Liquid discharge head manufacturing method

Abstract

To suppress variation in quality of a dry film when creating a plurality of dry films by spin coating.SOLUTION: A liquid discharge head manufacturing method has: a step at which a resist is dropped onto a surface of a base film fixed onto a supporter to be placed on a chuck; and a step at which spin coating is performed by use of the chuck in the state where the base film, onto which the resist has been dropped, is fixed onto the supporter. In a plan view of viewing the supporter in the state of being placed on the chuck in a direction of a rotation axis of the chuck, the supporter has asymmetric configuration with respect to the rotation axis of the chuck.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The technique disclosed herein relates to a manufacturing method for a liquid ejection head that performs a recording operation by ejecting liquid. [Background technology]

[0002] In semiconductor manufacturing technology, there is a process of applying resist to a substrate or base film in order to obtain a thin resist film with a high uniformity of thickness. When laminating resist on a substrate, the resist is applied directly to the substrate, and the desired pattern is formed by performing exposure and development. When laminating resist on a substrate in which an ink supply port is formed, the resist cannot be applied directly to the substrate. Therefore, the resist is applied to a base film fixed to a support to prepare a dry film, which is then transferred to the substrate by lamination, and the desired pattern is formed on the substrate by performing exposure and development.

[0003] Spin coating is a common resist coating technique. In spin coating, a support with a substrate or base film fixed thereon is carried into a coating device, the support is fixed on a chuck, and the resist dropped onto the base film is spread out at a high speed of 100 rpm to 5000 rpm. Since the support is larger than the substrate, the size of the chuck on which the support is placed and the coating cup into which the support is carried are also adjusted to the size of the support.

[0004] When the size of the coating cup becomes large, there is a concern that various issues may arise during spin coating. One of these issues is the generation of cotton candy-like foreign matter when the chuck rotates. One of the causes of the generation of cotton candy-like foreign matter is insufficient exhaust from within the coating cup. If the exhaust performance of the coating cup of the coating device is poor, cotton candy-like foreign matter may float in the coating cup during spin coating and adhere to the resist.

[0005] As a method for preventing quality degradation due to the adhesion of foreign matter to the resist during spin coating, the technology of Patent Document 1 has been proposed. According to Patent Document 1, the process of rotating the chuck at high speed and the process of discharging liquid onto the outer periphery of the base film are carried out simultaneously, and the liquid discharged onto the outer periphery is dried. This makes it possible to prevent the quality of the dry film from being degraded by foreign matter generated during spin coating, even if the coating device does not have sufficient exhaust performance. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2018-176077 A Summary of the Invention [Problem to be solved by the invention]

[0007] However, even if the technology disclosed in Patent Document 1 is used, when the support is placed on the chuck, and the resist is dropped and spin-coated, there is a concern that the size of the device will increase if the rotation axis of the chuck and the center of the support are aligned. In addition, the position of the support during spin-coating is not stable on the chuck, and the positions of the rotation axis of the chuck and the center of the support may vary each time the resist is dropped and spin-coated. As a result, the center of the obtained resist film varies with respect to the center of the support. When the resist film with the center position shifted in this way is baked to form a dry film and attached to a substrate, the position of the dry film attached to the substrate may be offset from the substrate center.

[0008] If the dry films are attached to the board with their centers misaligned, The dry film in the areas not in contact with the plate may become burrs, which may adhere to the dry film and reduce the quality of the dry film.

[0009] The technology disclosed herein has been made in consideration of the above, and aims to reduce variation in quality of dry films when multiple dry films are produced by spin coating. [Means for solving the problem]

[0010] In order to achieve the above-mentioned object, the manufacturing method for a liquid ejection head according to the present disclosure includes a step of dripping resist onto a surface of a base film fixed on a support placed on a chuck, and a step of performing spin coating using the chuck while the base film with the resist dripped thereon is fixed on the support, and includes a manufacturing method for a liquid ejection head characterized in that, when viewed in a planar view in the direction of the rotation axis of the chuck while the support is placed on the chuck, the support has an asymmetric configuration with respect to the rotation axis of the chuck. Effect of the Invention

[0011] According to the technology disclosed herein, by forming a dry film by orienting the support placed on the coating chuck in a fixed direction during spin coating, it is possible to reduce the misalignment of each dry film when multiple dry films are stacked on a substrate. [Brief description of the drawings]

[0012] [Figure 1] 1 is a diagram illustrating an example of a process for forming a liquid ejection head according to an embodiment; [Diagram 2] FIG. 1 shows the configuration of a support of a conventional art and a support of an embodiment. [Diagram 3] FIG. 1 illustrates the formation of a dry film using a support according to an embodiment. [Figure 4] FIG. 1 is a diagram showing a positional relationship between a support and a chuck according to the first embodiment; [Diagram 5] FIG. 13 is a diagram showing a configuration of a support according to a second embodiment; [Figure 6] FIG. 13 is a diagram showing a configuration of a support according to a third embodiment. [Figure 7]FIG. 13 is a diagram showing a configuration of a support according to a fourth embodiment. [Figure 8] FIG. 13 is a diagram showing a configuration of a support according to a fifth embodiment. [Figure 9] FIG. 13 is a diagram showing a configuration of a support according to a sixth embodiment. [Figure 10] FIG. 13 is a diagram showing a configuration of a support according to a seventh embodiment. [Figure 11] FIG. 13 is a diagram showing a configuration of a support according to a modified example. [Figure 12] FIG. 13 is a schematic diagram showing the movement of a support during spin coating according to one modified example. [Figure 13] FIG. 1 is a schematic diagram showing the formation of a dry film according to a conventional technique. [Figure 14] FIG. 1 is a diagram showing an example of a process for forming a dry film in one embodiment. [Figure 15] FIG. 2 is a schematic diagram showing the formation of a dry film in one embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Preferred embodiments of the technology of the present disclosure will be described in detail below with reference to the accompanying drawings. In each drawing, the same reference numerals are used for the same components, and duplicated descriptions will be omitted. Each embodiment will be described in more detail below. The numerical values ​​shown in each of the following examples are merely examples, and the technology of the present disclosure is not limited to these. The technology of the present disclosure is not limited to each embodiment, and includes combinations of these embodiments and applications to other technical fields.

[0014] (First embodiment) A method for manufacturing a liquid ejection head according to a first embodiment of the technique of the present disclosure will be described below. A liquid ejection head manufactured using a dry film as described below is mounted on, for example, an inkjet printer (not shown). Inkjet printers include a variety of types of Although there are various types of printers, generally, a printer is provided with a carriage (not shown) that can move in a scanning direction, and the carriage has a liquid ejection head that ejects ink onto a print medium. Ink is supplied to the liquid ejection head through a liquid flow path from an ink tank, and is ejected onto the print medium from ejection ports provided in the liquid ejection head. Then, by repeating the scanning of the carriage and the ejection of ink from the liquid ejection head, a desired print pattern is printed on the print medium.

[0015] Next, an example of a process for forming a liquid ejection head in this embodiment will be described. Fig. 1 shows a process for producing a so-called sheet-fed dry film, laminating the dry film on a substrate, and forming a pattern. First, in step S110, a base film is fixed onto a support. The material of the support can be selected from a wide variety of materials such as metal and resin. The base film can be fixed to the support by attaching it with double-sided tape or the like.

