser to melt the solder ball, and removes the oxide film from the electrode pad where a defect has been detected, and at the same time as removing the oxide film from the solder ball, melts the solder ball, and solders the solder ball to the electrode pad (forms a solder bump on the electrode pad).

[0144] Moreover, the laser unit 205 preferably irradiates the laser onto the upper portion of the solder ball supplied to the electrode pad. Moreover, the laser unit 205 preferably irradiates the laser substantially perpendicularly to the surface of the solder ball supplied to the electrode pad. Moreover, the laser unit 205 preferably irradiates the laser with a spot diameter suitable for the solder ball diameter, and this spot diameter is preferably substantially the same as or smaller than the solder ball diameter.

[0145] It is also preferable that the plasma unit irradiates the electrode pad with plasma over an area wider than the diameter of the solder ball or the electrode pad, thereby making it possible to efficiently remove the oxide film.

[0146] In the above explanation, removing the oxide film of the solder ball by plasma irradiation and melting the solder ball by laser irradiation at the same time means not only performing plasma irradiation and laser irradiation simultaneously for the same period or time period, but also having at least a period during which they are irradiated simultaneously, or having at least a time period during which they are irradiated simultaneously. Therefore, plasma irradiation may be performed prior to laser irradiation, plasma irradiation may be stopped while laser irradiation is being performed, or vice versa.

[0147] Furthermore, even if plasma irradiation and laser irradiation are switched instantaneously or for a short period of time, as long as the difference in time between removal of the oxide film by plasma irradiation is short enough that melting by laser irradiation does not cause any problems, this means that there is at least a period of simultaneous irradiation, or at least a time zone of simultaneous irradiation.

[0148] In addition, it is preferable that the timing of the plasma irradiation by the plasma unit to irradiate the electrode pads and / or solder balls with plasma is earlier than the timing of the laser irradiation by the laser unit 205 to irradiate the solder balls with laser, and that the plasma continues to be irradiated while the laser is being irradiated. In other words, it is preferable that there is a time period during which the plasma and the laser are irradiated simultaneously.

[0149] In particular, the solder balls irradiated with plasma have activated surfaces that are easily oxidized, and are oxidized again as soon as the plasma irradiation is stopped. Therefore, it is important to irradiate the solder balls with the laser while irradiating them with the plasma.

[0150] In this manner, in the solder ball repair device described in this embodiment, the solder balls and / or electrode pads provided on the electrode pads of the substrate 215 are irradiated with plasma while the solder balls are irradiated with a laser.

[0151] In addition, the solder ball repair device described in this embodiment is explained as being equipped with spot heater 210. However, this is not necessarily necessary depending on the product type, materials, and other circumstances, and may be omitted in some cases. However, by providing this spot heater 210 and controlling it as in the embodiment, the laser output can be reduced.

[0152] According to this embodiment, the solder balls are soldered onto the electrode pads with little damage, and repair and soldering can be performed efficiently and reliably.

[0153] Furthermore, according to this embodiment, the laser and plasma are irradiated only to the area where the defect has occurred, so the time required for soldering is short and repairs can be completed with a simple line configuration without using a batch reflow process, making it possible to keep the manufacturing costs of the device low.

[0154] Furthermore, according to this embodiment, only the defective electrode pad portion can be repaired and soldered using laser and plasma, so less energy is required for re-soldering and a large amount of heat is not generated, making it possible to provide an energy-saving and environmentally friendly system.

[0155] Furthermore, according to this embodiment, only the defective portion can be repaired and soldered using laser and plasma, so the area that needs to be re-soldered is narrow and no thermal history is applied to the non-defective portions that have already been reflow soldered, enabling highly reliable repair and soldering. EXAMPLES

[0156] Next, a plasma laser head 300 according to a second embodiment will be described with reference to Fig. 16. In describing the second embodiment, differences from the first embodiment will be described.

[0157] The plasma laser repair head unit 300 moves to the solder ball position, applies pinpoint spot preheating to the solder ball 24, irradiates the solder ball 24 with plasma to remove the oxide film of the solder ball 24, and after the oxide film is removed, irradiates the solder ball 24 with a laser to locally reflow or form a bump.

[0158] The plasma laser repair head section 300 has a laser unit (laser generating device (meaning laser irradiation means)) 305 that irradiates solder balls 24 with a laser in a spot manner to heat and melt the solder balls, a plasma unit (plasma generating device (meaning plasma irradiation means)) 306 that irradiates solder balls 24 with plasma in a spot manner, and a spot heater 210 that preheats solder balls 34 in a spot manner. It also has a unit fixing plate 219 that fixes at least the laser unit 305 and the plasma unit 306.

[0159] In the second embodiment, the laser irradiation axis of laser unit 305 and the plasma irradiation axis of plasma unit 306 are coaxial in the vicinity of solder ball 24, and plasma or laser is irradiated from above (directly above) onto solder ball 24. The axis of spot heater 210 is set so as to face one solder ball 24 to be irradiated with plasma or laser. As a result, the laser irradiation axis of laser unit 305, the plasma irradiation axis of plasma unit 306, and the axis of spot heater 210 are focused on one solder ball 24.

[0160] Next, the principle of the plasma laser head unit 300 of the second embodiment will be described with reference to FIG.

[0161] In the second embodiment, the laser emitted from the laser unit 305 is introduced in the horizontal direction, reflected in the vertical direction by the half mirror 309, and irradiated onto the solder balls 24 from above the solder balls 24.

[0162] In the second embodiment, the plasma emitted from the plasma unit 306 is also emitted to the solder balls 24 from above the solder balls 24 .

[0163] The plasma unit 306 uses hollow cathode discharge to generate high density plasma, and has a plasma electrode 313 that applies a high frequency voltage to generate plasma. The high frequency voltage to generate plasma is supplied from an electrode power supply 314 that supplies a high frequency voltage to the plasma electrode 313, and gas to become plasma is supplied from a gas supply unit 315, and plasma is generated in the plasma generation region. In particular, in the second embodiment, the gas is supplied from a horizontal direction so as to be the same as the laser introduction direction. In other words, the laser introduction direction and the gas supply direction are the same. This allows the plasma laser head unit 300 to be made compact.

[0164] In this way, in the second embodiment, the laser penetrates the plasma generation region, and the plasma and the laser are simultaneously irradiated onto the solder balls 24. This makes it possible to efficiently irradiate the solder balls 24 with the plasma and the laser simultaneously.

[0165] Furthermore, by making the laser irradiation axis of laser unit 305 and the plasma irradiation axis of plasma unit 306 coaxial, there is no need to align the laser irradiation axis of laser unit 305 with the plasma irradiation axis of plasma unit 306, and plasma and laser can be efficiently irradiated onto solder ball 24.

[0166] Also in the second embodiment, an observation camera 206 such as a microscope is installed. The observation camera 206 observes the state of the solder balls 24 from above (directly above) through a half mirror 309. However, the observation camera 206 is not necessarily required as an apparatus configuration.

[0167] When observation camera 206 is not installed, half mirror 309 is not installed, and laser unit 305 is installed above (directly above) solder balls 24, so that the solder balls 24 can be directly irradiated with a laser.

[0168] Also in the second embodiment, the spot heater 210 is used to apply preheat to the solder balls 34 in a spot manner. However, instead of the spot heater 210, a defocused laser may be used to preheat the periphery of the solder balls.

[0169] In particular, when observation camera 206 is not installed, the defocused laser can be passed through half mirror 309 and irradiated onto solder ball 24 from above (directly above) solder ball 24. In other words, the irradiation axis of the defocused laser is made coaxial with the laser irradiation axis of laser unit 305 and the plasma irradiation axis of plasma unit 306 in the vicinity of solder ball 24. This makes it possible to efficiently preheat the periphery of solder ball 24.

[0170] Next, the configuration of the plasma laser head 300 of the second embodiment, in particular the configuration of the plasma unit 306, will be described with reference to FIG.

[0171] The plasma unit 306, which irradiates the solder balls 24 with plasma in spots, uses hollow cathode discharge to generate high-density plasma.

[0172] 18, member 330 is a guide path component member that configures the gas guide path, and is formed in a substantially cylindrical shape. In member 330, gas guide path 331 is linearly formed in the axial direction by appropriate drilling or the like.

[0173] The upper end of the gas guide path 331 is wide open, and the lower end is narrowed to open in a nozzle shape. A gas supply port 332 is formed on the side of the gas guide path 331, and a gas to be turned into plasma is supplied from a gas supply unit 315 to the gas guide path 331.

[0174] A member 320 is installed at one open end of the gas guide path 331 so as to close the opening. Member 320 is not particularly limited as long as it seals one end of gas guide path 331 and transmits laser light, which will be described later, but is generally made of quartz glass (hereinafter, member 320 will be referred to as a quartz glass plate).