[0016] Next, in step S120, the support to which the base film is fixed is placed on a coating chuck in a coating device. Next, in step S130, resist is dropped onto the surface of the base film to form a dry film. Next, in step S140, the coating chuck is rotated with the support placed thereon, and the resist is spin-coated. Next, in step S150, the spin-coated resist is side-rinsed to remove unnecessary resist present on the outer periphery of the support. By dropping resist onto the base film fixed to the support and spin-coating it, the resist spreads over the entire surface of the base film. And, since the resist present on the outer periphery of the support may become a burr after the dry film of the resist is attached to the substrate, it is preferable to remove it in advance by side-rinsing.

[0017] Next, in step S160, the spin-coated resist is baked to turn the resist into a dry film. Baking can be performed using a baking mechanism such as a hot plate or oven provided in the coating device. Next, in step S170, the dry film obtained by baking in step S160 is attached to the surface of a substrate. Next, in step S180, the dry film attached to the substrate is exposed to light of a desired pattern and subjected to a PEB (Post Exposure Bake). Finally, in step S190, the dry film attached to the substrate is developed to form a desired pattern on the dry film.

[0018] 1, when stacking and patterning dry films are repeated, step S100-1 including steps S110 to S180 is repeated the number of times corresponding to the number of dry films to be stacked (S100-2). Finally, development in S190 can be performed collectively on the multiple dry films stacked on the substrate.

[0019] Next, an example of the support in this embodiment will be described. Fig. 2A shows a support 200 according to the conventional technology in a plan view when the support is placed on a chuck. Fig. 2B shows the support 2 according to this embodiment in a similar plan view, and Fig. 2C is a side view of the support 2. Fig. 2D also shows the movement of the support 2 on the chuck when spin coating is performed using the support 2.

[0020] First, the support 200 of the related art will be described. As shown in FIG. 2A, an X-axis, a Y-axis, and a Z-axis that are perpendicular to one another are set. As shown in FIG. 2A, the support 200 of the related art has a rectangular frame 210 that forms the outer periphery. Furthermore, the frame 210 is composed of two portions extending in the Y-axis direction and two portions extending in the X-axis direction. As shown in the figure, the width of the portion of the frame 210 extending in the Y-axis direction and the length of the portion of the frame 210 extending in the X-axis direction are All of the support members have the same width w. Therefore, in a plan view, the position 211 of the center of gravity of the support member 200 and the central position 224 of the support member approximately coincide with each other.

[0021] Next, the support 2 according to this embodiment will be described. As shown in FIG. 2B, an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other are set. As shown in FIG. 2B, the support 2 according to this embodiment has a rectangular frame 21 that constitutes the outer periphery. The frame 21 is composed of two parts extending in the Y-axis direction and two parts extending in the X-axis direction. FIG. 2C shows a side view of the support 2. As shown in FIG. 2B and FIG. 2C, in a plan view, the width of the part of the frame 21 of the support 2 that extends in the Y-axis direction is A, and the width of the part of the frame 21 that extends in the X-axis direction is a, with respect to the center position 24 of the support 2. The respective widths are set so that A>a. The width of the part of the frame 21 that extends in the X-axis direction is B, and the width of the part of the frame 21 that extends in the Y-axis direction is b, with respect to the center position 24 of the support 2. The respective widths are set so that B>b.

[0022] More specifically, portions of frame 21 corresponding to a pair of sides 21b, 21c sandwiching first corner 21a of the rectangle of frame 21 have first widths A, B. Moreover, portions of frame 21 corresponding to a pair of sides 21e, 21f sandwiching second corner 21d diagonally opposite first corner 21a have second widths a, b narrower than first widths A, B. In this embodiment, in order to move support 2 in a fixed direction during spin coating, the ratios of width A to width a and width B to width b are preferably 1.1 or more.

[0023] FIG. 2D shows a plan view of the support 2 in the direction of the rotation axis 55 in a state where the support 2 is placed on the coating chuck 50 so that the center position 24 of the support 2 and the rotation axis 55 of the coating chuck 50 overlap. At this time, the support 2 has an asymmetric configuration with respect to the rotation axis 55 of the coating chuck 50. In the support 2 shown in the figure, the center position 24 of the support 2 in a plan view is the same as the center position 224 of the support 200 of the conventional technology, but the position 11 of the center of gravity of the support 2 in a plan view is a position moved to the upper left from the center position 24. Therefore, in this embodiment, in a plan view in a state where the support 2 is placed on the coating chuck so that the rotation axis of the coating chuck and the center position 24 of the support 2 coincide with each other, the position 11 of the center of gravity of the support 2 is a position deviated from the rotation axis of the coating chuck. This is because, as described above, the width of the frame 21 of the support 2 in a plan view is uneven, causing a weight difference, and the position 11 of the center of gravity is deviated from the center position 24.

[0024] The entire frame 21 of the support 2 is made of the same material, such as stainless steel. Furthermore, since the thickness of the frame 21 is uniform, the wider parts of the rectangular frame 21 that extend in the vertical direction are relatively heavier than the narrower parts. For this reason, as shown in FIG. 2B, the center of gravity 11 of the support 2 can be shifted from the center 24 of the support 2.

[0025] FIG. 2D is a schematic diagram showing the movement of the support 2 when the support 2 is placed on the coating chuck 50 and spin coating is performed. As shown in the figure, the support 2 is placed on the coating chuck 50 in the coating cup 40. In addition, the coating chuck 50 is provided with a plurality of pins 1 that come into contact with the support 2 during spin coating to restrict the movement of the support 2 on the coating chuck 50. In addition, FIG. 2D shows a state in which the support 2 is placed on the coating chuck 50 such that the center position 24 of the support 2 and the rotation axis 55 of the coating chuck 50 overlap. At this time, in a plan view of the support 2 seen in the direction of the rotation axis 55, the support 2 has an asymmetric configuration with respect to the rotation axis 55 of the coating chuck 50.

[0026] In this embodiment, the center position 24 of the support 2 and the position 11 of the center of gravity of the support 2 in a plan view are When spin coating is performed in a state where the pins 1 and 2 are different, the support 2 and coating chuck 50 rotate in the direction of the arrow 12 in the figure, and a larger centrifugal force is applied to the support 2 in the direction of the arrow 13 in the figure. The direction of the arrow 13 is the direction in which the center of gravity 11 of the support 2 is located when viewed from the center position 24 of the support 2. As a result, the support 2 moves in the direction of the arrow 13 during rotation and comes into contact with the multiple pins 1. This allows the pins 1 to restrict the movement of the support 2 during spin coating.

[0027] Therefore, in this embodiment, as shown in Fig. 2D, centrifugal force during spin coating acts on support 2, causing it to move in the direction of arrow 13, and it comes into contact with pin 1 arranged on the upper left side of coating chuck 50 in the figure. In this embodiment, by changing only the width of frame 21 constituting support 2, it is possible to suppress variation in the movement of support 2 on coating chuck 50 during spin coating, and to improve the processing accuracy of resist and dry film. Furthermore, according to this embodiment, processing of support 2 is easy, and there is little concern that the productivity of support 2 will decrease.

[0028] Next, a case where spin coating is performed using the support 200 according to the conventional technology will be described with reference to FIGS. 3A to 3F. FIG. 3A is a top view showing a state where a first layer of resist 206 is formed on the surface of the base film 30 using the support 200, and FIG. 3B is a cross-sectional view taken along the line AA in FIG. 3A. In addition, in the cross-sectional view, some pins 1 that do not exist in the cross section are also shown in order to show the positional relationship between the pins 1 and the support 200. In this figure, as an example, the movement direction of the support 200 during spin coating is the upper left direction on the paper as indicated by the arrow 18. In addition, the center of the film of resist 206 formed on the base film 30 fixed to the support 200 coincides with the rotation axis 55 of the coating chuck 50. Therefore, the film of resist 206 is formed by spin coating, biased toward the lower right direction opposite to the arrow 18 as viewed from the center of the support 200.