[0175] An O-ring 321 is sandwiched between the quartz glass plate 320 and the member 330, and a lid 316 with an opening in the center is screwed onto the member 330 above it. As a result, the quartz glass plate 320 is pressed against the O-ring 321 side, and one end of the gas guide path 331 is sealed. (Note that the method is not limited to the screwing method as long as the quartz glass plate 320 can be sealed.) With this configuration, gas guided from gas supply unit 315 through gas inlet 317 and gas supply port 332 is guided by gas guide path 331 and sprayed downward from a nozzle formed at the lower end of gas guide path 331.

[0176] Quartz glass plate 322 is also installed at the nozzle-shaped, open lower end of gas guide path 331. With the same configuration as above, quartz glass plate 322 arranged at this lower end is pressed against O-ring 323 by O-ring 323 and cover 324, and one end of gas guide path 331 is sealed (except for a first hole portion described below).

[0177] Plasma electrodes 313 made of tungsten are installed on the upper and lower surfaces of the quartz glass plate 322 installed at the bottom, and a high frequency voltage is applied to excite the gas and generate plasma. An electrode power supply line for supplying high voltage and high frequency voltage from an electrode power supply 314 is connected to the plasma electrode 313 .

[0178] In the lower quartz glass plate 322, a first hole portion having a diameter of about 0.5 to 0.8 mm, similar to the nozzle tip formed at the lower end of the gas guide path 331 and opening in a nozzle shape, is formed. Furthermore, second holes are also formed in the plasma electrodes 313 installed on the upper and lower surfaces of the lower quartz glass plate 322. The diameter of the second holes is larger than or approximately equal to the diameter of the first holes.

[0179] Plasma is generated around the plasma electrode 313 (near the second hole) by supplying a high voltage and a high frequency voltage from the electrode power supply 314 to the plasma electrode 313, and this becomes the plasma generation region 318. Then, this generated plasma is irradiated from the lower opening formed in the lid 324 toward the solder ball 24 located below.

[0180] This irradiation can be adjusted by the supply pressure of the gas from the gas supply 315 . The pressure of the gas supplied from the gas supply unit 315 is set to an appropriate pressure so that the solder balls 24 mounted on the substrate do not fly off or move (displace) from the designated electrodes due to the gas pressure.

[0181] It is preferable that the diameter of the opening at the bottom of the lid 324 is approximately equal to the diameter of the first hole, or larger than the diameter of the first hole.

[0182] The laser emitted from laser unit 305 is introduced horizontally, reflected vertically by half mirror 309, passes through the opening at the top of lid body 316, penetrates the upper quartz glass plate 320 installed on component 330, passes through gas guide path 331, passes through the first hole portion, the second hole portion, and the opening at the bottom of lid body 324, and is irradiated onto solder ball 24 from above.

[0183] As in Example 1, the gas (medium gas) is preferably argon gas containing 1 to 4% by weight of hydrogen. In this case, too, the gas is excited by plasma electrode 313, which is a high-frequency power source (e.g., 5 kV, 50 Hz), and the gas is turned into radicals and plasma.

[0184] As a result, the laser irradiation axis of laser unit 305 and the plasma irradiation axis of plasma unit 306 become coaxial in the vicinity of solder ball 24, and the laser penetrates plasma generation region 318, so that the plasma and laser are simultaneously irradiated onto solder ball 24. This allows the plasma and laser to be efficiently irradiated onto solder ball 24 at the same time.

[0185] In the second embodiment, a plasma generation method was used in which hollow cathode discharge was used to generate high-density plasma, but the plasma generation method is not limited to this, and may be, for example, a method in which gas is excited by a high-frequency coil.

[0186] In addition, in the second embodiment, a hollow cathode discharge is used, and a plasma electrode is provided on the gas outlet side of the gas guide path 331 to generate plasma. However, the position of the plasma electrode is not limited to the gas outlet side in the embodiment, and it may be provided in any part of the gas flow path.

[0187] As described above, by carrying out the procedure of the second embodiment, it is possible to obtain a bump forming device which has a gas supply port 332 for supplying a gas for generating plasma to a side of the gas supply port 332, one end of which is sealed with a light-transmitting member (e.g., quartz glass plate 320) that transmits laser light, and a linearly formed gas guide path 331 which guides the gas supplied from the gas supply port 332 so as to be irradiated onto the solder balls mounted on the substrate, plasma generating means (e.g., plasma electrode 313) which surrounds a part of the distribution path from the gas guide path 331 to the solder balls and applies a high voltage / high frequency power source to the gas to turn the gas into plasma, and laser generating means (e.g., laser unit 305) which irradiates the generated laser light onto the solder balls through the light-transmitting member and the center of the gas distribution path and the plasma generation region, and which removes the oxide film of the solder balls with plasma and melts the solder balls with laser light to form bumps.

[0188] Next, the pulsed laser irradiation to which the second embodiment is applied will be described with reference to FIG.

[0189] The laser emitted from the laser unit 305 is preferably irradiated in a pulsed manner (15 to 25 kHz). By irradiating the solder balls 24 with a pulsed laser, the oxide film on the solder balls can be efficiently removed. This is because the impact of irradiating the laser in a pulsed manner and using the thermoacoustic effect can efficiently crack the oxide film formed on the surface of the solder ball.

[0190] Thus, according to the second embodiment, since soldering can be performed by laser and plasma, the soldering range is narrow, and highly reliable soldering is possible in the formation of ultrafine solder bumps.

[0191] As described above, according to this embodiment, the bump forming apparatus, the bump forming method, the solder ball repair apparatus, and the solder ball repair method have been described based on preferred embodiments. However, the present invention is not limitedly construed by the above embodiments. That is, the present invention can be implemented in various modifications and various forms without departing from its spirit and main features.

Explanation of Reference Numerals

[0192] 1... printing apparatus, 2... printing head, 3... squeegee, 4... motor, 10... printing table, 15... camera, 20, 20b... screen, 20d... opening, 21... substrate, 22... electrode pad, 23... flux, 24... solder ball, 60... solder ball supply head, 87... repair dispenser, 90... suction nozzle, 91... mandrel, 91a... upper end portion, 91b... lower end portion, 92... through hole, 92a... opening end portion, 93... support member, 94... nozzle support frame, 95... motor, 96... drive unit, 97... linear rail, 98... tip portion, 99... base end portion, 120... electrode pad, 121... flux, 130... sweeper, 131... squeegee, 200... plasma laser repair head portion, 201... motor, 202... actuator, 203... head frame, 204... substrate height displacement meter, 205... laser unit, 206... observation camera, 207... laser light guide port, 208... collimating lens, 209... condensing lens, 210... spot heater, 211... plasma antenna, 212... plasma capillary, 213... plasma electrode, 214... plasma nozzle, 215... substrate, 216... alignment stage, 217... alignment camera, 218... stage movement axis, 219... unit fixing plate, 300... plasma laser head portion, 305... laser unit, 306... plasma unit, 309... half mirror, 313... plasma electrode, 314... electrode power supply, 315... gas supply unit, 316... lid, 317... gas introduction portion, 318... plasma generation region, 320... member, quartz glass plate, 321... O-ring, 322... quartz glass plate, 323... O-ring, 324... lid, 330... member, 331... gas guide path, 332... gas supply port.

Claims

1. A bump forming apparatus that supplies solder balls to electrode pads formed on a substrate includes a plasma generating device that irradiates the supplied solder balls with plasma to remove oxide films on the solder balls, and a laser generating device that irradiates the solder balls with a laser to melt the solder balls, a bump forming apparatus comprising: a plasma generating device that irradiates the solder ball with plasma to remove an oxide film on the solder ball; and a laser generating device that irradiates the solder ball with laser to melt the solder ball and form a solder bump on the electrode pad.

2. 2. The bump forming apparatus according to claim 1, A bump forming apparatus comprising a control unit that controls the plasma irradiation by the plasma generating device and the laser irradiation by the laser generating device, and the control unit controls so that there is a time period during which the plasma irradiation by the plasma generating device and the laser irradiation by the laser generating device are irradiated simultaneously.

3. 3. The bump forming apparatus according to claim 2, The bump forming apparatus, wherein the control unit controls the plasma generating device to irradiate plasma prior to the laser irradiation by the laser generating device.

4. 2. The bump forming apparatus according to claim 1, A bump forming apparatus, characterized in that an axis of plasma irradiation by said plasma generating device and an axis of laser irradiation by said laser generating device are coaxial.

5. 2. The bump forming apparatus according to claim 1, a bump forming apparatus for preheating the solder ball and the periphery of the solder ball prior to the plasma irradiation and the laser irradiation on the solder ball;

6. 6. The bump forming apparatus according to claim 5, 4. The bump forming apparatus according to claim 1, wherein the preheating is performed by a spot heater which preheats the solder balls in a spot manner.