[0029] Next, Fig. 3C is a top view showing a state in which a second layer of resist 207 is formed on the surface of base film 30 using support 200, and Fig. 3D is a cross-sectional view taken along line BB in Fig. 3C. In this figure, as an example, the movement direction of support 200 during spin coating is the lower right direction on the paper as indicated by arrow 19. The center of the film of resist 207 formed on base film 30 fixed to support 2 coincides with rotation axis 55 of coating chuck 50. Therefore, by spin coating, the film of resist 207 is formed biased in the upper left direction opposite to arrow 19 as viewed from the center of support 200.

[0030] FIG. 3E shows a state in which a first dry film 221 obtained by baking the first layer resist 206 and a second dry film 222 obtained by baking the second layer resist 207 are laminated on a substrate 9. FIG. 3F also shows a schematic method of laminating a dry film 222 on the substrate 9 to which the dry film 221 has been attached. As shown in FIG. 3F, when the dry film 222 is attached to the substrate 9, the support 200 is turned upside down. The same is true when the dry film 221 is attached to the substrate 9. Therefore, the deviation direction of the dry film formed on the support 200 from the center of the support 200 is also reversed.

[0031] When the dry film 221 is applied to the substrate 9 using a dry film application device, it is possible to adjust the dry film application device in advance so that the center position of the substrate 9 and the center position of the dry film 221 overlap. Therefore, even if the center position 24 of the support 200 and the center of the dry film 221 are different, it is possible to align the center of the dry film 221 with the center of the substrate 9 and apply the dry film 221 to the substrate 9. However, as shown in Fig. 3A, the support 200 moves in the direction of the arrow 18 during spin coating to form the resist 206 that is the base of the dry film 221. On the other hand, as shown in Fig. 3C 1, during spin coating to form resist 207 that is the basis of dry film 222, support 200 moves in the direction of arrow 19. Therefore, the center position of dry film 221 relative to the center position of support 200 and the center position of dry film 222 relative to the center position of support 200 are different from each other.

[0032] Therefore, even if the dry film attachment device is adjusted in advance so that the center position of the substrate 9 and the center position of the dry film 221 overlap, the center position of the substrate 9 and the center position of the dry film 222 do not overlap. As a result, as shown in Fig. 3E, the attachment positions of the dry films 221 and 222 on the substrate 9 are different, resulting in an area 223 where the dry film 222 does not overlap with the dry film 221 in a plan view. Such an area 223 may become a burr 10 in the subsequent processing of the dry film and adhere to the surfaces of the dry films 221 and 222, resulting in a concern of degrading the quality of the dry film.

[0033] Next, a case where spin coating is performed using the support 2 according to this embodiment will be described. FIG. 4A is a top view showing a state where a first layer of resist 26 is formed on the surface of the base film 30 using the support 2, and FIG. 4B is a cross-sectional view taken along the CC line in FIG. 4A. In addition, in the cross-sectional view, some pins 1 that do not exist in the cross section are also shown in order to show the positional relationship between the pins 1 and the support 2. As shown in FIG. 4A, the movement direction of the support 2 during spin coating is the upper left direction of the paper as indicated by the arrow 28. In addition, the center of the film of resist 26 formed on the base film 30 fixed to the support 2 coincides with the rotation axis 55 of the coating chuck 50. Therefore, by spin coating, the film of resist 26 is formed on the support 2 in a biased direction to the lower right opposite to the arrow 28.

[0034] Next, FIG. 4C is a top view showing a state in which a second layer of resist 27 is formed on the surface of the base film 30 using the support 2, and FIG. 4D is a cross-sectional view taken along line DD in FIG. 4C. According to the support 2 of this embodiment, even when the resist 27 is formed by spin coating, as shown in FIG. 4C, the movement direction of the support 2 during spin coating is the upper left direction of the paper indicated by the arrow 38 (the same direction as the direction indicated by the arrow 28). In addition, the center of the film of resist 27 formed on the base film 30 fixed to the support 2 coincides with the rotation axis 55 of the coating chuck 50. Therefore, the film of resist 27 is formed on the support 2 by spin coating, biased toward the lower right direction opposite to the arrow 38.

[0035] FIG. 4E shows a state in which a first dry film 121 obtained by baking the first layer resist 26 and a second dry film 122 obtained by baking the second layer resist 27 are laminated on the substrate 9. FIG. 4F also shows a schematic method of laminating a dry film 122 on the substrate 9 to which the dry film 121 has been attached. As shown in FIG. 4F, when the dry film 122 is attached to the substrate 9, the support 2 is turned upside down. The same is true when the dry film 121 is attached to the substrate 9. Therefore, the deviation direction of the dry film formed on the support 2 from the center of the support 2 is also reversed.

[0036] In this embodiment, when the dry film 121 is attached to the substrate 9 using a dry film attachment device, the dry film attachment device is adjusted in advance so that the center position of the substrate 9 and the center position of the dry film 121 overlap. As a result, even if the center position 24 of the support 2 and the center positions of the dry films 121 and 122 differ in plan view, attachment can be performed by aligning the center positions of the dry films 121 and 122 with the center position of the substrate 9. As a result, when the dry film 122 is attached onto the dry film 121, an area (area 223 shown in FIG. 3F) that does not overlap with the dry film 121 is unlikely to occur in the dry film 122. As a result, the generation of burrs 10 as shown in FIG. 3F is reduced during processing of the dry film, and concerns about a deterioration in the quality of the dry film due to burrs are suppressed. It is possible.

[0037] Second embodiment Next, a description will be given of a method for manufacturing a liquid ejection head according to the second embodiment. In the following description, the same steps and configurations as those in the first embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0038] 5A and 5B show the support 3 in a plan view when the support 3 according to this embodiment is placed on the coating chuck 50, and FIG. 5B is a side view of the support 3. As shown in the figure, an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other are set. The support 3 has a rectangular frame 31 that forms an outer periphery. The frame 31 is a rectangular frame formed so as to surround the rotation axis of the coating chuck 50 in a plan view. It is composed of two parts extending in the Y-axis direction and two parts extending in the X-axis direction. As shown in the figure, the width of the part of the frame 31 extending in the Y-axis direction and the width of the part of the frame 31 extending in the X-axis direction are both the same width.

[0039] Moreover, the support 3 according to this embodiment has a thick portion 35 in a plan view, which corresponds to at least one side of the rectangle of the frame 31, and in which the thickness of the frame 31 in the direction of the rotation axis 55 is increased. In order to secure an area for fixing the base film 30 to the support 3, the thick portion 35 does not overlap the area where the base film 30 is placed in a plan view, as shown in Fig. 5A, and is provided only in a part of an area on the outer periphery of the area where the base film 30 is placed.

[0040] Also, as shown in FIG. 5B, in a side view of the support 3, the thickness of the support 3 in the Z-axis direction at the portion where the thick portion 35 is provided is C, and the thickness of the other portion in the Z-axis direction is c. In this case, the thick portion 35 is configured so that C>c. In this way, in a plan view of the support 3, the first corner portion 31a of the frame 31 corresponding to the first corner of the rectangle of the frame 31 has a first thickness C in the direction of the rotation axis 55. Also, the second corner portion 31d of the frame 31 corresponding to the second corner diagonally opposite the first corner has a second thickness c smaller than the first thickness C. Also, it is preferable that the ratio of C to c is 1.1 times or more.

[0041] The support 3 is made of the same material throughout the frame 31, and the thickness of the frame 31 is uniform, so that the portion where the thick portion 35 is provided is relatively heavier than the other portions. For this reason, as in the case shown in FIG. 2B, the center of gravity 311 of the support 3 can be shifted from the center position 324 of the support 3. As a result, as in the case of the support 2 shown in FIG. 2D, a centrifugal force during spin coating acts on the support 3, causing it to move in the upper left direction of the paper (in the direction of the arrow 13), and the support 3 comes into contact with the pin 1 arranged on the upper left side of the coating chuck 50 in the plan view of the figure. In this embodiment, by changing only the thickness of the support 3, the variation in the movement of the support 3 on the coating chuck 50 during spin coating can be suppressed, and the processing accuracy of the resist and dry film can be improved.

[0042] In this embodiment, in a plan view of the support 3, the thick portions 35 are provided in the portions extending in the X-axis direction and the Y-axis direction of the frame 31, but it is sufficient that they are provided in at least a portion extending in either direction of the frame 31. This allows the center of gravity position 311 of the support 3 to be shifted from the center position 324 of the support 3, as described above.

[0043] Third embodiment Next, a description will be given of a method for manufacturing a liquid ejection head according to the third embodiment. In the following description, the same steps and configurations as those in the above embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0044] 6A shows the support 4 according to this embodiment in a plan view when placed on a coating chuck 50, and FIG. 6B is a cross-sectional view of the support 4 taken along line EE in FIG. 6A. As shown in the figure, an X-axis, a Y-axis, and a Z-axis are set that are orthogonal to each other. The support 4 has a rectangular frame 41 that forms the outer periphery. The frame 41 is composed of two portions extending in the Y-axis direction and two portions extending in the X-axis direction. As shown in the figure, the width of the portion of the frame 41 extending in the Y-axis direction and the width of the portion of the frame 41 extending in the X-axis direction are both the same.

[0045] As shown in the figure, in the support 4 according to this embodiment, a part of the frame 41 is formed by a weight part 414 having a specific gravity D. Also, as shown in the figure, the part of the frame 41 other than the weight part 414 is formed by a light part 415 having a specific gravity d. At this time, the weight part 414 and the light part 415 are configured so that the specific gravity is D>d. Also, it is preferable that the ratio of D to d is 1.1 times or more. Here, the light part 415 is an example of a first part having a first specific gravity, and the weight part 414 is an example of a second part having a second specific gravity larger than the first specific gravity. In this embodiment, in a plan view of the support 4 in a state in which the support 4 is placed on the coating chuck 50 and seen in the direction of the rotation axis 55, the weight part 414 is arranged so as to be asymmetric with respect to the rotation axis 55. In this way, in a plan view, the support 4 has a first corner part 41a of the frame 41 corresponding to a first corner of the rectangle of the frame 41, which is formed by a first member (weight part 414) having a first specific gravity. Moreover, a second corner portion 41d of the frame 41 corresponding to a second corner diagonally opposite the first corner is formed of a second member (lightweight portion 415) having a second specific gravity smaller than the first specific gravity.

[0046] In addition, since the width and thickness of the frame 41 of the support 4 are configured to be uniform, the portion where the weight portion 414 of the frame 41 is provided becomes relatively heavier than the other portions. Therefore, similar to the case shown in FIG. 2B, the center of gravity position 411 of the support 4 can be shifted from the center position 424 of the support 4. As a result, similar to the case of the support 2 shown in FIG. 2D, a centrifugal force during spin coating acts on the support 4, causing it to move in the upper left direction of the paper (in the direction of the arrow 13), and the support 4 abuts against the pin 1 arranged on the upper left side of the coating chuck 50 in the plan view of the figure. In this embodiment, by changing only the specific gravity of the frame 41 of the support 4, the variation in the movement of the support 4 on the coating chuck 50 during spin coating can be suppressed, and the processing accuracy of the resist and dry film can be improved.

[0047] In this embodiment, in a plan view of the support 4, the weight section 414 is provided on each of the portions extending in the X-axis direction and the Y-axis direction of the frame 41, but it is sufficient that the weight section 414 is provided on a portion extending in at least either direction of the frame 41. By providing the weight section 414 in a portion corresponding to at least one side of the rectangle of the frame 41, the center of gravity position 411 of the support 4 can be shifted from the center position 424 of the support 4, as described above.

[0048] (Fourth embodiment) Next, a description will be given of a method for manufacturing a liquid ejection head according to the fourth embodiment. In the following description, the same steps and configurations as those in the above embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0049] 7A shows the support 5 according to this embodiment in a plan view when placed on a coating chuck 50, and FIG. 7B is a cross-sectional view of the support 5 taken along line FF in FIG. 7A. As shown in the figure, an X-axis, a Y-axis, and a Z-axis are set that are orthogonal to each other. The support 5 has a rectangular frame 51 that forms the outer periphery. The frame 51 is composed of two portions extending in the Y-axis direction and two portions extending in the X-axis direction. As shown in the figure, the width of the portion of the frame 51 extending in the Y-axis direction and the width of the portion of the frame 51 extending in the X-axis direction are both the same.

[0050] As shown in the figure, the support 5 according to this embodiment has a wall portion 516 in a part of the frame 51 of the support 5. In the plan view of FIG. 7A, the wall portion 516 is provided on the upper left side of the frame 51. The wall portion 516 functions as a wind receiving portion that receives the airflow generated in the coating cup 40 during spin coating, thereby moving the support 5 placed on the coating chuck 50. In this way, the support 5 is provided with the wall portion 516 at the first corner portion 51a of the frame 51 corresponding to the first corner of the rectangle of the frame 51, which receives the airflow generated during spin coating and moves the support 5 on the surface of the coating chuck 50.

[0051] As shown in the figure, the wall portion 516 has a curved shape that is convex toward the outer periphery of the support 5 as shown in the cross section of FIG. 7B, and therefore the area that receives the airflow generated during spin coating is larger than when the wall portion 516 has a flat plate shape. Furthermore, by providing the wall portion 516 in a part of the frame 51, the center of gravity position 511 of the support 5 can be shifted from the center position 524 of the support 5, as in the above embodiment. As shown in FIG. 7B, in a side view of the support 5, the height H of the wall portion 516 is preferably two times or more the thickness e of the support 5.

[0052] As a result, the airflow generated by the rotation of the coating chuck 50 during spin coating and the centrifugal force acting on the support 5 act on the support 5 to move it in the upper left direction of the drawing, and the support 5 comes into contact with the pin 1 arranged on the upper left side of the coating chuck 50 in the plan view of the figure. In the support 5 according to this embodiment, the wall portion 516 not only shifts the center of gravity position 511 of the support 5 from the center position 524, but also has the function of receiving the airflow during spin coating. This makes it possible to make the area in which the wall portion 516 is provided smaller than when the thick portion 35 is provided. Furthermore, the wall portion 516 can suppress the variation in the movement of the support 5 on the coating chuck 50 during spin coating, thereby improving the processing accuracy of the resist and dry film.

[0053] Fifth embodiment Next, a description will be given of a manufacturing method of a liquid ejection head according to the fifth embodiment. In the following description, the same steps and configurations as those in the above-mentioned embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0054] 8A and 8B, Fig. 8A is a top view of the support 6 according to this embodiment placed on the application chuck 50 in the application cup 40, and Fig. 8B is a cross-sectional view taken along line GG in Fig. 8A. Note that in the cross-sectional view, in order to show the positional relationship between the pins 1 and the support 6, some of the pins 1 that are not present in the cross section are also shown.