7. 6. The bump forming apparatus according to claim 5, 4. A bump forming apparatus, comprising: a bump forming step of: preheating the periphery of the solder ball by using a defocused laser;

8. 2. The bump forming apparatus according to claim 1, a laser generating device for generating a laser beam from the laser generating device to the solder balls in a pulsed manner;

9. 2. The bump forming apparatus according to claim 1, 2. A bump forming apparatus, wherein the plasma generating device generates plasma by using hollow cathode discharge.

10. A bump forming apparatus that supplies solder balls to electrode pads formed on a substrate includes a plasma generating device that irradiates plasma onto the electrode pads to remove oxide films on the electrode pads, the plasma generating device then supplies solder balls to the electrode pads, irradiates the supplied solder balls with the plasma to remove oxide films on the solder balls, and a laser generating device that irradiates a laser onto the solder balls to melt the solder balls, a bump forming apparatus which removes an oxide film from the solder ball and melts the solder ball at the same time to form a solder bump on the electrode pad.

11. A bump formation method for supplying a solder ball to an electrode pad formed on a substrate, the bump formation method comprising the steps of: supplying the solder ball to the electrode pad, irradiating the solder ball with plasma and irradiating it with a laser, thereby removing an oxide film on the solder ball and melting the solder ball to solder it to the electrode pad.

12. A bump formation method for supplying a solder ball to an electrode pad formed on a substrate, comprising the steps of: irradiating the electrode pad with plasma to remove an oxide film on the electrode pad; supplying a solder ball to the electrode pad; irradiating the solder ball with plasma and irradiating it with a laser to remove the oxide film on the solder ball and at the same time melt the solder ball and solder it to the electrode pad.

13. A solder ball repair device that inspects the condition of solder bumps formed on electrode pads of a substrate and has a repair dispenser that supplies solder balls to electrode pads where defects are detected, a plasma generating device that irradiates the solder balls supplied by the repair dispenser with plasma to remove oxide films on the solder balls, and a laser generating device that irradiates the solder balls with a laser to melt the solder balls, A solder ball repair device, characterized in that the oxide film on the solder ball is removed, and at the same time, the solder ball is melted and a solder bump is formed on the electrode pad.

14. 14. The solder ball repair apparatus according to claim 13, A solder ball repair device comprising a control unit which controls so that there is a time period during which the plasma generation device irradiates plasma and the laser generation device irradiates laser simultaneously.

15. 15. The solder ball repair device according to claim 13, A solder ball repair device characterized in that plasma irradiation is performed prior to laser irradiation.

16. 16. The solder ball repair device according to claim 13, 14 or 15, a plasma generating device that generates a plasma for generating a solder ball on an electrode pad having a defect detected by the repair dispenser;

17. A solder ball repair device that inspects the condition of solder bumps formed on electrode pads of a substrate and has a repair dispenser that supplies solder balls to electrode pads where defects are detected, a plasma generating device that irradiates plasma onto the electrode pad in which the defect has been detected, thereby removing an oxide film thereon, and also irradiates plasma onto the solder balls supplied by the repair dispenser, thereby removing an oxide film thereon; and a laser generating device that irradiates a laser onto the solder balls, thereby melting the solder balls; A solder ball repair device characterized by removing an oxide film from an electrode pad where a defect has been detected, and removing an oxide film from the solder ball, while melting the solder ball and soldering the solder ball to the electrode pad.

18. 15. The solder ball repair device according to claim 13, The solder ball repair device is characterized in that the laser generating device irradiates the solder ball with a laser having a spot diameter substantially the same as a diameter of the solder ball.

19. 15. The solder ball repair device according to claim 13, The solder ball repair device is characterized in that the plasma generating device irradiates plasma substantially at the center of the solder ball supplied to the electrode pad.

20. 15. The solder ball repair device according to claim 13, The solder ball repair device is characterized in that the plasma generating device irradiates plasma onto approximately an upper half portion of the solder ball supplied to the electrode pad.

21. 15. The solder ball repair device according to claim 13, The solder ball repair device is characterized in that the laser generating device irradiates a laser onto approximately the center of the solder ball supplied to the electrode pad.

22. 15. The solder ball repair device according to claim 13, The solder ball repair device is characterized in that the laser generating device irradiates a laser onto approximately an upper half portion of the solder ball supplied to the electrode pad.