[0055] In this embodiment, as shown in the figure, in plan view, the support 6 has an inclined surface 6a whose thickness in the direction of the rotation axis 62 of the coating chuck 50 increases in one direction (the direction of the arrow 61). Furthermore, in plan view, the coating chuck 50 has an inclined surface 50a whose height in the direction of the rotation axis 62 of the coating chuck 50 decreases in the above-mentioned one direction (the direction of the arrow 61). Then, as shown in FIG. 8B, the support 6 is placed on the coating chuck 50 so that the inclined surface 6a of the support 6 and the inclined surface 50a of the coating chuck 50 overlap. As a result, the surface of the support 6 placed on the coating chuck 50 to which the base film 30 is fixed becomes horizontal. The inclination angle of the inclined surface 6a of the support 6 with respect to the horizontal plane (the surface in the left-right direction of the paper) is an angle at which the surface 6b of the support 6 opposite to the contact surface with the coating chuck 50 becomes horizontal when the support 6 is placed so that the inclined surface 6a and the inclined surface 50a of the coating chuck 50 overlap. Furthermore, since the weight of the support 6 increases in the inclined direction of the arrow 61 , the center of gravity 611 of the support 6 is shifted in the direction of the arrow 61 from the center position 624 of the support 6 .

[0056] As a result, during spin coating, centrifugal force acting on support 5 due to rotation of coating chuck 50 acts on support 6, causing it to move in the upper left direction of the page and come into contact with pin 1 arranged on the upper left side of coating chuck 50 in plan view in the figure. In support 6 according to this embodiment, the inclined surface not only shifts center of gravity position 611 from center position 624, but also makes it easier to move support 6 in the direction of arrow 61 on coating chuck 50 during spin coating. This reduces variation in the movement of support 6 during spin coating, and improves the processing accuracy of resist and dry film.

[0057] Sixth embodiment Next, a method for manufacturing a liquid ejection head according to the sixth embodiment will be described. In the following description, the same steps and configurations as those in the above-mentioned embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0058] FIG. 9A is a top view of the support 7 according to this embodiment, and FIG. 9B is a cross-sectional view of the support 7 placed on the application chuck 50 in the application cup 40. The cross-sectional view of FIG. 9B corresponds to the cross-sectional view of the support 2 according to the first embodiment in FIG. 4B. In addition, in FIG. 9B, a part of the pins 1 that do not exist in the cross section is also shown in order to show the positional relationship between the pins 1 and the support 7. As shown in FIG. 9A, an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other are set. The support 7 has a rectangular frame 71 that constitutes the outer periphery. The frame 71 is composed of two parts extending in the Y-axis direction and two parts extending in the X-axis direction.

[0059] 9B, the support 7 of this embodiment has a friction reducing member 717 on its back surface, i.e., the surface facing the support 7 when placed on the coating chuck 50, which reduces the frictional force generated between the support 7 and the coating chuck 50. In addition to this, or instead of this, the coating chuck 50 has a friction reducing member 718 on its front surface, i.e., the surface facing the support 7 when the support 7 is placed on the coating chuck 50, which reduces the frictional force generated between the support 7. When the friction reducing member 717 is provided on the support 7 and the friction reducing member 718 is provided on the coating chuck 50, the friction reducing member 717 and the friction reducing member 718 function to reduce the frictional force generated between each other.

[0060] As shown in FIG. 9B, the support 7 according to this embodiment has a width of the portion of the frame 71 of the support 7 extending in the Y-axis direction, which is A' at the portion on the negative X-axis side with respect to the center position 724 of the support 7. The width of the portion on the positive X-axis side with respect to the center position 724 is a'. Furthermore, each width is set so that A'>a'. Furthermore, the width of the portion of the frame 71 of the support 7 extending in the X-axis direction, which is B' at the portion on the positive Y-axis side with respect to the center position 724 of the support 7, is b' at the portion on the negative Y-axis side with respect to the center position 724. The widths are set so that B'>b'.

[0061] Furthermore, by using the friction reducing member 717 of the support 7 and / or the friction reducing member 718 of the coating chuck 50, the support 7 is more likely to move during spin coating than when the friction reducing members 717, 718 are not used. Therefore, even if the deviation of the center of gravity position 711 of the support 7 from the center position 724 of the support 7 is made smaller than that of the support 2 in the first embodiment, the same effect as in the first embodiment can be obtained. Therefore, in this embodiment, as shown in FIG. 9A, when comparing the frame 71 of the support 7 and the frame 21 of the support 2, the widths of the frames can be set so that A>A'>a'>a and B>B'>b'>b.

[0062] Therefore, according to the support 7 of this embodiment, even if the rotation speed during spin coating is lower than that in the above embodiment, the support 7 can be moved on the coating chuck 50 by the centrifugal force during spin coating. By applying the reducing members 717 and 718 to other embodiments, the movement of the support during spin coating can be performed more reliably.

[0063] Seventh embodiment Next, a method for manufacturing a liquid ejection head according to the seventh embodiment will be described. In the following description, the same steps and configurations as those in the above-described embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0064] Fig. 10 shows an example of the support 8 and coating chuck 500 according to the seventh embodiment. The configuration of the support 8 according to this embodiment is the same as that of the support 2 according to the first embodiment, so a detailed description will be omitted. As shown in Fig. 10, the coating chuck 500 has three pins 510, 520, 530 that can come into contact with the support 8 and that position the support 8 and restrict the movement of the support 8 during spin coating. The coating chuck 500 differs from the coating chuck 50 in the above embodiment in the number of pins.

[0065] Similar to the movement of the support 2 shown in FIG. 2B and FIG. 2C, the support 8 moves in the direction indicated by the arrow 48 toward the upper left of the drawing (the same direction as the arrows 28 and 38) during spin coating. The support 8 comes into contact with three pins 510, 520, and 530 of the coating chuck 500, and the movement of the support 8 on the coating chuck 500 is restricted by the pins. As shown in FIG. 10, in a plan view, the two pins 520 and 530 are provided so as to be able to come into contact with one side 81b of a pair of sides 81b and 81c that sandwich a first corner 81a of the rectangle of the frame 81 of the support 8. In addition, one pin 510 is provided so as to be able to come into contact with the other side 81c of the pair of sides 81b and 81c.

[0066] Then, the pin 510 as the first pin abuts against the outer periphery of the support 8 so as to restrict the movement of the support 8 in a first direction 518 perpendicular to the rotation axis 502 of the coating chuck 500 during rotation of the coating chuck 500 by spin coating. Also, the pin 520 or the pin 530 as the second pin abuts against the outer periphery of the support 8 so as to restrict the movement of the support 8 in a second direction 528 perpendicular to the rotation axis 502 different from the first direction 518 during rotation of the coating chuck 500 by spin coating. As a result, during spin coating, the movement of the support 8 in the direction of the arrow 48 on the coating chuck 500 is restricted, and the support 8 is positioned in a state of abutment against the pins 510, 520, and 530.

[0067] According to this embodiment, as in the above embodiment, the variation in the movement of the support 8 during spin coating can be suppressed, and the processing accuracy of the resist and dry film can be improved. Furthermore, since the configuration of the pin of the coating chuck can be simplified, it is expected that the manufacturing efficiency of the coating chuck will be improved and the manufacturing cost of the coating chuck will be reduced.

[0068] Next, a modified example of this embodiment will be described. FIG. 11 shows an example of the support 8 and the coating chuck 550 according to this modified example. As shown in the figure, in this modified example, the coating chuck 550 has 12 pins 551 to 562 for positioning the support 8 during spin coating and restricting the movement of the support 8. As shown in FIG. 11, the pins 551, 552, and 553 abut against one side constituting the outline of the rectangular frame 81 of the support 8 in a plan view, and the pins 554, 555, and 556 abut against another side constituting the outline of the frame 81. In this way, the multiple pins 551 to 553 abut against the outer periphery of the support 8 so as to restrict the movement of the support 8 in the first direction 518 perpendicular to the rotation axis 502 of the coating chuck 550 during rotation of the coating chuck 550 by spin coating. Furthermore, the multiple pins 554 to 556 come into contact with the outer periphery of the support 8 so as to restrict movement of the support 8 in a second direction 528 perpendicular to the rotation axis 502, which is different from the first direction 518, during rotation of the coating chuck 550 during spin coating. In this way, the number of pins that come into contact with the support 8 during spin coating is greater than that shown in FIG. This is expected to make the position of support 8 on coating chuck 550 more stable during spin coating.

[0069] Next, modified examples applicable to the manufacturing method of the liquid ejection head of each of the above-mentioned embodiments will be described. In the modified example described below, as shown in Fig. 12, the rotational energy of the rotation indicated typically by the arrow 12 in Fig. 2D is increased, and the coating chuck 50 is rotated to rotate as indicated typically by the arrow 212. In this modified example, as an example, the support 2 according to the first embodiment is placed on the coating chuck 50 and spin-coated. By increasing the rotational energy of the coating chuck 50 during spin-coating, the centrifugal force acting on the support 2 in the direction of the arrow 213 becomes large, and the effect of positioning the support 2 by the pin 1 can be more easily obtained.

[0070] Here, an example of a method for increasing the rotational energy of the coating chuck 50 is to increase the rotational speed of the coating chuck 50. The higher the rotational speed of the coating chuck 50, the greater the rotational energy of the coating chuck 50, and the more reliably the effect of positioning the support 2 on the coating chuck 50 during spin coating can be obtained. However, simply increasing the rotational speed of the coating chuck 50 poses a problem that the film thickness of the resist formed on the base film 30 fixed to the support 2 becomes thin. This point will be described in detail below.

[0071] 13A is a schematic diagram showing a case where a side rinse is performed by a conventional technique on a resist 261 formed on a base film 30. The side rinse involves spraying a resist solvent 20 onto the resist 261 to dissolve and remove the resist 261. As shown in FIG. 13A, the side rinse removes the resist in a resist removal region 263 of the resist 261 with the resist solvent 20. This side rinse is performed immediately after spin coating, as shown in step S150 in FIG. 1.

[0072] In the side rinse, in order to maintain the film thickness and flatness of the resist 261 formed by spin coating as much as possible, the side rinse is generally performed at a rotation speed slower than that during spin coating. Splashes of the resist solvent may affect the quality of the resist during the side rinse. FIG. 13A shows splashes 119 and 129 as an example. When the rotation speed of the coating chuck 50 is low, the resist solvent 20 that hits the resist 261 may scatter in the opposite direction to the direction of the centrifugal force acting due to the rotation (arrow 313 in the figure) (splashes 129 in the figure). If the splashes 129 adhere to the effective area of ​​the resist 261, there is a concern that the splashes 129 may dissolve part of the resist 261, causing a deterioration in the film quality.

[0073] In addition, when the side rinse is performed by rotating the coating chuck 50 at a low speed, the resist solvent 20 sprayed to the resist removal region 263 may soak into the resist 261 in the effective region, and as a result, as shown in the figure, a part of the end of the resist 261 may dissolve. FIG. 13B is a schematic diagram showing a case in which the rotation speed of the coating chuck 50 is increased compared to the case of FIG. 13A to perform side rinsing on the resist 262 formed on the base film 30 in this modified example. As shown in the figure, by increasing the rotation speed of the coating chuck 50, it is possible to reduce the scattering of the splashes 119 into the effective region of the resist 262. In addition, by increasing the centrifugal force caused by the rotation of the coating chuck 50 (arrow 413 in the figure), the possibility that the resist solvent 20 sprayed to the resist removal region 263 may soak into the resist 262 in the effective region is reduced. As a result, it is possible to avoid the phenomenon in which a part of the end of the resist 262 dissolves. However, as shown in FIG. 1, the side rinse in step S150 is performed before the baking in step S160. Therefore, there is a concern that increasing the rotation speed of the coating chuck 50 may result in the film thickness of the resist 262 becoming smaller (film thickness: e) than in the case of FIG. 13A (film thickness: E).

[0074] Therefore, in the method for manufacturing a liquid ejection head according to this modified example, after baking the resist formed on the base film 30 by spin coating, a side rinse of the resist (post-bake side rinse) is performed.

[0075] Fig. 14 shows the process of preparing a sheet-fed dry film in this modified example, laminating the dry film on a substrate, and forming a pattern. In the following description, it is assumed that the support 2 is placed on the coating chuck 50 and a resist is formed on the base film 30 in the process of Fig. 14, but any of the supports in the above embodiments may be used instead of the support 2.

[0076] The steps from fixing the base film 30 to the support 2 in step S210 to rotating the coating chuck 50 by spin coating in step S240 are the same as steps S110 to S140 in Fig. 1. However, in step S240 of this modification, the rotation speed of the coating chuck in spin coating when forming a resist on the base film 30 is set higher than the rotation speed of the coating chuck in spin coating in the case of Fig. 1 where no side rinse is performed after baking.

[0077] As a result, the resist 264 is formed on the base film 30 fixed to the support 2. Next, in step S250, the resist 264 formed on the base film 30 is subjected to side rinsing to remove unnecessary resist in the resist removal area 263 of the resist 264. As shown in FIG. 15A, in the side rinsing in step S250, in order to suppress the possibility that the resist solvent 20 will soak into the resist 264 in the effective area, the resist solvent 20 is sprayed onto the resist 264 so that the resist 264 remains in the resist removal area 263. By doing so, even if splashes 119 are generated in the side rinsing, the splash position is more likely to adhere to the resist 264 in the resist removal area 263. As a result, the phenomenon in which a part of the resist 264 in the effective area is dissolved by the splashes 119 and the film quality is deteriorated can be suppressed.

[0078] Next, in step S260, the resist 264 is baked to form a single-wafer dry film. The baking is performed by a baking mechanism such as a hot plate or an oven provided in the coating apparatus. Next, in step S265, a side rinse is performed on the dry film 265 obtained by baking the resist 264 (post-bake side rinse). As shown in FIG. 15B, in the post-bake side rinse in step S265, even if the rotation speed of the coating chuck 50 is the same as that in FIG. 13B, there is no concern that the film thickness E of the dry film 265 will decrease because the resist 264 is baked in step S260. In addition, since the rotation speed of the coating chuck 50 is higher than that in the side rinse in FIG. 13A, it is possible to suppress the phenomenon that the splash 119 is scattered within the effective area of ​​the dry film 265 or the resist solvent 20 is soaked into the effective area of ​​the dry film 265. Therefore, as shown in FIG. 15B, according to this modification, the dry film 265 can be formed with the desired dimensions.