23. 15. The solder ball repair device according to claim 13, The solder ball repair device is characterized in that the plasma generating device irradiates plasma onto the electrode pad over an area wider than the diameter of the solder ball or the diameter of the electrode pad.

24. 15. The solder ball repair device according to claim 13, The solder ball repair apparatus is characterized in that the plasma generating device generates plasma by using a medium gas.

25. 25. The solder ball repair apparatus according to claim 24, The medium gas is argon gas containing 1 to 4% by weight of hydrogen.

26. 15. The solder ball repair device according to claim 13, A solder ball repair device, characterized in that an angle between an irradiation axis of the laser generating device and an irradiation axis of the plasma generating device can be adjusted within a range of 0 to 180 degrees.

27. A solder ball repair device that inspects the condition of solder bumps formed on electrode pads of a substrate and has a repair dispenser that supplies solder balls to electrode pads where defects are detected, A solder ball repair apparatus comprising: a plasma generating device that irradiates the solder ball supplied by the repair dispenser with plasma to remove an oxide film on the solder ball; and a laser generating device that irradiates the solder ball with a laser to melt the solder ball.

28. A solder ball repair method comprising: inspecting a state of a solder bump formed on an electrode pad of a substrate by a solder ball inspection process; and supplying a solder ball by a repair dispenser to an electrode pad in which a defect is detected by the solder ball inspection process, A solder ball repair method characterized by supplying a solder ball to an electrode pad where a defect has been detected by the repair dispenser, irradiating the solder ball with plasma and a laser to remove the oxide film on the solder ball while melting the solder ball and soldering it to the electrode pad.

29. A solder ball repair method comprising: inspecting a state of a solder bump formed on an electrode pad of a substrate by a solder ball inspection process; and supplying a solder ball by a repair dispenser to an electrode pad in which a defect is detected by the solder ball inspection process, A solder ball repair method comprising the steps of: irradiating a plasma onto an electrode pad in which a defect has been detected by the repair dispenser to remove an oxide film on the electrode pad; then supplying a solder ball to the electrode pad; and irradiating the solder ball with plasma and a laser to fix the solder ball to the electrode pad.

30. 14. The solder ball repair apparatus according to claim 13, A solder ball repair apparatus, characterized in that the plasma irradiation axis of said plasma generating device and the laser irradiation axis of said laser generating device are coaxial.

31. 14. The solder ball repair apparatus according to claim 13, A solder ball repair apparatus, comprising: a step of preheating the solder ball and the periphery of the solder ball prior to the irradiation of the plasma and the laser on the solder ball.

32. 32. The solder ball repair apparatus according to claim 31, 4. The solder ball repair apparatus according to claim 1, wherein the preheating is performed by a spot heater that preheats the solder balls in a spot manner.

33. 32. The solder ball repair apparatus according to claim 31, A solder ball repair apparatus, characterized in that the preheating is performed by a defocused laser that preheats the periphery of the solder ball.

34. 32. The solder ball repair apparatus according to claim 31, A solder ball repair device, characterized in that the laser emitted from the laser generating device is irradiated onto the solder balls in a pulsed manner.

35. 32. The solder ball repair apparatus according to claim 31, 2. A solder ball repair apparatus, wherein the plasma generating device generates plasma by using hollow cathode discharge.

36. a linear gas guide path having one end sealed with a light transmitting member that transmits laser light and having a gas supply port on one side for supplying a gas for generating plasma, the gas supplied from the gas supply port being guided so as to be irradiated onto a solder ball mounted on a substrate; a plasma generating means for surrounding a part of the gas flow path from the gas guide path to the solder ball and applying a high voltage and high frequency power source to the gas to generate plasma of the gas; a laser generating means for irradiating the generated laser light to the solder ball through the light transmitting member, the gas flow path, and the central portion of the plasma generating region; the plasma is used to remove an oxide film from the solder balls, and the laser light is used to melt the solder balls to form bumps.

37. A bump forming apparatus that supplies solder balls onto electrode pads formed on a substrate and melts the solder balls to form bumps, a unit fixing plate that fixes a plasma unit that irradiates a specific solder ball supplied to an electrode pad with plasma to remove an oxide film on the solder ball and a laser unit that irradiates the specific solder ball with a laser to melt the solder ball so that the irradiation direction of each unit is fixed to irradiate the specific solder ball; a driving means for positioning the unit fixing plate so that the irradiation direction of each unit irradiates the specific solder ball; A bump forming apparatus comprising:

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