[0079] Next, in step S270, the dry film 265 is attached to the surface of the substrate 9. Next, in step S280, the dry film 265 attached to the substrate 9 is exposed and PEBed to obtain a desired pattern. Finally, in step S290, the dry film 265 is developed to obtain the dry film 265 on which the desired pattern is formed. Note that, when the formation of the dry film is repeated, after step S280, step S200-1 including steps S210 to S280 is repeated to stack the required number of dry films on the substrate 9, and then the development in S290 is performed all at once.

[0080] According to this modification, the rotation speed of the coating chuck 50 during spin coating is set to be faster than the rotation speed when side rinsing is not performed after baking. As a result, it is expected that the support 2 will move more reliably in the movement direction (the movement direction indicated by the arrows 28 and 38 in FIG. 2A and FIG. 2C) due to the rotation of the coating chuck 50 during spin coating. This makes it possible to further reduce deviation in the formation position of the dry film relative to the substrate 9. Furthermore, according to this modification, after baking the resist formed by spin coating using the support 2, a side rinse is performed. This eliminates the concern that the film thickness of the resist formed by spin coating will become smaller when performing a side rinse.

[0081] In this modified example, for example, when multiple dry films formed by spin coating are laminated on a substrate using different vacuum bonding devices, the deviation of the attachment position on the dry film relative to the substrate varies for each bonding device. Therefore, it is preferable to provide the pins 1 of the coating chuck 50 so as to surround the support 2 as shown in Figs. 2A and 2C. As a result, the direction of movement of the support 2 during spin coating is changed according to the vacuum bonding device used, and the support 2 is placed on the coating chuck 50 so that the support 2 moves, for example, in the upper right direction, lower right direction, or lower left direction in Figs. 2A and 2C. As a result, the dry film can be formed using the support 2 so that the position deviation that occurs when the dry film is attached to the substrate using the vacuum bonding device is eliminated. Then, by eliminating the position deviation that occurs when the dry film is attached to the substrate, the area where the dry films laminated on the substrate overlap each other is also increased, and the effective area of ​​the dry film can be expanded more than before. Furthermore, it becomes possible to arrange more effective chips on the dry film than before, and the cost associated with the manufacture of the liquid ejection head can be reduced.

[0082] (Example) Next, an example will be described in which a laminated structure of two dry films is formed on a substrate 9 using the support 2 according to the first embodiment. In the following description, the same components as those in the first embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0083] First, the dimensions of the rectangular frame 21 of the support 2 are, for example, 320 mm x 290 mm in outer dimensions and 270 mm x 240 mm in inner dimensions. As shown in Figs. 2A and 2C, in plan view, the left side of the frame 21 is wider than the right side, and the upper side is wider than the lower side. The thickness of the frame 21 is 1.2 mm, and the material of the frame 21 is stainless steel SUS420J2. Note that these specifications of the frame 21 are merely examples, and the specifications of the frame 21 in this embodiment are not limited to these.

[0084] In this embodiment, a film with a release film, which is a roll-shaped PET thin film having a thickness of 100 μm and a width of 254 mm and has been subjected to a release treatment, is used as the base film 30 to be fixed to the support 2. The base film 30 is formed to a size that matches the dimensions of the support 2, and is fixed to the support 2 with a heat-resistant double-sided tape.

[0085] Then, the support 2 to which the base film 30 is fixed is carried in near the center of the coating cup 40. Next, the resist 26, which is the first layer, is dropped onto the surface of the base film 30. Spin coating is started with the support 2 placed on the coating chuck 50. The rotation speed of the coating chuck 50 during spin coating is 500 to 1800 r / m. Note that the rotation speed at this time is set within the range of 500 to 1800 r / m, and is faster than the rotation speed at step S140 in FIG. 1 in which the side rinse after baking in step S265 is not performed. At this time, in the plan view shown in FIG. 2A, the support 2 moves 5 mm in the upper left direction of the paper (the direction of the arrow 28 in the figure) and hits the pin 1 of the coating chuck 50.

[0086] Next, the resist 26 formed on the base film 30 by spin coating is A side rinse is performed to remove the resist in the resist removal region of the resist 26. The resist solvent 20 used in the side rinse is PGMEA (Propylene glycol). In the side rinse, the resist solvent 20 is sprayed onto the surface of the resist 26 at a flow rate of about 0.1 L / min for 60 to 90 seconds. Since the diameter of the wafer to which the dry film is attached after formation is 200 mm, the side rinse is performed so that the diameter of the resist 26 becomes 216 mm. The rotation speed of the coating chuck 50 during the side rinse is 500 to 1200 rpm.

[0087] Next, the resist 26 is baked at 90° C. for 15 minutes by a baking mechanism provided in the coating device, and a dry film 121 having a diameter of 216 mm is obtained. Next, the support 2 on which the dry film 121 made of the resist 26 is formed is carried into the coating cup 40 again. Then, side rinsing is performed at 500 to 1800 rpm so that the diameter of the dry film 121 becomes 199 mm. It is preferable that the rotation speed of the coating chuck 50 in the side rinsing after baking is at least 100 rpm faster than the rotation speed of the coating chuck 50 in the side rinsing before baking. At this time, the support 2 moves 5 mm in the upper left direction of the paper (the direction of the arrow 28 in the figure) in the same manner as in the spin coating, and hits the pin 1 of the coating chuck 50. Then, the support 2 is taken out of the coating device, and the first layer of dry film 121 is obtained. Then, as described with reference to FIG. 2F, the dry film 121 is attached to the substrate 9.

[0088] Next, the second layer of dry film 122 is created by the same procedure as above. When forming resist 27 by spin coating using support 2, as an example, support 2 is placed on coating chuck 50 so that frame 21 abuts on pin 1 arranged on the lower right side of coating chuck 50 in the plan view of FIG. 2C. Then, when spin coating is performed, support 2 moves approximately 10 mm in the upper left direction of the paper (the direction of arrow 38 in the figure) in the plan view of FIG. 2C and abuts on pin 1 arranged on the upper left side of coating chuck 50 in the plan view of FIG.

[0089] Then, the second layer dry film 122 obtained in the same manner as the dry film 121 is attached onto the dry film 121 of the substrate 9. In attaching the dry film, the dry film 121 is attached to the substrate 9 using a vacuum bonding device, and then exposure and PEB are performed, and similarly, the dry film 122 is attached to the dry film 121, and then exposure and PEB are performed. Exposure is performed using an exposure device such as an i-line stepper. Also, PEB is performed using a hot plate. Thereafter, the dry films 121 and 122 attached to the substrate 9 are developed at the same time, and a desired pattern can be formed with high precision.

[0090] The disclosure of this embodiment includes the following method. (Method 1) Dropping resist onto a surface of a base film fixed on a support placed on a chuck; performing spin coating using the chuck while the base film onto which the resist has been dropped is fixed on the support; having In a plan view of the support placed on the chuck in the direction of the rotation axis of the chuck, the support has an asymmetric configuration with respect to the rotation axis of the chuck. A method for manufacturing a liquid ejection head comprising the steps of: (Method 2) The support body has a rectangular frame formed so as to surround the rotation axis in the plan view, In the plan view, a portion of the frame corresponding to a pair of sides sandwiching a first corner of the rectangle has a first width, and a portion of the frame corresponding to a pair of sides sandwiching a second corner diagonally opposite the first corner has a second width. The method for manufacturing a liquid ejection head according to Method 1, wherein the portion of the frame that is to be fixed has a second width that is narrower than the first width. (Method 3) The support body has a rectangular frame formed so as to surround the rotation axis in the plan view, The method for manufacturing a liquid ejection head described in Method 1, characterized in that, in the planar view, a first corner portion of the frame corresponding to a first corner of the rectangle has a first thickness in the direction of the rotation axis, and a second corner portion of the frame corresponding to a second corner diagonally opposite the first corner has a second thickness smaller than the first thickness. (Method 4) The support body has a rectangular frame formed so as to surround the rotation axis in the plan view, The method for manufacturing a liquid ejection head described in Method 1, characterized in that, in the planar view, a first corner portion of the frame corresponding to a first corner of the rectangle is formed from a first member having a first specific gravity, and a second corner portion of the frame corresponding to a second corner diagonally opposite the first corner is formed from a second member having a second specific gravity smaller than the first specific gravity. (Method 5) The support body has a rectangular frame formed so as to surround the rotation axis in the plan view, The method for manufacturing a liquid ejection head described in method 1, characterized in that a wall portion is provided at a first corner portion of the frame which corresponds to a first corner of the rectangle when viewed in a plane, for receiving the airflow generated during the spin coating and moving the support on the surface of the chuck. (Method 6) In the plan view, the support has an inclined surface in which a thickness in the direction of the rotation axis increases in one direction, In the plan view, the chuck has an inclined surface whose height in the direction of the rotation axis decreases toward the one direction, The support is placed on the chuck such that the inclined surface of the support and the inclined surface of the chuck overlap. 2. The method for producing a liquid ejection head according to claim 1, (Method 7) The method for manufacturing a liquid ejection head described in Method 6, characterized in that the inclination angle of the inclined surface of the support relative to the horizontal plane is an angle at which the surface of the support opposite to the contact surface with the chuck becomes horizontal when the support is placed on the chuck so that the inclined surface of the support and the inclined surface of the chuck overlap. (Method 8) baking the resist after the spin coating; performing a side rinse of the baked resist; The method for producing a liquid ejection head according to any one of Methods 1 to 7, further comprising: (Method 9) The method for manufacturing a liquid ejection head according to Method 8, wherein the rotation speed of the chuck during the spin coating is faster than the rotation speed of the chuck during the spin coating in a case where the baking is not performed. (Method 10) The method for manufacturing a liquid ejection head described in any one of methods 1 to 9, wherein the support has a friction reduction member for reducing frictional force between the support and the chuck when performing the spin coating. (Method 11) 11. The method for manufacturing a liquid ejection head described in any one of methods 1 to 10, wherein the chuck has a friction reduction member for reducing friction between the chuck and the support when performing the spin coating. (Method 12) The support body has a rectangular frame formed so as to surround the rotation axis in the plan view, The chuck has at least three pins that are provided so as to be able to come into contact with the support placed on the chuck, In the plan view, two pins of the at least three or more pins are provided so as to be able to abut against one side of a pair of sides that sandwich a first corner of the rectangle, and one pin of the at least three or more pins is provided so as to be able to abut against the other side of the pair of sides. 12. The method for producing a liquid ejection head according to any one of Methods 1 to 11, (Method 13) forming a first dry film made of a first layer of resist and a second dry film made of a second layer of resist by the spin coating; a step of attaching the first dry film onto a substrate and performing exposure and baking related to the liquid ejection head on the first dry film; a step of attaching the second dry film onto the first dry film and performing exposure and baking related to the liquid ejection head on the second dry film; developing the first dry film and the second dry film attached to the substrate; 13. The method for producing a liquid ejection head according to any one of Methods 1 to 12, comprising: [Explanation of symbols]

[0091] 2 Support, 26, 27 Resist, 30 Base film, 50 Coating chuck

Claims

1. Dropping resist onto a surface of a base film fixed on a support placed on a chuck; performing spin coating using the chuck while the base film onto which the resist has been dropped is fixed on the support; having In a plan view of the support placed on the chuck in the direction of the rotation axis of the chuck, the support has an asymmetric configuration with respect to the rotation axis of the chuck. A method for manufacturing a liquid ejection head comprising the steps of:

2. The support body has a rectangular frame formed so as to surround the rotation axis in the plan view, A method for manufacturing a liquid ejection head as described in claim 1, characterized in that, in the planar view, a portion of the frame corresponding to a pair of sides that sandwich a first corner of the rectangle has a first width, and a portion of the frame corresponding to a pair of sides that sandwich a second corner diagonally opposite the first corner has a second width that is narrower than the first width.

3. The support body has a rectangular frame formed so as to surround the rotation axis in the plan view, 2. A method for manufacturing a liquid ejection head as described in claim 1, characterized in that, when viewed in a plane, a first corner of the frame corresponding to a first corner of the rectangle has a first thickness in the direction of the rotation axis, and a second corner of the frame corresponding to a second corner diagonally opposite the first corner has a second thickness smaller than the first thickness.

4. The support body has a rectangular frame formed so as to surround the rotation axis in the plan view, 2. A method for manufacturing a liquid ejection head as described in claim 1, characterized in that, when viewed in a plan view, a first corner of the frame corresponding to a first corner of the rectangle is formed from a first member having a first specific gravity, and a second corner of the frame corresponding to a second corner diagonally opposite the first corner is formed from a second member having a second specific gravity smaller than the first specific gravity.

5. The support body has a rectangular frame formed so as to surround the rotation axis in the plan view, The method for manufacturing a liquid ejection head according to claim 1, characterized in that, in the planar view, a wall portion is provided at a first corner portion of the frame which corresponds to a first corner of the rectangle, and which receives the airflow generated during the spin coating and moves the support on the surface of the chuck.

6. In the plan view, the support has an inclined surface in which a thickness in the direction of the rotation axis increases in one direction, In the plan view, the chuck has an inclined surface whose height in the direction of the rotation axis decreases toward the one direction, The support is placed on the chuck such that the inclined surface of the support and the inclined surface of the chuck overlap.

2. The method for manufacturing a liquid ejection head according to claim 1.

7. The inclination angle of the inclined surface of the support with respect to the horizontal plane is set to be 7. The method for manufacturing a liquid ejection head according to claim 6, wherein the surface of the support opposite to the contact surface with the chuck is at an angle to be horizontal.

8. baking the resist after the spin coating; performing a side rinse of the baked resist; The method for manufacturing a liquid ejection head according to claim 1 , further comprising:

9. 9. The method for manufacturing a liquid ejection head according to claim 8, wherein the rotation speed of the chuck during the spin coating is faster than the rotation speed of the chuck during the spin coating in a case where the baking is not performed.

10. The method for manufacturing a liquid ejection head according to claim 1 , wherein the support has a friction reducing member for reducing friction between the support and the chuck when the spin coating is performed.

11. The method for manufacturing a liquid ejection head according to claim 1 , wherein the chuck has a friction reducing member for reducing friction between the chuck and the support when the spin coating is performed.

12. The support body has a rectangular frame formed so as to surround the rotation axis in the plan view, the chuck has at least three pins that are provided so as to be able to come into contact with the support placed on the chuck, In the plan view, two pins of the at least three or more pins are provided so as to be able to abut against one side of a pair of sides that sandwich a first corner of the rectangle, and one pin of the at least three or more pins is provided so as to be able to abut against the other side of the pair of sides.

2. The method for manufacturing a liquid ejection head according to claim 1.

13. forming a first dry film made of a first layer of resist and a second dry film made of a second layer of resist by the spin coating; a step of attaching the first dry film onto a substrate and performing exposure and baking related to the liquid ejection head on the first dry film; a step of attaching the second dry film onto the first dry film and performing exposure and baking related to the liquid ejection head on the second dry film; developing the first dry film and the second dry film attached to the substrate; The method for manufacturing a liquid ejection head according to claim 1, further comprising the steps of:

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